JP2781362B2 - Manufacturing method of chrome plated products - Google Patents

Manufacturing method of chrome plated products

Info

Publication number
JP2781362B2
JP2781362B2 JP7175930A JP17593095A JP2781362B2 JP 2781362 B2 JP2781362 B2 JP 2781362B2 JP 7175930 A JP7175930 A JP 7175930A JP 17593095 A JP17593095 A JP 17593095A JP 2781362 B2 JP2781362 B2 JP 2781362B2
Authority
JP
Japan
Prior art keywords
nickel
plating layer
phosphorus
layer
chromium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP7175930A
Other languages
Japanese (ja)
Other versions
JPH08100273A (en
Inventor
新 藤井
泰治 山辺
清孝 船田
正敏 丸田
雅信 柘植
Original Assignee
マルイ工業株式会社
キザイ株式会社
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Publication date
Application filed by マルイ工業株式会社, キザイ株式会社 filed Critical マルイ工業株式会社
Priority to JP7175930A priority Critical patent/JP2781362B2/en
Publication of JPH08100273A publication Critical patent/JPH08100273A/en
Application granted granted Critical
Publication of JP2781362B2 publication Critical patent/JP2781362B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00Coating not provided for in groups C23C2/00 - C23C24/00
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • C25D5/12Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/605Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611Smooth layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/623Porosity of the layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、長期間にわたって
高い耐食性と優れた光沢外観を示す、自動車、建築物等
の外装や屋外装飾品として好適なクロムめっき製品の製
造方法に関するものである。さらに詳しくいえば、本発
明は、いわゆるマイクロポーラスめっきを施された製品
における耐食性をいっそう向上させるとともに光沢剤を
使用せずに、外観光沢を付与させたクロムめっき製品の
製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a chrome-plated product which exhibits high corrosion resistance and excellent gloss appearance over a long period of time and is suitable as an exterior or outdoor decoration of automobiles and buildings. More specifically, the present invention relates to a method for producing a chromium-plated product, which has improved corrosion resistance in a product having been subjected to so-called microporous plating and has an appearance gloss without using a brightener.

【0002】[0002]

【従来の技術】亜鉛ダイカスト品、鋼板プレス品、アル
ミニウムダイカスト品、無電解めっきを施し導電性を付
与した合成樹脂成形品などの基材に、銅とニッケルとク
ロム又はニッケルとクロムを順次電気めっきしたもの
が、自動車の装飾用外装用や建築物の外装用として広く
用いられている。
2. Description of the Related Art Copper, nickel and chromium or nickel and chromium are sequentially electroplated on a base material such as a zinc die-cast product, a steel plate pressed product, an aluminum die-cast product, or a synthetic resin molded product subjected to electroless plating to impart conductivity. These are widely used as exterior decorations for automobiles and exteriors for buildings.

【0003】ところで、ニッケル層上にクロムを電気め
っきした場合、図1の(a)に示すように、めっき時に
発生するクロム層を貫通したピット、クラックなどの欠
陥に起因して、クロム側が陰極、ニッケル側が陽極とな
り、両者間に電流が流れるが、ニッケル側の陽極面積が
小さいため、ニッケル層の腐食電流密度が大きくなり、
腐食が速かに進行する結果、形成された腐食空洞上のク
ロムめっき層が早期に脱離し、短時間で外観を損なうと
いう現象がみられる。
In the case where chromium is electroplated on a nickel layer, as shown in FIG. 1A, the chromium side has a negative electrode due to defects such as pits and cracks penetrating the chromium layer generated during plating. The nickel side becomes the anode, and current flows between them, but since the anode area on the nickel side is small, the corrosion current density of the nickel layer increases,
As a result of the rapid progress of corrosion, a phenomenon is observed in which the chromium plating layer on the formed corrosion cavities is detached at an early stage and the appearance is impaired in a short time.

【0004】このような欠点を改良するために、図1の
(b)に示すように、非金属不活性微粒子を分散したニ
ッケルめっき浴でめっきを行い、その微粒子をニッケル
めっき層中に析出させて複合ニッケルめっき層としたの
ち、その上にクロムめっきを施してクロムめっき層に多
数の微孔を形成させることにより陽極の面積を増大させ
て腐食電流密度を小さくし、耐食性を向上させる方法、
いわゆるマイクロポーラスクロムめっき法が知られてい
る。この方法においては下地層として設けるニッケルめ
っき層を光沢ニッケル層の単層又は、光沢ニッケル層と
半光沢ニッケル層の複層とすることが行われている。
In order to improve such disadvantages, as shown in FIG. 1B, plating is performed in a nickel plating bath in which non-metallic inert fine particles are dispersed, and the fine particles are deposited in a nickel plating layer. After forming a composite nickel plating layer, chromium plating is performed thereon to form a large number of micropores in the chromium plating layer, thereby increasing the area of the anode, reducing the corrosion current density, and improving the corrosion resistance.
A so-called microporous chrome plating method is known. In this method, the nickel plating layer provided as an underlayer is a single layer of a bright nickel layer or a multilayer of a bright nickel layer and a semi-bright nickel layer.

【0005】しかしながら、このマイクロポーラスクロ
ムめっき品には、これが腐食環境にさらされると、腐食
液がクロムめっき層の微孔に侵入し、クロムめっき層と
複合ニッケルめっき層との間で電池を形成し、陽極とな
った複合ニッケルめっき層が溶解、消失しついで光沢ニ
ッケルめっき層が円形状に溶解、消失して空洞化し、ク
ロムめっき層はこれを支持していた複合ニッケル層と光
沢ニッケル層を失うことにより、この空洞内に破片状と
なって折落するか、腐食液によって流失する。この結果
クロムめっき表面に腐食孔が散在し、短期間に霜降り状
の外観になるという欠点がある。
However, when the microporous chromium-plated product is exposed to a corrosive environment, a corrosive liquid penetrates into the micropores of the chromium plating layer and forms a battery between the chromium plating layer and the composite nickel plating layer. Then, the composite nickel plating layer serving as the anode dissolves and disappears, and then the bright nickel plating layer dissolves and disappears in a circular shape and becomes hollow, and the chromium plating layer removes the composite nickel layer and the bright nickel layer that supported it. By losing it, it will be broken into pieces in this cavity or will be washed away by the corrosive liquid. As a result, there is a defect that corrosion holes are scattered on the chromium plating surface and the appearance becomes marbling in a short time.

