KR100731813B1 - A plating way to improve a characteristic of the engineering plastic face - Google Patents

A plating way to improve a characteristic of the engineering plastic face Download PDF

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KR100731813B1
KR100731813B1 KR1020060014231A KR20060014231A KR100731813B1 KR 100731813 B1 KR100731813 B1 KR 100731813B1 KR 1020060014231 A KR1020060014231 A KR 1020060014231A KR 20060014231 A KR20060014231 A KR 20060014231A KR 100731813 B1 KR100731813 B1 KR 100731813B1
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engineering plastic
plastic resin
plating
vol
water
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김영자
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김영자
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    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • C25D5/56Electroplating of non-metallic surfaces of plastics
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • C23C18/1639Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641Organic substrates, e.g. resin, plastic
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1653Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22Roughening, e.g. by etching
    • C23C18/24Roughening, e.g. by etching using acid aqueous solutions
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/285Sensitising or activating with tin based compound or composition
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/04Electroplating: Baths therefor from solutions of chromium
    • C25D3/08Deposition of black chromium, e.g. hexavalent chromium, CrVI
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    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
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    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
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    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • C25D5/12Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
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    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

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  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
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  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

A plating method for improving surface characteristics of an engineering plastic resin is provided to obtain a beautiful external form and an electro-magnetic shielding effect by performing plating of an engineering plastic resin excluding ABS and ABS-containing resin by both electroless plating method and electroplating method. A plating method for improving surface characteristics of an engineering plastic resin comprises: an ultrasonic electrolytic degreasing step of removing alien substances covered on the surface of the engineering plastic resin; a solvent treating step of coating the engineering plastic resin passing through the ultrasonic electrolytic degreasing step with the diluted paint after diluting using a diluent a paint obtained by injecting MEK(methyl ethyl ketone), DMF(N,N-dimethyl formamide), XY(xylene), IPA(isopropyl alcohol) and BC(butyl cellosolve) into an agitator, thereby dissolving and liquefying the materials; an electroless-plating step of performing plating of the solvent treated engineering plastic resin, thereby forming a conductive coating film on a surface of the solvent treated engineering plastic resin to enable electroplating to be performed on the electroless-plated engineering plastic resin; an electroplating step of performing plating of the engineering plastic resin passing through the electroless-plating step to impart a peculiar gloss or matt effect of metal itself to the engineering plastic resin and increase corrosion resistance and wear resistance of the engineering plastic resin; and a cleaning and drying step of removing harmful substances of the electroplated engineering plastic resin and drying the harmful substance-removed engineering plastic resin.

Description

엔지니어링 플라스틱 수지의 표면특성 개선을 위한 도금방법{A plating way to improve a characteristic of the engineering plastic face}A plating way to improve a characteristic of the engineering plastic face}

도 1 은 본 발명에 의한 엔지니어링 플라스틱 수지의 도막을 샌드페이퍼로 마모시험한 결과를 나타낸 예시도,1 is an exemplary view showing a result of abrasion test of the coating film of the engineering plastic resin according to the present invention with sandpaper,

도 2 는 본 발명에 의한 엔지니어링 플라스틱 수지의 도막을 지우개로 마모시험한 결과를 나타낸 예시도,Figure 2 is an exemplary view showing a result of the wear test of the coating film of the engineering plastic resin according to the present invention with an eraser,

도 3 은 본 발명의 의한 엔지니어링 플라스틱 수지의 도막을 밀착시험한 결과를 나타낸 예시도,3 is an exemplary view showing a result of closely testing a coating film of an engineering plastic resin according to the present invention;

도 4 는 본 발명에 의한 엔지니어링 플라스틱 수지의 도막의 내구성을 시험한 결과를 나타낸 예시도,4 is an exemplary view showing a result of testing the durability of the coating film of the engineering plastic resin according to the present invention;

본 발명은 엔지니어링 플라스틱 수지의 표면특성 개선을 위한 도금방법에 관한 것으로, 보다 상세하게는 ABS 및 ABS가 다량 함유된 수지제품을 제외한 엔지니어링 플라스틱에 금속을 도금할 경우, 수지에 대한 금속 도금의 접착성을 향상시 켜 수지제품의 완전한 피복을 제공할 수 있도록 무전해 도금방법 및 전기 도금방법을 함께 사용하여 수지 표면특성 개선 및 전자파 차폐가 가능하도록 하는 엔지니어링 플라스틱 수지의 표면특성 개선을 위한 도금방법을 제공하는 것이다.The present invention relates to a plating method for improving the surface properties of an engineering plastic resin, and more particularly, in the case of plating metal on engineering plastics except for resin products containing a large amount of ABS and ABS, the adhesion of metal plating to the resin It provides a plating method for improving the surface properties of engineering plastic resins to improve the surface properties of the resin and shield electromagnetic waves by using electroless plating methods and electroplating methods together to provide a complete coating of resin products. It is.

일반적으로 플라스틱 부분의 금속 도금은 플라시특과 금속 모두의 바람직한 특성이 결합되어 각각의 기술상의 장점과 심미적 장점을 제공하기 때문에 상업적인 측면에서 상당히 중요한 것으로 알려져 있다.In general, metal plating of plastic parts is known to be of significant commercial importance because the desirable properties of both the placemat and the metal combine to provide the respective technical and aesthetic advantages.

따라서 플라스틱을 광택이 있는 금속성 표면처리로 도금하는 것은, 성형된 플라스틱을 금속으로 대체하는 것보다 비용과 중량에 있어서 경제적이며, 부가적으로 도금된 표면 처리 부분은 플라스틱 기판과 도금된 금속 사이에서 전지반응(palvanic reaction)이 일어나지 않기 때문에, 점식작용(pitting)과 부식작용(corrosion)을 받지 않는다.Therefore, plating plastics with a shiny metallic surface treatment is more economical in terms of cost and weight than replacing molded plastics with metals, and additionally, the plated surface treatments may be applied between the plastic substrate and the plated metal. It does not undergo pitting and corrosion because no pavanic reaction occurs.

