CN111385982A - Method for improving laminated structure of multilayer PCB - Google Patents
Method for improving laminated structure of multilayer PCB Download PDFInfo
- Publication number
- CN111385982A CN111385982A CN201910000048.5A CN201910000048A CN111385982A CN 111385982 A CN111385982 A CN 111385982A CN 201910000048 A CN201910000048 A CN 201910000048A CN 111385982 A CN111385982 A CN 111385982A
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- Prior art keywords
- core
- board
- circuit board
- plate
- thickness
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
Abstract
The invention discloses an improvement method of a laminated structure of a multilayer PCB (printed circuit board), which is characterized in that an exposure machine negative film is adopted to expose a core board circuit when a core board is manufactured, compared with the exposure operation of the exposure machine and a positive film on the PCB circuit board, the tin plating process of the core board circuit is reduced, the process is simpler and more convenient, the manufacturing time is reduced, the manufacturing cost is correspondingly reduced, the copper thickness of the core board is controlled to be half ounce through micro-etching thinning during subsequent lamination, the yield of the laminated multilayer circuit board is obviously improved when the copper thickness of the core board is half ounce through final tests, in addition, a board edge positioning hole is preferentially drilled during the core board manufacturing, good positioning is provided for subsequent through hole drilling, and the through hole can be precisely drilled so as to ensure that the subsequent core board and the PCB are fixedly connected to form the multilayer PCB circuit board.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a method for improving a laminated structure of a multilayer PCB circuit board.
Background
In the structure of a standard multi-layer PCB circuit board, which contains an inner layer circuit and an outer layer circuit, the inner connection function of each layer circuit is achieved by drilling and in-hole metallization processes, the surface layer and the inner layer are connected without penetrating through a via hole of the whole board, namely a blind hole of the circuit board, in the prior art, in the manufacture of a blind hole layer core board of the multi-layer circuit board, in the exposure and development process, an exposure machine and a positive film are usually adopted to expose and develop the circuit board circuit, then the circuit board circuit is etched by etching, and the circuit of the circuit board is exposed by the positive film, tinning operation is required to protect the circuit pattern of the circuit board from being etched in subsequent etching, the process is complicated, the manufacturing time is prolonged, the manufacturing cost is correspondingly increased, and the yield of the blind hole layer of the core board after the circuit is exposed by the positive film cannot be guaranteed, resulting in an increased scrap rate of the multilayer circuit board after subsequent lamination.
Disclosure of Invention
In order to fill the blank of the prior art, the invention provides an improved method for a laminated structure of a multilayer PCB circuit board.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a method for improving the laminated structure of a multilayer PCB circuit board comprises the following steps:
firstly, core board manufacturing: A. cutting: cutting the plate into the Pnl size of the engineering design by using a cutting machine;
B. drilling: drilling blind holes and plate edge positioning holes in a core plate;
C. copper deposition and thickening: copper deposition thickening is carried out through the copper deposition plate electric wire;
D. chemical cleaning: cleaning the core plate in a chemical cleaning line;
E. line exposure: after a dry film is pasted on the surface of the core plate, an exposure machine and a negative film are used for circuit exposure;
F. etching: transferring the circuit-exposed core plate to an etching process through an inserting frame, and etching the core plate through an etching machine;
G. and (4) checking: and transferring the core board of the etched circuit board to an AOI (automated optical inspection) process by using a rubber frame, and scanning and detecting the circuit of the core board by using an AOI scanner.
Then, lamination is carried out: a. browning before lamination: before laminating the core plate, performing brown oxidation treatment on the core plate;
b. laminating the core board: converting the resin in the PP from a semi-solidified state into a liquid state by a pressing and heating method through a press, bonding the core plates together, and solidifying to complete the pressing of each core plate;
c. removing brown oxide: removing the browning layer on the plate surface through a browning removing line;
d. micro-etching and thinning: reducing the thickness of the copper on the plate surface to half ounce by a microetching and thinning machine;
e. and (3) inspecting and drilling: detecting whether the copper thickness is reduced to half ounce or not, conveying the core plate with the copper thickness reduced to half ounce to a drilling process, drilling a through hole through the plate edge positioning hole in a positioning mode, and fixing the laminated core plate and a PCB (printed circuit board) through the through hole to form a multi-layer PCB (printed circuit board).
As an improvement of the above scheme, in the step B, the board edge positioning holes are drilled on the PCB board by a numerical control drilling machine, the board edge positioning holes are positioned by pinning, and the blind holes are drilled by using the board edge positioning holes as a positioning reference.
As an improvement of the above scheme, in the step C, when the deposited copper is thickened, the single-hole copper thickness single point is 12um minimum, and the single-hole copper thickness single point is 15um on average.
As an improvement of the above scheme, in the step E, after the exposure, the core circuit is developed by using a developing machine, and the unhardened dry film attached to the core circuit is washed away.
The improvement of the proposal is that the core board after the unhardened dry film is processed is transferred to an external line inspection working procedure through an inserting frame, and whether the circuit of the core board has exposure abnormality or deviation abnormality or other abnormal conditions is inspected through visual inspection and a 10-fold mirror.
As an improvement of the above scheme, in the step F, the qualified core board is transferred to an etching line through the insert rack, and the core board circuit pattern is etched.
As an improvement of the above scheme, an acidic etching solution is used for etching.
As a modification of the above scheme, in the step b, the PP is PP 1080.
As a modification of the above, in the step e, the L1-L2 layer core board thickness and the L5-L6 layer core board thickness of the multilayer PCB circuit board are 0.145mm, and the L1-L2 layer core board copper thickness and the L5-L6 layer core board copper thickness of the multilayer PCB circuit board are H/Hoz.
As an improvement of the scheme, in the step e, the thickness of the PCB board of the L3-L4 layers of the multilayer PCB board is 0.17mm, and the thickness of copper is 1/1 oz.
The invention has the beneficial effects that: according to the invention, the negative film process technology is adopted during the core board manufacturing, when the core board is exposed, the exposure machine and the negative film are used for exposing the core board, compared with the exposure machine and the positive film for exposing the PCB circuit board, the core board circuit tin plating process is reduced, the process is simpler and more convenient, the manufacturing time is reduced, the manufacturing cost is correspondingly reduced, the core board copper thickness is controlled to be half ounce through the micro-etching thinning during the subsequent lamination, the yield of the laminated multilayer circuit board is obviously improved when the core board copper thickness is half ounce through the final test, and in the core board manufacturing, the board edge positioning hole is preferentially drilled, good positioning is provided for the subsequent through hole drilling, and the through hole can be accurately drilled so as to ensure that the subsequent core board and the PCB are connected and fixed to form the multilayer PCB circuit board.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail with reference to examples.
The present invention relates to a method for improving a laminated structure of a multi-layer PCB circuit board, and a preferred embodiment of the present invention is described in further detail below.
A method for improving the laminated structure of a multilayer PCB circuit board comprises the following steps:
manufacturing a core plate: cutting the plate into engineering design Pnl size by using a cutting machine, transferring the core plate to a sinking drilling process by using a W-shaped transfer vehicle, drilling plate edge positioning holes on the PCB by using a numerical control drilling machine, positioning the plate edge positioning holes by using pins, and drilling the blind holes by using the plate edge positioning holes as positioning references; transferring the core plate to a copper deposition thickening process by using a W-shaped transfer trolley, and performing copper deposition thickening through a copper deposition plate wire, wherein the minimum 12um is preferably selected for a single-hole copper thickness single point, and the average 15um is preferably selected for the single-hole copper thickness single point; after the operation is finished, the core plate is transferred to a chemical cleaning process by using a rubber frame, and the core plate is cleaned by using a chemical cleaning line and then transferred to an outer line process; sticking a layer of dry film on the surface of a core plate by using a film sticking machine, then carrying out circuit exposure by using an exposure machine and a circuit film (negative film), developing the core plate by using a developing machine after exposure, washing off the unhardened dry film attached to the circuit of the core plate, transferring a core plate inserting frame to an external line inspection process after the dry film is washed, and transferring the inserting frame to an etching process after the surface of the core plate is inspected to have no poor exposure and abnormal deviation by visual inspection and a 10-time microscope; etching the core board circuit by an etching machine; and after the etching is finished, the core plate is transferred to an AOI process by using a rubber frame, and the line is scanned and detected by using an AOI scanner to detect the defects on the core plate and automatically mark the defects for the adjustment of maintenance personnel and the subsequent technical improvement. Note: pnl is an abbreviation for panel, which means a large block/piece PCB, and generally the actual line-playing piece is called a panel board, i.e. a step board, and several step boards are arranged on one panel board, which Pnl is the operation board of the actual PCB factory when manufacturing PCB. The W-shaped turnover vehicle is a production line transfer workbench commonly used in the field of PCB processing. AOI (automated Optical inspection) is known as automatic Optical inspection and is based on Optical principles to detect common defects encountered in welding production.
As an optional implementation manner, in the step E, a reciprocating forward film pasting manner may be adopted for pasting the dry film, that is, the film is pasted for a distance L, then the distance of 2/5L is returned, the film pasting distance L is advanced again, and the process is repeated in sequence until the film pasting is completed, and a pressing roller or a pressing roller may be simultaneously arranged for pressing.
Preferably, an acidic etching solution is used for etching.
The core board in the multi-layer PCB circuit board laminating structure is manufactured through the process, and the yield of the blind holes of the core board manufactured through the process is remarkably improved compared with that of the blind holes of the core board which is subjected to circuit exposure through a traditional positive film, so that the yield of the multi-layer PCB circuit board after subsequent lamination is ensured.
After the core board is manufactured, the core board needs to be subjected to laminating operation, and the laminating operation comprises the following specific steps:
browning before lamination: before laminating the core plate, performing brown oxidation treatment on the core plate;
laminating the core board: converting the resin in the PP from a semi-solidified state into a liquid state by a pressing and heating method through a press, bonding the core plates together, and solidifying to complete the pressing of each core plate;
removing brown oxide: removing the browning layer on the plate surface through a browning removing line;
micro-etching and thinning: reducing the thickness of the copper on the plate surface to half ounce by a microetching and thinning machine;
and (3) inspecting and drilling: detecting whether the thickness of the copper is reduced to half ounce or not, conveying the core plate with the thickness reduced to half ounce to a drilling process, and positioning and drilling a through hole through the plate edge positioning hole.
Manufacturing a multilayer PCB circuit board: drilling corresponding through holes at the positions of the PCB (common board) corresponding to the through holes of the core board, and fixing the laminated core board and the PCB through the through holes to form the multilayer PCB.
Preferably, the PP is PP 1080.
In consideration of the board thickness copper thickness, i.e., the machining tolerance, it is preferable that the L1-L2 layer core board thickness and the L5-L6 layer core board thickness of the multilayer PCB board be 0.145mm, and the L1-L2 layer core board copper thickness and the L5-L6 layer core board copper thickness of the multilayer PCB board be H/Hoz.
Preferably, the multilayer PCB has L3-L4 layers with a thickness of 0.17mm and a copper thickness of 1/1 oz.
Preferably, the PP1080 is laminated between the L1-L2 layer core board and the L3-L4 layer PCB board, and the PP1080 is laminated between the L3-L4 layer PCB board and the L5-L6 layer core board.
Finally, the above embodiments are only intended to illustrate the technical solution of the present invention and not to limit the same, and although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution, and all of them shall fall within the scope of the claims of the present invention.
