JPH05214578A - Production of noble metal electrocasting - Google Patents
Production of noble metal electrocastingInfo
- Publication number
- JPH05214578A JPH05214578A JP4199992A JP4199992A JPH05214578A JP H05214578 A JPH05214578 A JP H05214578A JP 4199992 A JP4199992 A JP 4199992A JP 4199992 A JP4199992 A JP 4199992A JP H05214578 A JPH05214578 A JP H05214578A
- Authority
- JP
- Japan
- Prior art keywords
- electrocasting
- copper
- noble metal
- wax
- base body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adornments (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は母型の基体としてワック
スを用い、貴金属又は貴金属合金の装飾用物品、細工物
などとなる貴金属電鋳品を作るときの製造方法に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a noble metal electroformed product which is a precious metal or a noble metal alloy decorative article or a work using a wax as a matrix substrate.
【0002】[0002]
【従来の技術】貴金属層を金属基体上にめっき析出させ
て装飾品や細工物を作ることは広く行われているが、こ
れらの方法は通常安価な装身具や細工物を作る為のもの
であって、貴金属の析出層は薄く物品全体の強さは基体
そのものによって維持している。2. Description of the Related Art It is widely practiced to deposit a precious metal layer on a metal substrate by plating to make a decoration or a work. However, these methods are usually used for making an inexpensive accessory or a work. Thus, the noble metal deposition layer is thin and the strength of the entire article is maintained by the substrate itself.
【0003】一方これに代わるものとして装飾用電鋳品
が知られているが、従来母型の基体として銀や銅などの
金属を使用した場合、母型を電解脱脂した後、活性化、
下地めっき、貴金属電鋳という工程を経て、最後に硝酸
等で母型を溶解して貴金属電鋳品を製造していた。とこ
ろで近年、母型の製造のし易さ及び電鋳後の母型の溶解
のし易さなどの点から、ワックスが母型の基体として好
まれるようになってきている。特に低融点ワックスの場
合、融点が60℃のため、温水に漬けるだけで15分間ほど
で母型が溶解でき、銀や銅を母型に使用したとき、溶解
に3日間ほどかかり、また硝酸等の薬品が多量に必要と
なることと比較すると、大幅にコスト及び時間を節約で
きる。On the other hand, as an alternative to this, an electroformed product for decoration is known, but when a metal such as silver or copper is used as a base material of the conventional mold, the master mold is electrolytically degreased and then activated.
After the steps of base plating and precious metal electroforming, the master mold was finally melted with nitric acid or the like to produce a precious metal electroformed product. By the way, in recent years, a wax has been favored as a base material of the master mold in view of the ease of manufacturing the master mold and the ease of melting the master mold after electroforming. Especially in the case of low melting point wax, the melting point is 60 ° C, so the master mold can be dissolved in about 15 minutes just by immersing it in warm water, and when silver or copper is used for the master mold, it takes about 3 days to melt and nitric acid etc. Compared with the large amount of chemicals required, the cost and time can be saved significantly.
【0004】ところが、このように利点の多いワックス
の母型であるが、その特性ゆえに、工程中に60℃以上の
温度での処理を必要とする工程が入ってくると、母型が
溶解してしまい、電鋳品が作れないという問題があっ
た。たとえば通常60℃程度で使用される電解脱脂剤を用
いると、母型のシャープさが損なわれたり、また白金の
電鋳品を製造する場合、市販の白金電鋳液は90℃という
高温で使用するため母型が溶け出してしまい、電鋳品が
作れないという問題があった。However, although the wax master block has many advantages as described above, due to its characteristics, the master block melts when a process requiring a treatment at a temperature of 60 ° C. or higher comes into the process. There was a problem that electroformed products could not be made. For example, if an electrolytic degreasing agent, which is usually used at about 60 ° C, is used, the sharpness of the mother die is impaired, and when manufacturing platinum electroformed products, commercially available platinum electroforming liquid is used at a high temperature of 90 ° C. Therefore, there is a problem that the mother die melts out and an electroformed product cannot be produced.
【0005】[0005]
【発明が解決しようとする課題】本発明は、上記課題を
解決し、ワックスを母型の基体として貴金属の電鋳品を
作るための製造方法を提供することを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to solve the above problems and provide a manufacturing method for producing an electroformed product of a noble metal by using a wax as a base material of a mold.
【0006】[0006]
【課題を解決するための手段】上記課題を解決するため
に、本発明は導電性被膜を形成したワックス基体を浸漬
脱脂液にて脱脂した後、銅電鋳液にて銅電鋳を行い、そ
の後該銅電鋳を行ったワックス基体に熱をかけてワック
スを抜き出し、さらに貴金属電鋳を行うことを特徴と
し、上記方法をとることにより、ワックス基体を母型と
して、使用温度の高い貴金属電鋳液を使いながら、貴金
属電鋳品を製造できるものである。In order to solve the above-mentioned problems, the present invention is to degrease a wax substrate on which a conductive coating is formed with an immersion degreasing solution, and then perform copper electroforming with a copper electroforming solution, After that, the wax base subjected to the copper electroforming is heated to extract the wax, and the noble metal electroforming is further performed. According to the above method, the wax base is used as a master mold and the noble metal electrode having a high operating temperature is used. A precious metal electroformed product can be produced while using a casting liquid.
【0007】上記本発明の方法では、貴金属電鋳前の、
従来薄かった下地めっきを銅電鋳とすることにより充分
な強度をもたせ、下地銅電鋳が終わった段階で母型のワ
ックスを抜き出すことが可能となった。このように下地
銅電鋳後にワックスを抜き出すことにより、その後の貴
金属電鋳処理では処理温度を気にする必要がなく、たと
えば90℃で使用する白金電鋳液を用いても、電鋳品が製
造できるようになった。また貴金属電鋳後、下地の銅電
鋳は硝酸等に浸漬することにより容易に溶解し、貴金属
のみの電鋳品ができあがる。なお下地銅電鋳液の例とし
ては、30乃至40℃で使用できる、硫酸銅電鋳液等が適し
ている。また脱脂工程も60℃程度で使用する電解脱脂剤
から、40℃で使用する浸漬脱脂剤に替えることにより、
母型のシャープ上がそこなわれることもなくなった。In the above method of the present invention, before noble metal electroforming,
By using copper electroforming as the base plating, which was conventionally thin, it has sufficient strength, and the wax of the mother die can be extracted at the stage when the base copper electroforming is finished. In this way, by extracting the wax after electroforming the copper base, it is not necessary to worry about the processing temperature in the subsequent noble metal electroforming treatment, for example, even when using the platinum electroforming liquid used at 90 ℃, electroformed products It can be manufactured. Further, after electroforming the noble metal, the copper electroforming as the base is easily dissolved by dipping in nitric acid or the like, and an electroformed product containing only the noble metal is completed. As an example of the base copper electroforming liquid, a copper sulfate electroforming liquid that can be used at 30 to 40 ° C. is suitable. In the degreasing process, by changing the electrolytic degreaser used at about 60 ° C to the immersion degreaser used at 40 ° C,
The sharpness of the mother mold is no longer compromised.
