JPH02153087A - Production of electroformed mold - Google Patents
Production of electroformed moldInfo
- Publication number
- JPH02153087A JPH02153087A JP30761988A JP30761988A JPH02153087A JP H02153087 A JPH02153087 A JP H02153087A JP 30761988 A JP30761988 A JP 30761988A JP 30761988 A JP30761988 A JP 30761988A JP H02153087 A JPH02153087 A JP H02153087A
- Authority
- JP
- Japan
- Prior art keywords
- matrix
- nickel plating
- mold
- electroless nickel
- treated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000007747 plating Methods 0.000 claims abstract description 37
- 239000011159 matrix material Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- 230000001235 sensitizing effect Effects 0.000 claims abstract description 7
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 5
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 3
- 229910052737 gold Inorganic materials 0.000 claims abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 63
- 229910052759 nickel Inorganic materials 0.000 claims description 32
- 238000005323 electroforming Methods 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 19
- 229910000510 noble metal Inorganic materials 0.000 abstract description 3
- 238000009713 electroplating Methods 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 230000007547 defect Effects 0.000 description 9
- 238000000465 moulding Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000003486 chemical etching Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- 238000010790 dilution Methods 0.000 description 3
- 239000012895 dilution Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000007788 roughening Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 238000009787 hand lay-up Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 238000003287 bathing Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、インストルメントパネルなどの自動車内装材
の表皮成形やその他の成形の成形型どして利用される電
鋳型の製作方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for producing an electroforming mold used as a mold for skin molding of automobile interior materials such as instrument panels and other molding.
インストルメントパネルなど自動車内装材の表皮の成形
法としては真空成形法や、最近では、表面繊細凹凸模様
の表現などを目的に粉末溶融成形法が採用されるように
なってきている。Vacuum forming has been used as a molding method for the skin of automobile interior materials such as instrument panels, and recently, powder melt molding has been used for the purpose of creating delicate surface irregularities.
この粉末溶融成形用の金型は一般に電鋳法により製作さ
れており、この方法は、予め必要な形状、表面状態に成
形された母型の表面に、例えば銀鏡反応による銀被膜の
形成あるいは銀ペーストを溶剤で希釈し塗布するなどの
方法により導電性を付与し、次いで電気ニッケルめっき
を施し、比較的厚いめっき膜を形成せしめた後、前記母
型を除去して、残されたニッケルめっき殻を成形用金型
とするものである。Molds for this powder melting molding are generally manufactured by electroforming, and this method involves forming a silver coating on the surface of a mother mold that has been previously molded into the required shape and surface condition, for example by silver mirror reaction, or Conductivity is imparted by diluting the paste with a solvent and applying it, and then electro-nickel plating is applied to form a relatively thick plating film. After that, the matrix is removed and the remaining nickel plating shell is removed. is used as a mold for molding.
ところでこの方法においては、１ａ鏡法にょる銀被膜や
銀ペースト被膜は本来的には出来上がった金型表面より
除去されるべきものであり、そのため、母型表面と金型
表面との間に前記導電被膜が介在するかたちとなって母
型表面の繊細な凹凸模様が忠実に金型表面に転写され難
いという欠点があり、また、電気めっきによるニッケル
はビッヵ−ス硬さが約２５０であり、耐摩耗性がやや劣
り、繊細凹凸模様が摩耗などにより乱れや消失が起こり
易い。By the way, in this method, the silver coating and silver paste coating in the 1a mirror method should originally be removed from the finished mold surface, so there is no space between the mother mold surface and the mold surface. There is a drawback that the delicate uneven pattern on the surface of the mother mold is difficult to be faithfully transferred to the mold surface due to the presence of a conductive film, and the Vickers hardness of electroplated nickel is approximately 250. Abrasion resistance is slightly inferior, and delicate uneven patterns are easily disturbed or lost due to wear.
