CN114302560A - Surface treatment combined processing technology for printed circuit board - Google Patents
Surface treatment combined processing technology for printed circuit board Download PDFInfo
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- CN114302560A CN114302560A CN202111396708.XA CN202111396708A CN114302560A CN 114302560 A CN114302560 A CN 114302560A CN 202111396708 A CN202111396708 A CN 202111396708A CN 114302560 A CN114302560 A CN 114302560A
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- circuit board
- gold
- printed circuit
- ink
- solder mask
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Abstract
The invention provides a surface treatment combined processing technology of a printed circuit board, which sequentially comprises a first solder mask process, a first character process, a first gold melting process, a second character process, a second gold melting process, a second solder mask process and a gold plating process. The invention has the advantages of optimizing the processing flow, saving the cost in the aspects of processing materials, manpower and time, improving the stability of the product quality and the like.
Description
Technical Field
The invention relates to the field of PCBs (printed circuit boards), in particular to a surface treatment combination processing technology of a printed circuit board.
Background
With the development of scientific and technological technology, the requirements of electronic products are more and more, and the requirements on the surface treatment of the printed circuit board are higher and higher; different surface treatments have been produced in the industry today in combination as: OSP + gold melting, OSP + tin spraying, gold melting + gold plating, OSP + gold melting + gold plating and the like.
The patent mainly introduces the process of gold melting, gold plating and OSP: solder resist (printing → exposure → development → baking) → characters (printing → baking) → wiring (pretreatment → press mold → exposure → development) → gold chemical (pretreatment → gold chemical → post-treatment) → wiring (gold chemical pretreatment → press mold → development) → gold plating (pretreatment → gold plating → post-treatment) → press baking → molding → sloping side → test → visual inspection (inspection 1 → OSP → inspection 2) → FQA → packaging → warehousing; the whole process can meet the product requirements, but the process is long, the cost is high, and the quality stability is poor.
Two dry film processes are required to be covered after solder mask, and the film removing liquid seriously attacks solder mask ink during film removal, so that the ink is frequently discolored, fogged and dropped, OSP is poor, soldering tin is poor and the like.
Therefore, there is a need to provide a new solution.
Disclosure of Invention
In order to solve the technical problems in the prior art, the invention discloses a surface treatment combination processing technology of a printed circuit board, which comprises the following specific technical scheme:
the invention provides a surface treatment combined processing technology of a printed circuit board, which sequentially comprises a first solder mask process, a first character process, a first gold melting process, a second character process, a second gold melting process, a second solder mask process and a gold plating process.
Further, the first solder mask process comprises the steps of printing, pre-baking, exposing, developing and baking, wherein the solder mask ink is uniformly brushed on the surface of the circuit board, and is dried and hardened.
Further, the first character process comprises the steps of printing and baking, wherein the character ink is printed on the surface of the circuit board, and the character ink is dried and hardened.
Furthermore, the first metal melting process comprises the steps of brushing, micro-etching, sand blasting, ultrasonic water washing, acid washing, water washing and drying, and the surface of the circuit board is cleaned.
Further, the second character process comprises a printing step and a baking step, wherein wet film ink is printed on the corresponding position of the surface of the circuit board, the OSP surface treatment area is completely covered with the ink, and then the character ink is dried and hardened.
Further, the second gold plating process comprises the steps of gold plating pretreatment, gold wire plating and gold plating post-treatment, and a nickel layer and a gold layer are deposited on the copper surface through chemical immersion plating reaction, displacement reaction and self-reduction reaction.
Further, the second solder mask process comprises the steps of printing, pre-baking, exposing and developing, wherein the OSP and the gold-plated surface treatment area are all covered by ink, and the exposed copper surface is subjected to gold plating.
The gold plating process comprises the steps of gold plating pretreatment, gold wire plating and gold plating post-treatment, wherein the circuit board is soaked in the liquid medicine to be used as a cathode and used as an anode through electrochemical reaction, and the required plating layer is deposited on the circuit board by connecting direct current.
The invention has the following beneficial effects:
1. the surface treatment combined processing technology of the printed circuit board can optimize the processing flow.
2. The combined processing technology for the surface treatment of the printed circuit board can save the cost in the aspects of processing materials, manpower and time.
3. The surface treatment combined processing technology of the printed circuit board can improve the stability of the product quality.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Detailed Description
The following detailed description is provided to further illustrate the technical means and effects of the present invention.
