TW554086B - Method for producing plated molded product - Google Patents

Method for producing plated molded product Download PDF

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Publication number
TW554086B
TW554086B TW091102193A TW91102193A TW554086B TW 554086 B TW554086 B TW 554086B TW 091102193 A TW091102193 A TW 091102193A TW 91102193 A TW91102193 A TW 91102193A TW 554086 B TW554086 B TW 554086B
Authority
TW
Taiwan
Prior art keywords
plating
molded product
layer
chromium
bath
Prior art date
Application number
TW091102193A
Other languages
Chinese (zh)
Inventor
Ichiro Hayashi
Kazuhiro Myokai
Original Assignee
Taiyo Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001041029A external-priority patent/JP3685999B2/en
Priority claimed from JP2001192023A external-priority patent/JP3722724B2/en
Priority claimed from JP2001322754A external-priority patent/JP3710408B2/en
Application filed by Taiyo Mfg Co Ltd filed Critical Taiyo Mfg Co Ltd
Application granted granted Critical
Publication of TW554086B publication Critical patent/TW554086B/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22Roughening, e.g. by etching
    • C23C18/24Roughening, e.g. by etching using acid aqueous solutions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/04Electroplating: Baths therefor from solutions of chromium
    • C25D3/06Electroplating: Baths therefor from solutions of chromium from solutions of trivalent chromium
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • C25D5/12Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • C25D5/56Electroplating of non-metallic surfaces of plastics
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/605Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611Smooth layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Abstract

A method for producing a plated molded product is provided, in which a surface of a molded product having a thin portion obtained by coinjection molding of resin is subjected to plating. A surface of a molded product having a thin portion obtained by high-speed injection molding of resin is plated by the steps of: (a) forming a metal plating layer on a surface of the molded product by electroless plating; (b) forming a copper plating layer on a surface of the electroless plating layer by electroplating; (c) forming a nickel layer on a surface of the copper plating layer by electroplating; and (d) forming a chromium or chromium alloy layer on a surface of the nickel layer by electroplating. Even for a molded product having a thin portion obtained by high-speed injection molding, a plating which resists removal can be obtained. Further, even when a plating is formed on a satin-finished surface, the plating can reproduce the satin-finished surface.

Description

554086 ^ A7554086 ^ A7

技術領域· 本發明有關一種具有薄部分之經鍍敷模製品之製造方法 。本發明亦有關一種對模製品具有樹脂模製品之共射出模 製品表面及併於其背側之彈性層之表面進行鍍敷之方法。 尤其,本發明有關一種鍍敷電氣或電子元件(如開關、及控 制個人電腦之鍵盤面)、〇A設備(如個人電腦及電話)及通訊 設備(如DVDs及MDs)之表面之方法,且特別是有關一種行 動電話(cellular phone)操作鈕(鍵盤)之製造方法。 技藝背景 例如,對減少摺疊型(掀蓋型)行動電話之厚度逐增需求。 就此行動電話而言,其所附接之操作鈕(鍵盤)需儘可能薄。 通常,操作鈕係自ABS樹脂(丙烯腈-丁二烯-苯乙烯共聚 物)所模製,其易於鍍敷。然而,ABS樹脂對行動電話主體 具有不良黏附性。再者,操作鈕可具有未鍍敷供裝飾目的 之部分。此例中,可使用ABS樹脂以外之樹脂如pc(聚碳酸 醋)樹脂共射出模製。再者,亮表面及霧表面(微粗表面)可 設在操作钮表面供裝倚目的。 習知上’當行動電話之操作紐係藉模内製造時,所得操 作紐將缺乏伶倒且亮麗印象。為避免此現象,模製品表面 在如上述共射出模製後予以鍍敷。 當製造薄共射出模製品時,典;-型上使用其中孔穴及核心 顛倒之模製方法而非慣用之方法。 再者’當藉共射出模製製造薄模製品,樹脂宜在高射出 速度下射入模穴中。若樹脂射出速度較慢,則樹脂未進入TECHNICAL FIELD The present invention relates to a method for manufacturing a plated molded article having a thin portion. The present invention also relates to a method for plating a surface of a co-injection molded article having a resin molded article and a surface of an elastic layer on the back side of the molded article. In particular, the present invention relates to a method for plating the surfaces of electrical or electronic components (such as switches, and controlling keyboard surfaces of personal computers), OA equipment (such as personal computers and telephones), and communication equipment (such as DVDs and MDs), and In particular, it relates to a method for manufacturing a cellular phone operation button (keyboard). Technical background For example, there is a growing demand for reducing the thickness of a foldable (clamshell) mobile phone. For this mobile phone, the operation button (keyboard) attached to it must be as thin as possible. Generally, the operation knob is molded from ABS resin (acrylonitrile-butadiene-styrene copolymer), which is easy to plate. However, ABS resin has poor adhesion to the body of a mobile phone. Furthermore, the operation button may have a portion which is not plated for decorative purposes. In this example, a resin other than the ABS resin such as a pc (polycarbonate) resin can be co-injection molded. In addition, bright and foggy surfaces (micro-rough surfaces) can be set on the surface of the operation button for installation purposes. Conventionally, when the operation button of a mobile phone is manufactured in-mold, the obtained operation button will lack an overwhelming and beautiful impression. To avoid this, the surface of the molded article is plated after co-injection molding as described above. When manufacturing thin co-injection moldings, the molding method is used in which the holes and cores are reversed instead of the usual method. Furthermore, when co-injection molding is used to manufacture thin molded products, the resin should be injected into the cavity at a high injection speed. If the resin injection speed is slow, the resin does not enter

本纸張尺度適财@ @家標^X 297公玉 554086 A7 B7 五、發明説明(2 ) 模六中且無法獲得薄模製品。然而,較快射出速度將引起 鍍敷層易自所得模製品脫離之問題。此問題之理由係認為 棋製品表面缺乏在其上之鍍敷層定銷(anchor)之能力,視模 具中樹脂流動性或定向性而定。 特定言之,依據習知鍍敷,藉無電鍍敷在模製品表面上 形成金屬鍍敷層;藉電鍍自無電鍍敷層表面上形成鎳層; 及藉電鑛在鎳層表面上形成鉻或絡合金層。此艘敷層易在 交叉剝除(cross-out)黏著性測試、熱衝擊測試等中脫離。 因此’考慮藉無電鍍敷形成金屬鑛敷-層後,藉電錢形成 銅鍍敷層。習知銅鍍敷層具有強烈齊平效果,引起下列問 題。 在習知鍍敷中,即使產生操作鈕微粗糙(光滑拋光)表面時 ’此粗糙表面藉鍍敷勻化產生亮度及失去粗糙度。亦即, 破壞電形成之孔穴表面特徵。 行動電話之操作鈕可設有彈性層,其併入共射出模製產 品中以在模製品背表面提供緩衝。再者,共射出模製品表 面可進行鍍敷。 此模製品表面鍍敷典型上藉無電鍍敷進行,其中依序進 行蝕刻步驟、洗滌步驟、觸媒步驟及加速器步驟,接著進 行電鍵。 於蝕刻步驟中,模製品浸於鉻―?曼與硫酸之鉻酸混合物中 。然而,姓刻中,彈性層易溶於鉻酸混合物中。溶解之成 分可在隨後洗滌步驟中凝集且於更隨後步驟中擴散,因此 外來小顆粒附著於模製品鍍敷表面,導致缺陷產品。 -5- 本紙張尺度適用t S S家標準(CNS) A4規格(210X297公爱)This paper is suitable for size @ @ 家 标 ^ X 297 公 玉 554086 A7 B7 5. Description of the invention (2) In the sixth mold, thin molded products cannot be obtained. However, a faster injection speed will cause a problem that the plating layer is easily detached from the obtained molded article. The reason for this problem is that the surface of chess products lacks the ability to anchor the plating on it, depending on the fluidity or orientation of the resin in the mold. In particular, according to the conventional plating, a metal plating layer is formed on the surface of the molded article by electroless plating; a nickel layer is formed from the surface of the electroless plating layer by electroplating; and chromium or Network alloy layer. This coating is easily detached in cross-out adhesion tests, thermal shock tests, and the like. Therefore, it is considered to form a copper plating layer by borrowing electricity after forming a metal ore-layer by electroless plating. The conventional copper plating has a strong flushing effect and causes the following problems. In the conventional plating, even when a slightly rough (smooth polished) surface of the operation knob is generated, the rough surface is uniformly plated to produce brightness and lose roughness. That is, the surface characteristics of the holes formed by the electricity are destroyed. The operation button of the mobile phone may be provided with an elastic layer which is incorporated into the co-injection molded product to provide cushioning on the back surface of the molded product. Furthermore, the surface of the co-injection molded product can be plated. The surface plating of this molded article is typically performed by electroless plating, in which an etching step, a washing step, a catalyst step, and an accelerator step are sequentially performed, followed by electric keys. During the etching step, the molded article is immersed in a chromic acid mixture of chromium-man and sulfuric acid. However, in the last name, the elastic layer is easily soluble in the chromic acid mixture. The dissolved components can agglomerate in a subsequent washing step and diffuse in a later step, so small foreign particles adhere to the plating surface of the molded product, resulting in defective products. -5- This paper size is applicable to SS, AS (CNS) A4 specifications (210X297 public love)

