KR20030075623A - Plating method for lusterless metal layer and products coated by the method - Google Patents

Plating method for lusterless metal layer and products coated by the method Download PDF

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KR20030075623A
KR20030075623A KR1020020014947A KR20020014947A KR20030075623A KR 20030075623 A KR20030075623 A KR 20030075623A KR 1020020014947 A KR1020020014947 A KR 1020020014947A KR 20020014947 A KR20020014947 A KR 20020014947A KR 20030075623 A KR20030075623 A KR 20030075623A
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plating
concentration
nickel
coating
workpiece
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KR1020020014947A
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KR100453508B1 (en
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박형진
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박형진
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/04—Electroplating: Baths therefor from solutions of chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

PURPOSE: A method for coating a lusterless metal film having glossiness similar to aluminum on the surface of steel, and products coated by the method are provided. CONSTITUTION: The coating method of lusterless metal film comprises dipping and degreasing step of dipping a workpiece to be coated into degreasing solution to degrease the workpiece; anode degreasing step of conducting electricity to the dipping and degreased workpiece as the anode in 50 to 60 g/L of a caustic soda solution to decompose contaminants on the surface of the workpiece by oxidation; cathode degreasing step of removing contaminants in 100 to 120 g/L of sodium cyanide solution by hydrogen gas generated from the metal surface of the anode degreased workpiece; copper coating step of coating copper cyanide (CuCN) on the cathode degreased workpiece in a plating pot containing free-sodium cyanide having concentration of 50 to 60 g/L and copper having concentration of 70 to 90 g/L for 10 to 15 minutes under the conditions that coating temperature is 50 to 55 deg.C, and current density is 2 to 3 A/dm¬2; nickel coating step of coating nickel on the copper cyanide coated workpiece in a plating pot containing nickel sulfate having concentration of 440 to 460 g/L, nickel chloride having concentration of 45 to 55 g/L and boric acid having concentration of 65 to 75 g/L under the conditions that coating temperature is 45 to 50 deg.C, and current density is 4 to 6 A/dm¬2 as vibrating the plating pot for 10 to 15 minutes; and chromium coating step of coating chromium on the nickel coated workpiece in a plating pot containing chromic anhydride having concentration of 240 to 250 g/L for 30 second to 1 minute under the conditions that coating temperature is 40 to 50 deg.C, and current density is 5 to 7 A/dm¬2.

Description

무광택 금속피막을 도금하는 방법 및 이에 의해 도금된 제품{PLATING METHOD FOR LUSTERLESS METAL LAYER AND PRODUCTS COATED BY THE METHOD}Method for Plating Matte Metal Film and Products Plated thereby {PLATING METHOD FOR LUSTERLESS METAL LAYER AND PRODUCTS COATED BY THE METHOD}

본 발명은 무광택 금속피막을 갖는 제품 및 이의 제조방법에 관한 것으로, 특히 강철의 표면에 알루미늄과 유사한 광택을 갖는 무광택 금속피막을 도금하는 방법 및 이에 의하여 도금된 제품에 관한 것이다.The present invention relates to an article having a matte metal coating and a method of manufacturing the same, and more particularly, to a method of plating a matte metal coating having a gloss similar to aluminum on a surface of steel, and a product plated thereby.

종래 강철 소재의 표면에 부식을 방지하고, 장식을 하기 위하여 도금이 행해지고 있다. 이러한 도금으로는 일반적으로 동-니켈-크롬 도금이 알려져 있다. 동-니켈-크롬의 3층 도금에 있어서, 동 도금은 소재의 평활성을 개선하여 도금의 밀착성을 개선하기 위한 것이다. 니켈도금은 미적감각을 주로하고 내식성을 가미하는 것이다. 크롬도금은 주로 표면에 내마모성을 부여하기 위하여 행해진다. 또한 현재 행하여 지고 있는 대부분의 구리-니켈-크롬 도금은, 시안화 구리도금-광택니켈도금-크롬도금이다.In order to prevent corrosion and to decorate the surface of steel materials conventionally, plating is performed. As such plating, copper-nickel-chromium plating is generally known. In the three-layer plating of copper-nickel-chromium, copper plating is for improving the smoothness of the material to improve the adhesion of the plating. Nickel plating is mainly for aesthetics and corrosion resistance. Chromium plating is mainly carried out to impart wear resistance to the surface. In addition, most of the copper-nickel-chromium plating currently performed is copper cyanide plating-polished nickel plating-chromium plating.

그러나 장식을 위하여 무광의 니켈의 도금이 필요한 경우가 있으며, 이경우종래에는 광택 니켈 도금을 행한 후, 별도로 무광처리를 하는 경우가 많았다. 또한 종래의 무광 니켈 도금을 할 경우, 입자의 거칠기와 전기 편차에 의한 무광 색상의 불균일, 밀착성의 불량등 균일한 무광을 얻는 데에 어려움이 있었다. 특히, 알류미늄과 유사한 색상의 무광을 얻기 위하여 구리-니켈-크롬 도금을 할 경우, 온도, 전류밀도, 도금시간 등의 조건을 정확히 알 수 없어서, 알루미늄의 질감을 대체하는 강도가 세고, 비용이 저렴한 철강 도금 제품의 활용에 어려움이 있었다.However, plating of matt nickel may be necessary for decoration, and in this case, conventionally, after polishing nickel plating, matting is often performed separately. In addition, in the conventional matt nickel plating, there is a difficulty in obtaining a uniform matt such as non-uniformity of the matte color due to the roughness of the particles and electrical variation, poor adhesion. In particular, when copper-nickel-chromium plating is used to obtain a matte color similar to that of aluminum, the conditions such as temperature, current density, and plating time cannot be accurately known. There was a difficulty in utilizing steel plated products.

일반적으로 도금된 표면의 물리적 성질에 영향을 주는 인자로는 전류밀도, 온도, pH, 전해욕의 조성, 첨가제 등이 있다. 이러한 물리적 성질 중에는 광택도 포함되며, 무광택의 도금을 하기 위하여 도금 금속의 석출을 조절하는 것이 요구된다. 전류밀도는 핵의 성장 속도에 영향을 미치며, 저전류 밀도에서 도금된 물질의 결정은 조대하다. 전류밀도를 늘리면 핵의 성장속도는 커져서 미세한 결정의 도금이 되고 광택이 나게 된다. 그러나 전류밀도를 한계치 이상으로 올리면 수소의 발생이 일어나고, 결정의 성장이 방해되어 다공질 해면 모양의 결정이 석출된다. 또한 도금에 있어서 농도를 높이면 일반적으로 치밀한 도금이 되며, 온도를 올리면 이온의 확산이 활발하여져서 비교적 높은 전류에서도 치밀한 도금을 얻을 수 있게된다.In general, factors affecting the physical properties of the plated surface include current density, temperature, pH, composition of the electrolytic bath, and additives. These physical properties include gloss, and it is required to control the precipitation of the plated metal in order to perform matt plating. Current density affects the growth rate of the nucleus, and at low current densities, the crystals of the plated material are coarse. Increasing the current density increases the growth rate of the nucleus, resulting in a fine crystal plating and glossiness. However, if the current density is raised above the limit, hydrogen is generated, and the growth of the crystal is disturbed and the porous sponge-like crystal is precipitated. In addition, in the plating, when the concentration is increased, the plating is generally dense, and when the temperature is increased, the diffusion of ions becomes active, so that the plating is obtained even at a relatively high current.

본 발명은 상기와 같은 알류미늄의 색상 및 광택과 유사한 질감을 얻을 수 있는 강철에 대한 구리-니켈-크롬 도금 방법을 제공하는 것을 목적으로 한다. 특히 본 발명은 상기의 목적을 달성하기 위한 각각의 도금액의 구성과 도금조건으로서의 도금온도와, 전류밀도, 도금시간에 대한 조건을 제공하는 것을 목적으로 한다.It is an object of the present invention to provide a copper-nickel-chromium plating method for steel that can obtain a texture similar to the color and luster of aluminum as described above. In particular, it is an object of the present invention to provide conditions for the composition of each plating liquid and the plating temperature, current density, and plating time as the plating conditions for achieving the above object.

도1은 본 발명에 의한 무광택 금속피막을 제조하는 개략 공정도1 is a schematic process chart for manufacturing a matte metal film according to the present invention

본 발명에 의한 무광택 금속피막을 소재에 도금하는 방법은 도금될 소재를 침적탈지하는 단계와, 침적탈지된 소재를 농도 50 g/l 내지 60 g/l의 가성소다 용액에서 양극탈지하는 단계와, 양극 탈지된 소재를 농도 100 g/l 내지 120 g/l의 청화소다 용액에서 음극탈지하는 단계와, 음극탈지된 소재를 농도 50 g/l 내지 60 g/l의 유리청화소다 , 농도 70 g/l 내지 90 g/l의 동 도금액에서, 온도 50 내지 55 ℃, 전류밀도 2 내지 3 A/dm2의 조건으로 10 내지 15분간 청화동(CuCN) 도금하는 단계와, 상기 청화동도금된 소재를 농도 440 g/l 내지 460 g/l의 유산니켈 , 농도 45 g/l 내지 55 g/l의 염화니켈, 농도 65 g/l 내지 75 g/l의 붕산 도금액에서, 온도 45 내지 50 ℃, 전류밀도 4 내지 6 A/dm2의 조건으로 10 내지 15분간 진동을 주면서 니켈도금하는 단계와, 상기 니켈도금된 소재를 농도 250 g/l의 무수크롬산 도금액에서, 온도 40 내지 50 ℃, 전류밀도 5 내지 7 A/dm2의 조건으로 30초 내지 1분간 크롬도금하는 단계를 포함하는 것을 특징으로 한다.The method for plating a matte metal film on a material according to the present invention comprises the steps of immersion degreasing of the material to be plated, anodizing the degreased material in a caustic soda solution having a concentration of 50 g / l to 60 g / l, Cathodic degreasing of the cathode degreased material in a solution of blue soda at a concentration of 100 g / l to 120 g / l, and a glass of blue soda at a concentration of 50 g / l to 60 g / l, and a concentration of 70 g / l plating copper cyanide (CuCN) for 10 to 15 minutes at a temperature of 50 to 55 ° C. and a current density of 2 to 3 A / dm 2 in a copper plating solution of 1 to 90 g / l, and concentration of the cyanated copper plated material Nickel lactic acid at 440 g / l to 460 g / l, nickel chloride at a concentration of 45 g / l to 55 g / l, boric acid plating solution at a concentration of 65 g / l to 75 g / l, temperature 45-50 ° C., current density of 4 to 6 a / dm 2 under the condition of 10 to 15 minutes while the vibration and the nickel plating step, wherein the nickel-plated material concentration 250 g / l for Can be in a chromic acid plating liquid, it characterized in that it comprises a temperature from 40 to 50 ℃, current density of 5 to 730 seconds under the conditions of A / dm 2 to 1 minutes Chrome-plated.

또한 본 발명은 상기의 도금방법에 의하여 도금된 금속피막을 갖는 제품을 포함한다.The present invention also includes a product having a metal film plated by the above plating method.

본 발명에 있어서 광택을 조절하기 위한 변수의 변화로는 특히 전류밀도, 전기도금시간, 그리고 도금 온도와 관련된다. 또한 본 발명에 있어서 동, 니켈, 크롬에 의하여 착색된 광택과 색상의 변화는 순수하게 도금 피막에서의 빛의 반사효과와 관련이 있는 것으로서, 이는 피막의 광택 및 색상이 피막의 도금두께 및 결정의 크기와 관련이 있다는 것을 의미한다. 본 발명은 상업적으로 이용가능한 알류미늄의 색상과 질감을 갖는 금속피막 도금에 관한 것으로, 광택은 빚의 반사와 관련이 있고, 빛의 반사는 피막의 두께와 거칠기에 관련이 있다.Changes in the parameters for controlling gloss in the present invention are particularly related to current density, electroplating time, and plating temperature. Also, in the present invention, the gloss and color change colored by copper, nickel, and chromium are purely related to the reflection effect of light in the plating film, which means that the gloss and color of the film are determined by the plating thickness and crystal of the film. It is related to the size. FIELD OF THE INVENTION The present invention relates to metallization plating with the color and texture of commercially available aluminum, wherein gloss is related to the reflection of the debt, and the reflection of light is related to the thickness and roughness of the coating.

이하 본 발명의 실시예를 도1의 공정도를 참조하여 설명한다.Hereinafter, an embodiment of the present invention will be described with reference to the process diagram of FIG. 1.

본 발명에 의한 구리-니켈-크롬 도금공정은 침적탈지공정(10), 양극탈지공정 (20), 음극탈지공정(30), 구리도금공정(40), 니켈도금공정(50), 및 크롬도금공정 (60)으로 구성된다. 각 공정의 사이에는 통상적으로 수세공정이 추가 될 수 있다. 수세공정은 도금에 종사하는 당업자에게 있어서 자명한 것으로 설명을 생략한다.Copper-nickel-chromium plating process according to the present invention is a deposition degreasing step (10), anodic degreasing step (20), negative electrode degreasing step (30), copper plating step (40), nickel plating step (50), and chromium plating It consists of a process (60). In general, a washing process may be added between the processes. The washing process is obvious to those skilled in the art working on the plating, and description thereof is omitted.

침적탈지공정(10)은 소재의 표면에 부착된 유기물 등의 오염물을 제거하기 위한 공정이다. 탈지액을 넣은 탱크 속에 소재를 침지하는 것으로 화학적 작용과 물리적 작용에 의하여 오염물을 제거한다. 소재가 탄소강인 경우에 아세톤, 벤젠, 알코올, 에테르 등의 용제를 섞은 물에 침적하여 탈지한다.The immersion degreasing step 10 is a step for removing contaminants such as organic matter attached to the surface of the material. Dipping the material in the tank containing degreasing liquid removes contaminants by chemical and physical action. When the material is carbon steel, it is dipped in water mixed with a solvent such as acetone, benzene, alcohol, ether, and degreased.

양극 탈지공정(20)은 소재를 양극으로 해서 전기를 통하는 것으로, 발생하는 산소에 의해서 표면의 오염물을 산화해서 분해하는 공정이다. 이때 사용되는 전해액은 수산화타트륨(NaOH, 가성소다라고도 함) 농도를 60 g/l로 하여 10 내지 20초간 탈지를 행한다.In the positive electrode degreasing step 20, the raw material is used as an anode to conduct electricity. The positive electrode degreasing step 20 is a step of oxidizing and decomposing contaminants on the surface by oxygen generated. At this time, the electrolyte solution is degreased for 10 to 20 seconds at a concentration of titanium hydroxide (NaOH, also called caustic soda) at 60 g / l.

음극 탈지공정(30)은 금속면에서 발생하는 수소가스에 의해 오염물을 제거하는 것으로, 표면을 활성으로 유지하여 산화물 피막도 이완되게 하며 제거하는 것도가능하게 된다. 이 때 사용되는 전해액은 시안화나트륨(NaCN, 청화소다라고도 함) 농도를 120 g/l로 하여 10 내지 20초간 탈지를 행한다.The negative electrode degreasing step 30 removes contaminants by hydrogen gas generated from a metal surface. The negative electrode degreasing step 30 also maintains the surface of the active material to relax and remove the oxide film. The electrolyte solution used at this time is degreased for 10 to 20 seconds at a concentration of 120 g / l sodium cyanide (NaCN).

동도금공정(40)은 일반적으로 소재 표면의 평활화를 위하여 행하여 진다. 그러나 본 발명에 있어서의 동 도금공정은 알류미늄의 광택 및 색상과 유사한 광택및 색상을 형성하기 위하여 행하여 지는 것으로, 니켈 도금을 위한 무광택의 바탕 기질을 형성하기 위한 것이다. 이러한 동 도금에서는 석출되는 결정의 크기와 형상이 중요하므로 온도, 전류밀도등의 도금조건이 중요하게 된다. 즉, 무광택의 니켈도금 피막을 수용하기 위하여, 적절한 석출 결정의 형상과 표면 거칠기를 갖는 무광택의 동 도금 피막이 형성되도록, 도금온도, 전류밀도, 도금시간등이 조절되어야 한다. 본 발명에 의한 무광택 금속피막을 얻기 위한 도금조건은 농도 70내지 90 g/l의 청화동(CuCN), 농도 50 내지 60 g/l의 유리청하소다(free-NaCN)의 도금욕에서, 도금 온도 50 내지 55 ℃, 전류밀도 2 내지 3 A/dm2의 조건으로 10 내지 15분간 청화동(CuCN) 도금을 하는 것이 바람직하다. 이러한 조건에서 도금된 동 도금의 두께는 최소 8 내지 10 ㎛ 가 되어야 한다.The copper plating process 40 is generally performed to smooth the surface of the material. However, the copper plating process in the present invention is performed to form a gloss and color similar to that of aluminum, and to form a matte base substrate for nickel plating. In such copper plating, the size and shape of the precipitated crystal is important, so the plating conditions such as temperature and current density become important. That is, in order to accommodate the matt nickel plated film, the plating temperature, the current density, the plating time, and the like must be adjusted so that a matt copper plated film having an appropriate precipitate crystal shape and surface roughness is formed. Plating conditions for obtaining a matte metal film according to the present invention is the plating temperature in a copper bath (CuCN) having a concentration of 70 to 90 g / l, a glass bath (free-NaCN) of 50 to 60 g / l concentration, the plating temperature It is preferable to perform cyanide copper (CuCN) plating for 10 to 15 minutes under conditions of 50 to 55 ° C and a current density of 2 to 3 A / dm 2 . Under these conditions, the thickness of the plated copper plating should be at least 8 to 10 μm.

니켈도금공정(50)은 일반적으로 내식성을 목적으로 금속의 표면에 행하여 지나, 본 발명에 있어서 니켈도금은 내식성의 목적과 함께 알루미늄 광택과 유사한 광택을 얻기위하여 행하여 지는 것이다. 이러한 목적을 달성하기 위하여는 적절한 도금온도와, 전류밀도, 도금시간이 중요하다. 즉, 석출되는 니켈이 적절한 결정 크기와 표면거칠기를 갖도록 하여야 한다. 본 발명에 의한 무광택 금속피막을 얻기 위한 도금조건은 농도 440 g/l 내지 460 g/l의 유산니켈(NiSO46또는7 H2O), 농도 45 g/l 내지 55 g/l의 염화니켈(NiCl26H2O) , 농도 65 g/l 내지 75 g/l 붕산(H3BO3)의 도금욕에서, 도금온도 45 내지 50 ℃, 전류밀도 4 내지 6 A/dm2의 조건으로 10 내지 15분간 진동을 주면서 니켈도금을 하는 것이다. 본 도금법의 특징은 니켈의 농도를 고농도로 하여 석출되는 니켈의 입자를 크게하고 무광택이 되도록 하여 알류미늄의 무광택과 유사한 광택을 내는 점이다.The nickel plating process 50 is generally performed on the surface of the metal for the purpose of corrosion resistance. In the present invention, nickel plating is performed to obtain a gloss similar to aluminum gloss with the purpose of corrosion resistance. In order to achieve this purpose, proper plating temperature, current density and plating time are important. That is, the precipitated nickel should have an appropriate crystal size and surface roughness. Plating conditions for obtaining a matte metal film according to the present invention is a nickel lactate (NiSO 4 6 or 7 H 2 O) of a concentration of 440 g / l to 460 g / l, nickel chloride of a concentration of 45 g / l to 55 g / l (NiCl 2 6H 2 O), in a plating bath having a concentration of 65 g / l to 75 g / l boric acid (H 3 BO 3 ), 10 at a plating temperature of 45 to 50 ° C. and a current density of 4 to 6 A / dm 2 . Nickel plating while giving a vibration for 15 minutes. A feature of this plating method is that the nickel concentration is increased to a high concentration, and the precipitated nickel particles are made large and matte to give luster similar to that of aluminum.

크롬도금공정(60)은 일반적으로 도금표면에 내마모성을 부여하기 위하여 행하여 진다. 크롬도금욕은 일반적으로 무수크롬산을 사용하고 이것에 황산, 불화물, 규불화물 등의 촉매를 단독 또는 혼합해서 첨가한다. 본 발명에 의한 무광택의 금속표면을 얻기위한 크롬도금의 조건은 농도 240 내지 250 g/l 무수크롬산, 도금온도 40 내지 50 ℃, 전류밀도 5 내지 7 A/dm2의 조건으로 30초 내지 1분간 도금을 하는 것이다.The chromium plating process 60 is generally performed to impart wear resistance to the plating surface. In the chromium plating bath, chromic anhydride is generally used, and a catalyst such as sulfuric acid, fluoride, and silicide is added alone or in combination. The chromium plating conditions for obtaining the matt metal surface according to the present invention are 30 seconds to 1 minute under the conditions of concentration 240 to 250 g / l chromic anhydride, plating temperature 40 to 50 ℃, current density 5 to 7 A / dm 2 It is plating.

본 발명에 의한 구리-니켈-크롬 도금 방법은 소재의 표면에 알루미늄의 광택및 색상과 유사한 색상 및 광택을 갖도록 강철의 표면에 도금을 하는 것이 가능하다. 특히 소재의 평활성은 청화동 무광 도금에서 충분히 확보되므로, 니켈도금시 청화동의 무광을 그대로 보존하게 되어 별도의 무광 처리를 하지 않아도 된다. 또한 소재에 청화동에 의한 무광 효과와 니켈에 의한 무광효과가 합성되므로 균일한무광으로 알류미늄 소재의 무광 색상에 근사한 색상을 얻을 수 있다.The copper-nickel-chromium plating method according to the present invention makes it possible to plate the surface of steel to have a color and luster similar to the gloss and color of aluminum on the surface of the material. In particular, the smoothness of the material is sufficiently secured in the blue and white copper matt plating, so that the nickel of the blue and blue copper is preserved as it is during nickel plating, so that no additional matting treatment is required. In addition, since the matte effect of cyanide copper and the matte effect of nickel are synthesized in the material, a color similar to that of the aluminum material can be obtained with uniform matte.

또한 본 발명의 도금방법에 의하면 별도의 유기물을 사용하지 않음으로서 유기물 도금액에 의한 환경오염을 방지 할 수 있다.In addition, according to the plating method of the present invention, it is possible to prevent environmental pollution by the organic plating solution by not using a separate organic material.

앞에서 설명되고, 도면에 도시된 본 발명의 일 실시예는 본 발명의 기술적사상을 한정하는 것으로 해석되어서는 안 된다. 본 발명의 보호범위는 청구범위에 기재된 사항에 의하여만 제한되고, 본 발명의 기술분야에서 통상의 지식을 가진 자는 본 발명의 기술적 사상을 다양한 형태로 개량 변경하는 것이 가능하다. 따라서 이러한 개량 및 변경은 통상의 지식을 가진 자에게 자명한 것인 한 본 발명의 보호범위에 속하게 될 것이다.An embodiment of the present invention described above and illustrated in the drawings should not be construed as limiting the technical spirit of the present invention. The protection scope of the present invention is limited only by the matters described in the claims, and those skilled in the art can change and change the technical idea of the present invention in various forms. Therefore, such improvements and modifications will fall within the protection scope of the present invention, as will be apparent to those skilled in the art.

Claims (2)

도금될 소재를 침적탈지하는 단계와,Dipping and degreasing the material to be plated; 침적탈지된 소재를 농도 50 g/l 내지 60 g/l의 가성소다 용액에서 양극탈지시키는 단계와,Anodizing the degreased material in a caustic soda solution at a concentration of 50 g / l to 60 g / l, 양극 탈지된 소재를 농도 100 g/l 내지 120 g/l의 청화소다 용액에서 음극 탈지 시키는 단계와,Cathodic degreasing of the cathode degreased material in a solution of blue soda at a concentration of 100 g / l to 120 g / l, 음극 탈지된 소재를 농도 50 g/l 내지 60 g/l의 유리청화소다, 농도 70 g/l 내지 90 g/l의 동 도금욕에서, 도금온도 50 내지 55 ℃, 전류밀도 2 내지 3 A/dm2의 조건으로 10 내지 15분간 청화동(CuCN) 도금하는 단계와,The negative electrode degreased material was placed in a glass and blue soda at a concentration of 50 g / l to 60 g / l, a copper plating bath at a concentration of 70 g / l to 90 g / l, and a plating temperature of 50 to 55 ° C. and a current density of 2 to 3 A /. quenching copper (CuCN) for 10 to 15 minutes under conditions of dm 2 , 상기 청화동도금된 소재를 농도 440 g/l 내지 460 g/l의 유산니켈, 농도 45 g/l 내지 55 g/l의 염화니켈 , 농도 65 g/l 내지 75 g/l의 붕산 도금욕에서, 도금온도 45 내지 50 ℃, 전류밀도 4 내지 6 A/dm2의 조건으로 10 내지 15분간 진동을 주면서 니켈도금하는 단계와,The cyanized copper plated material was used in a boric acid plating bath having a concentration of 440 g / l to 460 g / l nickel lactate, a concentration of 45 g / l to 55 g / l nickel chloride, and a concentration of 65 g / l to 75 g / l, Plating nickel while vibrating for 10 to 15 minutes under conditions of a plating temperature of 45 to 50 ° C. and a current density of 4 to 6 A / dm 2 , 상기 니켈도금된 소재를 농도 240 g/l 내지 250 g/l의 무수크롬산 도금욕에서, 도금온도 40 내지 50 ℃, 전류밀도 5 내지 7 A/dm2의 조건으로 30초 내지 1분간 크롬도금하는 단계를 포함하는 것을 특징으로 하는 무광택 금속피막을 소재에 도금하는 방법.The nickel plated material is chromium plated in a concentration of 240 g / l to 250 g / l in a chromic anhydride plating bath at a plating temperature of 40 to 50 ° C. and a current density of 5 to 7 A / dm 2 for 30 seconds to 1 minute. Method for plating a matte metal film on the material, characterized in that it comprises a step. 상기 제1항의 무광택 금속피막을 소재에 도금하는 방법에 의해서 도금된 금속피막을 갖는 제품.A product having a metal film plated by a method of plating the matte metal film of claim 1 on a material.
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KR100881061B1 (en) * 2007-06-19 2009-01-30 한용순 Method for electroplating with magnesium alloy a plate
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KR20210138399A (en) * 2020-05-12 2021-11-19 주식회사 써켐 A Cyanide Copper Plating Solution And A Method for Cyanide Copper Plating Using The Same

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JPS6289895A (en) * 1985-10-15 1987-04-24 Nippon Kokan Kk <Nkk> Energizing roll for surface treatment
JPS6289894A (en) * 1985-10-15 1987-04-24 Nippon Kokan Kk <Nkk> Energizing roll for surface treatment
JPH03153896A (en) * 1989-11-09 1991-07-01 Kanto Kasei Kogyo Kk Nickel plating solution, bright copper-nickel-chromium electroplating method using this solution and ensuring superior corrosion resistance and plating film obtained by this method
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JP3545051B2 (en) * 1994-06-14 2004-07-21 日新製鋼株式会社 Zn-Mg based plated steel sheet excellent in corrosion resistance and manufacturing method

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KR100872113B1 (en) * 2008-03-21 2008-12-05 주식회사 창성에이스산업 Surface treatment method for magnesium board
KR101112702B1 (en) * 2009-03-12 2012-02-16 신성테크윈 주식회사 method for E-coating of a metal goods
KR20210138399A (en) * 2020-05-12 2021-11-19 주식회사 써켐 A Cyanide Copper Plating Solution And A Method for Cyanide Copper Plating Using The Same

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