JP3722724B2 - Manufacturing method of plated molded products - Google Patents

Manufacturing method of plated molded products Download PDF

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Publication number
JP3722724B2
JP3722724B2 JP2001192023A JP2001192023A JP3722724B2 JP 3722724 B2 JP3722724 B2 JP 3722724B2 JP 2001192023 A JP2001192023 A JP 2001192023A JP 2001192023 A JP2001192023 A JP 2001192023A JP 3722724 B2 JP3722724 B2 JP 3722724B2
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JP
Japan
Prior art keywords
molded product
plating
bath
plated
plating bath
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JP2001192023A
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Japanese (ja)
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JP2003003289A (en
Inventor
一博 明海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TAIYO MANUFACTURING CO., LTD.
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TAIYO MANUFACTURING CO., LTD.
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Priority to JP2001192023A priority Critical patent/JP3722724B2/en
Priority to TW091102193A priority patent/TW554086B/en
Priority to PCT/JP2002/001274 priority patent/WO2002064862A2/en
Priority to MYPI20080007A priority patent/MY148983A/en
Priority to MYPI20020502A priority patent/MY142899A/en
Priority to CNB028068580A priority patent/CN100360716C/en
Priority to EP02700586A priority patent/EP1360347A2/en
Publication of JP2003003289A publication Critical patent/JP2003003289A/en
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Publication of JP3722724B2 publication Critical patent/JP3722724B2/en
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Description

【0001】
【発明の属する技術分野】
本発明は、シルバー色あるいはブラック色にメッキされた2色成型品の製造方法に関し、詳しくは、例えば、スイッチ、パソコン操作用キー・トップ等の電気、電子部品、パソコン、電話等のOA機器、DVD、MD等の通信機器表面のメッキ方法に関し、さらに詳しくは携帯電話の操作釦(キー)の製造方法に関する。
【0002】
【従来の技術】
従来、携帯電話の釦等の成形品をメッキする場合には、成型品を前処理(化学処理)した後、水洗し、次いでニッケルメッキ、水洗処理を行った後クロムメッキし、水洗した後、乾燥している。ここで、使用しているクロムメッキ液は、6価クロームを含む浴組成を用い、6価クロムをイオン化させ電気泳動で対象製品表面に金属クロム被膜を形成させる。金属クロム被膜は6価、3価などのイオンは存在しないが、人体の皮膚に対する悪影響が心配されており、また処理物が廃棄された後の金属クロム腐食による6価クロムへの酸化による自然界に残留することが問題となっている。
【0003】
そこで、従来より、クロムメッキ液に3価クロムだけを使用する処理法が検討されているが、6価クロムだけで金属被膜を形成する従来法と比較して、当初より3価クロムを使用する方法では被膜の形成が十分ではなく、耐蝕性が劣ることが判明している。
【0004】
また、新規に導入した3価クロムメッキ浴で、2色成型品の携帯電話操作用釦へメッキを施す場合、メッキ処理条件が、メーカーよりの標準管理値内で実施する場合では、ユーザーよりのスペックを十分管理できないいくつかの問題があり、標準の管理数値および設備の変更が必要である。
【0005】
例えば、メッキ製品の表面に微細な凹凸が形成されることがある。この原因は、液中に混入したゴミや電解時の生成不純物がメッキ被膜に取り込まれるためと思われる。また、メッキ付き回り(均一電着性)が悪いことがあり、この原因は、凹凸の大きい製品形状のために、標準の電流密度で電流を流せないためと推定される。
【0006】
【発明が解決しようとする課題】
本発明は上記の実状に着目してなされたものであって、その目的とするところは、6価クロムを含まない処理液を使った表面処理により耐蝕性に優れた化成被膜を形成できるメッキ成形品の製造方法を提供することにある。
【0007】
【課題を解決するための手段】
本発明のメッキ成形品の製造方法は、ABS樹脂にて形成された一次成形品と、該一次成形品の内側にポリカーボネート樹脂にて形成された二次成形品とからなる、2色成形によって得られた成形品の表面に、3価クロムメッキを処理するメッキ成形品の製造方法であって、該成形品が、携帯電話の操作用釦であり、該一次成形品は厚さ0.15〜0.30mmの薄肉部を有し、そのことにより上記目的が達成される:
(a)メッキ浴における3価クロムの液濃度:6〜10g/リットル、
(b)メッキ浴における総不純物量:60ppm以下、
(c)浴温度:40〜50℃、
(d)メッキ浴のpH:3.2〜3.6、
(e)陰極電流密度:3〜5A/dm
(f)陽極/陰極比率:1.5〜2:1。
なお、本発明では、陽極/陰極比率は、陽極と陰極の表面積の比を意味する。
【0008】
一つの実施態様では、前記メッキ処理条件が、さらに以下を含む:
(g)整流器:全電流量の3倍以上の能力を有するものを使用すること、
(h)濾過能力:メッキ浴槽に設けられた濾過部に、浴液を浴量に対して1時間当たり7回転以上通過させる。
【0009】
一つの実施態様では、前記成形品が、携帯電話のシルバー色の操作用釦である。
【0010】
本発明の他のメッキ成形品の製造方法は、ABS樹脂にて形成された一次成形品と、該一次成形品の内側にポリカーボネート樹脂にて形成された二次成形品とからなる、2色成形によって得られた成形品の表面に、3価クロムメッキを処理するメッキ成形品の製造方法であって、該成形品が、携帯電話の操作用釦であり、該一次成形品は厚さ0.15〜0.30mmの薄肉部を有し、そのことにより上記目的が達成される:
以下の処理条件でメッキする工程を包含するメッキ成形品の製造方法:
(a)メッキ浴における3価クロムの液濃度:5〜10g/リットル、
(b)メッキ浴における総不純物量:60ppm以下、
(c)浴温度:53〜63℃、
(d)メッキ浴のpH:3.2〜3.6、
(e)陰極電流密度:3〜5A/dm
(f)陽極/陰極比率:1.5〜2:1。
【0011】
一つの実施態様では、前記メッキ処理条件が、さらに以下を含む:
(g)整流器:全電流量の3倍以上の能力を有するものを使用すること、
(h)濾過能力:メッキ浴槽に設けられた濾過部に、浴液を浴量に対して1時間当たり7回転以上通過させる。
【0012】
一つの実施態様では、前記成形品が、携帯電話のブラック色の操作用釦である。
【0014】
本発明の作用は次の通りである。
【0015】
本発明においては、以下の項目について、次の通りメッキ処理条件を変更する。
(1)表面凹凸物(異物付着、傷)
メッキ浴内の濾過能力を向上し、および浴の不純物管理値を変更する。それによって、液中粒子の均一化(濾過精度の向上)が行え、異物付着が減少できる。
(2)メッキ付き回り(均一電着性)
液濃度管理幅を調整し、液温度標準値を再設定し、さらにpH値を再設定する。
【0016】
すなわち、従来の方法に比べて、浴中の金属分濃度を高めにして均一電着性を向上させる。また、反応速度を向上させて均一電着性を向上させる。さらに、pH値を高めに設定し、反応速度を上げる。
【0017】
【発明の実施の形態】
以下、本発明を詳細に説明する。
【0018】
本発明の薄型成形品4は、図1に示すように、2色成形によって得られた薄肉部3を有するものであり、ABS樹脂にて形成された一次成形品1と、該一次成形品1の内側に二色成形によって成形された二次成形品2とを有する。二次成形品2は、必要に応じてPC等の透明な樹脂にて形成することができる。
【0019】
この皿状に射出成形された成形品4は薄肉部3を有し、その薄肉部の厚さは、通常0.35mm以下であり、好ましくは0.15〜0.30mmである。このような成形品は、キャビティとコアとを逆構造にした二色成形によって成形することができる。
【0020】
このようにして得られた薄肉部を有する成形品の表面に以下の工程によりメッキ処理が行われる。
(A)成形品を水洗し、その表面に無電解ニッケルメッキ(化学メッキ)または銅メッキによって金属メッキ層を形成する。
【0021】
無電解メッキは、以下のように行うことができる。
【0022】
エッチング工程:無水クロム酸と硫酸の水溶液に成形品を所定温度にて浸漬後、水洗し、表面を粗面化する。
【0023】
キャタリスト(キャタライザー)工程:塩化パラジウムと塩化第一スズと塩酸の水溶液に、成形品を浸漬後、水洗し、成形品表面にパラジウムを吸着させる。
【0024】
アクセレーター工程:
塩酸の水溶液に成形品を浸漬し、水洗しキャタリスト工程でパラジウムと一緒に吸着したスズを塩酸で溶解、脱落させる。
【0025】
無電解ニッケルメッキまたは銅メッキ(化学メッキ):
ニッケルまたは銅、ホルマリン、ロッセル塩、苛性ソーダ、次亜リン酸ソーダ、アンモニア、水等の混合液に浸漬し、水洗する。これによって、ホルマリン、次亜リン酸ソーダによる還元反応により、ニッケル(銅)をパラジウム上に析出させる。
【0026】
次に、無電解メッキ層上に、以下のようにして電気メッキを行う。
【0027】
本発明では、銅メッキをした後に、ニッケルメッキ、クロムメッキ又はクロム合金メッキをする。
(B)無電解メッキ層の表面に、電気メッキによって銅メッキ層を形成する。
【0028】
銅メッキ層の厚みは、通常5μm〜15μmである。
【0029】
銅メッキ条件は次のようにすることができる。
【0030】
濃度70〜90g/lの硫酸銅、濃度170〜210g/lの硫酸の硫酸銅浴の中に、成形品を10〜30℃(より好ましくは20℃)にて浸漬し、陰極電流密度1〜4A/dm2にてメッキする。
(C)銅メッキ層の表面に、電気メッキによってニッケル層を形成する。
【0031】
硫酸ニッケル、塩化ニッケル、ホウ酸、光沢剤を含む混合液に成形品を浸漬後、所定の電圧、電流条件で処理後、水洗し、成形品の表面にニッケルの被膜を形成する。
【0032】
上記メッキ処理後の水洗は、特殊装置を用い水に振動を与え水洗処理するのが好ましく、2色成型品の一次成形品1と二次成形品2との隙間等に浸入した液を完全に追い出すことができる。
(D)ニッケル層の表面に、電気メッキによってクロム層またはクロム合金層を形成する。
【0033】
本発明においては、3価クロムメッキを処理する。メッキ液の組成は、例えば、特開2000−54157号公報に示されているように、硫酸クロム(3価)、酢酸クロム(3価)、硝酸クロム(3価)、塩化クロム(3価)、重リン酸クロム(3価)を使用することができる。
【0034】
ここで、シルバー色のメッキ処理条件は、以下の通りである。
(a)メッキ浴における3価クロムの液濃度:6〜10g/リットル(好ましくは7〜9g/リットル)、
(b)メッキ浴における総不純物量:60ppm以下(好ましくは35ppm以下)、
(c)浴温度:40〜50℃(好ましくは47〜49℃)、
(d)メッキ浴のpH:3.2〜3.6(好ましくはpH3.35〜3.45)、
(e)陰極電流密度:3〜5A/dm2(好ましくは3.5〜4.5A/dm2)、
(f)陽極/陰極比率:1.5〜2:1,
(g)整流器:全電流量の3倍以上の能力を有するものを使用する、
(h)濾過能力:浴量に対して1時間当たり、浴量を7回以上転濾過部を通過させる。この濾過は、連続して行う。すなわち、従来では、浴液の循環量が2回/1時間程度であったものを、本発明では7〜10回/時間、浴液が循環するようにする。また使用するフィルタ(濾布)は、メッシュ5μm〜10μm(従来では50〜100μm程度であった)のものを使用するのが好ましい。
【0035】
また、上記電流は、メッキ浴に常に印可しておくのがよい。
【0036】
なお、ブラック色の成形品を得る場合には、上記処理条件のうち、以下の点を変更するのみである。
(a’)メッキ浴における3価クロムの液濃度:6〜10g/リットル(好ましくは6〜9g/リットル)、
(c’)浴温度:53〜63℃(好ましくは57〜59℃)、
(d’)メッキ浴のpH:3.2〜3.6(好ましくはpH3.45〜3.55)。
【0037】
上記のように、メーカの標準メッキ処理条件に対して、クロム濃度、液温度を約2%上げ、pHを約0.2低い値に設定し、かつ濾過能力を2.5倍以上に設定することにより、不純物の低減につながることができる。
【0038】
【実施例】
(実施例1)
ニッケルメッキ処理後の成形品を、以下のメッキ処理条件で、3価クロムメッキを行いシルバー色の携帯用釦を得た。
(a)メッキ浴における3価クロムの液濃度:9g/リットル
(b)メッキ浴における総不純物量:35ppm以下
(c)浴温度:48℃
(d)メッキ浴のpH:3.4
(e)陰極電流密度:4.0A/dm2
(f)陽極/陰極比率:1.5:1
(g)整流器:全電流量の3倍の能力を有するものを使用する。
(h)濾過能力:浴量に対して1時間当たり、浴量を7回転以上連続して濾過部を通過させる。
【0039】
その結果、表面に凹凸のない、かつメッキ付き回りの良いシルバー色の携帯用釦が得られた。
(実施例2)
ニッケルメッキ処理後の成形品を、以下のメッキ処理条件で、3価クロムメッキを行いブラック色の携帯用釦を得た。
(a)メッキ浴における3価クロムの液濃度:9g/リットル
(b)メッキ浴における総不純物量:35ppm以下
(c)浴温度:58℃
(d)メッキ浴のpH:3.5
(e)陰極電流密度:4.0A/dm2
(f)陽極/陰極比率:1.5:1
(g)整流器:全電流量の3倍の能力を有するものを使用する。
(h)濾過能力:浴量に対して1時間当たり、浴量を7回転以上連続して濾過部を通過させる。
【0040】
その結果、表面に凹凸のない、かつメッキ付き回りの良いブラック色の携帯用釦が得られた。
(比較例1)
ニッケルメッキ処理後の成形品を、以下のメッキ処理条件で、3価クロムメッキを行いシルバー色の携帯用釦を得た。
(a)メッキ浴における3価クロムの液濃度:5g/リットル
(b)メッキ浴における総不純物量:600ppm
(c)浴温度:40℃
(d)メッキ浴のpH:3.2
(e)陰極電流密度:7.0A/dm2
(f)陽極/陰極比率:1.5:1
(g)整流器:全電流量の1倍の能力を有するものを使用する。
(h)濾過能力:浴量に対して1時間当たり、浴量を2回転連続して濾過部を通過させる。
【0041】
その結果、表面に凹凸のない、かつメッキ付き回りの悪いシルバー色の携帯用釦が得られた。
(比較例2)
ニッケルメッキ処理後の成形品を、以下のメッキ処理条件で、3価クロムメッキを行いブラック色の携帯用釦を得た。
(a)メッキ浴における3価クロムの液濃度:8g/リットル
(b)メッキ浴における総不純物量:640ppm以下
(c)浴温度:50℃
(d)メッキ浴のpH:3.4
(e)陰極電流密度:7.0A/dm2
(f)陽極/陰極比率:1.5:1
(g)整流器:全電流量の2倍の能力を有するものを使用する。
(h)濾過能力:浴量に対して1時間当たり、浴量を2回転連続して濾過部を通過させる。
【0042】
その結果、表面に凹凸のない、かつメッキ付き回りの悪いブラック色の携帯用釦が得られた。
【0043】
なお、表面凹凸物の判定は、異物付着、傷等を目視にて30cm以上離して観察し、0.2mm以上の異物があったものは不合格と判定した。
【0044】
メッキ付き回りの判定は、均一にメッキされているか否か、および変色、曇り等の有無を目視にて観察し、変色、曇り等があるものは不合格とした。
【0045】
【発明の効果】
本発明によれば、6価クロムを含まない処理液を使った表面処理により耐蝕性に優れた金属被膜を形成でき、しかもメーカ標準に対して、クロム濃度、液温度を約2%上げ、pHを約0.2低い値に設定し、かつ濾過能力を2.5倍以上に設定することにより、不純物の低減につながることができる。
【図面の簡単な説明】
【図1】本発明の製造方法によって得られたメッキ成形品の一実施例の断面図である。
【符号の説明】
1 一次成形品
2 二次成形品
3 薄肉部
4 成形品
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for producing a two-color molded product plated in silver or black, and more specifically, for example, electrical and electronic parts such as switches and key tops for PC operation, OA equipment such as personal computers and telephones, The present invention relates to a method for plating a surface of a communication device such as a DVD or MD, and more particularly to a method for manufacturing an operation button (key) of a mobile phone.
[0002]
[Prior art]
Conventionally, when plating a molded product such as a cellular phone button, the molded product is pretreated (chemical treatment), washed with water, then nickel plated, washed with water, chrome plated, washed with water, It is dry. Here, the chromium plating solution used uses a bath composition containing hexavalent chrome, ionizes the hexavalent chromium, and forms a metallic chromium film on the surface of the target product by electrophoresis. Metallic chromium coating is hexavalent, although ions do not exist, such as trivalent, human are concerned about adverse effects on the skin, also naturally by oxidation to hexavalent chromium by metallic chromium corrosion after the processed product is discarded It remains a problem to remain.
[0003]
Therefore, conventionally, a treatment method using only trivalent chromium in the chromium plating solution has been studied, but trivalent chromium is used from the beginning as compared with the conventional method of forming a metal film with only hexavalent chromium. It has been found that the method does not provide sufficient film formation and has poor corrosion resistance.
[0004]
In addition, when plating a two-color molded product mobile phone operation button with a newly introduced trivalent chromium plating bath, if the plating processing conditions are within the standard control values from the manufacturer, There are some problems that are not enough to manage the specs, and standard control values and equipment changes are required.
[0005]
For example, fine irregularities may be formed on the surface of the plated product. This is probably because dust mixed in the liquid and impurities generated during electrolysis are taken into the plating film. In addition, there is a case where the plating coverage (uniform electrodeposition property) may be poor, and this is presumed to be because the current cannot flow at the standard current density because of the product shape with large irregularities.
[0006]
[Problems to be solved by the invention]
The present invention has been made paying attention to the above-mentioned actual condition, and the object is to form a plating film capable of forming a chemical conversion film having excellent corrosion resistance by a surface treatment using a treatment liquid not containing hexavalent chromium. It is in providing the manufacturing method of goods.
[0007]
[Means for Solving the Problems]
The method for producing a plated molded product of the present invention is obtained by two-color molding comprising a primary molded product formed of ABS resin and a secondary molded product formed of polycarbonate resin inside the primary molded product. A method of manufacturing a plated molded product by treating trivalent chromium plating on the surface of the molded product, wherein the molded product is an operation button for a mobile phone, and the primary molded product has a thickness of 0.15 to 0.15. Having a thin wall of 0.30 mm, whereby the above objective is achieved:
(A) Trivalent chromium liquid concentration in the plating bath: 6 to 10 g / liter,
(B) Total impurity amount in the plating bath: 60 ppm or less,
(C) Bath temperature: 40-50 ° C.
(D) pH of the plating bath: 3.2 to 3.6
(E) Cathode current density: 3-5 A / dm 2
(F) Anode / cathode ratio: 1.5-2: 1.
In the present invention, the anode / cathode ratio means the ratio of the surface area of the anode and the cathode.
[0008]
In one embodiment, the plating conditions further include:
(G) Rectifier: Use a rectifier that has a capacity of three times or more of the total current.
(H) Filtration capacity: The bath liquid is passed through the filtration section provided in the plating bath at least 7 rotations per hour with respect to the bath amount.
[0009]
In one embodiment, the molded product is a silver color operation button of a mobile phone.
[0010]
Another method for producing a plated molded product of the present invention is a two-color molding comprising a primary molded product formed of ABS resin and a secondary molded product formed of polycarbonate resin inside the primary molded product. A method for producing a plated molded product, in which trivalent chromium plating is processed on the surface of the molded product obtained by the above method, wherein the molded product is a button for operating a mobile phone, and the primary molded product has a thickness of 0. It has a thin part of 15 to 0.30 mm, whereby the above objective is achieved:
A method for producing a plated molded article including a step of plating under the following processing conditions:
(A) Liquid concentration of trivalent chromium in the plating bath: 5 to 10 g / liter,
(B) Total impurity amount in the plating bath: 60 ppm or less,
(C) Bath temperature: 53-63 ° C.
(D) pH of the plating bath: 3.2 to 3.6
(E) Cathode current density: 3-5 A / dm 2
(F) Anode / cathode ratio: 1.5-2: 1.
[0011]
In one embodiment, the plating conditions further include:
(G) Rectifier: Use a rectifier that has a capacity of three times or more of the total current.
(H) Filtration capacity: The bath liquid is passed through the filtration section provided in the plating bath at least 7 rotations per hour with respect to the bath amount.
[0012]
In one embodiment, the molded product is a black color operation button of a mobile phone.
[0014]
The operation of the present invention is as follows.
[0015]
In the present invention, the plating process conditions are changed as follows for the following items.
(1) Surface irregularities (foreign matter adhesion, scratches)
Improve the filtration capacity in the plating bath and change the impurity control value of the bath. Thereby, the particles in the liquid can be made uniform (improvement of filtration accuracy), and adhesion of foreign matters can be reduced.
(2) Around plating (uniform electrodeposition)
Adjust the liquid concentration control range, reset the liquid temperature standard value, and reset the pH value.
[0016]
That is, compared with the conventional method, the metal concentration in the bath is increased to improve the throwing power. Moreover, the reaction rate is improved to improve the throwing power. Furthermore, the pH value is set high to increase the reaction rate.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail.
[0018]
As shown in FIG. 1, the thin molded product 4 of the present invention has a thin portion 3 obtained by two-color molding, a primary molded product 1 formed of ABS resin, and the primary molded product 1. And a secondary molded product 2 molded by two-color molding. The secondary molded product 2 can be formed of a transparent resin such as PC as necessary.
[0019]
The molded product 4 injection-molded in the shape of a dish has a thin portion 3, and the thickness of the thin portion is usually 0.35 mm or less, preferably 0.15 to 0.30 mm. Such a molded product can be molded by two-color molding in which the cavity and the core are reversed.
[0020]
Plating treatment is performed on the surface of the molded article having the thin wall portion thus obtained by the following steps.
(A) The molded product is washed with water, and a metal plating layer is formed on the surface thereof by electroless nickel plating (chemical plating) or copper plating.
[0021]
Electroless plating can be performed as follows.
[0022]
Etching step: The molded product is immersed in an aqueous solution of chromic anhydride and sulfuric acid at a predetermined temperature, and then washed with water to roughen the surface.
[0023]
Catalyst (catalyzer) step: A molded product is immersed in an aqueous solution of palladium chloride, stannous chloride and hydrochloric acid, and then washed with water to adsorb palladium on the surface of the molded product.
[0024]
Accelerator process:
The molded product is immersed in an aqueous solution of hydrochloric acid, washed with water, and tin adsorbed together with palladium in the catalyst process is dissolved and removed with hydrochloric acid.
[0025]
Electroless nickel plating or copper plating (chemical plating):
Immerse in a mixed solution of nickel or copper, formalin, Rossell salt, caustic soda, sodium hypophosphite, ammonia, water, etc. and wash with water. Thereby, nickel (copper) is deposited on palladium by a reduction reaction with formalin and sodium hypophosphite.
[0026]
Next, electroplating is performed on the electroless plating layer as follows.
[0027]
In the present invention, nickel plating, chromium plating, or chromium alloy plating is performed after copper plating.
(B) A copper plating layer is formed on the surface of the electroless plating layer by electroplating.
[0028]
The thickness of the copper plating layer is usually 5 μm to 15 μm.
[0029]
The copper plating conditions can be as follows.
[0030]
The molded product is immersed in a copper sulfate bath of 70 to 90 g / l of copper sulfate and 170 to 210 g / l of sulfuric acid at 10 to 30 ° C. (more preferably 20 ° C.) to obtain a cathode current density of 1 to 1. Plating at 4 A / dm 2 .
(C) A nickel layer is formed on the surface of the copper plating layer by electroplating.
[0031]
A molded product is immersed in a mixed solution containing nickel sulfate, nickel chloride, boric acid, and a brightening agent, then treated under predetermined voltage and current conditions, and then washed with water to form a nickel film on the surface of the molded product.
[0032]
The water washing after the plating treatment is preferably performed by applying vibration to the water using a special device, and the liquid that has entered the gap between the primary molded product 1 and the secondary molded product 2 of the two-color molded product is completely removed. Can be kicked out.
(D) A chromium layer or a chromium alloy layer is formed on the surface of the nickel layer by electroplating.
[0033]
In the present invention, trivalent chromium plating is processed. The composition of the plating solution is, for example, chromium sulfate (trivalent), chromium acetate ( trivalent), chromium nitrate ( trivalent), chromium chloride ( trivalent) as disclosed in JP-A-2000-54157. Chromium biphosphate ( trivalent) can be used.
[0034]
Here, the silver plating conditions are as follows.
(A) Liquid concentration of trivalent chromium in the plating bath: 6 to 10 g / liter (preferably 7 to 9 g / liter),
(B) Total amount of impurities in the plating bath: 60 ppm or less (preferably 35 ppm or less),
(C) Bath temperature: 40-50 ° C (preferably 47-49 ° C),
(D) pH of the plating bath: 3.2 to 3.6 (preferably pH 3.35 to 3.45),
(E) Cathode current density: 3 to 5 A / dm 2 (preferably 3.5 to 4.5 A / dm 2 ),
(F) Anode / cathode ratio: 1.5-2: 1
(G) Rectifier: Use a rectifier that has a capacity that is at least three times the total current.
(H) Filtration capacity: The amount of the bath is passed through the rolling filtration section 7 times or more per hour with respect to the amount of the bath. This filtration is performed continuously. That is, the bath liquid is circulated 7 to 10 times / hour in the present invention, while the circulation rate of the bath liquid is conventionally about 2 times / hour. Further, it is preferable to use a filter (filter cloth) having a mesh size of 5 μm to 10 μm (conventionally about 50 to 100 μm).
[0035]
Moreover, it is preferable to always apply the current to the plating bath.
[0036]
In order to obtain a black molded product, only the following points are changed among the above processing conditions.
(A ′) Trivalent chromium concentration in the plating bath: 6 to 10 g / liter (preferably 6 to 9 g / liter)
(C ′) bath temperature: 53 to 63 ° C. (preferably 57 to 59 ° C.),
(D ′) Plating bath pH: 3.2 to 3.6 (preferably pH 3.45 to 3.55).
[0037]
As described above, the chromium concentration and the liquid temperature are increased by about 2%, the pH is set to a value lower by about 0.2, and the filtration capacity is set to 2.5 times or more than the manufacturer's standard plating treatment conditions. As a result, impurities can be reduced.
[0038]
【Example】
(Example 1)
The molded product after the nickel plating was subjected to trivalent chromium plating under the following plating conditions to obtain a silver portable button.
(A) Liquid concentration of trivalent chromium in the plating bath: 9 g / liter (b) Total impurity amount in the plating bath: 35 ppm or less (c) Bath temperature: 48 ° C.
(D) Plating bath pH: 3.4
(E) Cathode current density: 4.0 A / dm 2
(F) Anode / cathode ratio: 1.5: 1
(G) Rectifier: Use a rectifier having a capacity three times the total amount of current.
(H) Filtration capacity: The bath volume is continuously passed through the filtration section for 7 or more revolutions per hour with respect to the bath volume.
[0039]
As a result, a silver-colored portable button with no irregularities on the surface and good plating was obtained.
(Example 2)
The molded product after the nickel plating was subjected to trivalent chromium plating under the following plating conditions to obtain a black portable button.
(A) Liquid concentration of trivalent chromium in the plating bath: 9 g / liter (b) Total impurity amount in the plating bath: 35 ppm or less (c) Bath temperature: 58 ° C.
(D) pH of plating bath: 3.5
(E) Cathode current density: 4.0 A / dm 2
(F) Anode / cathode ratio: 1.5: 1
(G) Rectifier: Use a rectifier having a capacity three times the total amount of current.
(H) Filtration capacity: The bath volume is continuously passed through the filtration section for 7 or more revolutions per hour with respect to the bath volume.
[0040]
As a result, a black portable button having no unevenness on the surface and good plating was obtained.
(Comparative Example 1)
The molded product after the nickel plating was subjected to trivalent chromium plating under the following plating conditions to obtain a silver portable button.
(A) Liquid concentration of trivalent chromium in the plating bath: 5 g / liter (b) Total impurity amount in the plating bath: 600 ppm
(C) Bath temperature: 40 ° C
(D) pH of plating bath: 3.2
(E) Cathode current density: 7.0 A / dm 2
(F) Anode / cathode ratio: 1.5: 1
(G) Rectifier: A rectifier having a capacity that is one time the total amount of current is used.
(H) Filtration capacity: The amount of the bath is passed through the filtration unit continuously for two rotations per hour with respect to the amount of the bath.
[0041]
As a result, a silver portable button having no irregularities on the surface and poor plating was obtained.
(Comparative Example 2)
The molded product after the nickel plating was subjected to trivalent chromium plating under the following plating conditions to obtain a black portable button.
(A) Liquid concentration of trivalent chromium in the plating bath: 8 g / liter (b) Total impurity amount in the plating bath: 640 ppm or less (c) Bath temperature: 50 ° C.
(D) Plating bath pH: 3.4
(E) Cathode current density: 7.0 A / dm 2
(F) Anode / cathode ratio: 1.5: 1
(G) Rectifier: Use a rectifier having a capacity twice as large as the total amount of current.
(H) Filtration capacity: The amount of the bath is passed through the filtration unit continuously for two rotations per hour with respect to the amount of the bath.
[0042]
As a result, a black portable button with no irregularities on the surface and poor plating was obtained.
[0043]
The surface irregularities were determined by visually observing the adhesion of foreign matter, scratches, etc. at a distance of 30 cm or more, and those having a foreign matter of 0.2 mm or more were judged as rejected.
[0044]
Judgment of plating around was made by visually observing whether or not there was uniform plating and the presence or absence of discoloration, haze, etc., and those with discoloration, haze, etc. were rejected.
[0045]
【The invention's effect】
According to the present invention, a metal film having excellent corrosion resistance can be formed by surface treatment using a treatment liquid containing no hexavalent chromium, and the chromium concentration and the liquid temperature are increased by about 2% relative to the manufacturer standard, and the pH is increased. Can be reduced to about 0.2 by setting the filtration capacity to 2.5 times or more.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of one embodiment of a plated molded product obtained by the manufacturing method of the present invention.
[Explanation of symbols]
1 Primary molded product 2 Secondary molded product 3 Thin part 4 Molded product

Claims (6)

ABS樹脂にて形成された一次成形品と、該一次成形品の内側にポリカーボネート樹脂にて形成された二次成形品とからなる、2色成形によって得られた成形品の表面に、3価クロムメッキを処理するメッキ成形品の製造方法であって、
該成形品が、携帯電話の操作用釦であり、該一次成形品は厚さ0.15〜0.30mmの薄肉部を有し、
以下の処理条件でメッキする工程を包含するメッキ成形品の製造方法:
(a)メッキ浴における3価クロムの液濃度:6〜10g/リットル、
(b)メッキ浴における総不純物量:60ppm以下、
(c)浴温度:40〜50℃、
(d)メッキ浴のpH:3.2〜3.6、
(e)陰極電流密度:3〜5A/dm
(f)陽極/陰極比率:1.5〜2:1。
Trivalent chromium is formed on the surface of a molded product obtained by two-color molding, which comprises a primary molded product formed of ABS resin and a secondary molded product formed of polycarbonate resin inside the primary molded product. A method of manufacturing a plated molded product for processing plating,
The molded product is a button for operating a mobile phone, and the primary molded product has a thin portion with a thickness of 0.15 to 0.30 mm,
A method for producing a plated molded article including a step of plating under the following processing conditions:
(A) Trivalent chromium liquid concentration in the plating bath: 6 to 10 g / liter,
(B) Total impurity amount in the plating bath: 60 ppm or less,
(C) Bath temperature: 40-50 ° C.
(D) pH of the plating bath: 3.2 to 3.6
(E) Cathode current density: 3-5 A / dm 2
(F) Anode / cathode ratio: 1.5-2: 1.
前記メッキ処理条件が、さらに以下を含む請求項1記載のメッキ成形品の製造方法:
(g)整流器:全電流量の3倍以上の能力を有するものを使用する、
(h)濾過能力:メッキ浴槽に設けられた濾過部に、浴液を浴量に対して1時間当たり7回転以上通過させる。
The method for producing a plated molded article according to claim 1, wherein the plating treatment condition further includes:
(G) Rectifier: Use a rectifier that has a capacity that is at least three times the total current.
(H) Filtration capacity: The bath liquid is passed through the filtration section provided in the plating bath at least 7 rotations per hour with respect to the bath amount.
前記成形品が、携帯電話のシルバー色の操作用釦である請求項1又は2に記載のメッキ成形品の製造方法。  The method of manufacturing a plated molded product according to claim 1 or 2, wherein the molded product is a silver color operation button of a mobile phone. ABS樹脂にて形成された一次成形品と、該一次成形品の内側にポリカーボネート樹脂にて形成された二次成形品とからなる、2色成形によって得られた成形品の表面に、3価クロムメッキを処理するメッキ成形品の製造方法であって、
該成形品が、携帯電話の操作用釦であり、該一次成形品は厚さ0.15〜0.30mmの薄肉部を有し、
以下の処理条件でメッキする工程を包含するメッキ成形品の製造方法:
(a)メッキ浴における3価クロムの液濃度:5〜10g/リットル、
(b)メッキ浴における総不純物量:60ppm以下、
(c)浴温度:53〜63℃、
(d)メッキ浴のpH:3.2〜3.6、
(e)陰極電流密度:3〜5A/dm
(f)陽極/陰極比率:1.5〜2:1。
Trivalent chromium is formed on the surface of a molded product obtained by two-color molding, which comprises a primary molded product formed of ABS resin and a secondary molded product formed of polycarbonate resin inside the primary molded product. A method of manufacturing a plated molded product for processing plating,
The molded product is a button for operating a mobile phone, and the primary molded product has a thin portion with a thickness of 0.15 to 0.30 mm,
A method for producing a plated molded article including a step of plating under the following processing conditions:
(A) Liquid concentration of trivalent chromium in the plating bath: 5 to 10 g / liter,
(B) Total impurity amount in the plating bath: 60 ppm or less,
(C) Bath temperature: 53-63 ° C.
(D) pH of the plating bath: 3.2 to 3.6
(E) Cathode current density: 3-5 A / dm 2
(F) Anode / cathode ratio: 1.5-2: 1.
前記メッキ処理条件が、さらに以下を含む請求項4記載のメッキ成形品の製造方法:
(g)整流器:全電流量の3倍以上の能力を有するものを使用する、
(h)濾過能力:メッキ浴槽に設けられた濾過部に、浴液を浴量に対して1時間当たり7回転以上通過させる。
The method for producing a plated molded article according to claim 4, wherein the plating treatment condition further includes:
(G) Rectifier: Use a rectifier that has a capacity that is at least three times the total current.
(H) Filtration capacity: The bath liquid is passed through the filtration section provided in the plating bath at least 7 rotations per hour with respect to the bath amount.
前記成形品が、携帯電話のブラック色の操作用釦である請求項4又は5に記載のメッキ成形品の製造方法。  The method of manufacturing a plated molded product according to claim 4 or 5, wherein the molded product is a black operation button for a mobile phone.
JP2001192023A 2001-02-16 2001-06-25 Manufacturing method of plated molded products Expired - Fee Related JP3722724B2 (en)

Priority Applications (7)

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JP2001192023A JP3722724B2 (en) 2001-06-25 2001-06-25 Manufacturing method of plated molded products
TW091102193A TW554086B (en) 2001-02-16 2002-02-07 Method for producing plated molded product
MYPI20080007A MY148983A (en) 2001-02-16 2002-02-14 Method for producing plated molded product
MYPI20020502A MY142899A (en) 2001-02-16 2002-02-14 Method for producing plated molded product
PCT/JP2002/001274 WO2002064862A2 (en) 2001-02-16 2002-02-14 Method for producing plated molded product
CNB028068580A CN100360716C (en) 2001-02-16 2002-02-14 Method for producing plated molded product
EP02700586A EP1360347A2 (en) 2001-02-16 2002-02-14 Method for producing plated molded product

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