KR101639219B1 - Resin member is formed in metal surface synthetic part production method - Google Patents

Resin member is formed in metal surface synthetic part production method Download PDF

Info

Publication number
KR101639219B1
KR101639219B1 KR1020150175930A KR20150175930A KR101639219B1 KR 101639219 B1 KR101639219 B1 KR 101639219B1 KR 1020150175930 A KR1020150175930 A KR 1020150175930A KR 20150175930 A KR20150175930 A KR 20150175930A KR 101639219 B1 KR101639219 B1 KR 101639219B1
Authority
KR
South Korea
Prior art keywords
synthetic resin
metal film
resin member
region
layer
Prior art date
Application number
KR1020150175930A
Other languages
Korean (ko)
Inventor
김재경
김근하
조성민
이홍일
주진호
Original Assignee
인탑스 주식회사
플라텔코퍼레이션(주)
아로 주식회사
김재경
김근하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 인탑스 주식회사, 플라텔코퍼레이션(주), 아로 주식회사, 김재경, 김근하 filed Critical 인탑스 주식회사
Priority to KR1020150175930A priority Critical patent/KR101639219B1/en
Application granted granted Critical
Publication of KR101639219B1 publication Critical patent/KR101639219B1/en
Priority to PCT/KR2016/011991 priority patent/WO2017099349A1/en

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • C25D5/022Electroplating of selected surface areas using masking means
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34Pretreatment of metallic surfaces to be electroplated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34Pretreatment of metallic surfaces to be electroplated
    • C25D5/46Pretreatment of metallic surfaces to be electroplated of actinides
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • C25D5/56Electroplating of non-metallic surfaces of plastics

Abstract

The present invention relates to a method to produce synthetic resin member having a partial metal film. According to the present invention, the synthetic resin member has strength and a texture of metal, with the metal film having a high adhesion partially formed on a raw material of synthetic resin, to have reliability in preventing detachment of the metal film even in a drastic temperature change. Furthermore, the method is able to reduce the number of components, to simplify a manufacturing process without an assembling process to reduce a manufacturing cost, and to form various patterns such as a logo and a character by the partial metal film on a surface of the raw material of synthetic resin. The method comprises: a step of pretreatment to form a fine roughness of a predefined form on a synthetic resin member surface; a step of forming a copper coating layer on the pretreated synthetic resin member surface; a step of divide the synthetic resin member to separate regions into a region to form a metal film and a region not to form a metal film; a step of performing acidic copper coating to form a copper thin film on the copper coating layer on the region to form the metal film, and to remove the copper coating layer on the region not to form a metal film; a step of forming the metal film on the copper thin film by electroplating; a step of detaching a remaining copper thin film and the copper coating layer in the region not to form a metal film; and a step of forming a finishing layer by spreading a finishing material and drying the same.

Description

금속막이 부분적으로 형성된 합성수지부재 제조방법{Resin member is formed in metal surface synthetic part production method}Technical Field [0001] The present invention relates to a method of manufacturing a synthetic resin member having a metal film partially formed thereon,

본 발명은 금속막을 부분적으로 형성한 합성수지프레임 제조방법에 관한 것으로, 더욱 상세하게는 합성수지부재의 표면에 부분적으로 금속막층을 형성하여, 금속막이 형성된 합성수지부재의 일부분이 금속성의 강도 및 질감을 갖고, 기계적/화학적 내구성이 뛰어난 금속막이 부분적으로 입혀진 합성수지부재 제조방법에 관한 것이다.
The present invention relates to a method of manufacturing a synthetic resin frame in which a metal film is partially formed, and more particularly, to a method of manufacturing a synthetic resin frame by partially forming a metal film layer on a surface of a synthetic resin member, To a method of manufacturing a synthetic resin member in which a metal film having excellent mechanical / chemical durability is partially applied.

근래에 제조되는 공산품은 디자인 및 색상이 구매자의 제품 선택에 있어서 매우 중요한 역할을 한다.The industrial products that are manufactured in the recent years play a very important role in the selection of the products of the buyer by the design and the color.

이에 따라 공산품의 색상을 미려하게 하기 위해 공산품의 케이스의 표면을 마그네슘, 티타늄 등의 다양한 금속 재질로 도금시킨 제품이 다양하게 출시되고 있다.Accordingly, in order to enhance the color of industrial products, there have been various products in which the surface of industrial products is plated with various metals such as magnesium and titanium.

이러한 일례로 차량에는 외부의 공기를 차량 실내로 유입시킬 수 있는 공조시스템은 외부공기나 가열 및 냉각된 공기를 차량 실내로 송풍하여 실내를 따뜻하게 하거나 냉각시키게 되는데, 이때 상기 에어 시스템으로부터 실내로 송풍되는 공기는 그 송풍방향을 조절할 수 있도록 통상 크러시패드 부위에 형성된 송풍구에 손으로 조작할 수 있는 에어밴트를 장착하게 된다.For example, an air-conditioning system capable of introducing outside air into a vehicle interior of the vehicle warms or cools the room by blowing outside air or heated and cooled air to the inside of the vehicle. At this time, The air can be hand-operated by an air vent on a blowing hole formed in the crush pad area so as to adjust the blowing direction.

