CN109468617A - A kind of local electroplating nickel gold process - Google Patents
A kind of local electroplating nickel gold process Download PDFInfo
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- CN109468617A CN109468617A CN201811452441.XA CN201811452441A CN109468617A CN 109468617 A CN109468617 A CN 109468617A CN 201811452441 A CN201811452441 A CN 201811452441A CN 109468617 A CN109468617 A CN 109468617A
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- circuit board
- nickel
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- plating
- palladium
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of local electroplating nickel gold process, successively the following steps are included: oil removing, protection non-plated region, microetch and activate, chemical nickel plating, microetch, ultrasonication and activate, chemical gilding and dissolution removal.The present invention carries out pre-treatment to circuit board non-plated region using chemical method, forms protective coating；Then topical nickel galvanization gold processing is carried out again, nano-titanium dioxide and ultrasonication are additionally added in treatment process, is not only advantageous to reduce content golden in nickel-plating liquid, but also can increase coating brightness.
Description
Technical field
The present invention relates to chemical nickel plating technology for gold field more particularly to a kind of local electroplating nickel gold process.
Background technique
Currently, the method for topical nickel galvanization, needs for be all carefully covered in other faces anti-plated patch, must will prevent after plating is good
Plating patch removes, and takes time more, influences production efficiency, and when improving production cost, while being electroplated, entire plating piece is placed on plating solution
In, after nickel plating, the plating piece surface of taking-up is unavoidably stained with plating solution, blocks not benefit and is also covered with nickel layer, wastes plating
Liquid, and since Au price is very expensive, in order to reduce cost, it is necessary to be improved to technique.Therefore the present invention provides one kind
Local electroplating nickel gold process.
Summary of the invention
Technical problems based on background technology, the invention proposes a kind of local electroplating nickel gold process.
Technical scheme is as follows:
A kind of local electroplating nickel gold process, comprising the following steps:
(1), oil removing: circuit board is put into acid deoiling agent, removes greasy dirt and fingerprint of plate face；
(2), it protects non-plated region: pre-treatment being carried out to circuit board surface, circuit board surface is divided into non-plated region and area to be plated
Domain；The non-plated region of circuit board surface Jing Guo pre-treatment is subjected to electric conductive oxidation processing, forms electric conductive oxidation in non-plated region
Layer；Circuit board non-plated region of the spraying by electric conductive oxidation processing forms drying after protective coating；
(3), it microetch and activates: circuit board being put into micro-corrosion liquid, erosion is slightly stung on copper surface；Circuit board is put into palladium activating solution
Activation makes circuit board region surface to be plated deposit one layer of activation palladium；
(4), chemical nickel plating: circuit board is put into nickel-plating liquid, deposits one layer of nickel on copper surface；
(5), microetch: product is placed in acid solution, and nickel surface is slightly stung to erosion；
(6), it ultrasonication and activates: circuit board being put into palladium activating solution, using ultrasonication 3-5min, is then carried out
Activation makes circuit board region surface to be plated deposit one layer of activation palladium；
(7), chemical gilding: circuit board is put into plating in chemical golden plating solution, one layer of gold plate is deposited in nickel surface and washes baking
It is dry；
(8), dissolution removal: the protective coating in removal step (2) is dissolved with isoamyl acetate.
Preferably, in the step (4), the content of the Nickel in Nickel Sulphate Plating Bath is 5.5-7.0g/L, and pH value control exists
4.2-5.0, temperature control is at 65-75 DEG C, time 3-5min.
Preferably, in the step (4) and (6), the content of palladium chloride is 35-55mg/L in the palladium activating solution.
It preferably, also include the nano-titanium dioxide of 5-12mg/L in the step (6), in palladium activating solution.
Preferably, the nano-titanium dioxide is rutile type nano titanic oxide, partial size 5-10nm.
Preferably, in the step (7), golden content is 0.1-0.3g/L, pH value control in the golden plating solution of the chemistry
System is in 5.0-5.4, and temperature control is at 80-90 DEG C, time 4-6min.
The invention has the beneficial effects that: the method for traditional topical nickel galvanization gold is masking method, and low efficiency is at high cost；This
Invention carries out pre-treatment to circuit board non-plated region using chemical method, forms protective coating；Then topical nickel galvanization is carried out again
Gold is handled, and nano-titanium dioxide and ultrasonication are additionally added in treatment process, is not only advantageous to reduce golden in nickel-plating liquid contain
Amount, but also coating brightness can be increased.
Specific embodiment
Embodiment 1:
A kind of local electroplating nickel gold process, comprising the following steps:
(1), oil removing: circuit board is put into acid deoiling agent, removes greasy dirt and fingerprint of plate face；
(2), it protects non-plated region: pre-treatment being carried out to circuit board surface, circuit board surface is divided into non-plated region and area to be plated
Domain；The non-plated region of circuit board surface Jing Guo pre-treatment is subjected to electric conductive oxidation processing, forms electric conductive oxidation in non-plated region
Layer；Circuit board non-plated region of the spraying by electric conductive oxidation processing forms drying after protective coating；
(3), it microetch and activates: circuit board being put into micro-corrosion liquid, erosion is slightly stung on copper surface；Circuit board is put into palladium activating solution
Activation makes circuit board region surface to be plated deposit one layer of activation palladium；
(4), chemical nickel plating: circuit board is put into nickel-plating liquid, deposits one layer of nickel on copper surface；
(5), microetch: product is placed in acid solution, and nickel surface is slightly stung to erosion；
(6), it ultrasonication and activates: circuit board being put into palladium activating solution, using ultrasonication 4min, is then lived
Change, circuit board region surface to be plated is made to deposit one layer of activation palladium；
(7), chemical gilding: circuit board is put into plating in chemical golden plating solution, one layer of gold plate is deposited in nickel surface and washes baking
It is dry；
(8), dissolution removal: the protective coating in removal step (2) is dissolved with isoamyl acetate.
In the step (4), the content of the Nickel in Nickel Sulphate Plating Bath is 6.2g/L, and pH value is controlled in 4.2-5.0, temperature
Control is at 72 DEG C, time 3.5min.
In the step (4) and (6), the content of palladium chloride is 52mg/L in the palladium activating solution.
It also include the nano-titanium dioxide of 10mg/L in the step (6), in palladium activating solution.
The nano-titanium dioxide is rutile type nano titanic oxide, partial size 5-10nm.
In the step (7), golden content is 0.25g/L in the golden plating solution of the chemistry, and pH value is controlled in 5.0-
5.4, temperature control is at 87 DEG C, time 5min.
Embodiment 2:
A kind of local electroplating nickel gold process, comprising the following steps:
(1), oil removing: circuit board is put into acid deoiling agent, removes greasy dirt and fingerprint of plate face；
(2), it protects non-plated region: pre-treatment being carried out to circuit board surface, circuit board surface is divided into non-plated region and area to be plated
Domain；The non-plated region of circuit board surface Jing Guo pre-treatment is subjected to electric conductive oxidation processing, forms electric conductive oxidation in non-plated region
Layer；Circuit board non-plated region of the spraying by electric conductive oxidation processing forms drying after protective coating；
(3), it microetch and activates: circuit board being put into micro-corrosion liquid, erosion is slightly stung on copper surface；Circuit board is put into palladium activating solution
Activation makes circuit board region surface to be plated deposit one layer of activation palladium；
(4), chemical nickel plating: circuit board is put into nickel-plating liquid, deposits one layer of nickel on copper surface；
(5), microetch: product is placed in acid solution, and nickel surface is slightly stung to erosion；
(6), it ultrasonication and activates: circuit board being put into palladium activating solution, using ultrasonication 3min, is then lived
Change, circuit board region surface to be plated is made to deposit one layer of activation palladium；
(7), chemical gilding: circuit board is put into plating in chemical golden plating solution, one layer of gold plate is deposited in nickel surface and washes baking
It is dry；
(8), dissolution removal: the protective coating in removal step (2) is dissolved with isoamyl acetate.
In the step (4), the content of the Nickel in Nickel Sulphate Plating Bath is 7.0g/L, and pH value is controlled in 4.2-5.0, temperature
Control is at 65 DEG C, time 5min.
In the step (4) and (6), the content of palladium chloride is respectively 35 and 45mg/L in the palladium activating solution.
It also include the nano-titanium dioxide of 12mg/L in the step (6), in palladium activating solution.
The nano-titanium dioxide is rutile type nano titanic oxide, partial size 5-10nm.
In the step (7), golden content is 0.1g/L in the golden plating solution of the chemistry, and pH value is controlled in 5.0-5.4,
Temperature control is at 90 DEG C, time 4min.
Embodiment 3:
A kind of local electroplating nickel gold process, comprising the following steps:
(1), oil removing: circuit board is put into acid deoiling agent, removes greasy dirt and fingerprint of plate face；
(2), it protects non-plated region: pre-treatment being carried out to circuit board surface, circuit board surface is divided into non-plated region and area to be plated
Domain；The non-plated region of circuit board surface Jing Guo pre-treatment is subjected to electric conductive oxidation processing, forms electric conductive oxidation in non-plated region
Layer；Circuit board non-plated region of the spraying by electric conductive oxidation processing forms drying after protective coating；
(3), it microetch and activates: circuit board being put into micro-corrosion liquid, erosion is slightly stung on copper surface；Circuit board is put into palladium activating solution
Activation makes circuit board region surface to be plated deposit one layer of activation palladium；
(4), chemical nickel plating: circuit board is put into nickel-plating liquid, deposits one layer of nickel on copper surface；
(5), microetch: product is placed in acid solution, and nickel surface is slightly stung to erosion；
(6), it ultrasonication and activates: circuit board being put into palladium activating solution, using ultrasonication 5min, is then lived
Change, circuit board region surface to be plated is made to deposit one layer of activation palladium；
(7), chemical gilding: circuit board is put into plating in chemical golden plating solution, one layer of gold plate is deposited in nickel surface and washes baking
It is dry；
(8), dissolution removal: the protective coating in removal step (2) is dissolved with isoamyl acetate.
In the step (4), the content of the Nickel in Nickel Sulphate Plating Bath is 5.5g/L, and pH value is controlled in 4.2-5.0, temperature
Control is at 75 DEG C, time 3min.
In the step (4) and (6), the content of palladium chloride is 55mg/L in the palladium activating solution.
It also include the nano-titanium dioxide of 5mg/L in the step (6), in palladium activating solution.
The nano-titanium dioxide is rutile type nano titanic oxide, partial size 5-10nm.
In the step (7), golden content is 0.3g/L in the golden plating solution of the chemistry, and pH value is controlled in 5.0-5.4,
Temperature control is at 80 DEG C, time 6min.
Comparative example 1
By the nano-titanium dioxide removal in embodiment 1, remaining proportion and technique are constant.
Comparative example 2
By the ultrasonic wave step removal in step (6), remaining proportion and technique are constant.
Through detecting, treated that thickness of coating homogeneity is outstanding for 1-3 local electroplating nickel of embodiment of the present invention gold process, finished product
Inoxidizability, electric conductivity and wearability are up to standard, coating coverage rate 100%.
And the sample of comparative example 1 and comparative example 2, coating coverage rate are equal less than 90%, by the golden plating solution of chemistry in comparative example 1
The content of middle gold is improved to 2g/L；Golden content is improved to 1.6g/L in the golden plating solution of chemistry in comparative example 2, just can achieve plating
Layer coverage rate 100%.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (6)
1. a kind of local electroplating nickel gold process, which comprises the following steps:
(1), oil removing: circuit board is put into acid deoiling agent, removes greasy dirt and fingerprint of plate face；
(2), it protects non-plated region: pre-treatment being carried out to circuit board surface, circuit board surface is divided into non-plated region and area to be plated
Domain；The non-plated region of circuit board surface Jing Guo pre-treatment is subjected to electric conductive oxidation processing, forms electric conductive oxidation in non-plated region
Layer；Circuit board non-plated region of the spraying by electric conductive oxidation processing forms drying after protective coating；
(3), it microetch and activates: circuit board being put into micro-corrosion liquid, erosion is slightly stung on copper surface；Circuit board is put into palladium activating solution
Activation makes circuit board region surface to be plated deposit one layer of activation palladium；
(4), chemical nickel plating: circuit board is put into nickel-plating liquid, deposits one layer of nickel on copper surface；
(5), microetch: product is placed in acid solution, and nickel surface is slightly stung to erosion；
(6), it ultrasonication and activates: circuit board being put into palladium activating solution, using ultrasonication 3-5min, is then carried out
Activation makes circuit board region surface to be plated deposit one layer of activation palladium；
(7), chemical gilding: circuit board is put into plating in chemical golden plating solution, one layer of gold plate is deposited in nickel surface and washes baking
It is dry；
(8), dissolution removal: the protective coating in removal step (2) is dissolved with isoamyl acetate.
2. local electroplating nickel gold process as described in claim 1, which is characterized in that in the step (4), the nickel plating
The content of nickel is 5.5-7.0g/L in liquid, and pH value control is in 4.2-5.0, and temperature control is at 65-75 DEG C, time 3-5min.
3. local electroplating nickel gold process as described in claim 1, which is characterized in that described in the step (4) and (6)
Palladium activating solution in palladium chloride content be 35-55mg/L.
4. local electroplating nickel gold process as described in claim 1, which is characterized in that in the step (6), in palladium activating solution
It also include the nano-titanium dioxide of 5-12mg/L.
5. local electroplating nickel gold process as claimed in claim 4, which is characterized in that the nano-titanium dioxide is rutile
Type nano-titanium dioxide, partial size 5-10nm.
6. local electroplating nickel gold process as described in claim 1, which is characterized in that in the step (7), the chemistry
Golden content is 0.1-0.3g/L in golden plating solution, and pH value control is in 5.0-5.4, and temperature control is at 80-90 DEG C, time 4-
6min。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811452441.XA CN109468617A (en) | 2018-11-30 | 2018-11-30 | A kind of local electroplating nickel gold process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811452441.XA CN109468617A (en) | 2018-11-30 | 2018-11-30 | A kind of local electroplating nickel gold process |
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| Publication Number | Publication Date |
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| CN109468617A true CN109468617A (en) | 2019-03-15 |
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| CN201811452441.XA Pending CN109468617A (en) | 2018-11-30 | 2018-11-30 | A kind of local electroplating nickel gold process |
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Citations (6)
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|---|---|---|---|---|
| CN101244459A (en) * | 2008-03-25 | 2008-08-20 | 合肥工业大学 | Chemical plating silver copper powder, chemical plating liquid and chemical plating method |
| CN102453933A (en) * | 2010-10-25 | 2012-05-16 | 深圳市国人射频通信有限公司 | Local electroplating method for aluminum material |
| CN102912329A (en) * | 2012-11-15 | 2013-02-06 | 苏州正信电子科技有限公司 | Chemical nickel and palladium plating process used for circuit boards |
| CN104561943A (en) * | 2014-12-27 | 2015-04-29 | 广东致卓精密金属科技有限公司 | Chemical nickel-palladium alloy plating process for circuit boards |
| CN106852007A (en) * | 2016-12-30 | 2017-06-13 | 广东致卓环保科技有限公司 | It is applied to the double layer nickel gold process of PCB surface treatment |
| CN107400881A (en) * | 2017-08-11 | 2017-11-28 | 深圳市百柔新材料技术有限公司 | A kind of nano composite colloid palladium composition and preparation method thereof |
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2018
- 2018-11-30 CN CN201811452441.XA patent/CN109468617A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101244459A (en) * | 2008-03-25 | 2008-08-20 | 合肥工业大学 | Chemical plating silver copper powder, chemical plating liquid and chemical plating method |
| CN102453933A (en) * | 2010-10-25 | 2012-05-16 | 深圳市国人射频通信有限公司 | Local electroplating method for aluminum material |
| CN102912329A (en) * | 2012-11-15 | 2013-02-06 | 苏州正信电子科技有限公司 | Chemical nickel and palladium plating process used for circuit boards |
| CN104561943A (en) * | 2014-12-27 | 2015-04-29 | 广东致卓精密金属科技有限公司 | Chemical nickel-palladium alloy plating process for circuit boards |
| CN106852007A (en) * | 2016-12-30 | 2017-06-13 | 广东致卓环保科技有限公司 | It is applied to the double layer nickel gold process of PCB surface treatment |
| CN107400881A (en) * | 2017-08-11 | 2017-11-28 | 深圳市百柔新材料技术有限公司 | A kind of nano composite colloid palladium composition and preparation method thereof |
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Application publication date: 20190315 |