裝 訂Binding

554086 _ A7 I——---—_ B7__ 五、發明説明(3 ) —-- 為了避免此問題,考慮降低鉻酸混合物濃度至彈性層可 抗溶解之程度。然而此例中,模製品表面上鍍敷層具有不 良黏著性。· 另外,考慮僅在模製品鐘敷後,彈性層再黏著於模製品 背表面。然而此例中,產量大量降低。 當模製品(如行動電話鈕等)鍍敷時,模製品進行預處理 (化學製程)、洗滌、鍍鎳、洗滌、鍍鉻、洗滌及乾燥。此例 中,所用鍍鉻溶液利用含六價鉻之鍍敷浴組合物,及六價 鉻經離子化並藉電泳沉積在標的品表面而形成金屬鉻塗覆 層。雖然六價或二價離子等不存在於金屬鉻塗覆層中,但 需考慮該塗覆層對人類皮膚之不利影響。再者,此產品丟 棄後,金屬鉻腐蝕自然導致六價鉻還原而引起問題。 為了避免此問題,習知上,研究於鍍鉻溶液中利用三價 鉻之處理方法。然而,此研究開始時了解,與僅使用六價 路形成金屬塗敷層之習知方法相較,利用三價路之方法無 • 法提供足夠之塗敷層形成及腐蝕抗性。 —再者,當行動電話操作鈕為共射出模製品且以新導入之 三價鉻鍍敷浴進行鍍敷時,若鍍敷條件設定在製造者設定 之標準控制值内,會引起有些問題因此無法良好控制使用 者所需之規格且需要改變標準控制值及設備。 例如,可在㈣產品表面形成^小脊及突起。此肇因認 為係進入溶液之粉塵或電解中產生之雜質捕捉於鐘敷塗覆 联中。再者’發射力不良。此肇因推測為當錄敷產品具有 極粒糙表面時,在標準電流密度電流無法流動。 _'6- 中國國家標準(CNS) A4規格(210 X 297公釐) --------- ) 五、發明説明(4 發明揭示 本發明一方面係有關一種製造本發明鍍敷模製品之方法 ’模製品具有藉樹脂高速射出模製所得之薄部分之表面進 行鍍敷。該方法包括下列步驟: 0)藉莱電鐘敷於模製品表面上形成金屬鐘敷層; (b) 藉電鍍在無電鍍敷層表面上形成銅鍍敷層; (c) 藉電錢在銅鍍敷層表面上形成鎳層;及 (d) 藉電鍵在鎳層表面上形成鉻或鉻合金層。 高速射出模製之,,高速”意指其中丁二烯分子於ABS樹脂中 定向改變之速度水平。特定言之,丁二烯分子實質上在習 知射出速度圓形定向。當速度大於或等於預定速度時,丁 二烯分子成橢圓定向。因此,習知鍍敷層易自模製品表面 脫離。 一具體例中,鍍銅係在下列條件進行·· 杈製品浸於10至301之含濃度70至90克/升濃度之硫酸銅 及含170至210克/升濃度之硫酸之硫酸銅浴且陰極電流密度 為 1 至 4 A/dm2。 具體例中,在模製品表面上設有亮表面及粗糙表面。 本發明之鍍敷模製品係藉上述任何方法製得。 一具體例中,模製品係行動電芎操作鈕。 一具體例中,藉無電鍍敷所形诔之金屬鍍敷層為鎳層、 銅層等。 依據本發明,甚至對具有藉高速射出模製所得之薄部分 之模製品而言,可獲得抗移除之鍍敷層。再者,即使在光 本纸張尺度it财國國家標準(CNS) A4規格(210) 297公釐) 554086554086 _ A7 I ——----_ B7__ V. Description of the invention (3) --- To avoid this problem, consider reducing the concentration of the chromic acid mixture to the extent that the elastic layer can resist dissolution. However, in this example, the plating layer on the surface of the molded article had poor adhesion. In addition, it is considered that the elastic layer is adhered to the back surface of the molded product only after the molded product is applied to the bell. However, in this case, the yield was greatly reduced. When the molded product (such as a mobile phone button, etc.) is plated, the molded product is subjected to pretreatment (chemical process), washing, nickel plating, washing, chrome plating, washing, and drying. In this example, the chromium plating solution used was a plating bath composition containing hexavalent chromium, and hexavalent chromium was ionized and deposited on the surface of the target by electrophoresis to form a metallic chromium coating layer. Although hexavalent or divalent ions and the like are not present in the metallic chromium coating layer, it is necessary to consider the adverse effect of the coating layer on human skin. Furthermore, after this product is discarded, metal chromium corrosion will naturally cause reduction of hexavalent chromium and cause problems. To avoid this problem, conventionally, a treatment method using trivalent chromium in a chromium plating solution has been studied. However, at the beginning of this study, it was understood that, compared to the conventional method of forming a metal coating layer using only a hexavalent path, the method using a trivalent path did not provide adequate coating layer formation and corrosion resistance. -Furthermore, when the mobile phone operation button is a co-injection molded product and is plated with a newly introduced trivalent chromium plating bath, if the plating conditions are set within the standard control value set by the manufacturer, some problems will be caused. The specifications required by the user cannot be well controlled and the standard control values and equipment need to be changed. For example, small ridges and protrusions can be formed on the surface of the product. This cause is thought to be that the dust entering the solution or the impurities generated in the electrolysis are captured in the bellows coating. Furthermore, the launching power is poor. This cause is presumed that when the recording product has an extremely grainy surface, current cannot flow at a standard current density. _'6- Chinese National Standard (CNS) A4 specification (210 X 297 mm) ---------) V. Description of the invention (4 Disclosure of the invention One aspect of the invention relates to the manufacture of a plating mold of the invention Method of the product 'The molded product has the surface of the thin part obtained by the high-speed injection molding of the resin to be plated. The method includes the following steps: 0) forming a metal clock coating layer on the surface of the molded product by a Lai electric bell; (b) A copper plating layer is formed on the surface of the electroless plating layer by electroplating; (c) a nickel layer is formed on the surface of the copper plating layer by electricity; and (d) a chromium or chromium alloy layer is formed on the surface of the nickel layer by electric bonds. "High-speed injection molding, high-speed" means the level of velocity in which butadiene molecules change orientation in ABS resin. In particular, butadiene molecules are substantially circularly oriented at conventional injection speeds. When the speed is greater than or equal to At a predetermined speed, the butadiene molecules are oriented in an ellipse. Therefore, it is known that the plating layer is easily detached from the surface of the molded product. In a specific example, the copper plating is performed under the following conditions. The product is immersed in a concentration of 10 to 301 Copper sulfate with a concentration of 70 to 90 g / L and copper sulfate bath with a concentration of 170 to 210 g / L of sulfuric acid and a cathode current density of 1 to 4 A / dm2. In the specific example, a bright surface is provided on the surface of the molded product And rough surface. The plated molded product of the present invention is prepared by any of the methods described above. In a specific example, the molded product is a mobile electric operation button. In a specific example, a metal plating layer formed by electroless plating is used. It is a nickel layer, a copper layer, etc. According to the present invention, even for a molded article having a thin portion obtained by high-speed injection molding, a removal-resistant plating layer can be obtained. Furthermore, even at the bare paper scale It Finance Country National Standard (CNS) A4 Regulation (210) 297 mm) 554086

