JP2003258442A - Electronic device housing and its processing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for processing a housing of an electronic device which has a feeling of metal and exhibits high corrosion resistance. <P>SOLUTION: The housing of the electronic device includes a plastic housing, aluminum, aluminum coating layer and a layer of oxides formed on the surface of an aluminum or an aluminum alloy coating layer. Its processing method includes a step (1) for injection-molding a plastic housing, a step (2) for forming an aluminum or an aluminum alloy coating layer on the surface of the plastic housing by thermal spraying, and a step (3) for anodizing the surface of the plastic housing having the aluminum or aluminum alloy plating layer. By the method, a housing for an electronic device which has a feeling of metal and exhibits high corrosion resistance can be obtained. For obtaining a housing for an electronic device having necessary colors or patterns, a coloring process can be performed following the anodizing process. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device housing and a method of processing the same, and more particularly to an electronic device housing having a metallic feeling, good corrosion resistance, and a colorful and pattern, and a method of processing the same.

[0002]

2. Description of the Prior Art The prior art has decided to deposit a metal layer on the surface of a plastic housing, usually by a plastic plating method, to obtain the metallic feeling. For example, USP6
045,866. However, in the plating of plastics, only inactive metals such as copper and nickel can be plated, but inactive metals such as aluminum are difficult to plate. Further, the plating of plastic is complicated in technology itself, has a low production rate, and is expensive. In order to solve the above problems, USP5
660 and 934 are a kind of thermal spraying method (Thermal S
Although a method of forming a metal layer on the surface of a plastic product through the plating has been disclosed, the metal layer on the surface of the plastic product is in direct contact with the external environment, and thus is prone to corrosion. Moreover, the color of the metal layer obtained by the above method is single and the decorative effect is not sufficient.

[0003]

In view of the above, the present invention provides an electronic device housing and a method of processing the same, thereby providing an electronic device housing having a metallic feel and good corrosion resistance. The purpose is to It is another object of the present invention to provide an electronic device housing and a method for processing the same so that an electronic device having a surface with a required color or pattern can be obtained.

[0004]

An electronic device housing includes a plastic housing, an aluminum or aluminum alloy coating layer, and an oxide layer formed on the surface of the aluminum or aluminum alloy coating layer. The housing is processed by the following steps (1) injection-molding a plastic housing, and (2) forming an aluminum or aluminum alloy coating layer on the surface of the plastic housing by a thermal spraying method. 3) Including steps such as anodizing the surface of a plastic housing having an aluminum or aluminum alloy plating layer. By the method described above, an electronic device housing having a metallic feel and good corrosion resistance can be obtained. Further, in order to obtain an electronic device casing having a required color or pattern, it is also possible to carry out anodizing by the above-mentioned processing method and then continue coloring.

[0005]

The electronic device housing of the present invention comprises a plastic housing, an aluminum or aluminum alloy coating layer,
Alternatively, it includes an oxide layer formed on the surface of the aluminum or aluminum alloy coating layer. In the present invention,
The plastic housing is made of ABS material or AB
It is a composite of S material and other plastic materials. The processing method of the electronic device housing is as follows: (1) injection molding a plastic housing; and (2) forming a coating layer of aluminum or aluminum alloy on the surface of the plastic housing by a thermal spraying method. And (3) anodizing the surface of the plastic housing to anodize the surface of the plastic housing having an aluminum or aluminum alloy coating layer. In the step (2), the injection-molded plastic housing is cleaned and sandblasted to further improve the connection with the subsequent aluminum or aluminum alloy coating layer.

The silica sand grain size adopted in the above sandblasting is 1 to 3 mm, and the surface roughness of the plastic housing after sandblasting is 4 to 15 μm.

In addition, as the heat spraying technique of the second step (2), a wire arc spraying method, a powder plasma spraying method, or a high velocity oxygen fuel (High Velocity Oxy-F) is used.
uel) Spraying can be adopted. When spraying, the spray tip of the spray gun that is loaded with aluminum or aluminum alloy powder is 150 ~
Placed at a distance of 350 mm, 0.1 to 0.
Aluminum or aluminum alloy powder having a thickness of 4 mm is sprayed on the surface of the plastic housing, and the surface of the plastic housing is sprayed with an aluminum or aluminum alloy coating layer of 0.8 to 1.2 mm. Then, the aluminum or aluminum alloy coating layer is mechanically ground and then polished. The step (3) of the processing method will be described in detail with reference to the following examples.

[0008]

Example 1 The polished casing is chemically degreased,
After washing with water, it is chemically treated and washed again with water. The pretreated housing is then placed in an electrolytic solution, such as a mixed solution of sulfuric acid and Sulfosalicylic Acid, and treated in an electrolyzer with direct current. The concentration of the sulfuric acid is 0.1 to 1 w
t%, the concentration of sulfosalicyl is 10 to 20 wt%, the current density is 1 to 4 A / dm ² , and the voltage of the direct current is 40 to
The treatment is performed at 80 V for 15 minutes to 1 hour until a colored oxide film having a thickness of 3 to 30 μm is formed on the surface of the casing. Finally, the housing having the oxide film is subjected to a sealing treatment.

[0009]

Example 2 The polished case is chemically degreased,
After washing with water, electrolytic treatment or chemical polishing is performed and washing with water is performed again. Next, the pretreated case is put in an electrolytic solution such as sulfuric acid, and anodized by an electrolyzer that conducts direct current. The concentration of the sulfuric acid is 150-
20000 g / L, the DC voltage is 12 to 20 V,
The current density is 1 to ^{2 A} / dm ² , the treatment time is 15 minutes to 1 hour, and the treatment is performed until the thickness of the oxide film becomes 3 to 30 μm. Finally, a sealing process is performed on the housing having the oxide film.

In Example 2 described above, the casing after anodization is colored before the sealing treatment to obtain a color or pattern required for the casing, and the coloring treatment is adsorption coloring. Method (Adoptive Colo
ring), or may be subjected to electrolytic coloring in a metal salt electrolytic solution.

According to the above-described embodiment, an electronic device casing having a good metallic feeling and corrosion resistance can be obtained, and a necessary color or pattern can be obtained on the surface thereof.

[0012] In general, the "electronic device housing and its processing method" of the present invention meets the requirements of the patent application.
Should be registered by law. It should be noted that the above is merely specific examples of the present application and does not limit the scope of the claims of the present invention, and any modifications or changes in details that can be made based on the present invention belong to the scope of the claims of the present invention. And

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) C25D 11/04 305 C25D 11/04 305 11/22 11/22 AF term (reference) 4D075 AA18 AA82 AA85 BB02Z BB67Z BB83Y BB89Z BB91Y BB92Y CA33 CB13 DA23 DB35 DB37 DB43 DC18 DC21 EA02 EA15 EB01 EC10 4E360 AB02 EE02 EE12 EE13 EE15 GA51 GC08 4K031 AA08 AB11 CB01 BB10 BB17 BB10 BB11 BB01 BB04A16 AB16 BB01 BB04A16 BB01 BB04B16A16 FA04 AA4 AB16 CB13A04

Claims (15)

[Claims] 1. An electronic device casing comprising a plastic housing, an aluminum or aluminum alloy layer, and an oxide layer formed on the surface of the aluminum or aluminum alloy layer. 2. The plastic housing is ABS.
The electronic device housing according to claim 1, wherein the electronic device housing is made of a material. 3. The plastic housing is ABS
The electronic device housing according to claim 1, wherein the electronic device housing is a composite of a material and another plastic material. 4. A step of (1) injection molding a plastic housing, and (2) a step of forming an aluminum or aluminum alloy coating layer on the surface of the plastic housing by a thermal spraying method (Thermal Spraying). ) For the surface of the plastic housing having an aluminum or aluminum alloy coating layer (Ano
a method of processing an electronic device casing, the method comprising: 5. A wire arc (W
The method of processing an electronic device casing according to claim 4, wherein an ir Arc) spraying method is adopted. 6. A powder plasma (P
5. The method for processing an electronic device casing according to claim 4, wherein an upper plasma spraying method is adopted. 7. The high-velocity oxygen fuel (H) is used as the heat spraying method.
5. The method for processing an electronic device housing according to claim 4, wherein a high velocity oxy-fuel spraying method is adopted. 8. A spray gun loaded with aluminum or aluminum alloy powder for the thermal spraying is placed at a position 150 to 350 mm away from the plastic housing, and each spraying thickness is set to 0.1 to 0.4 mm. The method for processing an electronic device housing according to claim 5, 6, or 7. 9. The electronic device according to claim 8, wherein the thermal spraying is performed until a coating layer of aluminum or aluminum alloy having a thickness of 0.6 to 1.2 mm is formed on the surface of the plastic housing. How to process the housing. 10. The electronic device casing according to claim 9, wherein after spraying an aluminum or aluminum alloy coating layer onto the plastic housing, the aluminum or aluminum alloy coating layer is mechanically ground and polished. How to process the body. 11. A sealing treatment (Sea) for the plastic housing after the anodization.
11. The method for processing an electronic device housing according to claim 10, wherein the processing is performed by a Ling Treatment. 12. A step of (1) injection molding a plastic housing, and (2) a step of forming an aluminum or aluminum alloy coating layer on the surface of the plastic housing by a thermal spraying method (Thermal Spraying). 3) Anodize the surface of the plastic housing having an aluminum or aluminum alloy coating layer (A
and a step of (4) coloring the plastic housing after the anodization, the method for processing an electronic device casing. 13. The method of processing an electronic device casing according to claim 12, wherein the coloring treatment adopts an adsorption coloring method to color the plastic housing after anodizing. 14. The method of processing an electronic device casing according to claim 12, wherein the coloring treatment adopts an electrolytic coloring method to color the plastic housing after anodizing. 15. After the coloring, a sealing process is further performed on the plastic housing.
Treatment) is performed.
The method for processing an electronic device casing according to claim 3 or claim 14.