상기한 에어밴트는 크러시패널의 공조시스템 송풍구에 장착되어 공기를 실내로 송풍하도록 개구된 개구부를 형성한 에어밴트 프레임과, 이 에어밴트 프레임의 개구부의 안쪽 상·하부위에 일정 간격으로 형성된 고정홀에 세로 방향으로 결합되는 세로윙, 이 세로윙에 대해 수평한 방향으로 상기 에어밴트 프레임의 개구부의 안쪽 좌·우부위에 일정 간격으로 형성된 고정홀에 결합되는 가로윙 및 이 가로윙에 삽입 결합되어 상기 윙을 이동시키는 노브로 구성된다.The above airbot has an airbot frame mounted on a ventilation hole of the air conditioning system of the crush panel and having an opening opened to blow air into the room and a fixing hole formed at a predetermined interval on the upper and lower sides of the opening of the airboutt frame A transverse wing coupled to a fixing hole formed at a predetermined interval in left and right inner sides of an opening of the air vent frame in a horizontal direction with respect to the longitudinal wing, And a knob for moving the wing.

최근 산업이 발달함에 따라 금속과 유사한 물리적 특성 및 화학적 특성을 갖는 합성수지를 이용하여 생산한 제품으로 차량의 실내를 연출하고 있다.As the industry develops in recent years, the interior of a vehicle is produced by using a synthetic resin having physical and chemical characteristics similar to those of a metal.

그러나 대부분의 합성수지를 이용한 제품은 금속의 고유한 광택을 갖지 못하기 때문에, 합성수지를 이용한 제품으로부터 금속 질감을 갖도록 하기 위해서는 합성수지 제품의 표면에 특수한 도금층을 형성함으로써 합성수지 제품은 금속과 유사한 광택을 갖는다.However, most synthetic resin products do not have the inherent luster of the metal. Therefore, in order to have a metal texture from a product using a synthetic resin, a special coating layer is formed on the surface of the synthetic resin product.

등록특허 제10-0690936호(2007.02.27)에서는 합성 수지를 성형하여 합성수지 성형품을 제조하는 단계; 상기 합성수지 성형품의 표면을 세정하는 단계; 상기 합성수지 성형품의 표면으로부터 기체가 발생하는 것을 억제 및 상기 합성수지 성형품의 표면 경도를 향상시키기 위해 단량체를 고분자 중합 공정에 의하여 중합한 중합체를 상기 합성수지 성형품의 표면에 코팅하여 중합체 코팅층을 형성하는 단계; 및 금속 질감을 얻기 위해 금속을 포함하는 반응가스를 반응시켜 형성된 금속 화합물을 상기 중합체 코팅층의 표면에 증착하여 금속 질감 코팅층을 형성하는 단계를 포함하는 합성수지 제품의 코팅 방법을 제공하였다.Japanese Patent Registration No. 10-0690936 (Feb. 27, 2007) discloses a process for producing a synthetic resin molded article by molding a synthetic resin; Cleaning the surface of the molded plastic article; Forming a polymer coating layer by coating a polymer obtained by polymerizing a monomer with a polymeric polymerization process on the surface of the synthetic resin molded article so as to suppress generation of gas from the surface of the synthetic resin molded article and to improve the surface hardness of the synthetic resin molded article; And reacting a reaction gas containing a metal to obtain a metal texture to deposit a metal compound on the surface of the polymer coating layer to form a metal texture coating layer.

그러나 종래 코팅방법은 금속과 같은 기계적 내구성 및 내마멸성 등이 우수한 제품을 생산하기에 어려운 문제점을 갖는다.However, the conventional coating method has a difficulty in producing a product excellent in mechanical durability such as metal and abrasion resistance.

또한 최근에는 진공 증착과 같은 건식 도금법이 많이 사용되고 있지만, 합성수지 제품으로부터 발생된 수분, 이산화탄소 암모니아 등의 가스로 인해 도금을 형성하기 위한 진공압을 정확하게 설정하기 어렵고 합성수지 성형품에 금속 질감의 효과를 위해서는 제품으로부터 발생하는 가스로 인해 원하고자 하는 막을 정밀하게 형성하기 어려운 문제점을 갖는다. In recent years, dry plating methods such as vacuum deposition have been widely used. However, it is difficult to accurately set the vacuum pressure for forming the plating due to moisture, carbon dioxide, ammonia, etc. generated from synthetic resin products. It is difficult to precisely form a desired film due to the gas generated from the gas.

이러한 문제로 기존의 건식 도금법은 생산성이 낮기 때문에 제조 가격이 높은 문제점도 함께 갖고, 이에 더하여 진공 증착 방법에 따라 합성수지 제품에 코팅된 도금층은 모재료인 합성수지 성형품과의 밀착력이 낮아 합성수지 성형품에 코팅된 도금층이 쉽게 박리 또는 파손되는 문제점을 갖는다.
Due to these problems, the conventional dry plating method has a problem of high production cost because of low productivity. In addition, the plating layer coated on the synthetic resin product by the vacuum deposition method has low adhesion to the synthetic resin molded article, The plating layer is easily peeled or broken.

본 발명은 합성수지인 원재에 부분적으로 형성된 금속막의 높은 밀착력으로 합성수지부재가 금속의 강도 및 질감을 갖고, 급격한 온도 변화에도 금속막이 박리되지 않는 신뢰성을 갖으며, 하나의 합성수지부재에 부분적으로 금속막을 형성하여, 부품 수를 줄이는 것은 물론, 조립공정이 불필요해 공정이 단순해짐에 따라 제조원가가 절감되고, 합성수지인 원재에 부분적으로 형성된 금속막층으로 로고 또는 문양 및 문자 등을 형성할 수 있어, 제품을 모방을 방지할 수 있는 금속막이 부분적으로 형성된 합성수지부재 제조방법을 제공하는 것을 그 목적으로 한다.
A synthetic resin member has strength and texture of a metal due to high adhesion strength of a metal film partially formed on a synthetic resin raw material and has reliability that a metal film is not peeled off even in a sudden temperature change and a metal film is partially formed on one synthetic resin member As a result, the number of components is reduced, and the assembly process is unnecessary. Therefore, the manufacturing cost is reduced as the process is simplified, and logos, patterns, and characters can be formed as a metal film layer partially formed on the synthetic resin raw material, And a method for manufacturing a synthetic resin member in which a metal film is partially formed.

