JP2004256876A - Method of producing plated molding - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of producing a plated molding in which, at the time of subjecting a product requiring precision appearance and thinness to one-color molding and two-color molding, plating is hard to peel, and even in the case a crimp texture, a hair line, a satin finish and an engraving texture are formed on the surface, they can be reproduced. <P>SOLUTION: In the method of producing a plated molding, the surface of a molding is subjected to plating by the following stages: a stage (a) where a metal plated layer is formed on the surface of the molding by electroless plating; a stage (b) where a first nickel plated layer is formed on the surface of the electroless plated layer by electroplating; a stage (c) where a second nickel plated layer is formed on the surface of the first nickel plated layer by electroplating; and a stage (d) where a third nickel plated layer is formed on the surface of the second nickel plated layer. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a plated molded product having a thin portion, and more specifically, for example, electric and electronic components such as switches and key tops for operating personal computers, OA equipment such as personal computers and telephones, and communications such as DVDs and MDs. More particularly, the present invention relates to a method for manufacturing an operation button (key) of a mobile phone.
[0002]
[Prior art]
For example, in a foldable (flap type) mobile phone, it is increasingly demanded that the thickness be thin. Operation buttons (keys) attached to such mobile phones are also required to be as thin as possible.
[0003]
By the way, the operation button is generally formed of ABS (acrylonitrile-butadiene-styrene) resin, which is easily plated, but the ABS resin has a property of poor adhesiveness to the body of the mobile phone, and is also decorative. In some cases, two-color molding may be performed using a resin other than the ABS resin, for example, a PC (polycarbonate) resin. Further, a glossy surface (mirror surface) and a matte surface (fine uneven surface) may be formed on the plated surface of the operation button for decoration.
[0004]
Conventionally, when manufacturing such an operation button for a mobile phone, since in-mold molding does not provide sharpness and glossiness, as described above, after two-color molding, it is necessary to perform plating treatment on the surface of the molded product. Has been done.
[0005]
Conventionally, when two-color molding of a thin molded product is performed, the injection speed is increased and the resin is injection-molded in the cavity. If the speed of the resin is low, the resin does not enter the cavity, and a thin molded product cannot be obtained. However, when the resin speed is high, there is a problem that the plating of the obtained molded product is easily peeled off. The reason for this is considered to be due to the flowability or orientation of the resin during molding, and it is considered that there is no plating anchor effect on the surface of the molded product.
[0006]
Therefore, in order to prevent peeling of the plating, a method of forming a metal plating layer by electroless plating and then electroplating copper plating was considered, but conventional copper plating has a strong leveling action, There are the following problems.
[0007]
When fine irregularities are formed on the surface of the operation button like a satin finish, sagging occurs in the conventional operation button and gloss is produced, and as a result, the satin finish is not reproduced.
[0008]
That is, {circle around (1)} products that require a high-precision appearance (eg, mobile phone operation buttons, home appliance operation buttons, etc.) are machined into a single product such as a mirror surface, blast (texture), and hairline. Precision products such as mixed products, (2) precision machined products (for example, products molded using an electroformed mold with a bite (sharp scratch) on the inner surface, digital video and other electronic home appliances), etc. When plating a product that requires a good appearance and enhances contrast, electrolytic copper plating has the property of trying to flatten the surface due to the properties of the film (smoothness), so it was molded with a precision mold There is a problem that the surface state of the molded product cannot be reproduced.
[0009]
[Problems to be solved by the invention]
The present invention has been made by focusing on the above-mentioned actual conditions, and the purpose thereof is that even in a molded product having a thin portion obtained by injection molding at a high speed, plating is hardly peeled off and the surface is It is an object of the present invention to provide a method of manufacturing a plated molded product capable of reproducing a matte surface even when the matte surface is provided.
[0010]
[Means for Solving the Problems]
The method for producing a plated molded article according to claim 1 is a method of treating a surface of the molded article with plating by the following steps, thereby achieving the above object:
(A) forming a metal plating layer on the surface of the molded product by electroless plating;
(B) forming a first nickel plating layer on the surface of the electroless plating layer by electroplating under the following conditions;
First nickel plating containing 120 g / L to 200 g / L of nickel sulfate, 45 g / L to 90 g / L of nickel chloride, 25 g / L to 50 g / L of boric acid, and having a pH of 3.7 to 4.6. Using a bath, plating at a bath temperature of 46 to 56 ° C. and a cathode current density of 1.0 to 3.5 A / dm ² ,
(C) forming a second nickel plating layer on the surface of the first nickel plating layer by electroplating under the following conditions;
Second nickel plating containing 200 g / L to 280 g / L of nickel sulfate, 45 g / L to 90 g / L of nickel chloride, 25 g / L to 50 g / L of boric acid, and having a pH of 3.7 to 4.6. A step of plating using a bath at a bath temperature of 42 to 56 ° C. and a cathode current density of 1.5 to 6.0 A / dm ² , and (d) applying the following conditions to the surface of the second nickel plating layer. Forming a third nickel plating layer by electroplating,
Third nickel plating containing 200 g / L to 280 g / L of nickel sulfate, 45 g / L to 90 g / L of nickel chloride, 25 g / L to 50 g / L of boric acid, and having a pH of 3.7 to 4.6. A step of plating using a bath at a bath temperature of 42 to 56 ° C. and a cathode current density of 1.5 to 6.0 VA / dm ² .
[0011]
The method for producing a plated molded product according to claim 2 is a method for producing a plated molded product in which plating is performed on a surface of a molded product having a thin portion obtained by two-color molding,
A method of treating a surface of a molded article having a thin portion with plating by the following steps, thereby achieving the above object:
(A) forming a metal plating layer on the surface of the molded product by electroless plating;
(B) forming a first nickel plating layer on the surface of the electroless plating layer by electroplating under the following conditions;
First nickel plating containing 120 g / L to 200 g / L of nickel sulfate, 45 g / L to 90 g / L of nickel chloride, 25 g / L to 50 g / L of boric acid, and having a pH of 3.7 to 4.6. Using a bath, plating at a bath temperature of 46 to 56 ° C. and a cathode current density of 1.0 to 3.5 A / dm ² ,
(C) forming a second nickel plating layer on the surface of the first nickel plating layer by electroplating under the following conditions;
Second nickel plating containing 200 g / L to 280 g / L of nickel sulfate, 45 g / L to 90 g / L of nickel chloride, 25 g / L to 50 g / L of boric acid, and having a pH of 3.7 to 4.6. A step of plating using a bath at a bath temperature of 42 to 56 ° C. and a cathode current density of 1.5 to 6.0 A / dm ² , and (d) applying the following conditions to the surface of the second nickel plating layer. Forming a third nickel plating layer by electroplating,
Third nickel plating containing 200 g / L to 280 g / L of nickel sulfate, 45 g / L to 90 g / L of nickel chloride, 25 g / L to 50 g / L of boric acid, and having a pH of 3.7 to 4.6. A step of plating using a bath at a bath temperature of 42 to 56 ° C. and a cathode current density of 1.5 to 6.0 VA / dm ² .
[0012]
In one embodiment, 0.4 to 1.2% by weight of an acetylene alcohol derivative is added to the second nickel plating bath.
[0013]
In one embodiment, a butynediol derivative is added in the third plating bath in an amount of 0.4 to 1.6% by weight.
[0014]
In one embodiment, the product is transferred from the step of forming the second nickel plating layer to the step of forming the third nickel plating layer while applying a current to the product.
[0015]
In one embodiment, a glossy surface and an uneven surface are formed on the surface of the molded article.
[0016]
A plated molded product according to claim 7 is obtained by any of the above methods.
[0017]
In one embodiment, the molded article is an operation button of a mobile phone.
[0018]
The operation of the present invention is as follows.
[0019]
As a characteristic of the nickel plating film is that it is deposited (follows) along the shape, it is possible to reproduce the surface condition of a molded product formed by a precision mold. Further, by applying a thin and matte electrolytic nickel (strike nickel) after applying the electroless nickel, the dissolution of the electroless nickel film of the electric power supply portion can be prevented.
[0020]
Furthermore, when doubly bright nickel (semi-bright / glossy) is applied, the product is transferred from one second nickel plating bath to the third nickel plating bath while applying electricity to the product in a special manner. Interlayer peeling (insufficient adhesion) between semi-gloss and gloss can be prevented.
