CN104451789A - Plating solution for electroplating nickel on aluminum-based carbon nanotube - Google Patents
Plating solution for electroplating nickel on aluminum-based carbon nanotube Download PDFInfo
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- CN104451789A CN104451789A CN201410840022.9A CN201410840022A CN104451789A CN 104451789 A CN104451789 A CN 104451789A CN 201410840022 A CN201410840022 A CN 201410840022A CN 104451789 A CN104451789 A CN 104451789A
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- plating solution
- carbon nanotube
- aluminium base
- electronickelling
- base carbon
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
- C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
- C25D3/16—Acetylenic compounds
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
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- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses plating solution for electroplating nickel on an aluminum-based carbon nanotube. Each liter of plating solution comprises 100-390g of nickel salt, 30-40g of boric acid, 0.1-0.3g of surface-active agents, 0.1-0.4g of grain refiners and 0-50g of complexing agents. The wetting property between the surface of the aluminum-based carbon nanotube and the plating solution is effectively improved by adding the surface-active agents in the plating solution, nano-nickel particles more uniformly wrap the surface of the aluminum-based carbon nanotube by the added grain refiners and are smaller, the particle size of the nano-nickel particles is 10-16nm, obtained materials can serve as an enhancement phase for composite materials such as an aluminum base, a magnesium base, a copper base, a titanium base, an alloy base and an intermetallic compound base, and the mechanical property and the corrosion resistance of the composite materials are finally improved.
Description
Technical field
The present invention relates to a kind of electronickelling liquid, be specifically related to a kind of plating solution for electronickelling on aluminium base carbon nanotube.
Background technology
Metallic aluminium is most widely used non-ferrous metal.Metallic aluminium has unique character, (is only 2.70g/cm as density metal is little
31/3 of copper or iron), quality is light, and there is good ductility, stable chemical performance, plasticity-by force, nontoxic pollution-free and the series of advantages such as good heat conductivility and conductivity, therefore occupy very important status in the national economic development.But aluminum also comes with some shortcomings, as poor in metal fatigue, Young's modulus is low and fusing point that is aluminium is lower.Be typically employed in prior art in aluminium liquid and add wild phase and can improve above-mentioned deficiency.In numerous doping mutually, carbon nanotube, owing to having the performances such as excellent electricity, mechanics, calorifics and optics, is desirable wild phase, and the aluminum matrix composite strengthened through carbon nanotube has the excellent properties such as specific tenacity, specific modulus are high, good stability of the dimension.But the wettability of carbon nanotube and aluminium liquid is poor, existing research shows, effectively can improve the wettability between them by nickel plating on the carbon nanotubes.At present, nickel plating mainly contains electroless plating method and electrochemical plating on the carbon nanotubes, and these methods have difference in preparation technology, respectively have relative merits.The people such as Susumu Arai carry out nickel plating by electric plating method in carbon nano tube surface, do negative electrode with copper coin, and nickel plate does anode and makes electrolyzer; Electrolytic solution consists of the H3BO3 of NiCl26H2O, 0.5mol/L of NiSO46H2O, 0.2mol/L of 1mol/L, the PA5000 of 2 × 10-5mol/L, plating under the current density of 5A/dm2.After having electroplated, acetone soln sonic oscillation is used to be separated by the settling of cathode surface.SEM result shows, the settling of cathode surface obviously increases along with the increase of coulomb amount, and along with the increase of coulomb amount, deposition nickel fractions changes, therefore can by the form regulating coulomb amount to control coating.In addition, also find that nickel deposition on the carbon nanotubes has selectivity, therefore have studied the mechanism of electronickelling.Because carbon nanotube axial conductivity is stronger, so cap end place specific surface more easily makes Ni
2+reduction obtains nickel; Defective place on the surface, specific surface elsewhere more easily reduces Ni
2+so just there is selectivity deposition (the Tatiana Brzozowska of nickel ion, Janusz Zielinski, JacekMachnikowski.Effect of polymeric additives to coal tar pitch oncarbonizationbehaviour and optical texture of resultant cokes [J] .Journal of Analytical and Applied Pyrolysis, 1998,48:45-58).Publication number is that the patent of invention of CNIO1255591 discloses one electrodip process at carbon nano-tube film substrates metallic nickel nano granule, has the method for carbon nano-tube/nano-nickel composite film of good catalysis, corrosion resisting property in metal foil surface preparation.The electrodeposit liquid adopted in the method is NiSO
4.6H
2o250 ~ 300g/L, NiC1
2.H
2o 35 ~ 40g/L and H
3bO
340 ~ 45g/L.In the matrix material that this invention is obtained, on the carbon nanotubes, the particle diameter of nano metal nickel particle is 10 ~ 30nm to the distribution of nano metal nickel uniform particles, and grain graininess span is larger; The electroplate liquid that the program configures in addition is only applicable to adopt potentiostat to electroplate, and needs with the metal of platinum costliness to be to electrode, and needs to control the distance between two-plate.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of plating solution for electronickelling on aluminium base carbon nanotube.Adopt electroplate liquid of the present invention to carry out electronickelling to aluminium base carbon nanotube, the matrix material being uniformly coated with more tiny nano nickle granules on the carbon nanotubes can be obtained.
