CN108683762B - Decorative ring, functional assembly, electronic device and processing method of decorative ring - Google Patents
Decorative ring, functional assembly, electronic device and processing method of decorative ring Download PDFInfo
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- CN108683762B CN108683762B CN201810495724.6A CN201810495724A CN108683762B CN 108683762 B CN108683762 B CN 108683762B CN 201810495724 A CN201810495724 A CN 201810495724A CN 108683762 B CN108683762 B CN 108683762B
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Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
- H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Chemical & Material Sciences (AREA)
- Multimedia (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The application provides a decorative ring, a functional assembly, an electronic device and a processing method of the decorative ring. The decorative ring comprises a decorative ring base body, a first plating layer and a second plating layer; the decorative ring base body is made of plastic materials and comprises an outer surface and an inner surface which are oppositely arranged, the outer surface forms part of the appearance surface of the decorative ring base body, and the inner surface forms an accommodating space in a surrounding mode; the first plating layer is arranged on the outer surface and used for increasing the surface flatness of the decorative ring base body, and the first plating layer presents metallic luster; the second plating layer is arranged on the surface, far away from the decorative ring base body, of the first plating layer, and the second plating layer is used for increasing the surface hardness of the decorative ring base body. The technical scheme of the application is favorable for reducing the cost.
Description
Technical Field
The application relates to the technical field of electronics, in particular to a decorative ring, a functional assembly, an electronic device and a processing method of the decorative ring.
Background
In order to protect the camera lens, the camera lens bezel usually requires a high-strength material and a high surface hardness, so that a stainless material and Physical Vapor Deposition (PVD) protection and decoration are generally adopted. Stainless steel is adopted for machining in the traditional technology, although initial forging and Computer Numerical Control (CNC) machining can be carried out, the total CNC machining cost is high; meanwhile, a powder metallurgy process can be used as a base material, but the powder metallurgy needs sintering, heat treatment and other processes, and simultaneously needs a small amount of CNC (computerized numerical control) machining, so that the cost is reduced but is still high.
Disclosure of Invention
The application provides a decorate circle, decorate the circle and include: the decorative ring comprises a decorative ring base body, a first plating layer and a second plating layer; the decorative ring base body is made of plastic materials and comprises an outer surface and an inner surface which are oppositely arranged, the outer surface forms part of the appearance surface of the decorative ring base body, and the inner surface forms an accommodating space in a surrounding mode; the first plating layer is arranged on the outer surface and used for increasing the surface flatness of the decorative ring base body, and the first plating layer presents metallic luster; the second plating layer is arranged on the surface, far away from the decorative ring base body, of the first plating layer, and the second plating layer is used for increasing the surface hardness of the decorative ring base body.
The utility model provides a decorate circle includes: the decorative ring comprises a decorative ring base body, a first plating layer and a second plating layer; the decorative ring base body is made of plastic materials and comprises an outer surface and an inner surface which are oppositely arranged, the outer surface forms part of the appearance surface of the decorative ring base body, and the inner surface forms an accommodating space in a surrounding mode; the first plating layer is arranged on the outer surface and used for increasing the surface flatness of the decorative ring base body, and the first plating layer presents metallic luster; the second plating layer is arranged on the surface, far away from the decorative ring base body, of the first plating layer, and the second plating layer is used for increasing the surface hardness of the decorative ring base body. Because the decoration circle base member is the plastic material, can adopt injection moulding, need not to adopt CNC processing, is applicable to mass production, helps saving the processing cost. The outer surface is provided with a first plating layer, the first plating layer is used for increasing the surface flatness of the decorative ring base body, the first plating layer is far away from the surface of the decorative ring base body, and a second plating layer is arranged on the surface of the decorative ring base body and used for increasing the surface hardness of the decorative ring base body, so that the service life of the decorative ring is prolonged. And further, the mounting groove, the positioning hole and other structures of the decorative ring base body can be formed in one step in injection molding, so that the processing time is greatly saved, and the development period of the decorative ring is favorably shortened.
The present application further provides a functional assembly comprising a functional device and a decorative ring as described above.
The application also provides an electronic device, which comprises the functional component.
The application also provides a processing method of the decorative ring, the decorative ring is used for forming decoration on the functional device, and the processing method of the decorative ring comprises the following steps:
providing a decorative ring base body, wherein the decorative ring base body is made of plastic materials and comprises an outer surface and an inner surface which are oppositely arranged, the outer surface forms part of the appearance surface of the decorative ring base body, and the inner surface encloses an accommodating space;
forming a first plating layer covering the outer surface to obtain a first substrate, wherein the first plating layer is used for increasing the surface flatness of the decorative ring substrate;
and forming a second plating layer covering the first substrate to obtain a second substrate, wherein the second plating layer is used for increasing the surface hardness of the decorative ring substrate.
The application also provides a decorative ring which is processed by the processing method of the decorative ring.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1(a) is a schematic structural diagram of a front view of a decorative ring provided in an embodiment of the present application.
FIG. 1(b) is an AA cross-sectional view of the bezel 10 provided in FIG. 1 (a).
Fig. 2 is a schematic structural diagram of an AA cross-sectional view of a decorative ring provided in the second embodiment of the present application.
Fig. 3 is a schematic structural diagram of an AA cross-sectional view of a decorative ring provided in the third embodiment of the present application.