そこでこれらの改良法として、ビッカース硬さが高く耐
摩耗性に優れた無電解ニッケルめっきを母型に施し、次
いで電気ニッケルめっきを行って電鋳型を製作する方法
が提案されている（例えば、特開昭５３−７５４５号公
報や特開昭５３−３３２５７号公報参照）。Therefore, as an improvement method for these, a method has been proposed in which electroless nickel plating, which has high Vickers hardness and excellent wear resistance, is applied to the mother mold, and then electrolytic nickel plating is performed to produce an electroforming mold (for example, (See JP-A-53-7545 and JP-A-53-33257).
しかしながら、上記の方法をインストルメントパネルの
表皮成形などに使用される大型且つ複雑形状の金型に適
用しようとする場合には、無電解ニッケルめっきが円滑
に進まず、部分的にめっき層が欠落したものができやす
く、このため、次の電気ニッケルめっきの工程において
も、無電解ニッケルめっきの欠落した部分は、電気めっ
きされない場合が多く、また電気めっきされた場合にお
いてもピンホールなどの欠点が数多く発生し、欠陥の多
い電鋳型になる問題点があった。However, when applying the above method to large and complex-shaped molds used for molding the skin of instrument panels, electroless nickel plating does not proceed smoothly and the plating layer is partially missing. For this reason, in the next electrolytic nickel plating process, the areas where the electroless nickel plating is missing are often not electroplated, and even when electroplated, there are defects such as pinholes. There was a problem with the electroforming mold having many defects.
本発明は、無電解ニッケルめっき層の欠陥を改良して、
繊細な凹凸模様の転写性が優れ且つ表面硬度が高く、大
型・？Ｊ［錐形状の電鋳型製作にも適用できる電鋳型の
製作方法を提供しようとするものである。The present invention improves defects in the electroless nickel plating layer,
It has excellent transferability of delicate uneven patterns, high surface hardness, and large size. J[This is an attempt to provide a manufacturing method for electroforming molds that can also be applied to manufacturing cone-shaped electroforming molds.
前記無電解ニッケルめっきが円滑に進まず、部分的にめ
っき層が欠落したものができやすい原因としては、大型
・複雑形状で且つ表面繊細凹凸模様を重視する用途にお
いて、母型がハンドレイアップ積層法などにより製作さ
れるエポキシ樹脂などの樹脂製であること及び表面繊細
凹凸模様を重視して、樹脂への無電解めっきで一般に採
用されている表面粗化あるいは化学エツチング工程を採
用しないか採用しても表面繊細凹凸模様に影響しない程
度にとどめていることによるものと推定される。The reason why the electroless nickel plating does not proceed smoothly and the plating layer is likely to be partially missing is that in applications where large, complex shapes and delicate surface patterns are important, the matrix is hand-layed up and laminated. The material is made of resin such as epoxy resin manufactured by a method such as epoxy resin, and the surface has a delicate uneven pattern, so the surface roughening or chemical etching process that is commonly used in electroless plating of resin is used. This is presumed to be due to the fact that the surface is kept to a level that does not affect the delicate uneven pattern on the surface.
このような推定の基に、−船釣に採用されている表面粗
化あるいは化学エツチングを行わずに、円滑な無電解ニ
ッケルめっきが可能な方法について種々検討した結果、
本発明の製作方法においては、樹脂製の母型に無電解ニ
ッケルめっきを施した後、電気ニッケルめつきを行って
電鋳型を製作する方法において、上記無電解ニッケルめ
っきの工程を、樹脂製の母型をｐＨ７以上の増感処理剤
で処理した後に行うようにしたものである。Based on these estimates, we investigated various methods that would allow smooth electroless nickel plating without the surface roughening or chemical etching that is used in boat fishing.
In the manufacturing method of the present invention, in the method of manufacturing an electroforming mold by applying electroless nickel plating to a resin mother mold and then performing electronickel plating, the above-mentioned electroless nickel plating step is performed on the resin mother mold. This is done after the mother mold is treated with a sensitizing agent having a pH of 7 or higher.
