CN105200462A - Electroplating method for elemental nickel transition layer of mould copper tube - Google Patents
Electroplating method for elemental nickel transition layer of mould copper tube Download PDFInfo
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- CN105200462A CN105200462A CN201510675345.1A CN201510675345A CN105200462A CN 105200462 A CN105200462 A CN 105200462A CN 201510675345 A CN201510675345 A CN 201510675345A CN 105200462 A CN105200462 A CN 105200462A
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Abstract
The invention discloses an electroplating method for an elemental nickel transition layer of a mould copper tube. The plating solution of the elemental nickel transition layer comprises the following ingredients: 500 to 600 g/L of nickel aminosulfonate, 25 to 35 g/L of nickel sulfate, and 55 to 65 g/L of sodium dodecyl sulfate; the electroplating technology is 4 to 6 in pH, about 45 to 55 DEG C in temperature of the plating solution, 4.5 to 6.5 A/dm<2> in cathode-current density, and 10 to 20 min in immersion time; the thickness of the electroplated layer is 3 to 4 microns.
Description
Technical field
The present invention relates to electroplating technology field, particularly relate to a kind of elemental nickel transition layer electro-plating method of crystallizer copper pipe.
Background technology
Crystallizer is the important component part of smeltery's continuous caster, and crystallizer copper pipe is the vitals on crystallizer.Because high-temperature molten steel directly flows through crystallizer copper pipe, for making continuous casting work process stabilization, support equipment and operator safety again, just requires that crystallizer copper pipe has good high temperature resistant, wear-resistant and corrosion resistance nature.By producing the crystallizer copper pipe with hard chromium in the chromium plating of copper pipe inwall, because greatly improving the high temperature resistant, wear-resistant of crystallizer copper pipe and corrosion resistance nature, and production technique is simple, efficiency is high, cost is low, and obtains more general application.But inwall is coated with the crystallizer copper pipe of hard chrome, in continuous casting production process, easily there is coating come off, thus shorten the work-ing life of crystallizer copper pipe.Its reason is that between Copper substrate and hard chromium, Physical Properties Difference is comparatively large, particularly their thermal expansivity and difference in hardness comparatively large, be difficult to the temperature environment change adapting to continuous casting production process.
CN1804144A discloses a kind of brilliant device copper pipe of combination with transition chromium coating and hard chromium, it includes matrix copper pipe and is placed in the hard chromium of copper pipe internal surface, it is characterized in that being provided with transition chromium coating between copper pipe inwall and surperficial hard chromium, the thermal expansivity of this transition chromium coating is 1.68 × 10
-5/ DEG C to 0.84 × 10
-5/ DEG C between, hardness is between HV450 to HV950.Although the problem of plating exfoliation has been noted in this patent application, it also uses suitable settling mode, namely the method for chromium plating transition layer is adopted, but its transition layer is still chromium, it does not still fundamentally solve the spallation problems that the chromium materials variances different from copper two kinds causes, and therefore its result of use is not still very good.
CN1465753A also discloses a kind of electroplating method for internal surface of crystallizer, it adopts nickel cobalt (alloy) as transition layer, although also solve the problem of the difference in material properties of chromium and copper, but because it adopts alloy layer, solution composition is complicated, and electroplating technology requires high, and the alloying constituent of alloy layer not temperature, not easily accurate correspondence controls, and therefore also there is coating inconsistent, unstable defect.
The report adopting nickel and other metal component alloy as transition layer is also had in prior art, but similar with above-mentioned patent, and all need the alloy electroplating bath configuring complexity, electroplating technology control overflow is high, and coating is unstable, inconsistent.There is not yet in prior art and only adopt nickel as the report of transition layer.
Summary of the invention
The object of the invention is to the elemental nickel transition layer electro-plating method proposing a kind of crystallizer copper pipe.The method only arranges nickel elemental metals transition layer by making copper pipe to the improvement of solution composition and technique, and the bonding force that can realize coating and matrix is good, thus fundamentally solves the spallation problems that chromium and copper product difference causes.
For reaching this object, the present invention by the following technical solutions:
An elemental nickel transition layer electro-plating method for crystallizer copper pipe, the solution composition of described plating elemental nickel transition layer is: nickel sulfamic acid 500-600g/L, single nickel salt 25-35g/L, sodium lauryl sulphate 55-65g/L; Electroplating technology is: pH4-6, and bath temperature is about 45-55 DEG C, cathode current density 4.5-6.5A/dm
2, the immersion plating time is about 10-20min; Thickness of coating is about 3-4 μm.
Such scheme is the main points of present invention process method, and all the other, as polishing rust cleaning, cleaning etc. the same prior art of routine operation, do not repeat them here.
