CN111182738B - Method for manufacturing characters on large copper surface of PCB - Google Patents
Method for manufacturing characters on large copper surface of PCB Download PDFInfo
- Publication number
- CN111182738B CN111182738B CN202010042241.8A CN202010042241A CN111182738B CN 111182738 B CN111182738 B CN 111182738B CN 202010042241 A CN202010042241 A CN 202010042241A CN 111182738 B CN111182738 B CN 111182738B
- Authority
- CN
- China
- Prior art keywords
- baking
- board
- characters
- copper surface
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
- B41M1/28—Printing on other surfaces than ordinary paper on metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/009—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using thermal means, e.g. infrared radiation, heat
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Thermal Sciences (AREA)
- Toxicology (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a method for manufacturing a large copper surface character of a PCB (printed circuit board), which comprises the following steps of: after a solder mask is manufactured on a production board, carrying out primary acid pickling treatment on the production board; then, silk-screen printing first-surface character ink on the copper surface of one surface of the production board, and pre-curing the first-surface character ink through pre-baking; carrying out acid washing treatment on the production plate for the second time; and silk-screening character printing ink on the second surface on the copper surface of the other surface of the production board, and completely curing the character printing ink on the first surface and the character printing ink on the second surface by baking. According to the method, by optimizing the character manufacturing process, before the characters are manufactured on the large copper surface, the acid washing process is added, the copper surface oxide layer after high-temperature baking is removed, the copper surface roughness is increased, the combination area of the copper surface and the character ink is increased, and therefore the problem that the characters fall off on the large copper surface is solved.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for manufacturing characters on a large copper surface of a PCB.
Background
The character process in the PCB production process refers to transferring a type of character ink to the surface of a circuit board by a screen printing method for the identification and installation of subsequent components and providing information such as production period, UL identification and the like. Most character ink is printed on a solder mask layer, and some PCBs need to be designed and printed on a large copper surface due to special structural requirements. The existing character making technology mainly comprises the following steps:
1. the conventional process comprises the following steps: silk-screen first face characters → post baking → silk-screen second face characters → post baking;
2. according to the patent 201020530989.4, solder resist ink is printed on a large copper surface of a circuit board according to the shape of characters, and then characters are printed on the dried solder resist ink to cover the solder resist ink;
3. in patent 201621071187.5, a base groove is formed on the large copper surface of the circuit board according to the shape of the characters, solder resist ink is printed, and the characters printed on the dried ink are directly embedded into the character groove.
In the above, the copper surface is easily oxidized after the conventional process of the method 1 is baked at a high temperature, the bonding force between the character ink and the copper surface is seriously affected, and in the subsequent surface treatment (nickel-gold deposition, nickel-gold electroplating, tin deposition and the like), the liquid medicine easily invades into the bottom layer of the character when the copper surface is treated, so that the character falls off, and thus part of the character is not clear, and the subsequent piece pasting, identification and the like are affected, so that the character manufacturing fails.
According to the patent technology 201020530989.4 of the method 2, solder resist ink is laid under the character ink, and the characteristic that the bonding force of the character ink and the solder resist ink is superior to the bonding force of the character ink and the copper surface is utilized, so that the character ink is prevented from directly contacting the copper surface, the defect that characters are easy to fall off after being treated by liquid medicine in the surface treatment process is overcome, the defects that the character ink and the solder resist ink are difficult to align, the solder resist ink below is easy to expose or offset to the copper surface, the process difficulty is increased, and the appearance of a finished product is influenced are overcome.
Patent 201621071187.5 of method 3 discloses that a groove is formed in the copper surface, which is beneficial to improving the bonding force between solder resist ink and the copper surface and further optimizing the stability of character ink, and has the disadvantages that the character ink and the solder resist ink are difficult to align, which increases the process difficulty, and in addition, the groove formed in the copper surface can influence the integrity of the large copper surface and influence the functionality thereof, and some customers do not agree with the groove.
Disclosure of Invention
Aiming at the problem that the existing circuit board has the defects, the invention provides a method for manufacturing characters on a large copper surface of a PCB, which increases an acid washing process, removes a copper surface oxidation layer after high-temperature baking of the board, increases the roughness of the copper surface and increases the combination area of the copper surface and character printing ink by optimizing a character manufacturing process before manufacturing the characters on the large copper surface, thereby improving the problem of character falling of the large copper surface.
In order to solve the technical problem, the invention provides a method for manufacturing a large copper surface character of a PCB, which comprises the following steps:
s1, after the solder mask layer is manufactured on the production board, carrying out first acid washing treatment on the production board;
s2, silk-screen printing first-surface character ink on the copper surface of one surface of the production board, and pre-curing the first-surface character ink through pre-baking;
s3, carrying out acid washing treatment on the production plate for the second time;
and S4, silk-screening second-side character ink on the copper surface of the other surface of the production board, and baking to completely cure the first-side character ink and the second-side character ink.
Further, in steps S1 and S3, sulfuric acid or hydrochloric acid with a volume concentration of 3% to 5% is used for the two acid washing treatments.
Further, in step S1, the time for pickling is 20-30S; in step S3, the time for pickling is 10 to 20 seconds.
Further, in step S2, a vertical oven is used to pre-bake the production board, and the pre-baking is divided into two stages:
the first stage is as follows: baking at 60 deg.C for 60 min;
and a second stage: baking at 65 deg.C for 60 min.
Further, in step S4, baking for 3-4min by using a wave band tunnel oven.
Further, in step S4, the baking is divided into five stages:
the first stage is as follows: baking at 160 deg.C for 30 s;
and a second stage: baking at 170 deg.C for 30 s;
and a third stage: baking at 175 deg.C for 30 s;
a fourth stage: baking at 185 deg.C for 90 s;
the fifth stage: baking at 170 deg.C for 30 s.
Furthermore, the production board is a core board, and an outer layer circuit is firstly manufactured on the core board.
Furthermore, the production board is a multilayer board formed by laminating an inner core board and an outer copper foil into a whole through a prepreg, the multilayer board sequentially passes through the processes of drilling, copper deposition, full-board electroplating and outer circuit manufacturing, and the inner circuit is manufactured on the inner core board before the inner core board and the outer copper foil are laminated into the multilayer board.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, by optimizing the character manufacturing process, before characters are manufactured on the large copper surface of the PCB, the acid washing process is added, and the roughness of the copper surface is improved while the copper surface oxide layer after high-temperature baking is removed, so that the bonding area of the copper surface and character ink is increased, the bonding force between the copper surface and the character ink is improved, and the problem that characters are easy to fall off on the large copper surface is solved, and the problems that in the prior art, the bonding force between the character ink and the copper surface is not firm, characters are easy to fall off due to the intrusion of liquid medicine in the surface treatment process, the alignment difficulty of the character ink printed on the solder resist ink is difficult, the process difficulty is increased, the; in addition, the concentration of sulfuric acid/hydrochloric acid and the cleaning time during acid cleaning are strictly controlled, so that the problem that the copper thickness cannot meet the requirement due to excessive corrosion of the copper surface is avoided; the character printing ink on the first surface is pre-cured in two stages of gradual temperature rise during primary baking, so that the pre-cured printing ink is good in stability and firm in combination with the copper surface, and the problem of serious oxidation of the copper surface on the other surface caused by high-temperature baking can be avoided while the character printing ink is primarily cured by adopting a low-temperature long-time baking mode during primary baking, so that the time of secondary acid pickling is shortened by oxidation, the problem of excessive corrosion of the copper surface on the second surface caused by twice acid pickling is avoided, and the production efficiency is improved; during the second baking, the five stages of gradual temperature rise and final temperature fall are firstly adopted for baking, the problem of oil explosion caused by too fast temperature rise can be avoided, the combination of the solidified character printing ink and the copper surface is good, and the baking mode of high temperature and short time is adopted during the second baking, so that the efficiency of the baking plate is effectively improved.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Example 1
The method for manufacturing a PCB shown in this embodiment, especially for a PCB that needs to manufacture characters on a large copper surface, sequentially includes the following processing steps:
(1) cutting: the core board is cut according to the size of the jointed board of 320mm multiplied by 420mm, the thickness of the core board is 1mm, and the thickness of the outer copper surface of the core board is 1 OZ.
(2) And manufacturing an inner layer circuit (negative film process): coating a photosensitive film on the core plate by using a vertical coating machine according to the pattern positioning hole, controlling the film thickness of the photosensitive film to be 8 mu m, completing the exposure of inner layer circuits by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers), and forming an inner layer circuit pattern after development; etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And pressing: and (3) performing brown oxidation at a brown oxidation speed according to the thickness of the bottom copper, sequentially overlapping the outer copper foil, the prepreg, the core plate, the prepreg and the outer copper foil according to requirements, and then pressing the plates under proper laminating conditions according to Tg to form the production plate.
(4) Drilling an outer layer: and drilling the production plate by using the drilling data.
(5) And depositing copper, namely metalizing the holes on the production board, and testing the backlight to 10 levels, wherein the thickness of the deposited copper in the holes is 0.5 mu m.
(6) And electroplating the whole plate: according to the prior art and according to the design requirement, the production board is subjected to full-board electroplating, and the board surface and the copper layer in the hole are thickened.
(7) And outer layer circuit manufacturing (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; electroplating an outer layer pattern, and then respectively plating copper and tin on the production plate, wherein the copper plating is carried out for 60min at the current density of 1.8ASD, the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the production board; and (4) performing outer layer AOI, then checking the defects of an outer layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, performing defective scrapping treatment, and discharging a defect-free product to the next flow.
(8) Solder resist: manufacturing a solder mask on a production board according to the design requirements according to the prior art, wherein a large copper surface for manufacturing characters also exists on the production board with the solder mask; the method specifically comprises the following steps: after the solder resist ink is printed on the surface of the production board in a silk-screen manner, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, TOP surface solder resist ink is printed by a white screen, and the TOP surface characters are added with UL marks, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need to be welded, and the effect of beautifying the appearance is achieved.
(9) Acid washing: carrying out primary acid pickling treatment on the production plate; and during acid cleaning, the production plate is cleaned for 20-30s by adopting sulfuric acid or hydrochloric acid with the volume concentration of 3-5% and is used for removing a copper surface oxidation layer after high-temperature baking when a solder mask is manufactured and increasing the roughness of the copper surface.
(10) And silk-screen printing first surface characters: adopting a screen printing plate to screen printing ink of first-side characters on the copper surface of one surface of the production plate, and pre-curing the ink of the first-side characters through pre-baking, thereby forming the required characters on the copper surface of the first side, wherein the screen printing plate is only provided with image-text meshes on the large copper surface corresponding to the production plate; specifically, adopt vertical oven to carry out prebaking to the production board, and prebake time divide into two stages and go on:
the first stage is as follows: baking at 60 deg.C for 60 min;
and a second stage: baking at 65 deg.C for 60 min.
(11) Acid washing: carrying out acid washing treatment on the production plate for the second time; and during acid cleaning, the production plate is cleaned for 10-20s by adopting sulfuric acid or hydrochloric acid with the volume concentration of 3-5% and is used for removing a copper surface oxidation layer on the other surface after the plate is baked at high temperature during manufacturing of the first surface character ink and increasing the roughness of the copper surface.
(12) And silk-screen printing characters on the second surface: printing second-surface character ink on the copper surface of the other surface of the production board by adopting a screen printing plate, and completely curing the first-surface character ink and the second-surface character ink by baking, so that required characters are formed on the second-surface copper surface, wherein the screen printing plate is only provided with image-text meshes on the large copper surface corresponding to the production board; specifically, the baking is carried out for 3-4min by adopting a wave band tunnel furnace, and in a specific embodiment, the baking is carried out in five stages:
the first stage is as follows: baking at 160 deg.C for 30 s;
and a second stage: baking at 170 deg.C for 30 s;
and a third stage: baking at 175 deg.C for 30 s;
a fourth stage: baking at 185 deg.C for 90 s;
the fifth stage: baking at 170 deg.C for 30 s.
(13) Surface treatment (nickel-gold deposition): according to the prior art and according to the design requirement, surface treatment is carried out on the production plate, the copper surface of the window opening position and the through hole needing to be back drilled are prevented from welding, and a nickel layer and a gold layer with certain required thickness are uniformly deposited on the copper layer.
(14) And forming: according to the prior art and according to the design requirement, routing the shape, and manufacturing the PCB with the tolerance of +/-0.05 mm.
(15) And electrical performance testing: detecting the electrical performance of the PCB, and enabling the qualified PCB to enter the next processing link;
(16) and final inspection: and (4) respectively measuring the appearance, the thickness of the hole copper, the thickness of the medium layer, the thickness of the green oil, the thickness of the inner layer copper and the like of the finished product, and discharging the qualified product.
Example 2
The method for manufacturing a PCB shown in this embodiment, especially for a PCB that needs to manufacture characters on a large copper surface, sequentially includes the following processing steps:
(1) cutting: the core board is cut according to the size of the jointed board of 320mm multiplied by 420mm, the thickness of the core board is 1mm, and the thickness of the outer copper surface of the core board is 1 OZ.
(2) Drilling: and drilling the core plate by using the drilling data, wherein the drilled holes comprise through holes needing to be drilled in a back drilling mode.
(3) And depositing copper, namely metalizing the holes on the core board, and testing the backlight to 10 levels, wherein the thickness of the deposited copper in the holes is 0.5 mu m.
(4) And electroplating the whole plate: according to the prior art and according to the design requirement, the production board is subjected to full-board electroplating, and the board surface and the copper layer in the hole are thickened.
(5) And outer layer circuit manufacturing (negative film process): coating a photosensitive film on the core plate by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, completing the exposure of an outer layer circuit by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers), and forming an outer layer circuit graph after development; etching the outer layer, namely etching the exposed and developed core board to form an outer layer circuit, wherein the width of the outer layer circuit is measured to be 3 mil; and (4) performing outer layer AOI, then checking the defects of an outer layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, performing defective scrapping treatment, and discharging a defect-free product to the next flow.
(6) Solder resist: according to the prior art and according to the design requirement, a solder mask layer is manufactured on a core board, and a large copper surface for manufacturing characters also exists on the core board on which the solder mask layer is manufactured; the method specifically comprises the following steps: after the solder resist ink is silk-screened on the surface of the core plate, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, TOP surface solder resist ink is printed by a white screen, and the TOP surface characters are added with UL marks, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need to be welded, and the effect of beautifying the appearance is achieved.
(7) Acid washing: carrying out primary acid washing treatment on the core plate; and during acid cleaning, the production plate is cleaned for 20-30s by adopting sulfuric acid or hydrochloric acid with the volume concentration of 3-5% and is used for removing a copper surface oxidation layer after high-temperature baking when a solder mask is manufactured and increasing the roughness of the copper surface.
(8) And silk-screen printing first surface characters: adopting a screen printing plate to screen printing ink of first-surface characters on the copper surface of one surface of the core plate, and pre-curing the ink of the first-surface characters through pre-baking, thereby forming the required characters on the copper surface of the first surface, wherein the screen printing plate is only provided with image-text meshes on the large copper surface of the corresponding production plate; specifically, a vertical oven is adopted to pre-bake the core plate, and the pre-baking is carried out in two stages:
the first stage is as follows: baking at 60 deg.C for 60 min;
and a second stage: baking at 65 deg.C for 60 min.
(9) Acid washing: performing secondary acid washing treatment on the core plate; and during acid cleaning, the core plate is cleaned for 10-20s by adopting sulfuric acid or hydrochloric acid with the volume concentration of 3-5% for removing the copper surface oxidation layer on the other surface after the plate is baked at high temperature during manufacturing of the first surface character ink, and the roughness of the copper surface is increased.
(10) And silk-screen printing characters on the second surface: printing character ink on a second surface on the copper surface of the other surface of the core plate by adopting a screen printing plate, and completely curing the character ink on the first surface and the character ink on the second surface by baking, so that required characters are formed on the copper surface of the second surface, wherein the screen printing plate is only provided with image-text meshes on the large copper surface of the corresponding production plate; specifically, the baking is carried out for 3-4min by adopting a wave band tunnel furnace, and in a specific embodiment, the baking is carried out in five stages:
the first stage is as follows: baking at 160 deg.C for 30 s;
and a second stage: baking at 170 deg.C for 30 s;
and a third stage: baking at 175 deg.C for 30 s;
a fourth stage: baking at 185 deg.C for 90 s;
the fifth stage: baking at 170 deg.C for 30 s.
(11) Surface treatment (nickel-gold deposition): according to the prior art and according to the design requirement, surface treatment is carried out on the core plate, the copper surface of the window opening position and the through hole needing to be back drilled are prevented from welding, and a nickel layer and a gold layer with certain required thickness are uniformly deposited on the copper layer.
(12) And forming: according to the prior art and according to the design requirement, routing the shape, and manufacturing the PCB with the tolerance of +/-0.05 mm.
(13) And electrical performance testing: detecting the electrical performance of the PCB, and enabling the qualified PCB to enter the next processing link;
(14) and final inspection: and (4) respectively measuring the appearance, the thickness of the hole copper, the thickness of the medium layer, the thickness of the green oil, the thickness of the inner layer copper and the like of the finished product, and discharging the qualified product.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (8)
1. A method for manufacturing characters with large copper surfaces of a PCB is characterized by comprising the following steps:
s1, after the solder mask layer is manufactured on the production board, carrying out first acid washing treatment on the production board;
s2, silk-screen printing first-surface character ink on the copper surface of one surface of the production board, and pre-curing the first-surface character ink through pre-baking;
s3, carrying out acid washing treatment on the production plate for the second time;
and S4, silk-screening second-side character ink on the copper surface of the other surface of the production board, and completely curing the first-side character ink and the second-side character ink by baking.
2. The method for manufacturing characters with large copper surfaces on PCB of claim 1, wherein in steps S1 and S3, sulfuric acid or hydrochloric acid with 3% -5% volume concentration is used in the two acid washing treatments.
3. The method for manufacturing characters with large copper surfaces on PCB as claimed in claim 1 or 2, wherein in step S1, the time for pickling is 20-30S; in step S3, the time for pickling is 10 to 20 seconds.
4. The method for manufacturing characters with large copper surfaces on PCB as claimed in claim 1, wherein in step S2, the production board is pre-baked by vertical oven, and the pre-baking is divided into two stages:
the first stage is as follows: baking at 60 deg.C for 60 min;
and a second stage: baking at 65 deg.C for 60 min.
5. The method for manufacturing characters with large copper surfaces on PCB as claimed in claim 1, wherein in step S4, baking is performed for 3-4min by using a wave band tunnel oven.
6. The method for manufacturing characters with large copper surfaces on PCB as claimed in claim 5, wherein in step S4, the baking is divided into five stages:
the first stage is as follows: baking at 160 deg.C for 30 s;
and a second stage: baking at 170 deg.C for 30 s;
and a third stage: baking at 175 deg.C for 30 s;
a fourth stage: baking at 185 deg.C for 90 s;
the fifth stage: baking at 170 deg.C for 30 s.
