CN106852007A - It is applied to the double layer nickel gold process of PCB surface treatment - Google Patents
It is applied to the double layer nickel gold process of PCB surface treatment Download PDFInfo
- Publication number
- CN106852007A CN106852007A CN201611270127.0A CN201611270127A CN106852007A CN 106852007 A CN106852007 A CN 106852007A CN 201611270127 A CN201611270127 A CN 201611270127A CN 106852007 A CN106852007 A CN 106852007A
- Authority
- CN
- China
- Prior art keywords
- nickel
- washing
- activation
- plating
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Abstract
The invention discloses a kind of double layer nickel gold process for being applied to PCB surface treatment, it is characterised in that it comprises the following steps：A, degreasing；B, washing；C, microetch；D, washing；E, activation；Washed after f, activation：First impregnated with finite concentration watery hydrochloric acid, then strong washing, hot water wash；G, a nickel：Pcb board is carried out into chemical nickel plating or electronickelling as needed；H, washing：First rinsed with running water, reusable heat washing, cleaning is twice；I, re-activation；J, ultrasound washing；K, secondary nickel：Selection corresponding chemical nickel-plating liquid carries out secondary nickel plating；L, ultrasound washing；M, chemical gilding：Chemical gilding, control time obtains the thickness of corresponding requirements；N, recovery washing：Deionized water rinsing, the gold that recovery is taken out of；O, drying：Dry packing treatment.The present invention is simple to operate, compared with prior art, it is to avoid the dew copper phenomenon that the formation and excessive corrosion in cavity are caused between nickel dam and layer gold.
Description
Technical field
The present invention relates to a kind of optimization of process for treating surface, more particularly to a kind of double layer nickel for being applied to PCB surface treatment
Gold process.
Background technology
Printed wiring board needs to be surface-treated before the packaging as the carrier of electric elements.Common table
Face treatment technology has chemical nickel plating to soak gold, chemical silver, organic matter coat film, chemical tin etc., but with electronic product with gently,
Thin, short, small development, new requirement is it is also proposed to wiring board, and chemical nickel plating leaching gold surface treatment technology can meet carefully because of it
Circuit and can meet simultaneously it is various encapsulation require and be greatly developed.
Chemical nickel plating gold is the common process for treating surface of printed wiring board, accepts PCB surface protection and encapsulation is inserted
Connecing for task.Traditional chemical nickel plating leaching gold is by after certain preceding treatment, first depositing a stratification in printed wiring plate surface
Learn nickel coating, redeposited stratification Gold plated Layer.But find in the application, traditional golden process of chemical nickel plating leaching is due to nickel dam
There is corrosion-resistant, easily form black nickel pad so that electronic product has very big reliability hidden danger, serious harm electronics
The reliability and service life of product.
The nickel dam microstructure of individual layer shows loose porous state, and chemistry leaching gold is again that displacement is reacted, in the golden process of leaching
In be actually a galvanic corrosion problems.Due to this configuration state and the corrosion behavior of chemical gilding of nickel dam, make
(leaching gold) must be corroded to be spread to base material depths along longitudinal development, many cavities are finally formd between nickel dam and layer gold,
Cause the problem of follow-up reliability.
The content of the invention
The purpose of the present invention is exactly provided to solve the deficiency of prior art a kind of not only easy to operate, and can be carried
The double layer nickel gold process for being applied to PCB surface treatment of high product quality.
