KR102309147B1 - Plating method for injection molded product - Google Patents

Abstract

The present invention relates to a plating method of an injection product, and more particularly, to a plating method of an injection product for plating an injection product formed of a resin material. The present invention includes a pre-processing step (S10); an etching step (S20); a neutralization step (S30); a first activation step (S40); a second activation step (S50); a chemical nickel plating step (S60); an electroplating step (S70); and a post-processing step (S80).

Description

Plating method of injection-molded products {PLATING METHOD FOR INJECTION MOLDED PRODUCT}

The present invention relates to a plating method of an injection product, and more particularly, to a plating method of an injection product for plating an injection product formed of a resin material.

Because plastic is light in weight, it is used in various fields. In particular, in order to reduce the weight of automobiles, the conversion from metal materials such as iron to plastic materials is continuously being made.

Plastics that are injected in a specific form for product use cannot be applied to products by themselves. The reasons for this are: First, the appearance of the material is not flashy, so the marketability is lowered. Second, the plastic hardness is low, so scratches due to collision easily occur, and there is a high risk of discoloration and damage by the external environment.

Plastic plating is performed to give the plastic material functionality as a commodity. Since metal does not adhere to plastic materials in common sense, it is treated with chemicals through a series of processes to surface-treat so that the metal can be adhered to the plastic surface, and then plated to give functionality.

Plastics have various names, such as ABS, ASA, PC, PVC, and flame-retardant plastics, depending on the chemical composition of the material, but it is common to mainly use ABS plastics by plating them.

On the other hand, the prior art Registration Patent No. 10-0293532 (hereinafter referred to as the prior art) relates to a metal plating method on the surface of a plastic polymer. As the temperature of the etching solution is higher, the etching effect is excellent, and a very excellent plastic polymer having an adhesion between the plastic polymer and the plating layer of up to 1000 N/cm 2 or more can be obtained. It was designed to manufacture fuel tanks for automobiles.

However, this prior art does not effectively suppress the occurrence of cracks, does not have excellent abrasion resistance, and has problems in that it is not possible to manufacture plated injection products having various and splendid appearances such as gloss, matte, color (black, gold), and black gloss. there was.

The present invention has been devised to solve the above problems, and it is possible to produce finished products that effectively suppress the occurrence of cracks, have excellent abrasion resistance, and have various and colorful appearances such as gloss, matte, color (black, gold), and black gloss. The purpose of this invention is to provide a plating method for injection-molded products.

Another object of the present invention is to provide a plating method for an injection-molded product capable of efficiently plating a plurality of injection-molded products.

The present invention for the purpose of solving the above problems has the following configuration and features.

A pre-treatment step (S10) comprising at least one of a locking process for mounting the injection-molded product on a jig and a degreasing process for removing foreign substances from the injection-molded product; An etching step (S20) of immersing the injection-molded product in an etching solution containing chromic acid to form irregularities on the injection-molded product; Neutralizing step (S30) of immersing the injection product in a neutralizing agent containing hydrochloric acid to neutralize; a first activation step of adsorbing palladium and tin to the surface of the injection product (S40); a second activation step (S50) of removing the tin from the injection product and activating the palladium; Chemical nickel plating step (S60) of immersing the injection product in a pretreatment agent containing nickel to form a chemical nickel layer on the surface of the injection product; A step of plating copper sulfate on the chemical nickel layer of the injection product, a step of plating nickel on the chemical nickel layer of the injection product, a step of plating satin nickel on the chemical nickel layer of the injection product, a chemical nickel layer of the injection product A process of plating trivalent chromium, a process of plating hexavalent chromium on the chemical nickel layer of the injection product, a process of plating black pearls on the chemical nickel layer of the injection product, and plating gold on the chemical nickel layer of the injection product An electroplating step (S70) comprising at least one of the processes; and a washing process of washing the injected product using ion-exchanged water, a chemical peeling process of immersing the injected product in a stripping solution containing sulfuric acid, a drying process of drying the injected product, and an inspection process of inspecting the injected product and a post-processing step (S80) including at least one of a packaging process for packaging the injection product.

In addition, the jig, a plurality of upper vertical bars; a plurality of horizontal bars connected to the lower ends of each of the plurality of upper vertical bars; a lower vertical bar extending downward from the lower end of the horizontal bar; a mounting part protruding from the lower vertical bar to mount the injection-molded product; a connecting bar connecting adjacent upper vertical bars; and a hook portion provided on the upper end of the upper vertical bar.

