CN105555046A - Production technology of double-sided PCB - Google Patents
Production technology of double-sided PCB Download PDFInfo
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- CN105555046A CN105555046A CN201511015907.6A CN201511015907A CN105555046A CN 105555046 A CN105555046 A CN 105555046A CN 201511015907 A CN201511015907 A CN 201511015907A CN 105555046 A CN105555046 A CN 105555046A
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- double
- clad laminate
- copper clad
- sided copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Materials For Photolithography (AREA)
Abstract
The invention relates to the technical field of PCBs, in particular to a production technology of a double-sided PCB. The technology sequentially comprises the following steps: double-sided copper foil substrate pretreatment, line coating and exposure treatment, line development, etching, de-inking treatment, solder resist pretreatment, solder resist development, lettering treatment, molding treatment, testing and antioxidant treatment. A copper foil substrate is subjected to surface polish-brush treatment through a polish-brush; a photosensitive ink layer and a solder resist ink layer coat the surface of the copper foil substrate; relatively high adsorption force is provided among the photosensitive ink layer, the solder resist ink layer and the copper foil substrate; the photosensitive ink layer and the solder resist ink layer are good in quality; and the produced PCB is good in quality. Cutting treatment is carried out on the copper foil substrate by a V-Cut technology; and the minimum thickness of the formed substrate corresponding to a V-shaped plate-dividing groove is controlled at 0.4-0.5mm, so that subsequent plate division is facilitated; and no burr is left.
Description
Technical field
The present invention relates to pcb board technical field, be specifically related to a kind of production technology of double-sided PCB board.
Background technology
Pcb board, also known as printed circuit board (PCB), printed substrate, is called for short printed board, be base material with insulation board, be cut into certain size, at least with a conductive pattern on it, and cloth porose (as component hole, fastener hole, plated-through hole etc.), and realize being interconnected between electronic devices and components.Because this plate adopts electron printing to make, therefore be called as " printing " circuit board.
Double-sided PCB board is a kind of pcb board very important in circuit board, market has double-sided wiring board metal base pcb board, Hi-Tg heavy copper foil circuit plate, the flat double-sided wiring board wriggled, high-frequency PCB, mixing dielectric base high frequency double-sided wiring board etc., it be applicable to widely new high-tech industry as telecommunications, power supply, computer, Industry Control, digital product, Science & Teaching Instrument, medicine equipment, automobile, aerospace defense etc.But the production technology of existing double-sided PCB board is comparatively complicated, and production cost is higher.
Summary of the invention
In order to overcome the shortcoming and defect existed in prior art, the object of the present invention is to provide a kind of production technology of double-sided PCB board, in this production process, photosensitive printing ink layer, solder mask layer and pcb board tightness of fitting is high, the quality of producing the pcb board obtained is good, and preparation production technology of the present invention is simple, equipment cost is low, can promote the use of on a large scale.
