TW477162B - Manufacturing method of electronic product case for separating electromagnetic wave - Google Patents

Manufacturing method of electronic product case for separating electromagnetic wave Download PDF

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Publication number
TW477162B
TW477162B TW89108182A TW89108182A TW477162B TW 477162 B TW477162 B TW 477162B TW 89108182 A TW89108182 A TW 89108182A TW 89108182 A TW89108182 A TW 89108182A TW 477162 B TW477162 B TW 477162B
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Taiwan
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shell
copper
nickel
metal
electronic product
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TW89108182A
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Chinese (zh)
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Yau-De Huang
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Macdermid Chemical Taiwan Ltd
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Abstract

The present invention relates to the method for manufacturing electronic product case that can separate electromagnetic wave, in which a kind of metal organic catalyst medium is used to coat the specific surface of the outer casing formed by injection molding. The catalyst medium contains more than one kind of metal having different electric potentials. After making wet the catalyst medium to decrease its surface tension, different metals are sequentially electroplated on the outer casing. When performing the electroplating process, through the incorporation of the catalyst medium, these metals are made capable of adhering to the specific surface of the outer casing. Thus, a completed product which has better effects of blocking EMI (electromagnetic interference) and lower production cost than those of the conventional one can be obtained.

Description

477162 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明(_ ) 本發明係一種阻隔電磁波之電子產品外殼製造方法,其 主要係一種藉由金屬有機觸媒介質之塗佈,以令該電子產品 外殼在進行電鍍時,可使一種以上之金屬依序附著在該電子 產品外殼表面上,進而可加強該電子產品阻隔電磁波(EMI) 干擾之效果者。 按,一般習知電子產品之塑膠外殼,其電鍍之方法係將 經射步成型之塑膠外殼特定位置作絕緣處理,再將其在50 °C〜609C之溫度中,乾燥10〜20分,再作脫脂處理,並以清 水清洗其表面後,再以高濃度鉻酸(Cr)粗化其表面後,以清 水清洗,再以鹼液中和後,進行酸浸洗、敏化、活化、清洗 等處理後,再以電鍍之方式,使銅附著在其表面上,再以水 清洗表面後,以酸重複活化其表面後,再以電鍍之方式,使 鎳附著在其表面上,再以加熱後之清水清洗其表面後,以50 °C〜60°C之溫度乾燥1〜2小時,如此,雖可將銅及鎳兩種金 屬電錄在塑膠外殼上,惟前述之製法,仍會以下之缺點: (1) ·因其僅部份之處作絕蝝處理,故,其它之處均會有 該銅、鎳等金屬之附著(包括外殼之内、外面),因此,不但 製造時間長,且成本亦很高。 (2) ·因其在進行鎳之電鍍後,必需再對外殼之表面進行 塗裝,以增加外殼之美觀,惟因喷塗在外殼表面的塗料舆外 層之鎳之附著性不佳,故常會發生塗料脫落之情形,且塗裝 作業在進行時,會對周遭環境一定程度之污染,而有環保之 問題產生。 貳 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) . 穿-- (請先閲讀背面之注意事項再填寫本頁) 、τ 477162 、發明説明(二) 經濟部中央標準局員工消費合作社印製 本發明乃鑑於上述已往技術之問題及缺失,爰精心研 究,且不斷開發研究,终於發展出一種製造能阻隔電磁波(EMI) 干擾之電子產品外殼之方法及其成品。 而本發明之主要目的,即是在提供一種阻隔電磁波(EMI) 之電子產品外殼製造方法,其係一種將經射出成型之外殼特 定<表面塗佈金屬有機觸媒介質,該金屬有機觸媒介質中含 有一種以上不同電位之金屬,再藉由濕潤觸媒介質,使其表 面張力降低後,將不同之金屬依序電鍍在外殼上,而在電鍍 之同時,可藉由觸媒介質之配合,使該等之金屬能依序附著 在外殼特定之表面上,如此,不但不會有習知之外殼電鍍時, 無法選擇所欲電鍍之處,而有縮短流程、增加生產效率、減 低成本之功效,且亦不需如習知在電鍍後需再塗裝,而可達 到到環保之目的。 本發明之另一目的,在提供一種電子產品外殼製造方 法’其在進行銅之電鍍時,因其化學銅可以析出99. 95X之 純銅金屬鍍層,且結晶顆粒細緻,導電性極佳,故,產生極 優異之阻隔電磁波(ΕΜΓ)干擾效果。 為使貴審査委員對本發明所述之組成及其功效,能作 更進一步的認識舆瞭解,茲舉一較佳實施例並配合圖树詳細 說明如下: 第一圖為本發明製造時之流程示意圖。 附件為依本發明所製造之成品之試驗報告 本發明係一種阻隔電磁波(EMI)之電子產品外殼製造 請 先 閱 讀 背 面 之 注 意· 事 項 再 旁 裝 訂 參 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) 47 6 經濟部中央標準局員工消費合作社印製 A7 __B7 五、發明説明(三) 方法,請參照第一圈所示,其製法包括有下列步驟: (1) ·塗伟(Base Coat):其係將含有一種以上不同電位 之金屬,於本實施例為銀、鐵、鎳、鈀、鈦、鋁、鋅、銅等 金屬(惟熟悉該項技藝者,仍可以其它金屬取代。)之金屬有 機觸媒介質,塗伟在經射出成型之電子產品外殼(於本實施 例為塑膠)特定之處,於本實施例為在外殼之内面上。 (2) 乾燥:把塗怖有觸媒介質之外羧置於溫度在50U0 \:間之烘乾裝置中,烘烤1〜2小時,使其乾燥》 (3) .濕潤(Wetting):再將經乾燥後之外殼,以含有界 面活性劑之溶液處理,俾可有效降低溶液(於本實施例為水) 之表面張力,如由70dynes/cm下降至30 dynes/cm;進而 可濕调該外殽上之金屬有機觸媒介質表面,加強其親水性、 再以清水清洗乾淨。 (4) ·加速(Leaching):將經清洗後之該外殼,以驗性混 合藥水(酸殮值10~12,於本實施例為氩氧化納(NaOH)浸泡 1〜10分,俾能適當有效地剝除該外殼上之觸媒介質表面多 餘之樹脂,進而使該介質中之金屬觸媒裸露出來,進而加速 其中之化學銅之析出反應後,再以清水清洗乾淨。 (5) ·鍍铜(Electroless Copper):以無電解之方式,將 銅金屬析出在該外殽塗佈有觸媒介質之處,而使銅可緊密附 著在該處後,以清水清洗乾淨〃 (6) ·敌始(Initidtor):將該外殻以含鈀(Pd)、釕(Ru)、 铑(Rh)金屬和螯合刻的混合藥劑(於本實施例為氣化鈀、氯 肆 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) 裝 訂 線 (請先閲讀背面之注意事項再填寫本頁) 477162 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明(四) 化釕、氣化姥)處理,俾可改變其表面上之銅之電位,使化 學鎳可以礪利反應析出,且該螯合劑可使被溶解之铜金屬, 不會舆氣離子結合成氣化銅而縮短其使用壽命,進而能有效 廷長其使用壽命為一般習知外殼之壽命3~6倍,再以清水清 洗乾淨。 (7) ·鍍鎳(Electroless Nickel):將經第(6)步驟處理 過之該外殼,以使用壽命為一般習知酸性產品5~10倍,且 析出較習知酸性產品緩慢且樣定之鹼性鎳磷合金(NiP)進行 電鍍,以使鎳金屌電鍍在該外殼塗佈有觸媒介質之處,而使 鎳可緊密附著在該處之銅金屬上後減少銅金屬接觸空氣、水 份以避免銅氧化,而產生阻抗,再以清水清洗乾淨。 (8) ·鈍化處理(Seal):將鍍鎳後之該外殼,以極低濃度 之鉻酸藥水(Cr03)對其表面進行處理,俾可效地對其鍍有鎳 之表面,進行鈍化封孔處理,且沒有廢水之問題產生,進而 可連到環保之要求,再以清水清洗乾淨。 (9) ·切水處理(Water Shedder) ··將經鈍化處理之外殼, 以帶有疏水基(即舆水不相溶)之界面活性劑進行處理,俾可 幫助該外殼快速排除其t殘餘之水份,苒以純水清洗其表面 後,將該外殼变於溫度在50°C〜6(TC間之烘乾裝置中,烘烤 1〜2小時,使其乾燥後,如此,即可得到一較習知阻隔電磁 波(EMI)干擾效果更佳,且流程大幅缩短、成本較為低廉之 成品,該成品不但可將觸媒介質塗佈所欲電鍍4;處,而使金 屬銅及鎳可依選擇,附著在該塗佈處,進而達到作可選 伍 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) ----------批衣------1T------^ (請先閲讀背面之注意事項再填寫本頁) 477162 A7 __B7 五、發明説明(五) 擇性處理之目的,且所電鍍之金屬厚度亦較習知外殼薄。 綜上所述,本發明顯具有增進習知者之使用功效,而具 產業上之利用價值;又,本案在提出申請前未有相同或近似 之技術分蘭使用或見於刊物,因而本案應同時具有其「新穎 性」。本案申請人麦依專利法第十九條之規定,向釣局提 出發明專利申請,並懇請准予專利,至感德便。 本案上述實施例,僅用以舉例說明本發明之一可行實 施例,對於熟悉該項技藝之人員,當可對其細部構造部份進 行各種等效之變化例,如各類之塑膠製品及電子產品之外殼 (筆記型電臈、個人數位處理器、行動電話、數位相機、全 球衛星定位儀、條碼掃描器等等);惟此等變化例,均應包 括在本發明之精神及範困内。 I---------^II (請先閲讀背面之注*-事項再填寫本頁) 、-ί:'ά 線 經濟部中央標隼局員工消費合作社印製 陸 本紙張尺度適用中國國家標準(CNS)八4規格(210χ;297公釐)477162 Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the Invention (_) The present invention is a method for manufacturing an electronic product shell that blocks electromagnetic waves. It is mainly a method of coating with a metal organic contact medium to make When the casing of the electronic product is electroplated, more than one metal can be sequentially attached to the surface of the casing of the electronic product, thereby further enhancing the effect of blocking the electromagnetic wave (EMI) interference of the electronic product. According to the general practice, the plastic shell of electronic products is generally electroplated by insulating the plastic shell at a specific position after the step forming, and then drying it at a temperature of 50 ° C ~ 609C for 10 ~ 20 minutes, and then After degreasing, and washing the surface with water, roughen the surface with high concentration chromic acid (Cr), then wash with water, and then neutralize with lye, then perform acid leaching, sensitization, activation, and cleaning After the treatment, copper is attached to the surface by electroplating, and the surface is washed with water. After the surface is repeatedly activated with acid, nickel is adhered to the surface by electroplating, and then heated. After the surface is washed with water, it is dried at a temperature of 50 ° C ~ 60 ° C for 1 ~ 2 hours. In this way, although two metals, copper and nickel, can be recorded on a plastic case, the aforementioned method will still be as follows: Disadvantages: (1) · Because only part of it is absolutely treated, other places will have the copper, nickel and other metals attached (including inside and outside the shell), so not only the manufacturing time is long , And the cost is also high. (2) · Because of the nickel plating, the surface of the shell must be painted to increase the appearance of the shell. However, due to the poor adhesion of the outer layer of nickel sprayed on the outer surface of the shell, it often occurs. The paint peeling occurs, and when the coating operation is carried out, it will pollute the surrounding environment to a certain extent, and environmental protection problems will arise.