CN103014825A - Method for reducing or removing suspended copper at orifices - Google Patents
Method for reducing or removing suspended copper at orifices Download PDFInfo
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- CN103014825A CN103014825A CN201210533697XA CN201210533697A CN103014825A CN 103014825 A CN103014825 A CN 103014825A CN 201210533697X A CN201210533697X A CN 201210533697XA CN 201210533697 A CN201210533697 A CN 201210533697A CN 103014825 A CN103014825 A CN 103014825A
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Abstract
The invention discloses a method for reducing or removing suspended copper at orifices. The method comprises the following steps of: putting a printed circuit board and a package substrate with suspended copper at orifices to be removed, to electrolyte; connecting the printed circuit board and the package substrate to the positive electrode of an electrolysis power supply as an electrolysis anode, and connecting other conductors to the negative electrode of the electrolysis power supply as an electrolysis cathode; carrying out electrolysis for certain time under certain voltage, current density and temperature; reducing or removing the suspended copper at the orifices by utilizing a principle that the suspended copper at the orifices are preferentially electrolyzed due to the concentrated power lines and large current density, so that the influence to the surface copper and the inner-layer copper far from the orifices is small.
Description
Technical field
The present invention relates to circuit card technology field, especially relate to a kind of reduce or remove printed circuit board and base plate for packaging make in after boring the method for the outstanding copper in aperture.
Background technology
In the prior art, in the manufacture craft of printed circuit board and base plate for packaging, in order to realize the interconnected of interlayer, generally hole first, the slag that then removes photoresist carries out electroless plating and plating again.Usually boring comprises machine drilling and laser drill.
Laser drill adopts following several method to carry out usually:
Method one: open large copper window+carbon dioxide laser boring, be commonly referred to as large window method.Opening large copper window and be the copper layer on top layer that needs is carried out the zone of laser drill with the method for chemical milling etches away, the diameter in the zone that etches away is larger than the aperture that needs boring, then hole with laser on the base material that exposes, the spot diameter of laser drill is the same large with the aperture that needs boring.Its general step is: central layer is made, and------------developing,------laser drill---slag removes photoresist---is electroplated to etch open large copper window in exposure to paste dry film for lamination medium layer and Copper Foil.
This method is not because laser touches the copper on top layer, therefore the problem that does not have the outstanding copper in aperture, but owing to need to carry out figure transfer and etching etc. before the laser drill, the problem that interlayer alignment is arranged, and owing to open copper window zone and the difference of altitude of not opening the copper layer in copper window zone, the pad in hole must be accomplished larger than copper window, has limited the raising of wiring density.And along with the function of electronic product constantly strengthens, electronic product is to compact future development, and also more and more higher to the become more meticulous requirement of degree of product, the diameter in hole and the diameter of pad are more and more less, therefore, this method is used seldom at high-end fine-line product.This technique process is complicated in addition, has increased process period and cost.
Method two: large copper window+carbon dioxide laser boring such as open, be commonly referred to as conformal mask method, to etch away with the copper layer on top layer that the method for chemical milling is carried out needs the zone of laser drill, the diameter in the zone that etches away is the same large with the aperture that needs boring, and then hole with laser on the base material that exposes, but the spot diameter of laser drill is larger than copper window diameter, and its general step is: central layer is made, and------------developing,------laser drill---slag removes photoresist---is electroplated the large copper window such as to etch open in exposure to paste dry film for lamination medium layer and Copper Foil.
This method can avoid pad must do to get very large defective, but because the diaphragm diameter of laser drill is larger than copper window diameter, can produce the outstanding copper problem in aperture in the aperture.Carry out blind hole at employing conformal mask and add man-hour, the blind hole aperture depends primarily on copper window opening and makes, because the restriction of dry film price, DES etching condition and laser ability, adopt conformal mask to add man-hour, can process minimum blind hole aperture is generally 3mil and meets cost of competition, if the aperture of blind hole is less, then conformal mask cost will significantly promote, and product yield is not high.
Method three: carbon dioxide laser is directly holed.The direct boring procedure of carbon dioxide laser is different from conformal mask blind hole complete processing, at first the Copper Foil behind the lamination is carried out attenuate and brown or roughening treatment, to increase Copper Foil to the absorption of laser, then ablate with carbon dioxide laser, form the copper window in certain aperture at copper face, then continue medium layer is ablated.The energy that laser is directly holed the generally blind hole complete processing than conformal mask is high.The carbon dioxide laser general step of directly holing is: central layer is made, and---------laser is directly holed---slag removes photoresist---electroplates in the copper surface treatment for lamination medium layer and Copper Foil.