【0008】[0008]
【実施例】本発明に係わるワックスを母型とした電鋳製
品の製造方法の実施例を記載するが、本発明を限定する
ものではない。低融点ワックスにてペンダント用の基体
を作成した。このワックス基体を、超音波をかけたアセ
トンに24分間浸漬して表面粗化した後、トリクロルエタ
ン50mlとイソプロピルアルコール 150mlの混合液に6分
間浸漬して表面を膨張させた。その後水 100mlとイソプ
ロピルアルコール 100mlの混合液にポリビニルアルコー
ル4gを溶かした液へ該ワックス基体を浸漬し、超音波
をかけながら6分間処理し、その後基体を取り出し、室
温にて8時間放置乾燥させた。その後、基体を上記水、
イソプロピルアルコールおよびポリビニルアルコールの
混合液へ再度浸漬し、超音波をかけながら6分間処理、
取り出して8時間室温乾燥を行う操作を繰り返した。つ
ぎに水 100ml、イソプロピルアルコール 100ml、塩酸4
mlの混合液へポリビニルアルコール2g、塩化パラジウ
ム 0.1gを溶解した液へ上記基体を6分間浸漬し、その
後基体を取り出して室温にて8時間放置乾燥させた。そ
の後再度、上記水、イソプロピルアルコール、塩酸、ポ
リビニルアルコール、塩化パラジウム混合液への6分間
浸漬、室温で8時間乾燥を繰り返した。このようにして
ワックス基体上に親水性被膜を強固に施した後、キャタ
ライジング処理、アクセルレーティング処理を行った。
キャタライジング液としては室町化学工業製MK220 を
用い、塩化パラジウム1g/l、塩化第1スズ70g/
l、HCl31ml/lの濃度になるように調製した液を使
用し、アクセルレーティング液としては同じく室町化学
工業製MK330(MK 330:10ml+水:90ml)を使用し
た。親水性被膜を施した基体を、室温でスターラ弱撹拌
した上記キャタライジング液に10分間浸漬し、取り出し
て充分水洗した後、上記アクセルレーティング液に室温
で10分間浸漬し、水洗することにより触媒付与を行っ
た。次に触媒付与したワックス基体上に無電解銅めっき
を行った。無電解銅めっき浴は室町化学工業製のアルカ
リ性無電解銅めっき浴MK430 を銅濃度22.9g/lとな
るように調製した液を用い、室温でエアー撹拌しなが
ら、触媒付与したワックス基体を20分間浸漬した後水洗
した。その後日本エレクトロプレイティング・エンジニ
ヤース社製浸漬脱脂剤イートレックス#11にて40℃で60
秒間浸漬脱脂し、水洗、10容量%の硫酸水溶液へ30秒間
浸漬、水洗を行い、エバラコージライト社製銅電鋳用添
加剤を入れた銅電鋳液にて、40℃で、10A/dm2 の電流
密度で60分間電解し、銅電鋳を50μm施した。その後、
日本エレクトロプレイティング・エンジニヤース社製金
ストライクめっき液オーロボンドにて32℃で6V30秒間
めっきした後、日本エレクトロプレイティング・エンジ
ニヤース社製金めっき液オートロネクスCIにて32℃で
1A/dm2 の電流密度で6分間めっきして金を1μm施
した基体を熱湯に15分間浸漬し、予め銅電鋳上に開けて
おいた小孔より、ワックス材を抜き出した。このように
して得られた銅電鋳品上に、日本エレクトロプレイティ
ング・エンジニヤース社製白金電鋳浴プラチナートに
て、90℃で、 2.5A/dm2 の電流密度で 280分間電鋳を
行い、 100μmの白金電鋳を施した。その後水洗し、硝
酸に30分間浸漬して銅下地電鋳を溶解し、さらに水洗す
ることにより、純白金の電鋳ペンダントができあがっ
た。この電鋳ペンダントは母型の形をきれいに再現し、
ピンホール、ブツ等のない非常に良好なものであった。EXAMPLE An example of a method for producing an electroformed product using a wax as a mother mold according to the present invention will be described, but the present invention is not limited thereto. A base material for a pendant was prepared with a low melting point wax. This wax substrate was immersed in ultrasonically applied acetone for 24 minutes to roughen the surface, and then immersed in a mixed solution of 50 ml of trichloroethane and 150 ml of isopropyl alcohol for 6 minutes to expand the surface. Then, the wax substrate was dipped in a solution prepared by dissolving 4 g of polyvinyl alcohol in a mixed solution of 100 ml of water and 100 ml of isopropyl alcohol, treated for 6 minutes while applying ultrasonic waves, and then taken out of the substrate and left to dry at room temperature for 8 hours. .. Then, the substrate is
Re-immerse in a mixed solution of isopropyl alcohol and polyvinyl alcohol, treat for 6 minutes while applying ultrasonic waves,
The operation of taking out and drying at room temperature for 8 hours was repeated. Next, 100 ml of water, 100 ml of isopropyl alcohol, 4 hydrochloric acid
The above substrate was immersed in a solution of 2 g of polyvinyl alcohol and 0.1 g of palladium chloride dissolved in a mixed solution of ml for 6 minutes, and then the substrate was taken out and left to dry at room temperature for 8 hours. After that, it was again immersed in the mixed solution of water, isopropyl alcohol, hydrochloric acid, polyvinyl alcohol and palladium chloride for 6 minutes and dried at room temperature for 8 hours. After the hydrophilic coating was firmly applied on the wax substrate in this manner, catalyzing treatment and accelerator rating treatment were performed.
MK220 manufactured by Muromachi Chemical Co., Ltd. was used as the catalyzing solution, and palladium chloride 1 g / l, stannous chloride 70 g /
1, a solution prepared to have a concentration of 31 ml / l HCl was used, and MK330 (MK 330: 10 ml + water: 90 ml) manufactured by Muromachi Chemical Co., Ltd. was also used as the accelerator solution. The substrate coated with the hydrophilic coating is immersed in the above-mentioned catalyzing solution with a stirrer at room temperature for 10 minutes, taken out and thoroughly washed with water, then immersed in the above-mentioned accelerator solution at room temperature for 10 minutes and washed with water to impart a catalyst. I went. Next, electroless copper plating was performed on the wax substrate to which the catalyst was added. As the electroless copper plating bath, a solution prepared by using an alkaline electroless copper plating bath MK430 manufactured by Muromachi Chemical Industry Co., Ltd. to have a copper concentration of 22.9 g / l was used, and the catalyst-added wax substrate was stirred for 20 minutes while air stirring at room temperature. After immersion, it was washed with water. After that, it was made at 60 ° C at 40 ° C with Japan Electroplating Engineering's immersion degreaser Eatrex # 11.
Immersion degreasing for 2 seconds, washing with water, immersion in a 10% by volume sulfuric acid aqueous solution for 30 seconds, washing with water, and a copper electroforming solution containing an additive for copper electroforming manufactured by Ebara Cordierite at 40 ° C, 10 A / dm Electrolysis was performed at a current density of 2 for 60 minutes, and copper electroforming was performed at 50 μm. afterwards,
Nippon Electroplating Engineers Gold Strike Plating Solution Aurobond plating at 32 ° C for 6V for 30 seconds, then using Nippon Electroplating Engineering Gold Plating Solution Autoronex CI at 32 ° C at 1 A / dm 2 The substrate coated with 1 μm of gold by plating at a current density for 6 minutes was immersed in hot water for 15 minutes, and the wax material was extracted from the small holes previously formed on the copper electroforming. The copper electroformed product thus obtained was electroformed with a platinum electroforming bath Platinate manufactured by Nippon Electroplating Engineering Co., Ltd. at 90 ° C. and a current density of 2.5 A / dm 2 for 280 minutes. , 100 μm platinum electroforming was performed. Then, it was washed with water, immersed in nitric acid for 30 minutes to dissolve the electroplated copper base, and further washed with water to form an electroplated pendant of pure platinum. This electroformed pendant beautifully reproduces the shape of the mother mold,
It was a very good product with no pinholes or lumps.
【0009】[0009]
【従来例】実施例と同様の方法で、ワックス基体に無電
解銅めっきまで施した。その後日本エレクトロプレイテ
ィング・エンジニヤース社製電解脱脂剤にて、60℃で、
2A/dm2 の電流密度で60秒間電解脱脂した。この時、
基体は熱により軟化し、形が若干変形してしまった。そ
の後、水洗、10容量%の硫酸水溶液へ30秒間浸漬、水洗
を行い、日本エレクトロプレイティング・エンジニヤー
ス社製銅めっき用添加剤をキューバスMを入れた銅めっ
き液にて室温で、2A/dm2 の電流密度で20分間電解
し、銅めっき10μmを施した。その後水洗し日本エレク
トロプレイティング・エンジニヤース社製白金電鋳液プ
ラチナートにて、90℃で電鋳を行おうとしたところ、ワ
ックス基体が融解し、銅めっきが割れてしまい、まった
く電鋳できなかった。PRIOR ART A wax substrate was subjected to electroless copper plating in the same manner as in the examples. Then, at 60 ° C with an electrolytic degreasing agent manufactured by Nippon Electroplating Engineers,
Electrolytic degreasing was performed for 60 seconds at a current density of 2 A / dm 2 . At this time,
The base material was softened by heat and its shape was slightly deformed. Then, it was washed with water, immersed in a 10% by volume sulfuric acid aqueous solution for 30 seconds and washed with water, and the additive for copper plating manufactured by Nippon Electroplating Engineers Co., Ltd. was added with Cubus M at room temperature for 2 A / Electrolysis was performed at a current density of dm 2 for 20 minutes, and copper plating was performed at 10 μm. After that, it was washed with water, and when electroplating was carried out at 90 ° C. with a platinum electroforming solution Platinate manufactured by Japan Electroplating Engineering Company, the wax base melted and the copper plating was cracked, and it could not be electroformed at all. ..
【0010】[0010]
【発明の効果】以上述べたように、本発明の貴金属電鋳
品の製造方法を用いれば、低融点ワックスを母型とした
貴金属電鋳品が、貴金属電鋳液の種類に係わらず安定し
て製造することができるようになり、銀、銅などの金属
を母型にしたときに比べ、大幅にコストや時間を節約す
ることができる。As described above, according to the method for producing a noble metal electroformed product of the present invention, a noble metal electroformed product having a low-melting wax as a matrix is stable regardless of the type of noble metal electroformed liquid. It becomes possible to manufacture by making it possible to save the cost and time significantly as compared with the case of using a metal such as silver or copper as the mother die.
Claims (1)
の製造方法において、導電性被膜形成処理を行ったワッ
クス基体を浸漬脱脂液にて脱脂した後、銅電鋳液にて銅
電鋳を行い、その後該銅電鋳を行ったワックス基体に熱
をかけてワックスを抜き出し、さらに貴金属電鋳を行う
ことを特徴とする貴金属電鋳品の製造方法。1. A method for manufacturing a noble metal electroformed product using a wax substrate as a master mold, after dewaxing a wax substrate subjected to a conductive film forming treatment with an immersion degreasing solution and then copper electroforming with a copper electroforming solution. Then, heat is applied to the wax base on which the copper electroforming has been performed, the wax is extracted, and the noble metal electroformed product is further produced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4199992A JPH05214578A (en) | 1992-01-31 | 1992-01-31 | Production of noble metal electrocasting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4199992A JPH05214578A (en) | 1992-01-31 | 1992-01-31 | Production of noble metal electrocasting |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05214578A true JPH05214578A (en) | 1993-08-24 |
Family
ID=12623909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4199992A Pending JPH05214578A (en) | 1992-01-31 | 1992-01-31 | Production of noble metal electrocasting |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05214578A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011246779A (en) * | 2010-05-28 | 2011-12-08 | Sumitomo Electric Ind Ltd | Method of manufacturing aluminum structure and the aluminum structure |
US8728627B2 (en) | 2010-05-12 | 2014-05-20 | Sumitomo Electric Industries, Ltd. | Manufacturing method of aluminum structural body and aluminum structural body |
CN104570693A (en) * | 2014-12-15 | 2015-04-29 | 深圳市凡逅珠宝首饰有限公司 | Hollow watch band of wrist watch |
CN112095093A (en) * | 2020-09-03 | 2020-12-18 | 南昌航空大学 | Treatment method for paraffin surface conductivity |
-
1992
- 1992-01-31 JP JP4199992A patent/JPH05214578A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8728627B2 (en) | 2010-05-12 | 2014-05-20 | Sumitomo Electric Industries, Ltd. | Manufacturing method of aluminum structural body and aluminum structural body |
JP2011246779A (en) * | 2010-05-28 | 2011-12-08 | Sumitomo Electric Ind Ltd | Method of manufacturing aluminum structure and the aluminum structure |
CN104570693A (en) * | 2014-12-15 | 2015-04-29 | 深圳市凡逅珠宝首饰有限公司 | Hollow watch band of wrist watch |
CN112095093A (en) * | 2020-09-03 | 2020-12-18 | 南昌航空大学 | Treatment method for paraffin surface conductivity |
CN112095093B (en) * | 2020-09-03 | 2022-11-11 | 南昌航空大学 | Treatment method for paraffin surface conductivity |
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