WO2008004558A1

WO2008004558A1 - Process for producing ornamental plated article with use of conversion of resin to conductive one by sputtering, and hanging jig for fixing of resin molding

Info

Publication number: WO2008004558A1
Application number: PCT/JP2007/063324
Authority: WO
Inventors: Kunihiro Kakihara; Yoshinori Noda; Takashi Ouro
Original assignee: Kakihara Kogyo Co., Ltd.
Priority date: 2006-07-05
Filing date: 2007-07-03
Publication date: 2008-01-10
Also published as: WO2008004315A1

Abstract

Without the use of conventional chemicals, such as chromic acid, not only resin surface roughening but also conductivity imparting is attained for resin molding by a dry process. Accordingly, deterioration of the resin surface of resin molding by such chemicals is prevented. Further, as such chemicals imposing heavy environmental load are not used, reduction of environmental load substances can be attained. Still further, surface layer detachment from resin plated articles is prevented, thereby ensuring the safety thereof. There is provided a process including the resin surface cleaning/activation step (S1) of performing plasma treatment of the surface of resin molding to thereby attain cleaning and surface reforming activation; the metal thin film forming step (S2) of forming a metal thin film on the surface of the resin molding by sputtering; the conductivity imparting film forming step (S4) of forming by sputtering a conductivity imparting film of nickel, copper, etc. on the metal thin film formed on the resin molding; and finally the electroplating step of electroplating the resin molding.

Description

Specification

Manufacturing method of decorative garnish using resin conductive film by sputtering and hanging jig for fixing resin molded product

Technical field

TECHNICAL FIELD [0001] The present invention relates to a resin plating technique for applying metal plating to a resin molded product, and in particular, before the resin plating until the surface adjustment process of the resin resin plating, the etching process power, and the conductive metal treatment process. Regarding the treatment, the present invention relates to a method for producing a decorative adhesive product using a resin conductive material by sputtering carried out by sputtering treatment without using hexavalent chromic acid and a hanging jig for fixing the resin molded product.

Background art

[0002] As shown in FIG. 20, a conventional general resin plating film-forming method includes: an etching process for roughening the surface of the resin molded article to be plated, an etching neutralization process, Direct plating pre-treatment process such as catalyst application process, conductive process (or electroless plating), and metal plating process, and pre-treated resin moldings with bright copper plating, semi-bright nickel plating, gloss In this method, each plating process is performed in the order of nickel plating and MP nickel plating (microporous nickel plating), and finally chrome plating is applied. Thus, since the resin molded product is non-conductive, a conductive step (direct plating pretreatment or electroless plating) is required to impart conductivity to the resin as a pretreatment for electroplating.

In addition, since the shrinkage rate of the raw material differs between the conventional resin molding for coating and the resin molding for resin plating, it is necessary to prepare two types: a coating mold and a resin plating mold There was.

[0003] As shown in Fig. 21, the conductive process (or electroless plating) of a resin molded product that uses a general wet method for resin plating is performed with a high concentration of chromic acid (hexavalent chromium) and sulfuric acid. Etching treatment using mixed acid, washing with water, neutralizing with chromic acid, washing with water, applying a catalyst such as PdZSn, washing with water, activating the water and washing with water. To do.

[0004] As a pretreatment technique for plating when electroless plating is applied to a resin molded product, for example, as disclosed in Japanese Patent Application Laid-Open No. 5-132785, “Electroless plating pretreatment method”, Fiber The surface of the insulating material contains chromic anhydride and sulfuric acid in the etching process of the insulating material, which is performed as a pretreatment when the surface of the insulating material made of polyimide resin is subjected to electroless plating. There has been proposed an electroless plating pretreatment method in which a two-stage etching process is performed in which etching is performed using a solution and then etching is performed using a solution containing hydrazine.

Patent Document 1: Japanese Patent Laid-Open No. 5-132785

[0005] The resin etching process that roughens the resin surface, which is the basis of this resin plating, still uses a mixed acid of high-concentration chromic acid (hexavalent chromium) and sulfuric acid. This etching process using chromic acid has the potential to adversely affect the human body even during work in the process that requires only waste liquid treatment. At present, various technologies have been proposed to eliminate the etching process using chromic acid. However, a pretreatment has been proposed that satisfies the stringent adhesion standards that are the basic performance of resin plating, such as automotive parts standards! I did not hesitate.

[0006] For example, a PA resin (polyamide resin, 6-nylon) resin molded product can be surface-roughened using a hydrochloric acid-based etching solution. POM resin (polyacetal) can be etched using hydrochloric acid Z sulfuric acid mixed acid or phosphoric acid Z sulfuric acid mixed acid. LC P resin (liquid crystal polymer) can be etched using caustic potash etching. As described above, some resin materials can be etched without using a chromic acid-based etching solution.

[0007] A resin molded product of a resin that is relatively weak in acidity, such as PPE resin (polyphenyl ether), can be surface-roughened using a permanganic acid-based etching solution.

[0008] A resin molded product of a general-purpose resin such as ABS resin (acrylonitrile Z butadiene Z styrene resin) can be etched using a manganic acid-based etchant. Etching can be performed with a weak etchant such as permanganate etching by adding a solvent pre-etching process.

[0009] Further, as a conductive treatment technology for the resin base material, for example, as disclosed in Japanese Patent Application Laid-Open No. 6-212405 of "Patent Document 2," a method of attaching copper on a polyphenylene sulfide support, Polyphenylene sulfide support is etched with RF argon plasma under vacuum . Sputter a layer of titanium on the etched surface without breaking the vacuum, and sputter the first copper layer on the surface sputtered with titanium, and after the sputtering procedure, apply the second copper layer to the support as desired. A method of electroplating the thickness has been proposed.

Patent Document 2: JP-A-6-212405

[0010] This method of Patent Document 2 provides a peel strength of 4.5 to 5.5 pounds Z inches. This method is said to be useful for making products for EMI shielding and printed circuit boards.

[0011] Further, as a technique for performing a sputtering treatment on a resin molded product, for example, Japanese Patent Application Laid-Open No. 9-511792 of "Patent Document 3" "Apparatus for coating a substrate with material vapor in a negative pressure or vacuum" A material vapor source and an ionic device comprising a cold anode and a cold cathode to generate a plasma between the anode and cathode and ionize the material vapor in an arc discharge assisted by the material vapor In this case, the material vapor source and the anode and cathode of the ionization apparatus are electrically separated from each other in a negative pressure or vacuum! A coating device has been proposed.

Patent Document 3: Japanese Patent Publication No. 9 511792

[0012] As shown in Fig. 22, the conventional sputtering apparatus causes atoms to be ejected from the metal target 52 by collision of argon or the like excited by plasma discharge in a vacuum chamber 51, and a resin molded product ( W). A metal target 52 is formed on the resin molded product W by this sputtering treatment. In this sputtering apparatus, in the case of a resin molded product W having a planar shape, or a resin molded product W in which only one surface of the resin is formed with unevenness, the resin molded product W is placed in the apparatus. It was enough to fix it. However, a uniform film could not be formed on the surface of the resin molded product W having an uneven surface.

Disclosure of the invention

Problems to be solved by the invention

[0013] However, in the wet etching process described above, conductive resin is used using various chemicals such as a mixed acid of high concentration chromic acid and sulfuric acid. In some cases, chemicals may remain on the surface of the resin molded product. As a result, the surface layer thin film of the resin molded product peeled off on some of the products plated with resin, and floated together with the plating film thereon, and the plating film sometimes cracked. The lift film S is a metal film with a thickness of about 30 to 50 m. When using the resin-plated product, problems such as the user's finger being cut sometimes occur.

[0014] In addition, depending on the resin material of the resin molded product, there are cases where the conductive treatment by the wet method as described above cannot be performed or is difficult. For example, PCZABS resin is mainly used for plating automotive door handles. PC for the same type of resin

PCZ polyester-based materials such as ZPBT and PCZPET are used. This is because PCZ polyester-based materials are more suitable as a resin material for door handles, but it is not possible to make resin-handled door handles that can meet automotive specifications that are difficult to plate.

[0015] Since the etching process uses a mixed acid of high concentration chromic acid and sulfuric acid, the handling environment is bad and handling is also dangerous. The work environment was bad because formalin and ammonia, which are carcinogenic substances, were used in the electroless plating process. In addition, it requires a complexing agent, making it difficult to treat wastewater. Since a water washing step is required after each treatment step, the amount of water used has problems such as winter.

[0016] On the other hand, a film-forming method in which a metal is struck into the resin with acceleration, such as magnetron sputtering, has been devised. However, the surface of the resin may be struck with argon and the processing surface temperature may increase. In addition, low melting point materials such as ABS resin have the problem of being easily deformed by heat.

[0017] The film formation method using the glow discharge plasma method cannot sufficiently accelerate the metal with a low ionization rate! /, So that the peeling adhesion strength of the resin plating standard cannot be obtained. Was.

[0018] In a sputtering apparatus for depositing a target metal on a resin molded product by sputtering shown in Patent Document 2 and Patent Document 3, a planar resin molded product, such as a substrate, or an uneven shape. However, it was a technique for forming a film on only one side of the film. Therefore, in the case of a resin molded product, it was sufficient to fix the resin molded product in the apparatus. Shi However, there has been a problem that it is impossible to form a uniform film on the surface of the resin molded product w having an uneven surface.

[0019] Further, in the conventional sputtering apparatus, the suspension jig is rotated with respect to the resin molded product fixed to the hanging jig, so that the outer peripheral side of the resin molded product can approach the metal target. . On the other hand, the inner peripheral side of the resin molded product does not approach the metal target. Therefore, a thick metal film is always formed on the outer peripheral side of the resin molded product, and on the contrary, a thin metal film is formed on the inner peripheral side of the resin molded product. The problem was.

[0020] In the conventional chromium sputtering method for decorative resin moldings, an undercoat is applied on the base plastic, and a very thin film of chromium sputter is formed on the order of 500-1000A. It has a structure in which a certain top coat is applied. For this reason, the durability of the film is poor, and wear due to car wash brushes, chipping due to gravel, wind and rain, and strong!

[0021] Furthermore, even if a hard coating or other wear-resistant coating is overcoated on the resin molded product to improve its performance, the durability of the metal film by the wet electroplating method can be reduced. In general, wet resin plating is used for the plating of automobile parts.

In the conventional chromium sputtering method for decorative use, it was necessary to install a clean room for painting with a large investment, with a great deal of concern about yield drop such as undercoat and top coat 'garbage caused by hard coat painting'.

[0022] The present invention has been devised in order to solve the problem. That is, the object of the present invention is to provide a resin surface roughening to a resin molded product by a processing method that does not use chemicals such as a mixed acid of chromic acid and sulfuric acid in the conventional etching process and conductive process, that is, a dry method. By adding conductivity and imparting conductivity, the surface layer of the resin does not deteriorate due to such chemicals, and it is possible to prevent cracking due to peeling between the oils and prevent cracking, and the safety of the resin-plated product Is also to provide a method for producing a decorative garment that can be secured.

[0023] Another object of the present invention is to maintain the durability-abrasion resistance of the metal film of the resin plating by the wet electroplating method, to invest a large amount of equipment such as a clean room for painting, This is to eliminate the need for a painting process that has a high yield reduction risk.

The deposited film of the present invention is a metal-plated film formed by sputtering and wet electric plating in a vacuum chamber, and the laminated films are all metal, so that they have wear resistance that can withstand automotive applications. Durability and the like can be imparted. In addition, since there is no painting process, it is possible to reduce trash defects. Accordingly, it is an object of the present invention to provide a method for manufacturing a decorative article that can simultaneously eliminate the disadvantages of a conventional wet plating method and a decorative chromium sputtering method.

[0024] In addition, the object of the present invention is to use a sputtering apparatus improved so as to suppress deformation of the resin molded product and to perform sputtering at a high rate at a low temperature. A method for producing a decorative plated product that makes it possible to perform the pretreatment process of various types of resin moldings by enabling the plating of strong resin materials that are difficult to fit by the wet method. There is also to provide.

[0025] Furthermore, an object of the present invention is to rotate the entire surface of the resin molded product so as to face the metal target in the vacuum chamber, so that the surface of the resin molded product having unevenness can be obtained without overheating. An object of the present invention is to provide a hanging jig for fixing a resin molded product capable of uniformly forming a metal film.

Means for solving the problem

[0026] According to the production method of the present invention, the surface of the resin molded article (W) is cleaned by plasma treatment in a vacuum atmosphere and activated by surface modification in a sputtering apparatus. Step (S1) and then a metal thin film forming step for forming a metal on the surface of the resin-molded product (W) in order to ensure adhesion to the resin by sputtering in the sputtering apparatus. (S2), and subsequently, a conductive film forming step of forming a conductive film by sputtering on the metal thin film formed on the resin molded product (W) by the metal thin film forming step (S2) ( S4) and an electro-plating process for electrically bonding the resin-molded product (W) after the conductive film formation step (S4), and an uneven surface of the resin-molded product (W). When the metal is uniformly deposited on the surface, the resin molded product (W) must be rotated in the sputtering apparatus. Sputtering process on the surface, method of manufacturing the decorative plated products using 榭脂 conductive by sputtering, characterized in that there is provided. [0027] For example, in a sputtering apparatus, cleaning and surface modification activation are performed by plasma treatment while rotating the resin molded product (W) attached to the hanging jig (11) in a vacuum atmosphere so as to rotate. Next, in the same sputtering process, the resin molded product (W) attached to the hanging jig (11) is placed on the metal target (52). A metal thin film forming step (S2) for forming a metal film to ensure adhesion to the resin by sputtering while rotating and revolving forward, followed by the formation of the metal thin film. The resin molded product (W) on which a metal thin film is formed in the step (S2) is moved so as to revolve before another metal target (52), and a conductive film is formed by sputtering while rotating there. A conductive film forming step (S4), and forming the conductive film An electric plated step of step (S4) 榭脂 molded article has finished (W) to electrically plated, a method of manufacturing a decorative plated products made of.

Following the metal thin film formation step (S2), a film surface activation treatment step (S3) is performed in which the metal thin film formed on the resin molded product (W) is activated by surface modification treatment by plasma treatment. It is preferable to further provide.

[0028] In the vacuum chamber of the sputtering apparatus, the resin molded product (W) is suspended from the hanging jig (11), and the hanging jig (11) is rotated around its rotation axis (L). While sputtering is preferred.

In the vacuum chamber of the sputtering apparatus, the resin molded product (W) is suspended from a plurality of hanging jigs (11), and each hanging jig (11) is rotated around its rotation axis (L). It is preferable to perform sputtering treatment by moving a plurality of hanging jigs (11) so that their rotational axes follow a circular trajectory and revolve.

[0029] Preferably, the resin surface cleaning 'activation step (S1) is plasma-treated in a vacuum atmosphere with a small amount of air remaining on the surface of the resin molded product (W). . In the resin surface cleaning and activation process (S1), a surface modification treatment by plasma treatment may be performed by injecting argon and a trace amount of oxygen into the surface of the resin molding (W) in a vacuum atmosphere. preferable.

[0030] For example, in the metal thin film forming step (S2), in a vacuum atmosphere, the surface of the resin molded product (W) has a strong single metal bond or strong bond strength with oxygen. Strong metal An alloy containing is formed by sputtering.

For example, in the metal thin film forming step (S2), a metal ionized to 0.01 to 50% can be formed on the surface of the resin molded product (W) in a vacuum atmosphere. In the metal thin film forming step (S2), the film is formed so that the film thickness is about 0.01 to 2.0 m.

In the conductive film formation step (S4), nickel or copper can be formed.

In the conductive film forming step (S4), it is preferable to form the film so that the film thickness is about 0.1 to 5.0 m.

[0032] The electroplating process is performed in the order of bright copper sulfate plating (S6), semi-bright nickel plating (S7), Mitsuzawa-Neckel plating (S8), MP nickel plating (microporous nickel plating) (S9). Each plating process can be performed with, and finally the plating process can be completed by applying a decorative finish plating (S10).

For example, in the decorative finish plating (S10), a plating treatment such as trivalent chromium plating, chromium plating, tin Z nickel alloy plating, ruthenium or gold plating is performed.

[0033] According to the hanging jig of the present invention, the sputtering process is performed in which atoms are ejected from the metal target (52) by collision of argon or the like excited by plasma discharge, and a film is formed on the resin molded product (W). A hanging jig (11) for fixing the resin molded product (W) when the hanging rod ( ₁₂ ) is rotated in the vacuum chamber, and the hanging rod ( ₁₂ ) is attached to the hanging jig (12). A hooking tool (13) for detachably fixing the resin molded article (W) attached thereto and a force, and sputtering treatment while rotating the suspension rod (12) in the vacuum chamber. There is provided a hanging jig configured to fix the resin molded product during the sputtering process, which is characterized in that it is configured to manage.

[0034] In addition, during the sputtering process in which atoms are ejected from the metal target (52) by collision of argon or the like excited by plasma discharge to form a film on the resin molded article (W), the resin molded article is used. A hanging jig (11) for fixing (W), and in a vacuum chamber, between two rotating plates (14) arranged vertically and between the rotating plates (14). A plurality of hanging rods (12) that are detachably leaned at intervals in the circumferential direction, and a hook jig that detachably fixes the resin molded product (W) attached to each hanging rod (12) (13) or In the vacuum chamber, the upper and lower rotating plates (14) can be rotated, and at the same time, the hanging rods (12) can be sputtered while being sputtered.

It is preferable that a partition wall (15) is further provided between the adjacent hanging rods (12) which are erected between the rotating plates (14).

The invention's effect

[0035] As described above, in the production method of the present invention, the surface of the resin molded product (W) is cleaned and treated by plasma treatment in the sputtering apparatus in the resin surface cleaning 'active process (S1). Activated surface modification, and then in the metal thin film deposition step (S2), also in the sputtering apparatus, the strength of the bond strength with oxygen, single metal or the strength of bond strength with oxygen, including the metal An alloy is formed, and then a conductive film is formed by sputtering a predetermined metal on the metal thin film formed on the resin molded product (W) in the conductive film formation step (S4). By doing so, it is possible to impart conductivity by forming a film on the resin molded article (W) by a dry method. Therefore, it is possible to form a film on a new special material that was impossible with the conventional wet method at a low temperature. Can be prevented

In the sputtering apparatus, a metal film can be uniformly formed on the surface of the resin molded article (W) having an uneven surface by performing sputtering treatment on the surface while rotating it.

[0036] Furthermore, since a high addition / high function film (transparent protective film, high hardness film, etc.) can be applied to the outermost layer after electric plating or after dry plating, plating using a dry method is possible. Application as surface treatment technology other than pretreatment technology is possible.

By adding the film surface activation treatment process (S3) after the metal thin film deposition process (S2), which is processed for the purpose of obtaining adhesion to the resin, the conductive film deposition process (S4) The adhesion of the conductive film to be processed is strengthened.

After the conductive film formation step (S4), the final resin-plated product can be produced simply by applying the same electrical plating as in normal resin-plating.

[0037] In addition, the pretreatment of the resin plating, that is, the conductive treatment of the resin molded product (W), Wet process power using hexavalent chrome As a result of changing to the dry process, it is not a wet conductive process that uses chemicals that have a large environmental impact in the production of resin plating. Can do. As before, waste liquid treatment such as hexavalent chromium is unnecessary or drastically reduced.

[0038] In the hanging jig of the present invention, the resin molded product (W) is fixed to the hanging jig (11) in the vacuum chamber, and sputtering is performed while rotating the hanging jig (11). By processing, even the uneven shaped resin molded product (W) maintains the same distance as the metal target (52) force, so of course both the front and back sides of the resin molded product (W) In other words, the metal can be uniformly formed on the entire surface of the molded resin article (W) having an uneven surface.

[0039] In addition, in the vacuum chamber, the upper and lower rotating plates (14) are rotated, and at the same time, the individual suspension rods (12) are rotated while performing the sputtering treatment to obtain the resin molded product (W). By maintaining an equal distance from the metal of the metal target (52), the resin molded product (W) can only be uniformly formed on the entire surface of the resin molded product (W) with an uneven surface. The metal target (52) can also be cooled away from the metal force.

Brief Description of Drawings

[0040] FIG. 1 is a process diagram showing a method for producing a decorative garnish using a resin conductive material obtained by sputtering in Example 1.

[FIG. 2] A bright nickel plating method is shown, (a) is a process diagram of a resin conductive treatment, and (b) is a wet electroplating process diagram.

FIG. 3 is a perspective view showing an example of a hanging rod of a hanging jig for fixing a resin molded product during a sputtering process.

FIG. 4 is an explanatory plan sectional view showing a positional relationship between a hanging rod of a hanging jig and a metal target.

FIG. 5 is a perspective view showing a hanging jig placed in a vacuum chamber.

FIG. 6 is a cross-sectional view of a resin molded product that has been subjected to a resin conductive treatment by sputtering in Example 1.

FIG. 7 is a cross-sectional view of a plating film attached by the method for producing a decorative garment using the resin conductive material obtained by sputtering in Example 1. FIG. 8 is a table showing “Table 1 Plate Adhesion Measurement Results”.

FIG. 9 is a table showing “Table 2 Sputtering Experiment Conditions”.

[Fig. 10] This is a table showing “Table 3 Result of actual product adhesion measurement (Ni—Cr) No 1”.

[Fig. 11] This is a table showing “Table 4 Actual Product Adhesion Measurement Results (Ni—Cr) No2”.

FIG. 12 is a table showing “Table 5 Result of actual product adhesion measurement (Cr)”.

FIG. 13 is a SEM observation photograph.

[Fig. 14] AFM observation photograph.

FIG. 15 is a table showing “Table 21 Experimental results of ion irradiation treatment”.

[FIG. 16] This is a table showing “Table 22-1 Experimental results 1Z2 with M target”.

FIG. 17 is a table showing “Table 22-2 Experimental result 2Z2 with M target”.

FIG. 18 is a table showing “Table 23 Experimental Results with Cr Targets”.

FIG. 19 is a table showing “Table 24 Experimental Results with Cu Target”.

FIG. 20 is a process diagram showing a conventional bright nickel plating method.

FIG. 21 is a process diagram showing a conventional method for conducting a resin.

FIG. 22 is a conceptual diagram showing a sputtering apparatus.

Explanation of symbols

S1 Wax surface cleaning and activation process

S2 Metal thin film process

S3 Deposition surface activation process

S4 Conductive film formation process

S5 Activation process

S6 Bright copper sulfate plating

S7 Semi-bright nickel plating

S8 Bright nickel plating

S9 MP nickel plating (microporous nickel plating)

S10 with decorative finish

11 Hanging jig

12 Hanging rod 13 Hook

14 Rotating plate

15 Bulkhead

52 Metal target

W

BEST MODE FOR CARRYING OUT THE INVENTION

[0042] The method for producing a decorative garnish using the resin conductive material by sputtering according to the present invention is a pretreatment method in which the wet conductive method of the resin plating is changed to the dry conductive method. After the electrification, wet electroplating is performed as usual.

Example 1

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a process diagram showing a method for producing a decorative garment using the resin conductive material by sputtering in Example 1. FIG. 2 shows an example of the bright nickel plating method. (A) is a process diagram of a resin conductive treatment, and (b) is a wet electroplating process diagram.

In the manufacturing method of the decorative product using the resin conductive material by sputtering in Example 1 of the present invention, the resin molded product W is set in a jig, and the resin surface cleaning 'active process step S1 is performed. In the sputtering apparatus, the surface of the resin molded product W is cleaned and activated by plasma treatment in a vacuum atmosphere. Next, in the metal thin film forming step S2, the surface of the resin molded article W is also cleaned in the sputtering apparatus. A single layer of a metal having a strong binding force to oxygen or an alloy containing a metal having a strong binding force to oxygen is formed on the surface of the molded fat W by sputtering. In the next film surface activation treatment step S3, the metal thin film formed on the resin molded product W is activated by surface modification treatment by plasma treatment, and finally in the conductive film formation step S4, the resin molded product is activated. Sputtering a predetermined metal on a metal thin film deposited on W This is a method of forming a conductive film.

In this manner, the surface modification of the resin molded product W and metal film formation are performed by a dry-type magnetron sputtering method or the like to impart conductivity. The resin molded product W that has been subjected to the resin conductive treatment also removes the jig force, and is subjected to an electrical plating process in steps S5 to S10 as will be described later. [0044] A sputtering apparatus used in magnetron sputtering is an apparatus that deposits atoms on a metal target W by depositing atoms from a metal target by collision of argon or the like excited by plasma discharge in a vacuum atmosphere. . By this sputtering treatment, a metal film of the target is formed on the resin molded product W, or the resin molded product W is irradiated with plasma.

[0045] The resin molded product W, which is a decorative garment according to the present invention, is a so-called "appearance product" such as a resin glazed part for automobiles, a housing-related mortar plated part such as a chassis or faucet part. In the conventional manufacturing method for decorative products, the plating film floats up due to the separation of the resin-molded product W between the oil and grease, which may cause personal injury such as cutting hands. The finishing power of the appearance is important. Incidentally, if it is a “functional product” such as a printed circuit board, there is no need to apply such decoration.

[0046] In榭脂surface cleaning 'activity spoon step S1, the degree of vacuum, for example 10 ^{_ 1} (= 10 - 1 power) Pa extent plasma treatment榭脂surface in a vacuum atmosphere such as a vacuum chamber one Activates cleaning and surface modification. For example, argon plasma treatment is performed with a small amount of air remaining. Alternatively, plasma treatment is performed by injecting argon and trace oxygen.

This resin surface cleaning 'active step S1 can use a plasma treatment method by an arc plasma deposition method in addition to the magnetron' sputtering method.

[0047] The metal thin film forming step S2 is a step for securing the adhesion between the resin and the plating film by the magnetron-sutter method in a vacuum atmosphere such as a vacuum chamber. Vacuum, for example 10 ^_2 ~ ³ (10 - 2-3 square) pulled about Pa, chromium ionized to 0.01 to 50% by the plasma, molybdenum, tungsten, titanium, zirconium, aluminum - © beam, indium A single metal of a metal having a strong binding force with oxygen, such as nickel, noradium (an oxygen-rich metal) or an alloy containing these metals is formed on the resin molded product W.

[0048] In the metal thin film forming step S2, it is preferable to use a nickel chromium alloy (alloy ratio = 50: 50) or metal chromium. The metal thin film to ensure the adhesion between the resin and the plating film is not only the good adhesion with the resin, but also the adhesion with the conductive film to smoothly handle the subsequent electric mating. It is necessary to use a metal with good properties. In the metal thin film forming step S2, it is preferable to use chromium alone, a chromium nickel alloy, aluminum, a copper alloy, or the like. The alloy ratio is not specified. Adhesion depending on the type of resin and molding conditions Select a good deposition metal material. For example, metallic copper can be used. There is no limit to the film thickness to ensure plating adhesion, but considering the plating stress, etc., 0.05 m to 0.5 μm) is appropriate.

[0049] It is preferable that the resin molded product W after the metal thin film forming step S2 is further subjected to the active surface treatment in the film formation surface active surface treatment step S3. For example, in a resin molded product W, 0.01 π! The metal thin film formed at ~ 2.0 μm is activated by surface modification treatment with argon plasma treatment. This increases the adhesion between the resin molded product W and the metal thin film.

[0050] Conductive film forming step S4 is a step of forming a conductive film on the resin molded product W for electroplating. A conductive film for electroplating is a conductive film for electroplating treatment, but it provides adhesion between the plating film formed by the dry plating method and the film formed by the electroplating method. It must be a metal film that can withstand acid treatment, soft etching with a dilute oxidizing agent, or electrolytic activation treatment. Therefore, the appropriate film thickness by the conductive film forming step S4 is, for example, 0. force and 2. O / zm in the case of metallic copper. This conductive film formation process S4 film formation is a pre-process (activation process) of wet electroplating (electrocopper plating and electronickel plating), which is a subsequent process that has good adhesion to the underlying metal. A metal other than metallic copper can be deposited if S5 is simple and has high adhesion.

FIG. 3 is a perspective view showing an example of a hanging jig for fixing the resin molded product W during the sputtering process. FIG. 4 is an explanatory plan sectional view showing the positional relationship between the hanging rod of the hanging jig and the metal target.

The hanging jig 11 for fixing the resin molded product during the sputtering process of the present invention includes a hanging rod 12 provided to rotate in a vacuum chamber (not shown), and the hanging jig 12. A hook 13 for fixing the resin molded product W is attached to the rod 12. In the hanging jig 11 configured as described above, the resin molded product W is attached to each hook 13. In the illustrated example, the resin molded product W indicates a door handle of an automobile. This door handle is only an example, and a resin molded product W having an uneven shape is suitable for the hanging jig 11 of the present invention.

[0052] A resin molded product W is attached, and the hanging jig 11 is placed in a vacuum chamber of a sputtering apparatus, and a metal target is formed by collision of argon or the like excited by plasma discharge. This jig is used when atoms are ejected from the base 52 to form a film on the resin molded product (W). In particular, in Example 1, by performing sputtering while rotating the hanging jig 11 in the vacuum chamber, a metal film can be uniformly formed on the entire surface of the concavo-convex shaped resin molded product W. can do.

FIG. 5 is a perspective view showing a hanging jig placed in the vacuum chamber.

The hanging jig 11 is used in a vacuum chamber that is detachably stood between two rotating plates 14 arranged in the vertical direction and the vertical rotating plate 14 with an interval in the circumferential direction. It is like that. A partition wall 15 is provided between the hanging jigs 11 between the upper and lower rotating plates 14. This partition wall 15 is for preventing the metal sputtered from the metal target 52 from being deposited on another resin molded product W adjacent to the intended resin molded product W.

In the hanging jig 11, the sputtering process can be performed while rotating the upper and lower rotating plates 14 and simultaneously rotating the individual hanging jigs 11 in the vacuum chamber. In other words, since each of the resin molded products W revolves while rotating, even if the resin molded product W has an uneven shape, it can have an uneven surface by maintaining an equal distance from the metal target 52. A film can be uniformly formed on the surface of the fat molded product W. Further, the resin molded product W can be cooled away from the metal target 52.

[0055] In the sputtering apparatus having such a structure, in the resin surface cleaning 'activation process S1, the resin molded product w attached to the hanging jig 11 in a vacuum atmosphere is rotated so as to rotate. However, cleaning and surface modification activities were performed by plasma treatment, and in the metal thin film forming step S2, the resin molded product W attached to the hook 12 was moved so as to revolve in front of the metal target 52 and rotated there. However, the adhesion of the metal to the resin is ensured by sputtering. Subsequently, in the conductive film forming step S4, the resin molded product W formed with the metal thin film in the metal thin film forming step S2 is replaced with another metal. The conductive film is moved to revolve before the target 52 and rotated there, and a conductive film is formed by sputtering to complete the resin conductive process.

[0056] In this way, the resin molded product finished with the conductive surface treatment after the dry surface finishing after the resin surface cleaning 'active process S1, the metal thin film forming process S2, and the conductive film forming process S4. The vacuum Take out the Yanbar force, replace it with a jig for electric fitting, and finish it with the usual electric fitting process.

[0057] In wet electroplating, as shown in Fig. 2 (b), a molded resin W, which has been subjected to a resin conductive treatment by magnetron sputtering, is activated in step S5. I'll do it. This activation process S5 is a process for ensuring close contact with the electric plating. For example, when copper was used as the final conductive metal for dry plating, it was performed in a soft etching process that was immersed in a 20 gZL sodium persulfate solution for 30 seconds. In addition, there are various methods for this activation process S5 depending on the type of conductive metal used for dry plating. The method is not limited as long as the adhesion between the dry plating film and the electroplating film can be secured.

[0058] Electric plating processes S6 to S10 can be applied to normal plating such as bright copper sulfate plating or metal plating. For example, as shown in the figure, each plating process is performed in the order of bright copper sulfate plating S6, semi-bright nickel plating S7, bright nickel plating S8, MP nickel plating (microporous nickel plating) S9.

Finally, apply plating finish S10 with trivalent chromium plating, tin Z nickel alloy plating, ruthenium or gold plating, and finish the plating process. Of course, the conventional chromium plating of hexavalent chromium can be used.

This electric plating process S6 to S10 is an example, and it is a matter of course that other metals can be plated.

FIG. 6 is a cross-sectional view of a resin molded article that has been subjected to a resin conductive treatment by sputtering in Example 1. FIG. 7 is a cross-sectional view of the plating film attached by the method for manufacturing a decorative adhesive using the resin conductive material by sputtering in Example 1.

Bright copper sulfate plating 30 m, semi-bright nickel plating 10 m, bright nickel plating 10 μm, microporous nickel plating 1.3 m, and chromium plating 0.35 μm Conducted functional tests such as tests and thermal cycle tests to evaluate plated products.

[0060] An experiment relating to the adhesion of the product plated by the method for producing a decorative swaged product using the resin conductive material by sputtering according to Example 1 of the present invention will be described. Fig. 8 is a table showing "Table 1 Plate adhesion measurement results". Fig. 9 shows `` Table 2. It is a table | surface which shows a matter. Figure 10 is a table showing “Table 3 Actual Product Adhesion Measurement Results (Ni—Cr) No 1”. Fig. 11 is a table showing "Table 4 Actual Product Adhesion Measurement Results (Ni-Cr) No2". Figure 12 is a table showing “Table 5 Result of actual product adhesion measurement (Cr)”.

(1) Preliminary test (grease plate)

Using a resin plate, we examined roughly the adhesion strength by material, whether there was an effect of oxygen injection on the surface cleaning of the resin before film formation, the difference depending on the resin material, the influence of inorganic filler, etc. The results are shown in “Table 1 Plate adhesion measurement results” in FIG. As shown in Table 1, the adhesion was improved by the oxygen gas injection during the surface cleaning of the resin. However, the effect of oxygen gas injection was strong for the ABS resin plate. The ABS resin plate test was conducted using a three-stage plate (gate = 3mmZ2mmZlmm = bottom) with different resin thickness. The thicker the film thickness, the more closely the shape and molding conditions were, and it was predicted that the adhesion would change. In terms of materials, the adhesion strength of nylon-based and ABS-based resins was high, and it proved powerful.

[0061] (2) Test results with actual molded products

The test conditions are shown in “Table 2 Sputtering Experiment Conditions” in FIG. Two types of metallurgy metal for plating adhesion were tested: nickel 'chromium alloy (alloy ratio = 50:50) and chromium (99.9%). The conductive film used metal copper (99.9%) as a target.

[0062] (3) Actual product adhesion measurement results

Figures 10 to 12 show “Table 3 Actual product adhesion measurement results (Ni—Cr) Nol” and “Table 4 Actual product adhesion measurement results (Ni—Cr) No2”. Actual product adhesion measurement results (Cr) ”show the results for chromium.

It was found that resin plating with high adhesion could be made under the conditions of experimental condition 4, experimental condition 8, and experimental condition 10 shown in “Table 2 Sputtering experimental conditions”. In particular, PAZABS resin showed a high adhesion value of max 4.75 kgfZcm = about 47 NZcm. Other materials can be mass-produced by selecting appropriate conditions.

[0063] (4) Thermal shock test results

PCZABS resin plating prototype (product of NiZCr experimental condition 10) and PA / ABS resin plating prototype (same condition) with 30 ° C / 0.5Hr → 80 ° C / 0.5Hr as one cycle, 120 A cycle thermal shock test was conducted. Therefore, it has been proved that the use of the method of the present invention makes it possible to mass-produce safe resin-plated parts.

[0064] The method for producing a decorative messenger product using a resin conductive material by sputtering according to the present invention uses a dry stencil method of sputtering for pretreatment of the resin plating, so that the conventional chromic acid method is used. Unlike the conductive wrinkle treatment method, various types of resin can be targeted. For example, AB S resin (acrylonitrile / butadiene / styrene), PCZABS resin (polycarbonate Z acrylonitrile / butadiene / styrene), PC / PET resin (polycarbonate / polyethylene terephthalate), PCZPBT resin (polycarbonate Z polybutylene terephthalate) , LCP resin (liquid crystal polymer), PA resin (polyamide), PA / ABS (polyamide Z atari mouth-tolyl / butadiene / styrene), PPE resin (polyphenylene ether), PP resin (polypropylene), PPS resin (polyphenylene sulfide), SPS resin (crystalline polystyrene), PS resin (polystyrene), MMA resin (methyl methacrylate), epoxy resin, urethane resin, PET resin (polyethylene terephthalate) , PBT resin (polybutylene terephthalate), PC resin (polycarbonate), etc. . Furthermore, it is possible to target polymer alloys of these resins.

[0065] In particular, the adhesion between the nylon-based resin and the dry plating film is good. Nylon-based resin is difficult to obtain a beautiful plating appearance due to etching treatment with hydrochloric acid or the like when wet-coated, and it is difficult to obtain a beautiful plating appearance. A beautiful appearance like a messy product was obtained.

[0066] Even with ABS resin generally used for resin plating, a plating adhesion strength of 1 kgfZcm (9.8 N / cm) or more was obtained. In the resin plating pretreatment process using the dry plating of the present invention (the resin conductive process), the test was conducted with a plating adhesion strength of 0.5 kgf / cm (4.9 NZcm) as a pass target value. I did it. In the automotive standard, 1. OKgf / cm (9.8 NZcm) is set as an effort target value, but it can be used at 0.5 kgf / cm (4.9 NZcm) in actual use.

[0067] Adhesion can be improved by performing oxygen plasma treatment (including plasma treatment with air) together with resin cleaning prior to dry staking. However, the condition is 榭 It is necessary to change according to fat and molding conditions.

[0068] By changing the pretreatment of the resin plating (conducting treatment of the resin) from the conventional wet method using hexavalent chromium to the dry method, the environmental burden in the production of the resin coating is expected to be drastically reduced.

[0069] [Observation of the surface of the surface after activation of rosin surface]

The surface observation after the surface cleaning and activation step S 1 was performed using a scanning electron microscope SEM (scanning electron microscope and AFM (Atomic Force Microscope)). .

Fig. 13 shows the SEM observation results and Fig. 14 shows the AFM observation results.

The force that the difference between the untreated plasma and the treated surface was unclear in SEM observation. In AFM observation, it was confirmed that irregularities were formed on the surface of the resin by performing plasma treatment. However, because the anchoring effect cannot be obtained with the unevenness of this SEM image level, the adhesion strength that satisfies the automotive parts standard cannot be obtained. However, this method satisfies the automotive part standard with the current surface irregularities. Adhesive strength is obtained.

[0070] Wet tension test was performed on the plasma-treated and untreated surfaces using a wet tension test mixture (manufactured by Kanto Yigaku Co., Ltd.). PC / ABS, ABS, PP, PC / PET) also improved wettability. From this, it is considered that hydrophilic functional groups are formed on the surface of the resin by plasma treatment.

This functional group chemically bonds with the sputtered metal in the metal thin film forming step S2, thereby generating adhesion with the resin.

[0071] Fig. 15 “Table 21 Experimental Results of Ion Irradiation Treatment” shows various plasma treatments for PAZABS (PA ratio 50%, 70%, with filler) and PCZABS, PCZPET automotive interior door handle products. Fig. 3 shows the results of an experiment on the condition of the resin surface cleaning 'activation step S1). As a result, it was found that there are good and bad adhesion conditions depending on the raw material, and it is necessary to select plasma treatment conditions depending on the raw material. Also, the door handle RH (right side) and LH (left side) may differ greatly in adhesion, so the adhesion was different depending on the molding conditions. [0072] Further, using the above-mentioned automotive interior door handle product, Ni-based, Cr-based, and Cu-based materials were sputtered with the above-mentioned raw materials in the metal thin film forming step S2. The results are shown in Fig. 16 "Table 22-1 Experimental results 1Z2 with Ni target", Fig. 17 "Table 22-2 Experimental results 2Z2 with Ni target" and Fig. 18 "Table 23 Cr target". The results are shown in Table 24, “Experimental results for Cu-based targets” in Fig. 19.

[0073] [Ni-based sputtering]

As shown in Table 22-1 in Fig. 16 and Table 22-2 in Fig. 17, all of the fats are wet surfaces that have poor adhesion if the ion irradiation in S1 is not performed. There was a tendency for bulges to occur after the electroplating process. PA-based resin has good Ni-based sputtering power. PCZABS has few conditions of good adhesion without swelling in the appearance of the product after wet electro-plating process. For PCZPET, all conditions are wet. Plating blisters occur in the electroplating process, and conditions with good adhesion are not found.

[0074] [Cr-based sputtering]

As shown in Table 23 of FIG. 18, if the plasma treatment has not been performed, none of the resins can obtain adhesion as in the Ni-based sputtering experiment (Table 22-1). When the plasma treatment was performed, the results were opposite to those of the Ni-based sputtering experiment, and the PA-based raw material showed poor adhesion. PCZABS and PCZPET had a peeling strength of 1. OkgfZcm or higher.

[0075] [Cu-based sputtering]

As shown in Table 24 of FIG. 19, if the plasma treatment is not performed, none of the resins can be adhered. Adhesion was bad in all cases except for one condition of PA / ABS.

[0076] From the above, none of the sputtered metals with good adhesion can be obtained without plasma treatment, as in the Ni-Cr-based experiments in Table 23. Moreover, it was found that there is a kind of sputtering metal in the metal thin film forming step S2 in which the adhesion strength can be obtained by the resin material, and it is necessary to select the sputtering metal according to the resin material.

[0077] In the present invention, a mold is used for a product having the same shape and using different resin raw material specifications such as plating (PCZABS) and Z coating (PCZPET). Can be standardized (no need to create a mold for each raw material like a mold for PC ZABS molding or a mold for PCZPET molding). Effort (raw material change work The cost can be reduced such that the work and the die mounting work on the molding machine can be omitted.

[0078] It should be noted that in the present invention, the resin surface of the resin molded product W is treated by a treatment method that does not use chemicals such as a mixed acid of chromic acid and sulfuric acid in the conventional etching process and conductive process, that is, a dry process. By roughening and imparting electrical conductivity, it is possible to prevent chemical deterioration of the surface of the resin w Of course, as long as the characteristics can be secured, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

[0079] In addition, according to the present invention, by imparting conductivity by a dry method, it is possible to plate a resin material that could not be attached by a wet method. Moreover, as long as the pre-processing process of many types of resin molded products W can be implemented easily, it will not be limited to the resin mentioned above.

[0080] In the present invention, by rotating the entire periphery of the resin molded product W in the vacuum chamber so as to face the metal target 52, a metal is applied to the surface of the resin molded product W having unevenness without overheating. As long as a uniform film can be formed, the present invention is not limited to the above-described embodiment. Industrial applicability

[0081] The method for producing a decorative garnish using a resin conductive material by sputtering according to the present invention includes a radiator grill, a door regulator handle, a knock door girsh, and a mall that require high corrosion resistance and heat cycle resistance. Parts such as automotive parts with grease for automobiles, handles that do not require high corrosion resistance, parts with grease for household appliances such as knobs, notebook PC cases that require high corrosion resistance, camera cases, mobile phone cases, etc. It can be used for various applications such as products such as fat-plated rigid housings.

[0082] In particular, the method for producing a decorative article using a resin conductive material by sputtering according to the present invention includes an automobile resin such as an automobile interior door handle, an exterior door handle, and an exterior handle cover part. Suitable for products such as metal parts, shower heads, faucet parts, etc. that are directly touched by humans, such as housing-related grease plated parts, and mobile phone parts.

[0083] The hanging jig of the present invention can be used as long as it is an apparatus for forming a film on a resin molded product W having an uneven shape.

Claims

The scope of the claims

[1] In the sputtering apparatus, the surface of the resin molded article (w) in a vacuum atmosphere is cleaned by a plasma treatment and activated by surface modification, and the activation process (S1), Similarly, in the sputtering apparatus, a metal thin film forming step for forming a metal film on the surface of the resin molded article (W) to ensure adhesion to the resin by sputtering.

(S2),

Subsequently, a conductive film forming step (S4) for forming a conductive film by sputtering on the metal thin film formed on the resin molded product (W) by the metal thin film forming step (S2),

An electroplating process for electroplating the resin molded product (W) after the conductive film formation process (S4) is completed,

When the metal film is uniformly formed on the uneven surface of the resin molded product (W), the surface of the resin molded product (W) is sputtered while rotating the resin molded product (W) in the sputtering apparatus. Manufacturing method of decorative garments using resin conductive material by sputtering

[2] In the sputtering system, the resin molded product (W) attached to the hanging jig (11) in a vacuum atmosphere is rotated and rotated so that it rotates and the surface treatment is activated by plasma treatment. Surface cleaning 'activation process (S1),

Next, in the same sputtering apparatus, the resin molded product (W) attached to the hanging jig (11) is moved so as to revolve in front of the metal target (52), and the metal is rotated while rotating there. A thin metal film forming step (S2) for forming a film to ensure adhesion to the resin by sputtering; and

Subsequently, the resin molded product (W) on which the metal thin film is formed in the metal thin film forming step (S2) is moved so as to revolve in front of another metal target (52), and is sputtered while rotating there. A conductive film forming step (S4) for forming a conductive film by:

An electroplating step (S4) for which the resin molded product (W) has been electroplated and an electroplating process using the resin conductive material by sputtering. A method for manufacturing decorated products.

[3] After the metal thin film forming step (S2), the metal thin film formed on the resin molded product (W) is brazed. A decorative surface using a resin conductive material by sputtering according to claim 1 or 2, further comprising a film surface activation treatment step (S3) activated by a surface modification treatment by a zuma treatment. A method for manufacturing accessories.

[4] Within the vacuum chamber of the sputtering apparatus, the resin molded product (W) is suspended from the hanging jig (11), and the hanging jig (11) is rotated around its rotation axis (L). Sputtering treatment is carried out, The manufacturing method of the decorative messenger goods using the grease resin electroconductivity of sputtering of Claim 1 or 2 characterized by the above-mentioned.

[5] In the vacuum chamber of the sputtering apparatus, the resin molded product (W) is suspended from a plurality of hanging jigs (11),

While rotating each hanging jig (11) with its rotation axis (L), a plurality of hanging jigs (

11. A decorative garment using a resin conductive material by sputtering according to claim 1 or 2, wherein the rotating shaft is moved so that it revolves along a circular locus and is sputtered. Manufacturing method.

[6] The resin surface cleaning and activation step (S1) is a plasma treatment with argon gas in a vacuum atmosphere with a small amount of air remaining on the surface of the resin molded product (W). 3. A method for producing a decorative article using a resin conductive material by sputtering according to claim 1 or 2.

[7] The resin surface cleaning 'activation step (S1) performs surface modification treatment by plasma treatment by injecting argon and a trace amount of oxygen into the surface of the resin molded product (W) in a vacuum atmosphere. A method for producing a decorative garment using the resin conductive material by sputtering according to claim 1 or 2.

[8] The metal thin film forming step (S2) includes a single metal having a strong binding force to oxygen or a metal having a strong binding force to oxygen on the surface of the resin molded article (W) in a vacuum atmosphere. 3. The method for producing a decorative garment using the resin conductivity by sputtering according to claim 1 or 2, wherein an alloy containing is formed by sputtering.

[9] The metal thin film forming step (S2) includes forming a metal ionized to 0.01 to 50% on the surface of the resin molded article (W) in a vacuum atmosphere. A method for producing a decorative garment using a resin conductive material by sputtering according to claim 1 or 2.

[10] The method according to claim 1, 2 or 9, wherein in the metal thin film forming step (S2), the film is formed to have a film thickness of about 0.01 to 2.0 m. A method for manufacturing decorative garnished products using oil conductive paste.

[11] In the conductive film forming step (S4), a nickel or copper film is formed, and the decoration-attached product using the resin conductive film by sputtering according to claim 1 or 2 is characterized. Production method

12. The sputtering according to claim 1, 2 or 11, wherein in the conductive film forming step (S4), the film is formed so as to have a film thickness of about 0.1 to 5.0 m. A method for manufacturing decorative garnished products using a resin conductive resin.

[13] The electroplating process consists of bright copper sulfate plating (S6), semi-bright nickel plating (S7), bright nickel plating (S8), MP nickel plating (microporous nickel plating) (S9) in this order. The decorative finish using the resin conductive material by sputtering according to claim 1 or 2, characterized in that the plating treatment is finished by applying a plating treatment and finally applying a decorative finish plating (S10). A method for manufacturing accessories.

[14] In the decorative finish plating (S10), a plating treatment such as trivalent chromium plating, chromium plating, tin Z nickel alloy plating, ruthenium or gold plating is performed. Item 14. A method for producing a decorative garment using the resin conductive material obtained by sputtering.

[15] When the metal of the metal target (52) is sputtered by argon plasma discharge to form a film on the resin molded product (W), a hanging jig (11) for fixing the resin molded product (W) (11) )

A suspension rod (12) that rotates within the vacuum chamber, and a hook (13) that removably fixes the resin molded product (W) attached to the suspension rod (12). In the vacuum chamber, the suspension rod (12) is configured to be sputtered while rotating, and the suspension for fixing the resin molded product during the sputtering process is characterized in that: jig.

[16] A hanging jig (11) for fixing the resin molded product (W) when the metal of the metal target (52) is sputtered by argon plasma discharge to form a film on the resin molded product (W). ) In the vacuum chamber, a plurality of suspension plates (14) vertically arranged and a plurality of suspensions detachably leaning between the rotation plates (14) with a circumferential interval. A lower bar (12),

A pulling hook (13) attached to each hanging rod (12) for detachably fixing the resin molded product (W), and a force,

In the vacuum chamber, the upper and lower rotating plates (14) are rotated, and at the same time, the suspension rods (12) are rotated while the sputtering process is performed. A hanging jig that secures the resin molded product to the surface.

17. A resin composition during the sputtering process according to claim 16, wherein a partition wall (15) is further provided between adjacent hanging rods (12) which are laid between the rotating plates (14). A hanging jig to fix the product.