This method does not need to carry out dry film and etches open the copper window to process, simplified technique and provided cost savings, when but laser was directly ablated to medium layer in the boring, the diaphragm diameter of laser drill was large than the copper window diameter of ablating out in advance, also can produce the aperture in the aperture and hang the copper problem.
Method four: UV laser drill.The UV laser general step that directly punches is: central layer is made, and---------UV laser drill---slag removes photoresist---is electroplated in the copper surface treatment for lamination medium layer and Copper Foil.
When UV laser was directly ablated to outer copper in the boring, the internal layer base material also can be heated, and therefore also may produce in the aperture the outstanding copper problem in aperture.
The outstanding copper in aperture is defined as: the outstanding copper 1 in aperture is that outer copper foil 2 is located in the aperture, and the below does not have base material 3 to support and unsettled part.Referring to Fig. 1 and Fig. 2.
For machine drilling, usually need to process the through hole slag that removes photoresist after the machine drilling, the slag that removes photoresist is processed the metapore internal orifice dimension and is become large, and aperture Copper Foil diameter is constant, causes Copper Foil to be suspended from the aperture and forms the outstanding copper in aperture.Improperly machine drilling parameter also can cause Copper Foil to be suspended from the outstanding copper in formation aperture, aperture in addition.For laser drill, outside the eliminating method one, method two, method three, laser all can touch the copper layer on top layer in the method four, because laser aperture edge is on the low side owing to energy, the copper layer of its contact differs and fully ablated surely, and the base material of these copper layer belows, position can ablate owing to being heated, thereby so that the copper layer of these positions becomes the outstanding copper in aperture.In addition removing photoresist during resin in the slag cleaning hole behind the drilling operating, copper corrosion is very little, so the size of the outstanding copper in aperture will increase.After the aperture that the outstanding copper in aperture occurred was crossed the slag that removes photoresist, the outstanding copper in aperture can be more serious.Laser drill also can cause the excessive resin disappearance in aperture and form the outstanding copper in aperture improperly in addition.
The appearance of the outstanding copper in aperture, with so that the diameter in aperture and area reduce, the slag that removes photoresist, electroless copper, the liquid medicine of the operations such as plating can not fully exchange in inside, hole, thereby following problem occurs.
In the slag operation of removing photoresist, the inner liquid medicine in hole can not fully exchange, and it is clean to cause the glue slag to be removed in the hole in, and interconnected separation 14 of internal layer that resin residue causes appears in through hole, and referring to Fig. 3, crack 12 at the bottom of the residual hole that causes of hole bottom resin appears in blind hole,, referring to Fig. 4.
In the chemical copper operation, the inner liquid medicine exchange in hole is insufficient, the hole wall part position that makes through hole and blind hole is occurred without the chemical copper deposition, thereby form hole wall coating cavity 7 when causing electroplating, referring to Fig. 3 and Fig. 4.
In electroplating work procedure, the shielding effect of the outstanding copper in aperture will affect the plating in the hole, and the aperture hangs copper and stopped on the one hand that electroplating liquid medicine enters in the hole and exchange, and may cause the hole wall coating copper of copper electroplating layer 5 in the hole thin 6, referring to Fig. 3 and Fig. 4.On the other hand because the power line concentration effect at outstanding copper place, aperture, the sedimentation velocity at outstanding copper place is fast, make aperture coating copper thick 8, can with aperture complete closed 9, referring to Fig. 5, increase the aperture liquid medicine has been stopped when serious, so that hole inner hole wall coating copper thin 6, referring to Fig. 5, the blind hole of needs being filled out copper can cause the filling perforation cavity 10 of filling out the copper centre, referring to Fig. 5.
The solution that reduces at present or remove the outstanding copper in aperture has two kinds.
