KR100953432B1 - Metal coating method for plastic material and modeling plastic material thereof - Google Patents

Metal coating method for plastic material and modeling plastic material thereof Download PDF

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KR100953432B1
KR100953432B1 KR1020090133029A KR20090133029A KR100953432B1 KR 100953432 B1 KR100953432 B1 KR 100953432B1 KR 1020090133029 A KR1020090133029 A KR 1020090133029A KR 20090133029 A KR20090133029 A KR 20090133029A KR 100953432 B1 KR100953432 B1 KR 100953432B1
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plastic injection
plating
injection molding
nickel
chromium
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Korean (ko)
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신정기
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신정기
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • C25D5/56Electroplating of non-metallic surfaces of plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B05D7/16Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies using synthetic lacquers or varnishes
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1653Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22Roughening, e.g. by etching
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/285Sensitising or activating with tin based compound or composition
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • C25D5/12Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48After-treatment of electroplated surfaces
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2503/00Polyurethanes

Abstract

PURPOSE: A method for plating a plastic extruded product and moldings thereof are provided to improve workability, to reduce a nickel plating process by shortening whole paltering process, and to obtain adhesion of a metal planting film. CONSTITUTION: A method for plating a plastic extruded product comprises the following steps: a step(S1) etching the plastic extruded product after degreasing the plastic extruded product; a step(S2) performing a first activation process and a second activation process; a step(S3) converting the surface of the plastic extruded product into a conductive material by plating the surface to form a conductive film; a step(S4) electrically plating the plastic extruded product after washing the product with acid; a step(S5) coating the plastic extruded product with chromic acid after washing the plastic extruded product; and a step(S6) coating the surface of the plastic extruded product with urethane-based transparent paint.

Description

플라스틱 사출 성형물의 도금방법 및 이로부터 제조된 성형물{METAL COATING METHOD FOR PLASTIC MATERIAL AND MODELING PLASTIC MATERIAL THEREOF}Plating method of plastic injection molding and molding manufactured therefrom {METAL COATING METHOD FOR PLASTIC MATERIAL AND MODELING PLASTIC MATERIAL THEREOF}

본 발명은 플라스틱 사출물의 도금방법 및 이로부터 제조된 성형물에 관한 것이다. The present invention relates to a method for plating plastic injection moldings and moldings made therefrom.

일반적으로 플라스틱의 금속 도금은 플라스틱과 금속 모두의 바람직한 특성이 결합되어 각각의 기술상의 장점과 심미적 장점을 제공하기 때문에 상업적인 측면에서 상당히 중요한 것으로 알려져 있다.In general, metal plating of plastics is known to be of significant commercial importance because the desirable properties of both plastics and metals combine to provide the respective technical and aesthetic advantages.

따라서 플라스틱을 광택이 있는 금속성 표면처리로 도금하는 것은, 성형된 플라스틱을 금속으로 대체하는 것보다 비용과 중량에 있어서 경제적이며, 부가적으로 도금된 표면 처리 부분은 플라스틱 기판과 도금된 금속 사이에서 전지반응(palvanic reaction)이 일어나지 않기 때문에, 점식작용(pitting)과 부식작용(corrosion)을 받지 않는다.Therefore, plating plastics with a shiny metallic surface treatment is more economical in terms of cost and weight than replacing molded plastics with metals, and additionally, the plated surface treatments may be applied between the plastic substrate and the plated metal. It does not undergo pitting and corrosion because no pavanic reaction occurs.

플라스틱 사출물의 도금시의 플라스틱에 대한 금속 도금의 접착성을 개선하 기 위해서 많은 방법이 개발되었고, 플라스틱 사출물에 금속 도금을 형성하는 방법으로는 전기도금에 의한 도금방법이 주로 적용되고 있는데, 탈지 - 에칭 - 중화 - 프리딥 - 제 1, 2 활성 - 화학니켈 - 유산동 코팅 - 3 중 니켈 도금(반광택 니켈- 광택 니켈- 다중니켈) - 크롬활성 - 크롬도금 - 제품완성의 공정으로 이루어져 왔다.In order to improve the adhesion of metal plating to plastics during the plating of plastic injection moldings, many methods have been developed, and as a method of forming metal plating on plastic injection molding, electroplating is mainly applied. Etching-Neutralization-Pre-Dip-First and Second Activity-Chemical Nickel-Copper Lactic Acid Coating-Triple Nickel Plating (Semi-Gloss Nickel-Gloss Nickel-Multinickel)-Chromium-Activation-Chromium Plating-Product Finishing.

상기와 같은 플라스틱 사출물의 금속도금은 다량의 화학물질을 필요로 하는 다단계의 공정으로 이루어져 있으며, 내식성을 위하여 다중으로 수행되는 니켈 도금 공정으로 인해 니켈을 다량 사용해야 하는 등의 문제점이 있다. Metal plating of the plastic injection molding as described above is made of a multi-step process requiring a large amount of chemicals, and there is a problem such as using a large amount of nickel due to the nickel plating process performed in multiple for corrosion resistance.

이러한 플라스틱 사출물의 도금시 플라스틱과 금속 도금의 접착성과 내식성의 향상 및 플라스틱 사출물 표면의 평활한 피복이 이루어지는 금속도금 방법의 개선이 필요하다.In the plating of the plastic injection molding, it is necessary to improve the adhesion and corrosion resistance of the metal and the metal plating, and to improve the metal plating method of smooth coating of the surface of the plastic injection molding.

본 발명은 화학물질 및 중금속의 사용량을 줄일 수 있으면서, 플라스틱 표면과 금속의 접착력과 도금된 금속의 내식성을 향상시킬 수 있는 플라스틱 사출물의 도금방법을 제공하고자 하는데 그 목적이 있다.An object of the present invention is to provide a plating method of a plastic injection molding that can reduce the amount of chemicals and heavy metals, and can improve the adhesion between the plastic surface and the metal and the corrosion resistance of the plated metal.

상기한 목적을 달성하기 위한 일례로서 본 발명의 플라스틱 사출물의 도금방법은, 플라스틱 사출물을 탈지한 후 에칭하는 공정; 상기 에칭된 플라스틱 사출물을 중화처리 후 주석-팔라듐 촉매를 사용하여 표면을 활성화 시키는 제 1 활성화(Catalyst) 공정과, 상기 제 1 활성화 공정을 거친 플라스틱 사출물을 황산(H2SO4) 용액에 50 내지 60 ℃ 조건에서 1 내지 2 분간 침지하여 이루어지는 제 2 활성화(Activator) 공정; 상기 활성화된 플라스틱 사출물을 전도성 피막이 형성되도록 도금하여 표면을 전도체로 전환시키는 화학 니켈 도금 공정; 상기 표면이 전도체로 전환된 플라스틱 사출물을 산세척한 다음 수세하고 전기 도금하는 광택 니켈 도금 공정; 상기 광택 니켈이 코팅된 플라스틱 사출물을 세척하고 크롬을 활성화시킨 후 크롬산(chromic acid)으로 코팅하는 크롬 도금 공정; 및, 상기 크롬이 도금된 플라스틱 사출물의 표면에 우레탄계 투명 도료로 코팅하는 클리어 코팅공정을 포함하여 이루어지는 것을 특징으로 한다.As an example for achieving the above object, the plating method of the plastic injection molding of the present invention comprises the steps of: degreasing and etching the plastic injection molding; After neutralizing the etched plastic injection molding, a first activation (Catalyst) process of activating a surface using a tin-palladium catalyst, and the plastic injection molding product having undergone the first activation process are carried out in a sulfuric acid (H 2 SO 4 ) solution 50 to 50. A second activator process made by immersion for 1 to 2 minutes at 60 ° C; A chemical nickel plating process of plating the activated plastic injection-molded product so that a conductive film is formed to convert the surface into a conductor; A bright nickel plating process of pickling, then washing and electroplating the plastic injection molded product whose surface is converted into a conductor; A chromium plating process of washing the bright nickel-coated plastic injection molding, activating chromium, and then coating it with chromic acid; And a clear coating process for coating the surface of the chromium-plated plastic injection molding with a urethane-based transparent paint.

상기한 본 발명에 의하면, 유산동 도금이 수행되지 않아도 플라스틱 사출물 표면의 금속도금막의 밀착성이 우수하게 나타나는 효과를 기대할 수 있다.According to the present invention described above, it can be expected that the effect of excellent adhesion of the metal plated film on the surface of the plastic injection molding even if copper lactate plating is not performed.

또한 본 발명에 의하면, 니켈 도금 공정이 수회 반복되지 않아도 금속도금막의 내식성 및 내마모성이 우수하게 나타나는 효과를 기대할 수 있다.In addition, according to the present invention, even if the nickel plating process is not repeated several times, the effect that the corrosion resistance and wear resistance of the metal plated film is excellent can be expected.

또한 본 발명에 의하면, 유산동 도금 공정의 생략과 다중으로 수행되던 니켈 도금 공정의 단축으로 인해 전체적인 도금 공정이 단축되어 수행되므로 작업성 및 생산성이 향상되는 효과를 기대할 수 있다.In addition, according to the present invention, the overall plating process may be shortened due to the omission of the copper lactate plating process and the shortening of the nickel plating process, which may be performed in multiple, so that the workability and productivity may be improved.

또한 본 발명에 의하면, 중금속 사용 빈도가 감소되므로 작업환경 개선 및 작업자에게 미칠 수 있는 유해성이 감소되는 효과를 기대할 수 있다.In addition, according to the present invention, since the use of heavy metals is reduced, it is possible to expect an effect of improving the working environment and reducing the harmful effects on workers.

또한 본 발명에 의하면, 화학약품의 사용량이 감소되므로 비용절감 및 환경오염 감소의 효과를 기대할 수 있다.In addition, according to the present invention, since the amount of chemicals used is reduced, the effect of cost reduction and environmental pollution can be expected.

이하 본 발명의 플라스틱 사출물의 도금방법을 실시예 및 도면에 의거하여 공정별로 구체적으로 설명하는 바, 다음 실시예 및 도면에 의하여 본 발명이 한정되는 것은 아니다. 도 1은 본 발명의 플라스틱 사출물의 도금방법의 흐름도를 나타낸 것이다.Hereinafter, the plating method of the plastic injection molded product of the present invention will be described in detail with reference to Examples and Drawings. However, the present invention is not limited by the following Examples and Drawings. Figure 1 shows a flow chart of the plating method of the plastic injection molding of the present invention.

1) 플라스틱 사출물을 탈지 및 에칭하는 공정[S1].1) Process of degreasing and etching plastic injection molding [S1].

본 발명의 도금방법은 플라스틱 사출물, 즉 합성수지를 원료로 하여 제작된 사출물에 도금하는 방법이며, 플라스틱 사출물을 이루는 플라스틱의 종류나 사출 방법, 사출물의 용도에 의하여 제한되는 것은 아니다. 본 발명에서는 자동차용 휠 캡을 예로 들어 설명하고 있으나 본 발명이 이에 한정되는 것이 아니고, 통상적인 방법에 의하여 대량생산된 플라스틱 사출물에 널리 적용될 수 있음은 자명하다.The plating method of the present invention is a method for plating plastic injection moldings, that is, injection moldings made of synthetic resin as a raw material, and is not limited by the type of plastic, injection method, or use of injection molding plastics. Although the present invention has been described using an automobile wheel cap as an example, it is apparent that the present invention is not limited thereto, and may be widely applied to a mass-produced plastic injection molding by a conventional method.

이때, 도 2에 도시한 바와 같이 사출응력을 개선하여 최소화한 방법으로 사출된 플라스틱 사출물을 대상으로 하면 플라스틱 사출물의 균열(crack) 발생이 감소되어 도금 불량률을 크게 감소시킬 수 있다.In this case, as shown in FIG. 2, when the plastic injection molded product is injected in a method of improving and minimizing the injection stress, cracking of the plastic injection molded product may be reduced, thereby significantly reducing the plating defect rate.

플라스틱 사출물은 금속도금이 이루어지기 전에 먼저 탈지하는데, 탈지는 플라스틱 사출물을 계면활성제 등에 침지하는 등의 방법으로 이루어진다. 상기 계면 활성제는 적절히 선택될 수 있다. 이는 플라스틱 사출물의 성형시에 발생된 성형가루나 몰드에 칠한 이형제 및 불필요한 지문자국 등을 제거하여 성형품 표면을 깨끗하게 하기 위해서이며, 또한 플라스틱 사출물의 표면에 친수성을 부여하기 위해서 실시한다. The plastic injection molding is first degreased before metal plating is performed, and degreasing is performed by dipping the plastic injection molding into a surfactant or the like. The surfactant may be appropriately selected. This is done to clean the surface of the molded article by removing the molding powder, the mold release agent applied to the mold, and unnecessary fingerprint marks, etc., and to provide hydrophilicity to the surface of the plastic injection molding.

탈지가 완료된 사출물은 에칭한다. 에칭은 플라스틱 사출물에 포함된 부타디엔 등을 파괴하여 제거하기 위해서이며, 도 3에 도시한 바와 같이 플라스틱 사출물의 표면에 요철을 형성하여 추후 도금되는 성분의 밀착력을 좋게하기 위하여 실시하는데, 에칭은 크롬산(chromic acid)과 황산(sulfuric acid)을 1 : 1 중량비로 혼합한 에칭액에 60 내지 75 ℃, 바람직하기로는 68 내지 72 ℃의 조건에서 5분 내지 15분, 바람직하기로는 5분 내지 10분 동안 침지하여 이루어진다. The injection-molded injection product is etched. Etching is performed to destroy and remove butadiene and the like contained in the plastic injection molding, and as shown in FIG. 3, to form irregularities on the surface of the plastic injection molding to improve adhesion between the components to be plated later. chromic acid) and sulfuric acid (sulfuric acid) in a 1: 1 weight ratio of the immersion for 5 minutes to 15 minutes, preferably 5 minutes to 10 minutes at 60 to 75 ℃, preferably 68 to 72 ℃ conditions It is done by

에칭 조건을 상기와 같이 조성하게 되면 ABS-PC제품이라 하더라도 부식면이 엣칭이 잘되는 잇점을 얻을 수 있다. 에칭액 중 크롬산의 비율이 상기 범위 미만으로 적으면 플라스틱 사출물 중 아크릴로니트릴(Acrylonitril)이 가수분해되는 경향이 있고, 상기 범위를 초과하여 많으면 크롬산이 포화 상태가 되어도 산화작용이 어려운 경향이 있으므로, 에칭액 중 크롬산과 황산의 비율을 상기 범위를 유지하도록 하는 것이 좋다.If the etching conditions are formed as described above, even the ABS-PC product can obtain the advantage that the corrosion surface is well etched. If the ratio of chromic acid in the etching solution is less than the above range, acrylonitrile (Acrylonitril) tends to be hydrolyzed in the plastic injection molding, and if it exceeds the above range, the oxidizing action tends to be difficult even if the chromic acid is saturated. The ratio of heavy chromic acid and sulfuric acid may be maintained in the above range.

2) 상기 에칭된 플라스틱 사출물을 알칼리로 중화처리 후 주석-팔라듐 촉매를 사용하여 표면을 활성화시키는 제 1 활성화 공정과, 상기 제 1 활성화 공정을 거친 플라스틱 사출물을 황산(H2SO4) 용액에 침지하는 제 2 활성화 공정[S2].2) neutralizing the etched plastic injection molding with alkali, and then activating the surface by using a tin-palladium catalyst and immersing the plastic injection molding after the first activation in a sulfuric acid (H 2 SO 4 ) solution. 2nd activation process [S2].

에칭이 이루어진 플라스틱 사출물은 충분히 수세하여 에칭액을 제거하고 중 화처리 하는데, 중화처리는 에칭액의 Cr+6를 Cr+3로 환원시키기 위한 것으로, 예를 들어, 중아류산소다(sodium bisulphide) 용액을 사용하거나 과산화수소(H2O2)용액을 사용하여 상온에서 1 분 이상 침지하여 이루어진다. 이는 에칭액을 중화처리하여 추후 무전해도금시 미도금 현상을 방지하기 위하여 실시한다.Etched plastic injection molding is sufficiently washed with water to remove and neutralize the etching solution. The neutralization treatment is for reducing the Cr +6 of the etching solution to Cr +3 , for example, a solution of sodium bisulphide. By dipping at least 1 min at room temperature using hydrogen peroxide (H 2 O 2 ) solution. This is done to neutralize the etchant to prevent the unplated phenomenon in the later electroless plating.

중화처리된 플라스틱 사출물은 활성 촉매화액에 수세수 지입에 의한 노화방지효과를 위하여 프리딥한다. 프리딥은 프리딥 탱크에서 이루어지는데 염산(HCl) 20 내지 30 중량% 수용액에, 상온에서 30 초 내지 1 분간 침지하는 방법으로 이루어진다. 상기 프리딥은 활성화공정이 잘 이루어지도록 하기 위하여 실시한다. The neutralized plastic injection molding is pre-dip for the anti-aging effect of washing with water into the active catalyzed liquid. Pre-dip is carried out in a pre-dip tank, which is immersed in an aqueous solution of hydrochloric acid (HCl) 20 to 30% by weight at room temperature for 30 seconds to 1 minute. The pre-dip is performed to make the activation process well.

프리딥이 수행된 플라스틱 사출물의 표면을 전도체로 활성화시키기 위하여 제 1차(Catalyst) 및 제 2차 활성화(Activator) 공정을 실시한다.First and second activator processes are performed to activate the surface of the plastic injection molded product, which has undergone pre-dip, as a conductor.

제 1 차 및 제 2차 활성화 공정은 프리딥한 플라스틱 사출물을 추후 전기도금시 금속 이온(Ni++)의 전도성 피막이 잘 침착되게 하기 위해 화학도금의 촉매가 되는 염화 팔라듐(백금족) 콜로이드 촉매를 흡착, 침투시킨 후 고착화시키는 공정을 말한다. The first and second activation processes adsorb and penetrate the pre-dip plastic injection product into the palladium chloride (platinum group) colloidal catalyst, which is a catalyst for chemical plating, in order to deposit a conductive film of metal ions (Ni ++) during the subsequent electroplating. The process of making it solidify after making it.

제 1 차 활성화 공정은 촉매화 공정(Catalyst)이라고도 하며, 이는 부도체인 플라스틱 표면에 도금이 되도록 씨드(seed)를 부여하는 과정으로 도금공정에 필요한 공정이며, 이전 처리 중에 생긴 얇은 산화층을 제거하여 표면을 활성상태로 만든다.The first activation process, also called catalysis, is a process that gives a seed to be plated on the plastic surface, which is a non-conductor, and is required for the plating process, and removes the thin oxide layer formed during the previous treatment. Makes it active.

제 1 활성화(Catalyst)공정은 중화처리된 플라스틱 사출물을 콜로이드상의 주석-팔라듐 촉매가 80 내지 100 ppm 의 농도로 포함된 염산 수용액(물 중 염산 함량이 25 내지 35 %)에 5 내지 10 분간 침지하였다가 수세하여 플라스틱 사출물의 표면에 촉매층을 형성하는 방법으로 이루어진다. 이때 사용되는 주석-팔라듐(tin-palladium cluster) 촉매의 모식도를 도 4에 간단하게 나타내었다.In the first activation process, the neutralized plastic injection product was immersed for 5 to 10 minutes in an aqueous hydrochloric acid solution containing 25 to 35% of hydrochloric acid in a colloidal tin-palladium catalyst at a concentration of 80 to 100 ppm. Is washed with water to form a catalyst layer on the surface of the plastic injection molding. The schematic diagram of the tin-palladium cluster catalyst used at this time is simply shown in FIG. 4.

상기 주식-팔라듐 촉매는 주석(Sn)과 팔라듐(Pd)이 2 : 1 중량비로 이루어진 것을 사용하는 것이 촉매층의 고착화 측면에서 바람직하다. 이는 에칭 공정에서 凹화된 친수성이 있는 플라스틱 사출물의 표면에 환원력이 강한 금속이온을 흡착 침투시켜 촉매 금속핵을 부여시켜 주는 공정이다. 즉 에칭이 이루어진 플라스틱 사출물의 표면 자체는 촉매성이 없으므로 그대로 화학니켈 도금액 중에 침적하여도 환원반응이 일어나기는 어려워 화학도금의 석출이 되어지지 않아 도금이 안된다.As for the stock-palladium catalyst, it is preferable to use a tin (Sn) and palladium (Pd) in a weight ratio of 2: 1 in terms of the solidification of the catalyst layer. This is a process of adsorbing and penetrating strong metal ions onto the surface of a hydrophilic plastic injection product quenched in an etching process to impart a catalytic metal nucleus. That is, since the surface of the plastic injection molded product itself is not catalytic, it is difficult to reduce the reaction even if it is deposited in the chemical nickel plating solution.

상기 제 1 활성화(Catalyst) 공정에 의하여 표면이 활성화된 플라스틱 사출물 표면의 모식도를 도 5에 나타내었다. 5 is a schematic diagram of the surface of the plastic injection molded product activated by the first activation process.

상기 제 1 활성화(Catalyst)공정이 완료된 플라스틱 표면에 흡착된 촉매금속을 활성화시키기 위하여 제 2 활성화(Activator) 공정을 거친다.In order to activate the catalytic metal adsorbed on the surface of the plastic on which the first activation process is completed, a second activation process is performed.

상기 제 2 활성화 공정은 제 1 활성화 공정을 거친 플라스틱 사출물을 황산(H2SO4)용액(농도 10 내지 20 %의 황산 수용액)에 50 내지 60 ℃ 조건에서 1 내지 2 분간, 바람직하기로는 1 분 내지 1 분 30초간 침지하여 이루어진다.In the second activation process, the plastic injection molded product is subjected to the first activation process in a sulfuric acid (H 2 SO 4 ) solution (concentration of 10-20% sulfuric acid solution) for 1 to 2 minutes, preferably for 1 minute. To immersion for 1 minute 30 seconds.

제 2 활성화 공정은 제 1 활성화 공정을 거친 후 촉매금속의 흡착 정도에 따라 상기 조건을 조절하여 적용하도록 하며, 제 2 활성화 공정이 과하게 이루어질 경우 플라스틱 사출물의 표면에서 팔라듐의 핵까지 탈락될 수 있으므로 주의하도록 한다.The second activation process is applied after adjusting the conditions according to the degree of adsorption of the catalytic metal after the first activation process, and if the second activation process is excessive, the nucleus of palladium may be dropped from the surface of the plastic injection molding. Do it.

한편, 제 2 활성화 공정에 사용되는 황산(H2SO4) 용액이 오염되면 스타더스트(Stardust)의 원인이 되므로, 상기 황산(H2SO4) 용액이 오염되지 않도록 정기적으로 갱신이 필요하다.Meanwhile, when the sulfuric acid (H 2 SO 4 ) solution used in the second activation process is contaminated to cause stardust, it is necessary to periodically renew the sulfuric acid (H 2 SO 4 ) solution so that the sulfuric acid (H 2 SO 4 ) solution is not contaminated.

도 6은 제 2 활성화(Activator) 공정에 의하여 활성화된 플라스틱 사출물의 표면 모식도를 나타낸 것이다. 상기와 같이 제 2 활성화(Activator) 공정을 거친 플라스틱 사출물은 표면은 도 5와 달리 주석이 제거되고 팔라듐이 고착되어 추후 하지니켈 도금(무전해 도금)이 용이하게 이루어지도록 한다. Figure 6 shows a schematic surface of the plastic injection molding activated by the second activator process. As described above, the plastic injection molding that has undergone the second activator process has a surface with tin removed and palladium fixed, unlike in FIG. 5, to facilitate nickel plating (electroless plating) later.

즉, 상기와 같은 에칭 공정과, 제 1 (Catalyst)및 제 2 활성화(Activator) 공정을 거쳐서 무전해 도금이 이루어진 플라스틱 사출물의 표면이 도체화되어 전기도금을 가능케 하며, 기존의 금속 도금시 필수적이던 유산동 도금 공정이 생략할 수 있도록 했다.In other words, the surface of the plastic injection molded product, which is electroless plated through the etching process and the first and second activator processes, is conductive and enables electroplating, which is essential for conventional metal plating. The lactic acid copper plating process can be omitted.

상기와 같이 제 1 활성화 및 제 2 활성화 공정을 거친 플라스틱 사출물 표면에 형성된 팔라듐의 고착면은 두께가 0.3 내지 0.5㎛ 범위로 이루어지는 것이 추후 전기 도금시 니켈의 고착이 잘 이루어지기에 적합하다.As described above, the fixing surface of the palladium formed on the surface of the plastic injection molded product which has undergone the first activation and the second activation process has a thickness in the range of 0.3 μm to 0.5 μm, so that nickel is well adhered during electroplating.

3) 상기 활성화된 플라스틱 사출물의 표면을 전도체로 전환시키는 화학 니켈 도금 공정[S3].3) A chemical nickel plating process [S3] to convert the surface of the activated plastic injection molding into a conductor.

상기 활성화 공정 후 충분히 수세한 다음 니켈 도금의 침착이 견고하게 이루어지도록 니켈금속이온으로 전도성 피막을 형성하게 하는 화학 니켈 도금 공정을 수행한다. After the activation process, the water is sufficiently washed and then a chemical nickel plating process is performed to form a conductive film with nickel metal ions so that the deposition of nickel plating is performed firmly.

화학 니켈 도금 공정은 상온에서, pH 8.5 내지 9.5의 알카리 상태를 유지하며, 니켈(Ni++)금속 이온이 4 내지 6 g/L 포함되어 이루어지는 화학니켈 도금액에 3 내지 5 분간 침지하였다가 수세하는 방법으로 이루어지며, 이에 의해 플라스틱 사출물의 표면에 전도성 피막이 형성된 전도체로 전환된다.The chemical nickel plating process maintains an alkaline state of pH 8.5 to 9.5 at room temperature and is immersed in a chemical nickel plating solution containing 4 to 6 g / L of nickel (Ni ++) metal ions for 3 to 5 minutes and washed with water. Thereby converting into a conductor having a conductive coating formed on the surface of the plastic injection molding.

도 7에는 화학 니켈 도금 공정이 수행된 플라스틱 사출물의 표면 모식도를 나타내었다. Figure 7 shows the surface schematic of the plastic injection molding chemical chemical plating process was performed.

활성화 공정에 의하여 플라스틱 사출물 표면의 활성화가 충분히 이루어지지 않을 경우에는 화학 니켈 도금이 충실히 이루어지지 않는다. 즉, 화학 니켈 도금이 이루어지지 않은 부위는 팔라듐 활성이 이루어지지 않았다는 의미가 되며, 추후 도금에 균열이 가거나 도금이 벗겨지는 등의 문제의 소지를 갖게 된다. 도금이 벗겨 질 경우에는 니켈이 용출되므로 니켈 사용으로 야기되는 피부 알러지 유발이나 중금속 오염 등의 부작용이 발생할 수 있다. 따라서 활성화 공정이 충실하게 이루어져야 할 것이다.If the surface of the plastic injection molding is not sufficiently activated by the activation process, chemical nickel plating is not faithfully performed. In other words, the site where the chemical nickel plating is not made means that the palladium activity is not performed, and there is a problem of cracking or peeling the plating later. When the plating is peeled off, nickel is eluted, which may cause side effects such as skin allergy or heavy metal contamination caused by the use of nickel. Therefore, the activation process must be faithfully performed.

상기 화학니켈 도금층의 두께는 0.3 내지 0.5 ㎛ 범위가 되는 것이 두께의 박형화와 내식성의 균형 측면에서 바람직할 것이다.It is preferable that the thickness of the chemical nickel plating layer is in the range of 0.3 to 0.5 μm in view of balance of thickness thinning and corrosion resistance.

4) 상기 표면이 전도체로 전환된 플라스틱 사출물의 산세척, 수세 및 광택 니켈 도 금 공정[S4].4) Pickling, flushing and bright nickel plating processes of plastic injection-molded parts whose surfaces are converted to conductors [S4].

본 발명에서는 상기 화학 니켈 도금처리에 의하여 전도성 피막이 형성된 플라스틱 사출물의 표면을 수세하여 화학 니켈 도금액을 세척한 후 유산동을 도금하지 않고 산세한다. 산세는 pH 3 이하로 유지되는 산용액, 예를 들어 무기산이 0.5 내지 2 중량% 포함된 산용액을 사용하여 이루어지며, 산세 후 수세하여 사용된 산용액이 세척되도록 한다. In the present invention, by washing the chemical nickel plating solution by washing the surface of the plastic injection-molded product with the conductive film formed by the chemical nickel plating treatment, it is pickled without plating copper lactate. Pickling is performed using an acid solution maintained at pH 3 or less, for example, an acid solution containing 0.5 to 2% by weight of an inorganic acid, and washed with water after washing to wash the used acid solution.

수세가 이루어진 플라스틱 사출물은 광택 니켈 도금 공정을 실시한다. 광택 니켈 도금은 장식성을 확보하기 위하여 이루어지는 것으로, 광택 니켈 도금층의 두께는 4 내지 12㎛ 범위가 되도록 하는 것이 장식성의 확보에 바람직할 것이다. 이러한 광택 니켈 도금은 작업온도 50 내지 60 ℃조건에서 황산니켈(NiSO4) 25 내지 35 중량%, 염화니켈(NiCl2) 3 내지 5 중량%, 붕산(H3BO3) 4 내지 6 중량% 및 적량의 광택제와 잔량의 물을 포함하는 광택 니켈 도금액에 전류밀도를 300내지 500 A/dm2, 정전압 6 내지 8 V 으로 한 조건에서 10 내지 20 분간 침지하였다가 수세하는 공정으로 이루어진다.Washed plastic injection moldings undergo a bright nickel plating process. Glossy nickel plating is performed to secure decorative properties, and the thickness of the glossy nickel plating layer may be in a range of 4 to 12 μm, which may be preferable for securing decorative properties. Such polished nickel plating is 25 to 35% by weight of nickel sulfate (NiSO 4 ), 3 to 5% by weight of nickel chloride (NiCl 2 ), 4 to 6% by weight of boric acid (H 3 BO 3 ) at a working temperature of 50 to 60 ℃ and It consists of the process of immersing for 10 to 20 minutes in the conditions which made the current density into 300-500 A / dm <2> and constant voltage 6-8V in the bright nickel plating liquid containing a suitable quantity of polish and residual amount of water, and wash | cleaning.

기존의 플라스틱 사출물의 금속 도금공정과 비교하여 본 발명에서는 유산동 도금 공정이 생략되고, 반광택 니켈 도금, 광택 니켈 도금 및 다중니켈 도금과 같이 3 중으로 이루어지던 니켈 도금 공정을 축소하여 광택 니켈 도금 공정을 수행한다.Compared with the metal plating process of the conventional plastic injection molding, the lactic acid copper plating process is omitted in the present invention, and the polished nickel plating process is reduced by reducing the triple nickel plating process such as semi-gloss nickel plating, polished nickel plating, and multi-nickel plating. To perform.

유산동 도금은 플라스틱 소재에 전기도금의 제1층으로써 유산동 도금이 적용 되며, 청화동이나 피로인산 동도금에 비하여 동도금막의 물성, 즉, 연성이 우수하고 양호한 밀착성을 갖기 때문에 널리 이루어져 왔다. 유산동 도금은 플라스틱과 그 표면에 도금되는 금속의 열팽창계수차에 의한 수축으로 인해 도금막의 밀착성이 저하되는 것을 방지하기 위하여 이루어지는 것으로, 유산동 도금은 동의 연성으로 열팽창에 의한 수축을 흡수하므로 도금 완성품의 밀착성을 위하여 필요하였다.Copper lactate plating has been widely applied as a first layer of electroplating to plastic materials, and has excellent physical properties, namely, ductility and good adhesiveness, compared to copper and copper pyrophosphate copper plating. Copper lactic acid plating is performed to prevent the adhesion of the plating film from deterioration due to shrinkage due to thermal expansion coefficient aberration of the plastic and the metal plated on the surface thereof, and copper lactic acid plating absorbs shrinkage due to thermal expansion due to copper ductility, and thus the adhesion of the finished product. It was necessary for.

본 발명에서는 이러한 유산동 도금이 없이도 플라스틱 사출물과 금속 피막의 밀착성이 우수한 도금방법을 제시한다. 유산동 도금이 생략될 수 있었던 것은, 상기한 대로 에칭 공정과 활성화 공정에 의하여 팔라듐이 플라스틱 사출물의 표면에 잘 고착되어 니켈의 고착을 용이하게 함에 있다. The present invention provides a plating method excellent in adhesion between the plastic injection-molded product and the metal film even without such copper lactate plating. The copper lactate plating could be omitted because the palladium is well adhered to the surface of the plastic injection-molded product by the etching process and the activation process as described above to facilitate the fixing of nickel.

한편, 내식성을 향상시키기 위하여 니켈 도금은 2 중 또는 3 중 니켈 도금이 적용되거나 도금의 두께를 증가시키는 경향이 있었다. 본 발명에서는 니켈의 고착력이 우수하여 1회 도금으로도 충분한 내식성을 만족시킬 수 있으며, 니켈 도금의 두께를 줄일 수 있으므로 완성품의 두께를 얇게 할 수 있는 효과와 함께 니켈 사용량의 감소에 따를 제반 잇점을 얻을 수 있는 효과를 기대할 수 있다.On the other hand, in order to improve the corrosion resistance, nickel plating tended to apply double or triple nickel plating or increase the thickness of the plating. In the present invention, it is excellent in the adhesion of nickel and can satisfy sufficient corrosion resistance even with one-time plating, and can reduce the thickness of the nickel plating, so that the thickness of the finished product can be reduced, and the advantages of reducing the amount of nickel used You can expect the effect to get.

5) 상기 광택 니켈이 코팅된 플라스틱 사출물의 크롬 도금 공정[S5].5) Chrome plating process of the plastic injection coating the bright nickel [S5].

상기와 같이 니켈 하지 도금이 완성되면 크롬 도금을 수행한다. 즉, 상기 광택 니켈이 코팅된 플라스틱 사출물은 충분히 수세한 크롬의 고착력을 높이기 위하여 먼저 크롬 활성 공정을 수행한다. 상기 크롬 활성 공정은 상온에서 크롬산(CrO3) 0.2 내지 0.5 중량%로 포함된 수용액에 30 초 내지 1 분간 침지하는 공정으로 이루어진다. 이는 상기 니켈 코팅 등에 사용된 용액이 크롬 코팅시 유입되는 것을 방지하고 니켈층이 형성된 플라스틱 사출물의 표면에 친수성을 부여하기 위하여 이루어진다.When the nickel base plating is completed as described above, chromium plating is performed. That is, the glossy nickel-coated plastic injection molding is first subjected to a chromium activation process in order to increase the adhesion of sufficiently washed chromium. The chromium activation process consists of immersion in an aqueous solution containing 0.2 to 0.5% by weight of chromic acid (CrO 3 ) at room temperature for 30 seconds to 1 minute. This is done to prevent the solution used in the nickel coating or the like from flowing into the chromium coating and to impart hydrophilicity to the surface of the plastic injection-molded product on which the nickel layer is formed.

상기 크롬 활성 공정이 이루어진 후 크롬 도금 공정을 수행한다. 크롬 도금 공정은 작업온도 35 내지 45 ℃에서, 크롬산(CrO3) 20 내지 30 중량%, 황산(H2SO4) 0.04 내지 0.14 중량%와 잔량의 물로 이루어지는 크롬 도금액에 전류밀도를 800내지 1,000 A/dm2, 정전압 5 내지 6 V 으로 한 조건에서 3 분 내지 5 분간 침지하는 방법으로 이루어진다. 상기한 크롬 도금 공정에 의하여 플라스틱 사출물의 표면에 내마모성이 부여되며, 크롬 금속 특유의 광택을 부여할 수 있게 된다. The chromium plating process is performed after the chromium activation process is performed. The chromium plating process has a current density of 800 to 1,000 A in a chromium plating solution consisting of 20 to 30 wt% of chromic acid (CrO 3 ), 0.04 to 0.14 wt% of sulfuric acid (H 2 SO 4 ) and a residual amount of water at a working temperature of 35 to 45 ° C. / dm 2 , a constant voltage of 5 to 6 V in a condition of immersion for 3 to 5 minutes. By the chromium plating process described above, wear resistance is imparted to the surface of the plastic injection molded product, and the gloss characteristic of the chromium metal can be imparted.

6) 상기 크롬이 도금된 플라스틱 사출물의 클리어 코팅공정[S6].6) Clear coating process of the chromium-plated plastic injection molding [S6].

본 발명에서는 플라스틱 사출물의 도금에 유산동 도금 공정이 수행되지 않고, 기존의 3 중으로 이루어지는 니켈 도금이 단일 공정으로 수행된다. 이에, 본 발명에서는 전체 도금 공정이 수행된 후 우레탄계 투명 도료를 사용하여 크롬 도금이 끝난 플라스틱 사출물을 코팅하는 클리어 코팅공정을 수행한다.In the present invention, the plating of the plastic injection molding is not carried out a copper lactate plating process, the conventional triple plating nickel plating is performed in a single process. Therefore, in the present invention, after the entire plating process is performed, a clear coating process of coating the plastic injection molded chrome plated using a urethane-based transparent paint is performed.

상기 클리어 코팅에 사용되는 투명 도료는 우레탄계 투명 도료이며, 여기에 이소시아네이트계 경화제를 혼합하여 사용한다. 우레탄계 도료와 이소시아네이트계 경화제를 1 : 0.3 내지 1의 중량비, 바람직하기로는 1 : 0.5의 중량비로 혼합하여 사용하는 것이 우레탄계 도료의 투명도와 경화 측면에서 좋다.The transparent paint used for the clear coating is a urethane-based transparent paint, and isocyanate-based curing agents are mixed and used therein. The use of a urethane paint and an isocyanate hardener in a weight ratio of 1: 0.3 to 1, preferably in a weight ratio of 1: 0.5, is preferable in view of transparency and curing of the urethane paint.

상기와 같이 클리어 코팅을 수행함으로써, 크롬 도금된 플라스틱 사출물의 내식성을 더욱 보강할 수 있고, 크롬 도금의 안정성을 향상시킬 수 있으며, 도금층의 두께가 얇게 형성되는 등이 잇점이 있다.By performing the clear coating as described above, the corrosion resistance of the chromium-plated plastic injection molding can be further reinforced, the stability of the chromium plating can be improved, and the thickness of the plating layer is advantageously formed.

상기한 방법에 의하여 제조된 플라스틱 사출물은 도금 후 소지 노출이나 부풀음, 박리, 균열 등이 발생하지 않았으며, 거칠음, 반점, 흐림, 주름 요철, 연마무늬, 연마에 의한 변형, 소지흠, 타박홈, 얼룩, 핀홀 등이 형성되지 않아 우수한 외관을 나타내었다.The plastic injection molding produced by the above method did not cause any exposure, swelling, peeling, cracking, etc. after plating, roughness, spots, cloudiness, wrinkle irregularities, abrasive patterns, deformation by polishing, scratches, bruise grooves, No stains, pinholes, etc. were formed, which resulted in an excellent appearance.

상기와 같은 공정으로 도금이 완료된 플라스틱 사출물의 도금막에 대한 밀착, 내마모성 및 내부식성 등에 대한 시험은 다음과 같이 수행된다.The test for adhesion, abrasion resistance and corrosion resistance to the plating film of the plastic injection molded product completed by the above process is performed as follows.

실험예 1. 밀착력 시험Experimental Example 1. Adhesion Test

[열싸이클 시험(Heat Cycle Test)] [Heat Cycle Test ]

상기한 공정으로 도금이 완료된 플라스틱 사출물의 시편(100mm× 80mm× 5mm)을 사용하여, 70℃ 1Hr → 실온 0.5Hr → -30℃ 1Hr → 실온 0.5Hr을 1싸이클로 하여 2싸이클의 방법으로 열싸이클 시험(MS-191-53)을 수행하였으며, 그 결과 부풀음이나 크랙 등이 발생하지 않는 양호한 결과를 얻었다.Using the specimen of the plastic injection molding (100mm × 80mm × 5mm) which has been plated by the above-described process, the heat cycle test was carried out by the method of two cycles with 70 ° C 1Hr → room temperature 0.5Hr → -30 ° C 1Hr → room temperature 0.5Hr as one cycle. (MS-191-53) was carried out. As a result, good results were obtained without swelling or cracking.

이는 기존의 유산동 도금 및 다중니켈 도금의 방법으로 도금이 완료된 플라스틱 사출물을 사용하여 동일한 방법으로 시험하여 얻어진 결과와 비교하여 동일수 준 이상의 결과인 것으로 나타났다. This was found to be the same level or higher than the result obtained by testing in the same method using a plastic injection molding is completed by the conventional copper lactate plating and multi-nickel plating method.

즉, 본 발명의 공정으로 도금을 완료한 경우에도 도금막의 밀착력이 우수함을 확인할 수 있다.That is, even when the plating is completed by the process of the present invention it can be confirmed that the adhesion of the plated film is excellent.

실험예 2. 내식성 시험Experimental Example 2. Corrosion Resistance Test

상기 실험예 1에 사용된 것과 동일한 시편을 사용하여 NaCl 50g/l, PH 6.5~7.2, 분무량 1.5± 0.5㎖/80㎠/H, Tank 온도 35℃± 2, 공기포화기온도 47℃± 2, 공기압력 70 내지 167 ㎪의 조건으로 240 Hr 염수분무(MS-600-35)한 조건에서 내식성을 시험하였으며, 그 결과 부식이 발견되지 않는 양호한 결과를 얻었다.Using the same specimen as used in Experimental Example 1 NaCl 50g / l, PH 6.5 ~ 7.2, spray amount 1.5 ± 0.5ml / 80 ㎠ / H, Tank temperature 35 ℃ ± 2, Air saturator temperature 47 ℃ ± 2, Corrosion resistance was tested under conditions of 240 Hr salt spray (MS-600-35) at an air pressure of 70 to 167 kPa, which resulted in good results without corrosion being found.

이는 기존의 유산동 도금 및 다중니켈 도금의 방법으로 도금이 완료된 플라스틱 사출물을 사용하여 동일한 방법으로 시험하여 얻어진 결과와 비교하여 기존수준 이상으로 양호한 것으로 나타났다. This was found to be better than the existing level compared with the results obtained by testing in the same manner using the plastic injection molding is completed by the conventional copper lactate plating and multi-nickel plating method.

즉, 본 발명의 공정으로 도금을 완료한 경우에도 도금막의 내식성이 우수함을 확인할 수 있다.That is, even when the plating is completed by the process of the present invention it can be confirmed that the plating film excellent corrosion resistance.

실험예 3. 내마모성 시험Experimental Example 3. Wear Resistance Test

상기 실험예 1에 사용된 것과 동일한 시편을 사용하여 시험하중 0.5㎏, 시험속도 15± 5 m/min, 마찰체는 병선범포 #10의 재질, WET조건은 범포를 케로신에 30초 침지의 시험기 조건을 맞추고 소지노출횟수가 Dry 500회 이상 Wet 50회 이상의조건에서 내마모성을 시험하였으며, 그 결과 소지노출, 부풀음, 균열 등이 없는 결 과를 얻었다.Using the same specimen used in Experimental Example 1, the test load 0.5 kg, test speed 15 ± 5 m / min, the friction body is the material of parallel ship # 10, WET condition is a tester immersed in kerosine for 30 seconds The wear resistance was tested under the conditions of dry 500 times and wet 50 times when the conditions were met. As a result, there was no free exposure, swelling and cracking.

이는 기존의 유산동 도금 및 다중니켈 도금의 방법으로 도금이 완료된 플라스틱 사출물을 사용하여 동일한 방법으로 시험하여 얻어진 결과와 비교하여 동일수준 이상으로 양호한 것으로 나타났다. This was found to be more than the same level as compared with the results obtained by testing in the same method using a plastic injection molding is completed by the conventional copper lactate plating and multi-nickel plating method.

즉, 본 발명의 공정으로 도금을 완료한 경우에도 도금막의 내마모성이 우수함을 확인할 수 있다.That is, even when the plating is completed by the process of the present invention it can be confirmed that the wear resistance of the plated film is excellent.

도 1은 본 발명의 플라스틱 사출물의 도금공정의 흐름도를 나타낸 것이다.Figure 1 shows a flow chart of the plating process of the plastic injection molding of the present invention.

도 2는 플라스틱 사출물의 균열(crack) 형성을 감소하기 위한 응력 개선실례를 나타낸 사진이다.2 is a photograph showing an example of stress improvement for reducing crack formation of a plastic injection molding.

도 3은 본 발명의 플라스틱 사출물의 도금공정 중 에칭 공정이 이루어진 플라스틱 사출물의 표면을 나타낸 모식도이다.Figure 3 is a schematic diagram showing the surface of the plastic injection molding made of the etching step of the plating process of the plastic injection molding of the present invention.

도 4는 주석-팔라듐 촉매의 모식도를 나타낸 것이다.4 shows a schematic diagram of a tin-palladium catalyst.

도 5는 본 발명의 플라스틱 사출물의 도금공정 중 제 1 활성화 공정이 이루어진 플라스틱 사출물의 표면을 나타낸 모식도이다.5 is a schematic view showing the surface of the plastic injection molded product made of the first activation step of the plating process of the plastic injection molded product of the present invention.

도 6은 본 발명의 플라스틱 사출물의 도금공정 중 제 2 활성화 공정이 이루어진 플라스틱 사출물의 표면을 나타낸 모식도이다.6 is a schematic view showing the surface of the plastic injection molded product made of the second activation process of the plating process of the plastic injection molded product of the present invention.

도 7은 본 발명의 플라스틱 사출물의 표면에 무전해 도금막이 형성된 모습을 나타낸 모식도이다.Figure 7 is a schematic diagram showing the appearance of the electroless plating film formed on the surface of the plastic injection molded product of the present invention.

도 8은 본 발명의 플라스틱 사출물의 도금공정에 의하여 금속막이 코팅된 자동차용 휠 캡의 모습을 나타낸 사진이다.Figure 8 is a photograph showing the appearance of a wheel cap for a vehicle coated with a metal film by the plating process of the plastic injection molding of the present invention.

Claims (6)

플라스틱 사출물을 탈지한 후 에칭하는 공정;Degreasing and etching the plastic injection molding; 상기 에칭된 플라스틱 사출물을 중화처리 후 주석-팔라듐 촉매를 사용하여 표면을 활성화 시키는 제 1 활성화(Catalyst)와, 상기 제 1 활성화 공정을 거친 플라스틱 사출물을 황산(H2SO4) 용액에 50 내지 60 ℃ 조건에서 1 내지 2 분간 침지하여 이루어지는 제 2 활성화(Activator) 공정; After neutralizing the etched plastic injection molding, the first activation (Catalyst) for activating the surface by using a tin-palladium catalyst, and the plastic injection molding product after the first activation process are carried out in a sulfuric acid (H 2 SO 4 ) solution in 50 to 60 A second activator process made by immersing for 1 to 2 minutes under the condition of ℃; 상기 활성화된 플라스틱 사출물을 전도성 피막이 형성되도록 도금하여 표면을 전도체로 전환시키는 화학 니켈 도금 공정;A chemical nickel plating process of plating the activated plastic injection-molded product so that a conductive film is formed to convert the surface into a conductor; 상기 표면이 전도체로 전환된 플라스틱 사출물을 산세척한 다음 수세하고 전기 도금하는 광택 니켈 도금 공정;A bright nickel plating process of pickling, then washing and electroplating the plastic injection molded product whose surface is converted into a conductor; 상기 광택 니켈이 코팅된 플라스틱 사출물을 세척하고 크롬을 활성화시킨 후 크롬산(chromic acid)으로 코팅하는 크롬 도금 공정; 및,A chromium plating process of washing the bright nickel-coated plastic injection molding, activating chromium, and then coating it with chromic acid; And, 상기 크롬이 도금된 플라스틱 사출물의 표면에 우레탄계 투명 도료로 코팅하는 클리어 코팅공정Clear coating process for coating with urethane-based transparent paint on the surface of the chromium-plated plastic injection molding 을 포함하여 이루어지는 것을 특징으로 하는 플라스틱 사출물의 도금방법.Plating method of plastic injection molding, characterized in that comprises a. 청구항 1에 있어서,The method according to claim 1, 상기 에칭은 크롬산(chromic acid)과 황산(sulfuric acid)이 1 : 1 중량비로 로 혼합된 용액에 침지하여 60 내지 75 ℃ 조건에서 5 내지 15 분간 이루어지는 것을 특징으로 하는 플라스틱 사출물의 도금방법.The etching is a plating method of a plastic injection molding, characterized in that chromic acid (sulfuric acid) and sulfuric acid (sulfuric acid) is immersed in a mixed solution in a weight ratio of 1: 1 to 5 to 15 minutes at 60 to 75 ℃ conditions. 청구항 1에서,In claim 1, 상기 제 1 활성화(Catalyst)공정은 중화처리된 플라스틱 사출물을 콜로이드상의 주석-팔라듐 촉매가 80 내지 100 ppm의 농도로 포함된 염산수용액(25 내지 35 중량% 염산)에 5 내지 10 분간 침지하는 방법으로 이루어지는 것을 특징으로 하는 플라스틱 사출물의 도금방법.The first activation process is a method of immersing the neutralized plastic injection product in an aqueous hydrochloric acid solution (25-35 wt% hydrochloric acid) containing a colloidal tin-palladium catalyst at a concentration of 80 to 100 ppm for 5 to 10 minutes. Plating method of plastic injection molding, characterized in that made. 청구항 3 에 있어서,The method according to claim 3, 상기 주석-팔라듐 촉매는 주석 : 팔라듐이 2 : 1 중량비로 이루어진 것을 특징으로 하는 플라스틱 사출물의 도금방법.The tin-palladium catalyst is a plating method of a plastic injection molding, characterized in that the tin: palladium is 2: 1 by weight ratio. 삭제delete 청구항 1에 있어서,The method according to claim 1, 상기 우레탄계 도료를 우레탄계 도료와 이소시아네이트계 경화제가 1 : 0.3 내지 1 중량비로 혼합되어 사용되는 것을 특징으로 하는 플라스틱 사출물의 도금방법.The urethane-based paint is a plating method of a plastic injection molding, characterized in that the urethane-based paint and isocyanate-based curing agent is mixed in a ratio of 1: 0.3 to 1 by weight.
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KR101193960B1 (en) * 2012-04-16 2012-10-26 주식회사엑소 Manufacturing method of tip for soldering device
KR101232718B1 (en) 2012-05-25 2013-02-13 (주) 딜라이트오브서피스앤컬러 Method for preparing molded product using plated resin
KR101263707B1 (en) * 2010-10-26 2013-05-13 한국내쇼날주식회사 One body shape of emblem & wheel cap, and production method of the one body shaping wheel cap
KR101367912B1 (en) * 2012-06-28 2014-02-27 서영호 Plating method using the Tin-Zinc alloy plating solution
KR101800436B1 (en) 2017-03-29 2017-11-22 대영엔지니어링 주식회사 Method for electrodeposition painting of plastic
KR102309147B1 (en) * 2021-06-09 2021-10-05 문성주 Plating method for injection molded product
KR102311650B1 (en) * 2021-05-20 2021-10-12 주식회사 승부 Chemical nickel plating soution and plating method using the same

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JPH11170434A (en) 1997-12-15 1999-06-29 Teijin Chem Ltd Plated product
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101263707B1 (en) * 2010-10-26 2013-05-13 한국내쇼날주식회사 One body shape of emblem & wheel cap, and production method of the one body shaping wheel cap
KR101193960B1 (en) * 2012-04-16 2012-10-26 주식회사엑소 Manufacturing method of tip for soldering device
KR101232718B1 (en) 2012-05-25 2013-02-13 (주) 딜라이트오브서피스앤컬러 Method for preparing molded product using plated resin
KR101367912B1 (en) * 2012-06-28 2014-02-27 서영호 Plating method using the Tin-Zinc alloy plating solution
KR101800436B1 (en) 2017-03-29 2017-11-22 대영엔지니어링 주식회사 Method for electrodeposition painting of plastic
KR102311650B1 (en) * 2021-05-20 2021-10-12 주식회사 승부 Chemical nickel plating soution and plating method using the same
KR102309147B1 (en) * 2021-06-09 2021-10-05 문성주 Plating method for injection molded product

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