CN115334768A - Packaging substrate processing method for improving OSP appearance quality - Google Patents
Packaging substrate processing method for improving OSP appearance quality Download PDFInfo
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- CN115334768A CN115334768A CN202211040150.6A CN202211040150A CN115334768A CN 115334768 A CN115334768 A CN 115334768A CN 202211040150 A CN202211040150 A CN 202211040150A CN 115334768 A CN115334768 A CN 115334768A
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- 239000000758 substrate Substances 0.000 title claims abstract description 61
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 29
- 238000003672 processing method Methods 0.000 title claims abstract description 10
- 238000012545 processing Methods 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 29
- 238000007788 roughening Methods 0.000 claims abstract description 11
- 230000008569 process Effects 0.000 claims abstract description 10
- 238000005259 measurement Methods 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims description 59
- 229910052802 copper Inorganic materials 0.000 claims description 52
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 51
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 44
- 238000004140 cleaning Methods 0.000 claims description 42
- 239000007788 liquid Substances 0.000 claims description 42
- 238000005406 washing Methods 0.000 claims description 39
- 239000003814 drug Substances 0.000 claims description 33
- 238000005530 etching Methods 0.000 claims description 24
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 16
- 229910052737 gold Inorganic materials 0.000 claims description 16
- 239000010931 gold Substances 0.000 claims description 16
- 238000007747 plating Methods 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 238000001035 drying Methods 0.000 claims description 14
- 239000012535 impurity Substances 0.000 claims description 14
- 230000003647 oxidation Effects 0.000 claims description 14
- 238000007254 oxidation reaction Methods 0.000 claims description 14
- GHOKWGTUZJEAQD-ZETCQYMHSA-N (D)-(+)-Pantothenic acid Chemical compound OCC(C)(C)[C@@H](O)C(=O)NCCC(O)=O GHOKWGTUZJEAQD-ZETCQYMHSA-N 0.000 claims description 11
- 238000005553 drilling Methods 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 10
- 238000007689 inspection Methods 0.000 claims description 9
- 150000002500 ions Chemical class 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 9
- 229940079593 drug Drugs 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 7
- 239000007921 spray Substances 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000013461 design Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000003486 chemical etching Methods 0.000 claims description 3
- 230000003628 erosive effect Effects 0.000 claims description 3
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 3
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims description 3
- 230000009467 reduction Effects 0.000 claims description 3
- 239000012452 mother liquor Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 7
- 239000000243 solution Substances 0.000 description 6
- 230000003064 anti-oxidating effect Effects 0.000 description 5
- 238000005238 degreasing Methods 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 239000005749 Copper compound Substances 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 4
- 150000001880 copper compounds Chemical class 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 230000007849 functional defect Effects 0.000 description 3
- 238000005554 pickling Methods 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000010413 mother solution Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000003755 preservative agent Substances 0.000 description 2
- 230000002335 preservative effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000010301 surface-oxidation reaction Methods 0.000 description 2
- 238000009461 vacuum packaging Methods 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000005202 decontamination Methods 0.000 description 1
- 230000003588 decontaminative effect Effects 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000005237 degreasing agent Methods 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000013072 incoming material Substances 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention provides a packaging substrate processing method for improving OSP appearance quality, and belongs to the field of packaging substrate processing technology. The processing method of the packaging substrate for improving the appearance quality of the OSP comprises the following steps: OSP pretreatment: sending the PCB which is formed and qualified through electrical measurement into an OSP pretreatment process, and carrying out super-roughening treatment on the PCB; OSP processing steps: and sending the PCB subjected to the OSP pretreatment into an OSP treatment line, and carrying out OSP treatment to obtain a final OSP packaging substrate. The beneficial effects of the invention are as follows: the rejection of the PCB caused by the appearance defect of the OSP film is avoided, and the product yield is effectively improved.
Description
Technical Field
The invention relates to the field of packaging substrate processing technology, in particular to a packaging substrate processing method for improving OSP appearance quality.
Background
In order to protect the copper surface of the circuit board welding point with good soldering performance, OSP surface treatment is carried out, and an organic film is chemically grown on the clean bare copper surface of the OSP. The film has the advantages of oxidation resistance, thermal shock resistance and moisture resistance, and is used for protecting the copper surface from continuously rusting (oxidation, vulcanization or the like) in a normal environment; the organic film can resist the attack of moisture in the air, can withstand the test of high temperature, keeps good activity, is easy to dissolve and break by the soldering flux, can keep good tin-coating capability and does not have residue, but the protective film can be quickly removed by the soldering flux in the subsequent high welding temperature, so that the exposed clean copper surface can be immediately combined with the molten soldering tin into a firm welding spot in a very short time.
