MY142899A - Method for producing plated molded product - Google Patents

Method for producing plated molded product

Info

Publication number
MY142899A
MY142899A MYPI20020502A MYPI20020502A MY142899A MY 142899 A MY142899 A MY 142899A MY PI20020502 A MYPI20020502 A MY PI20020502A MY PI20020502 A MYPI20020502 A MY PI20020502A MY 142899 A MY142899 A MY 142899A
Authority
MY
Malaysia
Prior art keywords
molded product
plating
layer
forming
electroplating
Prior art date
Application number
MYPI20020502A
Inventor
Ichiro Hayashi
Kazuhiro Miyokai
Original Assignee
Taiyo Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001041029A external-priority patent/JP3685999B2/en
Priority claimed from JP2001192023A external-priority patent/JP3722724B2/en
Priority claimed from JP2001322754A external-priority patent/JP3710408B2/en
Application filed by Taiyo Mfg Co Ltd filed Critical Taiyo Mfg Co Ltd
Publication of MY142899A publication Critical patent/MY142899A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/04—Electroplating: Baths therefor from solutions of chromium
    • C25D3/06—Electroplating: Baths therefor from solutions of chromium from solutions of trivalent chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)

Abstract

A METHOD FOR PRODUCING A PLATED MOLDED PRODUCT IS PROVIDED, IN WHICH A SURFACE OF A MOLDED PRODUCT HAVING A THIN PORTION OBTAINED BY COINJECTION MOLDING OF RESIN IS SUBJECTED TO PLATING. A SURFACE OF A MOLDED PRODUCT HAVING A THIN PORTION OBTAINED BY HIGH-SPEED INJECTION MOLDING OF RESIN IS PLATED BY STEPS: ( A ) FORMING A METAL PLATING LAYER ON A SURFACE OF THE MOLDED PRODUCT BY ELECTROLESS PLATING; ( B ) FORMING A COPPER PLATING LAYER ON A SURFACE OF THE ELECTROLESS PLATING LAYER BY ELECTROPLATING; ( C ) FORMING A NICKEL LAYER ON A SURFACE OF THE COPPER PLATING LAYER BY ELECTROPLATING; AND ( D ) FORMING A CHROMIUM OR CHROMIUM ALLOY LAYER ON A SURFACE OF THE NICKEL LAYER BY ELECTROPLATING . EVEN FOR A MOLDED PRODUCT HAVING A THIN PORTION OBTAINED BY HIGH-SPEED INJECTION MOLDING, A PLATING WHICH RESISTS REMOVAL CAN BE OBTAINED. FURTHER, EVEN WHEN A PLATING IS FORMED ON A SATIN-FINISHED SURFACE, THE PLATING CAN REPRODUCE THE SATIN-FINISHED SURFACE.
MYPI20020502A 2001-02-16 2002-02-14 Method for producing plated molded product MY142899A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001041029A JP3685999B2 (en) 2001-02-16 2001-02-16 Manufacturing method of plated molded products
JP2001192023A JP3722724B2 (en) 2001-06-25 2001-06-25 Manufacturing method of plated molded products
JP2001322754A JP3710408B2 (en) 2001-10-19 2001-10-19 Manufacturing method of plated molded products

Publications (1)

Publication Number Publication Date
MY142899A true MY142899A (en) 2011-01-31

Family

ID=27346013

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI20080007A MY148983A (en) 2001-02-16 2002-02-14 Method for producing plated molded product
MYPI20020502A MY142899A (en) 2001-02-16 2002-02-14 Method for producing plated molded product

Family Applications Before (1)

Application Number Title Priority Date Filing Date
MYPI20080007A MY148983A (en) 2001-02-16 2002-02-14 Method for producing plated molded product

Country Status (5)

Country Link
EP (1) EP1360347A2 (en)
CN (1) CN100360716C (en)
MY (2) MY148983A (en)
TW (1) TW554086B (en)
WO (1) WO2002064862A2 (en)

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* Cited by examiner, † Cited by third party
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JP2004256876A (en) * 2003-02-26 2004-09-16 Taiyo Manufacturing Co Ltd Method of producing plated molding
JP2004327306A (en) * 2003-04-25 2004-11-18 Sunarrow Ltd Multicolored molded resin component for mobile apparatus
CN100431080C (en) * 2005-04-29 2008-11-05 乐金电子（昆山）电脑有限公司 Press button module and its producing method
EP1876268B1 (en) 2006-06-13 2013-05-15 Wolf-Dieter Franz Black chromium process free of Cr-VI
KR101136180B1 (en) * 2006-06-14 2012-04-17 엘지전자 주식회사 Component for preventing static electricity and manufacturing method the same
CN101210334B (en) * 2006-12-29 2010-04-21 佛山市顺德区汉达精密电子科技有限公司 Technique for treating plastic surface
CN101246989A (en) * 2007-02-15 2008-08-20 上海安费诺永亿通讯电子有限公司 Antenna production method and antenna structure
US8763173B2 (en) * 2008-09-26 2014-07-01 Kohler Co. Stainless steel plumbing fixtures with resistant coatings
US20120156443A1 (en) * 2010-12-15 2012-06-21 David Reeder Methods of multi-shot injection molding and metal-plated surface coated polymeric articles made therefrom
US9062386B2 (en) 2011-03-01 2015-06-23 Srg Global, Inc. Methods of multi-shot injection molding and metal-plated polymeric articles made therefrom
FR2985741B1 (en) 2012-01-12 2015-05-29 Albea Services GOLD OR SILVER METALLIC SILVER PLASTIC PRODUCT FREE OF GOLD AND SILVER ELEMENT AND PROCESS FOR MANUFACTURING SAME.
CN104073846B (en) * 2014-06-25 2016-05-18 陕西华夏粉末冶金有限责任公司 The corronil sheet part preparation method of a kind of electrodeposited resin, atmosphere reduction
CN104626448A (en) * 2015-01-15 2015-05-20 温兵 Manufacturing process of shell
DE102015109506B4 (en) * 2015-06-15 2018-12-20 Dr. Schneider Kunststoffwerke Gmbh Method for selective metallization of plastic parts and component
CN108683762B (en) * 2018-05-22 2021-07-06 Oppo广东移动通信有限公司 Decorative ring, functional assembly, electronic device and processing method of decorative ring

Family Cites Families (20)

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NL111001C (en) * 1957-12-03
DE2113244C3 (en) * 1970-03-16 1984-05-17 Photocircuits Division of Kollmorgen Corp., Glen Cove, N.Y. Process for the direct metallization of exposed areas on an insulating material having an epoxy resin surface
US3655433A (en) * 1970-07-06 1972-04-11 Standard Oil Co Platable polymers
US3689303A (en) * 1970-12-21 1972-09-05 Crown City Plating Co Process for electroless plating of abs resins
US4002595A (en) * 1973-12-27 1977-01-11 E. I. Du Pont De Nemours And Company Electroplatable polypropylene compositions
US4038042A (en) * 1975-12-18 1977-07-26 E. I. Du Pont De Nemours And Company Electroplating of polypropylene compositions
US4199491A (en) * 1977-12-23 1980-04-22 Idemitsu Kosan Company Limited Polyolefin resin composition
GB2109816B (en) * 1981-11-18 1985-01-23 Ibm Electrodeposition of chromium
US4466865A (en) * 1982-01-11 1984-08-21 Omi International Corporation Trivalent chromium electroplating process
EP0102133A3 (en) * 1982-03-26 1985-04-10 General Electric Company Metallized article composed of polyphenylene ether resin, high impact polystyrene, alumina and, optionally, a styrene-butadiene radial teleblock copolymer
US4395313A (en) * 1982-07-29 1983-07-26 General Motors Corporation Vacuum pretreatment process for durable electroplated coatings on ABS and PPO plastics
FR2544341A1 (en) * 1983-04-15 1984-10-19 Rhone Poulenc Rech METHOD FOR METALLIZING ELECTRICALLY INSULATING FLEXIBLE FILMS AND ARTICLES OBTAINED
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JPS60155257A (en) * 1984-09-14 1985-08-15 住友ノ−ガタツク株式会社 Plated product
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CA2051604A1 (en) * 1991-09-17 1993-03-18 Guy St-Amant Plastic-mounted strips fabricated by vacuum deposition and cladding
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JP3785548B2 (en) * 1998-06-01 2006-06-14 ユケン工業株式会社 Hexavalent chromium and fluorine-free chemical conversion treatment agent
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Also Published As

Publication number Publication date
CN100360716C (en) 2008-01-09
WO2002064862A3 (en) 2003-08-28
MY148983A (en) 2013-06-28
CN1527892A (en) 2004-09-08
WO2002064862A2 (en) 2002-08-22
TW554086B (en) 2003-09-21
EP1360347A2 (en) 2003-11-12

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