플라스틱 도금시의 플라스틱에 대한 금속 도금의 접착성을 개선하기 위해서 많은 방법이 개발되었고, 이들 방법에서는 일반적으로 도금하기 전에 용매를 사용하여 플라스틱을 팽윤시키고 상태를 조절한 다음, 산화제를 사용하여 플라스틱의 표면을 에칭 시키는 표면가공 공정이 필요하게 되는데, 종래에는 표면가공이 용이한 ABS 성분이 다량 함유된 복합수지 제품에 한하여 행하여져 왔다. Many methods have been developed to improve the adhesion of metal plating to plastics during plastic plating, and these methods generally use solvents to swell and condition the plastics before plating and then use oxidants to There is a need for a surface processing step of etching the surface, which has been conventionally performed only for a composite resin product containing a large amount of an ABS component that is easily surface-processed.

그러나, ABS는 열에 약하다는 문제점이 있어, 상기 ABS와는 달리 내후성 및 기계의 강할 뿐만 아니라 내충격성까지 갖추고 있는 엔지니어링 프리스틱의 사용이 확대되고 있다. However, ABS has a problem in that it is weak in heat, and unlike ABS, the use of engineering presticks having not only weather resistance and mechanical strength but also impact resistance is expanding.

또한, 플라스틱 도금시의 문제점은 기존의 무전해 도금방법으로는 ABS 및 ABS를 다량 함유된 수지를 제외하고는 금속 도금의 접착성이 떨어지거나, 수지의 평활한 피복 및 사실상 완전한 피복을 제공하는데 어려움이 있다는 것이다.In addition, the problem of plastic plating is that the existing electroless plating method is difficult to provide a smooth coating and virtually perfect coating of the metal plating, except the ABS and the resin containing a large amount of ABS. Is that there is.

본 발명은 상기와 같은 종래의 문제점을 해결하기 위하여 제안한 것으로, 그 목적은 ABS 및 ABS성분을 제외한 엔지니어링 플라스틱수지에 대한 금속 도금의 접착성을 향상시키고, 수지제품의 완전한 피복을 제공할 수 있도록 무전해 도금방법 및 전기도금 방법을 함께 사용하여 미려한 외관과 전자파 차폐효과를 가능하도록 하는 엔지니어링 플라스틱 수지의 표면특성 개선을 위한 도금방법을 제공함을 목적으로 한다.The present invention has been proposed to solve the conventional problems as described above, the object of which is to improve the adhesion of metal plating to engineering plastic resin except ABS and ABS components, and to provide a complete coating of resin products It is an object of the present invention to provide a plating method for improving the surface characteristics of an engineering plastic resin using a sea plating method and an electroplating method to enable a beautiful appearance and electromagnetic shielding effect.

상기한 바와 같은 목적을 달성하고 종래의 문제점을 해결하기 위한 본 발명은 ABS 및 ABS가 다량 함유되어 있는 수지를 제외한 엔지니어링 플라스틱 수지 제품의 표면 특성을 개선하기 위한 것으로, 알콜을 이용하여 상기 엔지니어링 플라스틱 수지 표면에 묻은 오염물, 지문, 유지분 등의 이물질을 제거하는 초음파 전해 탈지 단계와, 상기 이물질이 제거된 엔지니어링 플라스틱 수지에 희석재에 의해 희석된 도료를 도포하여 도금이 이루어질 수 있는 표면 상태를 유지할 수 있도록 하는 용제처리단계와, 상기 용제처리된 엔지니어링 플라스틱 수지의 표면에 전도성 피막이 형성되도록 도금하여 전기도금이 가능하도록 하는 무전해도금단계, 상기 무전해도금단계의 엔지니어링 플라스틱 수지에 금속 특유의 광택 또는 무광택을 부여하고 내식성 및 내마모성이 증가되도록 도금하는 전기도금단계, 상기 전기도금된 엔지니어링 플라스틱 수지의 유해물질을 제거하고 건조시켜주는 세척 및 건조단계로 이루어진다.The present invention for achieving the object as described above and to solve the conventional problems is to improve the surface properties of engineering plastic resin products except ABS and a resin containing a large amount of ABS, using the engineering plastic resin Ultrasonic electrolytic degreasing step to remove foreign substances such as contaminants, fingerprints, oils and fats on the surface, and to maintain the surface state that can be plated by applying a paint diluted with a diluent to the engineering plastic resin from which the foreign substances were removed Solvent treatment step, and the electroless plating step so that the electroplating is possible by plating so that a conductive film is formed on the surface of the solvent-treated engineering plastic resin, the electroless plating step of the engineering plastic resin of the metal-specific gloss or matte Endowed with corrosion resistance and abrasion Composed of a washing and drying steps that by electroplating step of coating so that the property is increased, the removal of harmful substances in the electroplated engineering plastic resin and dried.

상기 엔지니어링 플라스틱 수지 표면의 이물질을 알콜을 이용하여 제거해 줌으로서 용제처리단계의 도료의 도포효과가 매우 뛰어나게 되는 것이다.By removing the foreign substances on the surface of the engineering plastic resin using alcohol, the coating effect of the solvent treatment step is very excellent.

한편 상기 용제처리단계는 상기 초음파 전해 탈지 단계를 거친 엔지니어링 플라스틱 수지에 MEK(Methyl Ethyl Ketone:메틸에틸케톤), DMF(N.N-Dimethly Formamide:디메틸포름아미드), XY(Xylnen:자일렌), IPA(Iso-Prapyl Alcohol:이소프라필알콜), BC(Butyl Cellosolve:부틸 셀로솔브)를 함께 교반기에 넣고 용해하여 액상화 시킨 도료를 희석재로 희석하여 도포하는 것이다.Meanwhile, the solvent treatment step includes MEK (Methyl Ethyl Ketone: Methyl Ethyl Ketone), DMF (NN-Dimethly Formamide), XY (Xylnen: Xylene), and IPA Iso-Prapyl Alcohol (isoprafil alcohol) and BC (Butyl Cellosolve: butyl cellosolve) are put together in a stirrer to dissolve and liquefy the paint with diluent.

이때 상기 도료는 MEK 30~35wt%, DMF 42~47wt%, XY 12~15wt%, IPA 2~5wt%, BC 2~5wt%로 이루어져 있으며 상기 교반기에 2시간 동안 혼합 용해하여 액상화 시킨 후 희석재로 희석하여 엔지니어링 플라스틱 수지에 도포하게 되며, 상기와 같은 비율로 혼합됨으로써 표면소재와 도금시 밀착력이 향상되는 것이다.At this time, the paint is composed of MEK 30 ~ 35wt%, DMF 42 ~ 47wt%, XY 12 ~ 15wt%, IPA 2 ~ 5wt%, BC 2 ~ 5wt% and mixed and dissolved in the stirrer for 2 hours to liquefy the diluent Diluted to apply to the engineering plastic resin, by mixing in the above ratio is to improve the adhesion between the surface material and the plating.

한편 상기 무전해도금단계는, 용제처리된 엔지니어링 플라스틱을 산화크롬과 황산이 혼합된 처리액에 침지하였다가 수세하여 도금막이 강한 밀착력을 갖도록 에칭하는 에칭 단계와, 상기 에칭된 엔지니어링 플라스틱 수지를 10%농도로 혼합되고 25~35℃를 유지하는 염산에 30~60초 동안 침지하였다가 수세하여 상기 산화크롬과 황산을 중화처리하여 무전해 도금시 미도금 현상을 방지하는 중화단계와, 상기 중화처리된 엔지니어링 플라스틱 수지를 주석(Sn)과 파라듐염이 10:1로 혼합된 촉매와 염산을 혼합한 처리액에 1~3분간 침지하였다가 수세하여 촉매층을 형성하는 제1활성단계와, 상기 제1활성단계의 엔지니어링 플라스틱 수지를 황산용액에 1~3분간 침지하였다가 수세한 후 수산화나트륨용액에서 다시 30초간 침지하였다가 수세하여 촉매층에 활성을 주어 화학도금의 석출이 가능하도록 하는 제2활성단계와, 상기 활성단계를 거친 엔지니어링 플라스틱 수지를 화학니켈 도금액에 침지하였다가 수세하여 전도성피막을 형성시켜주는 하지니켈도금단계로 로 이루어진 진다. On the other hand, the electroless plating step, the etching step of immersing the solvent-treated engineering plastics in the treatment solution mixed with chromium oxide and sulfuric acid and washed with water to etch the plating film has a strong adhesion, and the etched engineering plastic resin 10% A neutralization step of immersing in hydrochloric acid mixed at a concentration and maintaining at 25 to 35 ° C. for 30 to 60 seconds, followed by washing with water to neutralize the chromium oxide and sulfuric acid to prevent unplating during electroless plating; A first active step of immersing the engineering plastic resin in a treatment solution in which a tin (Sn) and a paradium salt are mixed in a 10: 1 mixture with a catalyst and hydrochloric acid for 1 to 3 minutes, followed by washing with water to form a catalyst layer; The engineering plastic resin in the active stage was immersed in sulfuric acid solution for 1 to 3 minutes, washed with water, and then immersed in sodium hydroxide solution for 30 seconds, and washed with water to activate the catalyst layer. It is composed of a second active step to enable the precipitation of the chemical plating, and a nickel plating step of immersing the engineering plastic resin passed through the active step in the chemical nickel plating solution and washing it with water to form a conductive film.

여기서 상기 에칭단계의 처리액은 산화크롬(Cr03)55~60vol%와 황산(H2SO4)15~25vol% 가 혼합되고 나머지는 물로 이루어져 있으며, 상기 처리액이 65~75℃인 상태에서 상기 엔지니어링 플라스틱 수지를 5~30초 동안 침지하였다 수세함으로서 도금막이 수지에 강한 밀착력을 갖도록 하는 것이다.Here, the treatment solution of the etching step is chromium oxide (Cr0 3 ) 55 ~ 60vol% and sulfuric acid (H 2 SO 4 ) 15 ~ 25vol% is mixed and the remainder is made of water, while the treatment solution is 65 ~ 75 ℃ The engineering plastic resin is immersed for 5 to 30 seconds and washed with water to make the plated film have a strong adhesion to the resin.

상기 제1활성단계의 처리액은 촉매(catalyst) 7.5vol%와, 염산(HCL)10vol% 가 혼합되고 나머지는 물로 이루어지며, 상기 엔지니어링 플라스틱 수지를 20~30℃로 유지되는 제1활성단계의 처리액에 1~3분간 침지하였다가 수세함으로써 엔지니어링 플라스틱 표면상에 촉매를 석출시켜 엔지니어링 플라스틱 표면이 활성화 되어 무전해 도금 막을 형성시켜 주는 것이다.The treatment liquid of the first active step is a mixture of 7.5vol% of catalyst (catalyst), 10vol% hydrochloric acid (HCL) and the rest is made of water, the first active step of maintaining the engineering plastic resin at 20 ~ 30 ℃ It is immersed in the treatment solution for 1 to 3 minutes and washed with water to precipitate a catalyst on the surface of the engineering plastic to activate the surface of the engineering plastic to form an electroless plating film.

