CN104772946B - Plate nickel chromium triangle part and its manufacture method - Google Patents
Plate nickel chromium triangle part and its manufacture method Download PDFInfo
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- CN104772946B CN104772946B CN201510105136.3A CN201510105136A CN104772946B CN 104772946 B CN104772946 B CN 104772946B CN 201510105136 A CN201510105136 A CN 201510105136A CN 104772946 B CN104772946 B CN 104772946B
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- nickel
- plating
- nickel dam
- dam
- chrome
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- 238000000034 method Methods 0.000 title claims abstract description 70
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 229910018487 Ni—Cr Inorganic materials 0.000 title abstract description 4
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 title abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 833
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 408
- 238000007747 plating Methods 0.000 claims abstract description 206
- 239000010410 layer Substances 0.000 claims abstract description 157
- 239000011248 coating agent Substances 0.000 claims abstract description 98
- 238000000576 coating method Methods 0.000 claims abstract description 98
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 90
- 239000000463 material Substances 0.000 claims abstract description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 56
- 229910052802 copper Inorganic materials 0.000 claims abstract description 56
- 239000010949 copper Substances 0.000 claims abstract description 56
- 239000011651 chromium Substances 0.000 claims abstract description 49
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 42
- 239000002346 layers by function Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000011593 sulfur Substances 0.000 claims description 46
- 229910052717 sulfur Inorganic materials 0.000 claims description 46
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 37
- 239000000080 wetting agent Substances 0.000 claims description 28
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 25
- 239000003795 chemical substances by application Substances 0.000 claims description 24
- 239000004327 boric acid Substances 0.000 claims description 23
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 21
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 20
- 239000000654 additive Substances 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 19
- HIRWGWMTAVZIPF-UHFFFAOYSA-N nickel;sulfuric acid Chemical compound [Ni].OS(O)(=O)=O HIRWGWMTAVZIPF-UHFFFAOYSA-N 0.000 claims description 17
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 16
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 15
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 10
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 9
- 230000000996 additive effect Effects 0.000 claims description 8
- 235000019270 ammonium chloride Nutrition 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 7
- 229910021555 Chromium Chloride Inorganic materials 0.000 claims description 6
- 208000037656 Respiratory Sounds Diseases 0.000 claims description 6
- QSWDMMVNRMROPK-UHFFFAOYSA-K chromium(3+) trichloride Chemical compound [Cl-].[Cl-].[Cl-].[Cr+3] QSWDMMVNRMROPK-UHFFFAOYSA-K 0.000 claims description 6
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 4
- 239000002270 dispersing agent Substances 0.000 claims description 4
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 claims description 3
- 239000005695 Ammonium acetate Substances 0.000 claims description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 3
- 229940043376 ammonium acetate Drugs 0.000 claims description 3
- 235000019257 ammonium acetate Nutrition 0.000 claims description 3
- SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical compound [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 claims description 3
- 239000000460 chlorine Substances 0.000 claims description 3
- 229910052801 chlorine Inorganic materials 0.000 claims description 3
- 239000003112 inhibitor Substances 0.000 claims description 3
- 235000006408 oxalic acid Nutrition 0.000 claims description 3
- WFIZEGIEIOHZCP-UHFFFAOYSA-M potassium formate Chemical compound [K+].[O-]C=O WFIZEGIEIOHZCP-UHFFFAOYSA-M 0.000 claims description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 2
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- 239000001632 sodium acetate Substances 0.000 claims description 2
- 235000017281 sodium acetate Nutrition 0.000 claims description 2
- SPIFDSWFDKNERT-UHFFFAOYSA-N nickel;hydrate Chemical compound O.[Ni] SPIFDSWFDKNERT-UHFFFAOYSA-N 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 28
- 230000007797 corrosion Effects 0.000 description 55
- 238000005260 corrosion Methods 0.000 description 55
- 239000000243 solution Substances 0.000 description 55
- 239000011259 mixed solution Substances 0.000 description 38
- 241000209140 Triticum Species 0.000 description 33
- 235000021307 Triticum Nutrition 0.000 description 33
- XADCESSVHJOZHK-UHFFFAOYSA-N Meperidine Chemical compound C=1C=CC=CC=1C1(C(=O)OCC)CCN(C)CC1 XADCESSVHJOZHK-UHFFFAOYSA-N 0.000 description 32
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 24
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 16
- 230000006872 improvement Effects 0.000 description 14
- 239000000126 substance Substances 0.000 description 14
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 12
- 238000002474 experimental method Methods 0.000 description 12
- 229910052763 palladium Inorganic materials 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 8
- 238000006386 neutralization reaction Methods 0.000 description 8
- 229920003023 plastic Polymers 0.000 description 8
- 239000004033 plastic Substances 0.000 description 8
- 239000000084 colloidal system Substances 0.000 description 7
- 230000005611 electricity Effects 0.000 description 7
- 230000003628 erosive effect Effects 0.000 description 7
- 238000001994 activation Methods 0.000 description 6
- 238000005238 degreasing Methods 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- 208000014451 palmoplantar keratoderma and congenital alopecia 2 Diseases 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 4
- 229910001018 Cast iron Inorganic materials 0.000 description 4
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 4
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 4
- 229910000029 sodium carbonate Inorganic materials 0.000 description 4
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 4
- 229910052911 sodium silicate Inorganic materials 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 3
- 239000004115 Sodium Silicate Substances 0.000 description 3
- 239000004902 Softening Agent Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000005253 cladding Methods 0.000 description 3
- 230000003111 delayed effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 239000001509 sodium citrate Substances 0.000 description 3
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 3
- 235000019795 sodium metasilicate Nutrition 0.000 description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 3
- 239000001119 stannous chloride Substances 0.000 description 3
- 235000011150 stannous chloride Nutrition 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 2
- 241000370738 Chlorion Species 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- 230000002421 anti-septic effect Effects 0.000 description 2
- 239000004637 bakelite Substances 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 230000001934 delay Effects 0.000 description 2
- 238000006056 electrooxidation reaction Methods 0.000 description 2
- 239000003623 enhancer Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 235000011149 sulphuric acid Nutrition 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910001141 Ductile iron Inorganic materials 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 229910001060 Gray iron Inorganic materials 0.000 description 1
- 241001124569 Lycaenidae Species 0.000 description 1
- 229910001296 Malleable iron Inorganic materials 0.000 description 1
- 229910002666 PdCl2 Inorganic materials 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- 229910001037 White iron Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- -1 and in this step Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000010338 boric acid Nutrition 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 238000002242 deionisation method Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 239000003906 humectant Substances 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- XIKYYQJBTPYKSG-UHFFFAOYSA-N nickel Chemical compound [Ni].[Ni] XIKYYQJBTPYKSG-UHFFFAOYSA-N 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- FPBMTPLRBAEUMV-UHFFFAOYSA-N nickel sodium Chemical compound [Na][Ni] FPBMTPLRBAEUMV-UHFFFAOYSA-N 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 229910003445 palladium oxide Inorganic materials 0.000 description 1
- JQPTYAILLJKUCY-UHFFFAOYSA-N palladium(ii) oxide Chemical compound [O-2].[Pd+2] JQPTYAILLJKUCY-UHFFFAOYSA-N 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000013139 quantization Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- KBAFDSIZQYCDPK-UHFFFAOYSA-M sodium;octadecane-1-sulfonate Chemical compound [Na+].CCCCCCCCCCCCCCCCCCS([O-])(=O)=O KBAFDSIZQYCDPK-UHFFFAOYSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- WWNBZGLDODTKEM-UHFFFAOYSA-N sulfanylidenenickel Chemical compound [Ni]=S WWNBZGLDODTKEM-UHFFFAOYSA-N 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Plating nickel chromium triangle part disclosed by the invention and its manufacture method, wherein plating nickel chromium triangle part includes base material；Coating is pre-processed, it is deposited over the whole substrate, formed with copper plate on pretreatment coating；And basal layer, it is formed on copper plate；And functional layer, it is formed on basal layer, and wherein functional layer includes low potential nickel dam and the micropore nickel dam being formed on low potential nickel dam；And decorative layer, it is formed on micropore nickel dam, and decorative layer is any of trivalent chrome plating or sexavalence chrome plating.On the basis of the present invention is by the micropore that is set in parts surface, chrome-plated process, increase low potential nickel coating, so as to improve the decay resistance of the decay resistance of product, especially trivalent chromium chrome plating product, it can promote more environmentally friendly trivalent chromium product is more massive to be applicable.
Description
Technical field
The present invention relates to a kind of workpiece and its manufacture method with surface plating structure, particularly a kind of plating nickel-chrome portion
Part and its manufacture method.
Electrical potential difference is the difference of the standard electrode potential measured with adjacent two layers respectively as an entirety in the application.
Background technology
European market to the increasingly tighter of environmental requirement, and each main engine plants to electroplate it is corrosion proof require more and more higher,
Trivalent chromium plating can not meet that the corrosion requirement of specific environment (while reaches salt-fog resistant test 80h and the examination of resistance to Russian mud at present
Test 336h).