【0006】このような欠点を改善するために、クロム
めっき層と複合ニッケルめっき層との間、複合ニッケル
めっき層と光沢ニッケルめっき層との間、及び光沢ニッ
ケルめっき層と半光沢ニッケルめっき層との間の電位差
を厳密に調整する方法(特開平5−287579号公
報、特開平5−171468号公報)が提案されている
が、電位差は、光沢剤の濃度、電流密度の不均一、かき
まぜ条件、不純物の有無によって左右されるので、これ
を製造ラインにおいては常時一定の範囲に保つことは困
難である。
[0006] In order to remedy such drawbacks, it is necessary to reduce the distance between the chromium plating layer and the composite nickel plating layer, between the composite nickel plating layer and the bright nickel plating layer, and between the bright nickel plating layer and the semi-bright nickel plating layer. (JP-A-5-287579 and JP-A-5-171468) have been proposed, but the potential difference is determined by the concentration of the brightener, the unevenness of the current density, and the stirring conditions. Since it depends on the presence or absence of impurities, it is difficult to always keep it in a certain range in a production line.

【0007】さらに、複合ニッケルめっき層を厚付けし
て強度を上げることにより、下地光沢ニッケルめっき層
が空洞化してもクロムめっき層を支持しうるようにする
方法も考えられるが、複合ニッケル層の厚さが増すとと
もにクロムめっき層の表面に曇りを生じ、装飾用として
の価値が低下するので、この方法は不適当である。
Further, a method of increasing the strength by thickening the composite nickel plating layer so as to support the chromium plating layer even when the underlying bright nickel plating layer is hollowed out is considered. This method is unsuitable because as the thickness increases, the surface of the chromium plating layer becomes fogged and its value as a decoration decreases.

【0008】[0008]

【発明が解決しようとする課題】本発明は、従来のマイ
クロポーラスめっき製品のもつ欠点を克服し、過酷な条
件下の使用においても、長期間にわたって高い耐食性と
優れた光沢外観を有するクロムめっき製品の製造方法を
提供することを目的としてなされたものである。
SUMMARY OF THE INVENTION The present invention overcomes the drawbacks of the conventional microporous plated products, and has high corrosion resistance and excellent gloss appearance over a long period of time even under severe conditions. The purpose of the present invention is to provide a production method.

【0009】[0009]

【課題を解決するための手段】本発明者らは、マイクロ
ポーラスめっき製品の耐食性及び外観光沢の向上につい
て鋭意研究を重ねた結果、非金属不活性微粒子を分散さ
せたニッケル・リン合金めっき層を界面活性剤を含むめ
っき浴で形成させ、非金属不活性微粒子を含むニッケル
・リン合金めっき層とクロム層との電位差を小さくする
ことにより、このニッケル・リン合金めっき層の腐食速
度を低下させるとともに、光沢ニッケルめっき層の腐食
開始を大幅に遅延させること、及びニッケル・リン合金
自体が高い強度を有するため、腐食により光沢ニッケル
層に空洞を生じても長期間にわたりクロム層の支持を可
能にし、しかも光沢剤を使用せずに優れた光沢外観が得
られることを見出し、この知見に基づいて本発明をなす
に至った。
Means for Solving the Problems The present inventors have conducted intensive studies on the improvement of corrosion resistance and appearance gloss of microporous plated products, and as a result, have found that a nickel-phosphorus alloy plated layer in which non-metallic inert fine particles are dispersed is formed. By forming in a plating bath containing a surfactant and reducing the potential difference between the nickel-phosphorus alloy plating layer containing non-metallic inert fine particles and the chromium layer, the corrosion rate of this nickel-phosphorus alloy plating layer is reduced and , Greatly delaying the start of corrosion of the bright nickel plating layer, and since the nickel-phosphorus alloy itself has a high strength, the chromium layer can be supported for a long time even if the bright nickel layer has a cavity due to corrosion, Moreover, they have found that an excellent gloss appearance can be obtained without using a brightener, and based on this finding, the present invention has been accomplished.

【0010】すなわち、本発明は、導電性素地に、所要
の金属下地層を電気めっきで形成させたのち、ニッケル
供給源、リン供給源及びアニオン系又はノニオン系界面
活性剤を含有するニッケル・リン合金めっき浴組成に非
金属不活性微粒子を添加して調製した電解液中において
電解めっきを行って厚さ0.15〜20μmの非金属不
活性微粒子を分散含有するニッケル・リン合金めっき層
を形成させ、次いでその上に厚さ0.01〜0.5μm
のクロムめっき被覆を施すことを特徴とするマイクロポ
ーラスクロムめっき製品の製造方法を提供するものであ
る。
That is, the present invention provides a method for producing a nickel-phosphorus containing a nickel supply source, a phosphorus supply source, and an anionic or nonionic surfactant after forming a required metal base layer on a conductive substrate by electroplating. Electroplating is performed in an electrolytic solution prepared by adding non-metallic inert fine particles to an alloy plating bath composition to form a nickel-phosphorus alloy plating layer containing dispersed non-metallic inert fine particles having a thickness of 0.15 to 20 μm. And then a thickness of 0.01 to 0.5 μm
And a method for producing a microporous chrome-plated product characterized by applying a chromium plating coating.