In addition, the neutralization step (S30) includes the step of accommodating the neutralizing agent in a container (S31) and immersing the jig on which the injection product is mounted in the neutralizing agent accommodated in the container (S32), but the container Silver, a protrusion protruding upward from the top; a fitting groove recessed downwardly from the upper end of the protrusion; and a mounting portion including a body inserted into the fitting groove and installed and on which a jig is hung, and a plurality of fastening holes formed along the longitudinal direction of the body.

The present invention having the above configuration and characteristics effectively suppresses the occurrence of racks, has excellent abrasion resistance, and enables the production of finished products having various and splendid appearances such as gloss, matte, color (black, gold), and black gloss. have

In addition, the present invention has the effect of allowing a plurality of injection-molded products to be efficiently plated.

1 is a schematic flowchart for explaining a plating method of an injection product according to an embodiment of the present invention.
2 is a view for explaining the jig.
3 is a view for explaining the container.
4 is a view for explaining a further embodiment of the present invention.

The present invention is intended to be described in detail in the text of the embodiment (態樣, aspect) (or embodiments) can be applied to various changes and can have various forms. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention.

The terminology used herein is only used to describe a specific embodiment (aspect, aspect, aspect) (or embodiment), and is not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as comprises or consists of are intended to designate that the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification exist, but one or more other features It is to be understood that it does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

~1~, ~2~, etc. described in the present specification will be referred to only to distinguish that they are different components, and are not limited to the order of manufacture, and their names in the detailed description and claims of the invention are may not match.

Throughout this specification, when a part is "connected" with another part, this includes not only the case of being "directly connected", but also the case of being "indirectly connected" with another element interposed therebetween. do.

1 is a schematic flowchart for explaining a method for plating an injection product according to an embodiment of the present invention, and FIG. 2 is a view for explaining a jig.

Hereinafter, for convenience of description, the plating method of an injection-molded article according to an embodiment of the present invention will be referred to as 'the present method'.

1 and 2, the method includes a pretreatment step (S10), an etching step (S20), a neutralization step (S30), a first activation step (S40), a second activation step (S50), a chemical nickel plating step (S60), an electroplating step (S70) and a post-processing step (S80).

The pretreatment step (S10) includes at least one of a locking process for mounting the injection product 3 on the jig 1 and a degreasing process for removing foreign substances from the injection product 3 . The injection product 3 is a resin material, and may be, for example, an ABS material injection-molded.

Illustratively, the jig 1 for performing the locking process includes a plurality of upper vertical bars 11, a plurality of horizontal bars 12 connected to the lower ends of the plurality of upper vertical bars 11, and the horizontal bars 12 ), a lower vertical bar (13) extending downward from the lower end, a mounting portion (14) protruding from the lower vertical bar (13) to mount the injection-molded product, and a connecting bar (15) connecting the neighboring upper vertical bars (11) ) and a hook 16 provided at the upper end of the upper vertical bar 11 .

The mounting portion 14 is exemplarily configured to correspond to the protrusion provided to protrude from the lower vertical bar 13 to the hole of the injection product 3 (eg, horizontally or inclined upward from the lower vertical bar 13) protrusion) may be included. The mounting portion 14 is preferably formed of a material that conducts electricity so that an electric current can flow after chemical nickel is attached to the surface of the injection product 3 to be described later.

When viewed in a plan view, the longitudinal direction of the horizontal bar 12 and the connecting portion 15 may be orthogonal to each other. That is, a plurality of upper vertical bars 11 may be disposed at intervals along a direction orthogonal to the longitudinal direction of the horizontal bar 12 .

The hook 16 includes an extension 161 extending upwardly from the upper end of the upper vertical bar 11 , a curved portion 162 curved downward from the upper end of the extension portion 161 , and the extension 161 . And it may include a hook groove formed by the curved portion (162).

The hook groove is a groove into which the holder 23 to be described later is inserted, and serves to allow the jig 1 to be hung on the holder 23 to be described later.

Here, the upper side (top, etc.) may mean the upper side (top, etc.) in the vertical direction and the lower side (lower side, etc.) may mean the lower side (lower side, etc.) in the vertical direction, and the same will be applied in the following description.

In this way, the jig 1 for performing the locking process is hung on the mounting part 23 to be described later, and the upper vertical bar 11, the horizontal bar 12, the lower vertical bar 13, and the connecting part 15 are connected to each other. There is an advantage in that a plurality of injection products 3 can be efficiently plated, including.

