1278538 九、發明說明： 【發明所屬之技術領域】 本發明關於一種製造具有薄部件之電鍍成型品之方法。 更特別地，本發明關於-種電鑛電元件或電子元件⑽如開 關及控制個人電腦鍵盤按鍵頂面等）、辦公室自動化（〇a) 設備（例如個人電腦及電話等）及通訊設備（例如dvds& MDs等)之表面之方法，且更特別地關於一種製造用於行動 電話之操作紐（鍵）之方法。 【先前技術】 β舉例來說，對於摺疊式（摺板式）行動電話厚度減少，有 提高的需求。就此等行動電話而言，黏附於其上之操作紐 (鍵）必須儘可能地薄。 一一般而言’操仙係成型自容易電鍍的ABS樹脂（丙婦腊 /丁一稀/苯乙稀共聚合物）。然、而，樹脂對於行動電話 本體有不良的黏合性。再者，為了裝飾目的，操作紐必須 /、有未電鍍之部分。於此情形下，除了 ABS樹脂外，可使 用，如PC(聚石反酸醋）等樹脂而進行共射出成型。再者，為 Y虞舞㈣’光党表面（鏡面）及消光表面（微粗面）可提供於 操作钮之電錢面上。 A、 Μ例’當行動電話之操作钮係藉由模内成型而製得 日:’所生成的操作鈕展現出缺乏清晰度及缺乏光亮印象。 為了避免此情形，成型u 取i叩表面係如上述於共射出成型後 链。 田藉由共射出成型製造薄成型品時，按慣例以高 90895.doc 1278538 射出速率將樹脂注入模槽中。偶若樹脂射出速率低，則樹 脂無法進入模槽，且無法製得薄成型品。然而，快射出速 率造成鑛層容易脫離所生成成型品之.問題。此問題之理由 被邊'為乃因成型品表面可能缺乏衫鑛層於其上之能力 (取決於成型中樹脂之流動性或定位）。 口此為了防止鍍層脫離，可考慮於藉非電鍍作用形成 金屬鐘層€ ’藉電鑛作用形成域層。習用的銅鑛層具有 強勻平效果，造成以下問題。 ;驾♦技術中，甚至當已產生操作鈕之微粗（例如鍛紋） 表面呀此一粗面係藉電鍍作用而勻平，以便產生光亮性， 且粗糙性喪失。 銅電鍍具有平滑薄膜表面之性質（平滑能力），因此，不 可能再製經由使用精密模具成型之製品的表面狀態，即⑴ 具有鏡面部分及機械工作面（噴砂（粒紋）、細紋等）之製品， 例如需要之高精密外觀之製品（例如行動電話之操作鈕、家 用電器。又備之操作鈕等）及類似物，及（ϋ)需要精密外觀及強 化對比之製品，例如精密機械加工製品（例如使用電成型模 具（於其内表面具有齒圖案（明顯瑕疵））而成型之製品、家用 電子設備（例如數位錄影設備）及類似物）。 【發明内容】 本毛月之怨樣係提供一種製造電鍵成型品之方法，其 乂成5L ua之表面受到電鍍作用。該方法包含以下步驟： ⑷藉非電錢作用，形成金屬鍍層於該成型品表面上；⑻於 、下條件下，藉電鍍作用，形成第一鎳鑛層於非電鍍層之 90895.doc 1278538 表面上：第-鎳電鏟浴含有120克/升至2〇〇克/升硫酸錄、45 克/升至90克/升氯化鎳及25克/升至5〇克/升删酸，且具阳為 3·7至4.6、該浴之溫度為46t至阶，且陰極f流密度^·〇 安培/平方分米至3.5安培/平方分米；⑷於以下條件下，藉 電鐘作用，形成第二錄鍍層於該第一錄㈣之表面上：第 二鎳電鑛浴含有克/升至28〇克/升硫酸錦、“克/升至9〇 克/升氯化錄及25克/升至50克/升蝴酸，且具阳為37至 該浴之溫度為饥至阶，且陰極電流密度為15安培/平方 刀米至6.G安培/平方分米；及⑷於以下條件下，藉電鑛作 用，形成第三鎳鑛層於該第二錦鑛層之表面上：第三錄電 鍍浴含有克/升至克/升硫酸鎳、45克/升至％克/升氣 化錄及25克/升至50克/升棚酸，且具PH為3.7至4.6、該浴之 溫度為42t至56t，且陰極電流密度為15安培 6.〇安培/平方分米。 π ^ 本發明之另一態樣係提供一種製造電鑛成型品之方法， ，中具有藉共射出成型而得的薄部件之該成型品之表面上 文到電鑛作用。該方法包含以τ步驟··⑷藉非電鍍作用， 形成金屬鑛層於該成型品表面上；㈦於以下條件下，藉電 鍍:乍用，形成第-錄鍍層於非電鍍層之表面上··第一 鍍冷3有12G克/升至2GG克/升硫酸錄、45克/升至升' :錄卿升至5。克/升·，且具阳為37至46、該= 酿^為46 C至56。(：，且陰極電流密度為J 〇安培/平方分米至 3第5安：:方分米；⑷於以下條件下’藉電鍍作用，形成 弟一鎳鍍層於該第一錄辦爲 鎳錢層之表面上：第二鎳電鑛浴含有 90895.doc 1278538 200克/升至280克/升硫酸鎳、45克/升至9〇克/升氯化鎳及25 克/升至50克/升领酸’且具阳為3.7至4.6、該浴之溫度為a C至56C，且陰極電流密度為15安培/平方分米至6〇安培/ 平方刀米，及⑷於以下條件下，藉電鍵作用，形成第三錄 鍍層於3亥第一鎳鍍層之表面上··第三鎳電鍍浴含有克/ 升至彻克/升硫酸錄、45克/升至90克/升氯化錄及25克/升 至。50克/升賴，且具阳為37至4·6、該浴之溫度為饥至 56°C ’且陰極電流密度為15安培/平方分米至6Q安培/平方 分米。 於本舍明之-具體例中，該第二錄電鍍浴係補充⑴心至 1·2%重量之乙炔醇衍生物。 於本發明之-具體例巾，該第三錄電鍍浴係補充m至 1.6%重量之丁炔二醇衍生物。 於本發明之—具體例中，該製品係自形成該第二鎳鑛層 之步驟轉移至形成該第三鎳鍍層之步驟，同時使電流流過 該製品。 於本發明之-具體财，光亮表面及祕表面係提供於 該成型品上。 本發明之另-態樣係提供—種藉由上述方法製得之電鑛 成型品。 & 於本發明之-具體例中，該成型品係為用於行動電話之 操作鈕。 本發明之功能將說明如下。 録鍍膜之特性係為使鎳順著下方形狀(順應性)沉積而得 90895.doc 1278538 者。因此，再製藉精密模具而成型之成型品的表面狀態是 可能的。於提供非電鍍鎳鍍層後，藉由提供薄的非光亮鎳 電鍍層（打底鍍層），防止非電鍍鎳膜於電流供應區處溶解是 可能的。 再者，當提供雙明亮鎳層（半明亮及明亮）時，藉由將製 品自第二鎳電鍍浴轉移至第三鎳電鍍浴，同時使用特殊技 術使電流流經製品，防止半光亮及光亮層彼此脫離（黏附力 不足）是可能的。 箠將製品自第二鎳電鍍浴轉移至第三鎳電鍍浴（具有不 同的浴組成及不同的電鍍條件）時，倘若將製品上拉至空氣 中，則鎳膜在空氣中氧化為氧化膜。基於此理由，藉由在 第二鎳電鍍浴中電鍍所形成之鎳膜可能脫離。根據本發 明，使電流流經用以支持及轉移製品之裝置，同時將製品 自第二鎳電鍍浴轉移至第三鎳電鍍浴。藉此，防止氧化膜 形成於第二鎳鍍層表面上以及防止第三鎳鍍層脫離是可能 的。 之後，藉形成鉻層或鉻合金層於第三鎳鍍層表面上（經由 電鍍作用），金屬鍍層可穩固地黏附於下方表面上，以致於 金屬鍍層可耐移除（甚至針對具有薄部件之成型品亦同）。此 外，當在其上具有光亮表面及緞紋表面之成型品表面上進 行電鍍時，再現性是令人感到滿意的。 成型品上之鍍層移除之容易程度係於以下條件下測得。 刪去黏附試驗：1毫米乘以1毫米橫切面。 熱衝擊試驗··重複85°c · 1小時及-35°c · 1小時之循環。 90895.doc 1278538 於6循環（或更多）後，鑛層必須仍完整無缺。傳統鑛層於3 循後破損。 因此’本發明於此中所揭示者使得提供製造電鍍成型品 方缶之k點成為可能’該方法可提供能耐移除及再製緞 紋:方表面之鑛層（甚至對於具有藉高速射出成型而製得 之薄部件之成型品亦同）。 當參照附圖研讀及瞭解以下詳細說明時，熟習本技藝之 人士當可明白本發明之此等及其他優點。 【實施方式】 以下將藉由例示實施例，參照附圖，說明本發明。 如圖1所示，根據本發明之薄成型品4包含經由共射出成 型而製得之薄部件3。再者，薄成型品4包含由娜樹脂形 :之-級成型品i’以及經由共射出成型而成型於一級成型 品1内側上之二級成型品2。二級成型品2可由透明 如PC)形成。 此藉由高速射出成型製得之碟狀製品4具有通常且厚产 為0.35毫米或更小（較佳狀15纽3G毫米）之薄部件3。為= 提供具有__具結構更複雜及精緻的形狀，可藉共射 出成型（其中模槽與核心顛倒）使製品成型。由於具有薄部件1278538 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a method of manufacturing an electroplated molded article having a thin member. More particularly, the present invention relates to an electric orthoelectric component or electronic component (10) such as a switch and a control panel top surface of a personal computer keyboard, etc., an office automation (〇a) device (such as a personal computer and a telephone, etc.), and a communication device (for example) A method of surface of dvds & MDs, etc., and more particularly with a method of manufacturing an operation button (key) for a mobile phone. [Prior Art] For example, there is an increased demand for the reduction in the thickness of a folding (folding type) mobile phone. In the case of such mobile phones, the operating