Before OSP surface treatment, the copper surface of the circuit board needs to be cleaned by micro-etching, and if the cleaning in the previous procedure is not complete, the OSP film becomes purple or black, and appearance abnormity appears.
In the industry at present, spray pipes are used for spray microetching treatment, for example, 5 or even 10 groups of spray pipes, because the requirement of line speed, although the etching amount is greater than 0.3-0.5 um, in practice, after the circuit board is microetched, there are many small openings in the board, for example: for a circuit board with dimensions of 10 x 10 cm, there may be many openings of 50-60, even 80um inside, since the openings are very small and dense. In the micro-etching film coating process, because of the requirement of productivity, the cleaning requirement cannot be met for one surface of the coating of the circuit board, especially for the cleaning in the opening, and the color abnormality of one or more openings may occur in the inner side of the circuit board, that is, the color abnormality problem exists.
If the circuit board has such a different color, the whole circuit board is scrapped because the OSP film is used for soldering, and if the OSP film has an opening different color, the solder balls are dropped by customers when being soldered, and further functional defects are generated. Therefore, a process method for improving the appearance quality of the OSP film and reducing the defect rate of the circuit board caused by the appearance quality of the OSP film is urgently needed.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a processing method of a packaging substrate for improving the appearance quality of an OSP.
The invention relates to a packaging substrate processing method for improving the appearance quality of an OSP (organic solderability preservative), which comprises the following steps of: sending the PCB which is formed and qualified through electrical measurement into an OSP pretreatment process, and carrying out super-roughening treatment on the PCB; OSP processing steps: and sending the PCB subjected to the OSP pretreatment into an OSP processing line, and carrying out OSP processing to obtain a final OSP packaging substrate.
The invention is further improved, and the OSP pretreatment step comprises the following substeps:
removing oxidation and impurities on the surface of the PCB;
first DI water wash: cleaning the surface of the PCB board, and cleaning the residual liquid medicine on the surface of the board;
micro-etching the solder ball pad with erosion amount of 1.0 + -0.1 um;
second DI water wash: cleaning the surface of the PCB, wherein the cleaning liquid is used for cleaning the residual liquid medicine on the surface of the PCB;
and drying the PCB.
In a further refinement, after the second DI water rinse, the DI water rinse further comprises:
acid washing step: the impurities and oxides on the board surface are cleaned by hydrochloric acid, so that the oxidation resistance of the board surface is improved;
third DI water wash: and cleaning the surface of the PCB, and cleaning the residual liquid medicine on the surface of the PCB.
The invention is further improved, when in acid cleaning, hydrochloric acid (HCL) solution is adopted, the concentration of the solution is 3-5 percent by mass, the Cu ion content is less than 2g/l, and the acid cleaning pressure is 0.7-0.9kg/cm 2 。
The invention is further improved, in the steps of the first DI water washing, the second DI water washing and the third DI water washing, the washing pressure is 0.7-0.9kg/cm < 2 >, and the washing section is hundred percent pure water, wherein the conductivity is less than 15uS/cm, and the PH value is 6-8.
The invention is further improved, in the step of removing the oxidation and impurities on the surface of the PCB, the liquid medicines of CT-9901 and CT-9901-H are adopted, the concentration range of the liquid medicines is kept between 40 and 80g/l, and the content of Cu ions is less than 25g/l.
The invention is further improved, and the treatment method is that the treatment is carried out in a 210L cleaning tank:
adding 90L of water, adding 60L of CT-9901 liquid medicine, adding 7.5kg of CT-9901-H liquid medicine, and adding water to standard liquid level, wherein the spray pressure of the spray pipe is 0.7-0.9kg/cm 2 The biting erosion amount is 0.2 +/-0.1 um, and the linear speed is 1.5-2.5m/min.
The invention is further improved, the micro-etching is carried out on the tin ball welding pad which is out of the anti-welding windowing, CZ-8101 and CZ-8101-B liquid medicines are adopted, CZ-8101-B mother liquor is added into an ultra-coarsening groove, CZ-8101 sub liquor is added after the concentration is adjusted, the concentration range of the liquid medicine is-10-10 percent of concentration rate, the content of Cu ions is 15-30g/l, the micro-etching temperature is 30 +/-2 ℃, the micro-etching time is about 50-70S, the biting amount is 1.0 +/-0.1 um, and the linear speed is 1.5-2.5m/min.