ここで母型は、先ず木型などに皮を貼り込むなどして原
型を製作し、次いで型取り用シリコーンゴムなどで反転
し反転母型を製作する０次にこの反転母型を基にエポキ
シ樹脂あるいはウレタン樹脂など液状樹脂を用いてハン
ドレイアップ積層法などにより製作する方法が代表的で
ある。Here, the matrix is first made by pasting leather onto a wooden mold, etc., and then inverted with silicone rubber for mold making to produce an inverted matrix.Next, based on this inverted matrix, epoxy A typical manufacturing method is a hand lay-up lamination method using resin or liquid resin such as urethane resin.
又、反転母型にアクリル系樹脂などを溶剤に溶かして塗
布し、その後エポキシ樹脂、ウレタン樹脂あるいは不飽
和ポリエステル樹脂など液状樹脂を用い、例えばハンド
レイアップ積層法などにより母型を作ることもできる。Alternatively, the matrix can be made by applying an acrylic resin or the like dissolved in a solvent to the inverted matrix, and then using a liquid resin such as epoxy resin, urethane resin, or unsaturated polyester resin, for example, by a hand lay-up lamination method. .
更に木型表面に塩化ビニル系樹脂シートなど熱可塑性樹
脂シートを貼り、これを母型とすることも可能である。Furthermore, it is also possible to apply a thermoplastic resin sheet such as a vinyl chloride resin sheet to the surface of the wooden pattern and use this as a matrix.
なお、熱可塑性樹脂シートとして軟質塩化ビニル系樹脂
シートを使用する場合、このシートはその表面にアクリ
ル系樹脂あるいはウレタン系樹脂などが被覆されている
ことが望ましい。Note that when a soft vinyl chloride resin sheet is used as the thermoplastic resin sheet, it is desirable that the surface of the sheet be coated with an acrylic resin, a urethane resin, or the like.
次に、無電解ニッケルめっきは、母型表面の脱脂・クリ
ーニングなど表面調整を行った後、ｐＨ７以上、好まし
くはｐＨ８〜１２に調整した増感処理剤で処理し、次い
で還元処理を行った後に、行われる。Next, electroless nickel plating is carried out after surface conditioning such as degreasing and cleaning of the surface of the matrix, treatment with a sensitizing agent adjusted to pH 7 or higher, preferably pH 8 to 12, and then reduction treatment. , is done.
増感処理剤は、Ｐｄ、Ｐｔ、７１．ｕより選ばれた１種
以上を含むものが好ましく、樹脂製の母型表面にこれら
の貴金属を付与するものである。The sensitizing agent includes Pd, Pt, 71. Those containing one or more selected from u are preferred, and these noble metals are applied to the surface of the resin matrix.
又、母型表面の脱脂・クリーニングなど表面調整の前あ
るいは後に表面粗化あるいは化学エツチングを行っても
良い。Furthermore, surface roughening or chemical etching may be performed before or after surface conditioning such as degreasing and cleaning of the surface of the matrix.
電鋳型の製作は、無電解ニッケルめっき後、殻に行われ
ている方法、すなわち希硫酸などで表面活性化処理後、
スルファミン酸ニッケル浴などで電気めっきを行い、母
型の脱型、離面の研削などの工程を経て行われる。The electroforming mold is manufactured using the method used for shells after electroless nickel plating, that is, after surface activation treatment with dilute sulfuric acid, etc.
Electroplating is performed in a nickel sulfamate bath, followed by steps such as demolding the matrix and grinding the surface.
以下、本発明を実施例及び比較例に基づき具体的に説明
する。Hereinafter, the present invention will be specifically explained based on Examples and Comparative Examples.
実施例−１
■ 母型の製作
木仮に牛皮を貼って作成した原型から型取り用シリコー
ンゴムを用いて反転母型を作成した。この反転母型の表
面に液状のエポキシ樹脂を３度に分けて塗布し、その後
エポキシ樹脂を含浸したガラスクロスを積層し、その上
から更に液状エポキシ樹脂を塗布した。Example 1 ■ Production of mother mold An inverted mother mold was created from a master mold made by temporarily pasting cowhide on wood using silicone rubber for mold making. Liquid epoxy resin was applied to the surface of this inverted matrix in three parts, and then glass cloth impregnated with epoxy resin was laminated, and liquid epoxy resin was further applied on top of it.
室温で４８時間硬化後、反転母型を脱型し母型を得た。After curing at room temperature for 48 hours, the inverted matrix was demolded to obtain a matrix.
■ 無電解ニッケルめっき
母型を６０℃に調整したクリーナコンディショナーＣＬ
Ｃ３０１（日立化成工業株式会社、商品名）を２０倍に
希釈した溶液に４分間浸漬し、次にゆるやかな流水浴に
５分間漬は水洗した。その後、３０℃に調整したパラジ
ウム付与剤であるアルカリ増感剤ＨＡＳＩＯＩ（日立化
成工業株式会社、商品名）を２０倍に希釈してｐ Ｈ９
，８とじた溶液で５分間処理し、ゆるやかな流水浴で５
分間水洗した。次に３０℃に調整した還元剤ＲＤＰＩ０
１ （日立化成工業株式会社、商品名）を１０倍に希釈
した溶液で５分間処理し、上記と同様に水洗した。■ Cleaner conditioner CL with electroless nickel plating matrix adjusted to 60℃
C301 (trade name, Hitachi Chemical Co., Ltd.) was immersed in a 20-fold diluted solution for 4 minutes, then immersed in a gentle running water bath for 5 minutes, and then rinsed with water. Thereafter, the alkaline sensitizer HASIOI (Hitachi Chemical Co., Ltd., trade name), which is a palladium imparting agent, was adjusted to 30°C and diluted 20 times to pH 9.
, 8 for 5 minutes, then rinse in a gentle running water bath for 5 minutes.
Washed with water for a minute. Next, reducing agent RDPI0 adjusted to 30°C
1 (Hitachi Chemical Co., Ltd., trade name) for 5 minutes with a 10-fold diluted solution, and washed with water in the same manner as above.
その後、４５℃に調整した無電解ニッケルめっき液シュ
ーマーＳ−６８０（日本カニゼン株式会社、商品名）を
５倍に希釈した溶液で３０分間処理し、無電解ニッケル
めっきを施した。Thereafter, electroless nickel plating was performed by treating for 30 minutes with a 5-fold dilution of electroless nickel plating solution Schumer S-680 (trade name, Nippon Kanigen Co., Ltd.) adjusted to 45°C.
■ 電気ニッケルめっき
無電解ニッケルめっきを施した母型を、ニッケル電極と
共に４０℃に調整されたスルファミン酸ニッケル浴に浸
漬し、電流密度０．５〜５ Ａ／ｄ ｏｆで通電しめっ
き層を析出させた。所定厚み析出後、取り出し水洗し、
母型を脱型して電鋳型を得た。■ Electrolytic nickel plating The mother mold subjected to electroless nickel plating is immersed together with a nickel electrode in a nickel sulfamate bath adjusted to 40°C, and a current is applied at a current density of 0.5 to 5 A/d of to deposit a plating layer. I let it happen. After depositing to a predetermined thickness, take it out and wash it with water.
The mother mold was demolded to obtain an electroforming mold.
電鋳型の評価方法
無電解ニッケルめっきの欠陥は、ニッケルめっき層の欠
落程度を目視にて評価した。Method for evaluating electroforming molds Defects in electroless nickel plating were visually evaluated to determine the degree of loss of the nickel plating layer.
めっき欠落、ピンホール殆んど認められずＯピンホール
状欠落がわずかに認められる ６部分的に欠落が認めら
れる ×凹凸模様転写性は、電鋳型を２３
０〜２４０℃に加熱し、塩ビ系パウダスラッシェ成形用
材料を接触させ、浴着・溶融して得られたシート状成形
品のしぼ深さを表面粗さ計で測定し、原型のしぼ深さと
比較し、つや状態、しぼ形状、欠陥など目視評価した。There are almost no plating defects or pinholes, and some pinhole-like defects are observed. 6. Partial defects are observed.
The grain depth of the sheet-shaped molded product obtained by heating it to 0 to 240°C, contacting it with a PVC-based powder slash molding material, bathing and melting it was measured using a surface roughness meter, and the grain depth of the original molded product was measured using a surface roughness meter. The gloss, grain shape, defects, etc. were visually evaluated.
しぼ深さ（表面粗さ）の保持率が９０％以上で且つつや
状態、しぼ形状など良好 ○無電解ニッケルめっ
きの欠落部が欠陥として認められるもの
×実施例−１の評価結果は表−１に示し
た。The retention rate of grain depth (surface roughness) is 90% or more, and the luster and grain shape are good. ○ Items where missing parts of electroless nickel plating are recognized as defects.
×The evaluation results of Example-1 are shown in Table-1.
実施例−２
実施例−１の方法に準じたが、アルカリ増感剤浴のｐＨ
を８．０に調整し使用した。Example-2 The method of Example-1 was followed, but the pH of the alkaline sensitizer bath was
was adjusted to 8.0 and used.
評価結果は表−１に示した。The evaluation results are shown in Table-1.
比較例−１
実施例−１の方法に準じたが、アルカリ増感剤浴のｐＨ
を４．０に調整し使用した。Comparative Example-1 The method of Example-1 was followed, but the pH of the alkaline sensitizer bath was
was adjusted to 4.0 and used.
評価結果は表−１に示した。The evaluation results are shown in Table-1.
比較例−２
母型の製作及び電気ニッケルめっきは実施例−１の方法
に準じたが、無電解ニッケルめっきは次のように行った
。Comparative Example 2 The production of the matrix and the electrolytic nickel plating were carried out in accordance with the method of Example 1, but the electroless nickel plating was carried out as follows.
母型を、６０℃に調整した脱脂液ＨＣＲ２０１（日立化
成工業株式会社、商品名）を５倍に希釈した溶液で３分
間処理後、水洗し続いて２０’ＣのコンディショナーＣ
０ＮＤ２０１ （日立化成工業株式会社、商品名）を２
０倍に希釈した溶液で４分間処理し、水洗した。次に２
０℃のプリデイツプ浴（濃塩酸３５ｖｏ１％と純水６５
ｖｏ１％とを混合したもの）に２分間浸漬し、続いて２
０℃の増感剤Ｈ３ＩＯＩＢ（日立化成工業株式会社、商
品名）を６ｖｏ １％、濃塩酸３２ＶＱＩ％、及び純水
６２ＶＯ１％の割合で調合し、ｐ Ｈ１，０以下とした
パラジウム付与剤で１０分間処理し水洗した。次に、２
０℃の密着促進剤ＡＤＰ２０１ （日立化成工業株式
会社、商品名）を５倍に希釈した溶液で５分間処理し、
水洗後４５℃に調整した無電解ニッケルめっき液シュー
マＳ−６８０（日本カニゼン株式会社、商品名）を５倍
に希釈したｉ８ ？＆に３０分間浸漬し、無電解ニッケ
ルめっきを施した。The mother mold was treated for 3 minutes with a 5-fold dilution of degreasing liquid HCR201 (trade name, Hitachi Chemical Co., Ltd.) adjusted to 60°C, washed with water, and then treated with conditioner C at 20°C.