The degreasing process is a process of removing dust and the like adhering to the surface of the injection product 3 . That is, as the object is precipitated in an alkaline or acidic solution containing a surfactant and treated with an alkaline or acid bath, the surface is cleaned by removing dust attached to the surface of the object in the injection molding process, as well as other contaminants such as fingerprints and oils and fats. make it

At this time, for example, for degreasing the surface of the object, a front degreasing agent (for example, 'CP face agent' manufactured by 'Shindong Chemical Co., Ltd.' may be used.) (About 200 mL of cp degreasing agent per 1 L of water An aqueous solution of sulfuric acid (approximately 400 mL of sulfuric acid per 1 L of water) diluted by mixing sulfuric acid (H2SO4) and water together with (CP face agent 200mL/L) is used, and at a temperature of 55~65℃, at 50ㅁ2℃ for 4~6 minutes. It can be maintained for a while to remove foreign substances attached to the surface.

The pretreatment step (S10) may further include a step of checking whether there is an abnormality in the weight or appearance of the injection product 3 .

The etching step ( S20 ) is a step of immersing the injection-molded product 3 in an etching solution containing chromic acid to form irregularities on the injection-molded product 3 .

The etching step (S20) is a step of dissolving the rubber component of the injection product 3 with a strong acid to form fine irregularities on the surface. As described above, it was said that the injection product 3 may be formed of an ABS resin, by partially oxidizing and dissolving (eluting) the butadiene component on the surface of the injection product 3 formed of the ABS material, thereby forming a number of fine irregularities.

The etching solution may be one in which 480 to 520 g of chromic acid and 180 to 220 g of sulfuric acid are dissolved in 2L of water, and the injection product 3 mounted on the jig 1 (RacK) is placed in a container in which the etching solution is accommodated (to be described later). It can be immersed in the container (which may include a configuration corresponding to the container (2)) and maintained at 70°C 2°C for 4 to 6 minutes.

On the other hand, of course, the method may further include a washing step of washing the surface of the injection product 3 with water after each step and each process. This is common in the relevant field, and a more detailed description thereof will be omitted.

3 is a view for explaining the container.

1 to 3 , the neutralization step S30 is a step of neutralizing the injection product 3 by immersing it in a neutralizing agent containing hydrochloric acid.

Illustratively, the neutralizing agent may be a mixture of 9 to 11 mL of hydrochloric acid in 1 L of water, and the neutralizing agent may be accommodated in the container (2). The container (2) will be described in more detail in the description to be described later.

In the neutralization step (S30), the injection product 3 is immersed in the neutralizing agent at 30 °C 2 ° C. and can be maintained for a predetermined time (about 2 minutes to 4 minutes), and the injection product 3 is prepared with the neutralizing agent as described above. The chromic acid remaining on the surface of the chromic acid immersed in the chromium is reduced to trivalent chromium to inhibit the decomposition of the chromic acid palladium particles in the first activation step (S40) to be described later.

Illustratively, the neutralizing agent may be added to neutralized oxygenated sodium 4 to 6 g/L (1 L of water) to remove various foreign substances remaining in the concave-convex portion.

Hereinafter, each component may be in g/L or mL/L units, which may mean the weight (g) or volume (mL) of the corresponding components per 1 L of water. The same will be applied in the following description.

The neutralization step (S30) may include a process of applying ultrasonic waves in a state in which the injection product 3 is immersed in the neutralizing agent (hereinafter, the ultrasonic step (S33)). Illustratively, two ultrasonic devices (according to the container capacity of 800L) may be installed in the container (2). For example, the frequency of the ultrasonic wave may be 28-40 kHz, and the output may be 2200-2600W.

In the case of neutralization using only a neutralizing agent in the prior art, the chromic acid remaining in the jig 1 could not be effectively neutralized. chromic acid, which also has the advantage that it can be removed more easily.

Also, in the case of double injection rather than single injection, chromic acid often flows out on the injection interface.

1 to 3 , it has been described above that the neutralizing agent is accommodated in the container 2 in the neutralization step ( S30 ). The neutralization step (S30) is a step (S31) of accommodating the neutralizing agent in the container (2) and immersing the jig (1) equipped with the injection product (3) in the neutralizing agent accommodated in the container (2) (S32) ) may be included. The ultrasonic step (S33) may be performed after the step (S32).

In this case, the container 2 may include a base and a side wall 21 protruding upward from the base edge to form an accommodation space in which the neutralizing agent is accommodated.

In addition, the receiving tube 2 is installed by being inserted into the protrusion 22 protruding upward from the top of the side wall 21, a fitting groove (not shown) that is recessed from the top of the protrusion 22 to the bottom, and the fitting groove. (1) may include a mounting portion 23 including a body 231 is hung and mounted.