The invention is further improved, and also comprises a processing step of the packaging substrate to obtain a qualified PCB,
the processing step of the packaging substrate comprises the following steps:
baking the hair materials: selecting a double-sided copper-clad plate as a raw material, and baking the raw material;
and (3) outer layer copper reduction: carrying out chemical etching treatment on the surface copper thickness of the raw material to the required thickness, and reducing the copper to ensure that the copper thickness of the two sides of the base material is consistent;
drilling: drilling corresponding hole sites on the copper-clad plate according to design requirements;
removing glue residues: processing residual glue in the holes generated after drilling, and cleaning the board surface;
hole forming and copper electroplating: plating an organic conductive film on the hole wall of the substrate after the glue residues are removed, conducting the upper layer and the lower layer to form a passage, and plating a copper layer on the hole wall and the surface of the substrate after the hole is formed, wherein the uniformity of the copper thickness is controlled within 5 um;
constructing an outer layer circuit;
AOI optical inspection:
solder mask: coating printing oil on the copper surface of the super-roughened substrate to form a double-sided solder mask layer, and then exposing a required solder mask opening through treatment;
leading: the position that does not need electrogilding is covered with the dry film, adopts LDI exposure machine counterpoint exposure, presents lid lead wire figure on the base plate, gets rid of unexposed dry film through developing to fade the dry film of exposure part, make lid lead wire figure show out completely:
PAU soft gold pretreatment: cleaning the surface of the substrate by using a flattening line to remove dirt, impurities and oxidation, and cleaning the surface of the substrate;
PAU gold plating soft gold: plating a layer of nickel gold on the bonding needing routing by using a soft gold VCP wire;
and (3) PAU gold plating and film removal: removing the dry film left by the lead wires by using the gold-plated film removing lines, and leaking the electroplating bus;
molding: routing the PAU gold-plated and membrane-removed packaging substrate into a PCB with a strip size.
The invention is further improved and also comprises the steps of final inspection, laser stamping, classification and packaging of the PCB processed by the OSP.
Compared with the prior art, the invention has the beneficial effects that: before OSP treatment, an OSP pretreatment step is added, and the board surface of the PCB is subjected to precleaning treatment, so that the cleanness and the oxidation resistance of the board surface of the PCB are increased, the appearance of the PCB treated by subsequent OSP is very beautiful, and the condition of different colors can not occur, so that the condition that the whole circuit board is scrapped due to the different colors of an OSP film can be effectively avoided, and in addition, the technical problem that balls fall off when welding tin balls of customers occur in subsequent processes without being checked out, and further functional defects are generated is also avoided.
Drawings
In order to illustrate the present application or prior art more clearly, a brief description of the drawings needed for the description of the embodiments or prior art will be given below, it being clear that the drawings in the following description are some embodiments of the present application and that other drawings can be derived from them by a person skilled in the art without inventive effort.
FIG. 1 is a flow chart of a method for processing a package substrate to improve the appearance quality of an OSP according to the present invention;
FIG. 2 is a flow chart of a pretreatment method for OSP according to the present invention;
FIG. 3 is a flow chart of the OSP processing method of the present invention.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions. The terms "first," "second," and the like in the description and claims of this application or in the above-described drawings are used for distinguishing between different objects and not for describing a particular order.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.
As shown in fig. 1, the method for processing a package substrate to improve the appearance quality of an OSP of the present invention includes:
s1: OSP pretreatment: sending the PCB which is formed and electrically tested to an OSP pretreatment process, and carrying out super-roughening treatment on the PCB;
s2: OSP processing steps: and sending the PCB subjected to the OSP pretreatment into an OSP processing line, and carrying out OSP processing to obtain a final OSP packaging substrate.
In order to improve the appearance of the OSP film and avoid the occurrence of the abnormal color, the invention adds a processing line on the basis of the existing OSP processing line for carrying out OSP pretreatment on a board which enters the OSP treatment in advance, and then passes the OSP pretreatment board through the OSP processing line, so that the appearance of the treated PCB is very beautiful, and the abnormal color cannot occur, thereby effectively avoiding the rejection of the whole circuit board caused by the abnormal color of the OSP film, and in addition, avoiding the technical problem that the ball falls off when a customer solders the ball in the subsequent process without inspection, thereby generating functional defects, effectively improving the appearance quality of the product and improving the yield of the product.
Specifically, the processing method of the present embodiment for improving the appearance quality of the OSP is described by taking the example of obtaining a single-sided OSP package substrate, and the complete process of the present embodiment is as follows:
the method comprises the following steps: baking hair
Selecting a double-sided copper-clad plate as a raw material, wherein the types of the double-sided copper-clad plate are mostly T/T, B/B and 1/1, and the thickness of a base plate of the raw material is determined by the thickness of a finished product plate required by a product part according to the design requirements of customers; the baking temperature is 195 ℃ and the baking time is 2H.
Step two: outer layer copper reduction
And (3) carrying out chemical etching treatment on the surface copper thickness of the raw material to the required thickness, and reducing the copper to ensure that the copper thickness of the two sides of the base material is consistent.
Step three: drilling a hole
Drilling corresponding positioning holes, pipe position holes, through holes and the like on the copper-clad plate by a drilling machine according to design requirements so as to conduct a circuit between an upper layer and a lower layer; and drilling through the upper layer and the lower layer at a high speed to form a through hole.
Step four: degumming slag
And (4) processing residual glue in the holes generated after drilling by using the characteristics of the liquid medicine, and cleaning the board surface.
Step five: voiding and electrolytic copper plating
Plating an organic conductive film on the hole wall of the substrate after the glue residue is removed, and conducting the upper layer and the lower layer to form a passage so as to provide a basic adhesion layer for subsequent copper electroplating; and electroplating a copper layer on the hole wall and the surface of the holed substrate, wherein the uniformity R value of the copper thickness is controlled within 5 um.
Step six: structural outer layer circuit
The substrate after the pored electro-coppering needs to be baked at high temperature, the moisture on the surface of the substrate is removed, the internal stress of the substrate is eliminated, the baking temperature is 150 ℃, and the baking time is 1H;
then, performing middle and middle coarsening film pressing before the circuit, pickling to remove dirt on the surface of the circuit, coarsening the roughness of the copper surface of the copper on the upper surface and the lower surface, improving the binding force of the copper surface and a dry film, wherein the dry film of the circuit is a photosensitive dry film, the temperature is 90-120 ℃ when the film pressing is automatically performed, and the film pasting time is 1-3 seconds;
and (3) circuit exposure, namely, automatically aligning and exposing by adopting engineering data of an ADtek exposure machine, presenting a circuit pattern on the substrate, removing an unexposed dry film through development, etching to remove the copper of the unexposed part, and fading the dry film of the exposed part to completely expose the circuit pattern.
Step seven: AOI optical inspection;
further carrying out optical scanning detection on the substrate after the circuit etching to detect the problems of circuit open short circuit, poor exposure, unclean development, unclean etching, hole deviation and the like; and marking the abnormal area, and performing scrap treatment in the subsequent process.
Step eight: solder mask
The solder mask super-roughening pretreatment removes board surface oxidation and impurities from the copper surface after the circuit, cleans the board surface, roughens the copper surface, and improves the bonding force of the solder mask ink and the copper surface;
coating printing oil on the copper surface of the substrate after the super-roughening to form a double-sided anti-welding layer;
the exposure machine utilizes the energy of ultraviolet rays to enable the printing ink to carry out photochemical reaction so as to achieve the effect of enabling the printing ink to be selectively hardened and not dissolved by a developer, and the printing ink of the part which is not subjected to photopolymerization reaction is washed away through development, so that a welding-proof opening required by a customer is exposed.
After the development, the invention adopts the substrate to irradiate UV and bake so as to ensure the secondary hardening of the solder-resisting green paint and ensure that the polymerization hardening degree of the green paint can meet the required requirements.
Step nine: lead wire
The position without electrogilding is covered by a dry film, the LDI exposure machine is used for automatic alignment exposure of engineering data, a lead covering graph is displayed on the substrate, the unexposed dry film is removed through development, the dry film of the exposed part is removed, and the lead covering graph is completely exposed.
Step ten: PAU soft gold pretreatment: and cleaning the surface of the substrate by using a leveling line to clean the surface of the substrate from dirt, impurities and oxidation.
Step eleven: PAU gold plating soft gold: a layer of nickel gold is plated on the bonding needing routing by using a soft gold VCP wire, so that the routing is convenient for customers.
Step twelve: PAU gold plating and membrane removal: and (4) removing the dry film remained by the lead wires of the cover by using a gold-plated film removing line, and leaking the Plating bus.
Step thirteen: shaping of
Firstly, an incoming material substrate passes through a two-dimensional code marking machine to be subjected to 2D code required by a plate surface laser client; the large board is then routed to the Strip-shaped size Strip small board (i.e. the PCB board of this example) required by the customer, and the size is measured for confirmation.
Fourteen steps: cleaning: and cleaning the surface of the formed Strip small plate with dirt impurities and oxidation, and further drying the plate surface.
Step fifteen: electrical measurement
Before electrical measurement, an AVI detector is used for scanning the Strip small plate to detect whether quality problems exist, particularly problems of copper surface and oil surface, poor appearance and open-short circuit in an electrical measurement substrate plate.
Sixthly, the steps are as follows: the OSP pretreatment, namely using super-coarsening as pretreatment, specifically comprises the following steps: decontamination, washing, super-coarsening, washing, acid washing, sponge drying and strong wind drying.
Because one side of the embodiment is the golden finger, the embodiment only needs to carry out OSP treatment on the PCB on the other side, therefore, the invention can skillfully carry out the pre-roughening treatment on the PCB on the side without influencing the golden finger on the other side, thereby achieving the effect of improving the appearance quality of the OSP.
As shown in fig. 2, the specific steps of this example are as follows:
s101: the Strip-shaped small plate is cleaned by removing plate surface oxidation and impurities through a cleaning section, and the invention adopts CT-9901 and CT-9901-H liquid medicines, wherein the concentration range of the liquid medicines is kept between 40 g/l and 80g/l, and the Cu ion content is less than 25g/l.
For example: adding 90L of water, then adding 60L of CT-9901, then adding 7.5kg of CT-9901-H, then adding water to a standard liquid level, and spraying pressure of an oil removing section is 0.7-0.9kg/cm 2 The bite etching amount is 0.2 +/-0.1 um, and the linear speed is 1.5-2.5m/min;
s102: washing with DI (deionized water) to remove residual liquid medicine on the board surface, wherein the washing pressure is 0.7-0.9kg/cm < 2 >, and the washing section is hundred percent pure water, wherein the conductivity is less than 15uS/cm, and the PH value is 6-8;
s103: and (3) super coarsening: the tin ball welding pad which is out of the solder mask window is micro-etched through a copper surface roughening agent, after micro-etching, the effect of thorough cleaning is achieved by matching with the micro-etching operation of the OSP line, and the prior art singly adopts OSP micro-etching groove cleaning, so that the good effect cannot be achieved, therefore, when the OSP line is coated, the appearance quality problem of different colors such as blacking, purplish and the like caused by incomplete cleaning can occur.
According to the invention, CZ-8101 and CZ-8101-B liquid medicines are preferably adopted to carry out roughening treatment on the copper surface, so that the copper surface can form a concave-convex surface with an anchor bolt effect, the physical binding force between copper and resin is enhanced, the tin-coating adhesive force is enhanced conveniently for a client side, and the effect of thorough cleaning can be achieved. The specific operation method of the embodiment is as follows:
adding 600kg CZ-8101-B mother solution into 1000L super-roughening tank, and adding CZ-8101 sub-solution to adjust concentration, wherein the concentration of the mother solution is-10-10%, CU ion content is 15-30g/L, micro-etching temperature is 30 + -2 deg.C, micro-etching time is 50-70S, bite etching amount is 1.0 + -0.1 um, and linear speed is 1.5-2.5m/min.
S104: and (2) washing with DI (deionized water) to clean residual liquid medicine on the board surface, wherein the washing pressure is 0.7-0.9kg/cm & lt 2 & gt, the washing section is hundred percent pure water, the conductivity is less than 15uS/cm, and the PH value is 6-8.
Preferably, the OSP pre-treatment of the present invention further comprises:
s105: the hydrochloric acid (HCL) is adopted to clean impurities and oxides on the board surface, the oxidation resistance of the board surface is improved, the concentration of the liquid medicine is 3-5 percent by mass, the content of Cu ions is less than 2g/l, and the pickling pressure is 0.7-0.9kg/cm 2 ；
S106: and thirdly, washing with DI water, namely cleaning the residual liquid medicine on the board surface, wherein the washing pressure is 0.7-0.9kg/cm & lt 2 & gt, the washing section is hundred percent pure water, the conductivity is less than 15uS/cm, and the PH value is 6-8.
Because CZ-8101 liquid medicine contains strong chelating agent, copper compound can be separated out from the copper surface along with the increase of PH value during washing, and the copper compound can obstruct the binding force between the copper surface and resin, therefore, in the embodiment, after the treatment by the super-coarsening liquid medicine, the treatment by hydrochloric acid pickling is added, the copper compound is treated into a substance which is easy to dissolve in water, thereby avoiding the residue of the copper compound on the copper surface and cleaning the copper surface more thoroughly.
S107: dry PCB board specifically includes:
(1) Absorbing the water remained on the board surface by using the water-absorbing sponge;
(2) Drying with strong wind, removing water on the board surface by using high temperature, and cooling the board surface by using cold wind, wherein the drying temperature is 80 +/-5 ℃.
Seventeen steps: OSP processing;
as shown in fig. 3, the specific steps of this example are as follows:
s201: degreasing the surface of the packaging substrate subjected to strip size electrical measurement, adopting an SC-1018 degreasing agent with the concentration controlled at 10%, adding two thirds of DI water into a 150L degreasing tank, adding 15L of SC-1018 solution, adding the DI water to the cylinder opening liquid level, starting a heating device and a pump, circulating for 30min, wherein the degreasing temperature is 35 +/-5 ℃, the degreasing pressure is 2.0kg/cm & lt 2 & gt, and the degreasing speed is controlled at 0.6-1.2m/min;
s202: DI water washing the plate surface at a washing pressure of 1.5kg/cm2, water washing 100% DI, wherein the conductivity is <10uS/cm, the chloride ion is <5ppm, and the pH is more than 5.0;
s203: carrying out microetching on a copper bonding pad formed by windowing a packaging substrate by adopting ME-1028A and PC-7016A liquid medicines, wherein in a 150L microetching groove, the concentration of the PC-7016A liquid medicine is 20 +/-5%, the concentration of the ME-1028 liquid medicine is 4 +/-2%, the microetching temperature is controlled to be 27 +/-3 ℃, the microetching time is 30-90 seconds, the microetching copper surface is controlled to be within the range of 1-2um, and copper ions in the groove are controlled to be less than 15g/L; the copper surface is bitten by 1-2um through micro-etching treatment;
s204: DI washing the board surface to remove the micro-etching agent remained on the board surface, the washing pressure is 1.5kg/cm2, the washing rate is 100% DI, wherein the conductivity is less than 10uS/cm, the chloride ion is less than 5ppm, and the PH value is more than 5.0;
s205: pre-soaking, adding two thirds of DI water, adding 8% PC1035 medicinal liquid, adding DI water to standard liquid level, at 25 + -5 deg.C for 30-60 s, and adding NH when pH is reduced in production process 3 H 2 O, supplementary pH value adjustment;
s206: DI washing the board surface to remove the prepreg remaining on the board surface, the washing pressure being 1.5kg/cm2, the washing being 100% DI, wherein the conductivity is <10uS/cm, the chloride ion is <5ppm, and the pH is greater than 5.0;
s207: performing suction-drying inspection, namely, sucking water by using a water-absorbing sponge, drying the board surface, and automatically inspecting the suction-drying degree, the drying degree and the cleaning degree of the upper board surface and the lower board surface of the packaging substrate;
s208: OSP anti-oxidation treatment, namely adding 72RB1 liquid medicine into a 280L cylinder, slowly adding 28RA liquid medicine, slowly adding 1.1RC, then adding DI water to the liquid level of the opened cylinder, wherein the concentration of RA is 10%, the concentration of RB1 is 25.5%, the concentration of RC is 0.4%, the thickness of the film is 0.2-0.6um, the concentration of copper ions is less than 100ppm, the anti-oxidation temperature is 36 +/-4 ℃, the anti-oxidation PH value is 2.95 +/-0.15, the total acidity is 255 +/-35%, when the acidity is insufficient, adding formic acid and acetic acid mixed liquor to adjust the acidity, and the anti-oxidation time is 45-90 seconds; forming a layer of copper protection film on the two-side solder-resisting windowing copper pad through OSP (organic solderability preservative) antioxidation, wherein the thickness of the upper and lower surfaces of the copper protection film is within the range of 0.3 +/-0.1 um;
s209: sucking to dry;
absorbing the moisture on the board surface by using a water-absorbing sponge;
s210: washing, drying and cooling;
and washing, drying and drying the cold air blowing board surface to obtain the final packaging substrate of the single-sided OSP, wherein the front side of the packaging substrate is provided with the soft golden fingers.
Eighteen steps: final inspection and water washing: the board surface is cleaned by pure water, so that subsequent AVI machine detection is facilitated;
nineteen steps: AVI automatic visual inspection: scanning the surface of the Strip platelet and reading the defects;
twenty steps: PVS maintenance: manually comparing and confirming the defects prompted by the AVI machine;
twenty one is as follows: manual visual inspection of MVI: confirming the board surface identification required by the customer and checking the appearance of the board surface;
twenty-two steps: laser stamping: laser marking is carried out on the single PCS which is scrapped, so that the single PCS can be distinguished by customers conveniently;
twenty-three steps: final inspection and water washing: washing the cleaning board surface by pure water to remove impurities generated by laser;
twenty-four steps: sorting classification: and distinguishing packages according to the number of fork plates generated by production, wherein Sorting means that the goods are grouped according to the types, the flow direction and the customer categories of the goods.
Twenty-five steps: and (3) vacuum packaging: and (6) vacuum packaging, counting and warehousing.
The above-described embodiments are intended to be illustrative, and not restrictive, of the invention, and all such modifications and equivalents as may be included within the scope of the invention are intended to be included therein.
Claims (10)
1. A packaging substrate processing method for improving OSP appearance quality is characterized by comprising the following steps:
OSP pretreatment: sending the PCB which is formed and qualified through electrical measurement into an OSP pretreatment process, and carrying out super-roughening treatment on the PCB;
OSP processing steps: and sending the PCB subjected to the OSP pretreatment into an OSP processing line, and carrying out OSP processing to obtain a final OSP packaging substrate.
2. The method of processing a package substrate for improving the appearance quality of an OSP according to claim 1, wherein: the OSP pretreatment step comprises the following substeps:
removing oxidation and impurities on the surface of the PCB;
first DI water wash: cleaning the surface of the PCB, wherein the cleaning liquid is used for cleaning the residual liquid medicine on the surface of the PCB;
and (3) super coarsening: carrying out micro-etching on the solder ball pad which is out of the solder windowing, wherein the etching amount is 1.0 +/-0.1 um;
second DI water wash: cleaning the surface of the PCB board, and cleaning the residual liquid medicine on the surface of the board;
and drying the PCB.
3. The method of processing a package substrate for improving the appearance quality of an OSP according to claim 2, wherein: after the second DI water rinse, further comprising:
acid washing step: the impurities and oxides on the board surface are cleaned by hydrochloric acid, so that the oxidation resistance of the board surface is improved;
third DI water wash: and cleaning the surface of the PCB, and cleaning the residual liquid medicine on the surface of the PCB.
4. The method of processing a package substrate for improving the appearance quality of an OSP according to claim 3, wherein: during acid cleaning, hydrochloric acid (HCL) solution with concentration of 3-5%, cu ion content less than 2g/l, and acid cleaning pressure of 0.7-0.9kg/cm is adopted 2 。
5. The method of processing a packaging substrate for improving the appearance quality of an OSP according to claim 3, wherein: in the steps of the first DI water washing, the second DI water washing and the third DI water washing, the washing pressure is 0.7-0.9kg/cm < 2 >, and the washing section is hundred percent pure water, wherein the conductivity is less than 15uS/cm, and the PH value is 6-8.
6. The method of processing a package substrate for improving the appearance quality of an OSP according to claim 2, wherein: in the step of removing the oxidation and impurities on the surface of the PCB, the liquid medicines of CT-9901 and CT-9901-H are adopted, the concentration range of the liquid medicine is kept between 40 and 80g/l, and the content of Cu ions is less than 25g/l.
7. The method of processing a package substrate for improving the appearance quality of an OSP according to claim 6, wherein: the treatment is carried out in a 210L cleaning tank by the following method:
adding 90L of water, adding 60L of CT-9901 liquid medicine, adding 7.5kg of CT-9901-H liquid medicine, and adding water to standard liquid level, wherein the spray pressure of the spray pipe is 0.7-0.9kg/cm 2 The biting erosion amount is 0.2 +/-0.1 um, and the linear speed is 1.5-2.5m/min.
8. The method of processing a package substrate for improving the appearance quality of an OSP according to claim 2, wherein: the method is characterized in that CZ-8101 and CZ-8101-B liquid medicine is adopted to carry out micro-etching on a tin ball welding pad which comes out from an anti-welding windowing way, CZ-8101-B mother liquor is added into an ultra-coarsening groove, CZ-8101 sub-liquor is added after the concentration is adjusted, the concentration range of the liquid medicine is-10-10%, the content of Cu ions is 15-30g/l, the micro-etching temperature is 30 +/-2 ℃, the micro-etching time is about 50-70S, the biting amount is 1.0 +/-0.1 um, and the linear speed is 1.5-2.5m/min.
9. The method of processing a packaging substrate for improving the appearance quality of an OSP according to any of claims 1-8, wherein: also comprises a step of processing the packaging substrate to obtain a qualified PCB,
the processing of the package substrate comprises:
baking the hair materials: selecting a double-sided copper-clad plate as a raw material, and baking the raw material;
and (3) outer layer copper reduction: carrying out chemical etching treatment on the surface copper thickness of the raw material to the required thickness, and reducing the copper to be consistent with the copper thickness of the two sides of the base material;
drilling: drilling corresponding hole sites on the copper-clad plate according to design requirements;
removing glue residues: processing residual glue in the holes generated after drilling, and cleaning the board surface;
hole forming and copper electroplating: plating an organic conductive film on the hole wall of the substrate after the glue residues are removed, conducting the upper layer and the lower layer to form a passage, plating a copper layer on the hole wall and the surface of the substrate after the hole is formed, and controlling the uniformity of the copper thickness within 5 um;
constructing an outer layer circuit;
AOI optical inspection:
solder mask: coating printing oil on the copper surface of the substrate after the super-roughening to form a double-sided solder mask layer, and then exposing a required solder mask opening through treatment;
leading wires: the position that does not need electrogilding is covered with the dry film, adopts LDI exposure machine counterpoint exposure, presents lid lead wire figure on the base plate, gets rid of unexposed dry film through developing to fade the dry film of exposure part, make lid lead wire figure show out completely:
PAU soft gold pretreatment: cleaning the surface of the substrate by using a flattening line to remove dirt, impurities and oxidation, and cleaning the surface of the substrate;
PAU gold plating soft gold: plating a layer of nickel gold on the bonding needing routing by using a soft gold VCP wire;
and (3) PAU gold plating and film removal: removing the dry film left by the lead wires by using the gold plating stripping lines, and leaking the electroplating bus;
molding: routing the PAU gold-plated and membrane-removed packaging substrate into a PCB with a strip size.
10. The method of processing a packaging substrate for improving the appearance quality of an OSP according to any of claims 1-8, wherein: the method also comprises the steps of final inspection, laser stamping, classification and packaging of the PCB processed by the OSP.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024178657A1 (en) * | 2023-03-01 | 2024-09-06 | 京东方科技集团股份有限公司 | Manufacturing method for array substrate, array substrate and display apparatus |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101508051A (en) * | 2009-03-11 | 2009-08-19 | 林原标 | Organic solderability preservative pre-soaking treating agent and organic solderability preservation film forming method |
| CN102548066A (en) * | 2012-02-08 | 2012-07-04 | 惠州中京电子科技股份有限公司 | PCB (Printed Circuit Board) surface treatment technology |
| CN104918417A (en) * | 2015-05-15 | 2015-09-16 | 江门崇达电路技术有限公司 | Method for producing organic solderability preservative on surface of circuit board |
| CN110049630A (en) * | 2019-04-17 | 2019-07-23 | 广州迅磊科技有限公司 | A kind of board production osp processing technology |
| CN112490134A (en) * | 2021-01-07 | 2021-03-12 | 深圳和美精艺半导体科技股份有限公司 | Packaging substrate processing method of double-sided OSP process |
| CN113597118A (en) * | 2021-09-28 | 2021-11-02 | 深圳和美精艺半导体科技股份有限公司 | Electroless plating lead gold plating process method |
| CN114453695A (en) * | 2022-01-06 | 2022-05-10 | 深圳市虹喜科技发展有限公司 | OSP process and PCB prepared by same |
-
2022
- 2022-08-29 CN CN202211040150.6A patent/CN115334768A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101508051A (en) * | 2009-03-11 | 2009-08-19 | 林原标 | Organic solderability preservative pre-soaking treating agent and organic solderability preservation film forming method |
| CN102548066A (en) * | 2012-02-08 | 2012-07-04 | 惠州中京电子科技股份有限公司 | PCB (Printed Circuit Board) surface treatment technology |
| CN104918417A (en) * | 2015-05-15 | 2015-09-16 | 江门崇达电路技术有限公司 | Method for producing organic solderability preservative on surface of circuit board |
| CN110049630A (en) * | 2019-04-17 | 2019-07-23 | 广州迅磊科技有限公司 | A kind of board production osp processing technology |
| CN112490134A (en) * | 2021-01-07 | 2021-03-12 | 深圳和美精艺半导体科技股份有限公司 | Packaging substrate processing method of double-sided OSP process |
| CN113597118A (en) * | 2021-09-28 | 2021-11-02 | 深圳和美精艺半导体科技股份有限公司 | Electroless plating lead gold plating process method |
| CN114453695A (en) * | 2022-01-06 | 2022-05-10 | 深圳市虹喜科技发展有限公司 | OSP process and PCB prepared by same |
Non-Patent Citations (1)
| Title |
|---|
| （叶建波: "《Altium Designer 15 电路设计与制板技术》", 北京：北京交通大学出版社, pages: 335 - 336 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024178657A1 (en) * | 2023-03-01 | 2024-09-06 | 京东方科技集团股份有限公司 | Manufacturing method for array substrate, array substrate and display apparatus |
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