It is normally applied in electroplating industry and first plates the method for double layer nickel or three layers of nickel chromium plating again and improve the antiseptic power of workpiece, quilt
Wide variety of double layer nickel technique has：Semi-gloss nickel+light nickel+flawless chromium, three layers of nickel technique being widely used have:Semi-gloss nickel+
Light nickel+microporous nickel+flawless chromium, or semi-gloss nickel+light nickel+micro-crack nickel+flawless chromium, but due to the stress of layers of chrome itself
Greatly, industrially hardly result in it is a kind of completely without the chromium electrodeposited coating of crackle or hole (including Cr VI and trivalent chrome plating), cruelly
Reveal after aerial chromium electrodeposited coating is passivated, its current potential than nickel just, when running into the corrosive medium in air, just with nickel dam structure
Into corrosion cell, ornamental nickel electrodeposited coating is caused to occur a large amount of irregular corrosion, or even the big face of nickel dam in extreme environment
Product corrosion causes coming off for layers of chrome.In order to further improve the antiseptic power of coating, microporous nickel and micro-crack nickel are applied to light
On nickel coating, micro-crack nickel plates a special nickel dam of floor height stress on light nickel dam, will be produced after chromium plating due to stress a large amount of
Micro-crack；And micropore nickel dam disperses corrosion current in MULTI-LAYER NICKEL, prevent from being formed the hot spot of depth, avoid visible corruption
Erosion.Due to micro-crack nickel dam is used alone, product surface hair mist, brightness is poor, and does not refer to that trivalent chromium is coated with, and due to list
Microporous nickel or micro-crack nickel solely are used, is limited to corrosion proof improve.
In the prior art, such as Chinese patent application (publication number：CN102766894 A) it is related to one kind for micro-crack nickel electricity
The electroplate liquid of plating and its application, the main composition of the micro-crack nickel electroplate liquid are as follows：Nickel chloride：180~260 g/l, acetic acid：
20~60 ml ls, ELPELYT MR：80~120 ml ls, 62A：1~5 ml l.In plastic part surface micro-crack nickel
Electroplating technology flow is：A. plastic part surface metallizes, B. bright coppers, half bright nickel of C., D. high-sulfur nickel E. bright nickels, F. micropores
Nickel, G. washings, H. light chromium, I. washings, J. are dried；Although using four layers of nickel nickel plating solution in plastic table in the technical scheme
The corrosion resistance for improving working of plastics to a certain extent is electroplated in face, but the resistance to corrosion of the technique still can not reach
To containing deicer salts (CaCl2) corrosive environment requirement, high-sulfur nickel electrodeposited coating locally have hair mist phenomenon, in addition in this method due to
Plastic surface processing is not in place, causes coating covering power poor, the easy embrittlement of coating, and the plastic cement after electroplating processes is as automobile component
(grid, panel, door handle) service life is short afterwards.And about introducing the technique of micro-crack nickel, as Chinese patent application is (open
Number：CN101705508A) it is related to a kind of electroplate liquid for micro-crack nickel plating and its application, the master of the micro-crack nickel electroplate liquid
Form as follows：Nickel chloride：180~260 g/l, acetic acid：20~60 ml ls, ELPELYT MR：80~120 ml ls,
62A：1~5 ml l, the evaluation of the example described in patent document is actual to be limited to Cr VI plating, does not refer to trivalent chromium electricity
Plating.
The content of the invention
To solve the above problems, the invention discloses one kind to plate nickel-chrome part, it is more by organically combining land productivity functional layer
The corrosion resistance characteristic and chemical property of layer nickel structure, both ensure that the shiny appearance characteristic of micropore nickel dam, have again comprising micro-
The dual corrosion resistance of the functional layer of hole nickel, can make product reach superelevation corrosion resistance and structural stability, even if in low potential nickel dam
After being corroded, micropore nickel dam can equally play the effect supported and delay corrosion.
Plating nickel-chrome part components disclosed by the invention, the part include：
Base material；
Coating is pre-processed, it is deposited over the whole substrate, formed with copper plate on pretreatment coating；With
Basal layer, it is formed on copper plate；With
Functional layer, it is formed on basal layer, and wherein functional layer includes low potential nickel dam and is formed on low potential nickel dam
Micropore nickel dam；With
Decorative layer, it is formed on micropore nickel dam, and the decorative layer is any of trivalent chrome plating or sexavalence chrome plating.
A kind of improvement of plating nickel-chrome part components disclosed by the invention, decorative layer is trivalent chrome plating, and trivalent chrome plating is
The trivalent chrome plating of the white chrome plating of trivalent or trivalent black chromium plating or other species.When decorative layer is trivalent chrome plating,
Trivalent chromium coating surface can also contain passivating film.
A kind of improvement of plating nickel-chrome part components disclosed by the invention, the potential difference of micropore nickel dam and low potential nickel dam are
10-120mv。
A kind of improvement of plating nickel-chrome part components disclosed by the invention, low potential nickel dam include high-sulfur nickel dam, micro-crack
It is compound between one layer or two layers in nickel dam.It is further preferred that the potential difference between micropore nickel dam and low potential nickel dam is 20-
100mv。
A kind of improvement of plating nickel-chrome part components disclosed by the invention, low potential nickel dam is using micro-crack nickel and high-sulfur nickel
During composite deposite, potential difference is in 10-80mv between micro-crack and high-sulfur nickel.
The manufacture method of plating nickel-chrome part disclosed by the invention comprises the following steps：
The surface of base material is pre-processed；
Pretreatment coating is deposited over the whole substrate, and copper plate is formed on pretreatment coating；With
Basal layer is formed on copper plate；With
Low potential nickel dam in functional layer is formed on basal layer；With
Micropore nickel dam in functional layer is formed on low potential nickel dam；Between the micropore nickel dam and low potential nickel dam
Potential difference is in the range of 10-120mv；With
Decorative layer is formed on micropore nickel dam, the decorative layer is any of trivalent chrome plating or sexavalence chrome plating.
Potential difference control in the range of this, is less prone to bubbling, while coating knot in 10-120mv in electroplating process
Structure is more stable and firm, is not susceptible to separation and peels off.Here low potential nickel dam is plated on copper plate indirectly, in low potential nickel dam
Other coating can also be electroplated between copper plate, referred to generally at based on layer, here basal layer can be semi-gloss, Quan Guang,
The corresponding coating such as Sha Ding, high-sulfur.
The first aspect of the present invention provides plating nickel-chrome part, and it includes following：Matrix；Pre-processing coating (can include changing
Learn nickel dam, bottoming nickel dam is any or the two is compound), it is formed on whole matrix；Copper plate, it is formed at pretreatment coating
On；Basal layer (can include any or a variety of compound in full light nickel dam, semi-gloss nickel dam, husky fourth nickel dam, high-sulfur nickel dam), its shape
Into on copper plate；Low potential nickel coating, it is formed on basic coating, microporous layers, in its formation and low potential nickel dam, wherein
Electrical potential difference between low potential nickel coating and micropore nickel coating is in the range of 10mV to 120mV；(can be that chromium plates with decorative layer
Layer, such as any of trivalent chrome plating or sexavalence chrome plating), it is formed on micropore nickel coating, and with microcellular structure and
Micro-cracked structure it is at least one of any.
The second aspect of the present invention provides the manufacture method of plating nickel-chrome part, and it comprises the following steps：Coating will be pre-processed
It is formed on whole matrix；Copper plate is formed on pretreatment coating；Basal layer is formed on copper plate；By your low potential
Nickel coating is formed on basic coating, and micropore nickel dam is formed on low potential nickel dam, wherein low potential nickel coating and microporous nickel
Electrical potential difference between coating is in the range of 10mV to 120mV；Decorative layer is formed on micropore nickel dam.
A kind of improvement of the manufacture method of plating nickel-chrome part disclosed by the invention, decorative layer are trivalent chrome plating, trivalent chromium
Coating is the white chrome plating of trivalent or trivalent black chromium plating or the trivalent chrome plating of other species.
A kind of improvement of the manufacture method of plating nickel-chrome part disclosed by the invention, low potential nickel dam include high-sulfur nickel dam,
It is compound between one layer or two layers in micro-crack nickel dam.
A kind of improvement of the manufacture method of plating nickel-chrome part disclosed by the invention, micropore nickel dam is using plating micropore nickel plating bath
Plating forms, and it is (addition in unit volume plating solution) that plating micropore nickel plating bath, which includes composition and concentration,：Aqueous sulfuric acid nickel 300-
350g/L, aqueous nickel chloride 50-60g/L, boric acid 40-50g/L, nickel envelope brightener 6-12ml/L (firmly believe it is happy think chemical trade (on
Sea) the hereinafter referred to as happy think of of Co., Ltd, wheat dolantin science and technology (Suzhou) Co., Ltd hereinafter referred to as wheat dolantin, such as happy 63 or the wheat thought
The INDEX of NIMAC 14 of dolantin), nickel envelope key light agent 4-7.5ml/L (such as the happy 610CFC thought the or NIMAC 33 of wheat dolantin),
Nickel seals particle 0.2-1.5g/L, and nickel envelope particle dispersants 0.5-3ml/L, wetting agent 1-5ml/L are (such as the happy ENHANCER thought or wheat
The NiMac Hypore XL dispersants of dolantin).Operation temperature control is between 50~60 DEG C when micropore nickel dam is coated with, pH value control
For system between 3.8~4.6, current density is 2~5ASD, and the operating time is controlled between 2~8min, is electrolysed by direct current
Mode makes nickel be deposited on plated item, it is desirable to which nickel coating thickness is not less than 1.5 microns.