The present invention is to realize above-mentioned purpose using following technical solution：It is a kind of to be applied to the double of PCB surface treatment
Layer nickel gold process, it is characterised in that it comprises the following steps：
A, degreasing：Printed wiring plate surface is cleared up with cleaning agent often using PCB；
B, washing：First rinsed with running water, reusable heat washing, cleaning is twice；
C, microetch：Its purpose obtains fresh copper face in removal oxidation, while reaching the copper of about 0.5-1.0 μm of absolute roughness
Face so that remain to obtain suitable rugosity after plating nickel gold, this result helps pulling force during routing；
D, washing：First rinsed with running water, reusable heat water is cleaned by ultrasonic, cleaning is twice；
E, activation：Copper face is activated using ionic palladium activation method, palladium ion concentration is controlled in 7ppm or so.Nickel of plating this
Step can be without；
Washed after f, activation：First impregnated with finite concentration watery hydrochloric acid, then strong washing, hot water wash；
G, a nickel：Pcb board is carried out into chemical nickel plating or electronickelling as needed；
H, washing：First rinsed with running water, reusable heat washing, cleaning is twice；
I, re-activation：Re-activation is carried out to a nickel dam；
J, ultrasound washing：First rinsed with running water, reusable heat water is cleaned by ultrasonic, cleaning is twice；
K, secondary nickel：Selection corresponding chemical nickel-plating liquid carries out secondary nickel plating；
L, ultrasound washing：First rinsed with running water, reusable heat water is cleaned by ultrasonic, cleaning is twice；
M, chemical gilding：Chemical gilding, control electroless plating time obtains the thickness of corresponding requirements；
N, recovery washing：Deionized water rinsing, the gold that recovery is taken out of；
O, drying：Dry packing treatment.
As further illustrating for such scheme, in the step g, be according to specific needs and printed wiring board spy
Property, select electronickelling or chemical nickel plating, nickel plating layer thick to control in 1-3um；In nickel process, the phosphorus content in coating is
5-15%, electronickelling does not contain phosphorus.
Further, during the re-activation of the step i, use contain dilute sulfuric acid 8-13% by weight percentage
Mixed liquor with citric acid 2-8% is activated.
Further, it is described ultrasound washing removal be adsorbed in coating surface impurity during, should be gone at 50 DEG C from
Carried out in the environment of sub- water.
Further, during the step k, phosphorus content of the nickel plating layer thick control in 0.5-1.5um, coating is
1%-10%.
Further, in the step m, plating solution is non-cyanide electroless gold liquid.
It is of the invention to be using the above-mentioned technical solution beneficial effect to be reached：
The coating that the present invention is obtained, can effectively weaken longitudinal direction corrosion of the plating solution to nickel dam, control during chemical gilding
Gold plated Layer is more evenly distributed in the superficial layer of nickel dam, it is to avoid the formation and excessive corrosion in cavity are made between nickel dam and layer gold
Into dew copper phenomenon.Additionally, when a nickel is electronickelling, electronickelling has the effect of filling perforation, and nickel dam is very smooth after secondary nickel,
Smooth nickel dam is highly beneficial to the deposition of layer gold, can cause that layer gold is more uniform, can also reduce the excessive corrosion of nickel.Together
When, MULTI-LAYER NICKEL can relatively thin thickness be issued to thicker nickel identical anticorrosion effect, the thickness of double layer nickel nickel dam can be one
Determine degree reduction, save cost.
Brief description of the drawings
Fig. 1 is process chart of the invention；
Fig. 2 is the double-deck nickel-gold layer surface topography map of the embodiment of the present invention 1；
Fig. 3 is the double layer nickel golden watch composition of layer figure of the embodiment of the present invention 1；
Fig. 4 is the double-deck nickel-gold layer surface topography map of the embodiment of the present invention 2；
Fig. 5 is the double layer nickel golden watch composition of layer figure of the embodiment of the present invention 2.