Fig. 4 is a schematic structural diagram of a functional device according to a preferred embodiment of the present application.
Fig. 5 is a schematic structural diagram of an electronic device according to a preferred embodiment of the present application.
Fig. 6 is a flowchart of a processing method of a decorative ring according to an embodiment of the present application.
Fig. 7 to 8 are partial flow charts of a method for processing a decorative ring according to an embodiment of the present application.
Fig. 9 is a flowchart of a processing method of a decorative ring according to a second embodiment of the present application.
Fig. 10 to 11 are partial flow charts of a method for processing a decorative ring according to a second embodiment of the present application.
Fig. 12 is a flowchart of a processing method of a decorative ring according to a third embodiment of the present application.
Fig. 13 is a flowchart of another method for processing a decorative ring according to the third embodiment of the present application.
Detailed Description
In order that the above objects, features and advantages of the present application can be more clearly understood, a detailed description of the present application will be given below with reference to the accompanying drawings and detailed description. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
Referring to fig. 1(a) and fig. 1(b), fig. 1(a) is a schematic structural diagram of a front view of a decorative ring according to an embodiment of the present disclosure. FIG. 1(b) is an AA cross-sectional view of the bezel 10 provided in FIG. 1 (a). In the present embodiment, the decorative ring 10 has a decorative effect, and includes: a decorative ring base 110 and a first plating layer 120. The decorative ring base body 110 is made of plastic materials, the decorative ring base body 110 comprises an outer surface 110a and an inner surface 110b which are oppositely arranged, and the outer surface 110a forms part of the appearance surface of the decorative ring base body 110. The inner surface 110B encloses a receiving space 110B. The first plating layer 120 is disposed on the outer surface 110a, and the first plating layer 120 is used to increase the surface flatness of the bezel substrate 110.
Optionally, the bezel 10 is used to decorate a cover glass 101 (see fig. 4) of a functional device 100 (see fig. 4). Wherein, the functional device 100 includes at least one of a camera, a fingerprint identification chip, and a flash. For example, when the functional device 100 is a camera, the decorative ring 10 is used for decorating a lens of the camera, at this time, the lens of the camera is the cover glass 101 and is located in the accommodating space 110B, and the functional device 100 is located at a position facing the decorative ring 10.
The term "plastic" refers to a liquid product that is mainly composed of carbon, oxygen, hydrogen, nitrogen and other organic or inorganic elements, is solid and is molten during the manufacturing process, and thus can be mechanically heated to melt, pressurized to flow, and cooled to solidify, thereby forming various shapes, and this large and versatile group of materials is called plastic.
The term "flatness" refers to the difference between the surface roughness and the absolute surface roughness when some object is machined or produced. Wherein, the smaller the value, the better the flatness.
Optionally, the first plating layer 120 is formed by water plating surface treatment, and the first plating layer 120 presents a metallic luster, so that the bezel 10 presents a metallic texture, and the bezel 10 presents a highlight effect, which is more cool. The 'water plating surface treatment' is that different special 'water plating' liquids are prepared according to the requirements of various decorative ring matrixes and plating layers, the decorative ring matrixes are placed in the water plating liquid at room temperature (15-40 ℃) and slightly shaken, and the treatment can be finished in a short time (for example, silver plating, usually 30 seconds).
Specifically, decorate circle base member 110 and be the plastic material, can adopt injection moulding, just decorate the mounting groove of circle base member 110 and structures such as chamfer and all can be once forming in the injection moulding, saved Computer numerical Control lathe (CNC) processing, consequently, help reducing the processing cost, and shortened processing cycle greatly, improved the development efficiency who decorates circle base member 110. Among them, "injection molding" is also called injection molding, which is a molding method of injection and molding. The injection molding method has the advantages of high production speed, high efficiency, automation of operation, various colors, various shapes from simple to complex, small sizes, accurate product size, easy replacement of products, capability of forming products with complex shapes, and suitability for the molding processing fields of mass production, products with complex shapes and the like.
Optionally, in an embodiment, since the inner surface 110B encloses a receiving space 110B, and the receiving space 110B is used for receiving the cover glass 101 of the functional device 100, the appearance of the inner surface 110B is not required to be excessive, the first plating layer 120 is not required to be performed on the inner surface 110B, the first plating layer 120 is only provided on the outer surface 110a, and when the first plating layer 120 is performed on the outer surface 110a, a protective film needs to be attached to the inner surface 110B, and the protective film is used for protecting the inner surface 110B and preventing the inner surface 110B from being affected during the first plating layer 120. At this time, the coating area of the first plating layer 120 is saved, the difficulty of operation is reduced, and cost reduction is facilitated.
It is understood that in other embodiments, the first plating layer 120 may be disposed on the inner surface 110b to further increase the surface flatness of the bezel 10. And after the first plating layer 120 is coated, the inner surface 110b is smoother, so that the cover glass 101 of the functional device 100 can be more smoothly mounted, and the mounting and dismounting between the bezel 10 and the cover glass 101 of the functional device 100 are facilitated.
Because the decoration circle base member is the plastic material, can adopt injection moulding, need not to adopt CNC processing, is applicable to mass production, helps saving the processing cost. And the outer surface is provided with a first plating layer, and the first plating layer is used for increasing the surface flatness of the decorative ring base body and is beneficial to enabling the decorative ring to present a highlight effect. And further, the mounting groove, the positioning hole and other structures of the decorative ring base body can be formed in one step in injection molding, so that the processing time is greatly saved, and the development period of the decorative ring is favorably shortened.
Referring to fig. 2, fig. 2 is a schematic structural diagram of an AA cross-sectional view of a decorative ring according to a second embodiment of the present application. The bezel 10 of the second embodiment has substantially the same structure as the bezel 10 of the first embodiment, except that in this embodiment, the bezel 10 further includes a second plating layer 130, the second plating layer 130 is disposed on the surface of the first plating layer 120 away from the bezel base 110, and the second plating layer 130 is used to increase the surface hardness of the bezel base 110.
Specifically, in this embodiment, a first plating layer 120 is first disposed on the outer surface 110a, the first plating layer 120 is used to increase the surface flatness of the decorative ring base 110, so that the outer surface 110a of the decorative ring base 110 is smoother, and the surface adhesion of the outer surface 110a is improved, and then a second plating layer 130 is disposed on the surface of the first plating layer 120 away from the decorative ring base 110, the second plating layer 130 can be better attached to the surface of the first plating layer 120, and the second plating layer 130 is used to increase the surface hardness of the decorative ring base 110, so that the decorative ring 10 can exhibit both a highlight effect and an improved surface hardness.
Optionally, the second plating layer 130 is formed by nano plating, and the second plating layer 130 is used for increasing the surface hardness of the bezel substrate 110. The 'nano electroplating' refers to a process of deactivating a nickel electroplating base solution or a chromium electroplating base solution by using a nano concentrated solution to make nickel ions or chromium ions contained in the base solution fine so as to enable the granularity of metal deposition crystal nuclei to be 18-25 nm. Wherein: the base liquid refers to a plating solution mixed with certain metal ions, and for example, in this embodiment, the base liquid of nickel refers to a plating solution mixed with nickel ions. The nano electroplating process is to adjust the ion distance in the decorative ring 10 from about 20-25nm to a distance smaller than 10nm, so as to enhance the surface hardness, strength and corrosion resistance of the decorative ring 10. The hardness can reach 8H, and the yield strength can reach 500-1000 Mpa; the first step of the basic processing flow is to provide a plastic matrix, the second step is to pre-treat the plastic matrix, the third step is to carry out chemical nickel process treatment on the plastic matrix, the fourth step is to carry out copper electroplating process treatment on the plastic matrix, the fifth step is to carry out nano nickel electroplating process treatment on the plastic matrix, and the sixth step is to carry out surface layer plating treatment on the plastic matrix.
Specifically, the respective steps described above will be described in detail as follows. The step of providing the plastic substrate refers to manufacturing a plastic blank of the decorative ring; the plastic base body is preprocessed, namely the plastic blank is made into a decorative ring base body, and the processing modes of grinding, polishing or linear cutting and the like can be adopted; the 'chemical nickel process treatment on the plastic matrix' means that the decorative ring matrix is placed in a mixed solution of nickel ions, and the mixed solution is used for carrying out surface cleaning treatment on the decorative ring matrix so as to improve the surface adsorption capacity of the decorative ring; the 'electroplating copper process treatment of the plastic matrix' means that the decorative ring matrix is immersed into electroplating liquid mixed with copper powder for electroplating so as to improve the metal mechanical property of the decorative ring, and the decorative ring electroplated with the copper powder is immersed into an acidic liquid medium so as to protect the decorative ring against oxidation; the 'nano nickel electroplating process treatment on the plastic matrix' means that the decorative ring matrix is immersed into electroplating solution mixed with nickel powder for electroplating, so that the decorative ring presents a bright effect; the plastic matrix is subjected to surface coating treatment, and the surface treatment is carried out on the plastic matrix after the procedures so as to obtain the decorative ring with good comprehensive performance.
Optionally, in an embodiment, the second plating layer 130 is disposed on a surface of the first plating layer 120 away from the bezel base 110, because the inner surface 110B encloses an accommodating space 110B, and the accommodating space 110B is used for accommodating the cover glass 101 of the functional device 100, there is no need to perform the second plating layer 130 treatment on the inner surface 110B without making an excessive requirement on the appearance of the inner surface 110B, and when performing the second plating layer 130 treatment on the surface of the first plating layer 120 away from the bezel base 110, a protective film needs to be attached to the inner surface 110B, and the protective film is used for protecting the inner surface 110B and preventing the inner surface 110B from being affected during the second plating layer 130 treatment. At this time, the coating area of the second plating layer 130 is saved, the difficulty of operation is reduced, and the cost is reduced.
It is understood that in other embodiments, the second plating layer 130 can be disposed on the inner surface 110b to further increase the surface hardness of the bezel 10. And after the second plating layer 130 is coated, the inner surface 110a is smoother, so that the cover glass 101 (see fig. 4) can be more smoothly mounted, and the mounting and dismounting between the bezel 10 and the cover glass 101 can be facilitated.
In this technical scheme, because the dress trim ring base member is the plastic material, can adopt injection moulding, need not to adopt CNC processing, is applicable to mass production, helps saving the processing cost. The outer surface is provided with a first plating layer, the first plating layer is used for increasing the surface flatness of the decorative ring base body, the first plating layer is far away from the surface of the decorative ring base body, and a second plating layer is arranged on the surface of the decorative ring base body and used for increasing the surface hardness of the decorative ring base body, so that the service life of the decorative ring is prolonged. And further, the mounting groove, the positioning hole and other structures of the decorative ring base body can be formed in one step in injection molding, so that the processing time is greatly saved, and the development period of the decorative ring is favorably shortened.
Referring to fig. 3, fig. 3 is a schematic structural diagram of an AA cross-sectional view of a decorative ring according to a third embodiment of the present application. The structure of the bezel 10 in the third embodiment is substantially the same as that of the bezel 10 in the second embodiment, except that in this embodiment, the bezel 10 further includes a third plating layer 140, the third plating layer 140 is disposed on the surface of the second plating layer 130 away from the first plating layer 120, and the third plating layer 140 is used for displaying a predetermined color.
Optionally, the third plating layer 140 is formed by vapor deposition, and the third plating layer 140 is used to present a preset color. Here, "vapor deposition" means that a functional or decorative metallic, non-metallic or compound coating is formed on the surface of the bezel substrate 110 by using a physical or chemical process occurring in a vapor phase. The vapor deposition techniques can be classified into chemical vapor deposition, physical vapor deposition, and plasma vapor deposition according to a film formation mechanism.
Optionally, the third plating layer 140 is used for displaying a preset color. Specifically, when the decoration ring 10 is required to be light yellow, the target is selected to be light yellow, and then the target is treated by vapor deposition, so that the decoration ring 10 with light yellow can be obtained.
Optionally, in an embodiment, the third plating layer 140 is only disposed on a surface of the second plating layer 130 away from the first plating layer 120, and since the inner surface 110B encloses a receiving space 110B, and the receiving space 110B is used for receiving the cover glass 101 (see fig. 4), the appearance of the inner surface 110B is not required to be excessively required, and the third plating layer 140 treatment need not be performed on the inner surface 110B, and when the third plating layer 140 treatment is performed on the surface of the second plating layer 130 away from the first plating layer 120, a protective film needs to be attached to the inner surface 110B, and the protective film is used for protecting the inner surface 110B and preventing the inner surface 110B from being affected during the third plating layer 140 treatment. At this time, the coating area of the third plating layer 140 is saved, the difficulty of the operation is reduced, and the cost is reduced.
It is understood that in other embodiments, the third plating layer 140 may also be disposed on the inner surface 110b to further increase the surface hardness of the bezel 10. And after the third plating layer 140 is coated, the inner surface 110a is smoother, so that the cover glass 101 (see fig. 4) can be more smoothly mounted, and the mounting and dismounting between the bezel 10 and the cover glass 101 can be facilitated.
Referring to fig. 1(b), fig. 2, fig. 3 and fig. 4, fig. 4 is a schematic structural diagram of a functional component according to a preferred embodiment of the present application. The functional assembly 1 comprises a functional device 100 and a decorative ring 10 as provided in any of the above embodiments.
Optionally, the functional device 100 includes at least one of a camera, a fingerprint identification chip, and a flash.
The functional assembly 1 of this technical scheme is including decorating circle 10 and functional device 100, decorate the circle and be used for decorating the cover glass 101 of functional device 100, decorate the circle and include: a decorative ring base body and a first plating layer; the decorative ring base body is made of plastic materials and comprises an outer surface and an inner surface which are oppositely arranged, the outer surface forms part of the appearance surface of the decorative ring base body, the inner surface is enclosed to form an accommodating space, and the accommodating space is used for accommodating the cover plate glass 101; the first plating layer is arranged on the outer surface and is used for increasing the surface flatness of the decorative ring base body. Because the decoration circle base member is the plastic material, can adopt injection moulding, need not to adopt CNC processing, is applicable to mass production, helps saving the processing cost. And set up first cladding material on the surface, first cladding material is used for increasing the surface smoothness of decorating the circle base member, helps prolonging the life of functional unit. And further, the mounting groove, the positioning hole and other structures of the decorative ring base body can be formed in one step in injection molding, so that the processing time is greatly saved, and the development period of the functional component is favorably shortened.
Referring to fig. 1(b), fig. 2, fig. 3, fig. 4 and fig. 5, fig. 5 is a schematic structural diagram of an electronic device according to a preferred embodiment of the present application. The electronic device 11 comprises the functional assembly 1 provided in any of the above embodiments.
Specifically, the electronic device 11 includes a housing 1101, a mounting hole 1101a is formed in the housing 1101, the functional assembly 1 is disposed opposite to the mounting hole 1101a, and at least a portion of the bezel 10 is exposed on a surface of the housing 1101. The electronic device 11 further comprises a circuit board 1102, and a controller 1102a is arranged on the circuit board 1102, and the controller 1102a is used for controlling the operation of the functional device 100 in the functional assembly 1. The housing 1101 is further provided with a positioning portion, which is used to form a fit with a mounting groove, a positioning hole, and the like in the bezel 10, so as to fix the bezel 10.
Alternatively, the electronic device 11 may be any device having communication and storage functions. For example: the system comprises intelligent devices with network functions, such as a tablet Computer, a mobile phone, an electronic reader, a remote controller, a Personal Computer (PC), a notebook Computer, an on-vehicle device, a network television, a wearable device and the like.