[0021]
That is, when the product is moved from the second nickel plating bath having different bath composition and plating conditions to the third nickel plating bath, if the product is lifted and moved to the air, the nickel film is oxidized in the air to form an oxide film. Therefore, the nickel film formed by the plating process in the third nickel plating bath is easily peeled off. However, as in the present invention, the product is subjected to the second nickel plating while applying a current to a jig which holds and moves the product. By moving from the bath to the third nickel plating bath, it is possible to prevent an oxide film from being formed on the surface of the second nickel plating layer and prevent the third nickel plating layer from peeling off.
[0022]
Then, by forming a chromium layer or a chromium alloy layer on the surface of the third nickel plating layer by electroplating, even in a molded product having a thin portion, the metal plating layer is strongly adhered to the cloth surface and peeled off. The plating process is performed with good reproducibility on the surface of the molded product in which the glossy surface and the matte surface are formed on the surface.
[0023]
The peelability of the plating-coated molded product is performed under the following conditions.
[0024]
Cross cut test: This is measured by a cross cut test (1 mm cross cut).
[0025]
Heat shock test: A repeated cycle test of 85 ° C. for 1 hour and −35 ° C. for 1 hour. It is required that the temperature does not change in 6 cycles or more, but the conventional one was broken in 3 cycles.
[0026]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in detail.
[0027]
As shown in FIG. 1, the molded article 4 of the present invention has a thin portion 3 obtained by two-color molding, and includes a primary molded article 1 formed of ABS resin, And a secondary molded product 2 formed by two-color molding inside. The secondary molded article 2 can be formed of a transparent resin such as a PC if necessary.
[0028]
The molded product 4 injection-molded at a high speed into a dish has a thin portion 3 (gate opening), and the thickness of the thin portion is usually 0.35 mm or less, preferably 0.15 to 0.30 mm. It is. Such a molded product has a more complicated shape than that of the conventional mold structure, and can be formed into a highly difficult shape by two-color molding in which the cavity and the core are reversed. Also, by having a thin portion, molding is performed in a state where the injection speed is higher than in the past. Injecting a resin at high speed means, for example, a speed at which the orientation of butadiene molecules in the ABS resin changes. That is, the butadiene molecule has a substantially spherical shape at the conventional injection speed, but has an elliptical shape at a certain speed or higher, and the plating is easily peeled off from the surface of the molded product by the conventional plating treatment.
[0029]
The plating process is performed on the surface of the molded product having the thin portion obtained in this manner by the following steps.
(A) The molded product is washed with water, and a metal plating layer is formed on the surface by electroless nickel plating (chemical plating).
[0030]
Electroless plating can be performed as follows.
[0031]
Etching step: The molded article is immersed in an aqueous solution of chromic anhydride and sulfuric acid at a predetermined temperature, washed with water, and the surface is roughened.
[0032]
Catalyst (catalyzer) step: After immersing the molded article in an aqueous solution of palladium chloride, stannous chloride and hydrochloric acid, the molded article is washed with water, and palladium is adsorbed on the surface of the molded article.
[0033]
Accelerator step: The molded article is immersed in an aqueous solution of hydrochloric acid, washed with water, and tin adsorbed together with palladium in the catalyst step is dissolved and removed with hydrochloric acid. In this case, the palladium on the ABS resin side of the two-color molded product is left, and the PC or the like is dropped off. Therefore, air bubbling is performed under special conditions from the bottom of the tank to prevent plating from flowing into the PC or the like.
[0034]
Electroless nickel plating or electroless copper plating (chemical plating):
It is immersed in a mixed solution of nickel or copper, formalin, Rossell's salt, caustic soda, sodium hypophosphite, ammonia, water, etc., and washed with water. Thereby, nickel (copper) is deposited on palladium by a reduction reaction of formalin and sodium hypophosphite.
(B) Next, electroplating is performed on the electroless plating layer as follows.
[0035]
In the present invention, the electrolytic nickel plating step includes (1) a sulfuric acid activation step, (2) a water washing step, (3) a recovery step, (4) a strike nickel plating step, (5) a semi-bright nickel plating step, and (6). Including a bright nickel plating step.
[0036]
(6) After the bright nickel plating step, washing with water is performed twice, and then the process proceeds to the chrome plating step.
[0037]
The purpose of each of the above steps is as follows.
(1) Sulfuric acid activating step: The oxide film covering the product surface after the pretreatment step (electroless nickel) is removed, and the surface of the electroless nickel is activated by an acid to improve the deposition of electrolytic nickel plating.
(2) Water washing step: The sulfuric acid aqueous solution adhering due to the sulfuric acid activity is washed away to prevent an increase in the pH of strike nickel.
{Circle over (3)} Recovery process: The product is allowed to stand still for a certain period of time in an empty tank so that washing water flows down from the product.
(4) Strike nickel process: A non-glossy nickel film is formed on the electroless nickel film in order to perform semi-bright and bright nickel plating. (The thickness is preferably about 1-2 μm.)
The objectives are (i) to improve the deposition of semi-bright nickel in the next step, and (ii) to apply a high current (4 to 6 V) with semi-bright nickel directly on the electroless nickel. This is because the coating is melted and electrical contacts cannot be secured, and therefore, strike nickel plating is performed.
(5) Semi-bright nickel process: A semi-bright (low gloss) nickel film having good throwing power (ductility) is applied. (The thickness is preferably about 3 to 7 μm.)
The purpose is to improve the deposition of bright nickel in the next step. (Easier to give glossiness.)
{Circle around (6)} Bright nickel process: Bright gloss nickel (high gloss) is applied. (The thickness is preferably 3 to 7 μm.)
The purpose is to reproduce glossiness that meets user needs.
[0038]
As described above, in the present invention, plating is performed in a nickel plating process of three or more layers, and since this nickel plating has excellent followability, the blasting treatment of the cloth of the molded product (texture, hair line, matte)・ Unevenness of the blasting process (texture, hairline, satin finish, sculpture) can be obtained as it is. Further, a flat portion (glossy surface) can obtain a glossy feeling as before.
[0039]
Then, a chromium layer or a chromium alloy layer is formed on the surface of the nickel plating layer by electroplating.
[0040]
The plating conditions in each of the above steps are as follows.
(1) Plating conditions in strike nickel step (step of forming first nickel plating layer):
The concentration of nickel sulfate is from 120 g / L to 200 g / L, preferably from 150 g / L to 190 g / L. When the concentration of nickel sulfate is less than 120 g / L, the throwing power of the plating film is reduced, and when it exceeds 200 g / L, the plating film becomes coarse.
[0041]
The concentration of nickel chloride is from 45 g / L to 90 g / L, preferably from 50 g / L to 80 g / L. When the concentration of nickel chloride is less than 45 g / L, the throwing power of the plating film is reduced, and when it exceeds 90 g / L, the plating film becomes brittle.
[0042]
The concentration of boric acid is from 25 g / L to 50 g / L, preferably from 35 g / L to 45 g / L. When the concentration of boric acid is less than 25 g / L, the pH fluctuation becomes large, and when it exceeds 50 g / L, the plating film becomes coarse.
[0043]
The pH of the nickel plating bath is between 3.7 and 4.6, preferably between 3.8 and 4.3. If the pH of the bath is lower than 3.7, the throwing power of the plating film is deteriorated, and if the pH is higher than 4.6, bits (traces of hydrogen gas of the electrolytic reaction) are likely to be generated.
[0044]
The bath temperature is between 46 and 56C, preferably between 48 and 56C. When the bath temperature is lower than 46 ° C., the throwing power of the plating film deteriorates, and when the bath temperature is higher than 56 ° C., kogation (abnormal deposition) failure occurs mainly at the corners.
[0045]
The cathode current density is 1.0 to 3.5 A / dm ² , preferably ² to 3 A / dm ² . When cathode current density is below 1.0A / dm ^2, it reduces the throwing of the plating film, exceeds the 3.5A / dm ^2, burnt around the corner (abnormal deposition) failure.
(2) Plating conditions in the semi-bright nickel step (the step of forming a second nickel plating layer):
The concentration of nickel sulfate is from 200 g / L to 280 g / L, preferably from 220 g / L to 260 g / L. When the concentration of nickel sulfate is out of this range, it is the same as the step of forming the first nickel plating layer.
[0046]
The concentration of nickel chloride is from 45 g / L to 90 g / L, preferably from 50 g / L to 70 g / L. When the concentration of nickel chloride is out of this range, it is the same as the step of forming the first nickel plating layer.
[0047]
The concentration of boric acid is from 25 g / L to 50 g / L, preferably from 35 g / L to 45 g / L. When the concentration of boric acid is out of this range, it is the same as the step of forming the first nickel plating layer.
[0048]
The pH of the nickel plating bath is between 3.7 and 4.6, preferably between 3.8 and 4.3. When the pH is out of this range, it is the same as the step of forming the first nickel plating layer.
[0049]
The bath temperature is from 42 to 56C, preferably from 44C to 53C. When the bath temperature is out of this range, it is the same as the step of forming the first nickel plating layer.
[0050]
Cathode current density was 1.5~6.0A / dm ^2, preferably 3.5~5.5A / dm ^2. When the cathode current density is out of this range, it is the same as the step of forming the first nickel plating layer.
[0051]
An acetylene alcohol derivative-based one is added to the second nickel bath in an amount of 0.4 to 1.2% by weight, preferably 0.6 to 1.0% by weight. If the amount of the additive is less than 0.4% by weight, the effect of imparting uniform electrodeposition and glossiness is small, and if it exceeds 1.2% by weight, the glossiness is excessive and the plating film becomes brittle. As a specific example of the acetylene alcohol derivative, there is a brightener for non-leveling Ni plating.
(3) Plating conditions in the bright nickel process (the process of forming the third nickel plating layer):
The concentration of nickel sulfate is from 200 g / L to 280 g / L, preferably from 220 g / L to 260 g / L. When the concentration of nickel sulfate is out of this range, it is the same as the step of forming the first nickel plating layer.
[0052]
The concentration of nickel chloride is from 45 g / L to 90 g / L, preferably from 50 g / L to 70 g / L. When the concentration of nickel chloride is out of this range, it is the same as the step of forming the first nickel plating layer.
[0053]
The concentration of boric acid is from 25 g / L to 50 g / L, preferably from 35 g / L to 45 g / L. When the concentration of boric acid is out of this range, it is the same as the step of forming the first nickel plating layer.
[0054]
The pH of the nickel plating bath is between 3.7 and 4.6, preferably between 3.8 and 4.3. When the pH is out of this range, it is the same as the step of forming the first nickel plating layer.
[0055]
The bath temperature is from 42 to 56C, preferably from 44C to 53C. When the bath temperature is out of this range, it is the same as the step of forming the first nickel plating layer.
[0056]
Cathode current density was 1.5~6.0A / dm ^2, preferably 3.5~5.5A / dm ^2. When the cathode current density is out of this range, it is the same as the step of forming the first nickel plating layer.
[0057]
As the additive, a butynediol derivative-based one is preferably added to the third nickel bath in an amount of 0.4 to 1.6% by weight, preferably 0.6 to 1.1% by weight. When the amount of the additive is less than 0.4% by weight, the effects of uniform electrodeposition, reduction of internal stress, and improvement of corrosion resistance are small, and when it exceeds 1.6% by weight, excessive gloss and residue. This causes defects such as kogation and spots in the next step (decorative plating). A specific example of the butynediol derivative system is a brightening agent for bright nickel plating.
[0058]
【The invention's effect】
According to the present invention, even in a molded product having a thin portion obtained by injection molding at a high speed, plating is difficult to peel off, and even when reproducing a grain, a hairline, a satin texture, a sculpture on the surface, the grain, Hairline, satin finish, and sculpture can be reproduced.
[0059]
That is, the conventional copper plating has a strong leveling action, and thus has the following problems. When fine irregularities are formed on the surface like grain, hairline, satin, sculptured eyes, sagging occurs with the conventional one, and the gloss is too much and the grained, hairline, satin, sculpted eyes are not reproduced . That is, the characteristics of the electroformed cavity are broken.
[0060]
On the other hand, according to the present invention, by using specific plating conditions, even in a molded product having a thin portion, the metal plating layer is firmly adhered to the cloth surface and does not peel off. The plating process on the surface of the molded product on which the glossy surface, the grain, the hair line, the satin finish, and the engraving are formed is performed with good reproducibility.
[0061]
In addition, the product produced by the present invention does not have any defects (unevenness, foreign matter adhesion (bulge projection)) and the like peculiar to copper plating at all, as compared with a product with a conventional base copper plating. Since the same kind of metal (nickel on nickel) is deposited instead of nickel on a dissimilar metal, compatibility between layers is good and interlayer adhesion is good. Special neutralization and washing steps to be performed can be omitted. Due to such comprehensive merits, there is a case where the work quality (yield) is improved by 30% or more as compared with a product in which the copper is plated on the base, and it can be improved by 20% on average.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of one embodiment of a plated product obtained by a manufacturing method of the present invention.
[Explanation of symbols]
1 Primary molded product 2 Secondary molded product 3 Thin part 4 Molded product

Claims (8)

A method for producing a plated molded article in which the surface of the molded article is subjected to plating by the following steps:
(A) forming a metal plating layer on the surface of the molded product by electroless plating;
(B) forming a first nickel plating layer on the surface of the electroless plating layer by electroplating under the following conditions;
First nickel plating containing 120 g / L to 200 g / L of nickel sulfate, 45 g / L to 90 g / L of nickel chloride, 25 g / L to 50 g / L of boric acid, and having a pH of 3.7 to 4.6. Using a bath, plating at a bath temperature of 46 to 56 ° C. and a cathode current density of 1.0 to 3.5 A / dm ² ,
(C) forming a second nickel plating layer on the surface of the first nickel plating layer by electroplating under the following conditions;
Second nickel plating containing 200 g / L to 280 g / L of nickel sulfate, 45 g / L to 90 g / L of nickel chloride, 25 g / L to 50 g / L of boric acid, and having a pH of 3.7 to 4.6. A step of plating using a bath at a bath temperature of 42 to 56 ° C. and a cathode current density of 1.5 to 6.0 A / dm ² , and (d) applying the following conditions to the surface of the second nickel plating layer. Forming a third nickel plating layer by electroplating,
Third nickel plating containing 200 g / L to 280 g / L of nickel sulfate, 45 g / L to 90 g / L of nickel chloride, 25 g / L to 50 g / L of boric acid, and having a pH of 3.7 to 4.6. A step of plating using a bath at a bath temperature of 42 to 56 ° C. and a cathode current density of 1.5 to 6.0 VA / dm ² . A method for producing a plated molded product, in which plating is performed on a surface of a molded product having a thin portion obtained by two-color molding,
A method for producing a plated molded product in which plating is performed on the surface of a molded product having a thin portion by the following steps:
(A) forming a metal plating layer on the surface of the molded product by electroless plating;
(B) forming a first nickel plating layer on the surface of the electroless plating layer by electroplating under the following conditions;
First nickel plating containing 120 g / L to 200 g / L of nickel sulfate, 45 g / L to 90 g / L of nickel chloride, 25 g / L to 50 g / L of boric acid, and having a pH of 3.7 to 4.6. Using a bath, plating at a bath temperature of 46 to 56 ° C. and a cathode current density of 1.0 to 3.5 A / dm ² ,
(C) forming a second nickel plating layer on the surface of the first nickel plating layer by electroplating under the following conditions;
Second nickel plating containing 200 g / L to 280 g / L of nickel sulfate, 45 g / L to 90 g / L of nickel chloride, 25 g / L to 50 g / L of boric acid, and having a pH of 3.7 to 4.6. A step of plating using a bath at a bath temperature of 42 to 56 ° C. and a cathode current density of 1.5 to 6.0 A / dm ² , and (d) applying the following conditions to the surface of the second nickel plating layer. Forming a third nickel plating layer by electroplating,
Third nickel plating containing 200 g / L to 280 g / L of nickel sulfate, 45 g / L to 90 g / L of nickel chloride, 25 g / L to 50 g / L of boric acid, and having a pH of 3.7 to 4.6. A step of plating using a bath at a bath temperature of 42 to 56 ° C. and a cathode current density of 1.5 to 6.0 VA / dm ² . The method according to claim 1, wherein an acetylene alcohol derivative is added to the second nickel plating bath in an amount of 0.4 to 1.2% by weight. The method according to any one of claims 1 to 3, wherein a butynediol derivative is added in the third plating bath in an amount of 0.4 to 1.6% by weight. The method according to any of claims 1 to 4, wherein the product is transferred while applying a current to the product from the step of forming the second nickel plating layer to the step of forming a third nickel plating layer. The method according to any one of claims 1 to 5, wherein a glossy surface and an uneven surface are formed on the surface of the molded article. A plated product obtained by the method according to claim 1. The plated molded product according to claim 7, wherein the molded product is an operation button of a mobile phone.

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