여기서 상기 촉매는 주석(Sn)과 파라듐염이 10:1로 혼합되어 이루어진다. Here, the catalyst is a mixture of tin (Sn) and palladium salt in 10: 1.

또한 상기 제2활성단계에서 황산(H2SO4)용액은 15%의 농도로서 40~50℃의 온 도를 유지하도록 제공되며, 상기 수산화나트륨(NaOH)용액은 10%의 농도로서 40~50℃의 온도를 유지하도록 제공된다.In the second active step, sulfuric acid (H 2 SO 4 ) solution is provided to maintain a temperature of 40 ~ 50 ℃ as a concentration of 15%, the sodium hydroxide (NaOH) solution is 40 ~ 50 as a concentration of 10% To maintain a temperature of < RTI ID = 0.0 >

이와 같이 황산용액과 수산화나트륨용액에 침지시켰다가 수세함으로서 엔지니어링플라스틱 수지의 표면에 형성된 촉매층에 활성을 주어 화학도금의 석출을 가능하게 하는 것이다.By immersing in a sulfuric acid solution and sodium hydroxide solution and washing with water, it is activated to the catalyst layer formed on the surface of the engineering plastic resin to enable the deposition of chemical plating.

또한 상기 하지니켈도금단계는 25~30℃의 화학니켈도금액에 5~8분간 침지하였다가 수세하는 것으로 엔지니어링 플라스틱 수지의 표면상에 전도성 피막을 생성시켜 전기 도금을 가능하게 하고 안정적인 금속피막을 입히기 위하여 실시하는 것으로, 상기 화학니켈도금액은 니켈도금액 20vol% 나머지는 물로 이루어진다.In addition, the lower nickel plating step is immersed in a chemical nickel plating solution of 25 ~ 30 ℃ 5 to 8 minutes and then washed with water to create a conductive film on the surface of the engineering plastic resin to enable electroplating and to coat a stable metal film In order to perform, the chemical nickel plating solution is made of 20vol% nickel plating solution the rest.

한편 상기 전기도금단계는, 무전해도금단계의 엔지니어링 플라스틱 수지의 표면에 유산동을 전기도금하여 연성과 밀착성 및 광택이 나도록 하는 유산동단계, 상기 유산동단계의 엔지니어링 플라스틱 수지에 니켈을 주 원료로 하는 처리액을 소정의 전류밀도로 도금하여 광택 또는 무광택이 나도록 하며 스크래치에 대한 저항력을 높이고 내식성이 제공되도록 하는 전기니켈도금단계, 상기 전기니켈도금단계의 엔지니어링 플라스틱 수지에 니켈도금 피막이 변색되는 것을 방지하도록 크롬을 주원료로 하는 처리액을 소정의 전류밀도로 도금하여 내마모성을 제공하는 크롬도금 단계로 이루어진다.On the other hand, the electroplating step, the electrolytic plating step of the electrolytic copper on the surface of the engineering plastic resin of the electroless plating step to ductility, adhesion and gloss, the treatment liquid containing nickel as the main raw material in the engineering plastic resin of the lactic acid copper step Chromium to prevent the nickel plating film from discoloring in the engineering plastic resin of the electronickel plating step, which is coated with a predetermined current density to make it glossy or matte, increase scratch resistance, and provide corrosion resistance. A chromium plating step of providing a wear resistance by plating a treatment liquid as a main raw material at a predetermined current density.

상기 유산동단계는, 상기 엔지니어링 플라스틱 수지에 황산동(CuSO4ㆍ5H2O) 20vol%, 황산(H2SO4) 6vol%, 동도금 광택제 0.1vol%, 건축용 광택제1vol% 가 혼합되 고 나머지는 물로 이루어진 처리액에 전류밀도 3~4A/dm2 ,온도20~30℃의 조건에서 10~20분 동안 침지하였다가 수세하는 것이다.In the copper lactate step, copper sulfate (CuSO 4 ㆍ 5H 2 O) 20vol%, sulfuric acid (H 2 SO 4 ) 6vol%, copper plating polisher 0.1vol%, building polisher 1vol% is mixed with the rest of the engineering plastic resin It is immersed in the treatment liquid for 10 to 20 minutes under conditions of current density of 3 to 4 A / dm 2 and a temperature of 20 to 30 ° C, followed by washing with water.

상기와 같이 유산동을 도금함으로써 엔지니어링 플라스틱 표면이 연성과 밀착성을 갖게 되며 밝은 광택이 나게 되며 전자파가 차폐되는 것이다.By plating copper lactic acid as described above, the surface of the engineering plastic has ductility and adhesion, bright gloss and electromagnetic waves are shielded.

상기 전기니켈(Ni)도금단계는 상기 유산동도금단계를 거친 엔지니어링 플라스틱 수지를 황산니켈(NiSO4ㆍ6H2O)24~32vol%, 염화니켈(NiCL2ㆍ6H2O)4~5vol%, 붕산(3BO3)3~5vol%, 광택제0.32~0.55vol%가 혼합되고 나머지가 물로 이루어진 처리액에서 전류밀도 4~5A/dm2 , 온도 50~55℃의 조건으로 5~15분 동안 침지하였다가 수세하는 것으로 이루어진다.The electro-nickel (Ni) plating step is an engineering plastic resin subjected to the lactic acid copper plating step nickel sulfate (NiSO 4 ㆍ 6H 2 O) 24 ~ 32vol%, nickel chloride (NiCL 2 ㆍ 6H 2 O) 4 ~ 5vol%, boric acid (3BO 3 ) 3 to 5 vol%, polish agent 0.32 to 0.55 vol% is mixed and the remainder is immersed for 5 to 15 minutes under the condition of current density 4 ~ 5A / dm 2 , temperature 50 ~ 55 ℃ in water treatment solution It consists of washing with water.

또한 상기 전기니켈(Ni)도금단계는, 상기 유산동도금단계를 거친 엔지니어링 플라스틱 수지를 황산니켈(NiSO4ㆍ6H2O)46~50vol%, 염화니켈(NiCL2ㆍ6H2O)2.5~4.0vol%, 붕산(3BO3)3.7~4.5vol%, 광택제2.1~3.1vol%가 혼합되고 나머지는 물로 이루어진 처리액에서 전류밀도 3~5A/dm2 , 온도50~55℃의 조건에서 5~10분 동안 침지하였다가 수세하는 것으로 이루어진다.In addition, the electroplating (Ni) plating step, the engineering plastic resin subjected to the lactic acid copper plating step of nickel sulfate (NiSO 4 ㆍ 6H 2 O) 46 ~ 50vol%, nickel chloride (NiCL 2 · 6H 2 O) 2.5 ~ 4.0vol %, Boric acid (3BO 3 ) 3.7 ~ 4.5vol%, polisher 2.1 ~ 3.1vol% are mixed and the remainder is 5 ~ 10 minutes under the condition of current density 3 ~ 5A / dm 2 , temperature 50 ~ 55 ℃ Soaking and then rinsing.

이와 같이 유산동 도금이 완료된 엔지니어링 플라스틱 수지에 전기니켈도금을 완료함으로서 플라스틱 수지 제품에 장식의 효과를 나타낼 수 있으며, 또한 무광택 도금을 하게 되면 제품을 손으로 만졌을 경우 지문이 남는 것을 방지하고 스크레치도 방지할 수 있게 되는 것이다.Thus, by completing the electro-nickel plating on the engineering plastic resin completed with lactic acid copper plating, the decorative effect on the plastic resin product can be exhibited. Also, the matte plating prevents fingerprints and scratches when the product is touched by hand. It will be possible.

한편 상기 크롬도금단계는 상기 전기니켈도금단계의 엔지니어링 플라스틱 수지를 산화크롬(CrO3)20~30vol%, 황산(H2SO4)0.07~0.15vol% 가 혼합되고 나머지는 물로 이루어진 처리액에서 전류밀도8~32A/dm2 , 온도 38~52℃의 조건에서 2~5분 동안 침지하였다가 수세하여 구성되며, 크롬을 도금함으로써 엔지니어링 플라스틱 수지 표면에 내마모성을 부여하며 크롬 금속 특유의 광택을 부여하게 되는 것이다.In the chromium plating step, chromium oxide (CrO 3 ) 20 to 30 vol% and sulfuric acid (H 2 SO 4 ) 0.07 to 0.15 vol% are mixed with the engineering plastic resin of the electronickel plating step, and the remainder is a current in a treatment liquid made of water. It is composed by immersing for 2 ~ 5 minutes in the condition of density of 8 ~ 32A / dm 2 and temperature of 38 ~ 52 ℃ and washing with water.The chromium plating gives abrasion resistance to the surface of engineering plastic resin and gives chrome metal luster. Will be.

한편 상기 세척 및 건조단계는 상기 엔지니어링 플라스틱 수지의 산화크롬을 완전히 제거하기 위하여 20~30℃의 100%의 순수한 물(H20)에서 1~2분간 침지하였다가 수세하여 세척하고, 이렇게 세척된 엔지니어링 플라스틱 수지의 수분을 완전히 제거할 수 있도록 원형 탈수하여 건조함으로써 완료된다.On the other hand, the washing and drying step is immersed for 1 to 2 minutes in 100% pure water (H 2 0) of 20 ~ 30 ℃ in order to completely remove the chromium oxide of the engineering plastic resin and washed by washing with water, It is completed by circular dehydration and drying to completely remove the moisture of the engineering plastic resin.

상기와 같은 공정으로 도금이 완료된 엔지니어링 플라스틱 수지의 도금막에 대한 마모, 밀착, 내구성에 대한 시험을 실시예을 통해 설명하면 다음과 같다.Referring to the test for the wear, adhesion, durability of the plating film of the engineering plastic resin plating is completed as described above through the embodiment as follows.

<실시예 1><Example 1>

도 1 에서와 같이 도금이 완료된 엔지니어링 플라스틱 수지의 도막을 800Cw의 샌드페이퍼를 이용하여 500g/cm2의 하중으로 130회 마모시험을 하였으며, 이때의 도막 두께는 니켈 13.04㎛, 크롬 0.34㎛ 이다.As shown in FIG. 1, the coating film of the engineering plastic resin completed with plating was subjected to abrasion test 130 times with a load of 500 g / cm 2 using 800 Cw sand paper, and the thickness of the coating film was 13.04 μm in nickel and 0.34 μm in chromium.

상기와 같은 조건으로 마모시험을 수행한 마모시험 후에도 엔지니어링 플라 스틱의 수지층이 나타나지 않았다.The resin layer of the engineering plastic did not appear even after the abrasion test was performed under the above conditions.

<실시예 2><Example 2>

도 2 에서와 같이 도금이 완료된 엔지니어링 플라스틱 수지의 도막을 지우개를 이용하여 500g/cm2의 하중으로 200회 마모시험을 하였으며, 이때의 도막 두께는 니켈 13.04㎛, 크롬 0.34㎛ 이다.As shown in FIG. 2, 200 times of wear tests were performed using an eraser coated film of engineering plastic resin at a load of 500 g / cm 2 , and the thickness of the coating film was 13.04 μm in nickel and 0.34 μm in chromium.