This technical scheme's electron device includes functional unit, functional unit includes decorates circle and functional device 100, decorate the circle and be used for decorating the cover plate glass 101 of functional device 100, decorate the circle and include: a decorative ring base body and a first plating layer; the decorative ring base body is made of plastic materials and comprises an outer surface and an inner surface which are oppositely arranged, the outer surface forms part of the appearance surface of the decorative ring base body, the inner surface is enclosed to form an accommodating space, and the accommodating space is used for accommodating the cover glass 101 of the functional device 100; the first plating layer is arranged on the outer surface and is used for increasing the surface flatness of the decorative ring base body. Because the decoration circle base member is the plastic material, can adopt injection moulding, need not to adopt CNC processing, is applicable to mass production, helps saving the processing cost. And set up first cladding material on the surface, first cladding material is used for increasing the surface smoothness of decorating the circle base member, helps improving electron device's brightness. And further, the mounting groove, the positioning hole and other structures of the decorative ring base body can be formed in one step in injection molding, so that the processing time is greatly saved, and the development period of the electronic device is favorably shortened.
Referring to fig. 6, fig. 6 is a flowchart of a method for processing a decorative ring according to an embodiment of the present application. The bezel 10 is used to decorate the cover glass 101 of the functional device 100, and the processing method of the bezel 10 includes, but is not limited to, steps S100 and S200, and the following is detailed with respect to steps S100 and S200.
S100: providing a decorative ring base body 110, wherein the decorative ring base body 110 is made of plastic materials, the decorative ring base body 110 comprises an outer surface 110a and an inner surface 110B which are oppositely arranged, the outer surface 110a forms part of the appearance surface of the decorative ring base body 110, and the inner surface 110B encloses an accommodating space 110B.
Optionally, the functional device 100 includes at least one of a camera, a fingerprint identification chip, and a flash.
Optionally, in an embodiment, a plastic blank is provided first, then injection molding is performed on the plastic blank to form the decorative ring base 110, and the mounting groove and the chamfer and other structures of the decorative ring base 110 can be formed in one step in the injection molding, so that machining by a Computer Numerical Control (CNC) machine is omitted, which is beneficial to reducing machining cost, greatly shortening machining period, and improving development efficiency of the decorative ring base 110. Among them, "injection molding" is also called injection molding, which is a molding method of injection and molding. The injection molding method has the advantages of high production speed, high efficiency, automation of operation, various colors, various shapes from simple to complex, small sizes, accurate product size, easy replacement of products, capability of forming products with complex shapes, and suitability for the molding processing fields of mass production, products with complex shapes and the like.
It is understood that in other embodiments, the decorative ring base 110 can be made by providing a plastic blank and then grinding, polishing, or wire cutting the plastic blank, and the application is not limited to the manner of forming the decorative ring base 110.
S200: forming a first plating layer 120 covering the outer surface 110a to obtain a first substrate 111, the first plating layer 120 for increasing the surface flatness of the bezel substrate 110.
Optionally, the first plating layer 120 is formed by water plating surface treatment, and the first plating layer 120 presents a metallic luster, so that the bezel 10 presents a metallic texture, and the bezel 10 presents a highlight effect, which is more cool. The 'water plating surface treatment' is that different special 'water plating' liquids are prepared according to the requirements of various decorative ring matrixes and plating layers, the decorative ring matrixes are placed in the water plating liquid at room temperature (15-40 ℃) and slightly shaken, and the treatment can be finished in a short time (for example, silver plating, usually 30 seconds).
Referring to fig. 7, in a preferred embodiment, in the step "S200: before forming the first plating layer 120 covering the outer surface 110a to obtain the first substrate 111, and the first plating layer 120 is used to increase the surface flatness of the bezel substrate 110 ", the method for processing the bezel further includes S190, which is described below with respect to S190.
S190: the outer surface 110a is subjected to a roughening treatment.
Specifically, the roughening process may be performed on the outer surface 110a by a grinding or polishing process, and the roughening process may increase the surface roughness of the outer surface 110a, so that the outer surface 110a has greater adhesion force, which is helpful for adhering the first plating layer 120 to the outer surface 110 a.
Referring to fig. 8, in a preferred embodiment, the step of forming the first plating layer 120 covering the outer surface 110a to obtain the first substrate 111 includes, but is not limited to, steps S210, S220, and S230, which are described in detail below with respect to steps S210, S220, and S230.
S210: providing clear water, and mixing metal powder into the clear water to obtain a mixed solution.
S220: and performing electrolytic treatment on the mixed solution to obtain an aqueous plating solution containing metal ions.
S230: the bezel substrate 110 is immersed in the water plating solution, and the metal ions are deposited to the outer surface 110a of the bezel substrate 110 to obtain a first substrate 111.
Referring to fig. 9, in a preferred embodiment, in the step "S200: after forming the first plating layer 120 covering the outer surface 110a to obtain the first substrate 111, and the first plating layer 120 is used to increase the surface flatness of the bezel substrate 110 ", the processing method of the bezel 10 further includes S300, which is described below with respect to S300.
S300: forming a second plating layer 130 covering the first substrate 111 to obtain a second substrate 112, the second plating layer 130 for increasing the surface hardness of the first substrate 111.