buttons (keys) attached to them must be as thin as possible. Generally speaking, the ABS resin (acrylonitrile/butylene/styrene copolymer) which is easy to electroplate is formed. However, the resin has poor adhesion to the body of the mobile phone. Furthermore, for decorative purposes, the operation must have / and have an unplated portion. In this case, in addition to the ABS resin, co-injection molding can be carried out using a resin such as PC (polyphenol vinegar). In addition, the Y-Dance (4) 'Guang Dang surface (mirror surface) and the matte surface (micro-rough surface) can be provided on the electric money surface of the operation button. A. Example: When the operation button of the mobile phone is made by in-mold molding: The generated operation button exhibits lack of clarity and lack of a bright impression. In order to avoid this, the forming u is taken as the above-mentioned co-injection molded chain. When the thin molded article was produced by co-injection molding, the resin was conventionally injected into the cavity at an injection rate of 90895.doc 1278538. Even if the resin injection rate is low, the resin cannot enter the cavity, and a thin molded article cannot be obtained. However, the rapid ejection rate causes the mineral layer to easily get rid of the problem of the formed molded article. The reason for this problem is that the surface of the molded article may lack the ability of the shell to be on the surface (depending on the fluidity or positioning of the resin in the molding). In order to prevent the delamination of the coating, it is conceivable to form a metal layer by non-electroplating to form a domain layer by means of electric ore. The conventional copper ore layer has a strong leveling effect, causing the following problems. In the technique of driving, even when the surface of the operation button is slightly thick (for example, forged), the rough surface is leveled by plating to produce gloss and the roughness is lost. Copper plating has the property of smooth film surface (smoothing ability), so it is impossible to reproduce the surface state of a product molded by using a precision mold, that is, (1) having a mirror portion and a mechanical working surface (blasting (grain), fine lines, etc.) Products, such as products requiring high-precision appearance (such as operating buttons for mobile phones, household appliances, operating buttons, etc.) and the like, and (ϋ) products that require precise appearance and enhanced contrast, such as precision machined products. (For example, an article molded using an electroforming mold (having a tooth pattern on its inner surface), a household electronic device (for example, a digital video device), and the like). SUMMARY OF THE INVENTION The complaint of the month of the month provides a method of manufacturing a key molded article, and the surface of the 5L ua is subjected to electroplating. The method comprises the following steps: (4) forming a metal plating layer on the surface of the molded product by non-electric money; (8) forming a first nickel ore layer on the surface of the non-electroplated layer by electroplating under the conditions of under and under conditions: 90895.doc 1278538 Top: The nickel-electric shovelling bath contains 120 g/L to 2 g/L of sulfuric acid, 45 g/L to 90 g/L of nickel chloride and 25 g/L to 5 g/L of acid, and The yang is from 3. 7 to 4.6, the temperature of the bath is 46t to the order, and the cathode f flow density is from 〇 ampere/square metre to 3.5 amps per square metre; (4) under the following conditions, by the action of the electric clock, Forming a second recording layer on the surface of the first recording (4): the second nickel electric ore bath contains gram/liter to 28 gram/liter of sulphate, "g/liter to 9 gram/liter chlorination and 25 gram /liter to 50 g / liter of acid, and the yang is 37 to the temperature of the bath is hunger to order, and the cathode current density is 15 amps / square knives to 6. G amps / square decimeter; and (4) below Under the condition, a third nickel ore layer is formed on the surface of the second gold ore layer by electro-mineralization: the third recording electroplating bath contains gram/liter to gram/liter of nickel sulfate, 45 g/liter to % gram/liter. gasification Recorded from 25 g / liter to 50 g / liter of shed acid, with a pH of 3.7 to 4.6, the temperature of the bath is 42t to 56t, and the cathode current density is 15 amps 6. ampere amperes / square decimeter. π ^ this Another aspect of the invention provides a method of manufacturing an electroformed molded article, wherein the surface of the molded article having a thin member obtained by total injection molding is subjected to an electric ore action. The method comprises the step of τ. (4) Forming a metal ore layer on the surface of the molded article by non-electroplating; (7) forming a first-recording layer on the surface of the electroless plating layer by electroplating: 乍 under the following conditions: · First plating cold 3 with 12G克 / liter to 2GG g / liter of sulfuric acid recorded, 45 grams / liter to liter ': recorded Qing rose to 5. gram / liter ·, and Yang is 37 to 46, the = brewing ^ 46 C to 56. (: And the cathode current density is J 〇 ampere/square decimeter to 3 5th amp:: square decimeter; (4) under the following conditions, 'by electroplating, forming a nickel-plated layer in the first recording for the nickel layer On the surface: the second nickel electric mine bath contains 90895.doc 1278538 200 g / l to 280 g / l nickel sulfate, 45 g / l to 9 g / l nickel chloride and 25 g / l to 50 g / l collar acid And the temperature is 3.7 to 4.6, the temperature of the bath is a C to 56 C, and the cathode current density is 15 amps/dm 2 to 6 amps per square metre, and (4) is formed by a bond under the following conditions. The third recording layer is on the surface of the first nickel plating layer of 3H··The third nickel plating bath contains gram/liter to the gram/liter sulphuric acid record, 45g/liter to 90g/liter chlorination record and 25g/liter Up to 50 g / liter, and the yang is 37 to 4.6, the temperature of the bath is hunger to 56 ° C ' and the cathode current density is 15 amps / square metre to 6 Q amp / square metre. In a specific example of the present invention, the second electroplating bath is supplemented with (1) centigram to 1-2% by weight of an acetylene alcohol derivative. In the specific embodiment of the present invention, the third recording plating bath is supplemented with m to 1.6% by weight of a butynediol derivative. In a specific embodiment of the invention, the article is transferred from the step of forming the second nickel ore layer to the step of forming the third nickel plating layer while allowing current to flow through the article. In the present invention, a glossy surface and a secret surface are provided on the molded article. Another aspect of the present invention provides an electroformed article obtained by the above method. & In the specific embodiment of the present invention, the molded article is an operation button for a mobile phone. The function of the present invention will be explained below. The characteristics of the recording film are obtained by depositing nickel along the lower shape (compliant) to obtain 90895.doc 1278538. Therefore, it is possible to reproduce the surface state of the molded article formed by the precision mold. After providing an electroless nickel plating, it is possible to prevent the electroless nickel film from being dissolved at the current supply region by providing a thin non-bright nickel plating layer (priming). Furthermore, when a double bright nickel layer (semi-bright and bright) is provided, the article is transferred from the second nickel electroplating bath to the third nickel electroplating bath, while special techniques are used to flow current through the article to prevent semi-brightness and brightening. It is possible that the layers are separated from each other (insufficient adhesion). When the product is transferred from the second nickel plating bath to the third nickel plating bath (having different bath compositions and different plating conditions), the nickel film is oxidized into an oxide film in the air if the product is pulled up into the air. For this reason, the nickel film formed by electroplating in the second nickel plating bath may be detached. In accordance with the present invention, current is passed through the means for supporting and transferring the article while the article is transferred from the second nickel electroplating bath to the third nickel electroplating bath. Thereby, it is possible to prevent the oxide film from being formed on the surface of the second nickel plating layer and to prevent the third nickel plating layer from being detached. Thereafter, by forming a chromium layer or a chrome alloy layer on the surface of the third nickel plating layer (via electroplating), the metal plating layer can be firmly adhered to the lower surface, so that the metal plating layer can be resisted to be removed (even for forming with thin parts) The same product). Further, reproducibility is satisfactory when electroplating is performed on the surface of a molded article having a shiny surface and a satin surface thereon. The ease of removal of the coating on the molded article was measured under the following conditions. Remove the adhesion test: 1 mm multiplied by 1 mm cross section. Thermal shock test · Repeat the cycle of 85 ° c · 1 hour and -35 ° c · 1 hour. 90895.doc 1278538 After 6 cycles (or more), the seam must remain intact. The traditional ore layer was damaged after 3 cycles. Thus, the invention disclosed herein makes it possible to provide a k-point for the manufacture of electroplated molded articles. This method provides a mineral layer capable of resisting removal and re-satin: a square surface (even for having high-speed injection molding) The molded parts of the obtained thin parts are also the same). These and other advantages of the present invention will become apparent to those skilled in the <RTIgt; [Embodiment] Hereinafter, the present invention will be described by way of exemplary embodiments with reference to the accompanying drawings. As shown in Fig. 1, a thin molded article 4 according to the present invention comprises a thin member 3 which is produced by co-injection molding. Further, the thin molded article 4 comprises a resin molded article: a graded molded article i' and a secondary molded article 2 molded on the inner side of the primary molded article 1 by co-injection molding. The secondary molded article 2 can be formed of a transparent such as PC). The disc-shaped article 4 produced by high-speed injection molding has a thin member 3 which is usually and thickly produced to have a thickness of 0.35 mm or less (preferably 15 to 3 Gm). For = to provide a more complex and refined shape with __ structure, the product can be molded by a common injection molding in which the cavity and the core are reversed. Due to thin parts
之緣故’射出速率較傳統者為快。快速射出成型代表在ABS 樹脂中改變丁二稀分子之定向。換言之，於傳統射出速率 下丁一婦刀子大體上具球形（雖然當速率超過某一水準 時’形狀會變為橢圓形）’以致於藉習知技術製得之鍵層容 易地脫離成型品表面。 90895.doc -10- 1278538 製仟之成型(具有薄部件)受到電鍍作 以下步驟在成型品表面上電鍍。 猎 ⑷於清洗成型品後，藉非錄電鑛作用（化學鍵），將金屬 鍍層形成於該成型品表面上。 可依以下方式進行非電鍍作用。 姓刻步驟：將成型品浸潰於含有鉻酸酐及硫酸之水溶液 中(於預定溫度下)，接著清洗’並且使成型品表面粗糙化。 觸媒⑽化劑）步驟：將成型品浸潰於含有氯化把、氯化 ^錫及虱氣酸之水溶液中，接著清洗，使得把吸附於成型 品表面上。 力速η丨步驟·將成型品浸潰於水性氳氯酸溶液中接著清 洗’使付觸媒步驟中已吸附之錫連同鈀溶解，並且以氫氯 酸溶液分離。於此例中，㈣留在共射出成型品之abs樹 月曰上，同時鈀係自Pc或類似物移除。為了達到此目的，在 特殊條件了自洛底部進行空氣冒泡，俾防止在pc或類似 物上發生電鍍。 非鎳電鍍或非銅電鍍（化學鍍）：將成型品浸潰於鎳或 銅才田馬林、洛瑟爾氏鹽（Rochelle salt)、氫氧化鈉、次麟 酉欠鈉氨、水等之混合物中，接著清洗，使得鎳或銅沉積 於把上（由於福馬林與次磷酸鈉之還原反應）。 (b)接著’依以下方式，在非電鍍層上進行電鍍作用。 於本發明中’鎳電鍍步驟包含硫酸活化步驟，（2)水洗 步驟’（3)回收步驟，（4)打底電鍍步驟，（5)半光亮鎳電鍍步 驟’及（6)光亮鎳電鑛步驟。 90895.doc -11 - 1278538 从應注意’於光亮錄電鍍步驟後，料水洗步驟二次，接 著進行鉻電鍍步驟。 母一步驟之目的將說明如下。 。⑴硫酸活化步驟··移除已於欲處理步驟中產生之覆蓋製 时表面之氧化膜(非電鍍鎳)’並且以酸活化非電鍍鎳表面， 俾促進於鎳電鍍期間之鎳沉積作用。 ⑺水洗步驟：洗掉附屬的水性疏酸溶液（由於硫酸活化步 驟所產生）’俾防止打底鎳之pH增加。 、主（3)回收步驟：使製品靜置於空浴中達—段期間，俾造成 清洗用水流動及使製品落下。 ⑷打底電鍍步驟：於半光亮/光亮鍍層之前，於非電鍛錄 膜上形成非光亮膜(厚度較佳為約1微米至約2微米）。 此v驟之理由為⑴促進接續步驟中之半光亮錄之沉積作 用，及（ii)當經由通過高電流（4至6伏特）直接地在非電鍍鎳 上進行半光亮錄電鍍時’非電鍍鎳膜溶解，且無法達到電 接觸，因而進行打底鎳電鏡。 (5)半光亮錄電鑛步驟：具有高勻鍍能力（延展性）之半光 儿（低光，u程度）鎳膜形成（厚度較佳為約3微米至約7微米）。 此步驟之理由為促進接續步驟中之光亮鎳之沉積步驟， 藉以使得容易得到光亮印象成為可能。 ⑹光澤鎳電鍍步驟:具有光亮印象之光亮鎳(高光亮程度) 形成（厚度較佳為約3微米至約7微米）。 此步驟之理由係、為再產生滿足使用者目的之光亮印象。 因此，本發明係以鎳電鍍步驟形成三或更多锻層。由於 90895.doc •12- 1278538 鎳鍍層具有極佳的順應性，故部分成型品受到噴砂（粒紋、 細紋、锻紋、刻紋）之原始表面成為如原來噴砂圖案（粒紋、 細紋、緞紋、刻紋）之隆起物及突出物。再者，平坦部分（亮 面）可展現如傳統得到之光亮印象。 之後，藉電鍍作用，將鉻層或鉻合金層形成於鎳鍍層表 面上。 應注意，於每一步驟中用於電鍍之條件將說明如下。 (1)於打底錄電鍍步驟（形成第一鎳鐘層之步驟）中之電鍍 條件： 硫酸鎳濃度為120克/升至200克/升，較佳為15〇克/升至 190克/升。倘若硫酸鎳濃度低於12〇克/升，則鍍膜之勻鍍能 力降低。倘若硫酸鎳濃度高於2〇〇克/升，則鍍膜變粗。 氯化鎳濃度為45克/升至90克/升，較佳為5〇克/升至8〇克〆 升。倘若氯化鎳濃度低於45克/升，則鍍膜之勾鍍能力降 低。倘右氣化錄濃度高於9〇克/升，則鑛膜變粗。 硼酸濃度為25克/升至50克/升，較佳為％克/升至“克/ 升。搞若硼酸濃度低於25克/升，則？11變化提高。倘若硼酸 濃度高於50克/升，則鏟膜變粗。 鎳電鍍浴之pH為3.7至4_6,較佳為3.8至4.3。倘若浴之pH 低於3.7’則鑛膜之勻難力變為不佳。倘若浴之高於 4.6，則凹點（自電解液反應產生之微量氫氣）可能出現。 浴溫為46。(：至56t，較佳為贼至⑽。倘若浴溫低於 46°C ’則舰Μ難力變為不彳卜倘若浴溫高於阶， 則燒過的沉積物（異常的沉積外）缺陷主要出現在角落區域。 90895.doc -13- 1278538 陰極電流密度為1_0安培/平方分米至3·5安培/平方分 米，較佳為2安培/平方分米至3安培/平方分米。倘若陰極電 流密度低於1 ·0安培/平方分米，則鍍膜之勻鍍能力降低。倘 若陰極電流密度高於3.5安培/平方分米，則燒過的沉積物 (異常的沉積外）缺陷主要出現在角落區域。 (2)於半光壳鎳電鑛步驟（形成第二鎳鑛層之步驟）中之電 鍍條件： 硫酸鎳濃度為200克/升至280克/升，較佳為220克/升至 260克/升。倘若硫酸鎳濃度脫離此範圍，則類似上述形成 第一鎳鍍層步驟之問題產生。 氯化鎳濃度為45克/升至90克/升，較佳為5〇克/升至7〇克/ 升。倘若氯化鎳浪度脫離此範圍，則類似上述形成第一鎳 鍍層步驟之問題產生。 硼酸濃度為25克/升至50克/升，較佳為35克/升至45克/ 升。倘若硼酸濃度脫離此範圍，則類似上述形成第一鎳鍍 層步驟之問題產生。 鎳電鍍浴之pH為3.7至4.6,較佳為3.8至4.3。倘若浴之？11 脫離此範圍，則類似上述形成第一鎳鍍層步驟之問題產生。 浴溫為42°C至56°C，較佳為抑至沉。倘若浴溫脫離 此範圍，則類似上述形成第一鎳鑛層步驟之問題產生。 陰極電流密度為1.5安培/平方分米至6 〇安培/平方分 米，較佳為3·5安培/平方分米至5·5安培/平方分米。倘若陰 極電流密度脫離此範圍，則類似上述形成第一鎳鍍層步驟 之問題產生。 90895.doc -14- 1278538 第二鎳浴較佳可補充〇·4%至1.2%重量之乙炔醇衍生物作 為添加劑，較佳為0.6%至1.0%重量。倘若添加劑含量低於 0.4%重量’則賦予均勻電沉積能力之效果及光亮程度是低 的。倘若添加劑含量超過1 ·2%重量，則光亮程度太高，且 所生成的鍍膜變脆。乙炔醇衍生物之實例包含非勻平的鎳 電鍍光亮劑。 (3)於光亮鎳電鍍步驟（形成第三鎳鍍層之步驟）中之電鍍 條件： 硫酸鎳濃度為200克/升至280克/升，較佳為22〇克/升至 2 6 0克/升倘右；l酸鎳丨辰度脫離此範圍，則類似上述形成 第一鎳鍍層步驟之問題產生。 氣化鎳濃度為45克/升至90克/升，較佳為50克/升至7〇克/ 升。倘若氯化鎳濃度脫離此範圍，則類似上述形成第一鎳 層步驟之問題產生。 硼酸濃度為25克/升至50克/升，較佳為35克/升至45克/ 升。倘若硼酸濃度脫離此範圍，則類似上述形成第一鎳鍍 層步驟之問題產生。 鎳電鍍浴之pH為3.7至4.6，較佳為3.8至4.3。倘若浴之？11 脫離此範圍，則類似上述形成第一鎳鍍層步驟之問題產生。 浴溫為42°C至5代，較佳為抑至抓。倘若浴溫脫離 此範圍，則類似上述形成第一鎳鍍層步驟之問題產生。 陰極電流密度為1.5安培/平方分米至6 〇安培/平方分 米，較佳為3.5安培/平方分米至55安培/平方分米。倘若險 極電流密度脫離此範圍，義似上述形成第—職層步^ 90895.doc -15- 1278538 之問題產生。 第三錄浴較佳可補充〇4%至16%重量之丁块二醇衍生物 作輕加，，較佳為議至11%重量。偏若添加劑含量低 於0.4%重#’則賦予均勻電沉積能力、降低内部應力及改 :耐腐姓性之效果是低的。偶若添加劑含量超社6%重 置，則於接續步驟中由於殘留添加劑造成之過高的光亮程 度^缺fe (例如燒過的沉積物、污跡等）及類情形出現。丁块 醇1生物之貫例包含光免錄電鑛光亮劑及類似物。 根據本u ’甚至針對具有藉高速射出成型製得之薄部 件之成型品而言’可製得耐移除之鍍層。再者，甚至當鍍 層形成於粒紋、細紋、緞紋或刻紋表面上時，鍍層可再製 粒紋、細紋、緞紋或刻紋表面。 習知的銅鍍層具有強勻平作用，因而具有以下問題。甚 至當微粗糙度（例如粒紋、細紋、锻紋或刻紋）提供於表面上 時’粗較度係受鑛層勻平，且可提供過量的光亮程度，以 致於無法再製粒紋、細紋、锻紋或刻紋。因此，電子形成 模槽之特性被破壞。 相較之下，本發明係於特殊電鍍條件下進行，使得金屬 鑛層可穩固地黏附於下方表面上，且可耐移除（甚至針對具 有薄部件之成型品亦同）。再者，電鍍作用可再製成型品之 明亮表面及粒紋、細紋、緞紋或刻紋表面。 此外，相較於具有習知下方銅鍍層之製品，根據本發明 製得之成型品不具銅鍍層特有的缺陷（例如不均勻、附著外 來外質（凸塊））。於本發明中，鎳係沉積於相同類型金屬上 90895.doc -16- 1278538 (鎳’儿積於鎳上），而不是在不同類型金屬上。因此，層間之 2容性是令人感到滿意的，且層間之黏附性是令人感到滿 思的，因此，可免除銅電鍍步驟與鎳電鍍步驟間之特殊的 中和及清洗步驟。根據此等優點，相較於在下方表面上具 有銅鍍層之製品，在相同情形下，可改良具有所欲品質之 製品產率達平均2〇%，尤其為3〇%或更多。 、·、、、驾本技藝之人士，當可明白許多其他修飾，且容易地 為此等修_皆不脫本發明之精神及範圍。因此，如附 申睛專利範圍之範圍非用以限制本發明，而是可廣泛地確 立申5青專利範圍。 【圖式簡單說明】 圖1為顯示藉由根據本發明方法製得之例示電鍍成型品 之斷面圖。 【主要元件符號說明】 1 一級成型品 2 二級成型品 3 薄部件 4 薄成型品 90895.doc -17-The reason for this is that the injection rate is faster than the traditional one. Rapid injection molding represents the change in the orientation of the dibutyl molecules in the ABS resin. In other words, at the traditional injection rate, the knives are generally spherical (although the shape becomes elliptical when the rate exceeds a certain level) so that the bond layer made by the conventional technique is easily separated from the surface of the molded article. . 90895.doc -10- 1278538 Forming of enamel (with thin parts) is electroplated The following steps are applied to the surface of the molded article. Hunting (4) After cleaning the molded article, a metal plating layer is formed on the surface of the molded article by a non-recording action (chemical bond). The electroless plating can be carried out in the following manner. Name engraving step: the molded article is immersed in an aqueous solution containing chromic anhydride and sulfuric acid (at a predetermined temperature), followed by washing' and roughening the surface of the molded article. Catalyst (10) agent: The molded article is impregnated into an aqueous solution containing a chlorinating agent, tin chloride, and xenon acid, followed by washing so as to be adsorbed on the surface of the molded article. Force speed η 丨 step • The molded article is immersed in an aqueous chloric acid solution and then washed. The adsorbed tin in the catalyst step is dissolved together with palladium and separated by a hydrochloric acid solution. In this case, (d) is left on the abs tree of the co-injected molded article, while the palladium is removed from Pc or the like. In order to achieve this, air bubbling is carried out at the bottom of the column under special conditions to prevent plating on the pc or the like. Non-nickel plating or non-copper plating (electroless plating): the molded product is impregnated with a mixture of nickel or copper, Marin, Rochelle salt, sodium hydroxide, sub-salt sodium, water, etc. Medium, followed by washing, so that nickel or copper is deposited on the handle (due to the reduction reaction of fumarin and sodium hypophosphite). (b) Next, electroplating was performed on the electroless plating layer in the following manner. In the present invention, the 'nickel plating step includes a sulfuric acid activation step, (2) a water washing step '(3) a recovery step, (4) a bottom plating step, (5) a semi-bright nickel plating step', and (6) a bright nickel electric ore. step. 90895.doc -11 - 1278538 It should be noted that after the electroplating step, the water washing step is repeated twice, followed by the chromium plating step. The purpose of the parent step will be explained as follows. . (1) Sulfuric acid activation step························································ (7) Water washing step: washing off the auxiliary aqueous acid solution (produced by the sulfuric acid activation step) 俾 prevents the pH of the nickel from increasing. Main (3) recovery step: the product is allowed to stand in the empty bath for a period of time, causing the cleaning water to flow and the product to fall. (4) Priming step: a non-bright film (having a thickness of preferably about 1 micrometer to about 2 micrometers) is formed on the non-electrically forged film before the semi-bright/bright plating. The reason for this is (1) to promote the deposition of the semi-bright recording in the subsequent step, and (ii) when the semi-bright recording is performed directly on the electroless nickel by passing a high current (4 to 6 volts). The nickel film was dissolved and electrical contact could not be achieved, so a nickel-electron microscope was performed. (5) Semi-bright recording operation: a semi-gloss (low-light, u-degree) nickel film having a high plating ability (ductility) (preferably, the thickness is about 3 μm to about 7 μm). The reason for this step is to facilitate the deposition step of bright nickel in the subsequent step, thereby making it easy to obtain a bright impression. (6) Gloss nickel plating step: Bright nickel having a bright impression (high gloss) is formed (preferably, the thickness is about 3 μm to about 7 μm). The reason for this step is to reproduce a bright impression that satisfies the user's purpose. Thus, the present invention forms three or more forged layers in a nickel plating step. Since 90895.doc •12- 1278538 nickel plating has excellent compliance, the original surface of some molded products is sandblasted (grain, fine, forged, engraved) to become the original sandblasting pattern (grain, fine lines) , satin, engraved) bulges and protrusions. Furthermore, the flat portion (bright surface) can exhibit a light impression as traditionally obtained. Thereafter, a chromium layer or a chromium alloy layer is formed on the surface of the nickel plating layer by electroplating. It should be noted that the conditions for electroplating in each step will be explained as follows. (1) Electroplating conditions in the plating step (step of forming the first nickel clock layer): The nickel sulfate concentration is from 120 g/liter to 200 g/liter, preferably from 15 g/l to 190 g/ Rise. If the nickel sulfate concentration is less than 12 g/l, the plating ability of the coating is lowered. If the nickel sulfate concentration is higher than 2 g/l, the coating becomes thick. The concentration of nickel chloride is from 45 g/liter to 90 g/liter, preferably from 5 gram/liter to 8 gram liter. If the concentration of nickel chloride is less than 45 g/liter, the plating ability of the coating is lowered. If the right gasification concentration is higher than 9 g/l, the mineral film becomes thicker. The concentration of boric acid is from 25 g / liter to 50 g / liter, preferably % gram / liter to "g / liter. If the concentration of boric acid is less than 25 g / liter, then the change of ? 11 is increased. If the concentration of boric acid is higher than 50 g / liter, the shovel film becomes thicker. The pH of the nickel plating bath is 3.7 to 4_6, preferably 3.8 to 4.3. If the pH of the bath is lower than 3.7', the uniformity of the mineral film becomes poor. At 4.6, a pit (a trace amount of hydrogen from the electrolyte reaction) may appear. The bath temperature is 46. (: to 56t, preferably thief to (10). If the bath temperature is lower than 46 °C, then the ship is hard to beat. It becomes not clear that if the bath temperature is higher than the order, the burnt deposit (abnormal deposition) defects mainly appear in the corner area. 90895.doc -13- 1278538 The cathode current density is 1_0 amps/dm 2 to 3 5 amps per square decimeter, preferably 2 amps/dm2 to 3 amps/dm2. If the cathode current density is less than 1.0 amp/dm2, the plating ability of the coating is reduced. When the current density is higher than 3.5 amps/dm2, the burnt deposits (abnormal depositional defects) mainly appear in the corner regions. (2) Half Electroplating conditions in the shell nickel electrowinning step (step of forming the second nickel ore layer): The nickel sulfate concentration is from 200 g/liter to 280 g/liter, preferably from 220 g/liter to 260 g/liter. The concentration deviates from this range, which is similar to the above-mentioned problem of forming the first nickel plating step. The concentration of nickel chloride is from 45 g/liter to 90 g/liter, preferably from 5 gram/liter to 7 gram/liter. The nickel vacancy is out of this range, which is similar to the above-mentioned problem of forming the first nickel plating step. The boric acid concentration is from 25 g/liter to 50 g/liter, preferably from 35 g/liter to 45 g/liter. Out of this range, a problem similar to the above-described step of forming the first nickel plating layer occurs. The pH of the nickel plating bath is 3.7 to 4.6, preferably 3.8 to 4.3. If the bath 11 is out of this range, the first nickel is formed similarly to the above. A problem with the plating step occurs. The bath temperature is from 42 ° C to 56 ° C, preferably from sinking. If the bath temperature is out of this range, a problem similar to the above-described step of forming the first nickel ore layer occurs. The cathode current density is 1.5. Amperes / square decimeter to 6 amps / square decimeter, preferably 3 · 5 amps / square Meter to 5.3 amps/dm2. If the cathode current density is out of this range, a problem similar to the above-described step of forming the first nickel plating layer occurs. 90895.doc -14- 1278538 The second nickel bath is preferably replenished 〇·4 From 8% to 1.2% by weight of the acetylene alcohol derivative as an additive, preferably from 0.6% to 1.0% by weight. If the additive content is less than 0.4% by weight, the effect of imparting uniform electrodeposition ability and the degree of lightness are low. When it exceeds 1.2% by weight, the brightness is too high, and the resulting coating becomes brittle. Examples of the acetylene alcohol derivative include a non-leveling nickel plating brightener. (3) Plating conditions in the bright nickel plating step (step of forming the third nickel plating layer): the nickel sulfate concentration is 200 g/liter to 280 g/liter, preferably 22 gram/liter to 260 g/ If the right side of the acid nickel is out of this range, a problem similar to the above-described step of forming the first nickel plating layer occurs. The vaporized nickel concentration is from 45 g/liter to 90 g/liter, preferably from 50 g/liter to 7 g/l. If the concentration of nickel chloride is out of this range, a problem similar to the above-described step of forming the first nickel layer occurs. The boric acid concentration is from 25 g/liter to 50 g/liter, preferably from 35 g/liter to 45 g/liter. If the boric acid concentration deviates from this range, a problem similar to the above-described step of forming the first nickel plating layer occurs. The pH of the nickel plating bath is from 3.7 to 4.6, preferably from 3.8 to 4.3. What if the bath? 11 Out of this range, a problem similar to the above-described step of forming the first nickel plating layer occurs. The bath temperature is from 42 ° C to 5 passages, preferably to scratch. If the bath temperature deviates from this range, a problem similar to the above-described step of forming the first nickel plating layer occurs. The cathode current density is from 1.5 amps per square centimeter to 6 amps per square centimeter, preferably from 3.5 amps per square centimeter to 55 amps per square centimeter. If the dangerous current density is out of this range, it is similar to the above problem of forming the first-level step ^ 90895.doc -15-1278538. Preferably, the third recording bath is supplemented with from 4% to 16% by weight of the butyl diol derivative, preferably from 11% by weight. If the additive content is less than 0.4% by weight, the uniform electrodeposition ability, the internal stress reduction, and the effect of the corrosion resistance are low. Even if the additive content exceeds 6%, the excessive brightness caused by the residual additive in the subsequent step (such as burnt deposits, stains, etc.) and the like occurs. The block of the alcohol 1 organism includes a light-free electrophoretic brightener and the like. According to the present invention, a plating layer resistant to removal can be produced even for a molded article having a thin member obtained by high-speed injection molding. Further, even when the plating layer is formed on the grain, fine grain, satin or embossed surface, the plating layer can be re-grained, fine-grained, satin-finished or embossed. Conventional copper plating has a strong leveling effect and thus has the following problems. Even when micro-roughness (such as grain, fine lines, embossed or embossed) is provided on the surface, the 'roughness is leveled by the ore layer and can provide excessive brightness so that the grain can no longer be granulated. Fine lines, forged lines or embossed. Therefore, the characteristics of the electron forming cavities are destroyed. In contrast, the present invention is carried out under special plating conditions so that the metal ore layer can be firmly adhered to the lower surface and is resistant to removal (even for molded articles having thin parts). Furthermore, the plating can be reworked into a bright surface and grain, fine grain, satin or embossed surface. Further, the molded article obtained according to the present invention does not have defects peculiar to the copper plating layer (e.g., unevenness, adhesion of external foreign matter (bump)) as compared with the article having the conventional copper plating layer. In the present invention, nickel is deposited on the same type of metal 90895.doc -16-1278538 (nickel's on nickel) rather than on different types of metals. Therefore, the inter-layer capacitance is satisfactory, and the adhesion between the layers is satisfactory, so that a special neutralization and cleaning step between the copper plating step and the nickel plating step can be eliminated. According to these advantages, in the same case, the yield of the article having the desired quality can be improved by an average of 2% by weight, especially 3% by weight or more, compared to the article having a copper plating layer on the lower surface. , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Therefore, the scope of the patent scope is not intended to limit the invention, but the scope of the patent application can be widely determined. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing an exemplary electroplated article produced by the method of the present invention. [Explanation of main component symbols] 1 Primary molded product 2 Secondary molded product 3 Thin member 4 Thin molded product 90895.doc -17-