纸张 This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm). Wear-(Please read the notes on the back before filling out this page), τ 477162, invention description (2) Staff of the Central Standards Bureau of the Ministry of Economic Affairs The consumer cooperative has printed the present invention in view of the problems and deficiencies of the above-mentioned prior technologies. After careful research and continuous development and research, a method for manufacturing an electronic product shell capable of blocking electromagnetic wave (EMI) interference and its finished product have finally been developed. The main object of the present invention is to provide a method for manufacturing an electronic product case that blocks electromagnetic waves (EMI). The method is a kind of coating of a metal-organic contact medium on the surface of the injection-molded case. The metal-organic contact medium Contains more than one metal with different potentials, and then wets the contact medium to reduce its surface tension, the different metals are sequentially plated on the shell, and at the same time as plating, the combination of the contact medium can be used. So that these metals can be sequentially attached to a specific surface of the shell, so that not only will there be no conventional shell plating, you cannot choose where you want to plating, but it has the effect of shortening the process, increasing production efficiency, reducing costs , And also does not need to be painted after electroplating as is known, but can achieve the purpose of environmental protection. Another object of the present invention is to provide a method for manufacturing an electronic product casing, which, when performing copper electroplating, can deposit 99.95X pure copper metal plating layer due to its chemical copper, and has fine crystal particles and excellent electrical conductivity. Generates excellent electromagnetic interference (EMI) interference. In order to make your reviewers better understand the composition and effect of the present invention, a preferred embodiment will be described in detail with the help of the graph tree as follows: The first diagram is a schematic diagram of the process of the invention during manufacture . Attachment is the test report of the finished product manufactured according to the present invention. The present invention is a manufacturing of electronic product enclosures that block electromagnetic waves (EMI). Please read the notes and notes on the back before side binding. This paper applies the Chinese national standard (CNS) A4 specification. (210X 297mm) 47 6 Printed by A7 __B7 of the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of the Invention (3) For the method, please refer to the first circle. The method includes the following steps: (1) · Tu Wei (Base Coat): It will contain more than one metal with different potentials. In this embodiment, it is silver, iron, nickel, palladium, titanium, aluminum, zinc, copper and other metals (but those who are familiar with this technology can still use other metals. Replaced.) Of the metal organic touch media, Tu Wei in the injection molding of the electronic product housing (plastic in this embodiment) specific place, in this embodiment is on the inner surface of the housing. (2) Drying: Put the carboxyl groups outside the coated medium into a drying device at a temperature of 50U0: and bake for 1 ~ 2 hours to dry it. (3). Wetting: Re The dried shell is treated with a solution containing a surfactant, which can effectively reduce the surface tension of the solution (in this example, water), such as from 70dynes / cm to 30 dynes / cm; further, the humidity can be adjusted. The surface of the metal-organic contact medium on the outer surface is strengthened to improve its hydrophilicity, and then washed with water. (4) · Acceleration (Leaching): The shell after cleaning is immersed in an experimental mixed medicine (acid tritium value 10 ~ 12, in this example, it is immersed in sodium hydroxide (NaOH) for 1 ~ 10 minutes. Effectively peel off the excess resin on the surface of the contact medium on the shell, so that the metal catalyst in the medium is exposed, and then the chemical copper precipitation reaction is accelerated, and then cleaned with water. (5) · Plating Copper (Electroless Copper): In a non-electrolytic manner, the copper metal is deposited on the outer surface where the contact medium is coated, so that the copper can be adhered to the place tightly, and then cleaned with water. (6) Initial (Initidtor): The shell is mixed with palladium (Pd), ruthenium (Ru), rhodium (Rh) metal and chelating etch (in this example, vaporized palladium and chlorine) Paper size applicable to China National Standard (CNS) A4 size (210X 297mm) gutter (please read the precautions on the back before filling this page) 477162 Printed by the Consumers Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 5. Description of Invention (4) Ruthenium Chemicals , Gasification 姥) treatment, 俾 can change the electricity of copper on its surface Position, so that chemical nickel can be precipitated sharply, and the chelating agent can dissolve the dissolved copper metal, which will not combine gas ions into gasified copper and shorten its service life, which can effectively prolong its service life. Know the life of the shell is 3 ~ 6 times, and then clean it with water. (7) · Nickel plating (Electroless Nickel): the shell treated in step (6), the service life is generally known as acidic products 5 ~ 10 times, and the precipitation is slower than the conventional acidic products and the sample is made of alkaline nickel-phosphorus alloy (NiP) for electroplating, so that the nickel-gold alloy is electroplated at the place coated with the contact medium, so that the nickel can adhere tightly After the copper metal is placed there, reduce the copper metal's contact with air and moisture to avoid copper oxidation, which will cause resistance, and then clean it with water. (8) · Passivation treatment (Seal): The shell after nickel plating is Low-concentration chromic acid solution (Cr03) can be used to treat the surface. It can effectively passivate and seal the nickel-plated surface, and there is no problem of waste water. It can be connected to environmental protection requirements. Rinse with clean water (9) (Water Shedder) ·· The passivated shell is treated with a surfactant with a hydrophobic group (that is, water is immiscible), which can help the shell to quickly remove residual water from the shell. After washing the surface with water, change the shell to a drying device at a temperature between 50 ° C and 6 ° C, and bake for 1 to 2 hours to allow it to dry. In this way, a more conventional blocking electromagnetic wave can be obtained. (EMI) Interference is better, and the process is greatly shortened, and the cost is relatively low. The finished product can not only coat the contact media with the desired electroplating 4; the metal copper and nickel can be selected and attached to the coating Settlement, and then reach the optional paper standard for China National Standards (CNS) A4 (210X 297 mm) ---------- approved clothing ------ 1T ---- -^ (Please read the precautions on the back before filling this page) 477162 A7 __B7 V. Description of the invention (5) The purpose of selective treatment, and the thickness of the plated metal is thinner than the conventional shell. To sum up, the present invention obviously has the effect of improving the use of the learner, and it has industrial utilization value. Moreover, before the application was filed, the same or similar technology was not used or found in the publication. Therefore, this case Has its "newness". The applicant in this case, Mai, filed an application for an invention patent with the Fishing Bureau in accordance with the provisions of Article 19 of the Patent Law, and pleaded for the patent to be granted. The above embodiment in this case is only used to illustrate a feasible embodiment of the present invention. For those who are familiar with the technology, they can make various equivalent changes to their detailed structural parts, such as various types of plastic products and electronics. The product's casing (notebook electronics, personal digital processors, mobile phones, digital cameras, GPS, barcode scanners, etc.); however, these variations should be included in the spirit and scope of the present invention . I --------- ^ II (Please read the note on the back *-Matters before filling out this page), -ί: 'ά Printed on paper by the Consumer Cooperatives of the Central Bureau of Standards, Ministry of Economic Affairs Chinese National Standard (CNS) 8-4 specifications (210χ; 297 mm)

Claims (1)

4//162 A8 B8 C8 -—_ ____D8 六、申請專利範圍 一'~ — 一· 1. 一種阻隔電磁波之電子產品外殼製造方法,其包含有 下列步驟: (請先閱讀背面之注意事項再填寫本頁) (1) ·塗佈··其係將含有一種以上不同電位之金屬,塗佈 在經射出成型之電子產品外殼特定之處; (2) 乾燥·把塗怖有觸媒介質之外殼置於烘乾裝置中, 烘烤數小時,使其乾燥; (3) .濕潤:再將經乾燥後之外殼,以含有非離子型之界 面活性谢之溶液處理,俾可有效降低溶液,並濕潤該外殼上 之觸媒介質表面; (4) ·加速:將經清洗後之該外殼,以鹸性藥水浸泡,俾 能剝除該外殼上之觸媒介質表面多餘之樹脂,進而使該介質 中之金屬觸媒裸露出來,進而加速其中之化學銅之析出反應 後; (5) ·鍵銅:以無電解之方式,將銅金屬電鍍在該外殼塗 佈有觸媒介質之處,而使銅可緊密附著在該處; 經濟部t慧財是A工消費合作社印製 (6) ·啟始:將該外殼,以含鈀(Pd)、釕(Ru)、铑(Rh) 等金屬之螯合劑處理,俾可改變其表面上之銅之電位,使化 學鎳可以順利反應析出,且該螯合剤可使被溶出之銅金屬, 不會與氣離子結合成氣化銅而縮短其使用壽命; (7) ·鍍鎳:將經第(6)步驟處理過之該外殼進行電鍍, 以使鎳金屬電鍍在該外殼塗佈有金屬有機觸媒介質之處,而 使鎳可緊密附著在該處之銅金屬上後; (8) ·鈍化處理:將鍍鎳後之該外殼,以極低濃度之鉻酸 藥水(Cr〇3)對其表面進行處理,俾可效地對其鍍有鎳之表 柒 本纸張尺度適用中國國家標隼(CNS ) A4規格(210X 297公釐) " ~ 477162 A8 B8 C8 D8 六、申請專利範圍 面,進行鈍化封孔處理,再以清水清洗乾淨; (9)·切水處理:將經鈍化處理之外殼,以帶有疏水基之 界面活性劑進行處理,俾可幫助該外殼快速排除其中殘餘之 水份’再以純水清洗其表面後,將該外殼乾燥後,即可得到 所需之成品。 2·如申請專利範圍第1項所逑之一種製造電子產品外 殼之方法,其觸媒介質可為銀、鐵、鎳等金屬。 3·如申請專利範圍第1項所逑之一種製造電子產品外 殼之方法,其乾燥時之溫度為5〇〜6〇〇c。 4·如申請專利範圍第1項所逑之一種製造電子產品外 殼之方法,其驗性藥水可為氩氧化鈉。 I· ^-- (請先閱讀背面t注意f項再填寫本I) 、1T 線 經濟部中央標隼局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X 297公釐)4 // 162 A8 B8 C8 -__ ____D8 VI. Scope of Patent Application I '~ — I · 1. A method for manufacturing an electronic product shell that blocks electromagnetic waves, which includes the following steps: (Please read the precautions on the back before filling (This page) (1) · Coating ·· It is the application of metal containing one or more different potentials to a specific part of the shell of an injection-molded electronic product; (2) Drying the shell Put it in a drying device and bake for several hours to dry it; (3) Wetting: Then the dried shell is treated with a solution containing non-ionic interfacial active substances, which can effectively reduce the solution, and Wet the surface of the contact medium on the shell; (4) • Acceleration: Soak the shell after cleaning with an alkaline solution to remove the excess resin on the surface of the shell that touches the medium, thereby making the medium After the metal catalyst in the substrate is exposed, and then the precipitation reaction of the chemical copper is accelerated; (5) Bonded copper: electrolessly, the copper metal is electroplated on the shell coated with the catalyst, so that Copper adheres tightly to Department of Economics thuicai is printed by A Industrial Consumer Cooperative (6) · Start: The shell is treated with a chelating agent containing metals such as palladium (Pd), ruthenium (Ru), rhodium (Rh), etc. Change the potential of copper on its surface, so that chemical nickel can be reacted and precipitated smoothly, and the chelated hafnium can dissolve the eluted copper metal, which will not combine with gas ions to form vaporized copper and shorten its service life; (7) · Nickel plating: The shell treated in step (6) is electroplated, so that nickel metal is plated on the place where the shell is coated with a metal organic contact medium, so that nickel can be closely adhered to the copper metal there. (8) Passivation treatment: the surface of the nickel-plated surface is treated with a very low concentration of chromic acid solution (CrO3), and the surface of the nickel-plated surface paper can be effectively treated. Zhang scale is applicable to China National Standard (CNS) A4 specification (210X 297 mm) " ~ 477162 A8 B8 C8 D8 Six, apply for patent scope, passivation sealing treatment, and then clean with water; (9) · cut Water treatment: Passivated shell with hydrophobic surfactant The treatment can help the shell to quickly remove the residual water ’, and then clean the surface with pure water. After drying the shell, the desired finished product can be obtained. 2. As a method of manufacturing an outer shell of an electronic product as described in item 1 of the scope of patent application, the contact medium may be silver, iron, nickel and other metals. 3. A method for manufacturing an outer casing of an electronic product as described in item 1 of the scope of the patent application, wherein the temperature during drying is 50 to 600 ° C. 4. As a method of manufacturing an electronic product case as described in item 1 of the scope of the patent application, the test solution may be sodium argon oxide. I. ^-(Please read the note t on the back before filling in this I), 1T Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs. The paper is printed in accordance with the Chinese National Standard (CNS) A4 specification (210X 297 mm) )
TW89108182A 2000-04-28 2000-04-28 Manufacturing method of electronic product case for separating electromagnetic wave TW477162B (en)

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