Illustratively, the base (not shown) may have a rectangular shape in plan view, so that the side wall 21 includes the first and second walls facing each other, and the third wall and the second wall interconnecting the first and second walls. It can include 4 walls.

At this time, the protrusion 22 and the fitting groove (not shown) are provided in a plurality of the first and second walls, or are provided in a plurality of the third and fourth walls, the mounting portions 23 parallel to the longitudinal direction of the third wall. ) may be installed in fitting grooves (not shown) provided on the first and second walls.

In FIG. 3, the fitting groove (not shown) is not shown since the body 231 is inserted.

As described above, the container 2 for performing the neutralization step (S30) in the present method includes a mounting portion 23 including a fitting groove (not shown) and a body 231 inserted and fitted into the fitting groove. , the mounting part 23 and the side wall 21 can be detachably coupled, and thus the mounting part 23 can be easily maintained, and the side wall 21 and the mounting part 23 can be washed separately. There are advantages to being able to

In particular, the mounting portion 23 is that the jig 1 is repeatedly hung, wear may be considerable, there is also an advantage that only the mounting portion 23 can be replaced.

Referring to FIG. 3 , the mounting part 23 may include a plurality of fastening holes 232 formed along the length direction of the body 231 . Since the body 231 includes the fastening hole 232, a plurality of mounting portions 23 can be connected to increase their length, so that the separation distance between the first wall and the second wall or the third wall and the fourth wall is reduced. Even if it becomes large, there is an advantage in that the installation of the mounting part 23 is easy.

Referring to FIG. 1 , the first activation step S40 is a step of adsorbing palladium and tin on the surface of the injection product 3 . Illustratively, in the first activation step (S40), the injection product 3 is immersed in a first active solution accommodated in a receiving vessel having a configuration corresponding to the receiving vessel 2 to adsorb palladium and tin to the surface. may be a step.

Illustratively, the first active solution is a solution containing palladium (for example, it may be 'NP-8', a product of 'Heesung Metal') 35~49mL/L (water 1L), hydrochloric acid 100~140mL/L (per liter of water).

In the first activation step (S40), the injection product 3 is immersed in the first active solution and can be maintained at 33 ° C. 2 ° C. for 3 to 6 minutes. In the first activation step ( S40 ), the palladium-tin cluster may be adsorbed and penetrated into the uneven etching hole.

The second activation step S50 is a step of removing the tin from the injection product 3 and activating the palladium.

The second activation step (S50) may be immersed in a second active solution containing sulfuric acid as an example (which may also be accommodated in a container) and maintained at 53 ㅁ2° C. for 2 to 4 minutes.

Illustratively, 90 to 110 mL/L of sulfuric acid (per 1 L of water) may be included in the second active solution. In the second activation step (S50), as described above, tin may be removed from the palladium-tin cluster and palladium may be activated.

The chemical nickel plating step (S60) is a step of immersing the injection product 3 in a pretreatment agent containing nickel to form a chemical nickel layer on the surface of the injection product.

Illustratively, the pretreatment agent may include 2.0 to 4.0 g/L of nickel lactate, 6.0 to 12.0 g/L of sodium citrate, and 1.5 to 3.5 g/L of sodium phosphate, 5 to 8 minutes at 35 ° C. 2 ° C. and finally, metal nickel is deposited on the catalyst layer (palladium) for electroplating, and the etching hole of the injection product 3 is etched to form a chemical nickel layer on the surface of the injection product 3 . Accordingly, it is possible to impart conductivity to the injection product 3 . Exemplarily, the pH of the pretreatment agent may be 7.8.

The electroplating step (S70) includes a process of plating copper sulfate on the chemical nickel layer of the injection product 3 (S71), a process of plating nickel on the chemical nickel layer of the injection product 3 (S72), and the injection product 3 The step (S73) of plating satin nickel on the chemical nickel layer of (3), the step of plating trivalent chromium on the chemical nickel layer of the injection product (3) (S74), the chemical nickel layer of the injection product (3) A step of plating hexavalent chromium (S75), a step of plating black pearls on the chemical nickel layer of the injection product 3 (S76), and a step of plating gold on the chemical nickel layer of the injection product 3 (S77) ) contains one or more of

Steps (S71) to (S77) included in the electroplating step (S70) may be steps of immersing the injection-molded product 3 in each electroplating solution and applying a voltage to perform electroplating.

The step (S71) may include, for example, a copper sulfate plating solution (eg, sulfuric acid (H2SO4) 55 to 65 ml/L (water 1L) in 190 to 210 g/L (1 L of water) of copper sulfate aqueous solution (CuSO4)) The injection product 3 is immersed in the to maintain 23 ~ 27 ° C., and electroplating can be carried out for 20 10 minutes in a state where a voltage of 5 1 [V] is applied.

Through this, it is possible to impart a gloss to the injection product 3 and increase the ductility of the surface to provide toughness (cushionability) against external impact.

In the step (S72), the injection product 3 is immersed in a nickel plating solution (eg 300-320 g/L of nickel sulfate, 50-60 g/L of nickel chloride, and 45-55 g/L of boric acid). Maintaining 50 ~ 60 ℃, it may be a step of performing electroplating for 15 ㅁ 10 minutes in a state where a voltage of 4.5 ㅁ 1 [V] is applied.

Through this, it is possible to impart corrosion resistance of the injection product 3 and to generate gloss.

In the step (S73), the injection product 3 is immersed in a satin nickel plating solution (eg, 430-480 g/L of nickel lactate, 28-32 g/L of nickel chloride, and 28-32 g/L of boric acid). It may be a step of performing electroplating for 8-10 minutes while maintaining 55°C 5°C and applying a voltage of 4.5°0.2 [V].

Through this, it is possible to improve the corrosion resistance of the injection product 3 and prevent the injection product 3 from generating gloss (matte).

In addition, the plating time can be increased from 5 minutes to 10 minutes compared to the conventional commercially available matte materials (eg, LLM Bright, a product of Cerchem Co., Ltd. containing nickel), thereby improving reliability and increasing the thickness of the plating layer. There is an advantage that there is

The step (S74) is exemplarily performed in a trivalent chromium plating solution (eg, trivalent chromium (Cr3) 20 to 24 g/L, boric acid (H3BO3) 270 to 330 g/L and whitening agent 7 to 13 ml/L) It may be a step of immersing the injection product 3 to maintain 32°C 3°C, and performing electroplating for 3 to 5 minutes in a state where a voltage of 8·2 [V] is applied.

The above-described whitening agent gives white color, and may include, for example, water and ammonium acetate. For example, the white agent may be a 'stabilizer' manufactured by Atotech Co., Ltd.

This can give gloss, give abrasion resistance and improve appearance. The trivalent chromium plating solution used in step (S74) is harmless to the human body than the hexavalent chromium plating solution used in step (S75), which will be described later, and thus can effectively protect workers, and thus can be used for products such as electronics and home appliances. have.

Step (S75) includes, for example, a hexavalent chromium plating solution (eg, 230-270 g/L of trivalent chromic anhydride (CrO3), 0.4-0.8 g/L of sulfuric acid, and 1-2 g/L of trivalent chromium (Cr3) ) to maintain the seed 27~37℃ by immersing the injection product 3 in the ), and electroplating can be performed for 5ㅁ2 minutes while applying a voltage of 3.5ㅁ1[V].

Through this, the appearance is gorgeous and the abrasion resistance of the injection product 3 can be improved.

The step (S76) is an exemplary black pearl plating solution (exemplarily a solution containing two or more of black pearl, nickel, zinc, and tin, for example, BLACK#1 (one of black pearl, nickel, and zinc) of Daejin Surface Treatment Company Including above) 80~120ml/L and BLACK#2 (including at least one of black pearl and tin) 160~240ml/L) is immersed to maintain 25~35℃, 5ㅁ1[ V], electroplating can be performed for 1 minute 30 seconds ㅁ 30 seconds in a state where the voltage is applied.

Through this, a black luster can be applied to the surface of the injection product 3 .

In the step (S77), the injection product 3 is immersed in a gold plating solution (eg, containing 1 to 3 g/L of blue-tipped gold) to maintain 40 to 55° C., and 2 ㅁ 0.5 [V] It may be a process of performing electroplating for 1 minute and 10 seconds in a state in which a voltage of

Through this, it is possible to impart a gold luster to the surface of the injection product 3 .

Referring to Figure 1, the post-treatment step (S80) is a washing process of washing the injection product 3 using ion-exchange water, a chemical peeling process of immersing the injection product 3 in a stripping solution containing sulfuric acid , including at least one of a drying process of drying the injection-molded product 3 , an inspection process of inspecting the injection-molded product 3 , and a packaging process of packaging the injected product 3 .

The washing process may be a process of washing the injected product 3 using ion-exchanged water (pure water) so that the surface of the injected product 3 is not stained.

In the chemical peeling process, the stripping solution may include, for example, sulfuric acid 20ml/L and hydrogen peroxide 20ml/L, and the chemical peeling process is performed by immersing the injection product 3 in the chemical peeling solution to 25°C It may be a process of maintaining ℃ for 20 minutes and 10 seconds.