Object of the present invention is achieved through the following technical solutions: a kind of production technology of double-sided PCB board, comprises the following steps:
(1) Double-sided copper clad laminate preliminary treatment: Double-sided copper clad laminate is cut to required size according to typesetting figure, then offer location hole at the marginal position of Double-sided copper clad laminate, finally to the two sides of Double-sided copper clad laminate carry out successively surface acid-washing, surperficial polish-brush, washing process and dry;
(2) deposit traces exposure-processed: use Ink Application wheel to be coated with photosensitive printing ink layer on the surface of Double-sided copper clad laminate, and dry process is toasted to photosensitive printing ink layer, finally line film exposure-processed is carried out to the Double-sided copper clad laminate that drying completes;
(3) circuit develops, etches, goes ink process: Double-sided copper clad laminate is placed in developing machine and carries out development treatment, develop unnecessary circuit, after Manual Visual Inspection, Double-sided copper clad laminate is placed in the circuit that etching machine etching removing is unnecessary, finally make to spend black liquid the photosensitive printing ink layer on circuit surface to be removed, cleaning removes black liquid, dries Double-sided copper clad laminate;
(4) welding resistance preliminary treatment: again surface acid-washing, surperficial polish-brush process and washing process are carried out successively to the surface of Double-sided copper clad laminate, and use Ink Application wheel to be coated with solder mask layer on the surface of Double-sided copper clad laminate, and dry process is toasted to solder mask layer, the Double-sided copper clad laminate finally completed drying carries out welding resistance film exposure-processed;
(5) welding resistance development, process of carving characters: Double-sided copper clad laminate is placed in developing machine and carries out development treatment, item number corresponding in printing, finally carries out baking process to Double-sided copper clad laminate, makes solder mask layer and word ink solidification;
(6) forming processes: the mechanical hole in the Double-sided copper clad laminate adopting CNC processing technology to obtain step (5) carries out processing and processes, V-Cut processing technology is adopted to carry out machining to Double-sided copper clad laminate again, form V-type and divide board slot, finally the Double-sided copper clad laminate after shaping is cleaned, after the aluminium bits that removing is residual and plate powder, make drying and processing;
(7) test: respectively short circuit current is carried out to the Double-sided copper clad laminate after shaping and open circuit detects;
(8) antioxygen process: surperficial polish-brush process is carried out to the Double-sided copper clad laminate that step (7) obtains, re-use the surface using degreaser and micro-etching agent process Double-sided copper clad laminate respectively, finally be coated with anti-oxidant liquid medicine on the surface of Double-sided copper clad laminate, make its surface form the anti-oxidant rete of one deck, obtain double-sided PCB board finished product.
The present invention first carries out surperficial polish-brush process by polish-brush to copper clad laminate, photosensitive printing ink layer and solder mask layer is coated with again on the surface of copper clad laminate, photosensitive printing ink layer, between solder mask layer and copper clad laminate, there is stronger absorption affinity, the quality of photosensitive printing ink layer and solder mask layer is good, to produce the quality of the pcb board obtained good; The present invention adopts V-Cut technique to carry out machining to copper clad laminate, and the minimum thickness of the substrate that the V-type of formation divides board slot corresponding controls at 0.4-0.5mm, is convenient to follow-up point of plate, and does not stay burr.
Preferably, the acid solution that described step (1) and the middle pickling processes of step (4) adopt is the sulfuric acid solution of mass concentration 3-6%; Surperficial polish-brush process in step (1) and step (4) all adopts 500 object nylon polish-brushes to carry out polish-brush process.
The present invention adopts mass concentration to be that the sulfuric acid solution of 3-6% cleans, deoil effective, 500 object nylon polish-brushes are adopted to carry out polish-brush process, polish-brush is effective, be convenient to the surface that photosensitive printing ink layer and solder mask layer are adsorbed in copper clad laminate, and photosensitive printing ink layer, solder mask layer and copper clad laminate are fitted closely, the pcb board quality that production obtains is good.
Preferably, the thickness of the photosensitive printing ink layer in described step (2) is 8-15um, and the baking drying equipment adopted is continuous tunnel furnace, and baking temperature is 125 DEG C, and baking speed is 4-6m/min; The thickness of the solder mask layer in described step (4) is 23-33um, and the baking drying equipment adopted is continuous tunnel furnace, and baking temperature is 105 DEG C, and baking speed is 4-6m/min.
The Thickness Design of photosensitive printing ink layer of the present invention is reasonable, thickness is excessive, consumptive material is many, and cost is high, and the too small then photosensitive printing ink layer of thickness and copper clad laminate are fitted defective tightness, and photosensitive effect is poor, easily cause photosensitive error, affect the quality of pcb board, adopt continuous tunnel furnace to toast, drying effect is good, and rate of drying is fast; The Thickness Design of solder mask layer is reasonable, thickness is excessive, and consumptive material is many, and cost is high, thickness too small then solder mask layer and copper clad laminate are fitted defective tightness, and welding resistance weak effect, solder mask layer easily damages, even Durchgangshohle, affect the quality of pcb board, adopt continuous tunnel furnace to toast, drying effect is good, and rate of drying is fast.
Preferably, when carrying out line film exposure-processed in described step (2), exposure energy chi controls at 7-9 lattice; When carrying out welding resistance film exposure-processed in described step (4), exposure energy chi controls at 8-11 lattice.
The energy lattice of the present invention's exposure energy chi when photosensitive printing ink layer and solder mask layer carry out exposure film process are reasonable in design, and exposure effect is good.
Preferably, the mass concentration of removing black liquid in described step (3) is 6-12%, goes the serviceability temperature of black liquid to be 50-70 DEG C.
Of the present invention go the mass concentration of black liquid and serviceability temperature reasonable in design, go ink effective.
Preferably, in described step (3), the mass concentration of the developer solution that development treatment adopts is 2-4%, and developing powder is 30-50Hz; In described step (5), the mass concentration of the developer solution that development treatment adopts is 0.8-1.2%, and developing powder is 40-60Hz.
Mass concentration and the developing powder of developer solution of the present invention are reasonable in design, and development effect is good.
Preferably, it is vertical type oven that described step (5) baking processes the equipment adopted, and adopt constant temperature roasting mode, baking temperature is 140-160 DEG C, and baking time is 50-70min.
The present invention adopts vertical type oven to carry out baking-curing to solder mask layer and word ink, baking temperature and baking time reasonable in design, dry solidification speed is fast, and gained solder mask layer quality is good.
Preferably, the short circuit current in described step (7) and open circuit are detected as conducting wire short circuit current and open circuit detects, and the test voltage that conducting wire short circuit current and open circuit detect is 200-250V, and maximum current bearing value is 0.1A.
The present invention carries out short circuit current to the conducting wire of copper clad laminate and open circuit detects, and can guarantee that product has good quality.
Preferably, the mass concentration of the anti-oxidant liquid medicine in described step (8) is 70-99%, and serviceability temperature is 43-47 DEG C, pH is 2.8-3.2.
The mass concentration of anti-oxidant liquid medicine of the present invention, serviceability temperature and pH are reasonable in design, and the air-tightness of the anti-oxidant rete of gained is good, and antioxygenic property is excellent.
Preferably, further comprising the steps of after described step (8): the double-sided PCB board finished product that step (8) obtains to be delivered to visual inspection district and carries out outward appearance detection, detect qualified product and carry out vacuum packaging.
The present invention again carries out artificial appearance visual inspection after pcb board has been produced, and guarantees the presentation quality of product, detects qualified product and carries out vacuum packaging process, can guarantee that pcb board does not pollute by external environment condition.
Beneficial effect of the present invention is: the present invention first carries out surperficial polish-brush process by polish-brush to copper clad laminate, photosensitive printing ink layer and solder mask layer is coated with again on the surface of copper clad laminate, photosensitive printing ink layer, between solder mask layer and copper clad laminate, there is stronger absorption affinity, the quality of photosensitive printing ink layer and solder mask layer is good, to produce the quality of the pcb board obtained good; The present invention adopts V-Cut technique to carry out machining to copper clad laminate, and the minimum thickness of the substrate that the V-type of formation divides board slot corresponding controls at 0.4-0.5mm, is convenient to follow-up point of plate, and does not stay burr.
Embodiment
For the ease of the understanding of those skilled in the art, below in conjunction with embodiment, the present invention is further illustrated, and the content that execution mode is mentioned not is limitation of the invention.
Embodiment 1
A production technology for double-sided PCB board, comprises the following steps:
(1) Double-sided copper clad laminate preliminary treatment: Double-sided copper clad laminate is cut to required size according to typesetting figure, then offer location hole at the marginal position of Double-sided copper clad laminate, finally to the two sides of Double-sided copper clad laminate carry out successively surface acid-washing, surperficial polish-brush, washing process and dry;
(2) deposit traces exposure-processed: use Ink Application wheel to be coated with photosensitive printing ink layer on the surface of Double-sided copper clad laminate, and dry process is toasted to photosensitive printing ink layer, finally line film exposure-processed is carried out to the Double-sided copper clad laminate that drying completes;
(3) circuit develops, etches, goes ink process: Double-sided copper clad laminate is placed in developing machine and carries out development treatment, develop unnecessary circuit, after Manual Visual Inspection, Double-sided copper clad laminate is placed in the circuit that etching machine etching removing is unnecessary, finally make to spend black liquid the photosensitive printing ink layer on circuit surface to be removed, cleaning removes black liquid, dries Double-sided copper clad laminate;
(4) welding resistance preliminary treatment: again surface acid-washing, surperficial polish-brush process and washing process are carried out successively to the surface of Double-sided copper clad laminate, and use Ink Application wheel to be coated with solder mask layer on the surface of Double-sided copper clad laminate, and dry process is toasted to solder mask layer, the Double-sided copper clad laminate finally completed drying carries out welding resistance film exposure-processed;
(5) welding resistance development, process of carving characters: Double-sided copper clad laminate is placed in developing machine and carries out development treatment, item number corresponding in printing, finally carries out baking process to Double-sided copper clad laminate, makes solder mask layer and word ink solidification;
(6) forming processes: the mechanical hole in the Double-sided copper clad laminate adopting CNC processing technology to obtain step (5) carries out processing and processes, V-Cut processing technology is adopted to carry out machining to Double-sided copper clad laminate again, form V-type and divide board slot, finally the Double-sided copper clad laminate after shaping is cleaned, after the aluminium bits that removing is residual and plate powder, make drying and processing;
(7) test: respectively short circuit current is carried out to the Double-sided copper clad laminate after shaping and open circuit detects;
(8) antioxygen process: surperficial polish-brush process is carried out to the Double-sided copper clad laminate that step (7) obtains, re-use the surface using degreaser and micro-etching agent process Double-sided copper clad laminate respectively, finally be coated with anti-oxidant liquid medicine on the surface of Double-sided copper clad laminate, make its surface form the anti-oxidant rete of one deck, obtain double-sided PCB board finished product.
The acid solution that described step (1) and the middle pickling processes of step (4) adopt is the sulfuric acid solution of mass concentration 3%; Surperficial polish-brush process in step (1) and step (4) all adopts 500 object nylon polish-brushes to carry out polish-brush process.
The thickness of the photosensitive printing ink layer in described step (2) is 8um, and the baking drying equipment adopted is continuous tunnel furnace, and baking temperature is 125 DEG C, and baking speed is 4m/min; The thickness of the solder mask layer in described step (4) is 23um, and the baking drying equipment adopted is continuous tunnel furnace, and baking temperature is 105 DEG C, and baking speed is 4m/min.
When carrying out line film exposure-processed in described step (2), exposure energy chi controls at 7 lattice; When carrying out welding resistance film exposure-processed in described step (4), exposure energy chi controls at 8 lattice.
The mass concentration of removing black liquid in described step (3) is 6-12%, goes the serviceability temperature of black liquid to be 50 DEG C.
In described step (3), the mass concentration of the developer solution that development treatment adopts is 2%, and developing powder is 30Hz; In described step (5), the mass concentration of the developer solution that development treatment adopts is 0.8%, and developing powder is 40Hz.
It is vertical type oven that described step (5) baking processes the equipment adopted, and adopt constant temperature roasting mode, baking temperature is 140 DEG C, and baking time is 50min.
Short circuit current in described step (7) and open circuit are detected as conducting wire short circuit current and open circuit detects, and the test voltage that conducting wire short circuit current and open circuit detect is 200-250V, and maximum current bearing value is 0.1A.
The mass concentration of the anti-oxidant liquid medicine in described step (8) is 70%, and serviceability temperature is 43 DEG C, and pH is 2.8.
Further comprising the steps of after described step (8): the double-sided PCB board finished product that step (8) obtains to be delivered to visual inspection district and carries out outward appearance detection, detect qualified product and carry out vacuum packaging.
Embodiment 2
The difference of the present embodiment and embodiment 1 is:
The acid solution that described step (1) and the middle pickling processes of step (4) adopt is the sulfuric acid solution of mass concentration 4%; Surperficial polish-brush process in step (1) and step (4) all adopts 500 object nylon polish-brushes to carry out polish-brush process.
The thickness of the photosensitive printing ink layer in described step (2) is 9um, and the baking drying equipment adopted is continuous tunnel furnace, and baking temperature is 125 DEG C, and baking speed is 5m/min; The thickness of the solder mask layer in described step (4) is 25um, and the baking drying equipment adopted is continuous tunnel furnace, and baking temperature is 105 DEG C, and baking speed is 5m/min.
When carrying out line film exposure-processed in described step (2), exposure energy chi controls at 8 lattice; When carrying out welding resistance film exposure-processed in described step (4), exposure energy chi controls at 9 lattice.
The mass concentration of removing black liquid in described step (3) is 6-12%, goes the serviceability temperature of black liquid to be 55 DEG C.
In described step (3), the mass concentration of the developer solution that development treatment adopts is 3%, and developing powder is 35Hz; In described step (5), the mass concentration of the developer solution that development treatment adopts is 0.9%, and developing powder is 45Hz.
It is vertical type oven that described step (5) baking processes the equipment adopted, and adopt constant temperature roasting mode, baking temperature is 145 DEG C, and baking time is 55min.
Short circuit current in described step (7) and open circuit are detected as conducting wire short circuit current and open circuit detects, and the test voltage that conducting wire short circuit current and open circuit detect is 200-250V, and maximum current bearing value is 0.1A.
The mass concentration of the anti-oxidant liquid medicine in described step (8) is 75%, and serviceability temperature is 44 DEG C, and pH is 3.
Further comprising the steps of after described step (8): the double-sided PCB board finished product that step (8) obtains to be delivered to visual inspection district and carries out outward appearance detection, detect qualified product and carry out vacuum packaging.
Embodiment 3
The difference of the present embodiment and embodiment 1 is:
The acid solution that described step (1) and the middle pickling processes of step (4) adopt is the sulfuric acid solution of mass concentration 5%; Surperficial polish-brush process in step (1) and step (4) all adopts 500 object nylon polish-brushes to carry out polish-brush process.
The thickness of the photosensitive printing ink layer in described step (2) is 11um, and the baking drying equipment adopted is continuous tunnel furnace, and baking temperature is 125 DEG C, and baking speed is 5m/min; The thickness of the solder mask layer in described step (4) is 28um, and the baking drying equipment adopted is continuous tunnel furnace, and baking temperature is 105 DEG C, and baking speed is 5m/min.
When carrying out line film exposure-processed in described step (2), exposure energy chi controls at 8 lattice; When carrying out welding resistance film exposure-processed in described step (4), exposure energy chi controls at 10 lattice.
The mass concentration of removing black liquid in described step (3) is 6-12%, goes the serviceability temperature of black liquid to be 60 DEG C.
In described step (3), the mass concentration of the developer solution that development treatment adopts is 2-4%, and developing powder is 40Hz; In described step (5), the mass concentration of the developer solution that development treatment adopts is 1%, and developing powder is 50Hz.
It is vertical type oven that described step (5) baking processes the equipment adopted, and adopt constant temperature roasting mode, baking temperature is 150 DEG C, and baking time is 60min.
Short circuit current in described step (7) and open circuit are detected as conducting wire short circuit current and open circuit detects, and the test voltage that conducting wire short circuit current and open circuit detect is 200-250V, and maximum current bearing value is 0.1A.
The mass concentration of the anti-oxidant liquid medicine in described step (8) is 80%, and serviceability temperature is 45 DEG C, and pH is 3.
Further comprising the steps of after described step (8): the double-sided PCB board finished product that step (8) obtains to be delivered to visual inspection district and carries out outward appearance detection, detect qualified product and carry out vacuum packaging.
Embodiment 4
The difference of the present embodiment and embodiment 1 is:
The acid solution that described step (1) and the middle pickling processes of step (4) adopt is the sulfuric acid solution of mass concentration 5%; Surperficial polish-brush process in step (1) and step (4) all adopts 500 object nylon polish-brushes to carry out polish-brush process.
The thickness of the photosensitive printing ink layer in described step (2) is 14um, and the baking drying equipment adopted is continuous tunnel furnace, and baking temperature is 125 DEG C, and baking speed is 5m/min; The thickness of the solder mask layer in described step (4) is 30um, and the baking drying equipment adopted is continuous tunnel furnace, and baking temperature is 105 DEG C, and baking speed is 5m/min.
When carrying out line film exposure-processed in described step (2), exposure energy chi controls at 8 lattice; When carrying out welding resistance film exposure-processed in described step (4), exposure energy chi controls at 10 lattice.
The mass concentration of removing black liquid in described step (3) is 6-12%, goes the serviceability temperature of black liquid to be 65 DEG C.
In described step (3), the mass concentration of the developer solution that development treatment adopts is 3%, and developing powder is 45Hz; In described step (5), the mass concentration of the developer solution that development treatment adopts is 1.1%, and developing powder is 55Hz.
It is vertical type oven that described step (5) baking processes the equipment adopted, and adopt constant temperature roasting mode, baking temperature is 155 DEG C, and baking time is 65min.
Short circuit current in described step (7) and open circuit are detected as conducting wire short circuit current and open circuit detects, and the test voltage that conducting wire short circuit current and open circuit detect is 200-250V, and maximum current bearing value is 0.1A.
The mass concentration of the anti-oxidant liquid medicine in described step (8) is 85%, and serviceability temperature is 46 DEG C, and pH is 3.
Further comprising the steps of after described step (8): the double-sided PCB board finished product that step (8) obtains to be delivered to visual inspection district and carries out outward appearance detection, detect qualified product and carry out vacuum packaging.
Embodiment 5
The difference of the present embodiment and embodiment 1 is:
The acid solution that described step (1) and the middle pickling processes of step (4) adopt is the sulfuric acid solution of mass concentration 6%; Surperficial polish-brush process in step (1) and step (4) all adopts 500 object nylon polish-brushes to carry out polish-brush process.
The thickness of the photosensitive printing ink layer in described step (2) is 15um, and the baking drying equipment adopted is continuous tunnel furnace, and baking temperature is 125 DEG C, and baking speed is 6m/min; The thickness of the solder mask layer in described step (4) is 33um, and the baking drying equipment adopted is continuous tunnel furnace, and baking temperature is 105 DEG C, and baking speed is 6m/min.
When carrying out line film exposure-processed in described step (2), exposure energy chi controls at 9 lattice; When carrying out welding resistance film exposure-processed in described step (4), exposure energy chi controls at 11 lattice.
The mass concentration of removing black liquid in described step (3) is 12%, goes the serviceability temperature of black liquid to be 70 DEG C.
In described step (3), the mass concentration of the developer solution that development treatment adopts is 4%, and developing powder is 50Hz; In described step (5), the mass concentration of the developer solution that development treatment adopts is 1.2%, and developing powder is 60Hz.
It is vertical type oven that described step (5) baking processes the equipment adopted, and adopt constant temperature roasting mode, baking temperature is 160 DEG C, and baking time is 70min.
Short circuit current in described step (7) and open circuit are detected as conducting wire short circuit current and open circuit detects, and the test voltage that conducting wire short circuit current and open circuit detect is 200-250V, and maximum current bearing value is 0.1A.
The mass concentration of the anti-oxidant liquid medicine in described step (8) is 99%, and serviceability temperature is 47 DEG C, and pH is 3.2.
Further comprising the steps of after described step (8): the double-sided PCB board finished product that step (8) obtains to be delivered to visual inspection district and carries out outward appearance detection, detect qualified product and carry out vacuum packaging.
Above-described embodiment is the present invention's preferably implementation, and in addition, the present invention can also realize by alternate manner, and any apparent replacement is all within protection scope of the present invention without departing from the inventive concept of the premise.
Claims (10)
1. a production technology for double-sided PCB board, is characterized in that: comprise the following steps:
(1) Double-sided copper clad laminate preliminary treatment: Double-sided copper clad laminate is cut to required size according to typesetting figure, then offer location hole at the marginal position of Double-sided copper clad laminate, finally to the two sides of Double-sided copper clad laminate carry out successively surface acid-washing, surperficial polish-brush, washing process and dry;
(2) deposit traces exposure-processed: use Ink Application wheel to be coated with photosensitive printing ink layer on the surface of Double-sided copper clad laminate, and dry process is toasted to photosensitive printing ink layer, finally line film exposure-processed is carried out to the Double-sided copper clad laminate that drying completes;
(3) circuit develops, etches, goes ink process: Double-sided copper clad laminate is placed in developing machine and carries out development treatment, develop unnecessary circuit, after Manual Visual Inspection, Double-sided copper clad laminate is placed in the circuit that etching machine etching removing is unnecessary, finally make to spend black liquid the photosensitive printing ink layer on circuit surface to be removed, cleaning removes black liquid, dries Double-sided copper clad laminate;
(4) welding resistance preliminary treatment: again surface acid-washing, surperficial polish-brush process and washing process are carried out successively to the surface of Double-sided copper clad laminate, and use Ink Application wheel to be coated with solder mask layer on the surface of Double-sided copper clad laminate, and dry process is toasted to solder mask layer, the Double-sided copper clad laminate finally completed drying carries out welding resistance film exposure-processed;
(5) welding resistance development, process of carving characters: Double-sided copper clad laminate is placed in developing machine and carries out development treatment, item number corresponding in printing, finally carries out baking process to Double-sided copper clad laminate, makes solder mask layer and word ink solidification;
(6) forming processes: the mechanical hole in the Double-sided copper clad laminate adopting CNC processing technology to obtain step (5) carries out processing and processes, V-Cut processing technology is adopted to carry out machining to Double-sided copper clad laminate again, form V-type and divide board slot, finally the Double-sided copper clad laminate after shaping is cleaned, after the aluminium bits that removing is residual and plate powder, make drying and processing;
(7) test: respectively short circuit current is carried out to the Double-sided copper clad laminate after shaping and open circuit detects;
(8) antioxygen process: surperficial polish-brush process is carried out to the Double-sided copper clad laminate that step (7) obtains, re-use the surface using degreaser and micro-etching agent process Double-sided copper clad laminate respectively, finally be coated with anti-oxidant liquid medicine on the surface of Double-sided copper clad laminate, make its surface form the anti-oxidant rete of one deck, obtain double-sided PCB board finished product.
2. the production technology of a kind of double-sided PCB board according to claim 1, is characterized in that: the acid solution that described step (1) and the middle pickling processes of step (4) adopt is the sulfuric acid solution of mass concentration 3-6%; Surperficial polish-brush process in step (1) and step (4) all adopts 500 object nylon polish-brushes to carry out polish-brush process.
3. the production technology of a kind of double-sided PCB board according to claim 1, it is characterized in that: the thickness of the photosensitive printing ink layer in described step (2) is 8-15um, the baking drying equipment adopted is continuous tunnel furnace, and baking temperature is 125 DEG C, and baking speed is 4-6m/min; The thickness of the solder mask layer in described step (4) is 23-33um, and the baking drying equipment adopted is continuous tunnel furnace, and baking temperature is 105 DEG C, and baking speed is 4-6m/min.
4. the production technology of a kind of double-sided PCB board according to claim 1, is characterized in that: when carrying out line film exposure-processed in described step (2), exposure energy chi controls at 7-9 lattice; When carrying out welding resistance film exposure-processed in described step (4), exposure energy chi controls at 8-11 lattice.
5. the production technology of a kind of double-sided PCB board according to claim 1, is characterized in that: the mass concentration of removing black liquid in described step (3) is 6-12%, goes the serviceability temperature of black liquid to be 50-70 DEG C.
6. the production technology of a kind of double-sided PCB board according to claim 1, is characterized in that: in described step (3), the mass concentration of the developer solution that development treatment adopts is 2-4%, and developing powder is 30-50Hz; In described step (5), the mass concentration of the developer solution that development treatment adopts is 0.8-1.2%, and developing powder is 40-60Hz.
7. the production technology of a kind of double-sided PCB board according to claim 1, is characterized in that: it is vertical type oven that described step (5) baking processes the equipment adopted, and adopt constant temperature roasting mode, baking temperature is 140-160 DEG C, and baking time is 50-70min.
8. the production technology of a kind of double-sided PCB board according to claim 1, it is characterized in that: the short circuit current in described step (7) and open circuit are detected as conducting wire short circuit current and open circuit detects, the test voltage that conducting wire short circuit current and open circuit detect is 200-250V, and maximum current bearing value is 0.1A.
9. the production technology of a kind of double-sided PCB board according to claim 1, is characterized in that: the mass concentration of the anti-oxidant liquid medicine in described step (8) is 70-99%, and serviceability temperature is 43-47 DEG C, pH is 2.8-3.2.
10. the production technology of a kind of double-sided PCB board according to claim 1, it is characterized in that: further comprising the steps of after described step (8): the double-sided PCB board finished product that step (8) obtains to be delivered to visual inspection district and carries out outward appearance detection, detect qualified product and carry out vacuum packaging.
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| CN105887086A (en) * | 2016-06-07 | 2016-08-24 | 共青城超群科技协同创新股份有限公司 | Anchor type three-dimensional etching method |
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| CN108055783A (en) * | 2017-12-15 | 2018-05-18 | 深圳市景旺电子股份有限公司 | A kind of pcb board inner figure production method |
| CN108112195B (en) * | 2018-01-23 | 2020-07-17 | 江西景旺精密电路有限公司 | Method for manufacturing multilayer circuit board |
| CN108112195A (en) * | 2018-01-23 | 2018-06-01 | 江西景旺精密电路有限公司 | A kind of manufacturing method of multi-layer circuit board |
| CN108712824A (en) * | 2018-06-04 | 2018-10-26 | 南通海舟电子科技有限公司 | The two-sided anti-oxidation PCB circuit board production technology of high-performance |
| CN108966520A (en) * | 2018-07-02 | 2018-12-07 | 昆山万源通电子科技有限公司 | Anti- plagiarism shielded type PCB printing technology |
| CN109462943A (en) * | 2018-12-14 | 2019-03-12 | 惠州市和鑫达电子科技有限公司 | A kind of pcb board production technology suitable for 3.2mm substrate |
| CN110732854A (en) * | 2019-10-26 | 2020-01-31 | 江西江南精密科技有限公司 | Production process of precision heat-dissipation copper blocks |
| CN111182738A (en) * | 2020-01-15 | 2020-05-19 | 珠海崇达电路技术有限公司 | Method for manufacturing characters on large copper surface of PCB |
| CN111182738B (en) * | 2020-01-15 | 2021-01-15 | 珠海崇达电路技术有限公司 | Method for manufacturing characters on large copper surface of PCB |
| CN111601460A (en) * | 2020-05-30 | 2020-08-28 | 涟水县苏杭科技有限公司 | Multi-spelling two-color solder mask, character plug hole adding and tin melting surface treatment processing method |
| CN114578029A (en) * | 2022-03-02 | 2022-06-03 | 江苏可信电子材料有限公司 | PCB solder mask ink performance testing method |
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