Optionally, the second plating layer 130 is formed by nano plating, and the second plating layer 130 is used for increasing the surface hardness of the bezel substrate 110. The 'nano electroplating' refers to a process of deactivating the nickel electroplating base solution and the chromium base solution by using a nano concentrated solution to make metal ions contained in the base solution fine so as to enable the granularity of metal deposition crystal nuclei to be 18-25 nm. The nano electroplating process is to adjust the ion distance in the decorative ring 10 from about 20-25nm to a distance smaller than 10nm, so as to enhance the surface hardness, strength and corrosion resistance of the decorative ring 10. The hardness can reach 8H, and the yield strength can reach 500-1000 Mpa; the first step of the basic processing flow is to provide a plastic matrix, the second step is to pre-treat the plastic matrix, the third step is to carry out chemical nickel process treatment on the plastic matrix, the fourth step is to carry out copper electroplating process treatment on the plastic matrix, the fifth step is to carry out nano nickel electroplating process treatment on the plastic matrix, and the sixth step is to carry out surface layer plating treatment on the plastic matrix.
Specifically, the respective steps described above will be described in detail as follows. The step of providing the plastic substrate refers to manufacturing a plastic blank of the decorative ring; the plastic base body is preprocessed, namely the plastic blank is made into a decorative ring base body, and the processing modes of grinding, polishing or linear cutting and the like can be adopted; the 'chemical nickel process treatment on the plastic matrix' means that the decorative ring matrix is placed in a mixed solution of nickel ions, and the mixed solution is used for carrying out surface cleaning treatment on the decorative ring matrix so as to improve the surface adsorption capacity of the decorative ring; the 'electroplating copper process treatment of the plastic matrix' means that the decorative ring matrix is immersed into electroplating liquid mixed with copper powder for electroplating so as to improve the metal mechanical property of the decorative ring, and the decorative ring electroplated with the copper powder is immersed into an acidic liquid medium so as to protect the decorative ring against oxidation; the 'nano nickel electroplating process treatment on the plastic matrix' means that the decorative ring matrix is immersed into electroplating solution mixed with nickel powder for electroplating, so that the decorative ring presents a bright effect; the plastic matrix is subjected to surface coating treatment, and the surface treatment is carried out on the plastic matrix after the procedures so as to obtain the decorative ring with good comprehensive performance.
Optionally, in an embodiment, the second plating layer 130 is disposed on a surface of the first plating layer 120 away from the bezel substrate 110, since the inner surface 110B encloses a receiving space 110B, and the receiving space 110B is used for receiving the cover glass 101 of the functional device 100 (see fig. 4), there is no need to perform the second plating layer 130 treatment on the inner surface 110B without excessively demanding the appearance of the inner surface 110B, and when performing the second plating layer 130 treatment on the surface of the first plating layer 120 away from the bezel substrate 110, a protective film needs to be attached to the inner surface 110B, and the protective film is used to protect the inner surface 110B and prevent the inner surface 110B from being affected during the second plating layer 130 treatment. At this time, the coating area of the second plating layer 130 is saved, the difficulty of operation is reduced, and the process and cost can be reduced.
Referring to fig. 10, in a preferred embodiment, the step of "forming the second plating layer 130 covering the first substrate 111 to obtain the second substrate 112" includes, but is not limited to, steps S310, S320, S330, S340 and S350, and the steps S310, S320, S330, S340 and S350 are described in detail below.
S310: the first base 111 is immersed in a plating solution mixed with copper powder to perform plating to improve the surface adsorption capacity of the first plating layer 120.
S320: the first substrate 111 is immersed in an acidic liquid medium to protect the first substrate 111 against oxidation.
S330: the first substrate 111 is subjected to a surface cleaning treatment.
S340: the first substrate 111 is immersed in a plating solution mixed with nickel powder to perform plating to enhance the metallic luster of the first substrate 111.
S350: the first substrate 111 is subjected to surface cleaning treatment and dried to obtain a second substrate 112.
Referring to fig. 11, in a preferred embodiment, in the step "S310: before the first substrate 111 is immersed in a plating solution mixed with copper powder to perform electroplating to improve the surface adsorption capacity of the first plating layer 120, the method for processing the bezel 10 further includes, but is not limited to, steps S302 and S304, and the details of steps S302 and S304 are described below.
S302: the first substrate 111 is subjected to a quality inspection.
While providing the first base body 111, the quality of the first base body 111 needs to be checked to ensure that the first base body 111 meets the quality requirement, and if the first base body 111 does not meet the quality standard, the first base body 111 needs to be replaced to ensure that the prepared decorative ring 10 meets the normal standard.
Specifically, the method for detecting whether the first substrate 111 meets the quality standard may be infrared detection, an infrared detector is used to detect the first substrate 111, and the detected data is received, and if the data of a local position in the detected data is significantly smaller, it may be considered that a crack or a cavity exists in the area, and the first substrate 111 is considered to be not in compliance with the quality standard, so that the first substrate 111 needs to be replaced, thereby ensuring the quality of the manufactured decorative ring 10.
In a preferred embodiment, it is also necessary to sample the first substrate 111 provided.