Specific embodiment
As shown in figure 1, the present invention is a kind of double layer nickel gold process for being applied to PCB surface treatment, it comprises the following steps：
A, degreasing：Printed wiring plate surface is cleared up with cleaning agent often using PCB, thoroughly removes surface and oil contaminant, table
Face wetting is good, without spot, impurity；
B, washing：First rinsed with running water, reusable heat washing, cleaning is twice；
C, microetch：Fresh copper face is obtained the purpose is to remove oxidation, while reaching about 0.5-1.0 μm of absolute roughness (Ra)
Copper face so that remain to obtain suitable rugosity after plating nickel gold, this result helps pulling force during routing, and micro-corrosion liquid main component is SPS
150g/l adds a small amount of hydrochloric acid, is principle to keep chlorion about 200ppm, and time control is in 1min；
D, washing：First rinsed with running water, reusable heat washing, cleaning is twice；
E, activation：Copper face is activated using ionic palladium activation method, palladium ion concentration is controlled in 7ppm or so；Nickel of plating this
Step can be without；
Washed after f, activation：First impregnated with finite concentration watery hydrochloric acid, then strong washing, the cleaning of hot water ultrasonic wave；
G, a nickel：Pcb board is carried out into chemical nickel plating or electronickelling, nickel-plating liquid selection acidic nickel plating solution as needed；
H, washing：First rinsed with running water, reusable heat washing, cleaning is twice；
I, re-activation：Re-activation is carried out to a nickel dam, activating solution includes 10% sulfuric acid and 5% citric acid；
J, ultrasound washing：First rinsed with running water, reusable heat water is cleaned by ultrasonic, cleaning is twice；
K, secondary nickel：Selection corresponding chemical nickel-plating liquid carries out secondary nickel plating, nickel-plating liquid selection acid chemical plating nickel liquid, thickness
It is maintained at 1um or so；
L, ultrasound washing：First rinsed with running water, reusable heat water is cleaned by ultrasonic, cleaning is twice；
M, chemical gilding：Chemical gilding, control electroless plating time obtains the thickness of corresponding requirements；
N, recovery washing：Deionized water rinsing, the gold that recovery is taken out of；
O, drying：Dry packing treatment.
Embodiment 1
In the present embodiment, a nickel major parameter control：Nickel plating layer thick 1.2um, phosphorus content：11.9%, nickel plating mode：
Chemical nickel plating；
Secondary nickel major parameter control：Thickness 0.2um, phosphorus content:7.9%；Chemical gilding layer parameter is controlled：Thickness
0.098um.The coating color for being obtained for it is golden yellow, without plating leakage and color distortion phenomenon, coating is uniformly arranged for graininess, survey
Examination adhesion is good, and coating welding performance is good, and coating morphology and composition are shown in accompanying drawing 1 and accompanying drawing 2.
Embodiment 2
In the present embodiment, a nickel major parameter control：Thickness 1.9um, phosphorus content：0 nickel plating mode：Electronickelling；
Secondary nickel major parameter control：Thickness 0.7um, phosphorus content：8.2%；Chemical gilding layer parameter is controlled：Thickness
0.11um.The coating color for being obtained for it is golden yellow, without plating leakage and color distortion phenomenon, top layer is totally deposited without black hot spot
Coating is more smooth, and test adhesion is good, and coating welding performance is good, and coating morphology and composition are shown in accompanying drawing 3 and accompanying drawing 4.
Embodiment 3
In the present embodiment, a nickel major parameter control：Thickness 2.3um, phosphorus content：8.6%；Nickel plating mode：Chemical plating
Nickel.Secondary nickel major parameter control：Thickness 1.3um, phosphorus content:3.2%；Chemical gilding layer parameter is controlled：Thickness 0.13um.Institute
The coating color of acquisition for it is golden yellow, without plating leakage and color distortion phenomenon, coating is uniformly arranged for graininess, tests adhesion good
Good, coating welding performance is good, and test effect has similar effects for 12 with example.
Compared with prior art, the coating of acquisition effectively can weaken plating solution to nickel dam to the present invention during chemical gilding
Longitudinal direction corrosion, control Gold plated Layer is more evenly distributed in the superficial layer of nickel dam, it is to avoid cavity between nickel dam and layer gold
Form the dew copper phenomenon caused with excessive corrosion.Additionally, when a nickel is electronickelling, electronickelling has the effect of filling perforation, secondary
Nickel dam is very smooth after nickel, and smooth nickel dam is highly beneficial to the deposition of layer gold, can cause that layer gold is more uniform, can also reduce
The excessive corrosion of nickel.Meanwhile, MULTI-LAYER NICKEL can be issued to and thicker nickel identical anticorrosion effect, double layer nickel nickel in relatively thin thickness
The thickness of layer can reduce to a certain degree, save cost.
Above-described is only the preferred embodiment of the present invention, it is noted that for one of ordinary skill in the art
For, without departing from the concept of the premise of the invention, various modifications and improvements can be made, these belong to the present invention
Protection domain.
Claims (6)
1. it is a kind of to be applied to the double layer nickel gold process that PCB surface is processed, it is characterised in that it comprises the following steps：
A, degreasing：Printed wiring plate surface is cleared up with cleaning agent often using PCB；
B, washing：First rinsed with running water, reusable heat washing, cleaning is twice；
C, microetch：Removal oxidation obtains fresh copper face, while reaching the copper face of absolute roughness Ra 0.5-1.0 μm；
D, washing：First rinsed with running water, reusable heat water is cleaned by ultrasonic, cleaning is twice；
E, activation：Copper face is activated using ionic palladium activation method, palladium ion concentration is controlled in 5-8ppm；
Washed after f, activation：First impregnated with finite concentration watery hydrochloric acid, then washed；
G, a nickel：Pcb board is carried out into chemical nickel plating or electronickelling as needed；
H, washing：First rinsed with running water, reusable heat washing, cleaning is twice；
I, re-activation：Re-activation is carried out to a nickel dam；
J, ultrasound washing：First rinsed with running water, reusable heat water is cleaned by ultrasonic, cleaning is twice；
K, secondary nickel：Selection corresponding chemical nickel-plating liquid carries out secondary nickel plating；
L, ultrasound washing：First rinsed with running water, reusable heat water is cleaned by ultrasonic, cleaning is twice；
M, chemical gilding：Control electroless plating time obtains the thickness of corresponding requirements；
N, washing are reclaimed：Deionized water rinsing, the gold that recovery is taken out of；
O, drying：Dry packing treatment.
2. it is according to claim 1 to be applied to the double layer nickel gold process that PCB surface is processed, it is characterised in that in the step
In rapid g, be according to specific needs and printed wiring board characteristic, select electronickelling or chemical nickel plating, nickel plating layer thick control exists
1-3um；In nickel process, the phosphorus content in coating is 5-15%, and electronickelling does not contain phosphorus.
3. it is according to claim 1 to be applied to the double layer nickel gold process that PCB surface is processed, it is characterised in that in the step
During the re-activation of rapid i, carried out using the mixed liquor containing dilute sulfuric acid 8-13% and citric acid 2-8% by weight percentage
Activation.
4. it is according to claim 1 to be applied to the double layer nickel gold process that PCB surface is processed, it is characterised in that described super
During sound washing removal is adsorbed in the impurity of coating surface, should be carried out in the environment of 50 DEG C of deionized waters.
5. it is according to claim 1 to be applied to the double layer nickel gold process that PCB surface is processed, it is characterised in that in the step
During rapid k, it is 1%-10% that nickel plating layer thick controls the phosphorus content in 0.5-1.5um, coating.
6. it is according to claim 1 to be applied to the double layer nickel gold process that PCB surface is processed, it is characterised in that in the step
In rapid m, plating solution is non-cyanide electroless gold liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611270127.0A CN106852007A (en) | 2016-12-30 | 2016-12-30 | It is applied to the double layer nickel gold process of PCB surface treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611270127.0A CN106852007A (en) | 2016-12-30 | 2016-12-30 | It is applied to the double layer nickel gold process of PCB surface treatment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106852007A true CN106852007A (en) | 2017-06-13 |
Family
ID=59116871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611270127.0A Pending CN106852007A (en) | 2016-12-30 | 2016-12-30 | It is applied to the double layer nickel gold process of PCB surface treatment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106852007A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493117A (en) * | 2018-03-13 | 2018-09-04 | 电子科技大学 | A kind of surface modification method inhibiting the diffusion of package substrate bond pad surface conductive silver glue |
| CN109468617A (en) * | 2018-11-30 | 2019-03-15 | 浙江长兴电子厂有限公司 | A kind of local electroplating nickel gold process |
| CN111763932A (en) * | 2020-06-01 | 2020-10-13 | 东莞市斯坦得电子材料有限公司 | Nickel plating process for flexible printed circuit board |
| CN114438482A (en) * | 2022-01-19 | 2022-05-06 | 广东工业大学 | Treatment fluid for rapidly increasing chemical gold leaching thickness and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59200451A (en) * | 1983-04-27 | 1984-11-13 | Niles Parts Co Ltd | Manufacture of hybrid integrated circuit substrate with bonding pad consisting of double layer structure |
| CN101525744A (en) * | 2009-04-27 | 2009-09-09 | 深圳市成功化工有限公司 | Superficial treatment method of printed wiring board |
| CN101684552A (en) * | 2008-09-26 | 2010-03-31 | 联鼎电子科技有限公司 | Electroless nickel plating method and circuit board manufactured by same |
-
2016
- 2016-12-30 CN CN201611270127.0A patent/CN106852007A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59200451A (en) * | 1983-04-27 | 1984-11-13 | Niles Parts Co Ltd | Manufacture of hybrid integrated circuit substrate with bonding pad consisting of double layer structure |
| CN101684552A (en) * | 2008-09-26 | 2010-03-31 | 联鼎电子科技有限公司 | Electroless nickel plating method and circuit board manufactured by same |
| CN101525744A (en) * | 2009-04-27 | 2009-09-09 | 深圳市成功化工有限公司 | Superficial treatment method of printed wiring board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493117A (en) * | 2018-03-13 | 2018-09-04 | 电子科技大学 | A kind of surface modification method inhibiting the diffusion of package substrate bond pad surface conductive silver glue |
| CN109468617A (en) * | 2018-11-30 | 2019-03-15 | 浙江长兴电子厂有限公司 | A kind of local electroplating nickel gold process |
| CN111763932A (en) * | 2020-06-01 | 2020-10-13 | 东莞市斯坦得电子材料有限公司 | Nickel plating process for flexible printed circuit board |
| CN114438482A (en) * | 2022-01-19 | 2022-05-06 | 广东工业大学 | Treatment fluid for rapidly increasing chemical gold leaching thickness and application thereof |
| CN114438482B (en) * | 2022-01-19 | 2023-08-15 | 广东工业大学 | Treatment fluid for rapidly improving thickness of chemical gold leaching and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106852007A (en) | It is applied to the double layer nickel gold process of PCB surface treatment | |
| JP2006188761A (en) | Conductive metal-plated polyimide substrate and method for producing the same | |
| JPH02500555A (en) | Multilayer circuit board manufacturing method | |
| CN107190254A (en) | A kind of new brown treatment fluid of printed circuit board | |
| JPS59104197A (en) | Machining method for clarifying hole of printed circuit board by using permanganate and caustic treating solution | |
| TWI241872B (en) | Improved coating for silver plated circuits | |
| JP2007056286A (en) | Aqueous solution for treating metal surface and method for preventing metal surface from discoloring | |
| JP2014053608A (en) | Circuit board and production method of the same | |
| JP2008516088A (en) | Method of processing non-conductive substrate for electroplating | |
| CN104241025B (en) | A kind of multiple layer nickel plating method of relay1 case | |
| CN110267455A (en) | A kind of PCB surface treatment process | |
| CN104619123B (en) | A kind of production method of pcb board | |
| CN107231753B (en) | A kind of heavy nickel gold method improving plating leakage | |
| CN107995802A (en) | A kind of preparation method of the immersion Ni/Au of printed circuit board (PCB) | |
| CN104394655B (en) | A kind of method for manufacturing gold finger for reducing golden finger oxidation | |
| TWI307730B (en) | Method of using ultrasonics to plate silver | |
| JP6184578B1 (en) | Method for electroless copper plating and method for producing catalyst solution for electroless copper plating | |
| CN101082126A (en) | Local chemical-plating technique for aluminum radiator bores | |
| CN104073845A (en) | Gold plating method for PCB | |
| WO2013109404A2 (en) | Low etch process for direct metalization | |
| KR20090116515A (en) | High ductility au surface treatment plating method of flexible printed circuit board | |
| CN110290647A (en) | A kind of repair method of immersion Ni/Au plating leakage plate | |
| DE4402413C2 (en) | Electroplating process | |
| CN112609217A (en) | Blackening solution and cyanide-free zinc-plating cadmium-free electroplating blackening process | |
| KR101478211B1 (en) | A preprocessing method of electronic copper-plating using Ionic conduting Nano Polymer to alternate a process of electroless copper-plating and Raw material for electronic copper plating of Copper Laminate of Plastic Circuit Board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170613 |
|
| RJ01 | Rejection of invention patent application after publication |