CN110049625A - It is a kind of with gold-plated and immersion process PCB plate production method - Google Patents
It is a kind of with gold-plated and immersion process PCB plate production method Download PDFInfo
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- CN110049625A CN110049625A CN201910335616.7A CN201910335616A CN110049625A CN 110049625 A CN110049625 A CN 110049625A CN 201910335616 A CN201910335616 A CN 201910335616A CN 110049625 A CN110049625 A CN 110049625A
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- gold
- plated
- circuit board
- dry film
- multilayer circuit
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention provides a kind of with gold-plated and immersion process PCB plate production method, includes the following steps, preprocessing, obtains the multilayer circuit board with outer-layer circuit；Electroplating gold surface treatment；Remove lead；Change golden pre-treatment, anti-oxidant treatment and welding resistance are carried out respectively to multilayer circuit board；Chemical turmeric surface treatment；Pcb board is made in post-processing.It is provided by the present invention a kind of with gold-plated and immersion process PCB plate production method, after first carrying out electroplating gold surface treatment and removal lead technique on multilayer circuit board, the golden pre-treatment of progress again, anti-oxidant treatment and welding resistance are carried out to multilayer circuit board, carry out chemical turmeric surface treatment again later, such process flow both ensure that the product quality in gold-plated region, the product quality in also ensuring gold region, more effectively solve the problems, such as when electroplating gold surface treatment that lead seeps gold, at the same can in removal lead step fully erased lead.
Description
Technical field
The present invention relates to the processing technique fields of printed circuit board, more particularly, to a kind of with gold-plated and immersion process
PCB plate production method.
Background technique
With the continuous development of science and technology, also higher and higher for the performance requirement of printed circuit board.Therefore in order to meet PCB
Plate can reach various electrical performance requirements, not only need to carry out electroplating gold surface treatment in pcb board process, also simultaneously
Need chemical turmeric surface treatment to meet the design requirement on pcb board.And it is existing with gold-plated and immersion process pcb board
It is all to be carried out again on the multilayer circuit board for having made outer-layer circuit and solder mask gold-plated and change metal working in process
Skill.And thus, lead caused by graphic plating is covered by solder mask on the pcb board of working process, in the etching of subsequent lead
It can not completely remove, be unable to reach the technique requirement of existing pcb board.And due to the influence of solder mask, in gold plating process, resistance
Difference of height easy to form between layer and lead, dry film can not cover whole plate, and lead is caused to seep gold, when subsequent lead etches
It can not completely remove, lead to short circuit or generate spun gold, and then influence the product quality of pcb board whole plate.
Summary of the invention
Existing in gold-plated and immersion process pcb board process it is an object of the invention to solve, lead can not
Completely remove and lead at seep gold the shortcomings that leading to shorted leads pcb board whole plate quality, providing a kind of have gold-plated and changes gold
The PCB plate production method of technique.
The technical solution used to solve the technical problems of the present invention is that: it is a kind of with gold-plated and immersion process pcb board system
Make method, which comprises the following steps:
S1: the multilayer circuit board with outer-layer circuit is made in preprocessing, and the outer-layer circuit is equipped with drawing with lead
Line region, the gold-plated region for plating and the non-gold-plated region without plating and for change gold change gold region and without change
The non-ization gold region of gold；
S2: the first dry film is arranged, and first dry film is in the plating in electroplating gold surface treatment on the multilayer circuit board
Golden region uplifting window exposes the gold-plated region, then carries out plating to the gold-plated region and forms Gold plated Layer, then
Remove the first dry film on the multilayer circuit board；
S3: the second dry film is arranged, and second dry film is in the lead areas in removal lead on the multilayer circuit board
Uplifting window exposes the lead areas, is then etched to the lead of the lead areas, then remove institute
State the second dry film on multilayer circuit board；
S4: change golden pre-treatment, anti-oxidant treatment and welding resistance are carried out respectively to the multilayer circuit board；
S5: third dry film is arranged, and the third dry film is described in chemical turmeric surface treatment on the multilayer circuit board
Changing golden region uplifting window exposes the golden region of describedization, then golden to the golden region progress of describedization, formationization layer gold,
The third dry film on the multilayer circuit board is removed again；
S6: post-processing carries out processing and forming to the multilayer circuit board and pcb board is made.
Further, in S4 step, the anti-oxidant treatment is to the non-gold-plated area on the multilayer circuit board
Domain is started the cleaning processing using antioxidant.
Further, in S4 step, the welding resistance is to carry out pickling to the multilayer circuit board whole plate, then to described
Non- gold-plated region and the golden region of non-ization use anti-solder ink, are formed in the non-gold-plated region and the golden region of non-ization
Anti-ization polishes layer of ink.
Further, further include that text adds roasting process in S2 step, the multilayer circuit board of windowing will have been completed
Baking inside oven is put into the mode of insert rack, and the baking temperature is 120 DEG C, and baking time is 20 minutes.
Further, in the S2 step, first dry film is acid resistance dry film, at the windowing of first dry film to
The gold-plated region extends 2mil.
Further, further include that text adds roasting process in S5 step, the multilayer circuit board of windowing will have been completed
Baking inside oven is put into the mode of insert rack, and the baking temperature is 120 DEG C, and baking time is 20 minutes.
Further, in S5 step, the third dry film is acid resistance dry film.
Further, in S5 step, further include to had been removed the multilayer circuit board of the third dry film into
The cleaning of rowization gold and change gold check.
Further, in the S3 step, second dry film is alkali resistance dry film.
Further, the preprocessing includes sawing sheet, drilling, whole plate plating, image transfer and graphic plating and figure
Etching step.
A kind of beneficial effect with gold-plated and immersion process PCB plate production method provided by the present invention is:
After first carrying out electroplating gold surface treatment and removal lead technique on multilayer circuit board, then the golden pre-treatment of progress, to multilayer line
Plate carries out anti-oxidant treatment and welding resistance, carries out chemical turmeric surface treatment again later, such process flow both ensure that plating
The product quality in the obtained gold-plated region of golden watch surface treatment also ensures the chemical golden region of turmeric surface treatment obtainedization
Product quality, while by welding resistance technique be set to electroplating gold surface treatment after carry out, avoid solder mask for outer layer
The covering of lead on figure, so that the lead at solder mask covering can not be cleaned out completely in removal lead portion, it can
To avoid short circuit caused by being not thorough due to lead removal, in turn for the more thorough of the lead cleaning on multilayer circuit board
The problem of influencing PCB whole plate quality.Meanwhile the welding resistance process is set to after electroplating gold surface treatment, can also be effectively resolved
When electroplating gold is surface-treated, the lead due to caused by difference in height seeps the problem of gold.
Detailed description of the invention
Fig. 1 is a kind of process flow chart with gold-plated and immersion process PCB plate production method provided by the invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Referring to Fig. 1, for a kind of technique stream with gold-plated and immersion process PCB plate production method provided by the present invention
Cheng Tu.As shown in Figure 1, to be provided by the present invention a kind of with gold-plated and immersion process PCB plate production method including following
Step:
S1: the multilayer circuit board with outer-layer circuit is made in preprocessing.Wherein, preprocessing includes sawing sheet, drilling, whole plate
Plating, image transfer and graphic plating and Etching step, specific as follows:
A: sawing sheet obtains core material according to the demand of pcb board, and processes to core material, after multiple processing
Core material carry out pressing form multilayer circuit board.
B: drilling drills out the via hole and tooling hole of each layer on multilayer circuit board.
C: whole plate plating, for thickening the copper thickness on multilayer circuit board in hole.
D: image transfer, by the pattern transfer to multilayer circuit board on the outer layer film in the way of film exposure, and
Outer-layer circuit is formed on multilayer circuit board.Outer-layer circuit is equipped with the lead areas with lead, the gold-plated area for plating
Domain and the golden region of change without the non-gold-plated region of plating and for changing gold and the non-ization gold region without changing gold.
E: graphic plating, the copper for thickening figure on multilayer circuit board are thick.
F: Etching is all removed copper point extra in outer-layer circuit and unwanted position with etching solution, will
The figure needed retains.
S2: the first dry film is arranged, and first dry film is in the plating in electroplating gold surface treatment on the multilayer circuit board
Golden region uplifting window exposes the gold-plated region, then carries out plating to the gold-plated region and forms Gold plated Layer, then
Remove the first dry film on the multilayer circuit board.It is specific as follows:
A: overlay film covers the first dry film on multilayer circuit board, and the first dry film is acid resistance dry film.
B: image transfer, in multilayer circuit board uplifting window, i.e., by the gold-plated region light transmission on multilayer circuit board, non-gold-plated area
Domain shading, after exposure and imaging, so that the gold-plated region on multilayer circuit board on the first dry film by exposing.Windowing
Afterwards, at the windowing of first dry film to gold-plated region extend 2mil, in this way can to have contraposition deviation when prevention technique exposure aligning,
Part other than gold-plated region especially lead areas is completely covered under the first dry film by the first dry film completely
Side.
C: text adds roasting, puts the mode of multilayer circuit board insert rack into inside oven baking, the baking temperature is 120
DEG C, baking time is 20 minutes, by text plus after baking, can reinforce the first dry film to the adhesive force of multilayer circuit board, in turn
Stability during protection following process at the first dry film covering, it is ensured that the quality in non-gold-plated region.
D: electroplating gold, to exposed gold-plated region carries out electronickelling and plating on the first dry film on multilayer circuit board
Gold.
E: taking off film, removes the first dry film on multilayer circuit board.
S3: the second dry film is arranged, and second dry film is in the lead areas in removal lead on the multilayer circuit board
Uplifting window exposes the lead areas, is then etched to the lead of the lead areas, then remove institute
State the second dry film on multilayer circuit board.It is specific as follows:
A: overlay film covers the second dry film on multilayer circuit board, which is alkali resistance dry film.
B: image transfer, lead areas and gold-plated region on multilayer circuit board open a window, i.e., by multilayer circuit board
On lead areas and gold-plated region light transmission, the rest part whole shading on plate, after exposure and imaging, so that multilayer
Lead areas and gold-plated region on wiring board on the second dry film by exposing.
C: alkali etching is removed the lead in the lead areas using the alkaline etching liquid under ammonium chloride copper system
It removes.
D: taking off film, removes the second dry film on multilayer circuit board.
S4: change golden pre-treatment, anti-oxidant treatment and welding resistance are carried out respectively to the multilayer circuit board；It is specific as follows:
A: anti-oxidant treatment makes the non-gold-plated region on the multilayer circuit board for having completed electroplating gold surface treatment
It is started the cleaning processing with antioxidant, can be kept at least two weeks by the copper face on the multilayer circuit board after anti-oxidant treatment
It will not be oxidized, thereby may be ensured that the multilayer circuit board after completing electroplating gold surface treatment to the chemical golden watch surface treatment of progress
In this period, the stability of copper face on multilayer circuit board is avoided when carrying out chemical turmeric surface treatment, copper face be oxidized and
It can not carry out chemical turmeric surface treatment.
B: welding resistance carries out pickling to the multilayer circuit board whole plate after anti-oxidant treatment has been carried out, then to the non-plated
The golden region of golden region and non-ization uses anti-solder ink, in forming anti-ization in the non-gold-plated region and non-ization gold region
Polishes layer of ink.In the welding resistance process, in order to protect Gold plated Layer, without opening polish-brush and grit blasting operation to whole plate, Gold plated Layer quilt is avoided
Scratch and wipe flower.
S5: third dry film is arranged, and the third dry film is described in chemical turmeric surface treatment on the multilayer circuit board
Changing golden region uplifting window exposes the golden region of describedization, then golden to the golden region progress of describedization, formationization layer gold,
The third dry film on the multilayer circuit board is removed again.It is specific as follows:
A: overlay film covers third dry film on multilayer circuit board, which is acid resistance dry film.
B: image transfer, it is in the change gold region uplifting window of multilayer circuit board, i.e., the change gold region on multilayer circuit board is saturating
Light, non-ization gold region shading, after exposure and imaging, so that the change gold region on multilayer circuit board is by naked on third dry film
Expose.
C: text adds roasting, puts the mode of multilayer circuit board insert rack into inside oven baking, the baking temperature is 120
DEG C, baking time is 20 minutes, by text plus after baking, can reinforce third dry film to the adhesive force of multilayer circuit board, in turn
Stability during protection following process at third dry film covering, it is ensured that the quality in non-ization gold region.
D: changing gold, to exposedization gold region carries out heavy nickel and turmeric on third dry film on multilayer circuit board, is formed
Change layer gold.
E: taking off film, removes the third dry film on multilayer circuit board.
F: changing Jin Qingxi, uses the oxide in dedicated golden face cleaning agent cleaningization layer gold.
G: changing gold and check, carries out quality inspection to the multilayer circuit board after completionization gold cleaning.
S6: post-processing carries out processing and forming to the multilayer circuit board and pcb board is made.Wherein, post-processing includes for the first time
Molding, flying probe, V-CUT, second molding, cleaning, visual examination, selective examination, packaging.It is specific as follows:
A: forming for the first time, and the peripheral frame for completing the multilayer circuit board after chemical turmeric is surface-treated is carried out at gong side
Reason.
B: flying probe is used for quickly detecting the electric property (such as open circuit and short circuit) of multilayer circuit board.
Multilayer circuit board is divided into several pcb boards by C:V-CUT.
D: second forms, and the peripheral frame of the pcb board after separation is carried out the processing of gong side.
E: cleaning: the outer surface for the pcb board for completing gong side is cleared up.
F: visual examination: the apparent parameter of pcb board progress is checked, measured hole copper thickness, internal layer copper thickness etc..
G: selective examination: the electric property of pcb board is surveyed sample again.
H: packaging: packaging is sealed to pcb board, is put into desiccant and humidity card.
It is provided by the present invention a kind of with gold-plated and immersion process PCB plate production method, on multilayer circuit board first
After carrying out electroplating gold surface treatment and removal lead technique, then the golden pre-treatment of progress, anti-oxidant place is carried out to multilayer circuit board
Reason and welding resistance, carry out chemical turmeric surface treatment again later, and such process flow both ensure that electroplating gold surface treatment gained
The product quality in the gold-plated region arrived also ensures that chemical turmeric is surface-treated the product quality in the golden region of obtainedization, together
When welding resistance technique be set to after electroplating gold surface treatment carry out, avoid solder mask and lead on outer graphics covered
Lid, so that the lead at solder mask covering can not be cleaned out completely in removal lead portion, it can be by multilayer circuit board
On lead cleaning more thoroughly, avoid due to lead removal be not thorough caused by short circuit, and then influence PCB whole plate quality
The problem of.Meanwhile the welding resistance process is set to after electroplating gold surface treatment, can also be effectively resolved electroplating gold surface treatment
When, the lead due to caused by difference in height seeps the problem of gold.
The above is merely preferred embodiments of the present invention, be not intended to limit the invention, it is all in spirit of the invention and
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within principle.
Claims (10)
1. a kind of with gold-plated and immersion process PCB plate production method, which comprises the following steps:
S1: the multilayer circuit board with outer-layer circuit is made in preprocessing, and the outer-layer circuit is equipped with the lead district with lead
Domain, the gold-plated region for plating and the non-gold-plated region without plating and the golden region of change for changing gold and without changing gold
Non-ization gold region；
S2: the first dry film is arranged, and first dry film is in the gold-plated area in electroplating gold surface treatment on the multilayer circuit board
Domain uplifting window exposes the gold-plated region, then carries out plating to the gold-plated region and forms Gold plated Layer, then removes
The first dry film on the multilayer circuit board；
S3: the second dry film is arranged, and second dry film is opened in the lead areas in removal lead on the multilayer circuit board
Window exposes the lead areas, is then etched to the lead of the lead areas, then removes described more
The second dry film on sandwich circuit board；
S4: change golden pre-treatment, anti-oxidant treatment and welding resistance are carried out respectively to the multilayer circuit board；
S5: third dry film is arranged in chemical turmeric surface treatment on the multilayer circuit board, and the third dry film is in describedization gold
Region uplifting window exposes the golden region of describedization, then to the golden formationization layer gold of the golden region progress of describedization, then goes
Except the third dry film on the multilayer circuit board；
S6: post-processing carries out processing and forming to the multilayer circuit board and pcb board is made.
2. as described in claim 1 a kind of with gold-plated and immersion process PCB plate production method, which is characterized in that in S4
In step, the anti-oxidant treatment is to be cleaned to the non-gold-plated region on the multilayer circuit board using antioxidant
Processing.
3. as described in claim 1 a kind of with gold-plated and immersion process PCB plate production method, which is characterized in that in S4
In step, the welding resistance is to carry out pickling to the multilayer circuit board whole plate, then to the non-gold-plated region and non-ization
Golden region use anti-solder ink, in the non-gold-plated region and non-ization gold region in form anti-ization polishes layer of ink.
4. as described in claim 1 a kind of with gold-plated and immersion process PCB plate production method, which is characterized in that in S2
Further include that text adds roasting process in step, puts the mode for having completed the multilayer circuit board insert rack of windowing into oven
The inside baking, the baking temperature are 120 DEG C, and baking time is 20 minutes.
5. as described in claim 1 a kind of with gold-plated and immersion process PCB plate production method, which is characterized in that described
In S2 step, first dry film is acid resistance dry film, extends 2mil to the gold-plated region at the windowing of first dry film.
6. as described in claim 1 a kind of with gold-plated and immersion process PCB plate production method, which is characterized in that in S5
Further include that text adds roasting process in step, puts the mode for having completed the multilayer circuit board insert rack of windowing into oven
The inside baking, the baking temperature are 120 DEG C, and baking time is 20 minutes.
7. as described in claim 1 a kind of with gold-plated and immersion process PCB plate production method, which is characterized in that in S5
In step, the third dry film is acid resistance dry film.
8. as described in claim 1 a kind of with gold-plated and immersion process PCB plate production method, which is characterized in that in S5
It further include to the multilayer circuit board progress gold cleaning for having had been removed the third dry film and changing gold inspection in step.
9. as described in claim 1 a kind of with gold-plated and immersion process PCB plate production method, which is characterized in that in S3
In step, second dry film is alkali resistance dry film.
10. as described in claim 1 a kind of with gold-plated and immersion process PCB plate production method, which is characterized in that described
Preprocessing includes sawing sheet, drilling, whole plate plating, image transfer and graphic plating and Etching step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910335616.7A CN110049625A (en) | 2019-04-24 | 2019-04-24 | It is a kind of with gold-plated and immersion process PCB plate production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910335616.7A CN110049625A (en) | 2019-04-24 | 2019-04-24 | It is a kind of with gold-plated and immersion process PCB plate production method |
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| Publication Number | Publication Date |
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| CN110049625A true CN110049625A (en) | 2019-07-23 |
Family
ID=67279123
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910335616.7A Pending CN110049625A (en) | 2019-04-24 | 2019-04-24 | It is a kind of with gold-plated and immersion process PCB plate production method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111542174A (en) * | 2020-03-08 | 2020-08-14 | 苏州浪潮智能科技有限公司 | Leadless electrogilding method and system for circuit board |
| CN114302560A (en) * | 2021-11-23 | 2022-04-08 | 江苏博敏电子有限公司 | Surface treatment combined processing technology for printed circuit board |
| CN114872466A (en) * | 2022-03-29 | 2022-08-09 | 柏承科技(昆山)股份有限公司 | High-processing-capacity gold plating process applying selective jet printing technology |
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| JP2002234932A (en) * | 2001-02-09 | 2002-08-23 | Nippon Kayaku Co Ltd | Epoxy carboxylate compound soluble in alkali aqueous solution photosensitive resin composition using the same and its cured product |
| CN105848423A (en) * | 2016-05-20 | 2016-08-10 | 江门崇达电路技术有限公司 | PCB manufacturing method having electrogilding surface treatment and chemical immersion gold surface treatment |
| CN108174510A (en) * | 2017-12-29 | 2018-06-15 | 深圳欣强智创电路板有限公司 | A kind of production method of grading connecting finger and optic module PCB plate comprising the golden finger |
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2019
- 2019-04-24 CN CN201910335616.7A patent/CN110049625A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002234932A (en) * | 2001-02-09 | 2002-08-23 | Nippon Kayaku Co Ltd | Epoxy carboxylate compound soluble in alkali aqueous solution photosensitive resin composition using the same and its cured product |
| CN105848423A (en) * | 2016-05-20 | 2016-08-10 | 江门崇达电路技术有限公司 | PCB manufacturing method having electrogilding surface treatment and chemical immersion gold surface treatment |
| CN108174510A (en) * | 2017-12-29 | 2018-06-15 | 深圳欣强智创电路板有限公司 | A kind of production method of grading connecting finger and optic module PCB plate comprising the golden finger |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111542174A (en) * | 2020-03-08 | 2020-08-14 | 苏州浪潮智能科技有限公司 | Leadless electrogilding method and system for circuit board |
| CN111542174B (en) * | 2020-03-08 | 2021-09-14 | 苏州浪潮智能科技有限公司 | Leadless electrogilding method and system for circuit board |
| CN114302560A (en) * | 2021-11-23 | 2022-04-08 | 江苏博敏电子有限公司 | Surface treatment combined processing technology for printed circuit board |
| CN114872466A (en) * | 2022-03-29 | 2022-08-09 | 柏承科技(昆山)股份有限公司 | High-processing-capacity gold plating process applying selective jet printing technology |
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Application publication date: 20190723 |
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