0ND201 (Hitachi Chemical Co., Ltd., product name) 2
It was treated with a 0x diluted solution for 4 minutes and washed with water. Next 2
0℃ pre-dip bath (concentrated hydrochloric acid 35 vol. and pure water 65 vol.
vol.1% mixture) for 2 minutes, followed by immersion in
The 0°C sensitizer H3IOIB (Hitachi Chemical Co., Ltd., trade name) was prepared in a ratio of 6VO 1%, concentrated hydrochloric acid 32VQI%, and pure water 62VO 1%, and the pH was adjusted to 1.0 or less with a palladium imparting agent. It was treated for a minute and washed with water. Next, 2
Treated for 5 minutes with a 5-fold diluted solution of adhesion promoter ADP201 (Hitachi Chemical Co., Ltd., trade name) at 0°C.
i8 is a 5-fold dilution of electroless nickel plating solution Shuma S-680 (Nippon Kanigen Co., Ltd., trade name) adjusted to 45°C after washing with water. It was immersed in & for 30 minutes and electroless nickel plating was applied.
評価結果は表−１に示した。The evaluation results are shown in Table-1.
表−１
施できるようになり、又、インストルメントパネル表皮
成形用電鋳型など大型・複雑形状で且つ表面の凹凸模様
が重視される用途にも適用できるようになった。更に、
硬く、耐７耗性に優れた無電解ニッケルめっき層が表面
層になっている電鋳型は、凹凸模様摩滅などに対し寿命
向上が期待でき〔発明の効果〕Table 1 It has also become possible to apply it to applications such as electroforming molds for forming instrument panel skins, which have large, complex shapes and where uneven patterns on the surface are important. Furthermore,
Electroformed molds whose surface layer is hard and have an electroless nickel plating layer with excellent wear resistance can be expected to have a longer lifespan against uneven pattern wear. [Effects of the invention]
Claims (1)
電気ニッケルめっきを行って電鋳型を製作する方法にお
いて、上記無電解ニッケルめっきを、上記樹脂製の母型
をｐＨ７以上の増感処理剤で処理した後に行うことを特
徴とする電鋳型の製作方法。 ２、ｐＨ７以上の増感処理剤がＰｄ、Ｐｔ及びＡｕより
選ばれた１種以上を含むものである請求項１記載の電鋳
型の製作方法。[Claims] 1. After applying electroless nickel plating to a resin matrix,
A method for producing an electroforming mold by electrolytic nickel plating, characterized in that the electroless nickel plating is performed after the resin matrix is treated with a sensitizing agent having a pH of 7 or higher. . 2. The method for producing an electroforming mold according to claim 1, wherein the sensitizing agent having a pH of 7 or more contains one or more selected from Pd, Pt, and Au.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30761988A JPH02153087A (en) | 1988-12-05 | 1988-12-05 | Production of electroformed mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30761988A JPH02153087A (en) | 1988-12-05 | 1988-12-05 | Production of electroformed mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02153087A true JPH02153087A (en) | 1990-06-12 |
Family
ID=17971209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30761988A Pending JPH02153087A (en) | 1988-12-05 | 1988-12-05 | Production of electroformed mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02153087A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006219752A (en) * | 2005-02-14 | 2006-08-24 | Canon Inc | Production method of structure |
| JP2007131919A (en) * | 2005-11-10 | 2007-05-31 | Iwate Univ | Method for producing electroforming die |
| WO2008037501A2 (en) * | 2006-09-29 | 2008-04-03 | Faurecia Innenraum Systeme Gmbh | Method for applying a nickel layer with fluoropolymer particles |
-
1988
- 1988-12-05 JP JP30761988A patent/JPH02153087A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006219752A (en) * | 2005-02-14 | 2006-08-24 | Canon Inc | Production method of structure |
| JP2007131919A (en) * | 2005-11-10 | 2007-05-31 | Iwate Univ | Method for producing electroforming die |
| WO2008037501A2 (en) * | 2006-09-29 | 2008-04-03 | Faurecia Innenraum Systeme Gmbh | Method for applying a nickel layer with fluoropolymer particles |
| WO2008037501A3 (en) * | 2006-09-29 | 2008-10-30 | Faurecia Innenraum Sys Gmbh | Method for applying a nickel layer with fluoropolymer particles |
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