상기와 같은 조건으로 마모시험을 수행한 결과 200회의 마모시험 후에도 엔지니어링 플라스틱의 수지층이 나타나지 않았다.As a result of performing the abrasion test under the above conditions, the resin layer of the engineering plastic did not appear even after 200 abrasion tests.

<실시예 3><Example 3>

도 3 에서와 같이 도금이 완료된 엔지니어링 플라스틱 수지의 도막 2mm 간격의 바둑판 모양의 형상을 만든 후 데이프를 이용하여 잡아당겼으나 박리현상이 없었다.As shown in FIG. 3, the plated shape of the engineering plastic resin plated as shown in FIG. 3 was pulled using a tape, but there was no peeling phenomenon.

<실시예 4><Example 4>

도 4 에서와 같이 도금이 완료된 엔지니어링 플라스틱 수지의 도막에 금속재질을 이용하여 스크레치를 형성한 후 손을 이용하여 2~3회 문질러 복원력을 확인하였으며, 이때의 도막 두께는 니켈 13.04㎛, 크롬 0.34㎛ 이다.As shown in FIG. 4, after forming a scratch using a metal material on the coating film of the engineering plastic resin completed with plating, the restoring force was confirmed by rubbing two or three times using a hand. The thickness of the coating film was 13.04 μm in nickel and 0.34 μm in chrome. to be.

상기와 같은 조건으로 내구성을 시험한 결과 스크레치된 부분이 복원되었다.The durability test was performed under the above conditions, and the scratched part was restored.

본 발명은 상술한 특정의 바람직한 실시예에 한정되지 아니하며, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 기술분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형실시가 가능한 것은 물론이고, 그와 같은 변경은 청구범위 기재의 범위 내에 있게 된다.The present invention is not limited to the above-described specific preferred embodiments, and various modifications can be made by any person having ordinary skill in the art without departing from the gist of the present invention claimed in the claims. Of course, such changes will fall within the scope of the claims.

상기와 같은 구성 및 작용에 의해 기대할 수 있는 본 발명의 효과는, ABS 및 ABS를 다량함유한 수지를 제외한 엔지니어링 플라스틱 수지 제품인 PDA, 핸드폰, 노트북 등이 표면에 무전해도금 공정을 거친 후 니켈 및 크롬을 전기 도금방법으로 도금함으로써 제품의 외부표면을 광택이나 무광택으로 장식하는 효과를 나타낼 수 있으며, 표면강도가 뛰어나고, 내마모성, 내열성이 향상되어 수지표면이 개선될 뿐만 아니라 전자파가 차폐되도록 하는 매우 유용한 발명이다.The effect of the present invention can be expected by the configuration and action as described above, after the electroless plating process on the surface of the PDA, mobile phone, notebook, etc., engineering plastic resin products except ABS and ABS-rich resin, nickel and chromium It is possible to show the effect of decorating the outer surface of the product with a gloss or matte by electroplating method, and excellent surface strength, wear resistance, heat resistance is improved not only to improve the resin surface but also to shield electromagnetic waves to be.

Claims (12)

