CN104164684B - A kind of method of oxygen-free copper plating nickel on surface - Google Patents
A kind of method of oxygen-free copper plating nickel on surface Download PDFInfo
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- CN104164684B CN104164684B CN201410255499.0A CN201410255499A CN104164684B CN 104164684 B CN104164684 B CN 104164684B CN 201410255499 A CN201410255499 A CN 201410255499A CN 104164684 B CN104164684 B CN 104164684B
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Abstract
The invention discloses a kind of methods of oxygen-free copper plating nickel on surface, including carrying out blasting treatment to oxygen-free copper matrix surface, then pre-processed again, activation process is carried out by acid and alkaline solution and to surface of steel plate, it is being electroplated, is being changed by the alternating for controlling current density size and electroplated, the product surface thickness of coating drawn is uniform, quality is high, has good market prospects.
Description
Technical field
The present invention relates to a kind of electric plating method, more particularly to a kind of method of oxygen-free copper plating nickel on surface.
Background technology
In modern industrial production, metal plating is widely applied by people, chemical industry application research chemical plating
Nickel technology replaces expensive corrosion resistant alloy to solve etching problem, and to improve the purity of chemical products, environmental protection improves behaviour
Make security and the reliability of production and transport, so as to obtain more favourable Technological Economy competitiveness.It is familiar and often make
Metallic nickel plated layer may generally serve as the intermediate deposit (outer layer is mostly chrome plating) or overlay coating of copper or copper and iron matrix, with
Improve the protective and dicoration of base metal.Prior art nickel-phosphorus alloy coating there are dispersibility it is poor the defects of, i.e., low electricity
The problem of current density area plating leakage, and electroplated in existing electronickelling using constant current density, the direct shadow of current density
After loud is exactly coating deposition rate, and current density is big, and deposition velocity is fast, on the contrary then slow, but current density is big, coating
Meeting is rougher or even can burn, and influences appearance and antiseptic property.Therefore how improving electroplating efficiency and improving electroplating quality becomes
The problem of one very big.
The content of the invention
To solve the above problems, the invention discloses a kind of methods of oxygen-free copper plating nickel on surface.
In order to achieve the above object, the present invention provides following technical solution：A kind of method of oxygen-free copper plating nickel on surface, including
Following steps：（1）, with the quartz sand of 120~160 mesh blasting treatment is carried out to oxygen-free copper matrix surface；（2）, by oxygen-free copper
Matrix, which is immersed in the alkaline cleaning fluid of pH10-12, impregnates 3-6min, carries out surface clean, removes the greasy dirt on surface, electrolysis finishes
It is rinsed afterwards with clear water；（3）, will oxygen-free copper matrix immerse acid flux material in clean, remove the oxide-film on its surface,
Oxygen-free copper matrix is put into clear water after pickling and is cleaned up；（4）, will treated that oxygen-free copper matrix activates through step 3
Processing, is rinsed well after being disposed with clear water again；（5）, oxygen-free copper matrix is put into electroplating solution and is electroplated, it is described
Electroplating solution include following ingredient：Concentration is 120g/L-250g/L nickel sulfates, concentration is 280g/L-360g/L amino sulphurs
The boric acid that nickel chloride that sour nickel, concentration are 15g/L-25g/L, concentration are 20g/L, the solution temperature are 35-70 DEG C, electric current
Density is 5-10A/dm2With 40-55A/dm2Between alternately, alternate frequency be 0-30 times, wherein low current density and high current is close
The time ratio of degree is 1:2-2:3, electroplating time 15min-20min；（6）, by the oxygen-free copper matrix deionization in step 5
Water rinses；（7）, oxygen-free copper matrix in step 6 is sent into the baking oven of vacuum and is dried, the temperature control of baking oven exists
480-600℃。
As a modification of the present invention, the concentration ratio between the nickel sulfate and the nickel sulfamic acid is 1:2-
2:3.As a modification of the present invention, the acid flux material in the step 3 is the mixture of dust technology and dilute sulfuric acid,
The concentration ratio of middle dust technology and dilute sulfuric acid is 1:1-1:2.
It is by oxygen-free copper to the step of oxygen-free copper matrix progress activation process in step 4 as a modification of the present invention
Matrix, which is put into the mixed solution of stearic acid, neopelex, to be impregnated, and wherein soaking time is 5-8min.
A kind of oxygen-free copper matrix nickel plating process provided by the invention, of low cost, operating procedure is simple, the efficiency of nickel plating
Height, and the nickel layer of the product of obtained nickel plating is uniform, corrosion-resistant, wear resistance, coating surface is smooth, is not likely to produce crackle, tool
There is vast market prospect.
Specific embodiment
Technical solution provided by the invention is described in detail below with reference to specific embodiment, it should be understood that following specific
Embodiment is only illustrative of the invention and is not intended to limit the scope of the invention.
Embodiment 1：A kind of method of oxygen-free copper plating nickel on surface, includes the following steps：（1）, with the quartz sand pair of 120 mesh
Oxygen-free copper matrix surface carries out blasting treatment；（2）, will oxygen-free copper matrix immerse pH10 alkaline cleaning fluid in impregnate 3min, into
Row surface clean removes the greasy dirt on surface, is rinsed after electrolysis with clear water；（3）, oxygen-free copper matrix immersed into dilute nitre
The mixture of acid and dilute sulfuric acid, the wherein concentration ratio between dust technology and dilute sulfuric acid are 1:1 removes the oxide-film on its surface, pickling
Oxygen-free copper matrix is put into clear water afterwards and is cleaned up；（4）, will treated that oxygen-free copper matrix is carried out at activation through step 3
Reason, oxygen-free copper matrix is put into the mixed solution of stearic acid, neopelex and is impregnated, wherein soaking time is
5min is rinsed well after being disposed with clear water again；（5）, oxygen-free copper matrix is put into electroplating solution and is electroplated, it is described
Electroplating solution include following ingredient：Concentration is 140g/L nickel sulfates, concentration is 280g/L nickel sulfamic acids, concentration 15g/
The nickel chloride of L, the boric acid that concentration is 20g/L, the solution temperature are 35 DEG C, and the density of electric current is 5A/dm2With 40A/dm2Between
Alternately, alternate frequency is 20 times, and wherein the time ratio of low current density and high current density is 1:2, electroplating time 15min；
（6）, by the oxygen-free copper matrix deionized water rinsing in step 5；（7）, the oxygen-free copper matrix in step 6 is sent into vacuum
It is dried in baking oven, the temperature of baking oven is controlled at 480 DEG C.
It is by oxygen-free copper to the step of oxygen-free copper matrix progress activation process in step 4 as a modification of the present invention
Matrix, which is put into the mixed solution of stearic acid, neopelex, to be impregnated, and wherein soaking time is 5-8min.
Embodiment 2：
A kind of method of oxygen-free copper plating nickel on surface, includes the following steps：（1）, it is copper-based to anaerobic with the quartz sand of 140 mesh
Body surface face carries out blasting treatment；（2）, oxygen-free copper matrix is immersed in the alkaline cleaning fluid of pH11 and impregnate 4min, it is clear to carry out surface
It washes, removes the greasy dirt on surface, be rinsed after electrolysis with clear water；（3）, oxygen-free copper matrix immersed into dust technology and dilute sulphur
The mixture of acid, the wherein concentration ratio between dust technology and dilute sulfuric acid are 1:1.5 remove the oxide-film on its surface, by nothing after pickling
Oxygen Copper substrate, which is put into clear water, to be cleaned up；（4）, activation process will be carried out through step 3 treated oxygen-free copper matrix, by nothing
Oxygen Copper substrate, which is put into the mixed solution of stearic acid, neopelex, to be impregnated, and wherein soaking time is 7min, is located
It is rinsed well again with clear water after reason；（5）, oxygen-free copper matrix is put into electroplating solution and is electroplated, the plating is molten
Liquid includes following ingredient：The chlorination that concentration is 180g/L nickel sulfates, concentration is 300g/L nickel sulfamic acids, concentration is 20g/L
Nickel, the boric acid that concentration is 20g/L, the solution temperature are 55 DEG C, and the density of electric current is 7A/dm2With 45A/dm2Between alternately, hand over
It it is 25 times for number, wherein the time ratio of low current density and high current density is 3:5, electroplating time 18min；（6）, will
Oxygen-free copper matrix deionized water rinsing in step 5；（7）, oxygen-free copper matrix in step 6 is sent into the baking oven of vacuum
It is dried, the temperature of baking oven is controlled at 520 DEG C.
Embodiment 3：
A kind of method of oxygen-free copper plating nickel on surface, includes the following steps：（1）, it is copper-based to anaerobic with the quartz sand of 160 mesh
Body surface face carries out blasting treatment；（2）, oxygen-free copper matrix is immersed in the alkaline cleaning fluid of pH12 and impregnate 6min, it is clear to carry out surface
It washes, removes the greasy dirt on surface, be rinsed after electrolysis with clear water；（3）, oxygen-free copper matrix immersed into dust technology and dilute sulphur
The mixture of acid, the wherein concentration ratio between dust technology and dilute sulfuric acid are 1:2 remove the oxide-film on its surface, by anaerobic after pickling
Copper substrate is put into clear water and cleans up；（4）, activation process will be carried out through step 3 treated oxygen-free copper matrix, handled
Bi Houzai is rinsed well with clear water；（5）, oxygen-free copper matrix is put into electroplating solution and is electroplated, the electroplating solution bag
Include following ingredient：It is concentration is 240g/L nickel sulfates, concentration is 360g/L nickel sulfamic acids, concentration is 25g/L nickel chloride, dense
The boric acid for 20g/L is spent, the solution temperature is 70 DEG C, and the density of electric current is 10A/dm2With 55A/dm2Between alternately, alternately time
Number is 30 times, and wherein the time ratio of low current density and high current density is 2:3, electroplating time 20min；（6）, by step 5
In oxygen-free copper matrix deionized water rinsing；（8）, oxygen-free copper matrix in step 6 is sent into the baking oven of vacuum and is dried
Dry, the temperature of baking oven is controlled at 600 DEG C.
A kind of oxygen-free copper matrix nickel plating process provided by the invention, of low cost, operating procedure is simple, the efficiency of nickel plating
Height, and the nickel layer of the product of obtained nickel plating is uniform, corrosion-resistant, wear resistance, coating surface is smooth, is not likely to produce crackle, tool
There is vast market prospect.
The technical means disclosed in the embodiments of the present invention is not limited only to the technological means disclosed in the above embodiment, further includes
Formed technical solution is combined by more than technical characteristic.
Claims (3)
- A kind of 1. method of oxygen-free copper plating nickel on surface, it is characterised in that：Include the following steps：（1）, with the quartz of 120~160 mesh Sand carries out blasting treatment to oxygen-free copper matrix surface；（2）, oxygen-free copper matrix is immersed in the alkaline cleaning fluid of pH 10-12 and is impregnated 3-6min carries out surface clean, removes the greasy dirt on surface, be rinsed after electrolysis with clear water；（3）, by oxygen-free copper matrix It immerses in acid flux material and is cleaned, remove the oxide-film on its surface, be put into clean in clear water by oxygen-free copper matrix after pickling and do Only；（4）, activation process will be carried out through step 3 treated oxygen-free copper matrix, rinsed well again with clear water after being disposed； （5）, oxygen-free copper matrix is put into electroplating solution and is electroplated, the electroplating solution include following ingredient：Concentration is 120 G/L-250 g/L nickel sulfates, concentration are 280 g/L-360g/L nickel sulfamic acids, concentration is 15 g/L-25 g/L nickel chloride, Concentration is the boric acid of 20 g/L, and the solution temperature is 35-70 DEG C, and the density of electric current is 5-10 A/dm2With 40-55A/dm2It Between alternately, alternate frequency be 20-30 time, wherein the time ratio of low current density and high current density be 1:2-2:3, electroplating time For 15min-20min；（6）, by the oxygen-free copper matrix deionized water rinsing in step 5；（7）, the anaerobic in step 6 is copper-based Body, which is sent into the baking oven of vacuum, is dried, and the temperature of baking oven is controlled at 480-600 DEG C；The step of carrying out activation process to oxygen-free copper matrix in step 4 is that oxygen-free copper matrix is put into stearic acid, detergent alkylate It is impregnated in the mixed solution of sodium sulfonate, wherein soaking time is 5-8min.
- 2. a kind of method of oxygen-free copper plating nickel on surface according to claim 1, it is characterised in that：The nickel sulfate and institute Concentration ratio between the nickel sulfamic acid stated is 1:2-2:3.
- 3. a kind of method of oxygen-free copper plating nickel on surface according to claim 1, it is characterised in that：In the step 3 Acid flux material is dust technology and the mixture of dilute sulfuric acid, and the wherein concentration ratio between dust technology and dilute sulfuric acid is 1:1-1:2.
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| CN106929888B (en) * | 2017-05-03 | 2018-12-14 | 上海电力学院 | A kind of preparation method of lamellar composite nanostructure nickel |
| CN109267115A (en) * | 2018-10-29 | 2019-01-25 | 江西凤凰光学科技有限公司 | A kind of copper components nickel plating process |
| CN109351290A (en) * | 2018-12-06 | 2019-02-19 | 中石化炼化工程（集团）股份有限公司 | Prevent backstop, its preparation process and the air inlet feed distributor of slurry oil adverse current |
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| CN101250727A (en) * | 2007-11-30 | 2008-08-27 | 南京师范大学 | Multifunctional composite electrochemical deposition liquid and method of use thereof |
| CN102080237A (en) * | 2009-11-30 | 2011-06-01 | 北京允升吉新技术有限公司 | Solution for nickel electroforming, electroforming method using solution and thin nickel plate manufactured by using method |
| CN103806074A (en) * | 2012-11-12 | 2014-05-21 | 无锡三洲冷轧硅钢有限公司 | Method for preparing Ni-W-nano CeF3 composite plating through direct current (DC) superposed pulse plating |
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| KR100560672B1 (en) * | 2003-08-30 | 2006-03-14 | 엘에스전선 주식회사 | surface treated copper foil and the preparation method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101250727A (en) * | 2007-11-30 | 2008-08-27 | 南京师范大学 | Multifunctional composite electrochemical deposition liquid and method of use thereof |
| CN102080237A (en) * | 2009-11-30 | 2011-06-01 | 北京允升吉新技术有限公司 | Solution for nickel electroforming, electroforming method using solution and thin nickel plate manufactured by using method |
| CN103806074A (en) * | 2012-11-12 | 2014-05-21 | 无锡三洲冷轧硅钢有限公司 | Method for preparing Ni-W-nano CeF3 composite plating through direct current (DC) superposed pulse plating |
Non-Patent Citations (1)
| Title |
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| "脉冲镀镍";刘伯生等，;《电镀与精饰》;19900401;第12卷(第3期);第4页左栏"二 试验方法"，第4-5页"三 结果与讨论"，图3~5，第8页右栏"四 结论" * |
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