The invention provides a surface treatment combined processing technology of a printed circuit board, which sequentially comprises a first solder mask process, a first character process, a first gold melting process, a second character process, a second gold melting process, a second solder mask process and a gold plating process.
The first solder mask process comprises the steps of printing, pre-baking, exposing, developing and baking, wherein solder mask ink is uniformly brushed on the surface of the circuit board, and the solder mask ink is dried and hardened.
The first character process comprises the steps of printing and baking, wherein character ink is printed on the surface of the circuit board, and the character ink is dried and hardened.
The first metal melting process comprises the steps of brushing, micro-etching, sand blasting, ultrasonic water washing, acid washing, water washing and drying, and the surface of the circuit board is cleaned.
And the second character process comprises the steps of printing and baking, wherein wet film ink is printed on the corresponding position on the surface of the circuit board, the OSP surface treatment area is completely covered with the ink, and then the character ink is dried and hardened.
The second gold melting process comprises the steps of gold melting pretreatment, gold melting wire treatment and gold melting post-treatment, and a nickel layer and a gold layer are deposited on the copper surface by using chemical immersion plating reaction, displacement reaction and self-reduction reaction.
And the second solder mask process comprises the steps of printing, prebaking, exposing and developing, wherein the OSP and the gold-plated surface treatment area are completely covered by ink, and the exposed copper surface is subjected to gold plating.
The gold plating process comprises the steps of gold plating pretreatment, gold wire plating and gold plating post-treatment, wherein the circuit board is soaked in the liquid medicine to be used as a cathode and used as an anode through electrochemical reaction, and the required plating layer is deposited on the circuit board by connecting direct current.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example" or "some examples" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by one skilled in the art.
While embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and not to be construed as limiting the present invention, and that changes, modifications and variations may be made therein by those of ordinary skill in the art within the scope of the present invention.
Claims (8)
1. A surface treatment combined processing technology of a printed circuit board is characterized by sequentially comprising a first solder mask process, a first character process, a first gold melting process, a second character process, a second gold melting process, a second solder mask process and a gold plating process.
2. The combined processing technology for processing the surface of the printed circuit board as claimed in claim 1, wherein the first solder mask process comprises the steps of printing, prebaking, exposing, developing and baking, the solder mask ink is uniformly brushed on the surface of the circuit board, and the solder mask ink is dried and hardened.
3. The combined printed circuit board surface treatment process of claim 1, wherein the first lettering process comprises the steps of printing and baking, printing lettering ink on the surface of the printed circuit board, and drying and hardening the lettering ink.
4. The combined processing technology for the surface treatment of the printed circuit board according to claim 1, wherein the first metal processing step comprises the steps of brushing, micro-etching, sand blasting, ultrasonic water washing, acid washing, water washing and drying, and the surface of the circuit board is cleaned.
5. The process of claim 1, wherein the second writing step comprises printing and baking, wherein wet-film ink is applied to the corresponding locations on the surface of the circuit board, the OSP surface treatment area is covered with ink, and the text ink is dried and cured.
6. The combined processing technique for processing the surface of the printed circuit board as claimed in claim 1, wherein the second gold plating process comprises the steps of gold plating pretreatment, gold plating and gold plating post-treatment, and a nickel layer and a gold layer are deposited on the copper surface by using chemical immersion plating reaction, displacement reaction and self-reduction reaction.
7. The combined processing technology for surface treatment of printed circuit board as claimed in claim 1, wherein the second solder mask process comprises printing, pre-baking, exposing and developing steps, the OSP and the gold surface treatment area are all covered with ink, and the exposed copper surface is gold plated.
8. The combined processing technology for processing the surface of the printed circuit board according to claim 1, wherein the gold plating process comprises the steps of gold plating pretreatment, gold wire plating and gold plating post-treatment, the circuit board is soaked in a liquid medicine as a cathode and the circuit board as an anode through electrochemical reaction, and direct current is connected to deposit a required coating on the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111396708.XA CN114302560A (en) | 2021-11-23 | 2021-11-23 | Surface treatment combined processing technology for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111396708.XA CN114302560A (en) | 2021-11-23 | 2021-11-23 | Surface treatment combined processing technology for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114302560A true CN114302560A (en) | 2022-04-08 |
Family
ID=80965742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111396708.XA Pending CN114302560A (en) | 2021-11-23 | 2021-11-23 | Surface treatment combined processing technology for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114302560A (en) |
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2021
- 2021-11-23 CN CN202111396708.XA patent/CN114302560A/en active Pending
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