This method is for plating the entire surface of the injection product 3, but the injection product 3 may be a process of plating only a part of the surface. The chemical nickel plating step (S60) may include a subsequent masking step (hereinafter, a masking step). The masking step is commonly used in the relevant field, and a more detailed description thereof will be omitted.

At this time, as described above, it was said that the present method may include a step (S75) of plating hexavalent chromium on the chemical nickel layer of the injection product 3, and even after the masking step, the injection product 3 remains on the surface of 6 Gachrome may be plated, so a process for peeling it is required.

The stripping solution is a solution for stripping unintentional hexavalent chromium in the partial plating process, and may include 100 parts by weight of water and 3 to 4 parts by weight of sulfuric acid and 2.5 to 3.5 parts by weight of hydrogen peroxide.

When the amount of sulfuric acid in the stripping solution is less than 3 parts by weight, the peeling of the hexavalent chromium layer is not easy and there is a problem that an immersion time for peeling the hexavalent chromium is excessively required, and when it exceeds 4 parts by weight, cracks in the plating layer (chromium plating layer) This problem may occur.

In addition, when the amount of hydrogen peroxide is less than 2.5 parts by weight, the peeling of the hexavalent chromium layer is similarly not easy and there is a problem that an immersion time for peeling the hexavalent chromium is excessively required, and when it exceeds 3.5 parts by weight, cracks in the plating layer (chromium plating layer) Problems may arise. It may be desirable to include 20 ml/L sulfuric acid and 20 ml/L hydrogen peroxide.

The drying process is a process of removing moisture from the injection product 3 and may be performed by a drying apparatus commonly used in the field, and the drying process is performed by drying the injection product 3 at 40°C 3°C for 4 hours. It may be a process of holding for 10 minutes.

The packaging process is a process of packaging the injection-molded product 3 by accommodating it in a box, etc., and the injection-molded product 3 may be accommodated in the box and stored and transported.

On the other hand, the container (2) may include a waterproof membrane (G) provided on the top. As described above, the container 2 may include a base (not shown) and a side wall 21 , and the waterproofing film G may be provided on the side wall 21 .

The waterproofing membrane G includes a water leak detecting means G2 provided on the upper portion of the container 2 (side wall 21) and a waterproofing means G1 provided on the water leak detecting means G2.

The waterproofing film G2 may further include an adhesive layer (not shown) for attaching the container 2 (side wall 21) and the leak detection means G2 to each other, and the adhesive layer (not shown) includes an acrylic adhesive. can do.

The waterproofing means (G1) includes 100 parts by weight of a propylene ethylene copolymer (or ethylene-propylene copolymer), and the propylene-ethylene copolymer is employed to impart elasticity.

In addition, the waterproofing means (G1) includes 60 parts by weight of a mixture of diisocyanate and polyol, which was used to impart waterproofness, and when the mixture of diisocyanate and polyol is less than 60 parts by weight, lubricity and surface coating properties are lowered and when it exceeds 60 parts by weight, the lightness of the entire waterproofing layer is reduced.

Aluminate is added to improve the bonding properties and cohesiveness of each component of the waterproofing means (G1), and when the bonding aid is less than 4 parts by weight, the mixing speed is lowered, and when it exceeds 4 parts by weight, mechanical properties and lightness this may be lowered.

Of course, the waterproofing means (G1) may further include an acrylic adhesive to improve adhesion with the leak detection means (G2).

4, the leak detection means (G2) will be described in more detail, the leak detection means (G2) is provided on the upper portion of the waterproof means (G1) and a plurality of support grooves (G211) are formed on the lower conductive layer ( G21), the insulating layer G22 provided on the lower conductive layer G21, the upper conductive layer G23 provided on the insulating layer G22, and the insulating layer supported by the support groove G211 The absorption expansion part G24 disposed in the layer G22, the lower conductor G25 connected to the lower conductive layer G21, the upper conductor G26 provided on the absorption expansion part G24, and the lower part A conductive line G27 electrically connecting the conductor G25 and the upper conductor G26 may be included.

Here, each of the lower conductive layer G21, the upper conductive layer G23, the lower conductor G25, the upper conductor G26, and the conductive wire G27 may be formed of a conductive film such as copper or aluminum or a metal material. can The insulating layer G22 may include, for example, a plurality of polymer resins having a granular shape. That is, a plurality of polymer resin grains are disposed between the lower conductive layer (G21) and the upper conductive layer (G23) so that the lower conductive layer (G21) and the upper conductive layer (G23) are in a state in which the absorption expansion part (G24) is not expanded. to separate

The absorbent expansion part (G24) is formed of an endothelium (G242) formed of cotton fabric and hemp woven fabric wrapped around polyacrylate (G241), polyacrylate (G241), and an outer shell (G242) surrounding the endothelium (G242). G243).

The absorption expansion part G24 is designed to absorb and expand the water when it comes into contact with water, and the water may be absorbed into the polyacrylate G241 by penetrating the endothelium G242 and the outer shell G243. The polyacrylate (G241) absorbs the water that has passed through the outer shell (G243) and the endothelium (G242) and expands, thereby increasing the volume of the absorption expansion part (G24). In this way, since the water leak detecting means (G2) can absorb water by including the absorption expansion part (G24), it is possible to improve the waterproofness.

The lower part of the upper conductor G26 may be fixed to at least one of the outer shell G243 and the inner shell G242 by a conventional method used in the relevant field, such as a strong adhesive.

Meanwhile, the upper conductive layer G23 may include a plurality of funnel-shaped hoppers G231 . Water may be introduced into the inlet G231a of the hopper G231 and discharged through the outlet G231b. In this case, the plurality of outlets G231b of each of the plurality of hoppers G231 may be disposed at positions corresponding to the central portions of each of the plurality of support grooves G211 in which the absorption and expansion parts G24 are disposed.

The width of the upper conductor G26 decreases from the lower side to the upper side, but the width of the upper end of the upper conductor G26 is smaller than the width of the outlet G231b, and the width of the lower end of the upper conductor G26 is the absorption expansion part ( It may be smaller than the width of G24).

Referring to [A] of FIG. 4 , the absorption expansion part G24 does not expand without absorbing water, so that the lower conductive layer G21 and the upper conductive layer G23 are spaced apart by the insulating layer G22. is in a state of being Accordingly, since no current flows from the lower conductive layer G21 to the upper conductive layer G23 or from the upper conductive layer G23 to the lower conductive layer G21, it can be confirmed that the leakage does not occur.

If water accumulates in the left area (hereinafter (the first area A1)) (the left area of FIG. 4 ) based on the boundary line DL of the neighboring hopper G231 in [A] of FIG. 4, the hopper G231 ), the water in the first area A1 may be collected.

The water in the hopper G231 disposed in the first area A1 is discharged through the outlet G231b and moves downward through the space between the polymer resin grains, and is wider than the outlet G231b (left and right direction based on FIG. 4 ) Length) is pulverized at the upper end of the small upper conductor G26 and is absorbed by the absorption expansion unit G24 by moving downward.

As described above, since the width of the upper end of the upper conductor G26 is larger than the width of the outlet G231b, the water droplets discharged from the outlet G231b may not accumulate at the upper end of the upper conductor G26, and the upper conductor Since the width of (G26) increases toward the lower side, water can move downward. At this time, as described above, since the width of the lower end of the upper conductor G26 is smaller than the width of the absorption expansion unit G24, the water moving downward through the upper conductor G26 moves to the absorption expansion unit G24 and is absorbed. can be

When the water flowing downward through the upper conductor G26 passes through the outer shell G243 and the inner shell G242 of the absorption expansion part G24 and is absorbed into the polyacrylate G241, the polyacrylate (G241) is The upper conductor G26, which expands within a few minutes and is fixed to the upper portion of the absorption expansion unit G24, moves the polymer resin particles upward and comes into contact with the upper conductive layer G23. Through this, current flows through the upper conductive layer G23 and the lower conductive layer G21, and it can be determined that a leak has occurred by checking the current through an ammeter or the like.

As described above, it was said that the outlet (G231b) of the hopper (G231) may be disposed at a position corresponding to the central portion of the support groove (G211). Leakage can be identified by using the expansion part G24 to a minimum. That is, since the absorption expansion part G24 can be disposed only in the support groove G211 without the need to be disposed on the upper surface of the lower conductive layer G21, material savings can be achieved.

In addition, by dividing the upper conductive layer G23 through the boundary line DL formed by the neighboring hopper G231 to zone it, any one of the plurality of zones (for example, the first region as shown in [B] in FIG. 4 ) (A1)) can be identified, so only the leaked area can be repaired.

In more detail with reference to [B] of FIG. 4 , the first of the hoppers G231 disposed in each of the first area A1 and the second area A2 (the area on the right with respect to the boundary line DL) When only the absorption and expansion part G24 disposed in the first area A1 expands due to the accumulation of water only in the hopper G231 disposed in the area A1, the upper conductive layer G23 and the lower portion of the first area A1 are It can be confirmed that only the conductive layer G21 is energized and leakage occurs only in the first area A1, so that only the first area A1 needs to be repaired, so that the repair process can be simplified ( Insulation is preferably provided between G231)).

The present invention described above with reference to the accompanying drawings is capable of various modifications and changes by those skilled in the art, and such modifications and changes should be construed as being included in the scope of the present invention.

Jig: 1 Upper vertical bar: 11
Horizontal bar: 12 Lower vertical bar: 13
Fittings: 14 Connections: 15
Hanger: 16 Extension: 161
Curvature: 162 Receptacle: 2
Sidewall: 21 Overhang: 22
Mounting part: 23 Body: 231
Fasteners: 232 Injection parts: 3

Claims (4)

A pretreatment step (S10) comprising at least one of a locking process for mounting the injection-molded product on a jig and a degreasing process for removing foreign substances from the injection-molded product;
An etching step (S20) of immersing the injection-molded product in an etching solution containing chromic acid to form irregularities on the injection-molded product;
Neutralizing step (S30) of immersing the injection product in a neutralizing agent containing hydrochloric acid to neutralize;
a first activation step of adsorbing palladium and tin to the surface of the injection product (S40);
a second activation step (S50) of removing the tin from the injection product and activating the palladium;
A chemical nickel plating step of immersing the injection product in a pretreatment agent containing nickel to form a chemical nickel layer on the surface of the injection product (S60);
A step of plating copper sulfate on the chemical nickel layer of the injection product, a step of plating nickel on the chemical nickel layer of the injection product, a step of plating satin nickel on the chemical nickel layer of the injection product, a chemical nickel layer of the injection product A process of plating trivalent chromium, a process of plating hexavalent chromium on the chemical nickel layer of the injection product, a process of plating black pearl on the chemical nickel layer of the injection product, and plating gold on the chemical nickel layer of the injection product An electroplating step (S70) comprising at least one of the processes; and
A washing process of washing the injected product using ion-exchanged water, a chemical peeling process of immersing the injected product in a stripping solution containing sulfuric acid, a drying process of drying the injected product, an inspection process of inspecting the injected product, and A post-processing step (S80) including at least one of a packaging process for packaging the injection product;
including,
The jig is
a plurality of upper vertical bars;
a plurality of horizontal bars connected to the lower ends of each of the plurality of upper vertical bars;
a lower vertical bar extending downward from the lower end of the horizontal bar;
a mounting part protruding from the lower vertical bar to mount the injection product;
a connecting bar connecting adjacent upper vertical bars; and
a hook portion provided on the upper end of the upper vertical bar;
including,
The neutralization step (S30),
A step of accommodating the neutralizing agent in the container (S31) and immersing the jig on which the injection product is mounted in the neutralizing agent accommodated in the container (S32),
The container is
a protrusion protruding upward from the top;
a fitting groove recessed downwardly from the upper end of the protrusion; and
a mounting portion including a body inserted into the fitting groove and installed and mounted with a jig, and a plurality of fastening holes formed along the longitudinal direction of the body;
including,
The container includes a waterproof membrane (G) provided on the upper portion,
The waterproof membrane (G) includes a water leak detecting means (G2) provided on the upper portion of the container and a waterproofing means (G1) provided on the upper portion of the water leak detecting means (G2),
The waterproofing means (G1) includes a propylene ethylene copolymer, a diisocyanate and polyol mixture, and aluminate,
The leak detection means includes a lower conductive layer having a plurality of support grooves formed on its upper surface, an insulating layer provided on the lower conductive layer, an upper conductive layer provided on the insulating layer, and the insulating layer supported by the support grooves. an absorption expansion unit disposed in the absorbing expansion unit, a lower conductor connected to the lower conductive layer, an upper conductor provided on the absorption expansion unit, and a conductive wire electrically connecting the lower conductor and the upper conductor;
The absorbent expansion unit is composed of a polyacrylate, an endothelium formed of a cotton fabric wrapped around the polyacrylate, and an outer skin surrounding the endothelium and formed of a hemp woven fabric,
The upper conductive layer includes a plurality of funnel-shaped hoppers, and the outlet of each of the plurality of hoppers is disposed at a position corresponding to the center portion of each of the plurality of support grooves,
Wherein the width of the upper conductor decreases from the lower side to the upper side, the width of the upper end of the upper conductor is smaller than the width of the outlet, and the width of the lower end of the upper conductor is smaller than the width of the absorption expander. The plating method of the exhibition. delete delete delete

Images