WO2008004315A1

WO2008004315A1 - Process for production of decoratively plated articles by utilizing the impartation of electroconductivity to resin by sputtering

Info

Publication number: WO2008004315A1
Application number: PCT/JP2006/313968
Authority: WO
Inventors: Kunihiro Kakihara; Yoshinori Noda; Takashi Ouro
Original assignee: Kakihara Kogyo Co., Ltd.
Priority date: 2006-07-05
Filing date: 2006-07-13
Publication date: 2008-01-10
Also published as: WO2008004558A1

Abstract

In the process of the invention, surface roughening of a molded resin article and impartation of electroconductivity to the article are conducted by a dry process without conventional chemicals such as chromic acid, which brings about protection of the article from surface deterioration by chemicals, environment load reduction due to nonuse of chemicals having large environment load, inhibition of plated resin articles from exfoliation, and secure safety of the articles. The process comprises the surface cleaning/activation step (S1) of conducting the surface cleaning and surface modification /activation of a molded resin article by gas sputtering, the metal thin film formation step (S2) of forming a metal thin film on the surface of the resulting resin article by metal sputtering, the electroconductive film formation step (S4) of forming an electroconductive film of nickel, copper or the like on the metal thin film by sputtering, and the final electroplating step of electroplating the resulting resin article.

Description

Specification

Manufacturing method for decorative products using resin conductive material by sputtering

TECHNICAL FIELD [0001] The present invention relates to a resin plating technique for applying metal plating to a resin molded product, and in particular, before the resin plating until the surface adjustment process of the resin resin plating, the etching process power, and the conductive metal treatment process. Regarding the treatment, the present invention relates to a method for producing a decorative adhesive product using a resin conductive material by sputtering, which is carried out by sputtering treatment without using hexavalent chromic acid.

Background art

[0002] As shown in Fig. 9, a conventional general resin plating film forming method includes: an etching process for roughening the surface of the resin molded article, an etching neutralization process, Direct plating pretreatment process such as catalyst application process, conductive process (or electroless plating), etc. This is a plating method in which bright nickel plating and MP nickel plating (microporous nickel plating) are used for each plating treatment, and finally chromium plating is applied to finish. Thus, since the resin molded product is non-conductive, a conductive step (direct plating pretreatment or electroless plating) is required to impart conductivity to the resin as a pretreatment for electroplating.

[0003] As shown in Fig. 10, the conductive process (or electroless plating) of a resin molded product that uses a general wet method for resin plating is performed with high concentrations of chromic acid (hexavalent chromium) and sulfuric acid. Etching treatment using mixed acid, washing with water, neutralizing with chromic acid, washing with water, applying a catalyst such as PdZSn, washing with water, activating the water and washing with water. To do.

[0004] As a pretreatment technique for plating when electroless plating is applied to a resin molded product, for example, as disclosed in Japanese Patent Application Laid-Open No. 5-132785, “Electroless plating pretreatment method”, a glass fiber is used. The surface of the insulating material is treated with chromic anhydride and sulfuric acid in the etching treatment of the insulating material, which is performed as a pretreatment when the surface of the insulating material made of polyimide resin containing An electroless plating pretreatment method has been proposed in which a two-stage etching process is performed in which etching is performed using a solution containing hydrazine and then etching is performed using a solution containing hydrazine. Patent Document 1: Japanese Patent Laid-Open No. 5-132785

[0005] The resin etching process that roughens the resin surface, which is the basis of this resin plating, still uses a mixed acid of high-concentration chromic acid (hexavalent chromium) and sulfuric acid. This etching process using chromic acid has the potential to adversely affect the human body even during work in the process that requires only waste liquid treatment. At present, various technologies have been proposed to eliminate the etching process using chromic acid. However, a pretreatment has been proposed that satisfies the stringent adhesion standards that are the basic performance of resin plating, such as automotive parts standards! I did not hesitate.

[0006] For example, a PA resin (polyamide resin, 6-nylon) resin molded product can be surface-roughened using a hydrochloric acid-based etching solution. POM resin (polyacetal) can be etched using hydrochloric acid Z sulfuric acid mixed acid or phosphoric acid Z sulfuric acid mixed acid. LC P resin (liquid crystal polymer) can be etched using caustic potash etching. As described above, some resin materials can be etched without using a chromic acid-based etching solution.

[0007] A resin molded product of a resin that is relatively weak in acidity, such as PPE resin (polyphenyl ether), can be surface-roughened using a permanganic acid-based etching solution.

[0008] A resin molded product of a general-purpose resin such as ABS resin (acrylonitrile Z butadiene Z styrene resin) can be etched using a manganic acid-based etchant. Etching can be performed with a weak etchant such as permanganate etching by adding a solvent pre-etching process. Disclosure of the invention

Problems to be solved by the invention

[0009] However, in the above-described wet etching process, various chemicals such as a mixed acid of chromic acid and sulfuric acid with a high concentration are used to conduct conductive resin. In some cases, chemicals may remain on the surface of the resin molded product. As a result, the surface layer thin film of the resin molded product peeled off on some of the products plated with resin, and floated together with the plating film thereon, and the plating film sometimes cracked. This floating force S sag film is a metal film of about 30-50 m, and its resin-plated product was used. Occasionally, there were problems such as the user's finger cutting.

[0010] Further, depending on the resin material of the resin molded product, there are cases where the conductive treatment by the wet method as described above cannot be performed or is difficult. For example, PCZABS resin is mainly used for plating automotive door handles. PC for the same type of resin

PCZ polyester-based materials such as ZPBT and PCZPET are used. This is because PCZ polyester-based materials are more suitable as a resin material for door handles, but it is not possible to make resin-handled door handles that can meet automotive specifications that are difficult to plate.

[0011] In the etching process, a mixed acid of high concentration chromic acid and sulfuric acid is used. The work environment was bad because formalin and ammonia, which are carcinogenic substances, were used in the electroless plating process. In addition, it requires a complexing agent, making it difficult to treat wastewater. Since a water washing step is required after each treatment step, the amount of water used has problems such as winter.

[0012] On the other hand, an etching process in which metal is struck into the resin with acceleration such as magnetron sputtering has been devised. However, the surface of the resin may be struck with argon and the surface temperature of the process may be increased. However, low melting point materials such as ABS resin have the problem of being easily deformed by heat.

[0013] In the etching process by the glow discharge plasma method, sufficient metal with a low ionization rate cannot be accelerated, and therefore, peeling adhesion strength according to the resin plating standard cannot be obtained. It was.

[0014] The present invention has been devised in order to solve the problem. That is, the object of the present invention is to provide a resin surface roughening to a resin molded product by a processing method that does not use chemicals such as a mixed acid of chromic acid and sulfuric acid in the conventional etching process and conductive process, that is, a dry method. By adding conductivity and imparting conductivity, the surface layer of the resin does not deteriorate due to such chemicals, and it is possible to prevent cracking due to peeling between the oils and prevent cracking, and the safety of the resin-plated product Is to provide a method for producing a decorative product using a resin conductive material by sputtering.

Furthermore, the object of the present invention is to suppress the deformation of the resin molded product and to sputter By using a sputtering device that has been improved so that it can be coated, by imparting conductivity to the resin molded product by the dry method, it is possible to plate a strong resin material that is difficult to fit by the wet method, Another object of the present invention is to provide a method for producing a decorative plated product, which can easily carry out a pretreatment process for various types of resin molded products.

Means for solving the problem

[0015] According to the present invention, in the sputtering apparatus, the surface of the resin molded product is cleaned with a gas by sputtering and the surface modification activity is performed in a vacuum atmosphere state. Next, in the same sputtering apparatus, a metal thin film forming step (S2) for forming a metal film on the surface of the resin molded product to ensure adhesion to the resin by sputtering, Subsequently, a conductive film forming step (S4) for forming a conductive film on the metal thin film formed on the resin molded product by the metal thin film forming step (S2) by sputtering, and the conductive Production of decorative plating products using resin conductive material by sputtering, which is characterized by the fact that it has an electric plating process for electroplating the resin molded product after the chemical film formation process (S4) is completed. A method is provided.

Following the metal thin film forming step (S2), it is preferable to include an active treatment step (S3) in which the metal thin film formed on the resin molded product is activated by an argon ion source treatment.

[0016] In the resin surface cleaning 'activation step (S1), a magnetron is formed in a vacuum atmosphere.

'It is preferable to irradiate argon gas with a small amount of air remaining on the surface of the resin molded product by sputtering.

In the resin surface cleaning 'activation step (S1), it is preferable to irradiate ion source by injecting argon and trace oxygen into the surface of the resin molded product by a magnetron sputtering method in a vacuum atmosphere. ,.

[0017] For example, in the metal thin film forming step (S2), a single metal having a strong binding force with oxygen or a strong binding force with oxygen is formed on the surface of the resin molded product in a vacuum atmosphere. An alloy containing a metal, or a magnetic metal or an alloy containing a magnetic metal can be formed by sputtering.

In the metal thin film forming step (S2), a magnetic metal ionized to 0.01 to 50% can be formed on the surface of the resin molded article in a vacuum atmosphere. For example, in the metal thin film forming step (S2), the film is formed so as to have a film thickness of about 0. O / zm.

[0018] In the conductive film forming step (S4), it is preferable to form nickel or copper.

For example, in the conductive film forming step (S4), the film is formed so that the film thickness is about 0.1 μm to 5.0 m.

[0019] The electroplating process is performed in the order of bright copper sulfate plating (S6), semi-bright nickel plating (S7), Mitsuzawa-Neckel plating (S8), MP nickel plating (microporous nickel plating) (S9). It is preferable that each plating process is performed in step (b), and the plating process is completed by applying a decorative finish plating (S10).

For example, in the decorative finish plating (S10), a plating process such as trivalent chromium plating, tin Z nickel alloy plating, ruthenium or gold plating is performed.

The invention's effect

[0020] As described above, in the present invention, the surface of the resin molded product is cleaned with gas by sputtering and the surface modification activity in the sputtering apparatus in the resin surface cleaning 'activity process (S1). Next, in the metal thin film deposition step (S2), in the same sputtering apparatus, a single metal having a strong binding force with oxygen or an alloy containing a metal having a strong binding force with oxygen, or a magnetic metal Alternatively, an alloy containing a magnetic metal is formed, and then a conductive film is formed by sputtering a predetermined metal on the metal thin film formed on the resin molded product in the conductive film forming step (S4). By forming a film, it is possible to impart conductivity by forming a film on the resin molded product by a dry method. Therefore, it is possible to form a film on a new special material, which was impossible with the conventional wet method, at a low temperature, so that the resin molded product softens as a result of heating as in the past, and prevents defects when it is further deformed. can do

[0021] Further, since it is possible to impart a high addition / high function film (transparent protective film, high hardness film, etc.) to the outermost layer after electric plating or after dry plating, plating using a dry method is possible. Application as surface treatment technology other than pretreatment technology is possible.

Conductive film processing step (S4) is performed by adding an activation processing step (S3) after the metal thin film deposition step (S2), which is processed for the purpose of obtaining adhesion to the resin. The adhesion of the chemical film becomes stronger. After the conductive film formation step (S4), the final resin-plated product can be produced simply by applying the same electrical plating as in normal resin-plating.

[0022] Further, the pretreatment of the resin plating, that is, the conductive treatment of the resin molded product! By changing from the conventional wet method using hexavalent chromium to the dry method, the resin plating is performed. Because it is not a wet conductive process that uses chemicals that have a large environmental impact in production, environmental impact substances can be drastically reduced. As before, waste liquid treatment such as hexavalent chromium can be unnecessary or drastically reduced.

Brief Description of Drawings

[0023] FIG. 1 is a process diagram showing a method for producing a decorative garnish using a resin conductive material obtained by sputtering in Example 1.

[FIG. 2] A bright nickel plating method is shown, (a) is a process diagram of a resin conductive treatment, and (b) is a wet electroplating process diagram.

FIG. 3 is a cross-sectional view of a plating film attached by the method for producing a decorative garment using the resin conductive material obtained by sputtering in Example 1.

[Fig. 4] A table showing "Table 1. Plate adhesion measurement results".

FIG. 5 is a table showing “Table 2. Sputtering experimental conditions”.

[Fig. 6] This is a table showing “Table 3. Results of actual product adhesion measurement (Ni—Cr) Nol”.

[Fig. 7] “Table 4. Actual product adhesion measurement results (Ni—Cr) No2j”.

FIG. 8 is a table showing “Table 5. Actual Product Adhesion Measurement Results (Cr)”.

FIG. 9 is a process diagram showing a conventional bright nickel plating method.

FIG. 10 is a process chart showing a conventional method for conducting a resin.

Explanation of symbols

[0024] S1 Wax surface cleaning and activation process

S2 Metal thin film deposition process

S3 Activation process

S4 Conductive film formation process

S5 Activation process

S6 Bright copper sulfate plating S7 Semi-bright nickel plating

S8 Bright nickel plating

S9 MP nickel plating (microporous nickel plating)

S10 with decorative finish

BEST MODE FOR CARRYING OUT THE INVENTION

[0025] The method for producing a decorative garnish using a resin conductive material by sputtering according to the present invention is a pretreatment method in which the wet conductive method of the resin plating is changed to the dry conductive method. After the electrification, wet electroplating is performed as usual.

Example 1

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a process diagram showing a method for producing a decorative garment using the resin conductive material by sputtering in Example 1. FIG. 2 shows an example of the bright nickel plating method. (A) is a process diagram of a resin conductive treatment, and (b) is a wet electroplating process diagram. FIG. 3 is a cross-sectional view of the plating film attached by the method for producing a decorative garment using the resin conductive material obtained by sputtering in Example 1.

In the manufacturing method of the decorative garnish using the resin conductive material by sputtering according to Example 1 of the present invention, the resin molded product is set in a jig, and the resin surface cleaning 'active process step S1 is performed. Inside the sputtering device, the surface of the resin molded product is cleaned with gas and activated by surface modification in a vacuum atmosphere, and then in the metal thin film formation step S2, the resin molding is performed in the same sputtering device. On the surface of the product, a single metal having a strong binding force with oxygen, or an alloy containing a metal having a strong binding force with oxygen, or a magnetic metal or an alloy containing a magnetic metal is deposited by sputtering, In this conductive film forming step S4, a conductive metal film is formed by sputtering a predetermined metal on the metal thin film formed on the resin molded product. In this way, the surface of the resin molded product is roughened and a metal film is formed by a dry-type magnetron sputtering method or the like to impart conductivity. The resin molded product subjected to the resin conductive treatment is a method for producing a decorative swaged product, in which the jig force is also removed and the electric galling process S5 to S10 is performed as described later.

[0027] Sputtering equipment used in magnetron sputtering is a vacuum atmosphere. This is an apparatus that ionizes the target metal and deposits it on the resin molded product by argon gas ion irradiation. This sputtering process forms a target metal film on the resin molded product or irradiates the resin molded product with gas.

[0028] The resin molded product to be used as a decorative product of the present invention is a so-called "appearance product" such as a resin-coated component for automobiles, a housing-related resin-plated component such as a shower or faucet component. With the conventional method of manufacturing decorative garments, the plating film floats due to the separation of the resin-molded products, which may cause personal injury such as cutting hands. is important. Incidentally, if it is a “functional product” such as a printed circuit board, it is not necessary to apply such decoration.

[0029] 'In the active I spoon step S1, the degree of vacuum, for example, 10 ^{_ 1} (= 10 - 1 power) Pa extent of the magnetron in a vacuum atmosphere such as a vacuum chamber one'榭脂surface cleaning by sputtering, Clean and activate the surface of the resin in vacuum. For example, it is irradiated with argon gas with a small amount of air remaining. Or, ion source irradiation with argon and trace oxygen is performed.

This resin surface cleaning 'active step S1 can use a plasma treatment method by an arc plasma deposition method in addition to the magnetron' sputtering method.

[0030] The metal thin film forming step S2 is a step for securing the adhesion between the resin and the plating film by the magnetron-sutter method in a vacuum atmosphere such as a vacuum chamber. Vacuum, for example 10 ^_2 ~ ³ (10 - 2-3 square) pulled about Pa, chromium ionized to 0.01 to 50% by the plasma, molybdenum, tungsten, titanium, zirconium, aluminum - © beam, indium A single metal of a metal having a strong binding force with oxygen, such as nickel, noradium (an oxyphilic metal) or an alloy containing these metals is formed on a resin molded article.

[0031] In addition, in the metal thin film forming step S2, it is preferable to use ion-concentrated metal alloy-- nickel chrome alloy (alloy ratio = 50:50) or metal chrome. The metal thin film for ensuring the adhesion between the resin and the plating film is not only a good adhesion with the resin but also a conductive film for smoothly treating the electric plating in the next process. It is necessary to use a metal with good adhesion. In the metal thin film forming step S2, it is preferable to use chromium alone, chromium-nickel alloy, aluminum, copper alloy or the like. Alloy ratio is not specified . A film-forming metal material with good adhesion is selected according to the type of resin and molding conditions. For example, metallic copper can be used. There is no limit on the film thickness to ensure the adhesion of plating. Considering plating stress, 0.05 / ζ πι to 0.5 / zm was appropriate.

[0032] It is preferable that the resin molded product that has undergone the metal thin film formation step S2 is further subjected to an activation treatment in an activation treatment step S3. For example, a metal thin film formed on a resin molded product at a ratio of 0.01 / ζ πι to 2. O / z m is activated by an argon ion source treatment. This increases the adhesion between the resin molded product and the metal thin film.

[0033] Conductive film forming step S4 is a step of forming a conductive film for electroplating the resin molded article. The conductive film for electroplating is a conductive film for electroplating, but the plating film formed by the dry plating method and the film deposited by the electroplating method are closely attached. It is necessary to be a metal film that can withstand acid treatment for ensuring the property, soft etching with a dilute oxidizing agent, or electrolytic activation treatment. Therefore, the appropriate film thickness by the conductive film forming step S4 is, for example, 0. force and 2. O / zm in the case of metallic copper. This conductive film formation process S4 film formation is a pre-process (activation process) of wet electroplating (electrocopper plating and electronickel plating), which is a subsequent process that has good adhesion to the underlying metal. A metal other than metallic copper can be deposited if S5 is simple and has high adhesion.

[0034] In the electroplating process, as shown in Fig. 2 (a), the resin surface cleaning'active process Sl, the metal thin film deposition process S2, and the conductive film deposition process S4 are completed. The resin molded product that has been processed up to the conductive finish is taken out from the vacuum chamber, replaced with a jig for electrical plating, and finished in the usual electrical plating process.

[0035] In wet electroplating, as shown in Fig. 2 (b), a dry squeeze film is activated in the activation step S5 on a resin molded product that has been subjected to a resin conductivity treatment by magnetron sputtering. To do. This activation process S5 is a process for ensuring close contact with the electric plating. For example, when copper was used as the final conductive metal for dry plating, it was performed in a soft etching process that was immersed for 30 seconds in a 20 gZL sodium persulfate solution. There are various methods for this active process S5 depending on the type of conductive metal used in the dry plating. As long as the adhesion between the dry plating film and the electric plating film can be secured, the method is not limited.

[0036] Electrical plating process S6 to S10 are normal resin plating such as bright copper sulfate plating or metal plating The electric mesh used in the can be adapted. For example, as shown in the figure, bright copper sulfate plating S6, semi-bright nickel plating S7, bright nickel plating S8, MP nickel plating (microporous nickel plating) S9 are applied in this order.

Finally, apply plating finish S10 with trivalent chromium plating, tin Z nickel alloy plating, ruthenium or gold plating, and finish the plating process.

This electric plating process S6 to S10 is an example, and it is needless to say that other metals can be bonded.

[0037] Bright copper sulfate plating 30 m, semi-bright nickel plating 10 m, bright nickel plating 10 μm, microporous nickel plating 1.3 m, chromium plating about 0.35 μm. We conducted plating adhesion tests and thermal cycle tests such as thermal cycle tests to evaluate plated products.

[0038] An experiment relating to the adhesion of the product plated by the method for producing a decorative swaged product using the resin conductive material by sputtering in Example 1 of the present invention will be described. Fig. 4 is a table showing "Table 1. Plate adhesion measurement results". Figure 5 is a table showing “Table 2. Sputtering Experiment Conditions”. Fig. 6 is a table showing "Table 3. Results of actual product adhesion measurement (Ni-Cr) Nol". Fig. 7 is a table showing "Table 4. Actual product adhesion measurement results (Ni-Cr) No2". Fig. 8 is a table showing "Table 5. Actual product adhesion measurement results (Cr)".

(1) Preliminary test (grease plate)

Using a resin plate, we examined roughly the adhesion strength by material, whether there was an effect of oxygen injection on the surface cleaning of the resin before film formation, the difference depending on the resin material, the influence of inorganic filler, etc. The results are shown in “Table 1. Plate adhesion measurement results” in FIG. As shown in Table 1, the adhesion was improved by the oxygen gas injection during the surface cleaning of the resin. However, the effect of oxygen gas injection was strong for the ABS resin plate. The ABS resin plate test was conducted using a three-stage plate (gate = 3mmZ2mmZlmm = bottom) with different resin thickness. The thicker the film thickness, the more closely the shape and molding conditions were, and it was predicted that the adhesion would change. In terms of materials, the adhesion strength of nylon-based and ABS-based resins was high, and it proved powerful.

[0039] (2) Test results with actual molded products The test conditions are shown in “Table 2. Sputtering Experiment Conditions” in FIG. Two types of metallurgy metal for plating adhesion were tested: nickel 'chromium alloy (alloy ratio = 50:50) and chromium (99.9%). The conductive film used metal copper (99.9%) as a target.

[0040] (3) Actual product adhesion measurement results

Figures 6 to 8 show the results for nickel and chromium alloys in Table 3. Actual product adhesion measurement results (Ni—Cr) Nol and Table 4. Actual product adhesion measurement results (Ni—Cr) No2. Table 5. Actual product adhesion measurement results (Cr) ”shows the results for chromium.

It was found that resin plating with high adhesion could be made under the conditions of experimental conditions 4, 8 and 10 shown in “Table 2. Sputtering experimental conditions”. In particular, PAZABS resin showed a high adhesion value of max 4.75 kgfZcm = about 47 NZcm. Other materials can be mass-produced by selecting appropriate conditions.

[0041] (4) Thermal shock test results

PCZABS resin plating prototype (product of NiZCr experimental condition 10) and PA / ABS resin plating prototype (same condition) 30 ° C / 0.5Hr → 80 ° C / 0.5Hr, 120 cycles The thermal shock test was conducted, but the buoyancy phenomenon due to the peeling of the thin resin layer film at the part was not confirmed. Therefore, it has been proved that the use of the method of the present invention makes it possible to mass-produce safe resin-plated parts.

[0042] The method for producing a decorative garnish using the resin conductive material by sputtering according to the present invention uses the dry galvanization method for the pretreatment of the resin plating, and thus, using conventional chromic acid. Unlike the conductive wrinkle treatment method, various types of resin can be targeted. For example, AB S resin (acrylonitrile / butadiene / styrene), PCZABS resin (polycarbonate Z acrylonitrile / butadiene / styrene), PC / PET resin (polycarbonate / polyethylene terephthalate), PCZPBT resin (polycarbonate Z polybutylene terephthalate) , LCP resin (liquid crystal polymer), PA resin (polyamide), PA / ABS (polyamide Z atari port-tolyl / butadiene / styrene), PPE resin (polyphenylene ether), PP resin (polypropylene), PPS resin (polyphenylene sulfide), SPS resin (crystalline polystyrene), PS resin (polystyrene), MMA resin (methyl methacrylate), epoxy resin, urethane resin, PET resin (polyethylene terephthalate) , PBT oil (polybutylene terephthalate), P c There are resin, such as polycarbonate. Furthermore, it is possible to target polymer alloys of these resins.

[0043] In particular, the adhesion between the nylon-based resin and the dry-type adhesive film is good. Nylon-based resin is difficult to obtain a beautiful plating appearance due to etching treatment with hydrochloric acid or the like when wet-coated, and it is difficult to obtain a beautiful plating appearance. A beautiful appearance like a messy product can be obtained.

[0044] Also in ABS resin generally used for resin plating, a plating adhesion strength of 1 kgfZcm (9.8 N / cm) or more was obtained. In the resin plating pretreatment process using the dry-type metal plating of the present invention (oil conductive process), the test was conducted with a plating adhesion strength of 0.5 kgf / cm (4.9 NZcm) as a passing target value. I did it. In the automotive standard, 1. OKgf / cm (9.8 NZcm) is set as an effort target value, but it can be used at 0.5 kgf / cm (4.9 NZcm) in actual use.

[0045] Adhesion can be improved by performing oxygen plasma treatment (including plasma treatment with air) together with resin cleaning prior to dry plating. However, the conditions need to be changed depending on the resin and molding conditions.

[0046] By changing the pretreatment of the resin plating (conducting treatment of the resin) from the conventional wet method using hexavalent chromium to the dry method, the environmental load in the production of the resin coating is expected to be drastically reduced.

[0047] It should be noted that the present invention provides a resin surface on a resin molded article by a processing method that does not use chemicals such as a mixed acid of chromic acid and sulfuric acid in a conventional etching process and a conductive plating process, that is, a dry method. By roughening and imparting conductivity, chemical degradation of the surface of the resin molded product caused by such chemicals can be prevented, and the surface layer of the resin can be prevented from peeling off. As long as the characteristics can be secured, the present invention is not limited to the above-described embodiments, and various changes can be made without departing from the scope of the present invention.

[0048] Further, the present invention provides a conductive process by a dry method, thereby enabling the plating of a resin material that has been difficult to fit by a wet process, and a pretreatment process for various types of resin molded products. If it can carry out easily, it will not be limited to the above-mentioned fat.

Industrial applicability

[0049] A method for producing a decorative garment using the resin conductive material by sputtering according to the present invention includes: High-corrosion and heat-cycle resistant parts such as radiator grille, door regulator handle, knock door gauze, molding parts, etc., oil-resisting parts for automobiles such as handles and knobs that do not require high corrosion resistance It can be used for various applications such as metal fittings, products such as laptop casings, camera casings, and mobile phone casings that require high corrosion resistance.

In particular, the method for producing a decorative garnish using a resin conductive material by sputtering according to the present invention is a method for producing an automobile greaves component such as an automobile interior door handle, an exterior door handle, an exterior handle cover part, etc. It is suitable for products such as shower heads, faucet parts, etc. that are directly touched by people such as housing-related grease plated parts and mobile phone parts.

Claims

The scope of the claims

[1] In the sputtering apparatus, in the vacuum atmosphere, the surface of the resin molded product is activated with a gas surface cleaning and activation process (S1) in which the surface is cleaned and activated by sputtering, and then the same. In a sputtering apparatus, a metal thin film deposition step (S2) for depositing a metal on the surface of the resin molded product to ensure adhesion to the resin by means of the sputtering,

Subsequently, a conductive film forming step (S4) for forming a conductive film by sputtering on the metal thin film formed on the resin molded product by the metal thin film forming step (S2),

A decorative plating product using a resin conductive film by sputtering, characterized in that it has an electro-plating process for electroplating the resin-molded product after the conductive film forming step (S4) is completed. Manufacturing method.

[2] After the metal thin film forming step (S2), an active metal treatment step (S3) for activating the metal thin film formed on the resin molded article by argon ion source treatment is provided. The method for producing a decorative garment using the resin conductive material by sputtering according to claim 1.

[3] The resin surface cleaning 'activation step (S1) is performed by irradiating argon gas in a vacuum atmosphere with a small amount of air remaining on the surface of the resin molded product by a magnetron' snotter method. The method for producing a decorative garment using the resin conductive material by sputtering according to claim 1.

[4] The resin surface cleaning 'activation step (S1) is performed by injecting argon and a trace amount of oxygen into the surface of the resin molded product by a magnetron'snotter method in a vacuum atmosphere and irradiating with an ion source. The method for producing a decorative garment using the resin conductive material by sputtering according to claim 1.

[5] In the metal thin film forming step (S2), in a vacuum atmosphere, the surface of the resin molded article is a single metal having a strong binding force with oxygen or an alloy containing a metal having a strong binding force with oxygen. The method for producing a decorative garment using the conductive resin according to claim 1, wherein the film is formed by sputtering.

[6] The metal thin film forming step (S2) is characterized in that a magnetic metal or an alloy containing the magnetic metal is formed on the surface of the resin molded article by sputtering in a vacuum atmosphere. A method for producing a decorative garnish using a resin conductive material by sputtering according to claim 1

[7] The metal thin film forming step (S2) is characterized in that a magnetic metal ionized to 0.01 to 50% is formed on the surface of the resin molded article in a vacuum atmosphere. The method for producing a decorative garment using the resin conductive material by sputtering according to claim 1.

[8] The resin conductivity by sputtering according to claim 1 or 7, wherein in the metal thin film forming step (S2), the film is formed to have a film thickness of about 0.01 to 2.0 m. A manufacturing method for decorative products using 品.

[9] The method for producing a decorative garnish using a resin conductive film by sputtering according to claim 1, wherein the conductive film forming step (S4) forms a film of nickel or copper.

[10] The method according to claim 1 or 9, wherein in the conductive film forming step (S4), the film is formed to have a film thickness of about 0.1 to 5.0 m. A method of manufacturing a product with a decoration using a resin resin.

[11] The electroplating process consists of bright copper sulfate plating (S6), semi-bright nickel plating (S7), bright nickel plating (S8), MP nickel plating (microporous nickel plating) (S9) in this order. 2. The manufacture of a decorative plated product using a resin conductive material by sputtering according to claim 1, characterized in that the plating process is finished by applying a plating process and finally applying a decorative finish plating (S10). Method.

[12] The ornamental finish plating (S10) is characterized in that a plating treatment such as trivalent chromium plating, tin Z nickel alloy plating, ruthenium or gold plating is performed. A method for manufacturing decorative garments using conductive resin by spattering.