CN201793785U - Rinsing bath device in copper foil surface treatment system - Google Patents
Rinsing bath device in copper foil surface treatment system Download PDFInfo
- Publication number
- CN201793785U CN201793785U CN 201020549834 CN201020549834U CN201793785U CN 201793785 U CN201793785 U CN 201793785U CN 201020549834 CN201020549834 CN 201020549834 CN 201020549834 U CN201020549834 U CN 201020549834U CN 201793785 U CN201793785 U CN 201793785U
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- conductive roller
- copper foil
- conductive rollers
- copper
- rinsing bath
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Abstract
The utility model discloses a rinsing bath device in a copper foil surface treatment system. The rinsing bath device comprises a rinsing bath; a submerged roller is arranged at the inner bottom of the rinsing bath; a conductive roller is arranged at one end above the outer part of the rinsing bath; an upper guide roller is arranged at the other end above the outer part of the rinsing bath; a liquid squeezing roller is arranged above the conductive roller; a flush pipe used for flushing residue solution at the end part of the conductive roller is arranged at the end part of the conductive roller to prevent residue copper sulfate solution from flowing into the surface of the conductive roller along copper foil, so that copper nodules caused by the reason that copper is plated at the end part of the conductive roller can be eliminated; in addition, a shower pipe with a water nozzle is additionally mounted at the lower part of the conductive roller, and is used for directly flushing the surface of the conductive roller to eliminate copper plated in the middle of the conductive roller, so that the copper plated on the surface in the middle of the conductive roller is decreased; and by rinsing either the end part of the conductive roller or the lower part of the conductive roller, the temperature of the surface of the conductive roller can be reduced, the electric conductivity of the conductive roller is enhanced, and the quality of copper foil and the economic benefit of enterprises are improved.
Description
Technical field
The utility model relates to the superficial treatment system of Copper Foil, relates in particular to the washing bath device in the superficial treatment system of Copper Foil.
Background technology
At present, electrolytic copper foil is the irreplaceable main base material of electronic industry, is widely used in high-tech areas such as electronics, space flight, communication, national defence, and market outlook are very wide.Want to produce high-quality Copper Foil, just to the production technique of Copper Foil, production unit is had higher requirement.In all technological processs, superficial treatment system is the most important thing, superficial treatment system mainly is to generate the back at the hair paper tinsel its surface is handled, and mainly contains system handles links such as pickling, alligatoring, curing, cobalt plating, zinc-plated, chromium plating, spray silicon, oven dry and constitutes.Through after the surface treatment, can improve the peel strength of Copper Foil, tensile strength, and can make Copper Foil possess performances such as anti-oxidation, moistureproof, drug-resistant, after-treatment system is divided into 18 cell bodies altogether, is subdivided into 9 solution tanks and 9 washing baths.When Copper Foil enters washing bath by solution tank, S has worn a spot of copper-bath after the electrochemical reaction through solution tank goes out groove, as shown in Figure 1, and after liquid squeezing roll 1 extruding of conductive rollers 2 tops, the acid solution of S face is got off by average extruding, flows back to copper-bath groove 8 according to Copper Foil 7 surfaces.In order to guarantee not take place defectives such as electric shock, the liquid squeezing roll 1 and the conductive rollers 2 of conductive rollers 2 tops pressed to such an extent that all compare closely, so the acid solution after S face limit portion is extruded can flow to the surface of conductive rollers 2 along the Copper Foil 7 and the joint of conductive rollers 2, thereby cause the galvanic deposit of cupric ion, and Copper Foil 7 forms many convex epireliefs through conductive rollers 2 surperficial the time, it is the copper gold-plating that we say, had a strong impact on apparent mass, apparent mass has directly influenced the quality of finished product paper tinsel, may be judged to B level or even useless paper tinsel, influence economic benefit of enterprises.
Summary of the invention
The purpose of this utility model provides the washing bath device in a kind of superficial treatment system of Copper Foil, can avoid the generation of copper gold-plating, improves the quality of Copper Foil.
The utility model adopts following technical proposals: the washing bath device in a kind of superficial treatment system of Copper Foil, comprise washing bath, the washing bath inner bottom part is provided with the liquid lower roll, top, washing bath outside one end is provided with conductive rollers, the other end is provided with deflector roll, wherein the conductive rollers top is provided with liquid squeezing roll, and it is characterized in that: an end of described conductive rollers is provided with the wash pipe that is used to wash conductive rollers end residual solution.
The other end of described conductive rollers also is provided with the wash pipe that is used to wash conductive rollers end residual solution.
The bottom of described conductive rollers also is provided with the water jet standpipe that is used to wash conductive rollers middle part residual solution, and water jet standpipe is provided with nozzle.
The utility model adopts and to install the water pipe flushing additional at the conductive rollers two ends and flow into the conductive rollers surface to stop residual copper-bath along Copper Foil, thereby can eliminate the copper facing of conductive rollers end and the copper gold-plating that causes; Also below conductive rollers, installed one water nozzle water jet standpipe in addition additional and directly washed the conductive rollers surface to eliminate the middle part copper facing of conductive rollers, the copper facing that has alleviated the conductive rollers middle part surface; And washing of conductive rollers end and the washing of conductive rollers below all can reduce the roll surface temperature of conductive rollers, strengthen its conductivity, thereby improve the quality and the economic benefit of enterprises of Copper Foil.
Description of drawings
Fig. 1 is the prior art constructions synoptic diagram;
Fig. 2 is a main TV structure synoptic diagram of the present utility model;
Fig. 3 is a left TV structure synoptic diagram of the present utility model.
Embodiment
As Fig. 2, shown in Figure 3, washing bath device in the superficial treatment system of the utility model Copper Foil, comprise washing bath 8, washing bath 8 inner bottom parts are provided with a liquid lower roll 4, washing bath 8 outside tops one end is provided with conductive rollers 2, the other end is provided with deflector roll 3, wherein conductive rollers 2 tops are provided with liquid squeezing roll 1, the both ends of conductive rollers 2 are provided with wash pipe 6 and the wash pipe 9 that is used to wash conductive rollers end residual solution respectively, have eliminated the copper gold-plating that residual solution causes along Copper Foil 7 ends inflow conductive rollers.The bottom of conductive rollers 2 also is provided with the water pipe 5 that is used to wash conductive rollers middle part residual solution, and water pipe 5 is provided with nozzle, has alleviated the copper facing of conductive rollers middle part surface.The bath of conductive rollers 2 ends, conductive rollers 2 belows are washed the roll surface temperature that all can reduce conductive rollers 2, thereby can be strengthened its conductivity.Through overtesting, after using, the utility model can avoid the generation of copper gold-plating, and the quality of Copper Foil is improved, thereby can improve economic benefit of enterprises.
Claims (3)
1. the washing bath device in the superficial treatment system of a Copper Foil, comprise washing bath, the washing bath inner bottom part is provided with the liquid lower roll, top, washing bath outside one end is provided with conductive rollers, the other end is provided with deflector roll, wherein the conductive rollers top is provided with liquid squeezing roll, and it is characterized in that: an end of described conductive rollers is provided with the wash pipe that is used to wash conductive rollers end residual solution.
2. the washing bath device in the superficial treatment system of Copper Foil according to claim 1, it is characterized in that: the other end of described conductive rollers also is provided with the wash pipe that is used to wash conductive rollers end residual solution.
3. the washing bath device in the superficial treatment system of Copper Foil according to claim 1 and 2 is characterized in that: the bottom of described conductive rollers also is provided with the water jet standpipe that is used to wash conductive rollers middle part residual solution, and water jet standpipe is provided with nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020549834 CN201793785U (en) | 2010-09-30 | 2010-09-30 | Rinsing bath device in copper foil surface treatment system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020549834 CN201793785U (en) | 2010-09-30 | 2010-09-30 | Rinsing bath device in copper foil surface treatment system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201793785U true CN201793785U (en) | 2011-04-13 |
Family
ID=43848705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020549834 Expired - Fee Related CN201793785U (en) | 2010-09-30 | 2010-09-30 | Rinsing bath device in copper foil surface treatment system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201793785U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103074655A (en) * | 2013-02-26 | 2013-05-01 | 灵宝华鑫铜箔有限责任公司 | Surface treatment method for use in production of electrolytic copper foil |
| CN103088397A (en) * | 2013-02-07 | 2013-05-08 | 灵宝华鑫铜箔有限责任公司 | Method for eliminating rough surface and red line defects in copper foil surface treatment |
| CN103173793A (en) * | 2011-12-20 | 2013-06-26 | 西安航天远征流体控制股份有限公司 | Water spraying device of electrolytic copper foil device |
| CN105780098A (en) * | 2014-12-23 | 2016-07-20 | 天津市麟祥久益科技有限公司 | Electroplated aluminum plate washing equipment |
| CN106299206A (en) * | 2015-09-30 | 2017-01-04 | 住友化学株式会社 | Film manufacturing method and film manufacturing device |
| CN112663119A (en) * | 2020-12-04 | 2021-04-16 | 重庆金美新材料科技有限公司 | Device and method for preventing conductive roller from being plated with copper |
| CN113755917A (en) * | 2021-08-02 | 2021-12-07 | 重庆金美新材料科技有限公司 | Electroplating system |
| WO2022134491A1 (en) * | 2020-12-24 | 2022-06-30 | 重庆金美新材料科技有限公司 | Device and method for preventing crystallization of plating solution on squeezing assembly of electroplating apparatus |
| CN114703538A (en) * | 2022-03-24 | 2022-07-05 | 重庆金美新材料科技有限公司 | Copper removing device for conductive belt |
-
2010
- 2010-09-30 CN CN 201020549834 patent/CN201793785U/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103173793A (en) * | 2011-12-20 | 2013-06-26 | 西安航天远征流体控制股份有限公司 | Water spraying device of electrolytic copper foil device |
| CN103088397A (en) * | 2013-02-07 | 2013-05-08 | 灵宝华鑫铜箔有限责任公司 | Method for eliminating rough surface and red line defects in copper foil surface treatment |
| CN103088397B (en) * | 2013-02-07 | 2015-11-18 | 灵宝华鑫铜箔有限责任公司 | A kind of method removing hair side red-way defect in copper foil surface process |
| CN103074655A (en) * | 2013-02-26 | 2013-05-01 | 灵宝华鑫铜箔有限责任公司 | Surface treatment method for use in production of electrolytic copper foil |
| CN105780098A (en) * | 2014-12-23 | 2016-07-20 | 天津市麟祥久益科技有限公司 | Electroplated aluminum plate washing equipment |
| CN106299206A (en) * | 2015-09-30 | 2017-01-04 | 住友化学株式会社 | Film manufacturing method and film manufacturing device |
| CN112663119A (en) * | 2020-12-04 | 2021-04-16 | 重庆金美新材料科技有限公司 | Device and method for preventing conductive roller from being plated with copper |
| CN112663119B (en) * | 2020-12-04 | 2022-05-31 | 重庆金美新材料科技有限公司 | Device and method for preventing conductive roller from being plated with copper |
| WO2022134491A1 (en) * | 2020-12-24 | 2022-06-30 | 重庆金美新材料科技有限公司 | Device and method for preventing crystallization of plating solution on squeezing assembly of electroplating apparatus |
| CN113755917A (en) * | 2021-08-02 | 2021-12-07 | 重庆金美新材料科技有限公司 | Electroplating system |
| CN113755917B (en) * | 2021-08-02 | 2023-04-14 | 重庆金美新材料科技有限公司 | Electroplating system |
| CN114703538A (en) * | 2022-03-24 | 2022-07-05 | 重庆金美新材料科技有限公司 | Copper removing device for conductive belt |
| CN114703538B (en) * | 2022-03-24 | 2024-05-10 | 重庆金美新材料科技有限公司 | Copper removing device for conductive belt |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110413 Termination date: 20130930 |