Claims (10)
1. A method for improving a laminated structure of a multilayer PCB circuit board is characterized by comprising the following steps:
firstly, core board manufacturing: A. cutting: cutting the plate into the Pnl size of the engineering design by using a cutting machine;
B. drilling: drilling plate edge positioning holes and blind holes on a core plate;
C. copper deposition and thickening: copper deposition thickening is carried out through the copper deposition plate electric wire;
D. chemical cleaning: cleaning the core plate in a chemical cleaning line;
E. line exposure: after a dry film is pasted on the surface of the core plate, an exposure machine and a negative film are used for circuit exposure;
F. etching: transferring the circuit-exposed core plate to an etching process through an inserting frame, and etching the core plate through an etching machine;
G. and (4) checking: transferring the core board of the etched circuit board to an AOI (automated optical inspection) process by using a rubber frame, and scanning and detecting the circuit of the core board by using an AOI scanner;
then, lamination is carried out: a. browning before lamination: before laminating the core plate, performing brown oxidation treatment on the core plate;
b. laminating the core board: converting the resin in the PP from a semi-solidified state into a liquid state by a pressing and heating method through a press, bonding the core plates together, and solidifying to complete the pressing of each core plate;
c. removing brown oxide: removing the browning layer on the plate surface through a browning removing line;
d. micro-etching and thinning: reducing the thickness of the copper on the plate surface to half ounce by a microetching and thinning machine;
e. and (3) inspecting and drilling: detecting whether the copper thickness is reduced to half ounce or not, conveying the core plate with the copper thickness reduced to half ounce to a drilling process, drilling a through hole through the plate edge positioning hole in a positioning mode, and fixing the laminated core plate and a PCB (printed circuit board) through the through hole to form a multi-layer PCB (printed circuit board).
2. The method of claim 1, wherein the step of laminating the multilayer PCB circuit board comprises the steps of: and B, drilling the plate edge positioning hole on the PCB by using a numerical control drilling machine, positioning the plate edge positioning hole by using a pin, and drilling the blind hole by using the plate edge positioning hole as a positioning reference.
3. The method of claim 1, wherein the step of laminating the multilayer PCB circuit board comprises the steps of: in the step C, when the copper deposition is thickened, the thickness of the single-hole copper single point is minimum 12um, and the thickness of the single-hole copper single point is average 15 um.
4. The method of claim 1, wherein the step of laminating the multilayer PCB circuit board comprises the steps of: in the step E, after exposure, the core board circuit is developed by using a developing machine, and the uncured dry film attached to the core board circuit is washed away.
5. The method of claim 4, wherein the step of laminating the multilayer PCB circuit board comprises the steps of: and transferring the core board after the unhardened dry film is treated to an external line inspection process through an inserting frame, and inspecting whether the circuit of the core board has exposure abnormality or deviation abnormality or other abnormal conditions through visual inspection and a 10-fold microscope.
6. The method of claim 1, wherein the step of laminating the multilayer PCB circuit board comprises the steps of: and in the step F, transferring the qualified core board to an etching line through an inserting frame, and etching a circuit pattern of the core board.
7. The method of claim 6, wherein the step of laminating the multilayer PCB circuit board comprises the steps of: the etching is carried out using an acidic etching solution.
8. The method of claim 1, wherein the step of laminating the multilayer PCB circuit board comprises the steps of: in the step b, the PP is PP 1080.
9. The method of claim 1, wherein the step of laminating the multilayer PCB circuit board comprises the steps of: in the step e, the thickness of the L1-L2 layer core board and the thickness of the L5-L6 layer core board of the multilayer PCB circuit board are 0.145mm, and the thickness of the L1-L2 layer core board copper and the thickness of the L5-L6 layer core board copper of the multilayer PCB circuit board are H/Hoz.
10. The method of claim 1, wherein the step of laminating the multilayer PCB circuit board comprises the steps of: in the step e, the thickness of the L3-L4 layer PCB board of the multilayer PCB board is 0.17mm, and the thickness of copper is 1/1 oz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910000048.5A CN111385982A (en) | 2019-01-01 | 2019-01-01 | Method for improving laminated structure of multilayer PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910000048.5A CN111385982A (en) | 2019-01-01 | 2019-01-01 | Method for improving laminated structure of multilayer PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111385982A true CN111385982A (en) | 2020-07-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910000048.5A Withdrawn CN111385982A (en) | 2019-01-01 | 2019-01-01 | Method for improving laminated structure of multilayer PCB |
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| CN (1) | CN111385982A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114727518A (en) * | 2022-04-22 | 2022-07-08 | 广德通灵电子有限公司 | Four-layer circuit board manufacturing process with high circuit alignment precision |
-
2019
- 2019-01-01 CN CN201910000048.5A patent/CN111385982A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114727518A (en) * | 2022-04-22 | 2022-07-08 | 广德通灵电子有限公司 | Four-layer circuit board manufacturing process with high circuit alignment precision |
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Application publication date: 20200707 |