ABS 및 ABS를 다량으로 함유하는 수지를 제외한 엔지니어링 플라스틱 수지를 도금함에 있어서,In plating engineering plastic resins except for resins containing a large amount of ABS and ABS, 상기 엔지니어링 플라스틱 수지의 표면에 묻은 이물질을 제거하는 초음파 전해 탈지 단계와;An ultrasonic electrolytic degreasing step of removing foreign matter from the surface of the engineering plastic resin; 상기 초음파 전해 탈지 단계를 거친 엔지니어링 플라스틱 수지에 MEK(Methyl Ethyl Ketone:메틸에틸케톤), DMF(N.N-Dimethly Formamide:디메틸포름아미드), XY(Xylnen:자일렌), IPA(Iso-Prapyl Alcohol:이소프라필알콜), BC(Butyl Cellosolve:부틸 셀로솔브)를 함께 교반기에 넣고 용해하여 액상화 시킨 도료를 희석재로 희석하여 도포하는 용제처리단계;MEK (Methyl Ethyl Ketone), DMF (NN-Dimethly Formamide), XY (Xylnen: Xylene), and IPA (Iso-Prapyl Alcohol: Iso) in the engineering plastic resin Solvent processing step of diluting and applying a diluent material to the liquefied paint) and BC (Butyl Cellosolve: Butyl Cellosolve) together in a stirrer; 상기 용제처리된 엔지니어링 플라스틱 수지의 표면에 전도성 피막이 형성되도록 도금하여 전기도금이 가능하도록 하는 무전해도금단계;An electroless plating step of plating to form a conductive film on the surface of the solvent-treated engineering plastic resin to enable electroplating; 상기 무전해도금단계의 엔지니어링 플라스틱 수지에 금속 특유의 광택 또는 무광택을 부여하고 내식성 및 내마모성이 증가되도록 도금하는 전기도금단계;An electroplating step of imparting metal-specific gloss or matte to the engineering plastic resin of the electroless plating step and plating to increase corrosion resistance and abrasion resistance; 상기 전기도금된 엔지니어링 플라스틱 수지의 유해물질을 제거하고 건조시켜주는 세척 및 건조단계; 로 이루어진 것을 특징으로 하는 엔지니어링 플라스틱 수지의 표면특성 개선을 위한 도금방법.A washing and drying step of removing and drying the harmful substances of the electroplated engineering plastic resin; Plating method for improving the surface properties of the engineering plastic resin, characterized in that consisting of. 제 1 항에 있어서,The method of claim 1, 상기 용제처리단계의 도료는 MEK30~35wt%, DMF42~47wt%, XY12~15wt%, IPA2~5wt%, BC2~5wt%로 이루어진 것을 특징으로 하는 엔지니어링 플라스틱 수지의 표면특성 개선을 위한 도금방법.The coating method of the solvent treatment step is MEK30 ~ 35wt%, DMF42 ~ 47wt%, XY12 ~ 15wt%, IPA2 ~ 5wt%, BC2 ~ 5wt% Plating method for improving the surface properties of the engineering plastic resin. 제 1 항에 있어서,The method of claim 1, 상기 무전해도금단계는, 용제처리된 엔지니어링 플라스틱을 산화크롬과 황산이 혼합된 처리액에 5~30초 동안 침지하였다 수세하는 에칭 단계;The electroless plating step, the etching step of immersing the solvent-treated engineering plastics in the treatment solution mixed with chromium oxide and sulfuric acid for 5-30 seconds, washed with water; 상기 에칭된 엔지니어링 플라스틱 수지를 10%농도로 혼합되고 25~35℃를 유지하는 염산에 30~60초 동안 침지하였다가 수세하는 중화단계;A neutralization step of immersing the etched engineering plastic resin in a 10% concentration and immersing in hydrochloric acid maintaining 25 to 35 ° C. for 30 to 60 seconds and then washing with water; 상기 중화처리된 엔지니어링 플라스틱 수지를 주석(Sn)과 파라듐염이 10:1로 혼합되어 있는 촉매와 이 촉매에 염산을 혼합한 처리액에 1~3분간 침지하였다가 수세하여 촉매층을 형성하는 제1활성단계; The neutralized engineered plastic resin was immersed in a catalyst in which tin (Sn) and a paradium salt were mixed at 10: 1 and a treatment solution in which hydrochloric acid was mixed with the catalyst for 1 to 3 minutes, and washed with water to form a catalyst layer. 1 active step; 상기 제1활성단계의 엔지니어링 플라스틱 수지를 황산용액에 1~3분간 침지하였다가 수세한 후 수산화나트륨용액에서 다시 30초간 침지하였다가 수세하는 제2활성단계;A second active step of immersing the engineering plastic resin of the first active step in a sulfuric acid solution for 1 to 3 minutes and then rinsing in sodium hydroxide solution for 30 seconds and then washing with water; 상기 활성단계를 거친 엔지니어링 플라스틱 수지를 화학니켈도금액에 5~8분간 침지하였다가 수세하는 하지니켈도금단계; 로 이루어진 것을 특징으로 하는 엔지니어링 플라스틱 수지의 표면특성 개선을 위한 도금방법.Haji nickel plating step of immersing the engineering plastic resin passed through the active step in the chemical nickel plating solution for 5-8 minutes and washed with water; Plating method for improving the surface properties of the engineering plastic resin, characterized in that consisting of. 제 3 항에 있어서,The method of claim 3, wherein 상기 에칭단계의 처리액은 산화크롬(Cr03)55~60vol%와 황산(H2SO4)15~25vol% 혼합되고 나머지는 물로 이루어지고 65~75℃의 온도를 유지하는 것을 특징으로 하는 엔지니어링 플라스틱 수지의 표면특성 개선을 위한 도금방법. The treatment liquid of the etching step is mixed with chromium oxide (Cr0 3 ) 55 ~ 60vol% and sulfuric acid (H 2 SO 4 ) 15 ~ 25vol%, the remainder is made of water and engineering characterized in that to maintain a temperature of 65 ~ 75 ℃ Plating method for improving the surface properties of plastic resins. 제 3 항에 있어서,The method of claim 3, wherein 상기 제1활성단계의 처리액은 촉매 7.5 vol% 과, 염산10 vol% 및 나머지는 물로 이루어지며 20~30℃의 온도를 유지하는 것을 특징으로 하는 엔지니어링 플라스틱 수지의 표면특성 개선을 위한 도금방법.The treating solution of the first active step is 7.5 vol% of the catalyst, 10 vol% of hydrochloric acid and the rest is made of water, the plating method for improving the surface properties of the engineering plastic resin, characterized in that to maintain a temperature of 20 ~ 30 ℃. 제 3 항에 있어서,The method of claim 3, wherein 상기 제2활성단계의 황산용액은 15% 농도로 제공되고 40~50℃의 온도를 유지하며, 수산화나트륨용액은 10% 농도로 제공되고 40~50℃의 온도로 유지되는 것을 특징으로 하는 엔지니어링 플라스틱 수지의 표면특성 개선을 위한 도금방법.The sulfuric acid solution of the second active step is provided at a concentration of 15% and maintains a temperature of 40 ~ 50 ℃, sodium hydroxide solution is provided at a concentration of 10% and engineering plastics, characterized in that maintained at a temperature of 40 ~ 50 ℃ Plating method to improve the surface properties of the resin. 