CN110557897A - Production process of environment-friendly printed circuit board - Google Patents
Production process of environment-friendly printed circuit board Download PDFInfo
- Publication number
- CN110557897A CN110557897A CN201910955793.5A CN201910955793A CN110557897A CN 110557897 A CN110557897 A CN 110557897A CN 201910955793 A CN201910955793 A CN 201910955793A CN 110557897 A CN110557897 A CN 110557897A
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- Prior art keywords
- printing
- circuit board
- environment
- circuit
- copper
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Abstract
the production process of the environment-friendly printed circuit board adopts the direct printing process technology of copper paste to directly embody the circuit image on an insulating substrate, reduces the production procedures of traditional circuit boards such as manufacturing of copper-clad plates, grinding of plates, etching, film stripping and the like, simplifies the processing process, saves resources, is economical, environment-friendly and safe in operation, and effectively solves the problems of waste water and waste liquid produced by the traditional process, environmental pollution, long production period, high cost and the like.
Description
Technical Field
The invention relates to the technical field of circuit board printing, in particular to a production process of an environment-friendly printed circuit board.
background
traditional printed circuit board production technology, be through printing ink printing mode printed circuit image on the copper-clad plate, unnecessary copper foil etching is clean on the copper-clad plate to the mode of rethread chemical liquid medicine corruption, thereby form the circuit image that can satisfy the electrical property ability, can consume a large amount of water resources at this in-process, can frequently use dangerization article in addition in the etching process, like sulphuric acid, caustic soda, liquid chlorine etc. increased the operational risk, can produce heavy metal pollutant simultaneously, the polluted environment, traditional technology production processes are numerous, the cycle length, it is with high costs.
Disclosure of Invention
Aiming at the situation, in order to overcome the defects of the prior art, the invention aims to provide the production process of the environment-friendly printed circuit board, which effectively solves the problems of low safety performance, environmental pollution, long period, high cost and the like.
the technical scheme for solving the problem is that the method comprises the following steps:
s1 insulator substrate without cu foil on the surface thereof;
S2 cutting, namely cutting the insulating substrate, and cutting the large material into required sizes according to the size of the makeup;
s3, printing the circuit, namely printing the required circuit image on the insulating substrate directly in a screen printing mode, wherein the printing material is copper paste;
s4, baking at 160 ℃ for 30 minutes to meet the standard of line resistance of less than 5 ohm/m;
S5 solder resist printing: printing solder resist ink on the surface of the circuit in a screen printing mode;
Character S6: printing characters on the surface of the solder mask in a silk-screen printing mode;
s7 forming: processing the appearance of the circuit board in a punch die or a numerical control gong machine and the like;
S8 cleaning: the whole cleaning process uses conventional tap water and requires acid-free operation, the operation parameters of the cleaning procedure require that the transmission speed is within 6M/MIN, the drying temperature is 100 ℃, and the abrasion pressure is 2.5-3A;
S9 checking and packaging: and (5) checking whether the circuit board package is complete.
the invention adopts the direct printing process technology of copper paste to directly embody the circuit image on the insulating substrate, reduces the traditional circuit board production procedures of manufacturing, board grinding, etching, film stripping and the like of the copper-clad plate, simplifies the processing technology, saves a large amount of energy, does not generate any waste gas and waste liquid in the process, and effectively solves the problems of energy consumption and high pollution in the circuit board production industry.
Drawings
fig. 1 is a conventional printed wiring board production process.
fig. 2 is a process for producing a printed wiring board of the present invention.
Detailed Description
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
as shown in fig. 1 to 2, a process for producing an environmentally friendly printed wiring board includes the steps of:
S1 insulator substrate without cu foil on the surface thereof;
S2 cutting, namely cutting the insulating substrate, and cutting the large material into required sizes according to the size of the makeup;
S3, printing the circuit, namely printing the required circuit image on the insulating substrate directly in a screen printing mode, wherein the printing material is copper paste;
s4, baking at 160 ℃ for 30 minutes to meet the standard of line resistance of less than 5 ohm/m;
s5 solder resist printing: printing solder resist ink on the surface of the circuit in a screen printing mode;
character S6: printing characters on the surface of the solder mask in a silk-screen printing mode;
s7 forming: processing the appearance of the circuit board in a punch die or a numerical control gong machine and the like;
s8 cleaning: the cleaning process is another key point of the production process of the environment-friendly printed circuit board, the use of customers (influencing the welding firmness of components of the customers) is directly influenced by the quality of the cleaning effect, the whole cleaning process only needs conventional tap water, but the cleaning process is different from the traditional process in which acid is added and micro-etching is carried out to remove oxidation, the new process requires no acid operation, the operation parameters of the cleaning process require that the transmission speed is within 6M/MIN, the drying temperature is 100 ℃, and the abrasion pressure is 2.5-3A;
s9 checking and packaging: whether the packaging of the circuit board is complete or not is checked, and the cleaned product needs to be subjected to glove operation in the checking and transporting process and cannot be directly contacted by hands, so that the oxidation is prevented, and the welding is prevented from being influenced.
In the step S3, the thickness of the copper paste is controlled by the mesh size according to the copper foil thickness requirement required by a customer, and the copper foil is thick and has a large mesh; the copper foil is thin, the meshes are small, and the copper paste has the same viscosity and fluidity as the circuit ink.
When the invention is used, the production of the diffuse reflection light bar product circuit board for the light source lighting product is taken as an example for explanation, the circuit board is produced by adopting the production process technology of the environment-friendly printed circuit board, and the method specifically comprises the following steps:
1) Selecting an appropriate insulator substrate: directly ordering aluminum plates with the plate thickness of 0.75mm from an aluminum plate factory (the specification requirement of a client plate is 0.8mm and 18 um), wherein the surfaces of the aluminum plates are free of copper foils;
2) cutting: cutting the ordered large materials into sizes of 950mm to 250mm according to the makeup requirement;
3) Printing a circuit: using copper paste with the same viscosity and fluidity as the circuit printing ink, printing a given circuit image on an insulating substrate by adopting 90T gauze, and keeping the cleanliness of a printing table surface before and during printing;
4) baking: placing the circuit board in a baking oven, setting the temperature of the baking oven at 160 ℃ for 30 minutes, and testing the resistance of two ends of the circuit after baking to be 125 ohms, so that the resistance value meets the standard that the resistance value reaches below 5 ohms/meter;
5) solder resist printing: printing white solder resist ink on the surface of the circuit in a screen printing mode;
6) character: printing black character ink on the surface of the solder mask in a silk-screen printing mode;
7) Molding: the circuit board is formed in a punching mode of a punch press, the board and the board can be connected through the V-shaped cut groove, and meanwhile, the board is convenient to divide after the surface mounting is finished;
8) cleaning: the operation parameters of the cleaning procedure are set to be 6M/MIN, the drying temperature is 100 ℃, the abrasion pressure is 2.8A, and the surface of the product after being brushed is bright and has no oxidation;
9) And (3) inspecting and packaging: the cleaned product needs to be handled by wearing gloves during the inspection and transportation process, and can not be directly contacted by hands, thereby preventing oxidation, influencing welding and checking whether the package is complete or not.
Compared with the traditional process, the invention has the following advantages: 1) the water consumption of a traditional printing plate production process treatment line is large, the water consumption per square meter of 1 ten thousand produced is counted to be more than 200 tons, and the water consumption by using a new process technology is reduced to be controlled within 50 tons per square meter of 1 ten thousand produced; 2) the etching process in the traditional process technology generates heavy metal pollutants such as waste liquid COD, copper and the like, and the new process technology is used for canceling the etching process to ensure that the generation amount of the heavy metal pollutants is zero; 3) dangerous chemicals such as sulfuric acid, caustic soda, liquid ammonia and the like are frequently used in the production process of the traditional process, and the dangerous chemicals are completely cancelled by using a new process technology, so that the production safety index is increased, and the operation safety of workers is guaranteed; 4) the traditional process has the advantages of various production procedures, long period and high cost, and the production procedures of the circuit board are reduced, the production period is shortened and the production cost is reduced through a new process technology.
The production process technology of the environment-friendly circuit board provided by the invention is energy-saving, environment-friendly, low in cost, high in efficiency, simple to operate, safe and effective, and has good market prospect, and the requirements of national energy conservation, emission reduction, environment protection and the like are met.
Claims (2)
1. the production process of the environment-friendly printed circuit board is characterized by comprising the following steps of:
s1 insulator substrate without cu foil on the surface thereof;
S2 cutting, namely cutting the insulating substrate, and cutting the large material into required sizes according to the size of the makeup;
s3, printing the circuit, namely printing the required circuit image on the insulating substrate directly in a screen printing mode, wherein the printing material is copper paste;
s4, baking at 160 ℃ for 30 minutes to meet the standard of line resistance of less than 5 ohm/m;
s5 solder resist printing: printing solder resist ink on the surface of the circuit in a screen printing mode;
Character S6: printing characters on the surface of the solder mask in a silk-screen printing mode;
S7 forming: processing the appearance of the circuit board in a punch die or a numerical control gong machine and the like;
S8 cleaning: the whole cleaning process uses conventional tap water and requires acid-free operation, the operation parameters of the cleaning procedure require that the transmission speed is within 6M/MIN, the drying temperature is 100 ℃, and the abrasion pressure is 2.5-3A;
S9 checking and packaging: and (5) checking whether the circuit board package is complete.
2. the process for producing an environmentally friendly printed wiring board as claimed in claim 1, wherein the thickness of the copper paste in step S3 is controlled by mesh size according to the copper foil thickness requirement of the customer, the copper foil thickness being larger than the mesh size; the copper foil is thin, and the mesh is small.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910955793.5A CN110557897A (en) | 2019-10-09 | 2019-10-09 | Production process of environment-friendly printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910955793.5A CN110557897A (en) | 2019-10-09 | 2019-10-09 | Production process of environment-friendly printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110557897A true CN110557897A (en) | 2019-12-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910955793.5A Pending CN110557897A (en) | 2019-10-09 | 2019-10-09 | Production process of environment-friendly printed circuit board |
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| Country | Link |
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| CN (1) | CN110557897A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112128720A (en) * | 2020-09-16 | 2020-12-25 | 浙江常山德讯达电子科技有限公司 | Circuit heat dissipation integrated heat dissipation aluminum substrate and LED lamp |
| CN113784535A (en) * | 2021-08-31 | 2021-12-10 | 龙南鼎泰电子科技有限公司 | Printed circuit board manufacturing system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR970009481A (en) * | 1995-07-31 | 1997-02-24 | 이형도 | Manufacturing method of multilayer ceramic circuit board |
| US20100009070A1 (en) * | 2006-10-17 | 2010-01-14 | Showa Denko K.K. | Method for forming solder layer on printed-wiring board and slurry discharge device |
| CN103889141A (en) * | 2012-12-20 | 2014-06-25 | 北京中科纳通科技有限公司 | High-heat-dissipating aluminium-based LED circuit board and preparation method thereof |
| CN108834325A (en) * | 2018-08-15 | 2018-11-16 | 郑胜 | A kind of production method of one-sided circuit board |
-
2019
- 2019-10-09 CN CN201910955793.5A patent/CN110557897A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR970009481A (en) * | 1995-07-31 | 1997-02-24 | 이형도 | Manufacturing method of multilayer ceramic circuit board |
| US20100009070A1 (en) * | 2006-10-17 | 2010-01-14 | Showa Denko K.K. | Method for forming solder layer on printed-wiring board and slurry discharge device |
| CN103889141A (en) * | 2012-12-20 | 2014-06-25 | 北京中科纳通科技有限公司 | High-heat-dissipating aluminium-based LED circuit board and preparation method thereof |
| CN108834325A (en) * | 2018-08-15 | 2018-11-16 | 郑胜 | A kind of production method of one-sided circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112128720A (en) * | 2020-09-16 | 2020-12-25 | 浙江常山德讯达电子科技有限公司 | Circuit heat dissipation integrated heat dissipation aluminum substrate and LED lamp |
| CN113784535A (en) * | 2021-08-31 | 2021-12-10 | 龙南鼎泰电子科技有限公司 | Printed circuit board manufacturing system |
| CN113784535B (en) * | 2021-08-31 | 2023-02-03 | 龙南鼎泰电子科技有限公司 | Printed circuit board manufacturing system |
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Application publication date: 20191210 |
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