A kind of method is to reduce the generation of the outstanding copper in aperture.Boring is the major cause that causes the outstanding copper in aperture on the impact of base material and the slag operation of removing photoresist to the erosion of stinging of base material.The producer of printed circuit board and base plate for packaging can by improving the front copper face surface treatment mode of boring, adjust data of holes drilled, adjusting the slag parameter of removing photoresist, descend the outstanding copper in aperture.These methods are effective to a certain extent.But, when the aperture further descends, this method has its limitation, the limit of equipment and liquid medicine has been arrived in the aperture, no matter how to adjust, the problem of the outstanding copper in aperture is still arranged, and the aperture is less, the impact of the outstanding copper in aperture is larger, and this is to allow the problem of many printed circuit boards and base plate for packaging producer headache.In addition, the direct boring method of laser such as the two apertures of the employing mentioned among the CN101372071, this method is more effective to the aperture more than the 75um and general FR4 base material, but for below the 75um or less aperture, and some other easier then to be improved effect by the base material of laser ablation little than FR4 base material.
Another kind method is after producing the outstanding copper in aperture the outstanding copper in aperture to be reduced or remove.
The requirement exploitation chemical medicinal liquid of the producer of printed circuit board and base plate for packaging is answered by the company of chemical medicinal liquid, as adopt sulfuric acid and hydrogen peroxide system or other liquid medicine systems that the outstanding copper in aperture is carried out chemical corrosion, the outstanding copper in aperture is reduced, but this method has an obvious defective, namely because chemical medicinal liquid is isotropic, the method of chemical corrosion is when removing the outstanding copper in part aperture, meeting has the corrosion of same degree to chassis copper at the bottom of top layer copper and the hole or internal layer copper, for through hole, may cause larger etchback 13 to internal layer copper 4, referring to Fig. 6, for laser blind hole, this not only can cause at the bottom of the hole of internal layer copper 4 at the bottom of the hole copper thin 15, referring to Fig. 7, cause reliability decrease, but also owing to the corrosion of bottom copper face forms little angle 11 at the bottom of the hole, referring to Fig. 7, the exchange of the liquid medicine at 11 places, little angle is bad at the bottom of the hole, it is bad chemical copper to occur easily, finally causes the long-term reliability of product to be affected.Because the existence of the problems referred to above, it is fast to the outstanding copper etching in aperture that chemical medicinal liquid supplier makes great efforts again exploitation, and to the slow liquid medicine of copper etching speed of blind hole bottom, but consequently cause the increase of cost, and up to the present, can't solve the situation that the blind hole base copper is corroded fully.In addition, another shortcoming that adopts chemical medicinal liquid to process the outstanding copper in aperture is: must have special equipment to carry out the operation of printed circuit board and base plate for packaging, this is a higher cost investment beyond doubt.
In sum, along with the decline in aperture, the problem of the outstanding copper in aperture is more and more outstanding, and the outstanding copper in aperture can cause the decline of product quality, yield and reliability, therefore must solve the problem of the outstanding copper in aperture.
Summary of the invention
For the deficiency that prior art exists, the purpose of this invention is to provide a kind of minimizing or remove the method that the aperture hangs copper, simple, economical, effective.
To achieve these goals, the technical solution adopted in the present invention is:
A kind of method that reduces or remove the outstanding copper in aperture may further comprise the steps:
Step 1, with to be reduced or remove the printed circuit board of the outstanding copper in aperture and the electrolytic solution that base plate for packaging places electrolyzer, and be connected to the positive pole of the electrolysis power of electrolyzer, as the anode of electrolysis;
Step 4, printed circuit board and base plate for packaging carry out electrolysis in electrolyzer, the outstanding copper in aperture is because power line is concentrated, and the large and preferential electrolysis of current density reduces the outstanding copper in aperture or removes by this step by electrolysis;
Step 5, will reduce or remove that printed circuit board and the base plate for packaging behind the outstanding copper in aperture takes out after the boring from electrolyzer, clean and dry;
Finish processing.
Further, in the described step 4, electrolysis power uses direct supply or pulse dc power.
Further, in the described step 4, the temperature of electrolytic solution is: 5 degrees centigrade-80 degrees centigrade, electrolysis time is: 0.001 second-30 minutes, electrolysis voltage was: 0.01V-100V, the current density during electrolysis on the printed circuit board is: 0.01ASD-20ASD.
Further, in the described step 4, the temperature of electrolytic solution is: 25 degrees centigrade, electrolysis time is: 30 seconds, electrolysis voltage was: 0.1V, the current density during electrolysis on the printed circuit board is: 0.8ASD.
Further, described electrolytic solution uses one or more in following acid and the salts solution: sulfuric acid, vitriol, phosphoric acid, phosphoric acid salt, nitric acid, nitrate, hydrochloric acid, hydrochloride, chromic acid, chromic salt, perchloric acid, perchlorate, formic acid, acetic acid, citric acid, tartrate, oxalic acid, lactic acid.