Because the present invention only adopts elemental nickel as transition layer, because elemental nickel does not form alloy with other element, the nickel after electroplating and copper pipe and follow-up coating is more easily made to form the metallurgical transition layer that alloy is combined respectively, namely there is copper nickel key coat between copper pipe and nickel, and there is the key coat of nickel and other mischmetal between nickel and other subsequent plating layer (as chromium), to outermost chromium, there is copper from the copper of innermost layer in fact, cupronickel, nickel, nickel and other mischmetal, subsequent plating layer five-layer structure, thus realize the perfect transition of thermal expansivity.
It is 3-4 μm that the present invention controls transition region thickness, transition effect will be caused not obvious lower than 3 microns, particularly can not realize forming perfect transition layer structure with copper and subsequent plating layer, and higher than 4 μm, one is cause efficiency low, cost is high, what is more important by due to transition layer blocked up and thermal expansivity can not be made to realize the continuous transition of copper to subsequent plating layer, be unfavorable for antistrip performance on the contrary.
Above-mentioned plating elemental nickel transition layer can as the transition layer of follow-up electrolytic coating, and follow-up electrolytic coating is as follow-up chromium, cobalt-base alloy, tungstenalloy etc.
Citing but the follow-up chromium coating of the one be not limited thereto can adopt following component and technique: the solution composition of chromium coating is: chromic anhydride 140-150g/l, sulfuric acid 1.0-1.2g/l, chromium sulphate 5-7g/l, formic acid 3-5g/l, sodium sulfate 6-8g/l; The technique of electrodeposited chromium layers is: pH3.5-4, is 35-45 DEG C in temperature, and current density is 44-48A/dm
2, electroplating time 30-40min.
The invention has the beneficial effects as follows:
1. and through reality use and compare, compared with the crystallizer copper pipe not adopting transition layer or adopt chromium transition layer or adopt the transition layer of nickelalloy to prepare, work-ing life can extend more than 50%.
2. nickel simple substance transition layer of the present invention, the creationary combination that have employed organic nickel salt nickel sulfamic acid and inorganic nickel single nickel salt, and determine the proportioning of the two, the ratio of organic nickel salt will be significantly higher than inorganic nickel, experiment shows, nickel sulfamic acid is higher than 600g/L, or single nickel salt is higher than 35g/L, to the bonding force of transition layer and subsequent plating layer be caused not good, and nickel sulfamic acid is lower than 500g/L, or single nickel salt is lower than 25g/L, will cause the bad in conjunction with effect of transition layer and matrix, transition layer is not fine and close.
3. transition layer solution composition of the present invention is simple, and be only made up of three kinds of components, add other component and cost will be caused to increase, performance does not but significantly improve, and component is more complicated, and uncontrollable factor is more, more causes transition layer unstable properties.And these three kinds of components, lacking any one will cause coating performance sharply to worsen, do not reach as transition layer requirement and with its effect, even can not form coating.Therefore, the preparation of present invention process plating solution is simple, controls easily, easy to operate.Compared with the technique of electronickelling alloy transition layer, cost reduces about 40%.
Embodiment
Embodiment one
An elemental nickel transition layer electro-plating method for crystallizer copper pipe, the solution composition of described plating elemental nickel transition layer is: nickel sulfamic acid 500g/L, single nickel salt 35g/L, sodium lauryl sulphate 55g/L; Electroplating technology is: pH4, bath temperature 55 DEG C, cathode current density 4.5A/dm
2, immersion plating time 20min; Thickness of coating 3 μm.
The component that the subsequent plating layer coordinated with this transition layer adopts and technique are: the solution composition of chromium coating is: chromic anhydride 140g/l, sulfuric acid 1.2g/l, chromium sulphate 5g/l, formic acid 5g/l, sodium sulfate 6g/l; The technique of electrodeposited chromium layers is: pH3.5, is 45 DEG C in temperature, and current density is 44A/dm
2, electroplating time 40min.
Embodiment two
An elemental nickel transition layer electro-plating method for crystallizer copper pipe, the solution composition of described plating elemental nickel transition layer is: nickel sulfamic acid 600g/L, single nickel salt 25g/L, sodium lauryl sulphate 65g/L; Electroplating technology is: pH6, bath temperature 45 DEG C, cathode current density 6.5A/dm
2, immersion plating time 10min; Thickness of coating 4 μm.
The component that the subsequent plating layer coordinated with this transition layer adopts and technique are: the solution composition of chromium coating is: chromic anhydride 150g/l, sulfuric acid 1.0g/l, chromium sulphate 7g/l, formic acid 3g/l, sodium sulfate 8g/l; The technique of electrodeposited chromium layers is: pH4, is 35 DEG C in temperature, and current density is 48A/dm
2, electroplating time 30min.
Embodiment three
An elemental nickel transition layer electro-plating method for crystallizer copper pipe, the solution composition of described plating elemental nickel transition layer is: nickel sulfamic acid 550g/L, single nickel salt 30g/L, sodium lauryl sulphate 60g/L; Electroplating technology is: pH5, bath temperature 50 DEG C, cathode current density 5A/dm
2, immersion plating time 15min; Thickness of coating 3.5 μm.
The component that the subsequent plating layer coordinated with this transition layer adopts and technique are: the solution composition of chromium coating is: chromic anhydride 145g/l, sulfuric acid 1.1g/l, chromium sulphate 6g/l, formic acid 4g/l, sodium sulfate 7g/l; The technique of electrodeposited chromium layers is: pH4, is 40 DEG C in temperature, and current density is 46A/dm
2, electroplating time 35min.
Applicant states, the present invention illustrates detailed process equipment and process flow process of the present invention by above-described embodiment, but the present invention is not limited to above-mentioned detailed process equipment and process flow process, namely do not mean that the present invention must rely on above-mentioned detailed process equipment and process flow process and could implement.Person of ordinary skill in the field should understand, any improvement in the present invention, to equivalence replacement and the interpolation of ancillary component, the concrete way choice etc. of each raw material of product of the present invention, all drops within protection scope of the present invention and open scope.
Claims (1)
1. an elemental nickel transition layer electro-plating method for crystallizer copper pipe, is characterized in that: the solution composition of described plating elemental nickel transition layer is: nickel sulfamic acid 500-600g/L, single nickel salt 25-35g/L, sodium lauryl sulphate 55-65g/L; Electroplating technology is: pH4-6, and bath temperature is about 45-55 DEG C, cathode current density 4.5-6.5A/dm
2, the immersion plating time is about 10-20min; Thickness of coating is about 3-4 μm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510675345.1A CN105200462A (en) | 2015-10-19 | 2015-10-19 | Electroplating method for elemental nickel transition layer of mould copper tube |
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| CN201510675345.1A CN105200462A (en) | 2015-10-19 | 2015-10-19 | Electroplating method for elemental nickel transition layer of mould copper tube |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1213019A (en) * | 1997-06-18 | 1999-04-07 | 阿托泰克德国有限公司 | Electroplating of low-stress nickel |
| CN1454735A (en) * | 2003-04-30 | 2003-11-12 | 陈小飞 | Method of manufacturing crystallizer of square or rectangular billet copper tube |
| US20080093047A1 (en) * | 2006-10-18 | 2008-04-24 | Inframat Corporation | Casting molds coated for surface enhancement and methods of making |
| CN102330122A (en) * | 2011-10-08 | 2012-01-25 | 上海应用技术学院 | Electroplate liquid for electroplating semi-bright nickel at high speed as well as preparation method and application thereof |
| CN103160868A (en) * | 2011-12-17 | 2013-06-19 | 鞍钢重型机械有限责任公司 | Electrolyte for producing active nickel with sulfur and use method thereof |
| CN104451789A (en) * | 2014-12-30 | 2015-03-25 | 广西师范大学 | Plating solution for electroplating nickel on aluminum-based carbon nanotube |
| EP2937450A1 (en) * | 2014-04-25 | 2015-10-28 | Kiesow Dr. Brinkmann GmbH & Co. KG | Galvanic bath or mixture for use in a galvanic bath for depositing a gloss nickel layer and method for producing an item with a gloss nickel layer |
-
2015
- 2015-10-19 CN CN201510675345.1A patent/CN105200462A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1213019A (en) * | 1997-06-18 | 1999-04-07 | 阿托泰克德国有限公司 | Electroplating of low-stress nickel |
| CN1454735A (en) * | 2003-04-30 | 2003-11-12 | 陈小飞 | Method of manufacturing crystallizer of square or rectangular billet copper tube |
| US20080093047A1 (en) * | 2006-10-18 | 2008-04-24 | Inframat Corporation | Casting molds coated for surface enhancement and methods of making |
| CN102330122A (en) * | 2011-10-08 | 2012-01-25 | 上海应用技术学院 | Electroplate liquid for electroplating semi-bright nickel at high speed as well as preparation method and application thereof |
| CN103160868A (en) * | 2011-12-17 | 2013-06-19 | 鞍钢重型机械有限责任公司 | Electrolyte for producing active nickel with sulfur and use method thereof |
| EP2937450A1 (en) * | 2014-04-25 | 2015-10-28 | Kiesow Dr. Brinkmann GmbH & Co. KG | Galvanic bath or mixture for use in a galvanic bath for depositing a gloss nickel layer and method for producing an item with a gloss nickel layer |
| CN104451789A (en) * | 2014-12-30 | 2015-03-25 | 广西师范大学 | Plating solution for electroplating nickel on aluminum-based carbon nanotube |
Non-Patent Citations (2)
| Title |
|---|
| 曹旭等: ""氨基磺酸盐镀液在结晶器铜板电镀中的应用"", 《电镀与精饰》 * |
| 朱诚意等: ""连铸结晶器表面镀层技术研究进展"", 《材料保护》 * |
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