Plating solution for electronickelling on aluminium base carbon nanotube of the present invention, the component containing following consumption in often liter of plating solution:
Nickel salt 100 ~ 390g, boric acid 30 ~ 40g, tensio-active agent 0.1 ~ 0.3g, grain-refining agent 0.1 ~ 0.4g, complexing agent 0 ~ 50g.
Preferentially, in often liter of plating solution, the content of each component is:
Nickel salt 130 ~ 310g, boric acid 35 ~ 40g, tensio-active agent 0.1 ~ 0.2g, grain-refining agent 0.2 ~ 0.3g, complexing agent 10 ~ 50g.
In technique scheme, described nickel salt can be a kind of or two or more arbitrarily combination be selected from six hydration nickel sulfate, Nickel dichloride hexahydrate and nickel sulfamic acid; When nickel salt be chosen as wherein two or more arbitrarily combinations time, the proportioning between them can be any proportioning.
In technique scheme, the interpolation of tensio-active agent effectively improves the wettability between base material and plating solution.Described tensio-active agent can be selected from the one in anion surfactant, cats product, zwitterionics and nonionogenic tenside; Or be selected from combinations two or more arbitrarily in anion surfactant, zwitterionics and nonionogenic tenside; Or cats product and one or both the combination that is selected from zwitterionics and nonionogenic tenside.Wherein: described anion surfactant can be that existing routine is selected, and can be specifically one or more the combination be selected from Sodium dodecylbenzene sulfonate, sodium lauryl sulphate, sodium laurylsulfonate, 1-isobutyl-3,5-dimethylhexylphosphoric acid and polyacrylic acid; When anion surfactant be chosen as wherein two or more arbitrarily combinations time, the proportioning between them can be any proportioning.The selection of described cats product is same as the prior art, can be specifically cetyl trimethylammonium bromide and/or perfiuoroalkyl ammonium salts; When cats product be chosen as wherein two or more arbitrarily combinations time, the proportioning between them can be any proportioning.The selection of described zwitterionics is same as the prior art, can be specifically trimethyl-glycine and/or dodecyl amino propionic acid.The selection of described nonionogenic tenside is same as the prior art, can be specifically to be selected from a kind of or two or more arbitrarily combination in polysorbas20, polysorbate40, polysorbate60, tween 80, OP-10, triton x-100, class of department 20, class 40 of department, class 60 of department, class 80 of department; When nonionogenic tenside be chosen as wherein two or more arbitrarily combinations time, the proportioning between them can be any proportioning.
In technique scheme, described grain-refining agent is a kind of or two or more arbitrarily combination be selected from thiocarbamide, thiourea derivative, asccharin, tonka bean camphor, coumarin derivatives and Isosorbide-5-Nitrae-butynediol.Wherein, described thiourea derivative can be specifically Allyl thiourea or phenylthiourea; Described coumarin derivatives can be specifically 4 hydroxy coumarin.
In technique scheme, described complexing agent is a kind of or two or more arbitrarily combination be selected from Citrate trianion, tartrate and edta salt.Described Citrate trianion can be specifically two citric acid monohydrate trisodium or Triammonium citrates; Described tartrate can be specifically two hydration sodium tartrate or Rochelle salts; Described edta salt can be specifically EDETATE SODIUM or EDTA dipotassium.
The compound method of plating solution of the present invention is same as the prior art, particularly, takes each component of respective amount, add a small amount of water dissolution, then be settled to 1L with water by proportioning.The pH value of the plating solution obtained by formula of the present invention is between 3 ~ 5.
When adopting plating solution of the present invention to carry out electronickelling to aluminium base carbon nanotube, electroplating technology is identical with existing common process, particularly, before nickel plating, first carries out conventional pre-treatment to aluminium base carbon nanotube, comprises and remove photoresist and/or plate front oxide treatment etc.During plating, with nickel plate for anode material, current density is 0.1 ~ 3A/dm
2, the temperature of plating is generally 5 ~ 40 DEG C, and electroplating time is 0.5 ~ 5min.
Adopting plating solution of the present invention to electroplate the material of rear gained to aluminium base carbon nanotube can as comprising wild phase that is aluminium base, the matrix material such as magnesium base, copper base, titanium base, alloy-based, intermetallic compound base.
Compared with prior art, the invention provides a kind of plating solution for electronickelling on aluminium base carbon nanotube, the wettability between aluminium base carbon nano tube surface and plating solution is effectively improved by interpolation tensio-active agent in this plating solution, the grain-refining agent added makes nano nickle granules be coated on aluminium base carbon nano tube surface more equably, and making the nano nickle granules being coated on aluminium base carbon nano tube surface more tiny, granularity is at 10 ~ 16nm; Resulting materials can as the wild phase comprising the matrix materials such as aluminium base, magnesium base, copper base, titanium base, alloy-based, intermetallic compound base, final mechanical property and the corrosion resistance improving matrix material.In addition, plating solution of the present invention not only can adopt potentiostat to electroplate, and using the nickel plate of cheapness as to electrode, the distance of two-plate does not only contact, but also the CV method on CHI690 electrochemical workstation can be used to electroplate.
Accompanying drawing explanation
Fig. 1 is the structural representation of the aluminium base carbon nanotube (namely as the aluminium base carbon nanotube of electroplating parts) before electroplating in the present invention;
Fig. 2 is the structural representation by the aluminium base carbon nano tube compound material of gained after technique plating described in the embodiment of the present invention 1;
Fig. 3 is the SEM figure by the carbon nanotube on the aluminium base carbon nanotube (namely as the aluminium base carbon nanotube of electroplating parts) before electroplating in the present invention;
Fig. 4 for by described in the embodiment of the present invention 1 technique plating after gained matrix material in Surface coating have the SEM of the carbon nanotube of nickel particle to scheme.
Number in the figure is:
1 aluminium foil; 2 carbon nanotubes; 3 nickel particles.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in further detail, and to understand content of the present invention better, but the present invention is not limited to following examples.
Embodiment 1
1) by aluminium base carbon nanotube, (as shown in Figure 1, wherein 1 is aluminium foil to its structure, and 2 is carbon nanotube; Electron-microscope scanning figure such as Fig. 3 of described carbon nanotube 2 shows) be soaked in 30min in acetone and remove photoresist, the more aluminium base carbon nanotube after removing photoresist at room temperature is washed;
2) the aluminium base carbon nanotube after process is carried out electronickelling, composition and the electroplating technology of plating solution are as follows:
After plating, the Surface coating of gained has the aluminium base carbon nano tube compound material of nano nickle granules 3 as shown in Figure 2, and wherein 1 is aluminium foil, and 3 is nickel particle; Electron-microscope scanning figure such as Fig. 4 that in resulting materials, surface includes the carbon nanotube of nano nickle granules 3 shows, as seen from Figure 4 evenly coated one deck nano nickle granules 3 on carbon nanotube, and nano nickle granules 3 is little, and grain-size is approximately 10 ~ 16nm.
Embodiment 2
1) aluminium base carbon nanotube is soaked in 30min in acetone to remove photoresist, the more aluminium base carbon nanotube after removing photoresist at room temperature is washed;
2) the aluminium base carbon nanotube after process is carried out electronickelling, composition and the electroplating technology of plating solution are as follows:
Embodiment 3
1) aluminium base carbon nanotube is soaked in 30min in acetone to remove photoresist, the more aluminium base carbon nanotube after removing photoresist at room temperature is washed;
2) by the aluminium base carbon nanotube after washing in the salpeter solution nitric acid 200ml of 68% (in often liter of solution containing), 60 DEG C of oxidation 30min, then at SnCl
2(in often liter of solution, 30gSnCl is contained with the solution of HCl
2, 37% HCl 60ml) in sensitization 5s, finally at PdCl
2(in often liter of solution, 0.25g PdCl is contained with the solution of HCl
2, 37% HCl 10ml) in activation 5s;
3) the aluminium base carbon nanotube after process is carried out electronickelling, composition and the electroplating technology of plating solution are as follows:
Embodiment 4
1) aluminium base carbon nanotube is placed in baking oven 250 DEG C of thermal treatment 2h to remove photoresist, the more aluminium base carbon nanotube after removing photoresist at room temperature is washed;
2) the aluminium base carbon nanotube after process is carried out electronickelling, adopt three-electrode system, cyclic voltammetric (CV) potential region is-1.2V ~ 0V, scanning speed 20mV/s, cycle index 5 times; Composition and the electroplating technology of plating solution are as follows:
Claims (10)
1. for a plating solution for electronickelling on aluminium base carbon nanotube, it is characterized in that: the component containing following consumption in often liter of plating solution:
Nickel salt 100 ~ 390g, boric acid 30 ~ 40g, tensio-active agent 0.1 ~ 0.3g, grain-refining agent 0.1 ~ 0.4g, complexing agent 0 ~ 50g.
2. the plating solution for electronickelling on aluminium base carbon nanotube according to claim 1, is characterized in that: in often liter of plating solution, the content of each component is:
Nickel salt 130 ~ 310g, boric acid 35 ~ 40g, tensio-active agent 0.1 ~ 0.2g, grain-refining agent 0.2 ~ 0.3g, complexing agent 10 ~ 50g.
3. the plating solution for electronickelling on aluminium base carbon nanotube according to claim 1 and 2, is characterized in that: described nickel salt is a kind of or two or more arbitrarily combination be selected from six hydration nickel sulfate, Nickel dichloride hexahydrate and nickel sulfamic acid.
4. the plating solution for electronickelling on aluminium base carbon nanotube according to claim 1 and 2, is characterized in that: described tensio-active agent is be selected from the one in anion surfactant, cats product, zwitterionics and nonionogenic tenside; Or be selected from combinations two or more arbitrarily in anion surfactant, zwitterionics and nonionogenic tenside; Or cats product and one or both the combination that is selected from zwitterionics and nonionogenic tenside.
5. the plating solution for electronickelling on aluminium base carbon nanotube according to claim 4, is characterized in that: described anion surfactant is one or more the combination be selected from Sodium dodecylbenzene sulfonate, sodium lauryl sulphate, sodium laurylsulfonate and 1-isobutyl-3,5-dimethylhexylphosphoric acid.
6. the plating solution for electronickelling on aluminium base carbon nanotube according to claim 4, is characterized in that: described cats product is cetyl trimethylammonium bromide and/or perfiuoroalkyl ammonium salts.
7. the plating solution for electronickelling on aluminium base carbon nanotube according to claim 4, is characterized in that: described zwitterionics is trimethyl-glycine and/or dodecyl amino propionic acid.
8. the plating solution for electronickelling on aluminium base carbon nanotube according to claim 4, is characterized in that: described nonionogenic tenside is be selected from a kind of or two or more arbitrarily combination in polysorbas20, polysorbate40, polysorbate60, tween 80, OP-10, triton x-100, class of department 20, class 40 of department, class 60 of department, class 80 of department.
9. the plating solution for electronickelling on aluminium base carbon nanotube according to claim 1 and 2, it is characterized in that: described grain-refining agent is a kind of or two or more arbitrarily combination be selected from thiocarbamide, thiourea derivative, asccharin, tonka bean camphor, coumarin derivatives and Isosorbide-5-Nitrae-butynediol.
10. the plating solution for electronickelling on aluminium base carbon nanotube according to claim 1 and 2, is characterized in that: described complexing agent is a kind of or two or more arbitrarily combination be selected from Citrate trianion, tartrate and edta salt.