7. The method of claim 1, wherein the production board is a core board, and the outer layer circuit is formed on the core board.
8. The method for manufacturing large copper characters on PCB according to claim 1, wherein the production board is a multi-layer board formed by laminating an inner core board and an outer copper foil together with a prepreg, and the multi-layer board is sequentially processed by drilling, copper deposition, full-board electroplating and outer circuit manufacturing, and the inner circuit is manufactured on the inner core board before the inner core board and the outer copper foil are laminated into the multi-layer board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010042241.8A CN111182738B (en) | 2020-01-15 | 2020-01-15 | Method for manufacturing characters on large copper surface of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010042241.8A CN111182738B (en) | 2020-01-15 | 2020-01-15 | Method for manufacturing characters on large copper surface of PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111182738A CN111182738A (en) | 2020-05-19 |
| CN111182738B true CN111182738B (en) | 2021-01-15 |
Family
ID=70654741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010042241.8A Active CN111182738B (en) | 2020-01-15 | 2020-01-15 | Method for manufacturing characters on large copper surface of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111182738B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113784536B (en) * | 2020-06-10 | 2023-06-02 | 深南电路股份有限公司 | Printed circuit board, preparation method thereof and electronic equipment using printed circuit board |
| CN112223889B (en) * | 2020-12-10 | 2021-03-02 | 四川英创力电子科技股份有限公司 | Method for printing characters with multiple colors on same side of printed board and manufacturing method of printed board |
| CN115209633B (en) * | 2022-09-14 | 2022-12-09 | 深圳万和兴电子有限公司 | Manufacturing method of single-sided windowing hole plugging of PCB lead-free tin-sprayed plate |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080121413A1 (en) * | 2006-11-27 | 2008-05-29 | Cardona Sergio E | Method for manufacturing printed circuit boards |
| US20100022078A1 (en) * | 2008-07-24 | 2010-01-28 | Joerg Rockenberger | Aluminum Inks and Methods of Making the Same, Methods for Depositing Aluminum Inks, and Films Formed by Printing and/or Depositing an Aluminum Ink |
| CN101670718A (en) * | 2009-09-29 | 2010-03-17 | 梅州博敏电子有限公司 | Method for printing printed circuit board double sided characters |
| CN105491805A (en) * | 2015-12-29 | 2016-04-13 | 江门崇达电路技术有限公司 | Method for fabricating characters on thick copper board of PCB |
| CN105555046A (en) * | 2015-12-31 | 2016-05-04 | 东莞市优森电子有限公司 | Production technology of double-sided PCB |
| CN105636359A (en) * | 2015-12-30 | 2016-06-01 | 广州兴森快捷电路科技有限公司 | Resistance welding processing method of package substrate |
| CN108289386A (en) * | 2017-12-29 | 2018-07-17 | 东莞市合鼎电路有限公司 | A kind of printed wiring board anti-welding printing method |
| CN109511230A (en) * | 2018-09-20 | 2019-03-22 | 通元科技(惠州)有限公司 | A kind of wiring board welding resistance spray printing processing method |
| CN110139498A (en) * | 2019-06-06 | 2019-08-16 | 恒赫鼎富(苏州)电子有限公司 | The anti-welding coating technique of flexible circuit board |
| CN110582170A (en) * | 2019-10-10 | 2019-12-17 | 高德（江苏）电子科技有限公司 | Anti-falling improvement process applied to black ink with glossiness less than 6 |
-
2020
- 2020-01-15 CN CN202010042241.8A patent/CN111182738B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080121413A1 (en) * | 2006-11-27 | 2008-05-29 | Cardona Sergio E | Method for manufacturing printed circuit boards |
| US20100022078A1 (en) * | 2008-07-24 | 2010-01-28 | Joerg Rockenberger | Aluminum Inks and Methods of Making the Same, Methods for Depositing Aluminum Inks, and Films Formed by Printing and/or Depositing an Aluminum Ink |
| CN101670718A (en) * | 2009-09-29 | 2010-03-17 | 梅州博敏电子有限公司 | Method for printing printed circuit board double sided characters |
| CN105491805A (en) * | 2015-12-29 | 2016-04-13 | 江门崇达电路技术有限公司 | Method for fabricating characters on thick copper board of PCB |
| CN105636359A (en) * | 2015-12-30 | 2016-06-01 | 广州兴森快捷电路科技有限公司 | Resistance welding processing method of package substrate |
| CN105555046A (en) * | 2015-12-31 | 2016-05-04 | 东莞市优森电子有限公司 | Production technology of double-sided PCB |
| CN108289386A (en) * | 2017-12-29 | 2018-07-17 | 东莞市合鼎电路有限公司 | A kind of printed wiring board anti-welding printing method |
| CN109511230A (en) * | 2018-09-20 | 2019-03-22 | 通元科技(惠州)有限公司 | A kind of wiring board welding resistance spray printing processing method |
| CN110139498A (en) * | 2019-06-06 | 2019-08-16 | 恒赫鼎富(苏州)电子有限公司 | The anti-welding coating technique of flexible circuit board |
| CN110582170A (en) * | 2019-10-10 | 2019-12-17 | 高德（江苏）电子科技有限公司 | Anti-falling improvement process applied to black ink with glossiness less than 6 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111182738A (en) | 2020-05-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111182738B (en) | Method for manufacturing characters on large copper surface of PCB | |
| CN108323037B (en) | PCB processing technology of double-sided step position electro-gold | |
| CN109275277B (en) | Solder mask manufacturing method for preventing small holes of PCB from entering ink | |
| CN110802963B (en) | Character processing method for PCB (printed circuit board) super-thick copper plate | |
| CN111556660B (en) | Manufacturing method of thick copper circuit board and thick copper circuit board | |
| CN108770238B (en) | Inner layer graph design method for improving copper pulling in drilling | |
| CN110839319A (en) | Method for manufacturing high-precision impedance circuit | |
| CN111867266A (en) | Circuit design method for preventing short circuit of isolated circuit of PCB | |
| CN111741615B (en) | Method for pressing and filling glue of blind hole with high thickness-diameter ratio | |
| CN110913601B (en) | Method for manufacturing solder mask translation film | |
| CN110121239B (en) | Manufacturing method of mechanical blind hole and half hole | |
| CN108401381B (en) | Method for manufacturing disconnected gold finger type printed circuit board | |
| CN111405761A (en) | Method for manufacturing resin hole plugging plate | |
| CN115135009A (en) | Method for manufacturing PCB character | |
| CN114040598A (en) | Method for removing flash of metalized half hole of electric gold plate | |
| CN111669905B (en) | Core plate, manufacturing method thereof and method for preventing bending plate of laminated plate from warping | |
| CN116867188A (en) | Manufacturing method of sectional golden finger circuit board | |
| CN112261787A (en) | Drilling method for large-size printed board | |
| CN111479400A (en) | Chemical gold-depositing plate plating-missing treatment method for circuit board | |
| CN113873762B (en) | PCB with surface treatments of nickel-gold deposition and oxidation resistance and manufacturing method thereof | |
| CN111586985A (en) | Manufacturing method of high-flatness multilayer circuit board | |
| CN111315141B (en) | Method for manufacturing explosion-proof plate of thick plate and thick copper plate, thick plate and thick copper plate | |
| CN113784545A (en) | Method for preventing hole of resin plug from being broken by printed board | |
| CN111465202A (en) | Drilling machining method for improving precision of gong platform | |
| CN111770636B (en) | Circuit board character baking method capable of saving electric energy |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |