CN112128720A - Circuit heat dissipation integrated heat dissipation aluminum substrate and LED lamp - Google Patents
Circuit heat dissipation integrated heat dissipation aluminum substrate and LED lamp Download PDFInfo
- Publication number
- CN112128720A CN112128720A CN202010971986.2A CN202010971986A CN112128720A CN 112128720 A CN112128720 A CN 112128720A CN 202010971986 A CN202010971986 A CN 202010971986A CN 112128720 A CN112128720 A CN 112128720A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- aluminum substrate
- circuit
- led lamp
- dissipation aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 46
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 34
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 22
- 239000011324 bead Substances 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000005530 etching Methods 0.000 abstract description 9
- 238000007639 printing Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004134 energy conservation Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 238000004140 cleaning Methods 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010019 resist printing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention relates to a circuit heat dissipation integrated heat dissipation aluminum substrate, which is printed with a circuit taking copper paste as a material. The invention also relates to an LED lamp with the circuit heat dissipation integrated heat dissipation aluminum substrate, wherein the heat dissipation aluminum substrate is arranged on a lamp holder, and the LED lamp bead is fixed on the heat dissipation aluminum substrate. The invention adopts a mode of directly printing the circuit on the heat-radiating aluminum substrate to realize that the circuit and the heat-radiating function are directly integrated, thereby saving the manufacturing links of the copper-clad plate and the circuit board and the split assembly process of the circuit board and the heat radiator, greatly reducing the working procedure links, avoiding etching by using etching solution, reducing the production cost, reducing the pollution and obtaining the effects of energy conservation and environmental protection.
Description
Technical Field
The invention relates to the technical field of LEDs (light emitting diode), in particular to a circuit heat dissipation integrated heat dissipation aluminum substrate and an LED lamp with the circuit heat dissipation integrated heat dissipation aluminum substrate.
Background
LEDs, i.e. semiconductor electric light sources, light emitting diodes, also called semiconductor lamps, are an electric light source without filaments, which directly convert electrical energy into light energy. The LED lamp has the characteristics of energy conservation and long service life, avoids the trouble that the bulb needs to be replaced frequently, and is favored by more and more users.
The radiator and the circuit board of the LED lamp in the traditional market are assembled in a split mode, namely the LED lamp is formed through the processes of pasting copper foil on an aluminum plate to manufacture a copper-clad plate, etching the copper-clad plate to form the circuit board, pasting lamp beads on the circuit board, pasting the circuit board on the radiator and assembling. However, the forming process is complicated in process and high in production cost, and the copper-clad plate needs to be etched and processed during production of the circuit board, so that pollution is caused.
Disclosure of Invention
The invention aims to solve the technical problem of providing a circuit heat dissipation integrated heat dissipation aluminum substrate to solve the problems of complicated working procedures, high production cost and etching pollution. Meanwhile, the invention also provides the LED lamp with the circuit heat dissipation integrated.
In order to solve the technical problems, the invention provides the following technical scheme: a circuit heat dissipation integrated heat dissipation aluminum substrate is provided, wherein a circuit made of copper paste is printed on the heat dissipation aluminum substrate.
The utility model provides a LED lamp of circuit heat dissipation integration, includes lamp stand, LED lamp pearl, as above-mentioned aluminium base board dispels the heat, aluminium base board dispels the heat is installed on the lamp stand, LED lamp pearl is fixed on aluminium base board dispels the heat.
On the basis of the scheme, the LED lamp beads are arranged on the heat dissipation aluminum substrate through a surface mounting process, and after the surface mounting process is finished, the LED lamp beads are fixed on the heat dissipation aluminum substrate through a stamping mode.
Compared with the prior art, the invention has the beneficial effects that: the invention adopts a mode of directly printing the circuit on the heat-radiating aluminum substrate to realize that the circuit and the heat-radiating function are directly integrated, thereby saving the manufacturing links of the copper-clad plate and the circuit board and the split assembly process of the circuit board and the heat radiator, greatly reducing the working procedure links, avoiding etching by using etching solution, reducing the production cost, reducing the pollution and obtaining the effects of energy conservation and environmental protection.
Drawings
FIG. 1 is a schematic view of an LED lamp according to the present invention;
the reference numbers in the figures are: the LED lamp comprises a heat dissipation aluminum substrate-11, a lamp holder-12 and LED lamp beads-13.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, in the present embodiment, a circuit-integrated heat dissipating aluminum substrate is provided, on which a circuit (not shown) using copper paste as a material is printed.
The embodiment further provides a circuit heat dissipation integrated LED lamp, which comprises a lamp holder 12, LED lamp beads 13 and the heat dissipation aluminum substrate 11, wherein the heat dissipation aluminum substrate 11 is installed on the lamp holder 12, the LED lamp beads 13 are arranged on the heat dissipation aluminum substrate 11 through a surface mounting process, and after the surface mounting process is finished, the LED lamp beads 13 are fixed on the heat dissipation aluminum substrate 11 through a stamping mode.
The specific manufacturing process of the LED lamp can comprise the following steps:
s1 heat-dissipating insulating substrate: selecting a heat dissipation aluminum substrate 11 without a copper foil on the surface as a heat dissipation insulating substrate;
s2 cutting: cutting a rectangular radiating insulating substrate, and cutting a large material into required sizes according to the size of a makeup;
s3 printed wiring: directly brushing a required circuit image on a heat-dissipation insulating substrate in a screen printing mode, wherein the printing material is copper paste;
s4 baking: the baking condition is 160 ℃, thirty minutes, and the qualified baking standard is that the resistance value of the line reaches below 5 ohm/meter;
s5 solder resist printing: printing solder resist ink on the surface of the circuit in a screen printing mode;
s6 forming: processing the appearance of the circuit board in a mode of a punch die or a numerical control gong machine and the like;
s7 cleaning: the cleaning process is another key point of the production process of the environment-friendly printed circuit board, the use of customers (influencing the welding firmness of components of the customers) is directly influenced by the quality of the cleaning effect, the whole cleaning process only needs conventional tap water, but the cleaning process is different from the traditional process in which acid is added and micro-etching is carried out to remove oxidation, the new process requires no acid operation, the operation parameters of the cleaning process require that the transmission speed is within 6M/MIN, the drying temperature is 100 ℃, and the abrasion pressure is 2.5-3A;
s8 paster: after the circuit board is printed on the heat dissipation insulating substrate, the LED lamp beads 13 are directly pasted;
s9 stamping: and (4) performing punch forming and assembling after the LED lamp bead 13 is pasted.
According to the invention, the circuit and the heat dissipation function are directly integrated by directly printing the circuit on the heat dissipation aluminum substrate, so that the manufacturing links of a copper-clad plate and a circuit board and the split assembly process of the circuit board and a heat radiator are omitted, the process links are greatly reduced, the heat dissipation performance is better than that of the traditional LED product, the product quality and the production efficiency are improved, etching processing is not required to be carried out by using etching liquid, the production cost is reduced, the pollution is reduced, and the effects of energy conservation and environmental protection are obtained.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (3)
1. The circuit heat dissipation integrated heat dissipation aluminum substrate is characterized in that a circuit made of copper paste is printed on the heat dissipation aluminum substrate (11).
2. The LED lamp integrating circuit heat dissipation comprises a lamp holder (12) and LED lamp beads (13), and is characterized by further comprising the heat dissipation aluminum substrate (11) in claim 1, wherein the heat dissipation aluminum substrate (11) is mounted on the lamp holder (12), and the LED lamp beads (13) are fixed on the heat dissipation aluminum substrate (11).
3. The line heat dissipation integrated LED lamp according to claim 2, wherein the LED lamp beads (13) are arranged on the heat dissipation aluminum substrate (11) through a surface mounting process, and after the surface mounting process is finished, the LED lamp beads (13) are fixed on the heat dissipation aluminum substrate (11) through a stamping mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010971986.2A CN112128720A (en) | 2020-09-16 | 2020-09-16 | Circuit heat dissipation integrated heat dissipation aluminum substrate and LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010971986.2A CN112128720A (en) | 2020-09-16 | 2020-09-16 | Circuit heat dissipation integrated heat dissipation aluminum substrate and LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112128720A true CN112128720A (en) | 2020-12-25 |
Family
ID=73845811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010971986.2A Pending CN112128720A (en) | 2020-09-16 | 2020-09-16 | Circuit heat dissipation integrated heat dissipation aluminum substrate and LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112128720A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101146409A (en) * | 2006-09-11 | 2008-03-19 | 台湾积层工业股份有限公司 | Device and method for making conductive antenna based on concave printing technology |
| CN102858093A (en) * | 2011-06-30 | 2013-01-02 | 株式会社德山 | Plating method of circuit substrate, production method of plated circuit substrate and silver etching liquid |
| CN108730908A (en) * | 2018-06-04 | 2018-11-02 | 广州欧浦朗电器有限公司 | LED car lamp and its manufacture craft with cooling mechanism and control method |
| CN110557897A (en) * | 2019-10-09 | 2019-12-10 | 新野县立新电子有限公司 | Production process of environment-friendly printed circuit board |
| CN210291447U (en) * | 2019-09-12 | 2020-04-10 | 绵阳市中野科技有限公司 | Environment-friendly ball bubble lamp with heat radiation structure |
-
2020
- 2020-09-16 CN CN202010971986.2A patent/CN112128720A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101146409A (en) * | 2006-09-11 | 2008-03-19 | 台湾积层工业股份有限公司 | Device and method for making conductive antenna based on concave printing technology |
| CN102858093A (en) * | 2011-06-30 | 2013-01-02 | 株式会社德山 | Plating method of circuit substrate, production method of plated circuit substrate and silver etching liquid |
| CN108730908A (en) * | 2018-06-04 | 2018-11-02 | 广州欧浦朗电器有限公司 | LED car lamp and its manufacture craft with cooling mechanism and control method |
| CN210291447U (en) * | 2019-09-12 | 2020-04-10 | 绵阳市中野科技有限公司 | Environment-friendly ball bubble lamp with heat radiation structure |
| CN110557897A (en) * | 2019-10-09 | 2019-12-10 | 新野县立新电子有限公司 | Production process of environment-friendly printed circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 钟名湖: "《LED照明的技术生态与跨域应用》" * |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201225 |
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| RJ01 | Rejection of invention patent application after publication |