제 3 항에 있어서,The method of claim 3, wherein 상기 하지니켈도금단계의 화학니켈도금액은 니켈도금액 20vol%와 나머지는 물로 이루어지고 25~30℃의 온도를 유지하는 것을 특징으로 하는 엔지니어링 플라스틱 수지의 표면특성 개선을 위한 도금방법.The plating process for improving the surface properties of the engineering plastic resin, characterized in that the chemical nickel plating solution of the nickel plating step is made of 20vol% of nickel plating solution and the remainder of water and maintaining a temperature of 25 ~ 30 ℃. 제 1 항에 있어서,The method of claim 1, 상기 전기도금단계는, 무전해도금단계의 엔지니어링 플라스틱 수지의 표면에 유산동을 전기도금하는 유산동단계;The electroplating step, the lactic acid copper step of electroplating lactic acid copper on the surface of the engineering plastic resin of the electroless plating step; 상기 유산동단계의 엔지니어링 플라스틱 수지에 니켈을 주 원료로 하는 처리액을 도금하는 전기니켈도금단계;An electric nickel plating step of plating a processing liquid containing nickel as a main raw material on the engineering plastic resin of the copper lactate step; 상기 전기니켈도금단계의 엔지니어링 플라스틱 수지에 니켈도금 피막이 변색되는 것을 방지하도록 크롬을 주원료로 하는 처리액을 도금하는 크롬도금 단계; 로 이루어진 것을 특징으로 하는 엔지니어링 플라스틱 수지의 표면특성 개선을 위한 도금방법.A chromium plating step of plating a treatment liquid containing chromium as a main raw material to prevent discoloration of the nickel plating film on the engineering plastic resin of the electric nickel plating step; Plating method for improving the surface properties of the engineering plastic resin, characterized in that consisting of. 제 8 항에 있어서,The method of claim 8, 상기 유산동단계는, 상기 엔지니어링 플라스틱 수지를 황산동 20 vol%, 황산6 vol%, 동도금 광택제0.1 vol%, 건축용 광택제 1 vol% 가 혼합되고 나머지가 물로 이루어진 처리액에 전류밀도 3~4A/dm2 ,온도20~30℃의 조건에서 10~20분 동안 침지하였다가 수세하는 것을 특징으로 하는 엔지니어링 플라스틱 수지의 표면특성 개선을 위한 도금방법. In the copper lactate step, 20 vol% copper sulfate, 6 vol% sulfuric acid, 0.1 vol% copper plating polisher, and 1 vol% building glaze are mixed, and the current density is 3-4 A / dm 2 , Plating method for improving the surface properties of the engineering plastic resin, characterized in that immersed for 10 to 20 minutes in a condition of temperature 20 ~ 30 ℃ and washed with water. 제 8 항에 있어서,The method of claim 8, 상기 전기니켈도금단계는, 엔지니어링 플라스틱 수지를 황산니켈24~32 vol%, 염화니켈4~5vol%, 붕산3~5vol%, 광택제0.32~0.55vol% 가 혼합되고 나머지가 물로 이루어진 처리액에서 전류밀도 4~5A/dm2 , 온도 50~55℃의 조건으로 5~15분 동안 침지하였다가 수세하는 것을 특징으로 하는 엔지니어링 플라스틱 수지의 표면특성 개선을 위한 도금방법. In the electro-nickel plating step, the engineering plastic resin is mixed with nickel sulfate 24-32 vol%, nickel chloride 4-5 vol%, boric acid 3-5 vol%, polisher 0.32-0.55 vol%, and the remainder is a current density in a treatment liquid consisting of water. Plating method for improving the surface properties of the engineering plastic resin, characterized in that immersed for 5 to 15 minutes at a condition of 4 ~ 5A / dm 2 , temperature 50 ~ 55 ℃ and washed with water. 제 8 항에 있어서,The method of claim 8, 상기 전기니켈도금단계는, 엔지니어링 플라스틱 수지를 황산니켈46~50vol%, 염화니켈2.5~4vol%, 붕산3.7~4.5vol%, 광택제0.21~0.31vol% 가 혼합되고 나머지가 물로 이루어진 처리액에서 전류밀도 3~5A/dm2 , 온도50~55℃의 조건에서 5~10분 동안 침지하였다가 수세하는 것을 특징으로 하는 엔지니어링 플라스틱 수지의 표면특성 개선을 위한 도금방법. In the electronickel plating step, the engineering plastic resin is mixed with nickel sulfate of 50 to 50 vol%, nickel chloride 2.5 to 4 vol%, boric acid 3.7 to 4.5 vol%, polisher 0.21 to 0.31 vol%, and the remainder of the current density in a treatment liquid consisting of water. Plating method for improving the surface properties of the engineering plastic resin, characterized in that immersed for 5 to 10 minutes in a condition of 3 ~ 5A / dm 2 , temperature 50 ~ 55 ℃. 제 8 항에 있어서,The method of claim 8, 상기 크롬도금단계는, 엔지니어링 플라스틱 수지를 산화크롬20~30vol%, 황산0.07~0.15vol% 가 혼합되고 나머지가 물로 이루어진 처리액에서 전류밀도8~32A/dm2 , 온도 38~52℃의 조건에서 2~5분 동안 침지하였다가 수세하는 것을 특징으로 하는 엔지니어링 플라스틱 수지의 표면특성 개선을 위한 도금방법.In the chromium plating step, the engineering plastic resin is mixed with 20 to 30 vol% chromium oxide and 0.07 to 0.15 vol% sulfuric acid, and the remainder is water at a current density of 8 to 32 A / dm 2 and a temperature of 38 to 52 ° C. Plating method for improving the surface properties of the engineering plastic resin, characterized in that immersed for 2 to 5 minutes and washed with water.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100953432B1 (en) 2009-12-29 2010-04-20 신정기 Metal coating method for plastic material and modeling plastic material thereof
WO2017099349A1 (en) * 2015-12-10 2017-06-15 인탑스 주식회사 Method for manufacturing synthetic resin member with metal film partially formed thereon

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60178456A (en) 1984-02-27 1985-09-12 Canon Inc Manufacture of photoconductive composition
US4846938A (en) 1987-07-13 1989-07-11 Honda Giken Kogyo Kabushiki Kaisha Method of manufacturing a porous electroformed object

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60178456A (en) 1984-02-27 1985-09-12 Canon Inc Manufacture of photoconductive composition
US4846938A (en) 1987-07-13 1989-07-11 Honda Giken Kogyo Kabushiki Kaisha Method of manufacturing a porous electroformed object

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100953432B1 (en) 2009-12-29 2010-04-20 신정기 Metal coating method for plastic material and modeling plastic material thereof
WO2017099349A1 (en) * 2015-12-10 2017-06-15 인탑스 주식회사 Method for manufacturing synthetic resin member with metal film partially formed thereon

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