【0011】[0011]

【発明の実施の形態】本発明方法で用いる導電性素地と
しては、鉄、亜鉛、銅、アルミニウムなどの金属やこれ
らの合金、無電解めっきにより導電化処理された各種の
セラミックスやプラスチックス例えばガラス、酸化鉄、
陶磁器、ABS樹脂、ポリカーボネート樹脂、ポリアセ
タール樹脂、ポリアミド樹脂、ポリプロピレン樹脂、ポ
リフェニレンオキシド樹脂、エポキシ樹脂、ポリウレタ
ン樹脂、尿素樹脂などが用いられる。
BEST MODE FOR CARRYING OUT THE INVENTION The conductive substrate used in the method of the present invention includes metals such as iron, zinc, copper, and aluminum, alloys thereof, and various ceramics and plastics such as glass, which have been made conductive by electroless plating. ,iron oxide,
Porcelain, ABS resin, polycarbonate resin, polyacetal resin, polyamide resin, polypropylene resin, polyphenylene oxide resin, epoxy resin, polyurethane resin, urea resin and the like are used.

【0012】これらの導電性素地の上に設けられる金属
電気めっき下地層としては、通常のマイクロポーラスク
ロムめっき製品の場合と同じく、光沢ニッケルめっき層
と半光沢ニッケルめっき層との組合せが一般的に用いら
れる。
As a metal electroplating underlayer provided on these conductive substrates, a combination of a bright nickel plating layer and a semi-bright nickel plating layer is generally used as in the case of a normal microporous chrome plating product. Used.

【0013】この光沢ニッケルめっき層はその上に施さ
れるクロム被覆に鏡面を付与するとともに、その下地層
の半光沢ニッケルめっき層に対する陽極防食の役割を果
すもので、通常のニッケル電気めっき浴例えばワット浴
に光沢剤を添加して形成することができる。この際の光
沢剤としては一次光沢剤として例えば1,5‐ナフタレ
ンジスルホン酸ナトリウム、1,3,6‐ナフタレント
リスルホン酸ナトリウム、サッカリンなどと、二次光沢
剤として例えば1,4‐ブチンジオール、プロパルギル
アルコール、アリルスルホン酸ナトリウムなどの組み合
わせを用いることができる。この光沢剤の含有量として
は0.04〜1.0重量%の範囲が適当である。
This bright nickel plating layer not only gives a mirror surface to the chromium coating applied thereon but also plays a role of anodic corrosion protection for the semi-bright nickel plating layer of the underlayer. It can be formed by adding a brightener to a watt bath. As a brightener at this time, for example, sodium 1,5-naphthalenedisulfonic acid, sodium 1,3,6-naphthalenetrisulfonate, saccharin and the like as a primary brightener, and 1,4-butynediol as a secondary brightener, Combinations of propargyl alcohol, sodium allyl sulfonate and the like can be used. An appropriate content of the brightener is in the range of 0.04 to 1.0% by weight.

【0014】次に半光沢ニッケルめっき層は素地の平滑
性を向上させて、全体の外観性を改善するとともに、柔
軟性に富むので素地の変形や熱膨張を吸収し、層剥離を
抑制する役割を果たすものである。この半光沢ニッケル
めっき層は実質的に硫黄を含まないものであり、この電
位の貴な半光沢ニッケルめっき層を形成するには、例え
ばワット浴にクマリン、ホルマリン、抱水クロラールの
ような光沢剤を添加した電気めっき浴を用いる。
Next, the semi-bright nickel-plated layer improves the smoothness of the substrate to improve the overall appearance, and because it is rich in flexibility, absorbs deformation and thermal expansion of the substrate and suppresses delamination. It fulfills. This semi-bright nickel plating layer is substantially free of sulfur. To form a noble semi-bright nickel plating layer of this potential, for example, a brightening agent such as coumarin, formalin, chloral hydrate is added to a watt bath. Is used.

【0015】この半光沢ニッケルめっき層と基体の導電
性素地の間には、素地表面の平滑化に加え、半光沢ニッ
ケルめっき層の電着応力の緩和及び素地の熱膨張の吸収
のために、通常、銅層のような金属下地層を設けるが、
この金属下地層は必ずしも必要ではなく、場合によって
は省くこともできる。本発明においては、クロム被覆の
直接接触する層として、非金属不活性微粒子を分散含有
するニッケル・リン合金めっき層を有することが必要で
ある。
Between the semi-bright nickel plating layer and the conductive base material of the substrate, in addition to smoothing the surface of the base material, to alleviate the electrodeposition stress of the semi-bright nickel plating layer and to absorb the thermal expansion of the base material, Usually, a metal base layer such as a copper layer is provided,
This metal underlayer is not always necessary and can be omitted in some cases. In the present invention, it is necessary to have a nickel-phosphorus alloy plating layer containing non-metallic inert fine particles dispersed therein as a layer in direct contact with the chromium coating.

【0016】このニッケル・リン合金層は、酸、アルカ
リに対し、良好な耐性を示し、硝酸のような酸化性の酸
にも侵されにくく、金に近い耐薬品性を有する。このニ
ッケル・リン合金めっき層を形成させるには、無電解法
と電解法とがあるが、低温における析出速度が大きくめ
っき時間が短かいこと及び亜リン酸や次亜リン酸などの
リン供給源の添加量によって生成するめっき層中のリン
含有量を制御しうること、リン供給源の消耗量が少ない
こと、浴寿命が長いことから、本発明においては電解法
を用いるのが好ましい。
The nickel-phosphorus alloy layer has good resistance to acids and alkalis, is not easily attacked by oxidizing acids such as nitric acid, and has chemical resistance close to that of gold. The nickel-phosphorus alloy plating layer can be formed by an electroless method or an electrolytic method. However, the deposition rate at a low temperature is large, the plating time is short, and a phosphorus supply source such as phosphorous acid or hypophosphorous acid is used. In the present invention, it is preferable to use an electrolysis method because the phosphorus content in the plating layer generated can be controlled by the addition amount of P, the consumption of the phosphorus supply source is small, and the bath life is long.

【0017】本発明における非金属不活性微粒子を含有
するニッケル・リン合金層は、公知の方法例えば特公平
5−60000号公報に記載されている方法に準じ、公
知のニッケル・リン合金めっき浴組成に、非金属不活性
微粒子を添加した液を電解液として用いて行うことがで
きる。この際のニッケル・リン合金めっき浴組成におけ
るニッケル供給源として硫酸ニッケル、塩化ニッケル、
炭酸ニッケルのようなニッケル塩が、またリン供給源と
しては、亜リン酸、次亜リン酸又はこれらの塩がそれぞ
れ用いられる。このめっき浴組成にはそのほか、所望に
応じ緩衝剤としてホウ酸、錯化剤が加えられ、またpH
調整剤例えばリン酸、水酸化ナトリウムによってpH
0.5〜4.0に調整される。
In the present invention, the nickel-phosphorus alloy layer containing the nonmetallic inert fine particles can be formed by a known nickel-phosphorus alloy plating bath composition according to a known method, for example, the method described in Japanese Patent Publication No. 5-600000. Alternatively, a solution to which non-metal inert fine particles are added can be used as an electrolytic solution. In this case, nickel sulfate, nickel chloride,
A nickel salt such as nickel carbonate is used, and as a phosphorus source, phosphorous acid, hypophosphorous acid or a salt thereof is used. In addition, boric acid and a complexing agent may be added to the plating bath composition as a buffering agent, if desired.
PH adjuster, such as phosphoric acid, sodium hydroxide
It is adjusted to 0.5-4.0.

【0018】本発明方法で形成される非金属不活性微粒
子を分散含有するニッケル・リン合金めっき層を形成す
るのに好適なめっき浴組成の例としては、硫酸ニッケル
100〜300g/リットル、塩化ニッケル0〜200
g/リットル、炭酸ニッケル0〜100g/リットル、
亜リン酸又は次亜リン酸ナトリウム5〜100g/リッ
トル、リン酸0〜100g/リットル、残部水の組成を
挙げることができる。
Examples of a plating bath composition suitable for forming a nickel-phosphorus alloy plating layer in which non-metallic inert fine particles are dispersed and formed by the method of the present invention include nickel sulfate 100 to 300 g / liter and nickel chloride. 0-200
g / liter, nickel carbonate 0-100 g / liter,
Examples of the composition include phosphoric acid or sodium hypophosphite, 5 to 100 g / liter, phosphoric acid, 0 to 100 g / liter, and the balance of water.

【0019】本発明方法で形成されるニッケル・リン合
金めっき層中のリン含有量は3〜19重量%の範囲が好
ましい。この量が3重量%未満では光沢めっきが得られ
にくく装飾的価値が低下するし、また19重量%を超え
ると光沢が低下するとともに、陰極電流効率が低下し、
所要のめっき厚を得るのに長時間を要することになる。
そして、前記した光沢ニッケル層に対するニッケル・リ
ン合金めっき層電気化学的電位は、そのリン含有量3〜
19重量%の範囲で140〜1150mV貴な値を示
す。
The phosphorus content in the nickel-phosphorus alloy plating layer formed by the method of the present invention is preferably in the range of 3 to 19% by weight. If the amount is less than 3% by weight, it is difficult to obtain bright plating and the decorative value is reduced. If it exceeds 19% by weight, the gloss is reduced and the cathode current efficiency is reduced.
It takes a long time to obtain the required plating thickness.
Then, the electrochemical potential of the nickel-phosphorus alloy plating layer with respect to the bright nickel layer is set to a phosphorus content of 3 to
It shows a value of 140 to 1150 mV in the range of 19% by weight.

【0020】このリン含有量は、ニッケル濃度、リン供
給源濃度、pH、電流密度に左右され、ニッケル塩の量
を少なくしたり、リン供給源の量を増加させたり、pH
を小さくしたり、電流密度を低下させることによって、
ニッケル・リン合金めっき層中のリン含有量を増大する
ことができる。また、陰極電流効率は、リン含有量が増
加するとともに低下する。
The phosphorus content depends on the concentration of nickel, the concentration of the phosphorus source, the pH and the current density, and can be used to reduce the amount of the nickel salt, increase the amount of the phosphorus source,
Or by reducing the current density,
The phosphorus content in the nickel-phosphorus alloy plating layer can be increased. Also, cathode current efficiency decreases with increasing phosphorus content.

【0021】このニッケル・リンめっき浴に添加される
非金属不活性微粒子としては、現在工業的に広く行われ
ているマイクロポーラスクロムに添加される微粒子、す
なわち酸化ケイ素、酸化チタン、酸化アルミニウム、硫
酸バリウム、酸化ジルコニウム、ケイ酸アルミニウム、
ケイ酸カルシウムなどをそのまま使用することができ
る。
As the non-metallic inert fine particles added to the nickel-phosphorus plating bath, fine particles added to microporous chromium which are currently widely used industrially, that is, silicon oxide, titanium oxide, aluminum oxide, sulfuric acid Barium, zirconium oxide, aluminum silicate,
Calcium silicate or the like can be used as it is.

【0022】めっき液中に分散している状態での非金属
不活性微粒子の粒径は0.01〜20μm、最頻粒径は
1〜9μmが好ましい。20μmを超えると、めっき層
に曇りを生じたり、梨地状のめっきとなり光沢外観の装
飾用として好ましくない。
The particle diameter of the non-metallic inert fine particles dispersed in the plating solution is preferably 0.01 to 20 μm, and the mode particle diameter is preferably 1 to 9 μm. If it exceeds 20 μm, the plating layer becomes cloudy or has a matte finish, which is not preferable for decorative use having a glossy appearance.

【0023】添加量は0.001〜30g/リットルの
範囲であり、微粒子の種類と粒径により添加量を調整す
る。一般的に0.001g/リットル未満であると顕著
な耐食性の向上効果が少なく、また30g/リットルを
超えると、曇りを生じたり、撹拌で均一な濃度に維持す
るのが困難になる。
The addition amount is in the range of 0.001 to 30 g / liter, and the addition amount is adjusted according to the type and particle size of the fine particles. In general, if it is less than 0.001 g / liter, the effect of remarkably improving corrosion resistance is small, and if it exceeds 30 g / liter, it becomes difficult to maintain clouding or to maintain a uniform concentration by stirring.

【0024】これらの微粒子の比重は比較的大きいの
で、ニッケル・リンめっき浴中で沈降しやすかったり、
また微粒子の水漏れ性と分散性が悪く均一に共析しにく
いので本発明方法においては、ニッケル・リンめっき浴
中の微粒子の分散性をよくするために低起泡性のアニオ
ン系あるいはノニオン系の界面活性剤を添加することが
必要である。カチオン系は下地ニッケル層との密着性を
低下させるので好ましくない。これらの微粒子はニッケ
ル・リンめっき液中に直接加えても良いが、界面活性剤
を添加した少量の水あるいはニッケル‐リンめっき液で
撹拌、超音波等の方法にてあらかじめ懸濁液として調整
して添加するのが好ましい。めっき浴のかきまぜは従来
のマイクロポーラスクロムと同じく、空気撹拌、プロペ
ラ撹拌、ポンプ撹拌等の機械撹拌を採用することができ
る。
Since the specific gravity of these fine particles is relatively large, they tend to settle in a nickel-phosphorus plating bath,
In addition, the method of the present invention uses a low foaming anionic or nonionic type in order to improve the dispersibility of the fine particles in the nickel-phosphorus plating bath because the water leakage and the dispersibility of the fine particles are poor and the uniform eutectoid is difficult. It is necessary to add a surfactant. The cationic type is not preferred because it lowers the adhesion to the underlying nickel layer. These fine particles may be added directly to the nickel-phosphorus plating solution.However, they are prepared in advance as a suspension using a small amount of surfactant-added water or nickel-phosphorus plating solution, stirring, ultrasonic waves, etc. It is preferable to add them. As with the conventional microporous chromium, mechanical stirring such as air stirring, propeller stirring, and pump stirring can be employed for stirring the plating bath.

【0025】このようにして形成されたニッケル・リン
めっき層のめっき厚は耐食性に大きな影響があり厚くな
るほど、耐食性が向上する。しかし生産性、経済性を考
慮すると0.15〜20μmが好ましい。0.15μm
未満であると耐食性向上の効果が少なく、また20μm
を超えると過剰品質となり不経済である。
The plating thickness of the nickel-phosphorus plating layer formed in this way has a great influence on the corrosion resistance, and as the thickness increases, the corrosion resistance improves. However, in consideration of productivity and economy, 0.15 to 20 μm is preferable. 0.15μm
If less than 20 μm, the effect of improving corrosion resistance is small.
Exceeding the limit results in excessive quality and is uneconomical.

【0026】次に、この非金属不活性微粒子を分散含有
するニッケル・リン合金めっき層の上に施されるクロム
被覆は、従来のマイクロポーラスクロム製品の場合と全
く同様にして形成される。そして、このクロムめっきの
膜厚は0.01〜0.5μm、好ましくは0.1〜0.
3μmの範囲である。0.5μmを超えて厚くなると、
クラックを生じてむしろ耐食性が悪くなる場合があり、
また0.01μm未満では耐摩耗性の点で問題がある。
Next, the chromium coating applied to the nickel-phosphorus alloy plating layer containing the non-metallic inert fine particles dispersed therein is formed in exactly the same manner as in the case of a conventional microporous chromium product. The thickness of the chromium plating is 0.01 to 0.5 μm, preferably 0.1 to 0.5 μm.
The range is 3 μm. When the thickness exceeds 0.5 μm,
Cracks may occur and corrosion resistance may worsen,
If it is less than 0.01 μm, there is a problem in terms of wear resistance.

【0027】[0027]

【実施例】次に実施例によって本発明をさらに詳細に説
明する。なお、各例中の耐食性試験はJIS H850
2の規定に従って、キャス試験方法で評価した。この結
果はレイティングナンバーにより示した。また、いずれ
の試料においても素地からの発錆は認められなかったの
で表面腐食のみを評価した。
Next, the present invention will be described in more detail by way of examples. The corrosion resistance test in each example is based on JIS H850.
According to the provisions of 2, evaluation was made by the Cass test method. This result is indicated by a rating number. In addition, in any of the samples, no rust was found from the substrate, so only the surface corrosion was evaluated.

【0028】実施例1 (1)金属電気めっき下地層の形成 常法により導電化処理されたABS樹脂板(50×90
mm)に、硫酸銅めっき浴を用いて厚さ20μmの銅め
っきを施したものを導電性素地として用い、次の組成及
び条件により、金属めっき下地層を形成させた。
Example 1 (1) Formation of metal electroplating underlayer ABS resin plate (50 × 90
mm), a copper plating having a thickness of 20 μm using a copper sulfate plating bath was used as a conductive base, and a metal plating underlayer was formed under the following composition and conditions.

【0029】すなわち、先ず硫酸ニッケル300g/リ
ットル、塩化ニッケル60g/リットル、ホウ酸45g
/リットル、クマリン0.1g/リットルを含みpH
4.0の電解液を用い、温度50℃、電流密度3A/d
2の条件下で電解めっきを行い、厚さ12μmの半光
沢ニッケルめっき層を形成させた。
That is, first, nickel sulfate 300 g / l, nickel chloride 60 g / l, boric acid 45 g
/ Liter, pH including coumarin 0.1g / liter
Using an electrolytic solution of 4.0 at a temperature of 50 ° C. and a current density of 3 A / d
Electroplating was performed under the conditions of m 2 to form a semi-bright nickel plating layer having a thickness of 12 μm.

【0030】次いで、この上に硫酸ニッケル300g/
リットル、塩化ニッケル60g/リットル、ホウ酸45
g/リットル、一次光沢剤としてサッカリン2g/リッ
トル、二次光沢剤として1,4‐ブチジオールを0.2
g/リットルを含みpH4.0の電解液を用い、温度5
0℃、電流密度3A/dm2の条件下で電解めっきを行
ない、厚さ8μmの光沢ニッケル層を形成させた。
Next, 300 g of nickel sulfate /
Liter, nickel chloride 60g / liter, boric acid 45
g / l, saccharin 2 g / l as primary brightener, 1,4-butydiol 0.2% as secondary brightener
g / liter and an electrolyte of pH 4.0 at a temperature of 5
Electroplating was performed at 0 ° C. and a current density of 3 A / dm 2 to form a bright nickel layer having a thickness of 8 μm.

【0031】(2)非金属不活性微粒子を分散したニッ
ケル・リン合金めっき層の形成 金属電気めっき下地層を設けた試料の上に、硫酸ニッケ
ル210g/リットル、塩化ニッケル90g/リット
ル、亜リン酸20g/リットル、リン酸100g/リッ
トル、酸化ケイ素微粒子(最頻径8.3μm)20g/
リットル及びノニオン性界面活性剤[日本油脂(株)
製;ノニオンNS−210]0.02g/リットルを含
み、pH0.5の電解液を用い、温度55℃、電流密度
3A/dm2の条件下で電解めっきを行い、厚さ3μ
m、リン含有量9重量%のニッケル・リン合金めっき層
を形成させた。
(2) Formation of nickel-phosphorus alloy plating layer in which non-metallic inert fine particles are dispersed On a sample provided with a metal electroplating underlayer, nickel sulfate 210 g / l, nickel chloride 90 g / l, phosphorous acid 20 g / liter, phosphoric acid 100 g / liter, silicon oxide fine particles (mode diameter 8.3 μm) 20 g / liter
Liter and nonionic surfactant [Nippon Yushi Co., Ltd.
Nonion NS-210], electroless plating was carried out at a temperature of 55 ° C. and a current density of 3 A / dm 2 using an electrolytic solution having a pH of 0.5 and a thickness of 3 μm.
m, a nickel-phosphorus alloy plating layer having a phosphorus content of 9% by weight was formed.

【0032】(3)クロムめっき層の形成 前記の電解めっき層をもつ試料で、無水クロム酸200
g/リットル、硫酸1.5g/リットル、ケイフッ化カ
リウム5g/リットルを含む電解液を用い、温度46
℃、電流密度15A/dm2の条件下で電解めっきを行
い、厚さ0.2μmのクロムめっき被覆を施した。この
ようにして、マイクロポーラスクロムめっき製品を製造
した。
(3) Formation of chromium plating layer A sample having the above-mentioned electrolytic plating layer was prepared by using chromic anhydride 200
g / l, 1.5 g / l sulfuric acid, 5 g / l potassium silicofluoride, at a temperature of 46
Electroplating was performed at a temperature of 15 ° C. and a current density of 15 A / dm 2 , and a chrome plating coating having a thickness of 0.2 μm was applied. Thus, a microporous chrome-plated product was manufactured.

【0033】実施例2 工程(2)を、硫酸ニッケル150g/リットル、塩化
ニッケル40g/リットル、亜リン酸20g/リット
ル、微粒状酸化ジルコニウム(最頻径4.5μm)5g
/リットル、ノニオン性界面活性剤[三洋化成工業
(株)製;ニューポールPE−64]0.01g/リッ
トルを含みpH0.8の電解液を用い、温度60℃、電
流密度2.0A/dm2の条件下で行って、厚さ3μ
m、リン含有量16重量%のニッケル・リン合金めっき
層を形成させることに変える以外は実施例1と全く同様
にして、マイクロポーラスクロムめっき製品を製造し
た。
Example 2 Step (2) was carried out using nickel sulfate 150 g / l, nickel chloride 40 g / l, phosphorous acid 20 g / l, and finely divided zirconium oxide (mode diameter 4.5 μm) 5 g.
/ Liter, nonionic surfactant [manufactured by Sanyo Kasei Kogyo Co., Ltd .; Newpole PE-64] containing 0.01 g / liter of an electrolytic solution having a pH of 0.8 at a temperature of 60 ° C. and a current density of 2.0 A / dm. Perform under the conditions of 2
A microporous chrome-plated product was manufactured in exactly the same manner as in Example 1 except that a nickel-phosphorus alloy plating layer having a m and phosphorus content of 16% by weight was formed.

【0034】実施例3 工程(2)を、硫酸ニッケル120g/リットル、塩化
ニッケル80g/リットル、亜リン酸15g/リット
ル、錯化剤30g/リットル、微粒状酸化チタン(最頻
径2.5μm)0.05g/リットル、ノニオン性界面
活性剤[三洋化成工業(株)製;ニューポールPE−6
4]0.01g/リットルを含み、pH2.5の電解液
を用い、温度50℃、電流密度2.5A/dm2の条件
下で、電解時間を変えることにより、リン含有量12重
量%のニッケル・リン合金めっき層の厚さを1μm
(A)、3μm(B)及び5μm(C)にすること以外
は全く実施例1と同様にして、マイクロポーラスクロム
めっき製品を製造した。
Example 3 Step (2) was carried out using nickel sulfate 120 g / l, nickel chloride 80 g / l, phosphorous acid 15 g / l, complexing agent 30 g / l, fine titanium oxide (mode diameter 2.5 μm). 0.05 g / liter, nonionic surfactant [manufactured by Sanyo Chemical Industry Co., Ltd .; Newpole PE-6]
4] By using an electrolytic solution containing 0.01 g / liter and having a pH of 2.5 and changing the electrolysis time under the conditions of a temperature of 50 ° C. and a current density of 2.5 A / dm 2 , a phosphorus content of 12% by weight was obtained. The thickness of the nickel-phosphorus alloy plating layer is 1 μm
(A) A microporous chrome-plated product was manufactured in exactly the same manner as in Example 1 except that the thickness was changed to 3 μm (B) and 5 μm (C).

【0035】実施例4 工程(2)を、硫酸ニッケル250g/リットル、塩化
ニッケル5g/リットル、次亜リン酸ナトリウム10g
/リットル、錯化剤50g/リットル、微粒状酸化ケイ
素(最頻径8.3μm)20g/リットル、アニオン性
界面活性剤[東邦化学工業(株)製;アルスコープLN
−90]0.03g/リットルを含みpH3.5の電解
液を用い、温度50℃、電流密度3A/dm2の条件下
で行い、リン含有量7重量%のニッケル・リン合金めっ
き層を厚さ3μmで形成させること以外は実施例1と全
く同様にして、マイクロポーラスクロムめっき製品を製
造した。
Example 4 Step (2) was carried out using 250 g / liter of nickel sulfate, 5 g / liter of nickel chloride, and 10 g of sodium hypophosphite.
/ Liter, complexing agent 50 g / liter, finely divided silicon oxide (mode diameter 8.3 μm) 20 g / liter, anionic surfactant [manufactured by Toho Chemical Industry Co., Ltd .; Alscope LN
-90] using an electrolytic solution containing 0.03 g / liter and a pH of 3.5 under the conditions of a temperature of 50 ° C. and a current density of 3 A / dm 2 , to form a nickel-phosphorus alloy plating layer having a phosphorus content of 7% by weight. A microporous chrome-plated product was manufactured in exactly the same manner as in Example 1 except that the product was formed to a thickness of 3 μm.

【0036】実施例5 工程(2)を、硫酸ニッケル150g/リットル、塩化
ニッケル150g/リットル、亜リン酸20g/リット
ル、リン酸100g/リットル、微粒状酸化アルミニウ
ム(最頻径2.1μm)1g/リットル、アニオン性界
面活性剤[東邦化学工業(株)製;アルスコープLN−
90]0.05g/リットルを含み、pH0.5の電解
液を用い、温度55℃、電流密度5A/dm2の条件下
で行い、リン含有量5重量%、厚さ3μmのニッケル・
リン合金めっき層を形成させること以外は、実施例1と
全く同様にしてマイクロポーラスクロムめっき製品を製
造した。
Example 5 Step (2) was carried out using nickel sulfate 150 g / l, nickel chloride 150 g / l, phosphorous acid 20 g / l, phosphoric acid 100 g / l, and fine aluminum oxide (mode diameter 2.1 μm) 1 g. / Liter, anionic surfactant [Toho Chemical Industry Co., Ltd .; Alscope LN-
90] using an electrolytic solution containing 0.05 g / liter, pH 0.5, at a temperature of 55 ° C. and a current density of 5 A / dm 2 , and having a phosphorus content of 5% by weight and a thickness of 3 μm.
A microporous chrome-plated product was manufactured in exactly the same manner as in Example 1 except that a phosphorus alloy plating layer was formed.

【0037】比較例1 工程(2)を、硫酸ニッケル210g/リットル、塩化
ニッケル90g/リットル、ホウ酸40g/リットル、
微粒状酸化ケイ素(最頻径8.3μm)20g/リット
ルを含み、pH3.5のリンを含まない電解液を用い、
温度55℃、電流密度4A/dm2の条件下で非金属不
活性微粒子を分散した厚さ0.25μmのニッケルめっ
き層を形成するように変えた以外は、実施例1と同様に
してマイクロポーラスクロムめっき製品を製造した。
Comparative Example 1 Step (2) was carried out using nickel sulfate 210 g / l, nickel chloride 90 g / l, boric acid 40 g / l,
An electrolytic solution containing 20 g / liter of finely divided silicon oxide (mode diameter: 8.3 μm) and not containing phosphorus having a pH of 3.5 was used.
A microporous film was prepared in the same manner as in Example 1 except that a nickel plating layer having a thickness of 0.25 μm in which non-metallic inert fine particles were dispersed was formed under the conditions of a temperature of 55 ° C. and a current density of 4 A / dm 2. Chrome plated products were manufactured.

【0038】比較例2 実施例3における電解液から微粒状酸化チタンを除いた
組成の電解液を用いる以外は、全く実施例3と同様にし
て、ニッケル・リン合金めっき層の厚さが1μm
(A′)、3μm(B′)及び5μm(C′)のクロム
めっき製品を製造した。
Comparative Example 2 The nickel-phosphorus alloy plating layer had a thickness of 1 μm in the same manner as in Example 3 except that an electrolytic solution having a composition obtained by removing fine-grained titanium oxide from the electrolytic solution in Example 3 was used.
(A ′), 3 μm (B ′) and 5 μm (C ′) chromium plated products were manufactured.

【0039】参考例 実施例1〜5及び比較例1、2で得た試料について、キ
ャス試験を240時間まで行い、その結果を表1に示
す。また、実施例3と比較例2との結果をグラフ上で対
比して図2に示す。また、比較のために従来のマイクロ
ポーラスめっき品についてのデータをDとして示す。
REFERENCE EXAMPLE The samples obtained in Examples 1 to 5 and Comparative Examples 1 and 2 were subjected to the Cass test for up to 240 hours, and the results are shown in Table 1. FIG. 2 shows a comparison between the results of Example 3 and Comparative Example 2 on a graph. For comparison, data on a conventional microporous plated product is shown as D.

【0040】[0040]

【表1】 [Table 1]

【0041】これから明らかなように、本発明方法によ
り得られるマイクロポーラスクロムめっき製品は、長期
間にわたり優れた耐食性を保ち、従来の製品のように腐
食孔に起因する外観劣化をもたらすことがない。
As is clear from the above, the microporous chrome-plated product obtained by the method of the present invention maintains excellent corrosion resistance for a long period of time, and does not cause deterioration in appearance due to corroded holes unlike conventional products.

【0042】[0042]

【発明の効果】従来のマイクロポーラスクロムめっき製
品は、過酷な条件下で長期間にわたって使用すると、腐
食孔が拡大し、遂には部分的なクロム被覆層の欠落をも
たらすが、本発明方法により得られるマイクロポーラス
クロムめっき製品は、過酷な条件下で長期間にわたって
使用してもクロム被覆層の欠落はなく、したがって外観
が劣化することはない。
The conventional microporous chrome-plated product, when used under severe conditions for a long period of time, enlarges the corrosion pits and eventually causes a partial loss of the chromium coating layer. The resulting microporous chromium-plated product does not have a chromium coating layer missing even when used under severe conditions for a long period of time, and therefore does not have any deterioration in appearance.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 通常のクロムめっき品とマイクロポーラスク
ロムめっき品との腐食の進行状態を説明するための模式
断面図。
FIG. 1 is a schematic cross-sectional view for explaining the progress of corrosion of a normal chromium-plated product and a microporous chrome-plated product.

【図2】 本発明の実施例と比較例の外観レイティング
ナンバーの変化を対比したグラフ。
FIG. 2 is a graph comparing changes in appearance rating numbers of an example of the present invention and a comparative example.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 船田 清孝 神奈川県横浜市金沢区福浦2−10−4 キザイ株式会社内 (72)発明者 丸田 正敏 神奈川県横浜市金沢区福浦2−10−4 キザイ株式会社内 (72)発明者 柘植 雅信 神奈川県横浜市金沢区福浦2−10−4 キザイ株式会社内 (56)参考文献 特開 平6−240490(JP,A) 特開 平1−294896(JP,A) 特開 平4−371597(JP,A) (58)調査した分野(Int.Cl.6,DB名) C25D 5/00 - 5/56 C23C 28/02 C25D 11/38 C25D 15/02──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kiyotaka Funada 2-10-4 Fukuura, Kanazawa-ku, Yokohama, Kanagawa Prefecture Inside (72) Inventor Masatoshi Maruta 2-10-4, Fukuura, Kanazawa-ku, Yokohama, Kanagawa Prefecture Inside (72) Inventor Masanobu Tsuge 2-10-4 Fukuura, Kanazawa-ku, Yokohama-shi, Kanagawa Inside Kizai Corporation (56) References JP-A-6-240490 (JP, A) JP-A-1-294896 (JP) (A) JP-A-4-371597 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) C25D 5/00-5/56 C23C 28/02 C25D 11/38 C25D 15/02

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 導電性素地に、所要の金属下地層を電気
めっきで形成させたのち、ニッケル供給源、リン供給源
及びアニオン系又はノニオン系界面活性剤を含有するニ
ッケル・リン合金めっき浴組成に非金属不活性微粒子を
添加して調製した電解液中において電解めっきを行って
厚さ0.15〜20μmの非金属不活性微粒子を分散含
有するニッケル・リン合金めっき層を形成させ、次いで
その上に厚さ0.01〜0.5μmのクロムめっき被覆
を施すことを特徴とするマイクロポーラスクロムめっき
製品の製造方法。
1. A nickel-phosphorus alloy plating bath composition containing a nickel supply source, a phosphorus supply source, and an anionic or nonionic surfactant after a required metal underlayer is formed on a conductive substrate by electroplating. Electrolytic plating is performed in an electrolyte solution prepared by adding non-metallic inert fine particles to a nickel-phosphorus alloy plating layer containing non-metallic inert fine particles having a thickness of 0.15 to 20 μm in a dispersed manner. A method for producing a microporous chrome-plated product, wherein a chromium plating coating having a thickness of 0.01 to 0.5 μm is provided thereon.
JP7175930A 1995-07-12 1995-07-12 Manufacturing method of chrome plated products Expired - Fee Related JP2781362B2 (en)

Priority Applications (1)

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JP7175930A JP2781362B2 (en) 1995-07-12 1995-07-12 Manufacturing method of chrome plated products

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Application Number Priority Date Filing Date Title
JP7175930A JP2781362B2 (en) 1995-07-12 1995-07-12 Manufacturing method of chrome plated products

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP6075697A Division JPH07278845A (en) 1994-04-14 1994-04-14 Chromium-plated product and its production

Publications (2)

Publication Number Publication Date
JPH08100273A JPH08100273A (en) 1996-04-16
JP2781362B2 true JP2781362B2 (en) 1998-07-30

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Country Link
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JP4068879B2 (en) * 2001-08-21 2008-03-26 株式会社神戸製鋼所 Metal parts with excellent antibacterial and / or algal resistance
JP4776033B2 (en) * 2006-07-05 2011-09-21 柿原工業株式会社 Method for producing decorative plated product using resin conductivity by sputtering
DE102007021390A1 (en) 2007-05-04 2008-11-06 Weber-Hydraulik Gmbh Mechanics component and its manufacturing process
DE102008049790A1 (en) 2008-10-03 2010-04-08 Weber Hydraulik Gmbh Hydraulic cylinder and its manufacturing process
BRPI0924283B1 (en) * 2009-02-13 2019-11-12 Atotech Deutschland Gmbh chrome part and method of manufacturing it
JP2015221944A (en) * 2015-08-07 2015-12-10 日産自動車株式会社 Chromium-plated part and production method thereof
JP6616637B2 (en) * 2015-09-18 2019-12-04 石原ケミカル株式会社 Method for forming conductive film on transparent conductive film
PL3147389T3 (en) * 2015-09-25 2019-09-30 Macdermid Enthone Gmbh Multicorrosion protection system for decorative parts with chrome finish
JP6405553B2 (en) * 2015-12-18 2018-10-17 石原ケミカル株式会社 Method for forming conductive film on non-forming light metal
JP6326591B2 (en) * 2016-10-25 2018-05-23 石原ケミカル株式会社 Method for forming heat-treatable conductive film on non-conductive metal
JP7330349B1 (en) * 2022-11-11 2023-08-21 株式会社Jcu Chrome-plated parts and manufacturing method thereof

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