Further, electrolyzer is rectilinear or horizontal.
Further, described step 1-5 carries out after drilling operating is finished immediately, perhaps carries out after the slag operation of removing photoresist, and perhaps carries out between machine drilling and two kinds of drilling operatings of laser drill.
Further, carry out step 1 before, printed circuit board and base plate for packaging are carried out the surface treatment of physics or chemistry, include but not limited to high-pressure washing, polish-brush or chemical corrosion.
According to Faraday's law, electric current is separated out or the amount of substance that dissolves is directly proportional with the electric weight that passes through at electrode when the electrolyte solution.Anticathode, the thin and thick of cathode surface different sites coating, whether homogeneity just is decided by whether the distribution of electric current on cathode surface be even.Current density is larger, and coating is thicker, otherwise current density is less, and coating is thinner.On this point, metal depends on the distribution of electric current on cathode surface at the deposition on the cathode surface.And antianode, the thickness of the copper of anode surface different sites dissolving also depends on the distribution of electric current on anode surface, and the current density at the most advanced and sophisticated place of anode surface is higher, and therefore the thickness of the copper of dissolving is also larger.
The difference of the current density when the present invention utilizes the outstanding copper in Faraday's law and aperture with the electrolysis that causes away from the surface shape difference of the surface copper in aperture and blind hole bottom, adopt the method for electrolysis to reduce or the outstanding copper in removal aperture, be different from the method that existing machinery or chemical medicinal liquid are processed, effectively avoided away from the surface copper in aperture and internal layer other not need removal or the corrosion of the copper removed, can reduce or eliminate the outstanding copper in aperture by method of the present invention, and then the subsequent handling after the improvement boring is to the effect of the processing in hole, the q﹠r of improving product.
The present invention is the principle that adopts electrolysis, printed circuit board and the base plate for packaging of the outstanding copper in aperture after removing boring are placed electrolytic solution, and be connected to the positive pole of electrolysis power, anode as electrolysis, other gets the negative pole that other conductors are connected to electrolysis power, as the negative electrode of electrolysis, under certain voltage, current density and temperature, carry out the electrolysis of certain hour.When printed circuit board or base plate for packaging during as anode, outstanding copper place power line is more concentrated in the aperture, and current density is larger, and therefore, during electrolysis, the copper at outstanding copper place, aperture is often dissolved; And the copper of upper other positions, surface is because surfacing, and power line is relatively sparse, and current density is less, so during electrolysis, copper is fewerly dissolved, so just can produce the speed of the dissolved copper of otherness.And the molten copper speed of this otherness is to be difficult to realize in the chemical medicinal liquid etching.Therefore copper or through hole internal layer copper do not participate in electrolytic reaction owing to be not connected with the electrolysis loop at the bottom of the hole in addition, thereby there is no that dissolving is protected.
The method of the present invention and existing commonly used other chemical corrosions relatively can greatly reduce other do not need the copper corrosion removed away from the surface copper in aperture and internal layer.The invention provides a kind of simple, economy, effective means reduces and eliminates the problem that the aperture hangs copper, the present invention is different from and usually adopts chemical medicinal liquid to process the method for the outstanding copper in aperture in the wiring board industry, proposed to adopt the method for electrolysis, be about to printed circuit board or base plate for packaging as anode, do negative electrode with supporting electrode, conductive soln is done electrolytic solution, forms the loop and carries out electrolysis, hangs copper to reduce or to eliminate the aperture.
The present invention can adopt existing electroplating device, no matter be vertical electroplating equipment or horizontal electroplating device, only needs the change sense of current to get final product, and does not need to increase new equipment, has therefore also saved cost.For printed circuit board and base plate for packaging factory, the present invention has technique simple, and facility investment is few, the advantage that the treatment time is short.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is the structural representation that forms the outstanding copper in aperture after the machine drilling.
Fig. 2 is the structural representation that forms the outstanding copper in another kind of aperture after the laser drill.
Fig. 3 is the defective synoptic diagram that through hole causes because of the outstanding copper in aperture.
Fig. 4 is the defective synoptic diagram that blind hole causes because of the outstanding copper in aperture.
Fig. 5 is blind hole causes aperture complete closed defective because of the outstanding copper in aperture synoptic diagram.
Fig. 6 is that through hole adopts the method for chemical corrosion to remove the outstanding copper in aperture and the defective synoptic diagram that causes.
Fig. 7 is that blind hole adopts the method for chemical corrosion to remove the outstanding copper in aperture and the defective synoptic diagram that causes.
Indicate among the figure: 1, the outstanding copper in aperture, 2, outer copper foil, 3, base material, 4, internal layer copper, 5, copper electroplating layer, 6, hole wall coating copper is thin, 7, hole wall coating cavity, 8, aperture coating copper is thick, 9, the aperture complete closed, 10, filling perforation cavity, 11, little angle at the bottom of the hole, 12, at the bottom of the hole crack, 13, etchback, 14, interconnected separation, 15, copper is thin at the bottom of the hole.
Embodiment
The following stated only is preferred embodiment of the present invention, does not therefore limit protection scope of the present invention.
Embodiment, the method for the outstanding copper of a kind of minimizing or removal aperture may further comprise the steps:
The preprocessing step is removed the printed circuit board of the outstanding copper in aperture through the deburring operation pre-treatment with needing after the laser drill.The laser drill aperture is 150um.
Step 1, with to be reduced or remove the printed circuit board that is formed with the outstanding copper in aperture after the boring and place the electrolytic solution of electrolyzer, and be connected to the positive pole of the electrolysis power of electrolyzer, as the anode of electrolysis.
Step 4, printed circuit board carry out electrolysis in electrolyzer, electrolysis voltage is volts DS 0.1V, and current density is 0.8ASD, and electrolyte temperature is 25 degrees centigrade, and electrolysis time is 30S.The electrolytic solution of electrolyzer is 25% phosphoric acid solution.
Step 5, will reduce or remove that the printed circuit board behind the outstanding copper in aperture takes out after the boring from electrolyzer, clean and dry.Finish processing.
The blind hole aperture diameter of printed circuit board is 125um before implementing, surface copper thickness is about 6.5um, the thick 17um that is about of copper at the bottom of the hole, and the blind hole aperture diameter of printed circuit board is 155um after implementing, surface copper thickness is for being about 5.5um, the thick 17um that is about of copper at the bottom of the hole.
Above content is preferred embodiment of the present invention only, for those of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, and this description should not be construed as limitation of the present invention.
Claims (8)
1. a method that reduces or remove the outstanding copper in aperture is characterized in that, may further comprise the steps:
Step 1, with to be reduced or remove the printed circuit board of the outstanding copper in aperture and the electrolytic solution that base plate for packaging places electrolyzer, and be connected to the positive pole of the electrolysis power of electrolyzer, as the anode of electrolysis;
Step 2, get the electrolytic solution that a conductor places electrolyzer in addition, and conductor is connected to the negative pole of the electrolysis power of electrolyzer, as the negative electrode of electrolysis;
Step 3, printed circuit board and base plate for packaging, conductor negative electrode form the loop with the electrolytic solution of electrolyzer;
Step 4, printed circuit board and base plate for packaging carry out electrolysis in electrolyzer, the outstanding copper in aperture is because power line is concentrated, and the large and preferential electrolysis of current density reduces the outstanding copper in aperture or removes by this step by electrolysis;
Step 5, printed circuit board and the base plate for packaging that will reduce or remove behind the outstanding copper in aperture take out from electrolyzer, clean and dry;
Finish processing.
2. a kind of method that reduces or remove the outstanding copper in aperture according to claim 1, it is characterized in that: in the described step 4, electrolysis power uses direct supply or pulse dc power.
3. a kind of method that reduces or remove the outstanding copper in aperture according to claim 1, it is characterized in that: in the described step 4, the temperature of electrolytic solution is: 5 degrees centigrade-80 degrees centigrade, electrolysis time is: 0.001 second-30 minutes, electrolysis voltage is: 0.01V-100V, the current density during electrolysis on the printed circuit board is: 0.01ASD-20ASD.
4. a kind of method that reduces or remove the outstanding copper in aperture according to claim 1, it is characterized in that: in the described step 4, the temperature of electrolytic solution is: 25 degrees centigrade, electrolysis time is: 30 seconds, electrolysis voltage is: 0.1V, the current density during electrolysis on the printed circuit board is: 0.8ASD.