滑拋光表面上形成鍍敷層,該鍍敷可再製得光滑拋光表面。 本發明功能如下。 藉無電鑛敷在模製品表面上形成金屬鍍敷層如鎳層或銅 層後,在無電鐘敷層表面上形成銅鐘敷層。隨後,藉電艘 在銅鍍敷層表面上形成鎳層及鉻或鉻合金層。因此,甚至 對具有薄部分之模製品而言,金屬鍍敷層可堅固地黏著於 底下表面(模製品)及抗脫離。再者,該鐘敷層可再製得模製 口口之光澤表面及光滑抛光表面。 模製品上鍍敷層移除難易係藉下列條杏測量。 交叉剝除黏著性測試:1毫米乘以1毫米交叉切割 熱衝擊測試:85。(: 1小時及-35t 1小時重複循環。在6次 或更多次循環後鍍敷層需仍完整。習知鍍敷層在3次循環後 遭破壞。 依據本發明鍍敷模製品製造方法之另一目的,在主要模 製品表面至少部分上藉整體模製彈性層作為次要模製品所 得之模製品表面進行鍍敷處理。該方法包括藉由使模製品 浸於鉻酸及硫酸之混合物中而蝕刻模製品表面之步驟,其 中蝕刻步驟係於下列條件下進行: (a) 混合物溫度為65至69°C ; (b) 混合物中鉻酸濃度為370烏_/升至390克/升;及 (c) 混合物中硫酸濃度為190尧/升至230克/升。 一具體例中,該方法在蝕刻步驟後又依序包括洗條步驟 、觸媒步驟及加速器步驟。加速器步驟包括將模製品浸於 pH比觸媒步驟中所用酸溶液之PH更接近中性之酸性溶液中 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 554086 五、發明説明(6 ) ,且使酸性溶液與活性碳接觸因此.酸性溶液中所含雜質被 吸收,及隨後洗滌該模製品。 一具體例中,洗蘇步驟包括在水槽底側提供噴嘴之步驟 ,該噴嘴吹出微小空氣泡及蔣空氣泡吹向模製品: -具體例中’彈性層係由熱塑性聚胺基甲衣酸:彈性體所 組成。 本發明之鍍敷模製品係蕻卜诚^ 一, 标猎上述任何方法所製得。該鍍敷 模製品為行動電話操作紐。 /據本發明’ Μ敷層可設在共射出模-製品表面上,該模 製品包括樹脂模製品及整體模製在樹脂模製品背表面之彈 性層而無細粗造度。 本發明功能如下。 藉由在最適蝕刻條件下蝕刻該共射出模製品,可在模製 表面上提供良好黏著性之鐘敷層同時儘可能抑制彈性體 溶出。若蝕刻條件未令人滿意,則鍍敷層黏著性不足,引 起較差耐久性。若過度進行蝕刻,則彈性層溶解,引起模 製品表面狀況劣化。結果,增加缺陷產品產生。 依據本發明鍍敷模製品製造方法之另一目的,共射出模 製所得之模製品藉三價鉻鍍敷處理。該方法包括在下列條 件鍍敷之步驟: (a) 鍍敷浴中三價鉻濃度為6至40克/升; (b) 鍍敷浴中雜質總量為60 ppm或以下; (c) 浴溫為40至50X:; (d) 鍍敷浴pH為3.2至3.6 ; -9- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 裝 訂 線 554086 A7 _ B7 五、發明説明(7 ) (e) 陰極電流密度為3至5 A/dm2 ;及 (f) 陽極/陰極比例為1 ·5至2 : 1。 一具體例中,鍍敷條件又包含: (g) 整流器··一具有調整電流量儘可能為總電流量之3倍 或以上之能力者;及 (h) 過濾能力:整個浴溶液每小時連續通過過濾器7次或 以上。 一具體例中,模製品為行動電話之操作銀鈕。 依據本發明鍍敷模製品製造方法之再一目的,共射出模 製所得之模製品藉三價鉻鍍敷處理。該方法包括在下列條 件鍍敷之步驟: (a) 鍍敷浴中三價鉻濃度為5至10克/升; (b) 鍍敷浴中雜質總量為60 ppm或以下; (c) 浴溫為53至63°C ; (d) 鍍敷浴pH為3.2至3·6 ; (e) 陰極電流密度為3至5 A/dm2 ;及 (f) 陽極/陰極比例為1.5至2 : 1。 一具體例中,鍍敷條件又包含: (g) 整流器:一具有調整電流量儘可能為總電流量之3倍 或以上之能力者;及 - (h) 過濾能力:整個浴溶液每小時連續通過過濾器7次或 以上。 一具體例中,模製品為行動電話操作黑鈕。 鍍敷模製品係以上述任何方法製得。 -10 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 五、發明説明(8 依據本發明,+ 對腐蝕具有優異抗性之化學轉化塗層可使 用热六價鉻之處理溶液藉表面處理而形成。 本發明功能如下。 本&明中1鍍敷條件有關下列項目改變如下。 ()表面脊及大起(附接外來物,缺陷) 邱改良錢敷洛之過濾性能且改變浴之雜質對照值,導致液 te中顆粒均勻度改良(改良過濾精確度)及減少附接之外來 物。 (2)投射力 调整液體濃度控制範圍,重設液體溫度標準值及重設pH 值。 特定言之,浴之金屬濃度調整至比習知方法高,因而改 良投射力。再者,改良反應率,因而改良投射力。再者, pH設定在較高’因而增加反應率。 圖式簡單說明 圖1為藉本發明製造方法所得之鍍敷模製品剖視圖。 圖2為藉本發明製造方法所得之另一錢敷模製品剖視圖。 進行本發明之最佳模式 (第一發明) 如圖1所示,本發明之薄模製土丨4包括藉共射出模製製得 之薄模製部分13。再者,該薄❹品14包括由他樹脂所 形成之主要模製品1 1及藉共射出模製在主要模製品11内側 模製之次要模製品丨2。該次要模製品丨2可由透明樹脂如% 所形成。 -11 - 本纸银尺度適用中國國家標準(CNS) A4規格(210 X 297¾) 554086 A7A plating layer is formed on the smooth polished surface, and the plating can be used to obtain a smooth polished surface. The function of the present invention is as follows. After forming a metal plating layer such as a nickel layer or a copper layer on the surface of the molded article by electroless ore coating, a copper bell cladding layer is formed on the surface of the electroless bell cladding layer. Subsequently, a nickel layer and a chromium or chromium alloy layer are formed on the surface of the copper plating layer by a power boat. Therefore, even for a molded article having a thin portion, the metal plating layer can firmly adhere to the bottom surface (molded article) and resist detachment. Furthermore, the bell cladding layer can be used to obtain the glossy surface and smooth polished surface of the molded mouth. The ease of removing the plating layer on the molded article is measured by the following bars. Cross-peel adhesion test: 1 mm by 1 mm cross-cut Thermal shock test: 85. (: 1 hour and -35t 1 hour repeat cycle. The plating layer needs to be intact after 6 or more cycles. It is known that the plating layer is damaged after 3 cycles. According to the method for manufacturing a plated molded product according to the present invention Another object is to perform a plating treatment on the surface of a molded article obtained by at least partially using the integrally molded elastic layer as a secondary molded article on the surface of the primary molded article. The method includes immersing the molded article in a mixture of chromic acid and sulfuric acid The step of etching the surface of the molded product in an intermediate manner, wherein the etching step is performed under the following conditions: (a) the temperature of the mixture is 65 to 69 ° C; (b) the concentration of chromic acid in the mixture is 370 U / L to 390 g / L And (c) the sulfuric acid concentration in the mixture is 190 to 230 g / l. In a specific example, the method includes a strip washing step, a catalyst step, and an accelerator step in order after the etching step. The accelerator step includes The molded product is immersed in an acidic solution whose pH is closer to neutral than the pH of the acidic solution used in the catalyst step. The size of this paper is applicable to China National Standard (CNS) A4 (210 X 297 mm) 554086 5. Description of the invention (6) And make the acidic solution and active The carbon contact is therefore the impurities contained in the acidic solution are absorbed, and the molded product is subsequently washed. In a specific example, the washing step includes the step of providing a nozzle on the bottom side of the water tank, which blows out tiny air bubbles and air bubbles. Molded products:-In the specific example, the 'elastic layer is composed of thermoplastic polyurethane amino acid: elastomer. The plated molded product of the present invention is made by any of the above methods. The plating The molded product is a mobile phone operation button. / According to the present invention, the 'M coating may be provided on the surface of the co-injection mold-product. The molded product includes a resin molded product and an elastic layer integrally molded on the back surface of the resin molded product. Fineness and coarseness. The function of the present invention is as follows. By etching the co-injection molding under the optimal etching conditions, a bell cladding layer with good adhesion on the molding surface can be provided while suppressing the elution of the elastomer as much as possible. If it is satisfactory, the adhesion of the plating layer is insufficient, causing poor durability. If the etching is excessively performed, the elastic layer is dissolved, causing the surface condition of the molded product to deteriorate. As a result, the production of defective products is increased. According to another object of the method for manufacturing a plated molded product of the present invention, the molded product obtained by injection molding is processed by trivalent chromium plating. The method includes the steps of plating under the following conditions: (a) three in the plating bath Valence chromium concentration is 6 to 40 g / L; (b) the total amount of impurities in the plating bath is 60 ppm or less; (c) the bath temperature is 40 to 50X :; (d) the pH of the plating bath is 3.2 to 3.6; -9- This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) binding line 554086 A7 _ B7 V. Description of the invention (7) (e) The cathode current density is 3 to 5 A / dm2; and (f) Anode / cathode ratio is 1.5 to 2: 1. In a specific example, the plating conditions also include: (g) a rectifier ... a person who has the ability to adjust the current as much as three times or more of the total current as much as possible; and (h) the filtration capacity: the entire bath solution is continuous every hour Pass the filter 7 or more times. In a specific example, the molded product is an operation silver button of a mobile phone. According to still another object of the method for manufacturing a plated molded product of the present invention, the molded product obtained by injection molding is processed by trivalent chromium plating. The method includes the steps of plating under the following conditions: (a) the concentration of trivalent chromium in the plating bath is 5 to 10 g / liter; (b) the total amount of impurities in the plating bath is 60 ppm or less; (c) the bath Temperature is 53 to 63 ° C; (d) plating bath pH is 3.2 to 3.6; (e) cathode current density is 3 to 5 A / dm2; and (f) anode / cathode ratio is 1.5 to 2: 1 . In a specific example, the plating conditions also include: (g) a rectifier: someone who has the ability to adjust the current as much as three times or more of the total current as much as possible; and-(h) the filtration capacity: the entire bath solution is continuous every hour Pass the filter 7 or more times. In a specific example, the molded product operates a black button for a mobile phone. The plated molded article is produced by any of the methods described above. -10-This paper size is in accordance with Chinese National Standard (CNS) A4 specification (210X297 mm) 5. Description of the invention (8 According to the present invention, + chemical conversion coatings with excellent resistance to corrosion can be treated with hot hexavalent chromium The solution is formed by surface treatment. The function of the present invention is as follows. The following conditions of the plating conditions of the & Mingzhong 1 are changed as follows. () Surface ridges and large rises (attach foreign objects, defects) Qiu improved the filter performance of Qian Shiluo And change the bath impurity control value, resulting in improved particle uniformity in the liquid te (improved filtration accuracy) and reduced attachment of foreign objects. (2) Projection force to adjust the liquid concentration control range, reset the standard value of the liquid temperature and reset pH value. In particular, the metal concentration of the bath is adjusted to be higher than the conventional method, thereby improving the projection force. Moreover, the reaction rate is improved, and therefore the projection force is improved. Furthermore, the pH is set to be higher, thereby increasing the reaction rate. Brief Description of the Drawings Figure 1 is a sectional view of a plated molded article obtained by the manufacturing method of the present invention. Figure 2 is a sectional view of another coined molded product obtained by the manufacturing method of the present invention. Mode (First Invention) As shown in FIG. 1, the thin-molded soil 4 of the present invention includes a thin-molded portion 13 made by co-injection molding. Furthermore, the thin-shaped product 14 includes a resin made of other materials. The main molded product 11 and the secondary molded product molded inside the main molded product 11 by co-injection molding. The secondary molded product 2 may be formed of a transparent resin such as%. -11-Paper silver scale Applicable to China National Standard (CNS) A4 specification (210 X 297¾) 554086 A7

此樓狀射出模製品u具有厚度狀35毫米或以下’較好 〇·15-〇·30毫米之薄部分。該 ^ ^ ^衩衣口口 Τ精共射出模製而模製 具中扠穴及核心係顛倒。由於π古兮益★ J由於δ又有泫溥部分,該射出速 度比習知快。 ~ ®、 因此所得具有薄部分之模製 <悮衣。口進仃鍍敷而藉下列步驟鍍 敷該模製品表面。 ⑷洗蘇模製品後’藉鍍敷錄(化學錢敷)或無電鍛敷銅(化 學鍍敷)而在模製品表面上形成金屬鍍敷層。 該無電鑛敷可以下列方式進行。 蝕刻步驟:模製品浸於預定溫度之含鉻酸酐及硫酸之水 溶液中’接著洗滌,及模製品表面變粗造。 觸媒(觸媒器)步驟:模製品浸於含氣化鈀、氣化亞錫及氫 氣S:SL之水浴液中,接著洗條,因此纪吸收至模製品表面。 加速器步驟:模製品浸於氫氣酸水溶液中,接著洗條, 因此吸附之錫與觸媒步驟中之鈀一起溶解且以氫氣酸溶液 分開。 無電鍍敷鎳或無電鍍敷銅(化學鍍敷): 模製品浸於鎳或銅、福馬林、Rochelle鹽、氫氧化納、水 、次磷酸鈉、氨等之混合物中’接著洗滌,因此鎳(銅)由於 福馬林及次磷酸鈉之還原反應而导積在鈀上。 接著,依下列方式在無電鍍敷肩上進行鍍敷。 本發明中,鏡銅、鑛鎳後,進行絡錄敷或鉻合金艘敷。 (b)猎電鐘在無電艘敷層表面上形成銅鍵敷層。 銅鍍敷層厚度典型上為5微米至15微米。 -12- 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 錢銅條件如下。 拉製品浸於1〇-30°C (更好20。〇之含有硫酸銅濃度70-90克/ 升及硫酸濃度170-210克/升之硫酸銅浴中,及在陰極電流密 度為1 -4 A/dm2進行鍵敷。 因此,本發明中,利用非等量硫酸銅。由於硫酸銅具有 優異追隨性(f〇ll〇wingness),因此接受瘤化(blasting)(粗化) 之模製品原始表面部分變成脊及就此為瘤化圖形(粗化)之突 起。再者,平坦表面(亮表面)可如習知所得般展現亮印象。 (0藉電鍍在銅鍍敷層表面形成鎳層。- K DO /又於g硫酸錄、氣化鎳、叾朋酸、及亮光劑之混合 物中及在電壓及電流預定條件下處理,接著洗滌,因而 在模製品表面形成鎳塗覆層。 (d)藉電鍍在鎳層表面形成鉻或鉻合金層。 隨後,模製品經洗滌及乾燥。 依此方式,模製品包括不同樹脂物質部分(15,⑻。因此 ’模製品表面部分可為透明。另夕卜’自模製品表面部分到 除鍍敷層’藉此模製品輯著劑緊㈣著於例如行動電話 主體之矽氧橡膠片。 :上述’裝飾用之習知硫酸銅提供高勾化能力之錄敷層 …底下層之經瘤化部分(粗,)及平滑 因鍍敷層而經亮拋光。 : ^ " )勾 二據本發明,非等量硫酸鋼可提供具優異追隨 部分(粗化)之脊-及-突起圖形。底下/之持平底/層之經瘤化 * s之+滑部分(亮表面) -13- 554086 A7This floor-like injection molded article u has a thickness of 35 mm or less, preferably a thin portion of 0.15 to 0.30 mm. The ^ ^ ^ 口 口 口 fine injection injection molding and the mold with the fork point and the core system are upside down. Due to π Gu Xiyi ★ J, because of the 又 part of δ, the injection speed is faster than that known. ~ ®, so the resulting molded part with thin portions < 悮 衣. Oral plating was performed by plating the surface of the molded article by the following steps. After washing the molded product, a metal plating layer is formed on the surface of the molded product by plating (chemical plating) or electroless forging copper (chemical plating). The electroless deposit can be performed in the following manner. Etching step: The molded article is immersed in an aqueous solution containing chromic anhydride and sulfuric acid at a predetermined temperature, followed by washing, and the surface of the molded article is roughened. Catalyst (catalyst) step: The molded product is immersed in a water bath containing vaporized palladium, stannous gas and hydrogen gas S: SL, and then the strip is washed, so it is absorbed onto the surface of the molded product. Accelerator step: The molding is immersed in a hydrogen acid solution, followed by washing the strip, so the adsorbed tin is dissolved together with the palladium in the catalyst step and separated with a hydrogen acid solution. Electroless nickel or electroless copper (electroless plating): The molding is immersed in a mixture of nickel or copper, formalin, Rochelle salt, sodium hydroxide, water, sodium hypophosphite, ammonia, etc. (Copper) is deposited on palladium due to the reduction reaction of formalin and sodium hypophosphite. Next, plating was performed on the electroless plated shoulder in the following manner. In the present invention, after mirror-copper or ore-nickel is applied, lacquering or chromium alloy boat coating is performed. (b) The hunting clock forms a copper bond coating on the surface of the non-electric ship coating. The thickness of the copper plating layer is typically 5 to 15 microns. -12- This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm). The copper and copper conditions are as follows. The drawn product is immersed in a copper sulfate bath at 10-30 ° C (better 20.0) containing a copper sulfate concentration of 70-90 g / L and a sulfuric acid concentration of 170-210 g / L, and at a cathode current density of 1- 4 A / dm2 for bonding. Therefore, in the present invention, non-equal amount of copper sulfate is used. Because copper sulfate has excellent followability (following), it is subject to blasting (roughening) moldings The original surface part becomes ridges and protrusions that are nodular patterns (roughened). Furthermore, the flat surface (bright surface) can show a bright impression as is known. (0 A nickel layer is formed on the surface of the copper plating layer by electroplating -K DO / is treated in a mixture of sulfuric acid, gasified nickel, pentopenic acid, and brightener and under predetermined conditions of voltage and current, followed by washing, thereby forming a nickel coating on the surface of the molded product. d) A chromium or chromium alloy layer is formed on the surface of the nickel layer by electroplating. Subsequently, the molded product is washed and dried. In this way, the molded product includes different resin substance parts (15, ⑻. Therefore, the surface part of the molded product may be transparent. In addition, 'from the surface part of the molded product to the plating layer' The molding agent is tightly adhered to, for example, the silicone rubber sheet of the main body of the mobile phone.: The above-mentioned "coated conventional copper sulfate provides a coating layer with high hooking ability ... the nodular part of the bottom layer (rough,)" And smooth polished due to the plating layer.: ^ &Quot;) Hook two According to the present invention, non-equal amount of sulfuric acid steel can provide a ridge-and-protrusion pattern with an excellent following portion (roughening). Bottom / flat bottom / Layer of nodularity * s + sliding part (bright surface) -13- 554086 A7

554086 A7 B7554086 A7 B7

五、發明説明 對此步驟而言,較佳條件如下: 所用鉻酸混合物溫度較好為65至69°C及更好66至68。(:。 鉻酸混合物之鉻酸濃度較好為370克/升至390克/升。其硫 酸辰度較好為190克/升至23 0克/升。姓刻步驟處理時間典型 上為8至12分鐘。 當鉻酸濃度遠咼於上述範圍,則彈性層22不利地炼解及 雜質溶入混合物中。當硫酸濃度遠高於上述範圍,則發展 出結晶,阻礙連續製造。該理由認為係高硫酸濃度引起鉻 酸混合物中絡酸變飽和。 預備姓刻步驟可在上述钱刻步驟之前進行。此例中,姓 刻條件如下。 預備蝕刻步驟: 所用鉻酸混合物溫度較好為66至68。(:。 絡酸混合物之鉻酸濃度較好為135至丨65克/升。硫酸濃度 車父好為1 80克/升至220克/升。飯刻步驟處理時間典型上為2 至4分鐘。 A-2.洗滌步驟 為了自模製品表面移除上述鉻酸混合物,進行洗滌。洗 滌步驟可藉水淋洗模製品。再者,洗滌後,若需要,進行 中和接著再度進行洗滌。 、 A-3·觸媒(觸媒器)步驟 上述模製品浸於氯化鈀、氣化亞錫及氫氣酸之水溶液中 ,接著洗滌,因而鈀吸附至模製品表面。 觸媒步驟中’浸泡係在下列條件進行。 -15 - 本紙張尺度㈣中@ @家料(CNS) A4規格(21G X撕公董了 裝 訂V. Description of the invention For this step, the preferred conditions are as follows: The temperature of the chromic acid mixture used is preferably 65 to 69 ° C and more preferably 66 to 68. (:. The chromic acid concentration of the chromic acid mixture is preferably 370 g / l to 390 g / l. The sulfuric acid degree is preferably 190 g / l to 230 g / l. The processing time of the engraving step is typically 8 To 12 minutes. When the concentration of chromic acid is far outside the above range, the elastic layer 22 is disadvantageously decomposed and impurities are dissolved in the mixture. When the concentration of sulfuric acid is much higher than the above range, crystals develop and hinder continuous manufacturing. The reason is that The high sulfuric acid concentration causes the complex acid to saturate in the chromic acid mixture. The preliminary name engraving step can be performed before the above money engraving step. In this example, the name engraving conditions are as follows. Preliminary etching step: The temperature of the chromic acid mixture used is preferably 66 to 68. (:. The chromic acid concentration of the complex acid mixture is preferably 135 to 65 g / l. The sulfuric acid concentration is preferably 180 g / l to 220 g / l. The processing time of the rice carving step is typically 2 to 4 minutes. A-2. Washing step In order to remove the chromic acid mixture from the surface of the molded article, washing. The washing step can be rinsed with water. After washing, if necessary, neutralize and then wash again. 、 A-3 · Catalyst (catalyst) The above molding is immersed in an aqueous solution of palladium chloride, stannous gas, and hydrogen acid, followed by washing, so that palladium is adsorbed on the surface of the molding. In the catalyst step, 'soaking is performed under the following conditions. -15-This paper scale ㈣ 中 @ @ 家 料 (CNS) A4 specifications (21G X tear off

554086 A7 ' B7554086 A7 '' B7

五、發明説明(13 溫度:31至35°C 濃度(觸媒):53-67克/升 濃度(氫氯酸):280-320克/升 滚度(鉻濃度):150 ppm或以下 洗滌可藉淋洗進行。 A - 4.加速為步驟 模製品浸於氫氯酸水溶液中,接著洗滌,因而可與觸媒 步驟中之鈀一起吸附之錫溶解並以鹽酸分開。 加速器步驟中較佳浸泡條件如下。V. Description of the invention (13 Temperature: 31 to 35 ° C Concentration (catalyst): 53-67 g / l Concentration (hydrochloric acid): 280-320 g / l Roller (chromium concentration): 150 ppm or less Washing It can be carried out by leaching. A-4. Acceleration is the step of immersing the molded product in aqueous hydrochloric acid solution, followed by washing, so that the tin adsorbed with the palladium in the catalyst step is dissolved and separated with hydrochloric acid. It is better in the accelerator step. The soaking conditions are as follows.

溫度:36至40°C 雜質(錫):100 ppm或以下 此步驟中,若模製品直接以水洗滌,則觸媒步驟中所用 之酸性溶液之pH (—般pH 1)快速降至中性,因此產生雜質 如氫氧化物並似乎附著至模製品表面。為了避免此,較好 酸性溶液之pH約為1.5及酸性溶液通過活性碳而吸附雜質。 就洗務步驟而言’吹出微小空氣泡之噴嘴設在水槽底部 因此洗滌彈性層22。空氣泡衝撞模製品表面(尤其彈性層22) ,因此模製品表面附著之雜質及殘留藥品可有效移除。 A-5.無電鍍敷鎳或鍍敷銅(化學鍍敷) 模製品浸於鎳或銅、福馬林、艮ochelle鹽、氫氧化納、次 碳酸鈉、氨、水等之混合物中,接著洗滌。結果,鎳(銅)由 於福馬林及次填酸納之退原反應而沉積在纪上。 隨後,在無電鍍敷層上如下進行鍍敷。 本發明中,鍍鎳或鍍銅後,進行鎳鍍敷、鉻鍵敷、絡入 -16- 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐)Temperature: 36 to 40 ° C Impurity (tin): 100 ppm or below In this step, if the molded product is directly washed with water, the pH of the acidic solution used in the catalyst step (normally pH 1) quickly drops to neutral Therefore, impurities such as hydroxides are generated and seem to adhere to the surface of the molded article. To avoid this, the pH of the acidic solution is preferably about 1.5 and the acidic solution adsorbs impurities through activated carbon. As far as the washing step is concerned, a nozzle for blowing out minute air bubbles is provided at the bottom of the water tank, thereby washing the elastic layer 22. Air bubbles impact the surface of the molded product (especially the elastic layer 22), so the impurities and residual medicines attached to the surface of the molded product can be effectively removed. A-5. Electroless nickel plating or copper plating (chemical plating) Moulded products are immersed in a mixture of nickel or copper, formalin, genchelle salt, sodium hydroxide, sodium hypocarbonate, ammonia, water, etc., and then washed . As a result, nickel (copper) was deposited on the period by the degenerative reaction of formalin and subfilled sodium. Subsequently, plating was performed on the electroless plating layer as follows. In the present invention, after nickel plating or copper plating, nickel plating, chromium keying, and encapsulation are performed. -16- This paper size applies to China National Standard (CNS) A4 (210X297 mm)

裝 訂Binding

554086 A7 ___ _ Έ7 五、發明説明(U^- —- 金鍍敷、金鍍敷或其他合金鍍敷。 (第三發明) 藉下列步驟在具有薄部分之上述模製品表面上進行三價 鉻鍍敷。 ' (A) 洗滌模製品。藉無電鍍敷鎳(化學鍍敷)或無電鍍敷銅 在模製品表面上形成金屬錢敷層。 無電链敷可如下進行。 蝕刻步驟:模製品浸於預定溫度之含鉻酸酐及硫酸之混 合物水溶液中,接著洗滌,及模製品表面變粗糙。 觸媒(觸媒器)步驟··模製品浸於含氣化鈀、氣化亞錫及氫 氯酸之水溶液中,接著洗滌,因而鈀吸附至模製品表面。 加速裔步驟·模製品浸於氫氣酸水溶液中,接著洗務, 因而可與觸媒步驟中之鈀一起吸附之錫溶解並以鹽酸溶液 分開。 無電鍍敷鎳或鍍敷銅(化學鍍敷): 模製品浸於鎳或銅、福馬林、Rochelle鹽、氫氡化納、次 磷酸鈉、氨、水等之混合物中,接著洗滌,因而鎳(銅)由於 福馬林及次碳酸鈉之還原反應而沉積在纪上。 隨後,在無電鍍敷層上如下進行鍍敷。 本發明中,鍍鎳或鍍銅後,進行鉻鍍敷或鉻合金錄敷。 (B) 藉電鍍在無電鍍敷層上形成顧I鍍敷層。 銅鍍敷層厚度典型上為5微米至15微米。 錢銅條件可如下。 模製品浸於10-3 0°C (更好20°C)之含有硫酸銅濃度70-90克/ -17- 本紙張尺度適用中國國家標準(CNS) A4規格(210 χ 297公釐) 554086 A7 —B7554086 A7 ___ _ Έ7 V. Description of the invention (U ^-—- Gold plating, gold plating or other alloy plating. (Third invention) The following steps are used to perform trivalent chromium on the surface of the above-mentioned molded product having a thin portion. Plating. '(A) Washing of molded products. Metal plating is formed on the surface of molded products by electroless nickel plating (electroless plating) or electroless copper plating. Electroless chain coating can be performed as follows. Etching step: dipping of molded products In a mixture of chromic anhydride and sulfuric acid at a predetermined temperature, followed by washing, and the surface of the molded product becomes rough. Catalyst (catalyst) step ·· The molded product is immersed in gaseous palladium, stannous gas and hydrogen chloride In the aqueous solution of acid, the palladium is adsorbed on the surface of the molded product. The accelerated step · The molded product is immersed in the hydrogen acid aqueous solution and then washed, so the tin adsorbed with the palladium in the catalyst step can be dissolved and dissolved in hydrochloric acid The solution is separated. Electroless nickel plating or copper plating (electroless plating): The molded product is immersed in a mixture of nickel or copper, formalin, Rochelle salt, sodium hydroxide, sodium hypophosphite, ammonia, water, etc., and then washed , So nickel ( ) Deposited on the surface due to the reduction reaction of formalin and sodium hypocarbonate. Subsequently, plating is performed on the electroless plating layer as follows. In the present invention, after nickel plating or copper plating, chromium plating or chromium alloy recording is performed. (B) Gu plating layer is formed on the electroless plating layer by electroplating. The thickness of the copper plating layer is typically 5 micrometers to 15 micrometers. The copper and copper conditions can be as follows. The molded product is immersed in 10-3 0 ° C ( Better at 20 ° C) Concentration of copper sulfate containing 70-90 g / -17- This paper size applies Chinese National Standard (CNS) A4 (210 χ 297 mm) 554086 A7 —B7

及在陰極電流密 及亮光劑之混合 接著洗條,因而 五、發明説明(15 升及硫酸Mm_2l…狀俩銅浴中 度為1-4 A/dm2進行電艘。 (C)藉電鍍在銅鍍敷層表面形成鎳層。 模製品浸於含硫酸鎳、氣化鎳、硼酸 物中,及纟電壓及電流預定條件下處理 在模製品表面形成錄塗覆層。 電鍍後絲步驟中,水較好藉特^裝置之方式震動給水 ’因此穿透共射出模製品主要及次要模製品!及2間之And in the cathode current dense and brightener mix and then wash the bar, so the fifth, the invention description (15 liters and sulfuric acid Mm_2l ... two copper baths with a moderate 1-4 A / dm2 for electric boat. (C) by electroplating on copper A nickel layer is formed on the surface of the plating layer. The molded article is immersed in nickel sulfate, gasified nickel, boric acid, and treated under predetermined voltage and current conditions to form a coating layer on the surface of the molded article. In the wire step after electroplating, water It is better to use special means to vibrate the water supply, so the main and secondary moldings are penetrated and co-injected!

之水可完全移除。 · S (D)藉電鍍在鎳層表面形成鉻或鉻合金層。 本發明中’進行三價鉻鍍敷。鍍敷溶液組成為例如硫酸 鉻(三價)、乙酸鉻(三價)、硝酸鉻(三價)、氣化鉻(三價)、 或忪s文氫鉻(二價)(參見日本公開公報2〇〇〇_54丨57號)。 此例中,鍍銀色之條件如下。 U)鍍敷浴三價鉻濃度:6至1〇克/升(較好7至9克/升) (b)鍍敷冷中總雜質量:6〇 ppm或以下(較好35卯㈤或以 下) (c) 浴溫·· 40至 50。(:(較好 47至 49。(:) (d) 鍍敷浴 pH ·· 3.2 至 3.6(較好 3.35 至 3.45) (e) 陰極電流密度:3至5_1112(較好3.5至4.5八/(11112) (0 陽極/陰極比例:1.5至2 : Γ (g) 整流态·一具有調整電流量儘可能為總電流量之3倍 或以上之能力者; (h) 過/慮此力·整個浴溶液每小時通過過;慮器7次或以上 -18 - 554086 A7 B7The water can be completely removed. · S (D) forms a chromium or chromium alloy layer on the surface of the nickel layer by electroplating. In the present invention, trivalent chromium plating is performed. The composition of the plating solution is, for example, chromium sulfate (trivalent), chromium acetate (trivalent), chromium nitrate (trivalent), vaporized chromium (trivalent), or chromium hydrogen hydrogen (divalent) (see Japanese Patent Publication) 2000 ~ 54 丨 57). In this example, the conditions for silver plating are as follows. U) Trivalent chromium concentration in the plating bath: 6 to 10 g / l (preferably 7 to 9 g / l) (b) Total impurities in the cooling of the plating: 60 ppm or less (preferably 35 卯 ㈤ or less) Below) (c) Bath temperature · 40 to 50. (: (Preferably 47 to 49. (:) (d) Plating bath pH · 3.2 to 3.6 (preferably 3.35 to 3.45) (e) Cathode current density: 3 to 5_1112 (preferably 3.5 to 4.5 // ( 11112) (0 anode / cathode ratio: 1.5 to 2: Γ (g) rectified state · one who has the ability to adjust the current as much as 3 times or more of the total current as much as possible; (h) over / consider this force · whole Bath solution passed every hour; 7 or more baths-18540540 A7 B7

。此過濾係連續進行。特定言之,心德環浴溶液量習知 上每小時约2次’而本發明為每小時7至1〇次。所用過濾器 (過滤布)較好網目大小為5微米至1〇微米(習知約5〇至1〇〇微 米)。 再者,上述電流較好經常施加於鍍敷浴中。 為了獲得黑色模製品,處理條件僅改變下列各點。 (a,)鍍敷浴中三價鉻濃度為6至1〇克/升(較好6至9克/升) (c)浴溫為:53至63。(3(較好57至59°C) (d’)艘敷洛 pH ·· 3·2 至 3.6(較好 3.45 至 3:55) 因此,鉻濃度及液體溫度增加約2%,pH降低約〇 2,及過 濾能力相對於製造商建議之標準鍍敷條件增加2 5倍或以上 ,因此可降低雜質。 (實例1) 由ABS樹脂製得之主要模製品及由熱塑性聚胺基曱酸酯彈 性體所製得之次要模製品藉共射出模製在一起而獲得行動 電話用之模製紐產品。 此模製品在下列條件下蝕刻。蝕刻後,模製品以水洗滌2 次。各洗滌水通過過濾膜(#2)及藉濾紙吸附之殘留物以視覺 觀察及評估(其因子範圍自最差5〇至最佳〇)。再者,洗滌之 模製品以習知方法鍍敷及模製品之鍍敷層以視覺觀察。 A.測試標的 : 相仏上述第二钱刻步驟(第二發明之丨步驟)中,熱塑性 水胺基曱酸醋彈性體溶解,及藉洗液等固化,及固化之彈 性體分散於隨後步驟中,因此產生缺陷產品。研究肇因是 • 19- 尽紙狀㈣财關家料(CNS^規格(咖χ撕公爱)- 554086 A7 B7 五、發明説明(17 ) 否為鉻酸混合物之鉻酸或硫酸。 B. 測試條件 鉻酸混合物藉組合3種量之鉻酸濃度(350至410克/升,30 克/升逐步變化)及3種量之硫酸濃度(180至240克/升,30克/ 升逐步變化)而製備。 C. 測試方法 上述製備之各絡酸混合物倒入1升燒瓶中。6個上述模製 品浸於此混合物中及蝕刻8分鐘。此蝕刻製程重複2次。 D. 評估方法 於C段落蝕刻之模製品洗滌2次。各洗滌水通過過濾膜(#2) ,及藉濾紙吸附之殘留物以視覺觀察及評估(其因子範圍自 最差50至最佳0)。再者,視覺觀察附著至濾紙之油膜。 E. 結果 結果示於表1。 表1 編號 蝕刻濃度 第一次洗滌 第二次洗滌 鍍敷產品測試結果 鉻酸 硫酸 殘留物 油膜 殘留物 油膜 n= p= % 突起大小 突起面積 1 410克/升 180克/升 50 略有 3 無 40 23 58% 大 大 2 380克/升 180克/升 50 多 3 多 48 45 94% 大 大 3 350克/升 180克/升 40 多 10 多 80 80 100% 大 大 4 410克/升 210克/升 20 多 1 略有 48 6 13% 中度 中度 5 380克/升 210克/升 1 略有 2 無 40 8 20% 中度 小 6 350克/升 21()克/升 5 多 3 略有_ 96 4 4% 中度 中度 7 410克/升 240克/升 2 略有 1 略有 48 32 67% 小 中度 S 380克/升 240克/升 1 無 1 略有 48 27 56% 中度 中度 9 350克/升 240克/升 1 無 1 無 48 34 71% 中度 中度 -20- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐). This filtration is performed continuously. Specifically, the amount of Xinde ring bath solution is conventionally about 2 times per hour ', while the present invention is 7 to 10 times per hour. The filter (filter cloth) used preferably has a mesh size of 5 to 10 micrometers (conventionally about 50 to 100 micrometers). Furthermore, it is preferable that the above-mentioned current is often applied to the plating bath. In order to obtain a black molded article, the processing conditions were changed only by the following points. (a,) The trivalent chromium concentration in the plating bath is 6 to 10 g / l (preferably 6 to 9 g / l). (c) The bath temperature is 53 to 63. (3 (preferably 57 to 59 ° C) (d ') Bunara pH ··· 3.2 to 3.6 (preferably 3.45 to 3:55) Therefore, the chromium concentration and liquid temperature increase by about 2%, and the pH decreases by about 2% 〇2, and the filtering capacity increased by 25 times or more relative to the standard plating conditions recommended by the manufacturer, so that impurities can be reduced. (Example 1) Main molded products made from ABS resin and thermoplastic polyurethane The secondary molded article made of the elastomer is molded by co-injection to obtain a molded button product for a mobile phone. This molded article is etched under the following conditions. After the etching, the molded article is washed twice with water. Each washing The water passed through the filter membrane (# 2) and the residue adsorbed by the filter paper were visually observed and evaluated (the factor ranged from the worst 50 to the best 0). Furthermore, the washed molded products were plated and molded by conventional methods. The plating layer of the product is visually observed. A. Test target: In the second step (the second step of the second invention), the thermoplastic water-based amino acetic acid elastomer is dissolved, and the liquid is cured by a lotion, etc. And the cured elastomer is dispersed in subsequent steps, resulting in defective products. • 19- Paper-like ㈣ 财 guan household materials (CNS ^ Specifications (咖 χ 撕 公 爱)-554086 A7 B7 5. Description of the invention (17) Whether it is chromic acid or sulfuric acid of chromic acid mixture. B. Test conditions chromic acid The mixture is prepared by combining three amounts of chromic acid concentration (350 to 410 g / L, stepwise change of 30 g / L) and three amounts of sulfuric acid concentration (180 to 240 g / L, stepwise change of 30 g / L). C. Test method Pour each of the complex acid mixtures prepared above into a 1 liter flask. Six of the above moldings are immersed in this mixture and etched for 8 minutes. This etching process is repeated twice. D. Evaluation method is in the mold etched in paragraph C The product was washed twice. Each wash water passed through the filter membrane (# 2), and the residue adsorbed by the filter paper was visually observed and evaluated (the factor range was from the worst 50 to the best 0). Furthermore, the visual observation was attached to the filter paper E. Results are shown in Table 1. Table 1 No. Etching Concentration First Washing Second Washing Plating Product Test Results Chromic Acid Sulfuric Acid Residue Oil Film Residual Oil Film n = p =% Protrusion Size Protrusion Area 1 410 G / l 180 g / l 50 slightly 3 no 40 23 58% greatly 2 380 g / l 180 g / l 50 more 3 more 48 45 94% greatly 3 350 g / l 180 g / l 40 more 10 more 80 80 100% large 4 410 g / l 210 g / l 20 more 1 slightly 48 6 13% moderate 5 380 g / l 210 g / l 1 slightly 2 no 40 8 20% moderately small 6 350 g / l 21 () g / l 5 more 3 slightly _ 96 4 4% medium Moderate Moderate 7 410 g / liter 240 g / liter 2 Slightly 1 Slightly 48 32 67% Small Moderate S 380 g / liter 240 g / liter 1 None 1 Slightly 48 27 56% Moderate Moderate 9 350 grams 240g / L1 No 1 No 48 34 71% Moderate Moderate -20- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

裝 玎Pretend

線 554086 A7 _B7 五、發明説明(18 ) 表1中,η代表測試總數,p代表缺陷產品數,及%代表缺 陷產品百分比。突起大小及面積以視覺測量。 由表1可看出,最佳結果出現在鉻酸濃度為380克/升及硫 酸濃度為210克/升。其中硫酸濃度為240克/升之測試中,在 破裂處液體表面周圍發展液體結晶,顯示此條件不適合確 實製程。此理由被認為係高硫酸濃度引起混合物中鉻酸飽 和。 (實例2) 藉鍍鎳處理之模製品在下列條件下進_行三價鉻鍍敷,獲 得行動電話用銀紐。 (a) 鍍敷浴中三價鉻濃度·· 9克/升 (b) 鍍敷浴中雜質總量·· 3 5 ppm或以下Line 554086 A7 _B7 V. Description of the invention (18) In Table 1, η represents the total number of tests, p represents the number of defective products, and% represents the percentage of defective products. The size and area of the protrusions were measured visually. As can be seen from Table 1, the best results occurred at a chromic acid concentration of 380 g / l and a sulfuric acid concentration of 210 g / l. In the test in which the sulfuric acid concentration was 240 g / L, liquid crystals developed around the liquid surface at the rupture site, indicating that this condition is not suitable for the actual manufacturing process. This reason is considered to be due to the high sulfuric acid concentration causing saturation of chromic acid in the mixture. (Example 2) A molded product treated with nickel plating was subjected to trivalent chromium plating under the following conditions to obtain a silver button for a mobile phone. (a) Trivalent chromium concentration in the plating bath ... 9 g / l (b) Total impurities in the plating bath ... 35 ppm or less

(c) 浴溫:48°C (d) 鍍敷浴pH : 3.4 (e) 陰極電流密度:4.0 A/dm2 (f) 陽極/陰極比例為1.5 : 1 (g) 整流器:一具有調整電流量儘可能為總電流量之3倍 或以上之能力者。 (h) 過濾能力:整個浴溶液每小時連續通過過濾器7次或 以上。 _ 結果,獲得具有良好電鏡覆蓋^7而無粗Μ度之行動電話 銀紐。 (實例3) 藉鍍鎳處理之模製品在下列條件下進行三價鉻鍍敷,獲 -21 - 本纸張尺度適用中國國家標準(CNS) Α4規格(210X297公釐) 554086 A7 _ B7 五、發明説明(19 ) '得行動電話用黑鈕。 (a) 鍍敷浴中三價鉻濃度:9克/升 (b) 鍍敷浴中雜質總量:35 ppm或以下(c) Bath temperature: 48 ° C (d) Plating bath pH: 3.4 (e) Cathode current density: 4.0 A / dm2 (f) Anode / cathode ratio of 1.5: 1 (g) Rectifier: one with adjustable current amount Capable of 3 times or more of the total current. (h) Filtration capacity: The entire bath solution continuously passes through the filter 7 times or more per hour. _ As a result, a mobile phone silver button with good electron microscope coverage ^ 7 without coarse M degrees was obtained. (Example 3) Trivalent chromium plating was performed on a molded product treated with nickel plating under the following conditions, and obtained -21-This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) 554086 A7 _ B7 V. Description of the invention (19) 'There is a black button for a mobile phone. (a) Trivalent chromium concentration in the plating bath: 9 g / l (b) Total impurities in the plating bath: 35 ppm or less

(c) 浴溫:58°C (d) 鍍敷浴pH ·· 3·5 (e) 陰極電流密度·· 4.0 A/dm2 (f) 陽極/陰極比例為1.5比1 (g) 整流器··一具有調整電流量儘可能為總電流量之3倍 或以上之能力者。 (h) 過濾能力:整個浴溶液每小時連續通過過濾器7次或 以上。 結果,獲得具有良好電鍍覆蓋力(thr〇wing Power)而無粗 糙度之行動電話黑鈕。 (比較例1) 藉鍍鎳處理之模製品在下列條件下進行三價鉻鍍敷,獲 得行動電話用銀鈕。 (a) 鍍敷浴中三價鉻濃度:5克/升 (b) 鍍敷浴中雜質總量:600 ppm(c) Bath temperature: 58 ° C (d) Plating bath pH ·· 3 · 5 (e) Cathode current density · 4.0 A / dm2 (f) Anode / cathode ratio of 1.5 to 1 (g) Rectifier ·· One who has the ability to adjust the current as much as three times or more of the total current. (h) Filtration capacity: The entire bath solution continuously passes through the filter 7 times or more per hour. As a result, a black button for a mobile phone having good plating power without roughness is obtained. (Comparative Example 1) A molded product treated with nickel plating was subjected to trivalent chromium plating under the following conditions to obtain a silver button for a mobile phone. (a) Trivalent chromium concentration in the plating bath: 5 g / l (b) Total impurities in the plating bath: 600 ppm

(c) 浴溫·· 4〇°C (d) 鍍敷浴pH :3.2 二一 (e) 陰極電流密度·· 7.0 A/dm2 (f) 陽極/陰極比例為1.5比1 (g) 整流器:一具有調整電流量儘可能為總電流量之1倍 之能力者。 -22- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 554086 A7 B7 五 發明説明(2〇 (h)過濾能力:整個浴溶液每小時連續通過過濾器2次。 結果’獲得具有不良電艘覆盍力而無粗植度之行動電話 銀紐。 (比較例2) 藉鍍鎳處理之模製品在下列條件下進行三價鉻鍍敷,獲 得行動電話用黑鈕。 (a) 鍍敷浴中三價鉻濃度:8克/升 (b) 鐘敷浴中雜質總量· 6 4 0 p p m或以下(c) Bath temperature · 40 ° C (d) Plating bath pH: 3.2 Two (e) Cathode current density · 7.0 A / dm2 (f) Anode / cathode ratio of 1.5 to 1 (g) Rectifier: One who has the ability to adjust the current as much as 1 times the total current. -22- This paper size is in accordance with Chinese National Standard (CNS) A4 specification (210 X 297 mm) 554086 A7 B7 Five inventions description (20 (h) filtration capacity: the entire bath solution continuously passes through the filter 2 times per hour. Result 'Obtained a mobile phone silver button with poor electric boat coverage and no coarseness. (Comparative Example 2) A nickel-plated molded product was subjected to trivalent chromium plating under the following conditions to obtain a black button for a mobile phone. (a) Trivalent chromium concentration in the plating bath: 8 g / l (b) Total impurities in the bell bath · 64 0 ppm or less

(c) 浴溫·· 5(TC (d) 鍍敷浴pH : 3.4 (e) 陰極電流密度:7.0 A/dm2 (f) 陽極/陰極比例為1.5比1 (g) 整流器:一具有調整電流量儘可能為總電流量之2倍 之能力者。 (h) 過濾忐力·整個浴溶液每小時連續通過過濾器2次。 結果,獲得具有不良電鍍覆蓋力而無粗糙度之行動電話 黑鈕。 。 表面粗糙度判斷如下進行:附著之外來物、裂紋等自 公分或更退距離以視覺觀察,及具有大小〇 2毫米或以上 外來物之產品判斷為不合袼。- ^ 電鍍覆蓋力判斷如下進行:先覺評估鍍敷是否均勾及Β 否脫色、污點等,&具有脫色、污點等之產品判斷為不: 產業利用性 -23- 554086 A7 B7 五、發明説明(21 )~ " ^--- 依據第一發明,甚至對具有由高速模製所得之薄部分之 模製品而言,可獲得抗移除之鍍敷層。再者,甚至在光滑 拋光表面形成鍍敷層時,該鍍敷層可再製得該光滑表面。 依據第二發明,可藉蝕刻模製品表面在共射出之模製品 上提供具良好黏著性之鍍敷層,而彈性層可儘可能避免溶 解因此,可避免在模製品表面上發展出突起,因而降低 缺陷產品產生。 依據第二發明,可使用不含有六價鉻之處理溶液藉表面 處理提供具有優異腐蝕抗性之金屬塗覆層。再者,鉻濃度 及液體溫度增加約2°/。,pH降低約0.2,及相對於製造商推薦 之標準鍍敷條件之過濾能力增加2.5倍或以上,因此可減少 雜質。 -24- 本纸張尺度適用中國國家標準(CNS) A4規格(210X 297公釐)(c) Bath temperature · 5 (TC (d) Plating bath pH: 3.4 (e) Cathode current density: 7.0 A / dm2 (f) Anode / cathode ratio of 1.5 to 1 (g) Rectifier: One with adjusted current (H) Filtration power. The entire bath solution passes through the filter twice per hour continuously. As a result, a black cell phone button with poor plating coverage and no roughness is obtained. The surface roughness is judged as follows: visual observation of adhering foreign objects, cracks, etc. from centimeters or less, and products with foreign objects with a size of 02 mm or more are judged to be incompatible.-^ The plating coverage is judged as follows Carry out: evaluate whether the plating is uniform and whether B is discolored, stained, etc. & Products with discoloration, stained, etc. are judged to be not: Industrial applicability-23- 554086 A7 B7 V. Description of the invention (21) ~ " ^ --- According to the first invention, even for a molded article having a thin portion obtained by high-speed molding, a removal-resistant plating layer can be obtained. Furthermore, even when a plating layer is formed on a smooth polished surface, the The plated layer can then be made into this smooth surface. The second invention can provide a good adhesion plating layer on the co-injected molded product by etching the surface of the molded product, and the elastic layer can avoid dissolution as much as possible. Therefore, the development of protrusions on the surface of the molded product can be avoided, thereby reducing defects. Product production. According to the second invention, a treatment solution containing no hexavalent chromium can be used to provide a metal coating layer with excellent corrosion resistance through surface treatment. Furthermore, the chromium concentration and liquid temperature increase by about 2 ° /., And the pH decreases It is about 0.2, and the filtering capacity is increased by 2.5 times or more compared to the standard plating conditions recommended by the manufacturer, so it can reduce impurities. -24- This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm)

Claims (1)

.造鍍敷模製品之方法’其中模製品具有藉樹脂高 、射出模製所得之薄部分之表面進行鍍敷 下列步驟: 匕祜 (a) 藉無電鍍敷於模製品表面形成金屬鍍敷層; (b) 藉電鍍在無電鍍敷層表面形成銅鍍敷層; (c) 藉電鍍在銅鍍敷層表面形成鎳層;及 (d) 藉電鍍在鎳層表面形成鉻或鉻合金層。 2. 如申請專利範圍第旧之方法,其中銅鍍敷係在下列條件 進行: •模製品浸於10至3(TC之含70至90克/升濃度之硫酸銅及 。Π0至2 10克/升濃度之硫酸之硫酸銅浴且陰極電流密度 為 1 至 4 A/dm2。 3. ^申請專利範圍第!項之方法,其中在模製品表面上設有 亮表面及粗糙表面。 ^ 種藉如申請專利範圍第1項之方法所製得之鍍敷模製 品。 、 如申請專利範圍第4項之錄敷模製品,其中模製品為行動 電話之操作鈕。 )·種製造鍍敷模製品之方法,其中模製品具有藉樹脂快 速共射出模製所得之薄部分之表面進行鍍敷,該方法包 括下列步驟: (a) 藉無電鍍敷於模製品表牵形成金屬鍍敷層; (b) 藉電鍍在無電鍍敷層表面形成銅鍍敷層; (c) 藉電鍍在銅鍍敫層表面形成鎳層;及The method of making plated molded products' where the molded product is plated with a thin part obtained by injection molding and the following steps are performed for plating: (a) forming a metal plating layer on the surface of the molded product by electroless plating (B) forming a copper plating layer on the surface of the electroless plating layer by electroplating; (c) forming a nickel layer on the surface of the copper plating layer by electroplating; and (d) forming a chromium or chromium alloy layer on the surface of the nickel layer by electroplating. 2. As the oldest method in the scope of patent application, copper plating is performed under the following conditions: • The molded product is immersed in 10 to 3 (TC containing 70 to 90 g / l of copper sulfate and Π0 to 2 10 g / L concentration of copper sulfate bath with sulfuric acid and cathodic current density of 1 to 4 A / dm2. 3. ^ The method of applying for the scope of the patent item !, wherein a bright surface and a rough surface are provided on the surface of the molded product. For example, the plated molded products produced by the method of applying for the scope of the patent item No. 1. For the plated molded products of the scope of the patent application No. 4, the molded product is the operation button of a mobile phone. A method in which the surface of a molded article having a thin portion obtained by rapid co-injection molding is subjected to plating, and the method includes the following steps: (a) forming a metal plating layer on the surface of the molded article by electroless plating; (b) ) Forming a copper plating layer on the surface of the electroless plating layer by electroplating; (c) forming a nickel layer on the surface of the copper plating layer by electroplating; and 本紙張尺度適财s國家料(_域织加彻公董) 554086 申請專利範圍 ⑷藉電鍍在鎳層表面形成鉻或鉻合金層。 =:=製.:之方法,其中在主要模製品表面至 品表面進二敷m層作為次要模製品所得之模製 於及炉妒夕 法包括藉由使模製品浸於鉻 =酸之混合物中而钱刻模製品表面之步驟 刻步驟係於下列條件下進行: 八 ⑷混合物溫度為65至69。〇; ㈨混合物中鉻酸濃度為37〇克/升至390克/升.及 ⑷混合物中硫酸濃度為190克/升至23〇克/升。 如申睛專利範圍第7項之方法’其在蝕刻步驟後又依 括洗滌步驟、觸媒步驟及加速器步驟,立中 =器步:包括將模製品浸於pH比觸媒 :=口接近中性之酸性溶液中,且使酸性溶液與 該模製品。 彳“隹貝被及收,及隨後洗 如申請專利範圍第8項之方苴 底側提供喷嘴之步驟,,喰:’”驟包括在水槽 泡吹向模製ί。亥Μ吹出微小空氣泡及將空 10.:=專利範圍第7項之方法,其中彈性層係由熱塑性 月女基甲酸酯彈性體所組成。 丨1.:種藉如申請專利範圍第7項之方法所製得之錄敷模 口口 ° — 12.::::利範圍第"項之鍵敷模製品,其中錢敷模製 為仃動電話之操作鈕。 7. 8. 包 酸 活蘇 9. 氣 聚 製 品 26 A4^(21〇x297^)This paper is suitable for national materials (_domain weaving and management) 554086 patent application scope ⑷ Chromium or chromium alloy layer is formed on the surface of nickel layer by electroplating. =: = Making method: The method in which two layers of m are applied on the surface of the main molded product to the surface of the molded product as a secondary molded product, and the molding method includes immersing the molded product in chromium = acid. The step of engraving the surface of the molded article in the mixture is carried out under the following conditions: The temperature of the hydrazone mixture is 65 to 69. ;; The chromic acid concentration in the rhenium mixture is from 37 g / L to 390 g / L. And the sulfuric acid concentration in the ⑷ mixture is from 190 g / L to 230 g / L. For example, the method of the seventh item in the patent scope of patent application, which includes a washing step, a catalyst step, and an accelerator step after the etching step. Lizhong = device step: including immersing the molded product in a pH ratio catalyst: = near the mouth Acidic solution, and the acidic solution and the molded product. (1) The step of “baking the quilt and collecting it, and then washing it as described in item 8 of the scope of patent application.” The step of providing a nozzle at the bottom side, “:” step includes blowing in a water tank to the mold. The method of blowing out tiny air bubbles and emptying the air 10.:= item 7 of the patent scope, wherein the elastic layer is composed of a thermoplastic melamine based formate elastomer.丨 1. A kind of recording die mouth made by the method of applying for the scope of patent application item 7 ° — 12.::::Key scope of the scope of application " Push the operation button of the phone. 7. 8. Acid-coated live perilla 9. Gas-polymerized products 26 A4 ^ (21〇x297 ^) 一種製造鍍敷模製品之方法, 製品表面係藉三價鉻鍍敷處理 鍍敷之步驟: ,其中猎共射出模製所得模 里,該方法包括在下列條件 ⑷鍍敷浴中三價鉻濃度為6至10克/升; (b)鍍敷浴中雜質總量為的卯瓜或以下; (C)浴溫為40至5〇t:; (d) 鍍敷浴pH為3.2至3.6 ; (e) 陰極電流密度為3至5A/dm2;及 (f) 陽極/陰極比例為1.5至2 : 1。 其中藉共射出模製所得模 ,該方法包括在下列條件 一種製造鍍敷模製品之方法,表 製品表面係藉三價鉻鍍敷處理, 鍍敷之步驟: (a) 鍍敷浴中三價鉻濃度為5至1〇克/升; (b) 鍍敷浴中雜質總量為go ppm或以下; (c) 浴溫為53至63°C ; (d) 錢敷浴pH為3.2至3.6 ; (e) 陰極電流密度為3至5 A/dm2 ;及 (f) 陽極/陰極比例為1.5至2 : 1。 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)A method for manufacturing a plated molded product. The surface of the product is subjected to a plating process by trivalent chromium plating: wherein the mold is obtained by injection molding. The method includes the following conditions: the concentration of trivalent chromium in the plating bath. 6 to 10 g / L; (b) total amount of impurities in the plating bath or below; (C) bath temperature of 40 to 50 t: (d) pH of the plating bath is 3.2 to 3.6; (e) the cathode current density is 3 to 5 A / dm2; and (f) the anode / cathode ratio is 1.5 to 2: 1. Among them, the obtained mold is co-injected. The method includes a method of manufacturing a plated molded product under the following conditions. The surface of the surface product is processed by trivalent chromium plating, and the steps of plating are: (a) trivalent in a plating bath The chromium concentration is 5 to 10 g / L; (b) the total amount of impurities in the plating bath is go ppm or less; (c) the bath temperature is 53 to 63 ° C; (d) the coin bath pH is 3.2 to 3.6 (e) the cathode current density is 3 to 5 A / dm2; and (f) the anode / cathode ratio is 1.5 to 2: 1. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)
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CN100360716C (en) 2008-01-09
WO2002064862A2 (en) 2002-08-22
MY148983A (en) 2013-06-28
CN1527892A (en) 2004-09-08
WO2002064862A3 (en) 2003-08-28
MY142899A (en) 2011-01-31

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