CN105007691B - Fine-line printed board etch process - Google Patents
Fine-line printed board etch process Download PDFInfo
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- CN105007691B CN105007691B CN201510507190.0A CN201510507190A CN105007691B CN 105007691 B CN105007691 B CN 105007691B CN 201510507190 A CN201510507190 A CN 201510507190A CN 105007691 B CN105007691 B CN 105007691B
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- printed board
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- stainless steel
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000005530 etching Methods 0.000 claims abstract description 92
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 22
- 239000010935 stainless steel Substances 0.000 claims abstract description 22
- 238000010923 batch production Methods 0.000 claims abstract description 19
- 239000007788 liquid Substances 0.000 claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 claims abstract description 19
- 238000001514 detection method Methods 0.000 claims abstract description 12
- 230000003628 erosive effect Effects 0.000 claims abstract description 8
- 238000005406 washing Methods 0.000 claims abstract description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 239000011889 copper foil Substances 0.000 claims description 16
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 230000002745 absorbent Effects 0.000 claims description 10
- 239000002250 absorbent Substances 0.000 claims description 10
- 210000002268 wool Anatomy 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 5
- 238000001914 filtration Methods 0.000 claims description 5
- 239000004519 grease Substances 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 239000010949 copper Substances 0.000 description 6
- 230000005611 electricity Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 230000008929 regeneration Effects 0.000 description 2
- 238000011069 regeneration method Methods 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The present invention relates to fine-line printed board etch process, comprise the following steps：S1, open cylinder and match somebody with somebody liquid；S2, start check；S3, start；S4, initial workpiece etching：Printed board etching to each model carries out initial workpiece etching, and its concrete operation step is as follows：S41, surface clean；S42, patch dry film；S43, sting erosion：Printed board is placed in stainless steel Hanging Basket and fixed up and down, stainless steel Hanging Basket inserted in the etching groove that step S1 is prepared, it is 45~53 DEG C to control temperature in etching groove, and nozzle exit pressure is 2.0~3.5 kg/cm2, 3min~5min is gently vibrated, is taken out after window dissolving；S44, washing；S45, ink retreating；S46, detection；S5, batch production：After step S46 detections are qualified, then polylith is put with the printed board of model and produced in batches on a production line according to step S41~S45, inspected by random samples in batch production process.The advantage of the invention is that：Batch substandard product can be avoided the occurrence of and etch effect is good.
Description
Technical field
The present invention relates to the production technical field of printed circuit board, particularly fine-line printed board etch process.
Background technology
The design of electronic instrument circuits all at present is based on printed circuit board (PCB), with electronics work with being connected mostly
The scientific and technological progress of industry, printed board develop to the direction of multiple stratification, densification, and etch process is progressively from past extensive to specialty
Change development.Etching is the necessary process in printed wiring board production, but as its degree that becomes more meticulous improves, traditional etching work
Skill has begun to realize, especially lateral erosion problem is increasingly severe.Corrode copper foil bearing printed circuit board in electronics industry
Shi Jing frequently with method be ferric trichloride chemical corrosion method, it has the disadvantage that：It may not apply to anti-plating method new technology；Three
Iron chloride consumption is big；Etchant solution capacity is small；Working condition difference etc..It is more complicated to handle used solution process, reclaim copper and
Regeneration ferric trichloride is required for more complicated equipment and larger investment.
The some regions being frequently necessary in fine-line board production in base material output the window of design requirement size, if
Plasma etching or laser ablation methods are selected, there is in advance that input and maintenance cost are too high, and to the requirement of operator
Also the deficiencies of high；And machinery punching is used, it often can be only applied to some single or double flexible electricals not high to required precision
In the plate of road, the production to small-sized, the highdensity fine-line multilayer circuit board of high added value can not be but completed.
Traditional circuit printed board, after the completion of once technological parameter is formulated, will be produced in batches directly in production, but
It is if a certain processing step goes wrong, causes PCB Production unqualified, it will to cause bulk article unqualified.Traditional
Etching solution use condition is indefinite in etching groove, it is unclear that when needs to be adjusted etching solution, this will be big
Big influence etch effect.
The content of the invention
The shortcomings that it is an object of the invention to overcome prior art, there is provided one kind can avoid the occurrence of batch substandard product with
And the fine-line printed board etch process that etch effect is good.
The purpose of the present invention is achieved through the following technical solutions：Fine-line printed board etch process, including following step
Suddenly：
S1, open cylinder and match somebody with somebody liquid：Inboard wall of cylinder block is rinsed, eliminating impurities are clean, then add water extremely into ink retreating cylinder
The 1/3 of ink retreating cylinder volume, then NaOH is added into ink retreating cylinder, then clear water is added to cylinder body requirement liquid level into ink retreating cylinder so that
Solution concentration is 3~8% in cylinder body；Etching solution is added into etching groove, and makes Cu2+Concentration be 135~160g/L, Cl-It is dense
Spend for 180~210g/L；
S2, start check：Including following sub-step：
S21, check nozzle：Check each nozzle in Plate grinder, it is ensured that its nozzles clear, and nozzle hangs down with printed board plate face
Directly；
S22, check filtration core：Each filter core checked on Plate grinder, it is ensured that no-sundries in filter core, and breakage is changed in time
Filter core；
S23, check absorbent wool：Ensure that absorbent wool wheel keeps cleaning, and be in semi-moist state, and without breakage；
S3, start：Plate grinder is required to start in strict accordance with operation, controlling transmission velocity interval is 2~4m/min；
S4, initial workpiece etching：Printed board etching to each model carries out initial workpiece etching, and its concrete operation step is as follows：
S41, surface clean：1~3 printed board with model is successively placed on production line, printing board surface is carried out
Cleaning, 2min~6min in acid deoiling liquid is put into, removes grease pollution and oxide layer in plate face, it is ensured that plate face cleans, and dries
It is dry；
S42, patch dry film, stick copper foil layer, it is necessary to which the part for etching windowing does not cover copper foil layer, remaining is in printed board
It is completely covered；Post and carry out Double-face adhesive multilayer dry film again on the outside of the printed board of copper foil layer；
S43, sting erosion：Printed board is placed in stainless steel Hanging Basket and fixed up and down, stainless steel Hanging Basket is inserted into step S1 institutes
In the etching groove of preparation, it is 45~53 DEG C to control temperature in etching groove, and nozzle exit pressure is 2.0~3.5 kg/cm2, is gently vibrated
3min~5min, taken out after window dissolving；
S44, washing：Stainless steel Hanging Basket equipped with printed board is rinsed with water, untill etching solution is washed out completely；
S45, ink retreating：Stainless steel Hanging Basket is put into ink retreating cylinder together with printed board, it is 40 to control ink retreating cylinder temperature
~50 DEG C, nozzle exit pressure is 1.0~2.5kg/cm2, gently vibrates 1min~3min, after dry film is completely dissolved, takes out drying；
S46, detection：Obtained initial workpiece product is put and detected under watch window under the microscope, then tester electricity
Gas performance；
S5, batch production：Step S46 detection it is qualified after, then by polylith with the printed board of model put on a production line according to
Step S41~S45 is produced in batches, is inspected by random samples in batch production process.
It is additionally included in batch production process and the proportion of etching solution is detected with densimeter, when etching solution proportion is less than
When 1.1, then Cu is added into etching groove2+And Cl-, make its proportion between 1.1~2.5.
For etching solution in described etching groove also added with hydrogen peroxide, the volume of wherein hydrogen peroxide accounts for the 25% of etching solution volume.
The present invention has advantages below：
1st, for the present invention before the printed board batch production of same model, the printed board to the model carries out initial workpiece etching life
Production, carried out fully according to the etch process step of printed board, and initial workpiece etching is detected, it is raw to carry out batch after qualified again
Production, and printed board is inspected by random samples in batch production process, if there is substandard product, adjustment, can be avoided out in time
Now high-volume substandard product occurs.
2nd, when etching solution proportion is less than 1.1, then Cu is added into etching groove2+And Cl-, make its proportion 1.1~2.5 it
Between, it can be ensured that etching process is carried out completely, and is in optimum state, can effectively improve the etch effect of etched circuit board.Work as erosion
Etched circuit board area is more than 4000m2Afterwards, the liquid in ink retreating cylinder is changed, while etching solution is monthly changed, can be true
Protect liquid active in cylinder.
3rd, hydrogen peroxide is added in etching groove, stannous chloride oxidation regeneration can be made, reclaimed.
Embodiment
The present invention will be further described below, but protection scope of the present invention be not limited to it is as described below.
【Embodiment 1】：
Fine-line printed board etch process, comprises the following steps：
S1, open cylinder and match somebody with somebody liquid：Inboard wall of cylinder block is rinsed, eliminating impurities are clean, then add water extremely into ink retreating cylinder
The 1/3 of ink retreating cylinder volume, then NaOH is added into ink retreating cylinder, then clear water is added to cylinder body requirement liquid level into ink retreating cylinder so that
Solution concentration is 8% in cylinder body；Etching solution is added into etching groove, and makes Cu2+Concentration be 160g/L, Cl-Concentration be
210g/L；
S2, start check：Including following sub-step：
S21, check nozzle：Check each nozzle in Plate grinder, it is ensured that its nozzles clear, and nozzle hangs down with printed board plate face
Directly；
S22, check filtration core：Each filter core checked on Plate grinder, it is ensured that no-sundries in filter core, and breakage is changed in time
Filter core；
S23, check absorbent wool：Ensure that absorbent wool wheel keeps cleaning, and be in semi-moist state, and without breakage；
S3, start：Plate grinder is required to start in strict accordance with operation, controlling transmission speed is 4m/min；
S4, initial workpiece etching：Printed board etching to each model carries out initial workpiece etching, and its concrete operation step is as follows：
S41, surface clean：1~3 printed board with model is successively placed on production line, printing board surface is carried out
Cleaning, 2min~6min in acid deoiling liquid is put into, removes grease pollution and oxide layer in plate face, it is ensured that plate face cleans, and dries
It is dry；
S42, patch dry film, stick copper foil layer, it is necessary to which the part for etching windowing does not cover copper foil layer, remaining is in printed board
It is completely covered；Post and carry out Double-face adhesive multilayer dry film again on the outside of the printed board of copper foil layer；
S43, sting erosion：Printed board is placed in stainless steel Hanging Basket and fixed up and down, stainless steel Hanging Basket is inserted into step S1 institutes
In the etching groove of preparation, it is 45 DEG C to control temperature in etching groove, nozzle exit pressure 2.0kg/cm2, 5min is gently vibrated, treats window
Taken out after dissolving；
S44, washing：Stainless steel Hanging Basket equipped with printed board is rinsed with water, untill etching solution is washed out completely；
S45, ink retreating：Stainless steel Hanging Basket is put into ink retreating cylinder together with printed board, it is 50 to control ink retreating cylinder temperature
DEG C, nozzle exit pressure 2.5kg/cm2, 1min is gently vibrated, after dry film is completely dissolved, takes out drying；
S46, detection：Obtained initial workpiece product is put and detected under watch window under the microscope, then tester electricity
Gas performance；
S5, batch production：Step S46 detection it is qualified after, then by polylith with the printed board of model put on a production line according to
Step S41~S45 is produced in batches, is inspected by random samples in batch production process.
The proportion of etching solution is detected with densimeter in batch production process, when etching solution proportion is less than 1.1,
Cu is then added into etching groove2+And Cl-, it is 1.1 to make its proportion.
For etching solution in described etching groove also added with hydrogen peroxide, the volume of wherein hydrogen peroxide accounts for the 25% of etching solution volume.
【Embodiment 2】：
Fine-line printed board etch process, comprises the following steps：
S1, open cylinder and match somebody with somebody liquid：Inboard wall of cylinder block is rinsed, eliminating impurities are clean, then add water extremely into ink retreating cylinder
The 1/3 of ink retreating cylinder volume, then NaOH is added into ink retreating cylinder, then clear water is added to cylinder body requirement liquid level into ink retreating cylinder so that
Solution concentration is 5% in cylinder body；Etching solution is added into etching groove, and makes Cu2+Concentration be 150g/L, Cl-Concentration be
200g/L；
S2, start check：Including following sub-step：
S21, check nozzle：Check each nozzle in Plate grinder, it is ensured that its nozzles clear, and nozzle hangs down with printed board plate face
Directly；
S22, check filtration core：Each filter core checked on Plate grinder, it is ensured that no-sundries in filter core, and breakage is changed in time
Filter core；
S23, check absorbent wool：Ensure that absorbent wool wheel keeps cleaning, and be in semi-moist state, and without breakage；
S3, start：Plate grinder is required to start in strict accordance with operation, controlling transmission speed is 3m/min；
S4, initial workpiece etching：Printed board etching to each model carries out initial workpiece etching, and its concrete operation step is as follows：
S41, surface clean：1~3 printed board with model is successively placed on production line, printing board surface is carried out
Cleaning, 2min~6min in acid deoiling liquid is put into, removes grease pollution and oxide layer in plate face, it is ensured that plate face cleans, and dries
It is dry；
S42, patch dry film, stick copper foil layer, it is necessary to which the part for etching windowing does not cover copper foil layer, remaining is in printed board
It is completely covered；Post and carry out Double-face adhesive multilayer dry film again on the outside of the printed board of copper foil layer；
S43, sting erosion：Printed board is placed in stainless steel Hanging Basket and fixed up and down, stainless steel Hanging Basket is inserted into step S1 institutes
In the etching groove of preparation, it is 48 DEG C to control temperature in etching groove, and nozzle exit pressure is 2.8 kg/cm2, 4min is gently vibrated, treats window
Taken out after mouth dissolving；
S44, washing：Stainless steel Hanging Basket equipped with printed board is rinsed with water, untill etching solution is washed out completely；
S45, ink retreating：Stainless steel Hanging Basket is put into ink retreating cylinder together with printed board, it is 45 to control ink retreating cylinder temperature
DEG C, nozzle exit pressure 2.0kg/cm2, 2min is gently vibrated, after dry film is completely dissolved, takes out drying；
S46, detection：Obtained initial workpiece product is put and detected under watch window under the microscope, then tester electricity
Gas performance；
S5, batch production：Step S46 detection it is qualified after, then by polylith with the printed board of model put on a production line according to
Step S41~S45 is produced in batches, is inspected by random samples in batch production process.
The proportion of etching solution is detected with densimeter in batch production process, when etching solution proportion is less than 1.1,
Cu is then added into etching groove2+And Cl-, it is 1.8 to make its proportion.
For etching solution in described etching groove also added with hydrogen peroxide, the volume of wherein hydrogen peroxide accounts for the 25% of etching solution volume.
【Embodiment 3】：
Fine-line printed board etch process, comprises the following steps：
S1, open cylinder and match somebody with somebody liquid：Inboard wall of cylinder block is rinsed, eliminating impurities are clean, then add water extremely into ink retreating cylinder
The 1/3 of ink retreating cylinder volume, then NaOH is added into ink retreating cylinder, then clear water is added to cylinder body requirement liquid level into ink retreating cylinder so that
Solution concentration is 3% in cylinder body；Etching solution is added into etching groove, and makes Cu2+Concentration be 135g/L, Cl-Concentration be
180g/L；
S2, start check：Including following sub-step：
S21, check nozzle：Check each nozzle in Plate grinder, it is ensured that its nozzles clear, and nozzle hangs down with printed board plate face
Directly；
S22, check filtration core：Each filter core checked on Plate grinder, it is ensured that no-sundries in filter core, and breakage is changed in time
Filter core；
S23, check absorbent wool：Ensure that absorbent wool wheel keeps cleaning, and be in semi-moist state, and without breakage；
S3, start：Plate grinder is required to start in strict accordance with operation, controlling transmission speed is 2m/min；
S4, initial workpiece etching：Printed board etching to each model carries out initial workpiece etching, and its concrete operation step is as follows：
S41, surface clean：1~3 printed board with model is successively placed on production line, printing board surface is carried out
Cleaning, 2min~6min in acid deoiling liquid is put into, removes grease pollution and oxide layer in plate face, it is ensured that plate face cleans, and dries
It is dry；
S42, patch dry film, stick copper foil layer, it is necessary to which the part for etching windowing does not cover copper foil layer, remaining is in printed board
It is completely covered；Post and carry out Double-face adhesive multilayer dry film again on the outside of the printed board of copper foil layer；
S43, sting erosion：Printed board is placed in stainless steel Hanging Basket and fixed up and down, stainless steel Hanging Basket is inserted into step S1 institutes
In the etching groove of preparation, it is 53 DEG C to control temperature in etching groove, and nozzle exit pressure is 3.5 kg/cm2, 3min is gently vibrated, treats window
Taken out after mouth dissolving；
S44, washing：Stainless steel Hanging Basket equipped with printed board is rinsed with water, untill etching solution is washed out completely；
S45, ink retreating：Stainless steel Hanging Basket is put into ink retreating cylinder together with printed board, it is 40 to control ink retreating cylinder temperature
DEG C, nozzle exit pressure 1.0kg/cm2, 3min is gently vibrated, after dry film is completely dissolved, takes out drying；
S46, detection：Obtained initial workpiece product is put and detected under watch window under the microscope, then tester electricity
Gas performance；
S5, batch production：Step S46 detection it is qualified after, then by polylith with the printed board of model put on a production line according to
Step S41~S45 is produced in batches, is inspected by random samples in batch production process.
The proportion of etching solution is detected with densimeter in batch production process, when etching solution proportion is less than 1.1,
Cu is then added into etching groove2+And Cl-, it is 2.5 to make its proportion.
For etching solution in described etching groove also added with hydrogen peroxide, the volume of wherein hydrogen peroxide accounts for the 25% of etching solution volume.
Claims (1)
1. fine-line printed board etch process, it is characterised in that：Comprise the following steps：
S1, open cylinder and match somebody with somebody liquid：Inboard wall of cylinder block is rinsed, eliminating impurities are clean, water is then added into ink retreating cylinder to ink retreating
The 1/3 of cylinder volume, then NaOH is added into ink retreating cylinder, then clear water is added to cylinder body requirement liquid level into ink retreating cylinder so that cylinder body
Interior solution concentration is 3~8%；Etching solution is added into etching groove, and makes Cu2+Concentration be 135~160g/L, Cl-Concentration be
180~210g/L；Etching solution in described etching groove also accounts for etching solution volume added with hydrogen peroxide, the volume of wherein hydrogen peroxide
25%；
S2, start check：Including following sub-step：
S21, check nozzle：Check each nozzle in Plate grinder, it is ensured that its nozzles clear, and nozzle is vertical with printed board plate face；
S22, check filtration core：Each filter core checked on Plate grinder, it is ensured that no-sundries in filter core, and damaged filter is changed in time
Core；
S23, check absorbent wool：Ensure that absorbent wool wheel keeps cleaning, and be in semi-moist state, and without breakage；
S3, start：Plate grinder is required to start in strict accordance with operation, controlling transmission velocity interval is 2~4m/min；
S4, initial workpiece etching：Printed board etching to each model carries out initial workpiece etching, and its concrete operation step is as follows：
S41, surface clean：1~3 printed board with model is successively placed on production line, printing board surface is cleaned,
2min~6min in acid deoiling liquid is put into, removes grease pollution and oxide layer in plate face, it is ensured that plate face cleans, drying；
S42, patch dry film, stick copper foil layer, it is necessary to which the part for etching windowing does not cover copper foil layer, remaining is complete in printed board
Covering；Post and carry out Double-face adhesive multilayer dry film again on the outside of the printed board of copper foil layer；
S43, sting erosion：Printed board is placed in stainless steel Hanging Basket and fixed up and down, stainless steel Hanging Basket is inserted into step S1 and prepared
Etching groove in, it is 45~53 DEG C to control in etching groove temperature, and nozzle exit pressure is 2.0~3.5 kg/cm2, gently vibrate 3min
~5min, taken out after window dissolving；
S44, washing：Stainless steel Hanging Basket equipped with printed board is rinsed with water, untill etching solution is washed out completely；
S45, ink retreating：Stainless steel Hanging Basket is put into ink retreating cylinder together with printed board, it is 40~50 to control ink retreating cylinder temperature
DEG C, nozzle exit pressure is 1.0~2.5kg/cm2, 1min~3min is gently vibrated, after dry film is completely dissolved, takes out drying；
S46, detection：Obtained initial workpiece product is put and detected under watch window under the microscope, then tester electrical resistance
Energy；
S5, batch production：After step S46 detections are qualified, then polylith put on a production line according to step with the printed board of model
S41~S45 is produced in batches, is inspected by random samples in batch production process, is additionally included in batch production process and is used densimeter
The proportion of etching solution is detected, when etching solution proportion is less than 1.1, then new sub- liquid is added into etching groove, makes its proportion
Between 1.1~2.5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510507190.0A CN105007691B (en) | 2015-08-18 | 2015-08-18 | Fine-line printed board etch process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510507190.0A CN105007691B (en) | 2015-08-18 | 2015-08-18 | Fine-line printed board etch process |
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| CN105007691A CN105007691A (en) | 2015-10-28 |
| CN105007691B true CN105007691B (en) | 2018-02-06 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105263270B (en) * | 2015-11-09 | 2018-08-31 | 四川普瑞森电子有限公司 | Internal layer board manufacturing method |
| CN106132099A (en) * | 2016-07-06 | 2016-11-16 | 四川海英电子科技有限公司 | A kind of etch process of high-order high-density fine-line |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0396056A2 (en) * | 1989-05-02 | 1990-11-07 | Nikko Gould Foil Co., Ltd. | Treatment of copper foil for printed circuits |
| CN201386136Y (en) * | 2009-04-15 | 2010-01-20 | 苏州市飞莱克斯电路电子有限公司 | Concentration control device of flexible circuit board etching liquid |
| CN102808181A (en) * | 2011-06-01 | 2012-12-05 | 莆田市佳宜电子有限公司 | Alkaline etching process of printed circuit board |
| CN104185386A (en) * | 2014-09-16 | 2014-12-03 | 四川海英电子科技有限公司 | Etching process for multilayer circuit board with fine lines |
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2015
- 2015-08-18 CN CN201510507190.0A patent/CN105007691B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0396056A2 (en) * | 1989-05-02 | 1990-11-07 | Nikko Gould Foil Co., Ltd. | Treatment of copper foil for printed circuits |
| CN201386136Y (en) * | 2009-04-15 | 2010-01-20 | 苏州市飞莱克斯电路电子有限公司 | Concentration control device of flexible circuit board etching liquid |
| CN102808181A (en) * | 2011-06-01 | 2012-12-05 | 莆田市佳宜电子有限公司 | Alkaline etching process of printed circuit board |
| CN104185386A (en) * | 2014-09-16 | 2014-12-03 | 四川海英电子科技有限公司 | Etching process for multilayer circuit board with fine lines |
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