5. a kind of method that reduces or remove the outstanding copper in aperture according to claim 1 is characterized in that: one or more below described electrolytic solution uses in acid and the salts solution: sulfuric acid, vitriol, phosphoric acid, phosphoric acid salt, nitric acid, nitrate, hydrochloric acid, hydrochloride, chromic acid, chromic salt, perchloric acid, perchlorate, formic acid, acetic acid, citric acid, tartrate, oxalic acid, lactic acid.
6. a kind of method that reduces or remove the outstanding copper in aperture according to claim 1, it is characterized in that: electrolyzer is rectilinear or horizontal.
7. a kind of method that reduces or remove the outstanding copper in aperture according to claim 1, it is characterized in that: described step 1-5 carries out after drilling operating is finished immediately, perhaps after the slag operation of removing photoresist, carry out, perhaps between machine drilling and two kinds of drilling operatings of laser drill, carry out.
8. a kind of method that reduces or remove the outstanding copper in aperture according to claim 1, it is characterized in that: before carry out step 1, printed circuit board and base plate for packaging are carried out the surface treatment of physics or chemistry, include but not limited to high-pressure washing, polish-brush or chemical corrosion.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210533697XA CN103014825A (en) | 2012-12-11 | 2012-12-11 | Method for reducing or removing suspended copper at orifices |
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| CN201210533697XA CN103014825A (en) | 2012-12-11 | 2012-12-11 | Method for reducing or removing suspended copper at orifices |
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| CN201210533697XA Pending CN103014825A (en) | 2012-12-11 | 2012-12-11 | Method for reducing or removing suspended copper at orifices |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555062A (en) * | 2015-12-30 | 2016-05-04 | 广东工业大学 | Method for removing suspension copper in blind hole of circuit board |
| CN105813396A (en) * | 2016-03-30 | 2016-07-27 | 广东工业大学 | Medical liquid for electroless copper plating desmearing of printed circuit board (PCB) and preparation method and application thereof |
| CN106559962A (en) * | 2016-10-27 | 2017-04-05 | 傅本友 | A kind of reduction or the method for removing the outstanding copper in aperture |
| CN108624884A (en) * | 2017-03-17 | 2018-10-09 | 昆山市板明电子科技有限公司 | The PCB surface conditioning agents and surface treatment method for removing brown layer and the outstanding copper of blind hole |
| CN110923797A (en) * | 2019-11-08 | 2020-03-27 | 东莞市国瓷新材料科技有限公司 | Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85102760A (en) * | 1985-04-01 | 1986-08-06 | 大连工学院 | The electrochemical trimming of harmonic gear |
| CN101550560A (en) * | 2009-04-30 | 2009-10-07 | 健鼎（无锡）电子有限公司 | Treatment method for using copper sulphate electrolysis method to strip residue copper on electroplating skeet chuck of PCB |
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- 2012-12-11 CN CN201210533697XA patent/CN103014825A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85102760A (en) * | 1985-04-01 | 1986-08-06 | 大连工学院 | The electrochemical trimming of harmonic gear |
| CN101550560A (en) * | 2009-04-30 | 2009-10-07 | 健鼎（无锡）电子有限公司 | Treatment method for using copper sulphate electrolysis method to strip residue copper on electroplating skeet chuck of PCB |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555062A (en) * | 2015-12-30 | 2016-05-04 | 广东工业大学 | Method for removing suspension copper in blind hole of circuit board |
| CN105555062B (en) * | 2015-12-30 | 2018-12-14 | 广东工业大学 | A kind of outstanding copper minimizing technology of route board blind hole |
| CN105813396A (en) * | 2016-03-30 | 2016-07-27 | 广东工业大学 | Medical liquid for electroless copper plating desmearing of printed circuit board (PCB) and preparation method and application thereof |
| CN105813396B (en) * | 2016-03-30 | 2019-06-11 | 广东工业大学 | A kind of liquid medicine and its preparation method and application of PCB electroless copper plating de-smear |
| CN106559962A (en) * | 2016-10-27 | 2017-04-05 | 傅本友 | A kind of reduction or the method for removing the outstanding copper in aperture |
| CN108624884A (en) * | 2017-03-17 | 2018-10-09 | 昆山市板明电子科技有限公司 | The PCB surface conditioning agents and surface treatment method for removing brown layer and the outstanding copper of blind hole |
| CN110923797A (en) * | 2019-11-08 | 2020-03-27 | 东莞市国瓷新材料科技有限公司 | Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning |
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Application publication date: 20130403 |