A kind of improvement of the manufacture method of plating nickel-chrome part disclosed by the invention, decorative layer are the white chrome plating of trivalent, trivalent
White chrome plating is formed using the white chromium plating solution plating of plating trivalent, and it is (unit volume plating solution that the white chromium plating solution of trivalent, which includes composition and concentration,
Middle addition)：Aqueous chromium chloride 90-150g/L, potassium formate 50-100g/L, ammonium bromide 8-25g/L, ammonium chloride 40-60g/L, chlorine
Change potassium 40-100g/L, sodium acetate 10-60g/L, boric acid 40-80g/L, wetting agent 0.5-2.5ml/L.It is required that chrome plating is not less than
0.1μm。
A kind of improvement of the manufacture method of plating nickel-chrome part disclosed by the invention, decorative layer are trivalent black chromium plating, trivalent
Black chromium plating is formed using the black chromium plating solution plating of plating trivalent, and it is (unit volume plating solution that the black chromium plating solution of trivalent, which includes composition and concentration,
Middle addition)：Aqueous chromium chloride 150-250g/L, oxalic acid 2-5g/L, ammonium acetate 3-10g/L, ammonium chloride 20-40g/L, boric acid
20-41g/L, additive 0.5-3g/L.It is required that chrome plating is not less than 0.1 μm.
A kind of improvement of the manufacture method of plating nickel-chrome part disclosed by the invention, decorative layer are sexavalence chrome plating, Cr VI
Coating is formed using the plating solution plating of plating Cr VI, and Cr VI plating solution includes composition and concentration (to be added in unit volume plating solution
Amount)：Chromic anhydride 260-360g/L, sulfuric acid 0.5-3g/L, decorative chromium brightener 1-4g/L, chromium fog inhibitor 0.1-0.4ml/L.It is required that
Chrome plating is not less than 0.1 μm.
A kind of improvement of the manufacture method of plating nickel-chrome part disclosed by the invention, micro-crack nickel dam is using plating micro-crack nickel
Plating solution plating forms, and it is (addition in unit volume plating solution) that plating micro-crack nickel plating solution, which includes composition and concentration,：Aqueous nickel chloride：
180-260g/L, acetic acid：10-40ml/L, PN-1A：40-90g/L, PN-2A：1-5ml/L, wetting agent：1-5ml/L (thinks as happy
62A or wheat dolantin NIMAC 32C WETTER).Operation temperature is controlled between 25~35 DEG C when micro-crack nickel dam is coated with,
PH value is controlled between 3.6~4.6, and current density is 5~9ASD, and the operating time is controlled between 2~8min, passes through direct current
The mode of electrolysis makes nickel be deposited on plated item light-plated nickel dam surface, it is desirable to which micro-crack nickel thickness of coating is not less than 1.0 microns.
A kind of improvement of the manufacture method of plating nickel-chrome part disclosed by the invention, high-sulfur nickel dam is using plating high-sulfur nickel plating bath
Plating forms, and it is (addition in unit volume plating solution) that plating high-sulfur nickel plating bath, which includes composition and concentration,：Aqueous sulfuric acid nickel 250-
350g/L, aqueous nickel chloride 35-60g/L, boric acid 35-65g/L, high sulfur additives 3-10ml/L, wetting agent 0.5-3ml/L is (such as
The happy 62A thought or wheat dolantin NIMAC 32C WETTER).Temperature control is between 55~65 DEG C when high-sulfur nickel dam is coated with, pH
To control between 2.0~3.5, current density is 2~6ASD, and the operating time is controlled between 2~8min, passes through direct current electricity
The mode of solution makes nickel be deposited on the basic coating surface of plated item plating, and high-sulfur nickel layer thickness is not less than 1.0 microns.
In above-mentioned manufacture method, in addition to base material pretreatment process early stage, including the non-gold including ABS resin
Category class base material pretreatment process early stage, which comprises at least, surface grease treatment process, surface hydrophilic, surface coarsening treatment process, table
Face neutralisation treatment operation, surface preimpregnation, surface activation process process and surface dispergation treatment process；And metal class base material then exists
Surface grease treatment process can be subsequently coated with work after carrying out oil removing, before equally applicable non-metallic base set forth below
Corresponding process in phase pretreatment process.
In above-mentioned manufacture method, non-metal kind base material pretreatment process early stage is specially in hydroxide by base material blank
Degreasing is cleaned in sodium, sodium carbonate, surfactant and sodium metasilicate mixed solution, chromic anhybride and sulfuric acid mixing are immersed after degreasing
Surface coarsening processing is carried out in liquid, progress surface neutralization in hydrochloric acid solution is then placed in, is carried out after neutralization using colloid palladium solution
Surface activation process, surface dispergation processing is then carried out in sulfuric acid solution.
Preferably, the mixed solution of surface grease treatment process includes composition and concentration is：The concentration of sodium hydroxide
For 20-50g/L, the concentration of sodium carbonate is 10-40g/L, and surfactant 1-3g/L, the concentration of sodium metasilicate is 10-40g/L.
Here surface degreasing step can remove the greasy dirt and other impurities of substrate surface, promote surface coarsening uniform, carry
High binding force of cladding material.
Preferably, the sulfuric acid solution concentration of surface hydrophilic process is 20-100g/L, whole face agent 0.5-2ml/L.
Preferably, the mixed liquor of surface coarsening treatment process includes composition and concentration is：The concentration of chromic anhybride is
330-480g/L, the concentration of sulfuric acid is 330-480g/L.
Preferably, the mixed solution of surface neutralization step includes composition and concentration is：Hydrochloric acid 30-100ml/L, hydration
Hydrazine 15-60ml/L.
Preferably, the concentration of hydrochloric acid solution of surface preimpregnation process is 40-120ml/L.
Preferably, the colloid palladium solution of surface activation process includes composition and concentration is：Hydrochloric acid 180-280ml/L,
The concentration of palladium bichloride is 20-60ppm, the concentration 1-6g/L of stannous chloride.
Here in colloid palladium solution, palladium bichloride is covered in substrate surface, and catalytic center is provided for follow-up chemical nickel, and chlorine
Changing the tin ion of stannous can be then deposited on around palladium ion with the group of chemical combination too, avoid palladium ion from being aoxidized in water or in air
With come off, the service life of colloid palladium solution can be increased.
Preferably, the sulfuric acid solution concentration of surface dispergation treatment process is 40-100g/L.
Surface dispergation, which is handled, to be referred to remove the stannous chloride being coated in colloid palladium solution around palladium oxide using sulfuric acid, will
Metal Palladium particle is exposed so that the heavy nickel technique of subsequent chemistry is more smoothly.
In above-mentioned manufacture method, pretreatment coating can include electroless nickel layer either any in bottoming nickel dam or
Two layers compound.When electroless nickel layer and bottoming nickel dam simultaneously in the presence of, then electroless nickel layer is formed on base material, and bottoming nickel dam is formed at
In electroless nickel layer.
Preferably, plating chemical nickel process mixed solution includes composition and concentration is：The concentration of nickel sulfate is 15-40g/
L, the concentration of sodium hypophosphite is 20-50g/L, and the concentration of ammonium chloride is 10-50g/L, and the concentration of sodium citrate is 10-40g/L,
Ammoniacal liquor adjusts pH value to 8.6-9.2.
Here one layer of thin conductive layer is deposited in the Metal Palladium that chemical sinking nickel refers to have catalytic activity in substrate surface, just
In subsequently electroplating various metals, during chemical sinking nickel, nickel sulfate provides nickel element；Sodium hypophosphite is strong reductant, and it will
Nickel element in nickel sulfate is reduced into metallic nickel；Sodium citrate is buffer, and it causes the anti-of sodium hypophosphite reduction nickel element
Should be more gentle.
Preferably, the mixed solution of plating bottoming nickel process includes composition and concentration is：The concentration of aqueous sulfuric acid nickel is
180-280g/L, the concentration of aqueous nickel chloride is 35-60g/L, and the concentration of boric acid is 35-60g/L, and the concentration of wetting agent is 1-
3ml/L (such as the happy 62A thought the or NIMAC 32C WETTER of wheat dolantin).
In the presence of electroless nickel layer and bottoming nickel dam are on matrix simultaneously, base material has passed through oxidation in chemical sinking nickel
Reduction reaction causes substrate surface to cover the conductive nickel dam of layer；And in bottoming nickel is plated, then using electrochemistry
Method plates last layer nickel in chemical nickel, further strengthens the electric conductivity of coating.In this step, aqueous sulfuric acid nickel, aqueous chlorination
Nickel provides nickel ion needed for electrochemical reaction.
In above-mentioned manufacture method, each component and concentration are in the mixed solution of copper plate process：Copper sulphate it is dense
Spend for 160-260g/L, the concentration of sulfuric acid is 50-100g/L, and the concentration of chlorion is 40-100ppm, and the concentration of leveling agent is
0.2-1ml/L (the 1560 sour copper additives such as happy think of are serial), (1561 such as happy think of are sour for 0.2-1ml/L for the concentration for the agent that walks
Copper additives series), the concentration of open cylinder agent is 2-10ml/L (such as the happy 1562 sour copper additives series thought).
Here the purpose of copper plate be using copper sulphate characteristic to improve the brightness of substrate surface and planarization, and
The overall toughness of coating can also be improved.Because copper coating compares nickel coating and other coats of metal, its ductility is more preferable, because
After this plates sour layers of copper, the toughness and Surface flat of overall coating are improved.
In above-mentioned manufacture method, basal layer can include semi-gloss nickel dam, full light nickel dam, husky fourth nickel dam, high-sulfur nickel dam
In it is any or multilayer compound.
Preferably, each component and concentration are in the mixed solution of plating semi-gloss nickel process：Aqueous sulfuric acid nickel 200-300g/
L, aqueous nickel chloride 35-50g/L, boric acid 35-50g/L, semi-bright nickel primary brightener 3.0-7.0ml/L is (such as the happy BTL thought
MU or wheat dolantin NIMAC SF DUCT), semi-bright nickel second-class brightener 0.3-1.0ml/L is (such as the happy TL-2 or wheat dolantin thought
NIMAC SF LEVELER), potential difference regulator 0.8-1.2ml/L is (as the happy B thought is mended or the NIMAC SF of wheat dolantin
MAINTENANCE), wetting agent 2.0-3.0ml/L (such as the happy 62A thought the or NIMAC 32C WETTER of wheat dolantin).Semi-gloss nickel
Operation temperature control is between 50~60 DEG C when layer is coated with, and pH value is controlled between 3.6~4.6, and current density is 2~5ASD,
Operating time is controlled between 12~24min, nickel is deposited in plated item copper facing layer surface by way of direct current electrolysis,
It is required that semi-gloss nickel coating thickness is not less than 8 microns.
Here the purpose for plating semi-gloss nickel is that semi-gloss nickel coating is column knot in one and half bright nickel dam of substrate surface plating
Structure, the corrosion resistance of coating can be improved.
Preferably, plating each component and concentration in the mixed solution of full light nickel process and being：Aqueous sulfuric acid nickel 220-340g/
L, aqueous nickel chloride 40-50g/L, boric acid 35-40g/L, bright nickel softening agent 8-12ml/L is (such as happy 63 or the wheat dolantin thought
The INDEX of NIMAC 14), bright nickel key light agent 0.5-0.9ml/L is (such as the happy 66E thought the or NiMac of wheat dolantin
Chanllenger Plus), wetting agent 2.0-3.0ml/L (such as the happy 62A thought the or NIMAC 32C WETTER of wheat dolantin).Entirely
When light nickel dam is coated with operation temperature control between 50~60 DEG C, pH value control between 3.6~4.6, current density be 2~
5ASD, operating time are controlled between 9~20min, nickel is deposited on plated item by way of direct current electrolysis and are plated semi-gloss nickel
On surface, it is desirable to which full light nickel coating thickness is not less than 5 microns.
Here the purpose for plating full light nickel is that the nickel dam of one layer of entire bright is plated in substrate surface, and full light nickel coating is stratiform knot
Structure, the brightness of coating can be improved.
Preferably, plating each component and concentration in the mixed solution of husky fourth nickel process and being：The concentration of aqueous sulfuric acid nickel is
250-350g/L, the concentration of aqueous nickel chloride is 35-60g/L, and the concentration of boric acid is 35-65g/L, and the concentration of auxiliary additive is
5-20ml/L is (such as the happy Elpelyt pearlbrite carrier K4 or Elpelyt carrier brightener thought
H), the concentration of husky fourth nickel forming agent is 0.1-0.6ml/L (such as the happy Elpelyt pearlbrite additive K6AL thought).
Preferably, each component and concentration are in the mixed solution of plating high-sulfur nickel process：The concentration of aqueous sulfuric acid nickel is
250-350g/L, the concentration of aqueous nickel chloride is 35-60g/L, and the concentration of boric acid is 35-65g/L, and the concentration of high sulfur additives is
3-10ml/L, the concentration of wetting agent is 0.5-3ml/L (such as the happy 62A thought the or NIMAC 32C WETTER of wheat dolantin).
Plating micro-crack nickel refer to substrate surface plate one layer and the coating containing numerous crackle, can be with distributed erosion
Electric current, reduce corrosion electric current density.Plating microporous nickel refers to that plating one layer in plastic surface uniformly contains numerous non-conductive particulate
Coating, can further distributed erosion electric current, reduce corrosion electric current density, improve coating corrosion stability comprehensively.
In plating semi-gloss nickel, the full light nickel step of plating, stabilizer employs boric acid rather than the citric acid in chemical sinking nickel
Sodium, because more paying close attention to the covering power of coating and the compactness of coating when plating semi-gloss nickel, plating full light nickel step.
Micro-crack nickel dam, micropore nickel dam or both combination can play anticorrosion and exist the reason for protecting base material in functional layer
In coated metal/ground metal extremely easily forms corrosion cell on workpiece, and in the case where negative and positive electrode potential determines, it is rotten
Erosion speed is controlled by the ratio of coated metal (negative electrode) surface ground metal (anode) exposed area.Corrosion at only one
During point, at this moment cathode/anode ratio is maximum, and corrosion current just concentrates on this point, and corrosion rate just becomes very big, easily inwardly
Pitting is formed, but when metal coating surface has more potential hot spot, cathode/anode ratio is smaller, corrosion current quilt
It is assigned to everywhere, the electric current originally in hot spot is significantly reduced, and corrosion rate is greatly reduced.Simultaneously as micropore
Or the segmentation between crackle, coating negative electrode is formed discontinuously, the coating after being divided becomes small area by large area, so again
It further limit cathode/anode ratio.However as when the passage asked, when coating surface is influenceed to start by extraneous factor
During existing large-scale crackle, micro-crack, the potential corrosion cell of microcellular structure will be initiated, so as to which it arrives protection by hot spot
Effect, corrosion electric current density is reduced so as to which can plays a part of double-core, so as to significant increase corrosion resistant erosion degree.
The anticorrosive mechanism of low potential nickel
The first step：When piece surface has corrosive medium, first meet with as anodic coating exposed to outer nickel dam at micropore
To be corroded, the size of corrosion current is determined by the surface area of coating, in the presence of a large amount of discontinuous micropores, the nickel that is corroded
Aspect product will increase significantly and discontinuously, in the case where corrosion current is certain, these " micropores " have greatly disperseed corrosion electricity
Stream, reduces corrosion rate, the corrosion rate delayed.
Second step：When erode to reach low potential nickel dam when, because microporous nickel current potential is high compared with low potential nickel current potential, now low electricity
Position nickel is preferentially corroded (i.e. low potential layer is preferentially used as sacrifice layer) as anodic coating, and the corrosion in microporous nickel is terminated.
In the presence of a large amount of discontinuous micro-cracks, the nickel dam area corroded will increase and discontinuously significantly, in corrosion current one
In the case of fixed, these " micropores " have greatly disperseed corrosion current, again reduce corrosion rate, the corrosion rate delayed.
3rd step：Corrosion is extended further downward in low potential nickel until basic coating (including plates below low potential nickel
Layer) when, because the current potential of basic coating is high equally than low potential nickel, low potential nickel has equally been taken as anodic coating, now
The corrosion extended downwardly is terminated in basic coating, and corrosion position is laterally carried out in low potential nickel, is so further delayed
Corrosion drops the speed of bottom corrosion significantly to the time of ground.
Compared with prior art, the advantage of the invention is that：
1st, the present invention is by after base material workpiece premenstruum (premenstrua) pretreatment process, being follow-up low potential nickel dam and micropore nickel dam electricity
Plating lays the first stone, process stabilizing, and compatibility is reasonable.
2nd, substrate surface of the present invention electroplates obtained micropore nickel dam and low potential nickel dam, has high anticorrosive property energy, high hard
Degree, the advantages that high-wearing feature, binding force of cladding material is good, and brightness is high；Simultaneously with micropore nickel dam and tool with high potential characteristic
There is the MULTI-LAYER NICKEL of low potential characteristic --- low potential nickel dam is functional layer, and using low potential nickel dam as sacrifice layer, with micropore
The micropore nickel dam of structure can disperse the micro-current of electrochemical corrosion, delay to occur by corrosion, while formed and can also led to
Cross microcellular structure and form oxide after oxidation and be supported, can be in the low potential nickel dam as sacrifice layer by more serious
Corrosion after form support to it, reduce part coating damage speed.Be provided as sacrifice layer low potential nickel dam have compared with
Low potential, when electrochemical corrosion occurs for piece surface coating, low potential nickel dam preferentially corrodes, and has microporous nickel
When layer or micro-crack nickel dam, its micropore or micro-cracked structure can equally play distributed erosion micro-current, while in low electricity
Also there is during layer structure when protective layer (such as decorative layer either) can also pass through micropore or micro-cracked structure on the outside of the nickel dam of position
Outboard structure is supported, the steadiness of reinforcing material structure.Other the present invention program utilizes microporous nickel and micro-crack nickel
Pore structure, while reinforcing material structural support performance, can also play reduces quality of coating and reduces what raw material expended
Effect.Its micro hole structure can also form the sull structure of large area when oxide etch occurs simultaneously, so as to pole
The earth delays the generation of corrosion.
3rd, in addition, the present invention selects the small plating solution of effect on environment when being formulated and choosing as far as possible so that electroplating technology is more
Environmental protection, further, coating are firmly combined with, and are evenly distributed, and service life is longer, no matter make final products in outward appearance or performance
On can meet the requirement of user, make the technique obtained by the present invention that there is the higher market competitiveness.
Brief description of the drawings
Fig. 1 is the coating structure schematic diagram of the embodiment of present invention plating nickel-chrome part.
The plating nickel part CASS of Fig. 2 prior arts metallographs after 72 hours, (a) is the front gold of sample after experiment in Fig. 2
Phasor, (b) is side (section) metallograph of sample after experiment in Fig. 2.
Fig. 3 present invention plating nickel part CASS metallographs after 72 hours, (a) is the front metallographic of sample after experiment in Fig. 3
Scheme, (b) is the side metallograph of sample after experiment in Fig. 3.
The plating nickel part fluorgypsum of Fig. 4 prior arts tests the picture after carrying out 168 and 336 hours.
Fig. 5 present invention plating nickel part fluorgypsums test the picture after carrying out 168 and 336 hours.
(low potential nickel dam is high-sulfur nickel dam or micro-crack nickel dam to the single low potential nickel dam potential difference picture of Fig. 6 present invention
It is any).
(low potential nickel dam is high-sulfur nickel dam and micro-crack nickel dam to the compound low potential nickel dam potential difference picture of Fig. 7 present invention
Composite bed).
The MULTI-LAYER NICKEL corrosion principle figure of Fig. 8 present invention (using ABS as part base material).
Reference numerals list：
1st, base material；2nd, coating is pre-processed；21st, vacancy is corroded；
3rd, copper plate；31st, surface micropore；32nd, etch pit；
4th, functional layer；141st, low potential nickel dam；142nd, micropore nickel dam；
6th, basal layer；801st, corrosive medium；802nd, decorative layer；
805th, erosional surface；808th, bottoming nickel dam；809th, electroless nickel layer；
810th, ABS substrate.
Embodiment
With reference to the accompanying drawings and detailed description, the present invention is furture elucidated, it should be understood that following embodiments are only
For illustrating the present invention rather than limitation the scope of the present invention.
As shown in figure 1, the coating structure for plating nickel-chrome part to the present invention below illustrates, base material of the present invention can here
With using metal, plastics and other parts that can be applicable plating.
Constructive embodiment 1
The plating nickel-chrome part of the present embodiment, the part include：Base material 1 (ABS materials)；Pretreatment coating 2 includes chemical nickel
Layer 809, bottoming nickel dam 808 and copper plate 3, electroless nickel layer 809 are deposited on whole base material 1, and bottoming nickel dam 808 is deposited on chemistry
On nickel dam 809, formed with copper plate 3 on bottoming nickel dam 808；With basal layer 6, it is formed on copper plate 3；With functional layer 4,
It is formed on basal layer 6, and wherein functional layer 4 includes low potential nickel dam 141 and micropore nickel dam 142, wherein low potential nickel dam 141
For high-sulfur nickel dam, micropore nickel dam 142 is formed on low potential nickel dam 141；With decorative layer 802, it is formed at micropore nickel dam 142
On, wherein decorative layer is the white layers of chrome of trivalent.
Constructive embodiment 2
The plating nickel part of the present embodiment, the part include：Base material 1 (ABS materials)；Pretreatment coating 2 includes electroless nickel layer
809th, bottoming nickel dam 808 and copper plate 3, electroless nickel layer 809 are deposited on whole base material 1, and bottoming nickel dam 808 is deposited on chemical nickel
On layer 809, formed with copper plate 3 on bottoming nickel dam 808；With basal layer 6, it is formed on copper plate 3；With functional layer 4, its
It is formed on basal layer 6, wherein functional layer 4 includes low potential nickel dam 141 and micropore nickel dam 142, and wherein low potential nickel dam 141 is
Micro-crack nickel dam, micropore nickel dam 142 are formed on low potential nickel dam 141；With decorative layer 802, it is formed at micropore nickel dam 142
On, wherein decorative layer is the white layers of chrome of trivalent.
Constructive embodiment 3
The plating nickel part of the present embodiment, the part include：Base material 1 (ABS materials)；Basal layer 2 include electroless nickel layer 809,
Bottoming nickel dam 808 and copper plate 3, electroless nickel layer 809 are deposited on whole base material 1, and bottoming nickel dam 808 is deposited on electroless nickel layer
On 809, formed with copper plate 3 on bottoming nickel dam 808；With basal layer 6, it is formed on copper plate 3；With functional layer 4, its shape
Into on basal layer 6, wherein functional layer 4 includes low potential nickel dam 141 and micropore nickel dam 142, and wherein low potential nickel dam 141 is height
Sulphur nickel dam and micro-crack nickel dam (can be that high-sulfur nickel dam is formed on copper plate 3, micro-crack nickel dam is formed on high-sulfur nickel dam；
Can also be that micro-crack nickel dam is formed on copper plate 3, high-sulfur nickel dam is formed on micro-crack nickel dam), micropore nickel dam 142 is formed
In on low potential nickel dam 141；With decorative layer 802, it is formed on micropore nickel dam 142, and wherein decorative layer is the white layers of chrome of trivalent.
The unique of constructive embodiment 4-6 and constructive embodiment 1-3 differs only in：Pretreatment coating 2 includes bottoming nickel dam
808 and copper plate 3, bottoming nickel dam 808 is deposited on whole base material 1, formed with copper plate 3 on bottoming nickel dam 808.
The unique of constructive embodiment 7-9 and constructive embodiment 1-3 differs only in：Pretreatment coating 2 includes electroless nickel layer
809 and copper plate 3, electroless nickel layer 809 is deposited on whole base material 1, formed with copper plate 3 in electroless nickel layer 809.
The unique of constructive embodiment 10-12 and constructive embodiment 1-3 differs only in：In the absence of coating 2 is pre-processed, directly
Formed with copper plate 3 on base material 1.
The unique of constructive embodiment 13-24 and constructive embodiment 1-12 differs only in：Decorative layer 802 is sexavalence layers of chrome.
The unique of constructive embodiment 25-36 and constructive embodiment 1-12 differs only in：Decorative layer 802 is the black chromium of trivalent
Layer.
The unique of constructive embodiment 37-72 and constructive embodiment 1-36 differs only in：Base material 1 is pp materials.
The unique of constructive embodiment 73-108 and constructive embodiment 1-36 differs only in：Base material 1 is nylon material；
The unique of constructive embodiment 109-144 and constructive embodiment 1-36 differs only in：Base material 1 is pc materials；
The unique of constructive embodiment 145-180 and constructive embodiment 1-36 differs only in：Base material 1 is pet materials；
The unique of constructive embodiment 181-216 and constructive embodiment 1-36 differs only in：Base material 1 is bakelite material；
The unique of constructive embodiment 217-252 and constructive embodiment 1-36 differs only in：Base material 1 be cast iron (including and
It is not limited to grey cast-iron, white cast-iron, spheroidal graphite cast-iron, vermicular cast iron, malleable cast iron and alloy cast iron etc.) material；
The unique of constructive embodiment 253-288 and constructive embodiment 1-36 differs only in：Base material 1 is that steel is (including each
Kind ordinary steel, stainless steel etc.) and aluminum alloy material, magnesium alloy material；
The material of base material 1 employed in technical solution of the present invention can also be it is other can be used for being coated with its surface copper,
The material of nickel, chrome plating.
The solvent of solution is that water (includes but not limited to distilled water, deionization unless otherwise indicated in the embodiment of the present invention
Water, low-hardness water etc.), concentration is with the solution measures of unit volume or quality.
The base material of following examples part preferably uses ABS materials.
Prepare embodiment 1-5
The manufacture method of the plating nickel part of an embodiment of the present invention is as follows, and the surface of base material is pre-processed into (pre- place
Reason in turn includes the following steps：Surface degreasing, surface hydrophilic processing, surface coarsening processing, surface neutralisation treatment, preimpregnation, table
Face activation process, the processing of surface dispergation)；Pretreatment coating (including chemical sinking nickel and bottoming nickel) is deposited over the whole substrate,
The electroless nickel layer and bottoming nickel dam being sequentially outwardly formed by substrate surface, and copper plate is formed at pretreatment coating (bottoming nickel
Layer is outer) on；It is formed at by basal layer on copper plate, basal layer here is semi-gloss nickel dam, full light nickel dam and Sha Ding nickel dams, half
Light nickel dam is formed on copper plate, and full light nickel dam is formed on semi-gloss nickel dam, and husky fourth nickel dam is formed on full light nickel dam；With by work(
Low potential layer in ergosphere is formed on the full light nickel dam of basal layer, and low potential nickel dam is high-sulfur nickel dam here；With by functional layer
In micropore nickel dam be formed on high-sulfur nickel dam；It is formed at by decorative layer on micropore nickel dam, decorative layer here is white for trivalent
Layers of chrome.
Potential difference between micropore nickel dam and high-sulfur nickel dam (low potential nickel dam) is respectively 10,20,30,40,50,60,70,
80th, 90,100,110, (embodiment 1-5 can be selected other arbitrary values in the range of 120mv any or 10-120 respectively
Different numerical value are potential difference between micropore nickel dam and low potential nickel dam in corresponding embodiment in 10-120, microporous nickel in each embodiment
Layer can also be identical with the potential difference between low potential nickel dam).Micropore nickel dam is to plate one layer in product surface uniformly and contain to whether there is
The nickel dam of several non-conductive particles and conductive particle, so that ABS substrate workpiece surface has high anticorrosive property energy, high hard
Degree, the advantages that high-wearing feature, binding force of cladding material is good, and brightness is high.
Nickel electric plating method comprises the following steps on above-mentioned part：
(1) surface degreasing：By ABS substrate in sodium hydroxide NaOH, sodium carbonate Na2CO3, sodium metasilicate Na2SiO3And surface
Cleaning treatment in the mixed solution of activating agent.In this step, the concentration proportioning of each component in different embodiments in mixed solution
It is shown in Table one.Surfactant is conventional surfactants such as dodecyl sodium sulfate, sodium stearyl sulfonate etc..
Table one
(2) surface hydrophilic is handled：Carried out in sulfuric acid and whole face agent mixed solution.Sulfuric acid and whole face agent be not in this step
Two are shown in Table with the concentration proportioning in embodiment：
Table two
(3) surface coarsening is handled：Carried out after degreasing in chromic anhybride CrO3 and sulfuric acid H2SO4 mixed liquors.In this step,
The concentration proportioning of chromic anhybride CrO3 and sulfuric acid H2SO4 in different embodiments is shown in Table three：
Table three
(4) surface neutralisation treatment：ABS substrate after surface coarsening is handled is put into the mixed solution of hydrochloric acid and hydrazine hydrate
Carry out.In this step, hydrochloric acid and hydrazine hydrate are shown in Table four in the concentration proportioning of different embodiments：
Table four
(5) surface presoaks：Base material after the neutralisation treatment of surface is carried out in hydrochloric acid solution, and in this step, hydrochloric acid solution exists
The concentration proportioning of different embodiments is shown in Table five：
Table five
(6) surface activation process：Surface activation process is carried out using colloid palladium solution after neutralization, salt in colloid palladium solution
Acid, palladium bichloride PdCl2With stannous chloride SnCl2Six are shown in Table in the concentration proportioning of different embodiments：
Table six
(7) surface dispergation is handled：In sulfuric acid H2SO4Carried out in solution.Sulfuric acid solution is in the dense of different embodiments in this step
Degree proportioning is shown in Table seven：
Table seven
(8) electroless nickel layer is plated：Containing nickel sulfate, sodium hypophosphite, sodium citrate C6H5Na3O7, ammonium chloride and ammoniacal liquor
Carried out in the mixed solution of (pH that ammoniacal liquor is used for adjusting solution is 8.6-9.2).In this step, each component is not in mixed solution
Eight are shown in Table with the concentration proportioning in embodiment.
Table eight
(9) bottoming nickel dam is plated：Containing aqueous sulfuric acid nickel2SO4-6H2O, aqueous nickel chloride NiCl2-6H2O, boric acid
H3BO3Carried out with the mixed solution of wetting agent.In this step, the concentration of each component in different embodiments is matched somebody with somebody in mixed solution
Than being shown in Table nine.Wetting agent is the NIMAC 32C WETTER such as the happy 62A thought or wheat dolantin in table nine.
Table nine
(10) copper plate：In copper sulphate CuSO4, sulfuric acid H2SO4, chlorion, leveling agent, walk agent and the mixing of open cylinder agent
Carried out in solution.In this step, each component is shown in Table ten in the concentration proportioning of different embodiments in mixed solution.Here leveling agent is
The happy 1560 sour copper additives series thought, the 1561 sour copper additives series that the agent that walks is thought for pleasure, open cylinder agent is the 1562 of happy think of
Sour copper additives series.
Table ten
(11) semi-gloss nickel dam is plated：In aqueous sulfuric acid nickel2SO4-6H2O, aqueous nickel chloride NiCl2-6H2O and boric acid H3BO3、
Semi-bright nickel primary brightener, semi-bright nickel second-class brightener, potential difference regulator and wetting agent mixed solution in carry out.This
In step, each component is shown in Table 11 respectively in the concentration proportioning of different embodiments in mixed solution.Here wetting agent is to think as happy
62A or wheat dolantin NIMAC 32C WETTER, semi-bright nickel primary brightener is the happy BTL MU thought or wheat dolantin
NIMAC SF DUCT, the TL-2 or the NIMAC SF LEVELER of wheat dolantin that semi-bright nickel second-class brightener is thought for pleasure, potential difference
Regulator is mended for the happy B thought or the NIMAC SF MAINTENANCE of wheat dolantin.
Table 11
(12) full light nickel dam is plated：In aqueous sulfuric acid nickel2SO4-6H2O, aqueous nickel chloride NiCl2-6H2O, boric acid H3BO3、
Carried out in the mixed solution of bright nickel softening agent, the agent of bright nickel key light and wetting agent.In this step, each component exists in mixed solution
The concentration proportioning of different embodiments is shown in Table 12 respectively.Here wetting agent is the NIMAC 32C such as the happy 62A thought or wheat dolantin
WETTER, bright nickel softening agent are the INDEX of NIMAC 14 of happy 63 or the wheat dolantin thought, and the agent of bright nickel key light is the happy 66E thought
Or the NiMac Chanllenger Plus of wheat dolantin.
Table 12
(13) husky fourth nickel dam is plated：In aqueous sulfuric acid nickel, aqueous nickel chloride, boric acid, auxiliary additive and Sha Ding nickel forming agents
Mixed solution in carry out.In this step, each component is shown in Table 13 respectively in the concentration proportioning of different embodiments in mixed solution.
Here auxiliary additive is happy Elpelyt pearlbrite carrier K4 or the Elpelyt carrier thought
Brightener H, husky fourth nickel forming agent are the happy Elpelyt pearlbrite additive K6AL thought.
Table 13
(14) high-sulfur nickel dam (low potential layer) is plated：In aqueous sulfuric acid nickel, aqueous nickel chloride, boric acid, high sulfur additives and profit
Carried out in the mixed solution of humectant.In this step, each component is shown in Table respectively in the concentration proportioning of different embodiments in mixed solution
14.Here wetting agent is the NIMAC 32C WETTER such as the happy 62A thought or wheat dolantin.
Table 14
(15) micropore nickel dam is plated：In aqueous sulfuric acid nickel, aqueous nickel chloride, boric acid, nickel envelope brightener, nickel envelope key light agent and nickel
Seal in the mixed solution of particulate vector and carry out.In this step, concentration proportioning point of each component in different embodiments in mixed solution
It is not shown in Table 15.Here nickel envelope brightener is the 63 of happy think of；Nickel envelope key light agent is the happy 610CFC thought；Nickel envelope particulate vector is pleasure
The ENHANCER of think of.
Table 15
(16) the white layers of chrome of trivalent (decorative layer) is plated：In aqueous chromium chloride, potassium formate, ammonium bromide, ammonium chloride, potassium chloride, second
Sour sodium, boric acid, wetting agent mixed solution in carry out.In this step, each component in different embodiments dense in mixed solution
Degree proportioning is shown in Table 16.Here wetting agent is the NIMAC 32C WETTER such as the happy 62A thought or wheat dolantin.
Table 16
Embodiment CASS made above experiment reach 96-120h and more than, fluorgypsum experiment then reaches stable more than 336h.
Prepare embodiment 6-10 and differed only in preparing the unique of embodiment 1-5, low potential nickel dam is fine fisssure lamina.Plating
Micro-crack nickel dam aqueous nickel chloride, acetic acid, PN-1A, PN-2A, wetting agent mixed solution in carry out.In this step, mixing
The concentration proportioning of each component in different embodiments is shown in Table 17 in solution.Here wetting agent is such as the happy 62A thought or wheat moral
Beautiful NIMAC 32C WETTER.
Table 17
Prepare embodiment 11-15 and differed only in preparing the unique of embodiment 1-5, low potential nickel dam includes high-sulfur nickel
Layer (each embodiment plating solution is accordingly sequentially referring to shown in table 14), micro-crack nickel dam (accordingly sequentially join by each embodiment plating solution
It is shown in Table shown in 17) it is compound between two layers.Now between fine fisssure lamina and high-sulfur nickel dam potential difference be 10,20,30,40,50,
60th, 70,80 any or 10-80 scopes arbitrary value mv.
Prepare embodiment 16-30 and differed only in preparing the unique of embodiment 1-15, decorative layer is sexavalence layers of chrome.Plating six
Valency layers of chrome is carried out in the mixed solution of chromic anhydride, sulfuric acid, decorative chromium brightener and chromium fog inhibitor.In this step, mixed solution
The concentration proportioning of middle each component in different embodiments is shown in Table 18.Here decorative chromium brightener is the happy 1120F thought or Japan
The 7000C of chemical metallization.
Table 18
Prepare embodiment 31-45 and differed only in preparing the unique of embodiment 1-15, decorative layer is trivalent black chromium coating.Plating
Trivalent black chromium coating is carried out in the mixed solution of aqueous chromium chloride, oxalic acid, ammonium acetate, ammonium chloride, boric acid and additive.This step
In, the concentration proportioning of each component in different embodiments is shown in Table 19 in mixed solution.
Table 19
Prepare embodiment 46-90 and differed only in preparing the unique of embodiment 1-45, basal layer is included by copper plate table
Semi-gloss nickel dam (each embodiment plating solution is accordingly sequentially referring to shown in table 11), high-sulfur nickel dam and the Sha Ding that face is sequentially outwardly formed
Nickel dam (each embodiment plating solution is accordingly sequentially referring to shown in table 13).Plate high-sulfur nickel dam aqueous sulfuric acid nickel, aqueous nickel chloride,
Carried out in the mixed solution of boric acid, high sulfur additives and wetting agent.In this step, each component is in different embodiments in mixed solution
Concentration proportioning be shown in Table 20 respectively.Here wetting agent is the NIMAC 32C WETTER such as the happy 62A thought or wheat dolantin.
Table 20
Prepare embodiment 91-135 and differed only in preparing the unique of embodiment 1-45, basal layer is included by copper plate table
The semi-gloss nickel dam (each embodiment plating solution is accordingly sequentially referring to shown in table 11) and full light nickel dam (each reality that face is sequentially outwardly formed
A plating solution is applied accordingly sequentially referring to shown in table 12).
Prepare embodiment 136-180 and differed only in preparing the unique of embodiment 1-45, basal layer is included by copper plate
The semi-gloss nickel dam (each embodiment plating solution is accordingly sequentially referring to shown in table 11) and husky fourth nickel dam that surface is sequentially outwardly formed are (each
Embodiment plating solution is accordingly sequentially referring to shown in table 13).
Prepare embodiment 181-225 and differed only in preparing the unique of embodiment 1-45, basal layer is included by copper plate
Semi-gloss nickel dam (each embodiment plating solution is accordingly sequentially referring to shown in table 11) that surface is sequentially outwardly formed, high-sulfur layer (each reality
Apply a plating solution accordingly sequentially referring to shown in table 20) and full light nickel dam (each embodiment plating solution is accordingly sequentially referring to table 12
It is shown).
Prepare embodiment 226-450 and differed only in preparing the unique of embodiment 1-225, nickel envelope brightener is wheat dolantin
The INDEX of NIMAC 14；Nickel envelope key light agent is the NIMAC 33 of wheat dolantin；Nickel envelope particulate vector is the NiMac of wheat dolantin
Hypore XL dispersants.
Prepare embodiment 451-900 and differed only in preparing the unique of embodiment 1-450, plating micropore nickel plating bath also includes
(dosage in embodiment on micropore powder particles can select arbitrary value to micropore powder particles 0.3-0.8ml/L here：
0.3、0.32、0.33、0.34、0.37、0.39、0.4、0.42、0.43、0.44、0.47、0.49、0.5、0.52、0.53、0.54、
0.57th, 0.59,0.6,0.62,0.63,0.64,0.67,0.69,0.7,0.72,0.73,0.74,0.77,0.79,0.8), it is happy to think
618；(dosage in embodiment on wetting agent can select arbitrary value to wetting agent 1.0-3.0ml/L here：1、
1.2nd, 1.3,1.4,1.7,1.9,2,2.2,2.3,2.4,2.7,2.9,3.0), the happy 62A thought.
Prepare embodiment 901-1350 and differed only in preparing the unique of embodiment 451-900, plated in micropore nickel plating bath
Micropore powder particles are the NiMac Hypore XL pulvis of wheat dolantin；Wetting agent is the NIMAC 32C WETTER of wheat dolantin.
Prepare embodiment 1351-2700 and differed only in preparing the unique of embodiment 1-1350, pretreatment coating is to change
Learn nickel dam (each embodiment plating solution is accordingly sequentially referring to shown in table eight).
Prepare embodiment 2701-4050 and differed only in preparing the unique of embodiment 1-1350, pretreatment coating is to beat
Bottom nickel dam (each embodiment plating solution is accordingly sequentially referring to shown in table nine).
Prepare embodiment 4051-5400 and differed only in preparing the unique of embodiment 1-1350, substrate surface is not present
Coating is pre-processed, copper plate is formed directly into substrate surface.
PN-1A, PN-2A are Atotech (China) Chemical Co., Ltd. commercially available prod in embodiment made above.
In summary all embodiments, it can be seen that all embodiments of technical solution of the present invention are reached by CASS experiments
96-120h and the above (prior art is then proposed as 40-48h), fluorgypsum experiment then reach stable more than 336h (prior art institutes
Obtained product is then unstable, can not carry out quantization signifying).
In technical solution of the present invention base material can also use include but not limited to PC, PP, nylon, PET, bakelite and cast iron,
Made of material including the materials such as steel, aluminium alloy, magnesium alloy.When selecting other base materials in addition to ABS, coating is pre-processed
Selection can be carried out according to the performance and process requirements of actual material has pretreatment coating or without pretreatment coating.
The corruption obtained such as Fig. 3 for the plating nickel part sample obtained by one embodiment of the invention after 72h CASS experiments
State diagram is lost, is obtained with Fig. 2 for the plating nickel part sample of prior art after 72h CASS experiments (under equal experiment condition)
Etch state figure, can be intuitive to see by contrast, existing sample exist after the test substantial amounts of plating exfoliation and
Caused corrosion vacancy 21, has severely impacted the quality of product coating after corrosion.Fig. 3 then can be seen that what the present invention obtained
Nickel plating sample then only exists a number of surface micropore 31 on surface, and section is shown, equally only exists less corruption
Etch pit caused by pit 32, either surface micropore and sacrifice layer is all without the coating structure that can destroy part, not shadow
Ring the use of product and attractive in appearance.
Fig. 4 and Fig. 5 then nickel plating respectively obtained by the plating nickel part sample of prior art and one embodiment of the invention
(circle is internal in figure is divided into experiment to sample surfaces etch state figure of the part sample after fluorgypsum tests (336h, 336h, 168h)
Region), it can be seen from the figure that, the plating nickel part sample surfaces of prior art are and of the invention by different degrees of corrosion
The sample arrived is then very slight by extent of corrosion, does not change colour substantially.As can be seen here, unquestionable technical solution of the present invention
Obtained plating nickel part has more excellent coating stability and corrosion resistance so that plating nickel part is more durable, attractive in appearance.
By Fig. 6 and Fig. 7 coating potential diagram then it can be seen from the present invention program, no matter low potential layer be simple layer or
Person's lamination layer structure, it is using low potential nickel dam as sacrifice layer when being corroded, low potential nickel dam is high-sulfur nickel dam and micro-crack
During the composite bed of nickel dam, the height of high-sulfur nickel dam and the current potential of micro-crack nickel dam is adjusted with actual production technique, Ke Yishi
High-sulfur nickel dam potential is slightly higher or micro-crack nickel dam potential is slightly higher.
As shown in figure 8, the mechanism when plating nickel part that the present invention program obtains is corroded is：It is in ABS substrate in figure
Electroless nickel layer 809, bottoming nickel dam 808, copper plate 3, basal layer 6, low potential nickel dam 141, micropore nickel dam are formed on 810 layer by layer
142 and decorative layer 802.Corrosive medium 801 is in the microcellular structure distributed erosion electric current and entrance low potential nickel dam of micropore nickel dam 142
141 (reduce the area of actual participation corrosion, have less corroded area, form multiple independent hot spots, so as to scattered corruption
Electric current is lost, delays corrosion rate), after corrosion forms erosional surface 805, run into after erosional surface 805 runs through low potential nickel dam 141
Stop longitudinal direction corrosion after the basal layer 6 and copper plate 3 of high potential, be changed into lateral encroaching until whole low potential nickel dam 141 is rotten
It has been lost that, can just carry out the corrosion of next step, until coating structure is integrally destroyed.
, equally all will in the present invention in place of this place embodiment is to the claimed non-limit of technical scope midrange
In the range of asking protection.
Technological means disclosed in the present invention program is not limited only to the technological means disclosed in above-mentioned technological means, in addition to
Formed technical scheme is combined by above technical characteristic.Above is the embodiment of the present invention, it is noted that right
For those skilled in the art, under the premise without departing from the principles of the invention, some improvement can also be made
And retouching, these improvements and modifications are also considered as protection scope of the present invention.
Claims (11)
1. plating nickel-chrome part, the part includes：
Base material；
Pre-process coating, it is deposited over the whole substrate, wherein pretreatment coating include electroless nickel layer, bottoming nickel dam it is any or
The two is compound；With
Copper plate, it is formed on pretreatment coating；With
Basal layer, it is formed on copper plate, and wherein basal layer is semi-gloss nickel dam, full light nickel dam and Sha Ding nickel dams；With
Functional layer, it is formed on basal layer, and wherein functional layer includes low potential nickel dam and is formed at micro- on low potential nickel dam
Hole nickel dam, the potential difference between the micropore nickel dam and low potential nickel dam are described low potential nickel dam in the range of 10-120mv
It is micro- when the low potential nickel dam is using micro-crack and high-sulfur nickel composite deposite for high-sulfur nickel dam and micro-crack nickel dam composite deposite
Potential difference is in 10-80mv between crackle nickel and high-sulfur nickel；With
Decorative layer, it is formed on micropore nickel dam, and the decorative layer is any of trivalent chrome plating or sexavalence chrome plating.
2. plating nickel-chrome part according to claim 1, it is characterised in that：The decorative layer is trivalent chrome plating, described three
Valency chrome plating is the white chrome plating of trivalent or trivalent black chromium plating.
3. plating nickel-chrome part according to claim 1, it is characterised in that：Between the micropore nickel dam and low potential nickel dam
Potential difference in the range of 20-100mv.
4. plating the manufacture method of nickel-chrome part, this method comprises the following steps：
The surface of base material is pre-processed；
Pretreatment coating is deposited over the whole substrate, and copper plate is formed on pretreatment coating；With
Basal layer is formed on copper plate；Wherein basal layer is semi-gloss nickel dam, full light nickel dam and Sha Ding nickel dams；With
Low potential nickel dam in functional layer is formed on basal layer；With
Functional layer, it is formed on basal layer, and wherein functional layer includes low potential nickel dam and is formed at micro- on low potential nickel dam
Hole nickel dam, the potential difference between the micropore nickel dam and low potential nickel dam are described low potential nickel dam in the range of 10-120mv
It is micro- when the low potential nickel dam is using micro-crack and high-sulfur nickel composite deposite for high-sulfur nickel dam and micro-crack nickel dam composite deposite
Potential difference is in 10-80mv between crackle nickel and high-sulfur nickel；With
Decorative layer is formed on micropore nickel dam, the decorative layer is any of trivalent chrome plating or sexavalence chrome plating.
5. the manufacture method of plating nickel-chrome part according to claim 4, it is characterised in that：The decorative layer is trivalent chromium
Coating, the trivalent chrome plating are the white chrome plating of trivalent or trivalent black chromium plating.
6. the manufacture method of plating nickel-chrome part according to claim 4, it is characterised in that：Described micropore nickel dam uses
The nickel plating bath plating of plating micropore forms, and it is (addition in unit volume plating solution) that the plating micropore nickel plating bath, which includes composition and concentration,：
Aqueous sulfuric acid nickel 300-350g/L, aqueous nickel chloride 50-60g/L, boric acid 40-50g/L, nickel envelope brightener 6-12ml/L, nickel envelope
Key light agent 4-7.5ml/L, nickel envelope particle 0.2-1.5g/L, nickel envelope particle dispersants 0.5-3ml/L, wetting agent 1-5ml/L.
7. the manufacture method of plating nickel-chrome part according to claim 5, it is characterised in that：Described decorative layer is trivalent
White chrome plating, the white chrome plating of trivalent are formed using the white chromium plating solution plating of plating trivalent, and the white chromium plating solution of trivalent includes composition
It is with concentration：Aqueous chromium chloride 90-150g/L, potassium formate 50-100g/L, ammonium bromide 8-25g/L, ammonium chloride 40-60g/L, chlorine
Change potassium 40-100g/L, sodium acetate 10-60g/L, boric acid 40-80g/L, wetting agent 0.5-2.5ml/L.
8. the manufacture method of plating nickel-chrome part according to claim 5, it is characterised in that：Described decorative layer is trivalent
Black chromium plating, the trivalent black chromium plating are formed using the black chromium plating solution plating of plating trivalent, and the black chromium plating solution of trivalent includes composition
It is with concentration：Aqueous chromium chloride 150-250g/L, oxalic acid 2-5g/L, ammonium acetate 3-10g/L, ammonium chloride 20-40g/L, boric acid 20-
41g/L, additive 0.5-3g/L.
9. the manufacture method of plating nickel-chrome part according to claim 4, it is characterised in that：Described decorative layer is sexavalence
Chrome plating, the sexavalence chrome plating are formed using the plating solution plating of plating Cr VI, and the Cr VI plating solution includes composition and concentration is：
Chromic anhydride 260-360g/L, sulfuric acid 0.5-3g/L, decorative chromium brightener 1-4g/L, chromium fog inhibitor 0.1-0.4ml/L.
10. the manufacture method of plating nickel-chrome part according to claim 6, it is characterised in that：Described micro-crack nickel dam is adopted
Formed with plating micro-crack nickel plating solution plating, the plating micro-crack nickel plating solution includes composition and concentration is：Aqueous nickel chloride：180-
260g/L, acetic acid：10-40ml/L, PN-1A：40-90g/L, PN-2A：1-5ml/L, wetting agent：1-5ml/L.
11. the manufacture method of plating nickel-chrome part according to claim 6, it is characterised in that：Described high-sulfur nickel dam uses
The nickel plating bath plating of plating high-sulfur forms, and the plating high-sulfur nickel plating bath includes composition and concentration is：Aqueous sulfuric acid nickel 250-350g/L, contains
Water nickel chloride 35-60g/L, boric acid 35-65g/L, high sulfur additives 3-10ml/L, wetting agent 0.5-3ml/L.
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| CN104775143A (en) * | 2015-03-11 | 2015-07-15 | 嘉兴敏惠汽车零部件有限公司 | Multilayer ultra corrosion resistant nickel-chromium plating part and manufacturing method thereof |
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| CN105696041A (en) * | 2016-04-08 | 2016-06-22 | 苏州市美能五金镀饰有限公司 | Hardware chromium plating technology |
| CN106521591A (en) * | 2016-11-10 | 2017-03-22 | 无锡市明盛强力风机有限公司 | Nickel plating method for plastic for automobiles |
| CN107313101B (en) * | 2017-06-08 | 2019-06-18 | 华南理工大学 | A kind of environment-friendly nickel seal-the preparation method of chromium-free passivation layer |
| CN108425917A (en) * | 2018-03-30 | 2018-08-21 | 芜湖强振汽车紧固件有限公司 | A kind of automobile-used fastener constructions improving antiseptic property |
| CN110219028B (en) * | 2019-06-27 | 2021-06-25 | 九牧厨卫股份有限公司 | High-blackness matte metal black composite coating and preparation method thereof |
| CN111020647B (en) * | 2019-12-20 | 2020-10-30 | 常州极太汽车配件有限公司 | Composition for surface treatment of aluminum flexible connection |
| CN111910230B (en) * | 2020-07-15 | 2021-08-06 | 九牧厨卫股份有限公司 | Antibacterial black chromium surface coating and preparation method thereof |
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| JP2741126B2 (en) * | 1991-12-16 | 1998-04-15 | 荏原ユージライト株式会社 | Nickel-chrome plated products |
| US6468672B1 (en) * | 2000-06-29 | 2002-10-22 | Lacks Enterprises, Inc. | Decorative chrome electroplate on plastics |
| JP4494310B2 (en) * | 2005-08-05 | 2010-06-30 | 柿原工業株式会社 | Film formation method for copper-free resin plating |
| EP2396455B1 (en) * | 2009-02-13 | 2018-10-24 | Nissan Motor Co., Ltd. | Chrome-plated part and manufacturing method of the same |
| CN104775143B (en) * | 2015-03-11 | 2020-08-18 | 嘉兴敏惠汽车零部件有限公司 | Multilayer super corrosion resistant nickel-chromium plated component and method of making same |
| CN204640958U (en) * | 2015-03-11 | 2015-09-16 | 嘉兴敏惠汽车零部件有限公司 | Nickel plating-chromium parts |
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