CN106242314A - A kind of glass copper-plating technique - Google Patents
A kind of glass copper-plating technique Download PDFInfo
- Publication number
- CN106242314A CN106242314A CN201610710798.8A CN201610710798A CN106242314A CN 106242314 A CN106242314 A CN 106242314A CN 201610710798 A CN201610710798 A CN 201610710798A CN 106242314 A CN106242314 A CN 106242314A
- Authority
- CN
- China
- Prior art keywords
- glass
- copper
- plating technique
- conductive paint
- spraying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3649—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer made of metals other than silver
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3655—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating containing at least one conducting layer
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of glass copper-plating technique, described glass copper-plating technique is: needs copper-plated region spraying conductive paint at glass surface, forms conductive layer, then on the surface of conductive layer, glass is carried out copper facing.The invention have the benefit that one glass copper-plating technique of the present invention, use the surface spraying conductive paint at glass, it is achieved the copper-plating technique to glass, technique is simple, production cost is low.Glass copper-plating technique of the present invention, before spraying conductive paint, does not do any chemical treatment to the surface of glass, cleans glass surface with tap water, it is ensured that the integrity of glass surface, turn avoid the residual of chemical substance and then affect its conductive effect.When glass surface spraying conductive paint, treat that conductive paint carries out copper facing the most again, it is ensured that the surface sprayed is uniform, smooth, it is ensured that make whole film continuous uniform reach good electric conductivity in the copper-plated uniformity of glass surface.
Description
Technical field
The present invention relates to inorganic material coating preparation field, be specifically related to a kind of glass copper-plating technique.
Background technology
In process of glass, add colored elements produce stained glass and surface spraying coloring matter and prepare organic
Films etc., can greatly enrich the surface decoration effect of glass, but these can't resolve the surface conductance performance of glass, metallic luster and
Mirror effect, uses ion plating method, cathode sputtering etc. to produce the output investment ratio of coated glass relatively big, and technique is loaded down with trivial details, produce into
This height.
At present, when the Electroless copper of glass, first the solution of glass NaOH, KOH or HF is carried out table
Face roughening treatment, then after the activation processing of palladium solution, the surface of glass will activate, carries out chemical plating the most again
Copper, through the coating technique such as light-sensitive surface, etching, obtains circuit on glass.But, such coarsing processing method, the most very
The rare copper plate good to adhesive strength.Additionally, due to the activation processing of palladium, palladium residual on glass or ceramic substrate,
Affect the insulation resistance between copper conductor, sometimes also need to be removed the process of residual palladium, more complicated.
Chinese patent CN 104561944 A discloses the electroless copper plating method of a kind of glass, ceramic substrate, and the method is:
Preparation zinc powder, mantoquita and the suspended viscous solution with alcohol as solvent of Lac, be uniformly coated with described viscous solution and invest glass or pottery
Surface, through 80～120 DEG C, within 5～15 minutes, dry, then through 300～600 DEG C, after the high temperature sintering of 10～30 minutes processes
Film forming, carries out electroless copper on the surface of described film.But method of the present invention needs high-temperature process, complex steps, operation
Complicated.
Summary of the invention
It is an object of the invention to provide that a kind of technique is simple, low cost, and the electric conductivity of the glass produced is relatively good
Glass copper-plating technique.
A kind of glass copper-plating technique, described glass copper-plating technique is, needs the spraying of copper-plated region to lead at glass surface
Electricity paint, forms conductive layer, then on the surface of conductive layer, glass is carried out copper facing.When glass surface spraying conductive paint, paper using
Or cloth covers need not copper-plated glass surface, its position is prevented to be sprayed onto conductive paint, after conductive paint spray, then
Remove paper or cloth.Owing to conductive paint is a kind of paint that can be used for spraying, it is dried the work that can play conduction after forming paint film
With, by conductive paint spray on the surface of glass, the surface of such glass just has the performance of conduction, i.e. can be on the surface of glass
Electroplate.
Further, before glass surface spraying conductive paint, glass is carried out and is dried.If the surface at glass
Remain impurity, the electric conductivity of conductive paint may be affected, so before spraying conductive paint, needing the surface of glass is entered
Row cleans.
Further, described cleaning is for clean up glass surface with tap water, and described dry temperature is 80-120
DEG C, the time being dried is 60-90min.Glass is done dried, for ensureing the spraying effect of spraying conductive paint, even if conduction
Paint can be sprayed on the surface of glass equably.
Further, the glass of spraying conductive paint is dried process, then copper facing.When spraying conductive paint, will prepare
Conductive paint for spraying stirs, and directly can be carried out spraying after stirring, and regards workpiece and select spray during spraying
Rifle, uses wet shot mode, and ensures that sprayed surface is uniform, smooth in spraying, the position of difficulty spraying is suitably added spray, it is ensured that
Whole film continuous uniform reaches good electric conductivity.
Further, described dry temperature is 60-70 DEG C, and the time being dried is 50-70min.
Further, the thickness of described conductive layer is 0.3-0.5mm.Walk rifle during spraying and want uniformly, it is ensured that the surface of spraying
Smooth, not dusting, thickness want consistent.
Further, described conductive paint comprises copper microgranule and silver microgranule.
Further, the liquid that crosses that described copper facing uses is copper sulfate, and using copper as anode.When copper facing, with copper sulfate
For plating solution, copper sulfate crosses liquid mainly copper sulfate, sulphuric acid and water, and copper sulfate is copper ion (Cu2+) source, when being dissolved in the water
Can dissociate copper ion, copper ion can reduce (obtaining electronics) depositing on the electrically conductive and become metallic copper, it is achieved the copper facing to glass.
Negative electrode dominant response: Cu2+(aq)+2e-→Cu(s)
Certainly, the copper ion concentration that electroplating process crosses in bath declines because of consumption, so using copper to make anode when plating,
The effect of anode is mainly conductor, is connected by circuit loop, and uses copper to make anode, and copper oxidized (losing electronics) is dissolved into copper
Ion, thus supplement and cross the consumption of copper ion in liquid.
Anode dominant response: Cu (s) → Cu2+(aq)+2e-
The invention have the benefit that one glass copper-plating technique of the present invention, use the surface spraying conductive paint at glass,
Realizing the copper-plating technique to glass, technique is simple, production cost is low.Glass copper-plating technique of the present invention, in spraying conduction
Before paint, any chemical treatment is not done on the surface of glass, cleans glass surface with tap water, it is ensured that glass surface
Integrity, turn avoid the residual of chemical substance and then affects its conductive effect.
When glass surface spraying conductive paint, treat that conductive paint carries out copper facing the most again, it is ensured that the surface sprayed uniformly,
Smooth, it is ensured that to make whole film continuous uniform reach good electric conductivity in the copper-plated uniformity of glass surface.
Detailed description of the invention
Embodiment one
A kind of glass copper-plating technique, described glass copper-plating technique is, it would be desirable to copper-plated glass tap water cleans dry
Only, then under conditions of 80 DEG C, being dried process, the time of dried is 60min, and dried is for ensureing spraying
The spraying effect of conductive paint, i.e. ensures that conductive paint can be sprayed on the surface of glass equably；After Gan Zaoing, paper using or cloth is not to
Need copper-plated glass surface to cover, prevent its position to be sprayed onto conductive paint, then spray conductive paint, spraying at glass surface
During conductive paint, first conductive paint is stirred, the most directly carry out spraying, during spraying, use the mode of wet shot to spray
It is coated with, and suitably adds spray at difficult japanning position, it is ensured that whole film continuous uniform reaches good electric conductivity；As the most excellent
The scheme of choosing, the conductive paint used is containing copper microgranule and the conductive paint of silver microgranule；After conductive paint spray, then remove
Paper and cloth, be then dried the glass scribbling conductive paint under conditions of 60 DEG C, and the time being dried is 50min, has been dried
Obtaining conductive layer after Biing, here the thickness of conductive layer is 0.3mm, then on the surface of conductive layer, glass is carried out copper facing.
When copper facing, with copper sulfate as plating solution, copper sulfate crosses liquid mainly copper sulfate, sulphuric acid and water, copper sulfate be copper from
Son (Cu2+) source, copper ion can be dissociated when being dissolved in the water, copper ion can reduce (obtaining electronics) depositing on the electrically conductive
Become metallic copper, it is achieved the copper facing to glass.
Negative electrode dominant response: Cu2+(aq)+2e-→Cu(s)
Certainly, the copper ion concentration that electroplating process crosses in bath declines because of consumption, so using copper to make anode when plating,
The effect of anode is mainly conductor, is connected by circuit loop, and uses copper to make anode, and copper oxidized (losing electronics) is dissolved into copper
Ion, thus supplement and cross the consumption of copper ion in liquid.
Anode dominant response: Cu (s) → Cu2+(aq)+2e-
Embodiment two
A kind of glass copper-plating technique, described glass copper-plating technique is, it would be desirable to copper-plated glass tap water cleans dry
Only, then under conditions of 100 DEG C, being dried process, the time of dried is 70min, and dried is for ensureing spray
It is coated with the spraying effect of conductive paint, i.e. ensures that conductive paint can be sprayed on the surface of glass equably；After Gan Zaoing, paper using or cloth pair
Need not copper-plated glass surface cover, prevent its position to be sprayed onto conductive paint, then spray conductive paint, spray at glass surface
When being coated with conductive paint, first conductive paint is stirred, the most directly carry out spraying, during spraying, use the mode of wet shot to spray
It is coated with, and suitably adds spray at difficult japanning position, it is ensured that whole film continuous uniform reaches good electric conductivity；As the most excellent
The scheme of choosing, the conductive paint used is containing copper microgranule and the conductive paint of silver microgranule；After conductive paint spray, then remove
Paper and cloth, be then dried the glass scribbling conductive paint under conditions of 65 DEG C, and the time being dried is 60min, has been dried
Obtaining conductive layer after Biing, here the thickness of conductive layer is 0.4mm, then on the surface of conductive layer, glass is carried out copper facing.
When copper facing, with copper sulfate as plating solution, copper sulfate crosses liquid mainly copper sulfate, sulphuric acid and water, copper sulfate be copper from
Son (Cu2+) source, copper ion can be dissociated when being dissolved in the water, copper ion can reduce (obtaining electronics) depositing on the electrically conductive
Become metallic copper, it is achieved the copper facing to glass.
Negative electrode dominant response: Cu2+(aq)+2e-→Cu(s)
Certainly, the copper ion concentration that electroplating process crosses in bath declines because of consumption, so using copper to make anode when plating,
The effect of anode is mainly conductor, is connected by circuit loop, and uses copper to make anode, and copper oxidized (losing electronics) is dissolved into copper
Ion, thus supplement and cross the consumption of copper ion in liquid.
Anode dominant response: Cu (s) → Cu2+(aq)+2e-
Embodiment three
A kind of glass copper-plating technique, described glass copper-plating technique is, it would be desirable to copper-plated glass tap water cleans dry
Only, then under conditions of 120 DEG C, being dried process, the time of dried is 90min, and dried is for ensureing spray
It is coated with the spraying effect of conductive paint, i.e. ensures that conductive paint can be sprayed on the surface of glass equably；After Gan Zaoing, paper using or cloth pair
Need not copper-plated glass surface cover, prevent its position to be sprayed onto conductive paint, then spray conductive paint, spray at glass surface
When being coated with conductive paint, first conductive paint is stirred, the most directly carry out spraying, during spraying, use the mode of wet shot to spray
It is coated with, and suitably adds spray at difficult japanning position, it is ensured that whole film continuous uniform reaches good electric conductivity；As the most excellent
The scheme of choosing, the conductive paint used is containing copper microgranule and the conductive paint of silver microgranule；After conductive paint spray, then remove
Paper and cloth, be then dried the glass scribbling conductive paint under conditions of 70 DEG C, and the time being dried is 70min, has been dried
Obtaining conductive layer after Biing, here the thickness of conductive layer is 0.5mm, then on the surface of conductive layer, glass is carried out copper facing.
When copper facing, with copper sulfate as plating solution, copper sulfate crosses liquid mainly copper sulfate, sulphuric acid and water, copper sulfate be copper from
Son (Cu2+) source, copper ion can be dissociated when being dissolved in the water, copper ion can reduce (obtaining electronics) depositing on the electrically conductive
Become metallic copper, it is achieved the copper facing to glass.
Negative electrode dominant response: Cu2+(aq)+2e-→Cu(s)
Certainly, the copper ion concentration that electroplating process crosses in bath declines because of consumption, so using copper to make anode when plating,
The effect of anode is mainly conductor, is connected by circuit loop, and uses copper to make anode, and copper oxidized (losing electronics) is dissolved into copper
Ion, thus supplement and cross the consumption of copper ion in liquid.
Anode dominant response: Cu (s) → Cu2+ (aq)+2e-
The present invention is not limited to above-mentioned preferred forms, and anyone can show that under the enlightenment of the present invention other are various
The product of form, no matter but in its details, make any change, every have same as the present application or akin technical scheme,
Within all falling within protection scope of the present invention.
Claims (8)
1. a glass copper-plating technique, it is characterised in that described glass copper-plating technique is: need copper-plated district at glass surface
Territory spraying conductive paint, forms conductive layer, then on the surface of conductive layer, glass is carried out copper facing.
Glass copper-plating technique the most according to claim 1, it is characterised in that before glass surface spraying conductive paint, to glass
Glass is carried out and is dried.
Glass copper-plating technique the most according to claim 2, it is characterised in that described cleaning is with tap water, glass surface is clear
Wash clean, described dry temperature is 80-120 DEG C, and the time being dried is 60-90min.
Glass copper-plating technique the most according to claim 1, it is characterised in that the glass of spraying conductive paint is dried place
Reason, then copper facing.
The most according to claim 4, glass copper-plating technique, it is characterised in that described dry temperature is 60-70 DEG C, be dried
Time is 50-70min.
Glass copper-plating technique the most according to claim 1, it is characterised in that the thickness of described conductive layer is 0.3-0.5mm.
Glass copper-plating technique the most according to claim 1, it is characterised in that described conductive paint comprises copper microgranule and silver microgranule.
Glass copper-plating technique the most according to claim 1, it is characterised in that the liquid that crosses that described copper facing uses is copper sulfate, and
Using copper as anode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610710798.8A CN106242314A (en) | 2016-08-23 | 2016-08-23 | A kind of glass copper-plating technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610710798.8A CN106242314A (en) | 2016-08-23 | 2016-08-23 | A kind of glass copper-plating technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106242314A true CN106242314A (en) | 2016-12-21 |
Family
ID=57595970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610710798.8A Pending CN106242314A (en) | 2016-08-23 | 2016-08-23 | A kind of glass copper-plating technique |
Country Status (1)
| Country | Link |
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| CN (1) | CN106242314A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115418686A (en) * | 2022-11-07 | 2022-12-02 | 深圳创智芯联科技股份有限公司 | Through hole high-depth copper electroplating solution for glass substrate and copper electroplating process thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09230107A (en) * | 1995-12-22 | 1997-09-05 | Toto Ltd | Anti-fogging glass lens and its anti-fogging method |
| CN1944718A (en) * | 2006-07-17 | 2007-04-11 | 昆明亘宏源科技有限公司 | New process for electroplating non-metal material surface and its special conductive paint |
| CN101824637A (en) * | 2009-03-06 | 2010-09-08 | 佛山市顺德区锐新科屏蔽材料有限公司 | Novel environmentally-friendly electroplating method for non-conductor |
| CN104561944A (en) * | 2015-02-11 | 2015-04-29 | 广德宏霞科技发展有限公司 | Electroless copper plating method for glass or ceramic substrate |
-
2016
- 2016-08-23 CN CN201610710798.8A patent/CN106242314A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09230107A (en) * | 1995-12-22 | 1997-09-05 | Toto Ltd | Anti-fogging glass lens and its anti-fogging method |
| CN1944718A (en) * | 2006-07-17 | 2007-04-11 | 昆明亘宏源科技有限公司 | New process for electroplating non-metal material surface and its special conductive paint |
| CN101824637A (en) * | 2009-03-06 | 2010-09-08 | 佛山市顺德区锐新科屏蔽材料有限公司 | Novel environmentally-friendly electroplating method for non-conductor |
| CN104561944A (en) * | 2015-02-11 | 2015-04-29 | 广德宏霞科技发展有限公司 | Electroless copper plating method for glass or ceramic substrate |
Non-Patent Citations (3)
| Title |
|---|
| "《印刷电路制造工艺》" * |
| 曾华梁等: "《电镀工艺手册》", 31 August 1997, 北京：机械工业出版社 * |
| 朱晓云等: "《有色金属特种功能粉体材料制备技术及应用》", 31 October 2011, 北京：冶金工业出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115418686A (en) * | 2022-11-07 | 2022-12-02 | 深圳创智芯联科技股份有限公司 | Through hole high-depth copper electroplating solution for glass substrate and copper electroplating process thereof |
| CN115418686B (en) * | 2022-11-07 | 2023-01-10 | 深圳创智芯联科技股份有限公司 | Through hole high-depth copper electroplating solution for glass substrate and copper electroplating process thereof |
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Application publication date: 20161221 |
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