본 발명에 따른 금속막이 부분적으로 형성된 합성수지부재 제조방법은 a)지정형태의 합성수지부재 표면에 미세한 조도가 형성되도록, 전처리하여 준비하는 단계, b)전처리하여 준비된 합성수지부재에 화학동도금을 실시하여 합성수지부재의 표면에 동도금층을 형성하는 단계, c)상기 합성수지부재에서 금속막이 형성될 영역과, 금속막이 형성되지 않을 영역이 구분되도록 경계를 구획하는 단계, d)금속막이 형성될 영역과, 금속막이 형성되지 않을 영역으로 경계가 구획된 합성수지부재에 유산동도금을 실시하여, 금속막이 형성되지 않을 영역의 동도금층을 제거하고, 금속막이 형성될 영역의 동도금층 표면에는 동박층을 적층하는 단계, e)금속막이 형성될 영역의 동도금층에 동박층이 적층된 합성수지부재에 전해도금법을 실시하여 상기 동박층에 금속막을 형성하는 단계, f)합성수지부재 중 금속막이 형성되지 않은 영역의 잔존 동박층 및 동도금층을 박리하는 단계, g)금속막이 부분적으로 입혀진 합성수지부재 표면에 마감처리도료를 도포한 후, 건조과정을 거쳐 마감재층을 형성하는 단계를 포함한다.The method for manufacturing a synthetic resin member partially formed with a metal film according to the present invention comprises the steps of: a) preparing a synthetic resin member having a designated shape by a pretreatment so as to form a fine roughness on the surface thereof, b) performing chemical plating on the synthetic resin member prepared by pre- Forming a copper plating layer on the surface of the synthetic resin member, c) separating a boundary between the region where the metal film is to be formed and the region where the metal film is not formed in the synthetic resin member, and d) E) depositing a metal layer on the surface of the copper plating layer in the region where the metal film is to be formed; and d) A synthetic resin member in which a copper foil layer is laminated on a copper plated layer of a region where a film is to be formed is subjected to electrolytic plating to form a gold F) peeling off the remaining copper foil layer and the copper plating layer in the region where the metal film is not formed in the synthetic resin member, g) applying the finish paint on the surface of the synthetic resin member partially covered with the metal film, To form a finish material layer.

이때 본발명에 따른 상기 a)단계인 합성수지부재 표면에 전처리하여 준비하는 단계에서는, 상기 합성수지부재 표면에 전처리도료를 도포하여, 그 표면에 미세한 조도가 형성되도록 하거나, 또는 연마가공으로 합성수지부재 표면에 미세한 조도가 형성되도록 한다.At this time, in the step of preprocessing and preparing the surface of the synthetic resin member in the step a) according to the present invention, a pretreatment paint is applied to the surface of the synthetic resin member so that a fine roughness is formed on the surface of the synthetic resin member, So that a fine illuminance is formed.

그리고 본 발명에 따른 상기 c)단계인 금속막이 형성될 영역과, 금속막이 형성되지 않을 영역이 구분되도록 경계를 구획하는 단계에서는, 동도금층을 라인 형태로 제거하여 경계를 구획한다.In the step of dividing the boundary between the region where the metal film is to be formed and the region where the metal film is not to be formed, which is the step c) according to the present invention, the copper plating layer is removed in a line shape to partition the boundary.

또한 본 발명에 따른 상기 f)단계인 금속막이 형성되지 않은 영역의 동박층 및 동도금층을 박리하는 단계에서는, 물 50~70%, 질산 30~50%로 혼합되고, 수온이 30~50℃로 유지되는 박리용액이 수용된 욕조에 금속막이 부분적으로 형성된 합성수지부재를 지그에 거치한 후 침지하여 박리한다.
In the step of peeling the copper foil layer and the copper plating layer in the region where the metal film is not formed, which is the step f) according to the present invention, water is mixed at 50 to 70% and nitric acid at 30 to 50% A synthetic resin member having a metal film partially formed in a bath containing the peeling solution to be retained is immersed in a jig, followed by dipping and peeling.

본 발명에 따른 금속막을 부분적으로 형성한 합성수지부재 제조방법은 다음과 같은 효과를 가진다.The method of manufacturing a synthetic resin member in which a metal film is partially formed according to the present invention has the following effects.

첫째, 합성수지인 원재에 부분적으로 형성된 금속막의 높은 밀착력으로 합성수지부재가 금속의 강도 및 질감을 갖고, 급격한 온도 변화에도 금속막이 박리되지 않는 신뢰성을 갖는 효과를 가진다.First, the synthetic resin member has the strength and the texture of the metal due to the high adhesion strength of the metal film partially formed on the synthetic resin raw material, and has the effect that the metal film is not peeled off even in a sudden temperature change.

둘째, 종래에는 합성수지부재에 금속재의 부재가 결합하던 것을 하나의 합성수지부재에 부분적으로 금속막을 형성하여, 부품 수를 줄이는 것은 물론, 조립공정이 불필요해 공정이 단순해짐에 따라 제조원가가 절감되는 효과를 가진다.Secondly, a metal film is partially formed on one synthetic resin member to reduce the number of parts, and a manufacturing process is unnecessary, thereby simplifying the manufacturing process and reducing manufacturing cost. I have.