In the present embodiment, after a plurality of first substrates 111 are provided, the first substrates 111 are sampled. The sampling method of the first substrate 111 may be to extract a preset number of the first substrates 111 in a preset period, measure the size of the preset number of the first substrates 111, and determine whether the size of the preset number of the first substrates 111 is within an allowable value range. If the size of the first substrate 111 is within the allowable value range, the next step is performed. If the size of the first substrate 111 exceeds the allowable value range, the preparation parameters of the first substrate 111 by the preparation tool and the like are adjusted so as to obtain the qualified first substrate 111.
S304: and performing surface cleaning treatment on the first substrate 111 with the quality meeting the requirement.
Referring to fig. 12, in a preferred embodiment, in the step "S300: after forming the second plating layer 130 covering the first substrate 111 to obtain the second substrate 112, and the second plating layer 130 is used to increase the surface hardness of the first substrate 111 ", the method for processing the bezel 10 further includes, but is not limited to, steps S400, S410, and S420, and the details about steps S400, S410, and S420 are described below.
S400: a vacuum sputtering chamber J is provided.
S410: the second substrate 112 is placed in the vacuum sputtering chamber J.
S420: providing a target 1000, applying a voltage to the target 1000 to form sputtered particles 1000a, wherein the sputtered particles 1000a cover the surface of the second substrate 112 to form the third plating layer 140.
Specifically, the "sputtering" process is a process in which particles (ions or neutral atoms, molecules) with certain energy bombard the surface of a solid, so that atoms or molecules near the surface of the solid obtain enough energy to finally escape from the surface of the solid, and sputtering can only be performed in a certain vacuum state. The bombarding particles for sputtering are typically positively charged inert gas ions, most commonly argon ions. After argon ionization, the argon ions gain kinetic energy to bombard the target 1000 under the acceleration of the electric field. When the energy of the argon ions is lower than 5 ev, only the outermost surface layer of the target 1000 is acted, and the original adsorbed impurities on the surface of the target 1000 are mainly desorbed. When the argon ion energy reaches the binding energy of the target 1000 atoms (about the sublimation heat of the target 1000 material), the atoms on the surface of the target 1000 migrate, causing surface damage. When the energy of the bombarding particles exceeds 4 times of the sublimation heat of the target 1000 material, atoms are pushed out of the lattice position to escape as vapor phase, and sputtering occurs. For most metals, the sputtering threshold energy is about 10-25 electron volts.
The target 1000 is a sputtering source for forming various functional films on a substrate by sputtering through magnetron sputtering, multi-arc ion plating or other types of coating systems under appropriate process conditions. In brief, the target material 1000 is a target material bombarded by high-speed charged particles, and when used in a high-energy laser weapon, lasers with different power densities, different output waveforms and different wavelengths interact with different target materials, different killing and destruction effects are generated. For example: the evaporation magnetron sputtering coating is heating evaporation coating, aluminum film and the like. Different target materials 1000 (such as aluminum, copper, stainless steel, titanium, nickel targets and the like) are replaced, and different film systems (such as superhard, wear-resistant and corrosion-resistant alloy films and the like) can be obtained.
Optionally, the third plating layer 140 is used for displaying a preset color. Specifically, when the decoration ring 10 is required to be light yellow, the color of the target 1000 is selected to be light yellow, and then the target 1000 is processed through vapor deposition, so that the decoration ring 10 with light yellow can be obtained.
Referring to fig. 13, in a preferred embodiment, in the step "S300: after forming the second plating layer 130 covering the first substrate 111 to obtain the second substrate 112, and the second plating layer 130 is used to increase the surface hardness of the first substrate 111 ", the method for processing the bezel 10 further includes, but is not limited to, steps S500, S510, and S520, and the details about steps S500, S510, and S520 are described below.
S500: a vacuum sputtering chamber J is provided.
S510: the second substrate 112 is placed in the vacuum sputtering chamber J.
S520: providing a first target 1100 and a second target 1200, wherein the first target 1100 and the second target 1200 are made of different materials, the first target 1100 and the second target 1200 are arranged at intervals, a first voltage is applied to the first target 1100 to enable the first target 1100 to generate first sputtering particles 1100a, a second voltage is applied to the second target 1200 to enable the second target 1200 to generate second sputtering particles 1200a, and the first sputtering particles 1100a and the second sputtering particles 1200a cover the surface of the second substrate 112 to form the third plating layer 140.
Optionally, the third plating layer 140 is formed by vapor deposition, and the third plating layer 140 is used to present a preset color. The term "vapor deposition" refers to the formation of functional or decorative metallic, non-metallic or compound coatings on the surface of the decorative ring substrate by physical or chemical processes occurring in the vapor phase. The vapor deposition techniques can be classified into chemical vapor deposition, physical vapor deposition, and plasma vapor deposition according to a film formation mechanism.
Optionally, the third plating layer 140 is used for displaying a preset color. Specifically, when the decoration ring 10 is required to be light yellow, the target is selected to be light yellow, and then the target is treated by vapor deposition, so that the decoration ring 10 with light yellow can be obtained.
Specifically, in a preferred embodiment, an inert gas is applied between the first target 1100 and the second target 1200, and the inert gas is used to isolate the first sputtered particles 1100a generated by the first target 1100 from the second sputtered particles 1200a generated by the second target 1200, so as to prevent the first sputtered particles 1100a from reacting with the second sputtered particles 1200a before reaching the surface of the second substrate 112. When the first target 1100 is subjected to a first voltage to form the first sputtering particles 1100a, the second target 1200 is subjected to a second voltage to form the second sputtering particles 1200a, and the first sputtering particles 1100a and the second sputtering particles 1200a are deposited on the surface of the second substrate 112, the first sputtering particles 1100a and the second sputtering particles 1200a react to deposit the third plating layer 140 on the surface of the second substrate 112.
Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.
Claims (9)
1. The processing method of the decorative ring is characterized by comprising the following steps:
providing a decorative ring base body, wherein the decorative ring base body is made of plastic materials and comprises an outer surface and an inner surface which are oppositely arranged, the outer surface forms part of the appearance surface of the decorative ring base body, and the inner surface encloses an accommodating space;
forming a first plating layer covering the outer surface to obtain a first substrate, wherein the first plating layer is used for increasing the surface flatness of the decorative ring substrate;
forming a second plating layer covering the first substrate to obtain a second substrate, wherein the second plating layer is used for increasing the surface hardness of the decorative ring substrate;
wherein the content of the first and second substances,
the "forming a second plating layer covering the first base to obtain a second base" includes: immersing the first substrate into an electroplating solution mixed with copper powder for electroplating so as to improve the surface adsorption capacity of the first plating layer; immersing a first matrix into an acidic liquid medium to perform anti-oxidation protection on the first matrix; carrying out surface cleaning treatment on the first substrate; immersing the first matrix into an electroplating solution mixed with nickel powder for electroplating so as to improve the metallic luster of the first matrix; cleaning the surface of the first substrate, and drying to obtain a second substrate;
wherein the grain size of the metal deposition crystal nucleus of the second plating layer is 18-25 nm,
wherein, the yield strength of the decorative ring reaches 500-1000Mpa, and the hardness reaches 8H;
wherein, after the "forming a second plating layer covering the first substrate to obtain a second substrate, the second plating layer being used to increase the surface hardness of the decorative ring substrate", the processing method of the decorative ring further includes: providing a vacuum sputtering chamber; placing the second substrate within the vacuum sputtering chamber; providing a first target and a second target, wherein the first target and the second target are made of different materials and are arranged at intervals, applying a first voltage to the first target to enable the first target to generate first sputtering particles, applying a second voltage to the second target to enable the second target to generate second sputtering particles, and covering the surfaces of the second substrates with the first sputtering particles and the second sputtering particles to form a third coating;
the sputtering process is a process of bombarding the surface of a solid by particles with certain energy to enable atoms or molecules near the surface of the solid to obtain enough energy and finally escape from the surface of the solid, the sputtering can only be carried out in a certain vacuum state, bombarding particles for sputtering are argon ions, the argon ions obtain kinetic energy to bombard a target under the acceleration of an electric field after the ionization of the argon, wherein when the energy of the argon ions is lower than 5 electron volts, only the outermost surface layer of the target is acted, impurities originally adsorbed on the surface of the target are desorbed, when the energy of the argon ions reaches the binding energy of target atoms, the atoms on the surface of the target are caused to migrate and generate surface damage, when the energy of the bombarding particles exceeds 4 times of sublimation heat of the target material, the atoms are pushed out of a lattice position to form vapor phase escape to generate sputtering, the sputtering threshold energy of the sputtering is 10-25 electron volts, and the target is a sputtering source and multi-arc ion plating to sputter on a substrate under the process condition.
2. The method of manufacturing a bezel as claimed in claim 1, wherein before said "forming a first plating layer covering said outer surface to obtain a first base, said first plating layer for increasing the surface flatness of said bezel base", said method of manufacturing a bezel further comprises:
and carrying out roughening treatment on the outer surface.
3. The method of claim 1, wherein said providing a decorative ring substrate comprises:
and processing the decorative ring base body by injection molding.
4. A decorative ring, characterized in that the decorative ring is processed by the processing method of the decorative ring according to any one of claims 1 to 3.
5. A decorative ring, characterized in that said decorative ring comprises: the decorative ring comprises a decorative ring base body, a first plating layer and a second plating layer; the decorative ring base body is made of plastic materials and comprises an outer surface and an inner surface which are oppositely arranged, the outer surface forms part of the appearance surface of the decorative ring base body, and the inner surface forms an accommodating space in a surrounding mode; the first plating layer is arranged on the outer surface and used for increasing the surface flatness of the decorative ring base body, and the first plating layer presents metallic luster; the second plating layer is arranged on the surface, far away from the decorative ring base body, of the first plating layer, and the second plating layer is used for increasing the surface hardness of the decorative ring base body;
the decorative ring is processed by the method of any one of claims 1 to 3.
6. The decorative ring of claim 5, further comprising:
and the third plating layer is arranged on the surface of the second plating layer far away from the first plating layer, and is used for presenting a preset color.
7. A functional assembly, characterized in that the functional assembly comprises a functional device and a decorative ring according to any one of claims 5 to 6.
8. The functional assembly of claim 7, wherein the functional device comprises at least one of a camera, a fingerprint recognition chip, and a flash.
9. An electronic device, characterized in that the electronic device comprises a functional assembly according to any one of claims 7 to 8.
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| CN113106517A (en) * | 2021-04-09 | 2021-07-13 | 维沃移动通信(重庆)有限公司 | Preparation method of decorative ring, decorative ring and electronic equipment |
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