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105177656A (en) * | 2015-10-19 | 2015-12-23 | 姜少群 | Elemental nickel transition layer of electroplated chromium of crystallizer copper tube |
| CN105200462A (en) * | 2015-10-19 | 2015-12-30 | 姜少群 | Electroplating method for elemental nickel transition layer of mould copper tube |
| CN105239116A (en) * | 2015-10-28 | 2016-01-13 | 安徽恒源煤电股份有限公司 | Corrosion resistant composite electroplating liquid |
| CN105332011A (en) * | 2015-11-24 | 2016-02-17 | 广西师范大学 | Plating solution for plating cobalt on carbon nano tube |
| CN106119905A (en) * | 2016-08-15 | 2016-11-16 | 亚太水处理(天长)有限公司 | A kind of preparation method of the aerator bearing internal axle sleeve Composite Coatings masking liquid that floats |
| CN106521550A (en) * | 2016-12-09 | 2017-03-22 | 济南大学 | Method for preparing foamed nickel/ layer-by-layer self-assembled carbon nano tube / nickel composite material used for hydrogen production by electrolysis |
| CN109136986A (en) * | 2018-10-29 | 2019-01-04 | 河南工程学院 | A kind of preparation method of nano nickel/array carbon nano tube composite material |
| CN111020647A (en) * | 2019-12-20 | 2020-04-17 | 常州极太汽车配件有限公司 | Composition for surface treatment of aluminum flexible connection |
| CN111501071A (en) * | 2020-05-26 | 2020-08-07 | 珠海冠宇电池股份有限公司 | Nickel electrodeposition layer and workpiece comprising same |
| CN108683762B (en) * | 2018-05-22 | 2021-07-06 | Oppo广东移动通信有限公司 | Decorative ring, functional assembly, electronic device and processing method of decorative ring |
| CN114059125A (en) * | 2016-07-18 | 2022-02-18 | 巴斯夫欧洲公司 | Cobalt plating compositions comprising additives for void-free sub-micron structure filling |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101255591A (en) * | 2008-04-03 | 2008-09-03 | 厦门大学 | Method for preparing carbon nano-tube/nano-nickel composite film |
| CN102383115A (en) * | 2011-11-09 | 2012-03-21 | 南昌航空大学 | Method for preparing functionally gradient composite coating in osmosis plating |
-
2014
- 2014-12-30 CN CN201410840022.9A patent/CN104451789A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101255591A (en) * | 2008-04-03 | 2008-09-03 | 厦门大学 | Method for preparing carbon nano-tube/nano-nickel composite film |
| CN102383115A (en) * | 2011-11-09 | 2012-03-21 | 南昌航空大学 | Method for preparing functionally gradient composite coating in osmosis plating |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105177656B (en) * | 2015-10-19 | 2018-03-16 | 永春县达埔文雅家庭农场 | A kind of elemental nickel transition zone of crystallizer copper pipe electrodeposited chromium |
| CN105200462A (en) * | 2015-10-19 | 2015-12-30 | 姜少群 | Electroplating method for elemental nickel transition layer of mould copper tube |
| CN105177656A (en) * | 2015-10-19 | 2015-12-23 | 姜少群 | Elemental nickel transition layer of electroplated chromium of crystallizer copper tube |
| CN105239116A (en) * | 2015-10-28 | 2016-01-13 | 安徽恒源煤电股份有限公司 | Corrosion resistant composite electroplating liquid |
| CN105332011A (en) * | 2015-11-24 | 2016-02-17 | 广西师范大学 | Plating solution for plating cobalt on carbon nano tube |
| CN114059125A (en) * | 2016-07-18 | 2022-02-18 | 巴斯夫欧洲公司 | Cobalt plating compositions comprising additives for void-free sub-micron structure filling |
| CN106119905A (en) * | 2016-08-15 | 2016-11-16 | 亚太水处理(天长)有限公司 | A kind of preparation method of the aerator bearing internal axle sleeve Composite Coatings masking liquid that floats |
| CN106119905B (en) * | 2016-08-15 | 2018-03-16 | 亚太水处理(天长)有限公司 | A kind of preparation method for the aeration machine bearing internal axle sleeve Composite Coatings masking liquid that floats |
| CN106521550A (en) * | 2016-12-09 | 2017-03-22 | 济南大学 | Method for preparing foamed nickel/ layer-by-layer self-assembled carbon nano tube / nickel composite material used for hydrogen production by electrolysis |
| CN106521550B (en) * | 2016-12-09 | 2018-09-25 | 济南大学 | Nickel foam/LBL self-assembly carbon nanotube/nickel composite material preparation method for electrolytic hydrogen production |
| CN108683762B (en) * | 2018-05-22 | 2021-07-06 | Oppo广东移动通信有限公司 | Decorative ring, functional assembly, electronic device and processing method of decorative ring |
| CN109136986A (en) * | 2018-10-29 | 2019-01-04 | 河南工程学院 | A kind of preparation method of nano nickel/array carbon nano tube composite material |
| CN109136986B (en) * | 2018-10-29 | 2020-05-22 | 高彪峰 | Preparation method of nano nickel/array carbon nanotube composite material |
| CN111020647A (en) * | 2019-12-20 | 2020-04-17 | 常州极太汽车配件有限公司 | Composition for surface treatment of aluminum flexible connection |
| CN111501071A (en) * | 2020-05-26 | 2020-08-07 | 珠海冠宇电池股份有限公司 | Nickel electrodeposition layer and workpiece comprising same |
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