셋째, 합성수지인 원재에 부분적으로 형성된 금속막층으로 로고 또는 문양 및 문자 등을 형성할 수 있어, 제품을 모방을 방지할 수 있는 효과를 가진다.
Third, a logo, a pattern, a character, and the like can be formed as a metal film layer formed partly on a synthetic resin raw material, thereby preventing imitation of a product.

도 1은 본 발명의 실시에 따른 금속막을 부분적으로 형성한 합성수지부재 제조방법의 간략하게 보인 블록도이다.
도 2는 본 발명의 실시에 따른 금속막을 부분적으로 형성한 합성수지부재 제조방법이 실시되는 상태를 간략하게 보인 예시도이다.
1 is a simplified block diagram of a method for manufacturing a synthetic resin member in which a metal film is partially formed according to an embodiment of the present invention.
2 is a schematic view showing a state in which a synthetic resin member manufacturing method in which a metal film is partially formed according to an embodiment of the present invention is performed.

이하, 첨부된 도면을 참조하여 본 발명에 따른 바람직한 실시 예를 상세히 설명하기로 한다. 이에 앞서, 본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니 되며, 발명자는 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여, 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms, and the inventor should appropriately interpret the concepts of the terms appropriately The present invention should be construed in accordance with the meaning and concept consistent with the technical idea of the present invention.

따라서 본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 가장 바람직한 실시 예에 불과할 뿐이고, 본 발명의 기술적 사상을 모두 대변하는 것은 아니므로, 본 출원시점에 있어서 이들은 대체할 수 있는 균등한 변형 예들이 있을 수 있음을 이해하여야 한다.Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention, and not all of the technical ideas of the present invention are described. Therefore, at the time of the present application, It should be understood that variations can be made.

도 1은 본 발명의 실시에 따른 금속막을 부분적으로 형성한 합성수지부재 제조방법의 간략하게 보인 블록도이고, 도 2는 본 발명의 실시에 따른 금속막을 부분적으로 형성한 합성수지부재 제조방법이 실시되는 상태를 간략하게 보인 예시도이다.FIG. 1 is a simplified block diagram of a method for manufacturing a synthetic resin member in which a metal film is partially formed according to an embodiment of the present invention. FIG. 2 is a view showing a state in which a synthetic resin member manufacturing method in which a metal film is partially formed according to an embodiment of the present invention Fig.

본 발명은 지정 형태를 이루는 합성수지부재에 부분적으로 금속막을 형성하여, 금속막이 형성된 합성수지부재의 표면이 금속성의 강도 및 질감을 갖고, 금속 막이 외부에서 가해지는 물리적 충격 및 급격한 온도변화, 화학적 요소에도 쉽게 박리되지 않는 금속막을 부분적으로 형성한 합성수지부재 제조방법에 관한 것으로, 도면을 참조하여 더욱 상세하게 살펴보면 다음과 같다.The present invention relates to a synthetic resin member having a predetermined shape by partially forming a metal film so that the surface of the synthetic resin member having the metal film formed thereon has a strength and a texture of metallic material and the metal film is easily subjected to physical impact and sudden temperature change, The present invention relates to a method of manufacturing a synthetic resin member in which a metal film not to be peeled is partially formed, and will be described in more detail with reference to the drawings.

도 1 및 도 2를 참조하여 본 발명에 따른 금속막을 부분적으로 형성한 합성수지부재 제조방법은 지정형태의 합성수지부재를 전처리하여 준비하는 단계; 준비된 합성수지부재 중 일부분에 동도금층 및 동박층을 순차로 형성하는 단계; 및 합성수지부재의 일부분에 형성된 동박층에 금속막을 형성하는 단계를 포함한다.Referring to FIGS. 1 and 2, a method of manufacturing a synthetic resin member having a metal film partially formed according to the present invention includes: preparing a synthetic resin member of a designated type by pretreatment; Sequentially forming a copper plating layer and a copper foil layer on a part of the prepared synthetic resin members; And forming a metal film on the copper foil layer formed on a part of the synthetic resin member.

본 발명에 따른 상기한 단계들을 도 1 및 도 2을 참조하여 보다 상세하게 살펴보면 다음과 같다.The above steps according to the present invention will be described in more detail with reference to FIGS. 1 and 2. FIG.

먼저 a)단계는, 지정형태의 합성수지부재 표면에 미세한 조도가 형성되도록, 전처리하여 준비한다.(S100)First, a) is prepared by preprocessing so as to form a fine roughness on the surface of the synthetic resin member in the designated shape (S100)

이때, 지정형태의 합성수지부재(10)는 폴리카보네이트, ABS 등의 레진으로, 이를 지정형태의 금형을 이용하여 사출성형 또는 압출성형법으로 지정형태로 제조되는 것이 바람직하다.At this time, the specified shape of the synthetic resin member 10 is resin such as polycarbonate or ABS, and it is preferable that the synthetic resin member 10 is produced in a designated form by injection molding or extrusion molding using a mold of a specified form.

그리고 지정형태로 성형된 합성수지부재(10)의 표면을 전처리하여, 합성수지부재 표면에 미세한 조도가 형성되도록 한다. Then, the surface of the synthetic resin member 10 molded in the designated shape is pretreated so that a fine roughness is formed on the surface of the synthetic resin member.

이때, 조도는 합성수지부재(10) 표면의 거칠기를 말하는 것으로, 동도금층이 합성수지부재(10)의 표면에 견고하게 밀착되도록 하기 위한 것으로, 상기한 전처리의 일실 예로는 합성수지부재(10)의 표면에 전처리용 도료를 지정 두께로 도포하여 도료층(11)을 형성하는 것으로, 상기 전처리용 도료를 합성수지 프레임(10)의 표면에 도포하는 두께는 6㎛∼16㎛를 이루도록 형성하는 것이 바람직하나 필요에 따라 가감될 수도 있으며, 도포된 도료층(11)은 60℃∼80℃의 열풍으로 강제건조하는 것이 바람직하다.In this case, the roughness refers to the roughness of the surface of the synthetic resin member 10, which is used for firmly adhering the copper plating layer to the surface of the synthetic resin member 10, The pretreatment paint is applied to the surface of the synthetic resin frame 10 with a specified thickness to form the paint layer 11. It is preferable that the thickness for applying the pretreatment paint to the surface of the synthetic resin frame 10 is 6 to 16 占 퐉, And the applied coating layer 11 is preferably forcedly dried by hot air at 60 ° C to 80 ° C.

상기 도료층(11)은 별도의 공정 없이 마감처리나 클리어 코팅으로 색상(컬러)의 구현이 가능하다.The color of the paint layer 11 can be realized by a finishing process or a clear coating without a separate process.

또한 전처리의 다른 실시예로는 합성수지부재(10) 표면을 연마재로 연마하여 미세한 조도를 형성할 수도 있다.In another embodiment of the pretreatment, the surface of the synthetic resin member 10 may be polished with an abrasive to form a fine roughness.

다음은 b)단계로, 상기 a)단계(S100)를 실시한 후, 전처리하여 준비된 합성수지부재에 화학동도금을 실시하여 합성수지부재(10)의 표면에 동도금층(20)을 형성한다.(S200)Next, a copper plating layer 20 is formed on the surface of the synthetic resin member 10 by performing chemical plating on the synthetic resin member prepared by the pretreatment after the step a)

이때 상기 합성수지부재(10)의 표면에 형성되는 동도금층(20)은 화학동도금의 실시에 의해 상기 합성수지부재(10)의 표면 전체에 형성되는데, 화학동도금의 일 실시예로 무전해 동도금법이 실시될 수 있는데, 무전해 동도금법은 외부로부터 전기에너지를 공급받지 않고 금속염 수용액 중의 금속이온을 환원제의 힘에 의해 자기 촉매적으로 환원시켜 피처리물의 표면 위에 동을 석출시키는 것으로, 구리(銅)도금제를 이용하여 동도금층(20)을 부도체인 합성수지부재(10) 표면 전체에 0.1㎛∼0.5㎛ 두께로 형성한다.At this time, the copper plating layer 20 formed on the surface of the synthetic resin member 10 is formed on the entire surface of the synthetic resin member 10 by the chemical plating, and the electroless copper plating method is performed as one embodiment of chemical plating. The electroless copper plating method is a method in which metal ions in an aqueous metal salt solution are autocatalytically reduced by the force of a reducing agent without being supplied with external electrical energy to deposit copper on the surface of the object to be treated, The copper plating layer 20 is formed to a thickness of 0.1 탆 to 0.5 탆 on the entire surface of the non-conductive synthetic resin member 10.

다음은 c)단계로, 상기 b)단계(S200)에 의해 표면 전체에 동도금층(20)이 형성된 합성수지부재(10) 중 금속막이 형성될 영역과, 금속막이 형성되지 않을 영역이 구분되도록 경계를 구획한다.(S300)Next, in step c), a boundary is formed between the region where the metal film is to be formed and the region where the metal film is not to be formed, in the synthetic resin member 10 having the copper plating layer 20 formed on the entire surface by the step b) (S300).

이때, 경계의 구획은 상기 합성수지부재(10)의 표면에 형성된 동도금층(20)을 라인 형태로 제거하여 경계를 구획하는데, 본 발명의 실시에 따른 적용 예는 레이저를 이용한 식각으로 동도금층(20)을 라인 형태로 제거하여 경계를 구획할 수 있다.In this case, the boundary divides the copper plating layer 20 formed on the surface of the synthetic resin member 10 in the form of a line to divide the boundary. In the application example according to the embodiment of the present invention, the copper plating layer 20 ) Can be removed in the form of a line to divide the boundary.

먼저 레이저로 식각할 시에는 상기 합성수지부재(10)에 전처리용으로 도포되어 형성된 도료층(11)의 식각이 발생하지 않도록, 도료층(11)의 두께를 고려하여 레이저의 출력이 조절되어, 동도금층(20)의 경계만 식각되어 제거되도록 하는 것이 바람직하다.The output of the laser is controlled in consideration of the thickness of the coating layer 11 so that etching of the coating layer 11 formed by applying for pretreatment to the synthetic resin member 10 does not occur when the laser is etched first, It is preferable that only the boundary of the plating layer 20 is etched and removed.

다음은 d)단계로, 상기 c)단계(S300)의 실시에 의해 금속막이 형성될 영역과, 금속막이 형성되지 않을 영역으로 경계가 구획된 합성수지부재(10)에 유산동도금을 실시하여, 금속막이 형성되지 않을 영역의 동도금층(20)을 제거하고, 금속막이 형성될 영역의 동도금층(20) 표면에는 동박층(30)을 적층한다.(S400)Next, step d) is carried out to perform copper plating on the synthetic resin member 10 whose boundaries are defined by the region where the metal film is to be formed and the region where the metal film is not formed by performing the step c) (S300) The copper plating layer 20 of the region not to be formed is removed and the copper foil layer 30 is laminated on the surface of the copper plating layer 20 in the region where the metal film is to be formed.

이때 유산동도금을 실시할 시, 구획된 금속막이 형성되지 않을 영역은 양극으로 하고, 금속막이 형성될 영역은 음극으로 하여, 유산동도금을 통해 금속막이 형성되지 않을 부분의 동도금층(20)이 이온화되어 박리 제거되고, 금속막을 형성될 영역의 동도금층(20)에는 동박층(30)이 적층되는 것이 바람직하다.At this time, when the sacrificial copper plating is performed, the copper plating layer 20 where the metal film is not to be formed is ionized through the sacrificial copper plating and the region where the partitioned metal film is not to be formed as the anode and the region where the metal film is to be formed as the cathode, It is preferable that the copper foil layer 30 is laminated on the copper plating layer 20 of the region where the metal film is to be formed.

또한 형성되는 동박층(30) 적층의 두께가 0.5㎛∼2㎛로, 동박층(30)의 적층 두께를 조절하기 위해 연속반복으로 제2,제3의 유산동도금을 실시할 수도 있다.The second and third sacrificial copper plating may be performed continuously and repeatedly to adjust the thickness of the copper foil layer 30 so that the thickness of the formed copper foil layer 30 is 0.5 mu m to 2 mu m.

다음은 e)단계로, 금속막이 형성될 영역의 동도금층(20)에 동박층(30)이 적층된 합성수지부재(10)에 전해도금법을 실시하여 상기 동박층(30)에 금속막(40)을 형성한다.(S500)Next, in step e), a synthetic resin member 10 in which a copper foil layer 30 is laminated on a copper plating layer 20 in a region where a metal film is to be formed is subjected to electrolytic plating to form a metal film 40 on the copper foil layer 30, (S500).

이때 합성수지부재(10)의 표면에 형성되는 금속막(40)은 동박층(30)을 부분적으로 형성한 합성수지부재(10)를 금속이온을 포함하는 전해질용액에 침지한 후, 전해도금법으로 상기 합성수지부재(10)의 동박층(30)에 형성된다.At this time, the metal film 40 formed on the surface of the synthetic resin member 10 is formed by dipping the synthetic resin member 10 partially formed with the copper foil layer 30 into an electrolyte solution containing metal ions, Is formed on the copper foil layer (30) of the member (10).

여기서 상기 금속막(40)은 전해질 용액을 이용하여 전해도금법으로 실시하는 바람직한 실시예를 살펴보면, 우선 전해질 용액의 온도를 60 ~ 70℃로 유지하고, 수소이온농도(PH)는 12.3~12.7이며, 전류밀도 1 ~ 3A/dm2로 1 ~ 40분(min) 동안 정전류로 전해도금법으로 진행하는 것이 바람직하다.Here, the metal film 40 is electrolytically coated with an electrolytic solution. First, the temperature of the electrolytic solution is maintained at 60 to 70 ° C., the hydrogen ion concentration (PH) is 12.3 to 12.7, It is preferable to proceed by electrolytic plating at a constant current for 1 to 40 minutes (min) at a current density of 1 to 3 A / dm2.

아울러, 상기 금속막 도금을 실시함에 있어서는 흑연판을 양극으로 하고, 음극에 상기 동박층(30)이 적층된 상기 합성수지부재(10)를 연결하여, 전해질 용액을 교반 해주면서 진행하는 것이 바람직하다.In addition, in performing the metal film plating, it is preferable that the graphite plate is used as an anode and the synthetic resin member 10 in which the copper foil layer 30 is laminated is connected to a cathode, and the electrolytic solution is stirred while proceeding.

이와 같은 조건으로 금속막(40)이 상기 동박층(30) 표면에 형성된다.Under such conditions, a metal film 40 is formed on the surface of the copper foil layer 30.

이때 상기 전해질에 포함되는 금속이온으로는 니켈(Ni), 은(Ag), 크롬(Cr), 팔라듐(Pd), 주석(Sn), 이리듐(Ir), 로듐(Rh), 코발트(Co) 또는 알루미늄(Al) 금속이온 중 어느 하나의 금속이온을 포함하는 것이 바람직하다.The metal ions included in the electrolyte may include at least one selected from the group consisting of Ni, Ag, Cr, Pd, Sn, iridium, rhodium, cobalt, Aluminum (Al) metal ion.

다음은 f)단계로, e)단계(S500)의 실시에 의해 합성수지부재(10)에 부분적으로 금속막(40)이 형성되면, 금속막이 형성되지 않은 영역의 잔존 동박층(30) 및 동도금층(20)을 박리한다.(S600)Next, in step f), when the metal film 40 is partially formed on the synthetic resin member 10 by the execution of step e), the remaining copper foil layer 30 in the region where the metal film is not formed, (20) is peeled off. (S600)

이때 잔존 동박층(30) 및 동도금층(20)을 박리는 화학적으로 박리하게 되는데, e)단계(S500)에 의해 부분적으로 금속막(40)이 형성된 합성수지부재(10)를 해당 지그에 거치한 후, 박리용액이 수용된 욕조에 1~2분 정도 침지하여 박리하게 된다.At this time, the remaining copper foil layer 30 and the copper plating layer 20 are chemically peeled off. E) The synthetic resin member 10 partially having the metal film 40 formed thereon is placed on the jig After that, the substrate is immersed in the bath containing the peeling solution for 1 to 2 minutes to peel off.

여기서 박리용액은 물 50~70%, 질산 30~50%가 혼합된 수용액으로 30~40℃의 수온을 유지하며, 박리 중 육안으로 확인하여 잔여물이 남을 경우, 시간을 1~2분 더 추가하여 박리를 할 수 있고, 욕조에 초음파 버블을 발생시키면서 진행할 수도 있다. In this case, the peel solution is an aqueous solution containing 50 to 70% of water and 30 to 50% of nitric acid. The water temperature is maintained at 30 to 40 ° C., and if the residue remains after peeling, the time is increased by 1 to 2 minutes It is possible to carry out the separation while generating ultrasonic bubbles in the bath.

다음은 g)단계로, f)단계(S600)에 실시에 의해 금속막이 형성되지 않은 영역의 잔존 동박층(30) 및 동도금층(20)을 박리되면, 수세, 건조과정을 거치고, 금속막(40)이 부분적으로 입혀진 합성수지부재(10) 표면에 마감처리도료를 도포한 후, 건조과정을 거쳐 마감재층(50)을 형성한다.Next, if the remaining copper foil layer 30 and the copper plating layer 20 in the region where the metal film is not formed are peeled off in the step g) and f) in the step S600, 40 is applied to the surface of the synthetic resin member 10, and then the finish material layer 50 is formed through a drying process.

따라서 본 발명은 합성수지부재의 표면 부분적으로 금속막을 형성한 후, 합성수지부재의 표면에 잔존하는 동도금층 및 동박층을 화하적 방식으로 박리하여, 고품질의 제품을 제공할 수 있다.Therefore, the present invention can provide a high-quality product by forming a metal film on the surface portion of the synthetic resin member and peeling the copper-plated layer and the copper foil layer remaining on the surface of the synthetic resin member in a harmonic manner.

상기한 일련의 과정이 완료되면 금속막(40)이 부분적으로 형성된 합성수지부재(10)가 완성하게 되는데, 상기 합성수지부재(10)의 지정 부분에 금속막(40)이 형성되어, 금속성의 강도 및 질감을 갖고, 기계적/화학적 내구성이 뛰어난 합성수지부재를 제공한다.The metal film 40 is formed on the designated portion of the synthetic resin member 10 so that the metal film 40 is formed to have a metallic strength To provide a synthetic resin member having excellent mechanical and chemical durability.

본 발명은 도면에 도시된 실시 예를 참고로 설명되었으나 이는 예시적인 것에 불과하며, 본 기술 분야의 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 다른 실시 예가 가능하다는 점을 이해할 것이다. 따라서 본 발명의 진정한 기술적 보호 범위는 첨부된 특허청구범위의 기술적 사상에 의하여 정해져야 할 것이다.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: 합성수지부재
11: 도료층
20: 동도금층
30: 동박층
40: 금속막
50: 마감재층
10: synthetic resin member
11: paint layer
20: Copper plating layer
30: Copper foil layer
40: metal film
50: Finish layer

Claims (4)

a)지정형태의 합성수지부재 표면에 미세한 조도가 형성되도록, 전처리하여 준비하는 단계;
b)전처리하여 준비된 합성수지부재에 화학동도금을 실시하여 합성수지부재의 표면에 동도금층을 형성하는 단계;
c)상기 합성수지부재에서 금속막이 형성될 영역과, 금속막이 형성되지 않을 영역이 구분되도록 경계를 구획하는 단계;
d)금속막이 형성될 영역과, 금속막이 형성되지 않을 영역으로 경계가 구획된 합성수지부재에 유산동도금을 실시하여, 금속막이 형성되지 않을 영역의 동도금층을 제거하고, 금속막이 형성될 영역의 동도금층 표면에는 동박층을 적층하는 단계;
e)금속막이 형성될 영역의 동도금층에 동박층이 적층된 합성수지부재에 전해도금법을 실시하여 상기 동박층에 금속막을 형성하는 단계;
f)합성수지부재 중 금속막이 형성되지 않은 영역의 잔존 동박층 및 동도금층을 박리하는 단계; 및
g)금속막이 부분적으로 입혀진 합성수지부재 표면에 마감처리도료를 도포한 후, 건조과정을 거쳐 마감재층을 형성하는 단계를 포함하는 금속막이 부분적으로 형성된 합성수지부재 제조방법.
a) preprocessing and preparing so as to form a fine roughness on the surface of the synthetic resin member in the designated form;
b) chemically plating the synthetic resin member prepared by preprocessing to form a copper plating layer on the surface of the synthetic resin member;
c) dividing a boundary of the synthetic resin member so that a region where a metal film is to be formed and a region where a metal film is not to be formed are separated;
d) copper plating is performed on a synthetic resin member having a boundary defined by a region where a metal film is to be formed and a region where a metal film is not to be formed to remove a copper plating layer in a region where a metal film is not to be formed, Stacking a copper foil layer on the surface;
e) forming a metal film on the copper foil layer by performing electrolytic plating on a synthetic resin member in which a copper foil layer is laminated on the copper plated layer in a region where the metal film is to be formed;
f) peeling the remaining copper foil layer and the copper plating layer in the region of the synthetic resin member where the metal film is not formed; And
g) applying a finishing paint on the surface of the synthetic resin part on which the metal film is partially applied, and then drying to form a finishing material layer.
청구항 1에 있어서,
상기 a)단계인 합성수지부재 표면에 전처리하여 준비하는 단계에서는,
상기 합성수지부재 표면에 전처리도료를 도포하여, 그 표면에 미세한 조도가 형성되도록 하거나, 또는 연마가공으로 합성수지부재 표면에 미세한 조도가 형성되도록 하는 금속막이 부분적으로 형성된 합성수지부재 제조방법.
The method according to claim 1,
In the step of preprocessing and preparing the surface of the synthetic resin member as the step a)
A method for manufacturing a synthetic resin member, comprising the steps of: applying a pretreatment paint on a surface of the synthetic resin member to form a fine roughness on the surface thereof; or partially forming a metal film on a surface of the synthetic resin member by polishing.
청구항 1에 있어서,
상기 c)단계인 금속막이 형성될 영역과, 금속막이 형성되지 않을 영역이 구분되도록 경계를 구획하는 단계에서는,
동도금층을 라인 형태로 제거하여 경계를 구획하는 금속막이 부분적으로 형성된 합성수지부재 제조방법.
The method according to claim 1,
In the step of dividing the boundary between the region where the metal film is to be formed and the region where the metal film is not formed,
A method for manufacturing a synthetic resin member in which a metal film for partitioning a boundary is partially formed by removing a copper plating layer in a line form.
청구항 1에 있어서,
상기 f)단계인 금속막이 형성되지 않은 영역의 동박층 및 동도금층을 박리하는 단계에서는,
물 50~70%, 질산 30~50%로 혼합되고, 수온이 30~50℃로 유지되는 박리용액이 수용된 욕조에 금속막이 부분적으로 형성된 합성수지부재를 지그에 거치한 후 침지하여 박리하는 금속막이 부분적으로 형성된 합성수지부재 제조방법.
The method according to claim 1,
In the step of peeling the copper foil layer and the copper plating layer in the region where the metal film is not formed, which is the step f)
A synthetic resin member in which a metal film is partially formed in a bath containing a peeling solution which is mixed with 50 to 70% of water and 30 to 50% of water and the water temperature is maintained at 30 to 50 ° C is immersed in a jig, Wherein the synthetic resin member is formed of a synthetic resin.
KR1020150175930A 2015-12-10 2015-12-10 Resin member is formed in metal surface synthetic part production method KR101639219B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020150175930A KR101639219B1 (en) 2015-12-10 2015-12-10 Resin member is formed in metal surface synthetic part production method
PCT/KR2016/011991 WO2017099349A1 (en) 2015-12-10 2016-10-25 Method for manufacturing synthetic resin member with metal film partially formed thereon

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150175930A KR101639219B1 (en) 2015-12-10 2015-12-10 Resin member is formed in metal surface synthetic part production method

Publications (1)

Publication Number Publication Date
KR101639219B1 true KR101639219B1 (en) 2016-07-13

Family

ID=56505754

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150175930A KR101639219B1 (en) 2015-12-10 2015-12-10 Resin member is formed in metal surface synthetic part production method

Country Status (2)

Country Link
KR (1) KR101639219B1 (en)
WO (1) WO2017099349A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11017930B2 (en) 2018-02-08 2021-05-25 Samsung Electro-Mechanics Co., Ltd. Inductor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0565687A (en) * 1991-09-05 1993-03-19 Tsukada Riken Kogyo Kk Method for partially plating plastic molded body
KR100516682B1 (en) * 2004-06-16 2005-09-22 김진수 A method of partially transmitted light plating for polycarbonate constituted resin using the laser engraving
KR100844584B1 (en) * 2008-01-29 2008-07-09 양주동 Production method of intenna
KR20150086811A (en) * 2014-01-20 2015-07-29 주식회사 부광피엘 Method for metal plating on synthetic resin product

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100731813B1 (en) * 2006-02-14 2007-06-25 김영자 A plating way to improve a characteristic of the engineering plastic face

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0565687A (en) * 1991-09-05 1993-03-19 Tsukada Riken Kogyo Kk Method for partially plating plastic molded body
KR100516682B1 (en) * 2004-06-16 2005-09-22 김진수 A method of partially transmitted light plating for polycarbonate constituted resin using the laser engraving
KR100844584B1 (en) * 2008-01-29 2008-07-09 양주동 Production method of intenna
KR20150086811A (en) * 2014-01-20 2015-07-29 주식회사 부광피엘 Method for metal plating on synthetic resin product

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11017930B2 (en) 2018-02-08 2021-05-25 Samsung Electro-Mechanics Co., Ltd. Inductor

Also Published As

Publication number Publication date
WO2017099349A1 (en) 2017-06-15

Similar Documents

Publication Publication Date Title
US20100068465A1 (en) Housing and method for making the housing
US20110048754A1 (en) Housing for electronic device and method for making the same
US4774122A (en) Resinous product provided with surface coatable with metal layer bonded through an array of microdendrites and metal-clad resinous product thereof
Khan et al. Optimizing surface texture and coating thickness of nickel coated ABS-3D parts
CN105141725A (en) Method for manufacturing mobile phone middle frame and structure of mobile phone middle frame
US3661538A (en) Plastics materials having electrodeposited metal coatings
WO2008091328A1 (en) Second surface metallization
JP2002241988A (en) Method for producing plated molding
KR101639219B1 (en) Resin member is formed in metal surface synthetic part production method
US20090255823A1 (en) Method for electroplating a plastic substrate
EP2305449B1 (en) Porous electroformed shell for patterning and manufacturing method thereof
CN106521591A (en) Nickel plating method for plastic for automobiles
US9074293B2 (en) Porous electroformed shell for patterning and manufacturing method thereof
KR100996655B1 (en) Method of manufacturing a holey electroformed shell for patterning
KR101587402B1 (en) Resin frame is formed in metal surface synthetic part production method
EP2405033B1 (en) Porous electroformed shell for patterning and manufacturing method thereof
CN102312256B (en) Multi-hole electroformed sheath and manufacturing method thereof used for forming grain patterns
KR102154931B1 (en) Emblem electroforming method and emblem manufactured by thr same
JP5627177B2 (en) How to create a metal design mockup and metal design mockup
JP2000212792A (en) Production of partially plated plastic molding
KR102375837B1 (en) Method for manufacturing the glossy and matte emblem and glossy and matte produced by the same
US20230242049A1 (en) Decorative automotive component having multiple electrical current pathways and different surface finishes
JPH02225688A (en) Production of electroformed die
JPH0133560B2 (en)
JPH0734286A (en) Production of electroforming having microhole

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant