CN108624884A - The PCB surface conditioning agents and surface treatment method for removing brown layer and the outstanding copper of blind hole - Google Patents
The PCB surface conditioning agents and surface treatment method for removing brown layer and the outstanding copper of blind hole Download PDFInfo
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- CN108624884A CN108624884A CN201710159890.4A CN201710159890A CN108624884A CN 108624884 A CN108624884 A CN 108624884A CN 201710159890 A CN201710159890 A CN 201710159890A CN 108624884 A CN108624884 A CN 108624884A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
- C23F1/04—Chemical milling
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a kind of PCB surface conditioning agents and surface treatment method for removing brown layer and the outstanding copper of blind hole, the surface conditioning agent includes outside sulfuric acid/hydrogen peroxide system, further include that outstanding copper ingratiates with wetting 0.01~20.0g/L of activator and selective etch 10~100g/L of agent, and its pH value is 1.0~5.0；It is alkylol ether surfactant and the composition without hydracid that wherein outstanding copper, which ingratiates with wetting activator,；Selective etch agent is the composition of the salt of aminated compounds and/or aminated compounds, organic phosphine compound and water soluble nitro compound；Hydrogen peroxide stabilizer is the compound for capableing of stable peroxide hydrogen in acid solution, the inorganic agent can not only uniformly remove the brown layer of blind hole brown copper coin, and blind hole can be effectively removed and hang copper, to normal copper face no corrosion, the uniform clean copper foil surface of microetch can be obtained, simple for process and dipping and spray, entirely appropriate industrial application.
Description
Technical field
The present invention relates to a kind of PCB surface conditioning agents and its application method more particularly to a kind of PCB with remove brown layer and
The method that blind hole hangs the surface conditioning agent of copper and carries out PCB surface processing using the surface conditioning agent, belongs to PCB fine chemistry industries
Product technical field.
Background technology
With the continuous upgrading of electronic product, electronic product is just sent out towards miniaturization, high-performance and multifunctional direction
Exhibition.This proposes increasingly higher demands to integrated circuit, and (HDI) plate is interconnected in high density becomes the mainstream of next-generation development,
The aperture that i.e. line width of copper conductive pattern and line-spacing constantly reduce on either copper is smaller and smaller (blind hole), processes swashing for micro hole
Light drilling technique more prevalentization, when aperture as low as micron level, laser drill also produces new problem, as laser drilling is blind
Outstanding copper is produced during hole.Outstanding copper does not remove, and will lead to the problem of the poor platings such as copper tumor, cavity in the plating process.Currently, high
End plate is mostly used modified form semi-additive process (MSAP) technique and is handled plate face using brown liquid medicine before laser drill, will
Copper face color becomes brown by brass, is conducive to the absorption of laser and to carry out electroless copper plating and flash after laser drill, this
Just need to be removed brown layer to brown blind hole plate and remove blind hole aperture simultaneously and hang copper, with ensure subsequent handling it is smooth into
Row.
It is typically by sulfuric acid and hydrogen peroxide system or other chemical substances by the outstanding copper in aperture to remove outstanding copper at present
Corrosion is learned, aperture, which is hanged copper, to be reduced, but this method has the obvious disadvantage that, while removal part aperture hangs copper, meeting
There is the corrosion of same degree to surface layer copper and bottom hole chassis copper or internal layer copper.
There is the prior art to propose to remove the outstanding copper of printed circuit board and package substrate, this party with anode electrolytic method at present
Although the method electrolytic process time is shorter, to normal copper face and bottom hole copper, there are still corrosion, and production capacity is limited, are not so good as chemical solution
Liquid method production capacity is big.For through-hole, larger etchback may be caused to internal layer copper；For laser blind hole, do not only result in blind
Hole bottom hole internal layer copper is thinning, causes reliability decrease.
It is another to there is researcher to propose to remove the hole top-hung copper after the direct pore-forming of wiring board laser by microetch：Use 6%-
8% sulfuric acid+hydrogen peroxide solution can be attacked outstanding copper from three directions, and outstanding copper is got rid of.For normal copper face and
Bottom hole copper is equally corroded, it is possible that the excessive corrosion of copper face.
Furthermore also technical staff proposes to use A liquid and B liquid, and copper can be hanged to blind hole and carries out chemical etching, and to normal copper
Without etching, wherein A liquid is made of acid or alkaline matter and wetting agent for face and copper-based of bottom hole；B liquid by hydrogen peroxide, persulfate,
One or more of nitrate, hypochlorite, copper sulphate, ammonium chloride substance form.It is in the actual production process it is difficult to real
Row, another typical problem are that AB liquid separates, and when actually connecting among can not wash, this means that A liquid
B liquid can be entered, A liquid may be alkaline solution, and B liquid is oxidation solution, and A liquid continues into B liquid there may be potential when volume production
The safety problem.To sum up, brown is gone for the copper foil proposed in the application and the correlation for removing the outstanding copper in blind hole aperture simultaneously is ground
Study carefully and is rarely reported.
Invention content
In order to solve the above technical problems, the present invention provides a kind of PCB surface treatments for removing brown layer and the outstanding copper of blind hole
Agent and surface treatment method, the surface conditioning agent used in the processing method can not only uniformly remove blind hole brown copper coin
Brown layer, and blind hole can be effectively removed and hang copper, to normal copper face no corrosion, the uniform clean copper of microetch can be obtained
Foil surface, simple for process and do not increase special technique, the making of the high end plate of entirely appropriate PCB ensures the suitable of subsequent handling
Profit carries out.
Special composition contained in herein described surface conditioning agent --- outstanding copper ingratiates with wetting activator and selectivity
Etchant, hanging copper part to aperture has skin effect, the protrusion or tip location occurred after drilling can be adsorbed in, to increase medicine
The surface area of water contact, acceleration sting erosion and hang copper rate, can not only effectively remove the outstanding copper generated after laser drill, and to normal
Clean coarse copper surface also can be obtained in copper face no corrosion.
The technical scheme is that：
A kind of PCB surface conditioning agents for removing brown layer and the outstanding copper of blind hole, are sulfuric acid/hydrogen peroxide system comprising sulfuric acid
0.5~1.0g/L, 10~200g/L of hydrogen peroxide, 0.1~8.0g/L of hydrogen peroxide stabilizer, outstanding copper ingratiate with wetting activator 0.01~
The deionized water of 20.0g/L, 10~100g/L of selective etch agent and surplus, and the pH value of the surface conditioning agent be 1.0~
5.0；It is alkylol ether surfactant and the composition without hydracid that the wherein described outstanding copper, which ingratiates with wetting activator,；The selection
Property etchant be aminated compounds and/or aminated compounds salt, organic phosphine compound and water soluble nitro compound combination
Object；The hydrogen peroxide stabilizer is the compound for capableing of stable peroxide hydrogen in acid solution.
Its further technical solution is：
The PCB surface conditioning agents for removing brown layer and the outstanding copper of blind hole, including 0.5~1.0g/L of sulfuric acid, hydrogen peroxide
20~100g/L, 0.5~4.0g/L of hydrogen peroxide stabilizer, outstanding copper ingratiate with 0.1~10.0g/L of wetting activator, selective etch
The deionized water of 20~80g/L of agent and surplus, and the pH value of the surface conditioning agent is 1.5~4.5.
Brown blind hole plate in surfactant, without hydracid, aminated compounds and its salt, organic phosphine compound, water-soluble nitre
Under based compound collective effect, the surface tension of etching solution can be reduced, hanging copper part to aperture has skin effect, can be adsorbed in
The protrusion or tip location occurred after drilling, to increase the surface area of liquid medicine contact, acceleration stings erosion and hangs copper rate, can not only have
The outstanding copper generated after effect removal laser drill, and to normal copper face no corrosion, while preventing hydrogen peroxide in copper ion
In the presence of decompose, control the stability of micro-etching speed.Halide ion is huge on micro-etching speed influence, therefore selects halogen-free chemical combination
Object.
The further technical solution of the application is：
The alkylol ether surfactant is propylene glycol monomethyl ether, dihydroxypropane single-ether, propylene glycol monobutyl ether, second two
At least one in alcohol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, dimethyl ether and dipropylene glycol monomethyl ether
Kind.
The no hydracid be phosphoric acid, acetic acid, citric acid, sulfamic acid, succinic acid, nitric acid, lactic acid, malonic acid, malic acid,
At least one of sulfuric acid and tartaric acid.
The aminated compounds and its salt be aniline, pentamethylene amine, cycloheptyl alkanamine, dihydroxy ethyl cyclohexylamine, dicyclohexyl amine,
It is 4- cyclohexyls amine, dihydroxy ethyl cyclohexylamine, dimethyl cyclohexyl amine, cyclobutane dimethylamine, N- ethyls cyclopentamine, ethanol amine, more
At least one of bar amine, cyclobutane formamide, amino -1- cyclopentane formamides, Ammonium benzoate and its salt.
The organic phosphine compound is aminotrimethylenephosphonic acid, diethylenetriamine pentamethylenophosphonic acid, organic phosphine sulphur
Acid, Polyol Phosphate, 2- phosphonobutane -1,2,4- tricarboxylic acids, phosphono hydroxyacetic acid, hydroxy ethylene diphosphonic acid, more ammonia
Quito ether tetramethylene phosphonic acid, ethylenediamine tetramethylene phosphonic acid, diethylenetriamine penta, two hexene triamine five are sub-
At least one of methylphosphonic acid and its ammonium salt.
The water soluble nitro compound is nitrobenzoic acid, nitro-salicylic acid, nitrophenol, nitrotoleune, nitrobenzene
At least one of amine, nitrobenzene-sulfonic acid, nitrobenzene ethane nitrile, nitracetanilide, nitrourea, nitroguanidine and its salt.
The hydrogen peroxide stabilizer be allylurea, 1,3- dimethyl ureas, phenylurea, phenyl acetamide, styrene glycol and
At least one of phenolsulfonic acid.
PCB is carried out with the surface conditioning agent for removing brown layer and the outstanding copper of blind hole using above-mentioned PCB the invention also discloses a kind of
The method of copper coin surface treatment, this method are to contact on the copper surface of PCB copper coins with the copper surface treatment agent to be removed palm fibre
Change layer and blind hole hangs copper, wherein the temperature in use of the copper surface treatment agent is 10~40 DEG C；Wherein the copper surface of PCB copper coins with
The mode of the copper surface treatment agent contact is that copper is impregnated in copper surface treatment agent or uniformly sprays copper surface treatment agent
In on copper surface, wherein the pressure sprayed is 0.05~0.30MPa.
The method have the benefit that：The surface conditioning agent is suitable for the preparation of PCB high end plates, is particularly suitable for changing
Good figure semi-additive process (MSAP) technique is not only able to uniformly remove the brown layer of blind hole brown copper coin, and can effectively remove
Blind hole hangs copper, to normal copper face no corrosion, can obtain the uniform clean copper foil surface of microetch, ensure subsequent handling (such as
Electroless copper plating and flash) it is smoothed out, it is simple for process, it is suitble to industrial application.
Description of the drawings
Fig. 1-1 to Fig. 1-10 is that the blind hole brown plate amplification 200 before the processing of specific embodiment 1-10 surface conditioning agents is shown
Micro mirror photo；
Fig. 2-1 to Fig. 2-10 is that specific embodiment 1-10 surface conditioning agents treated blind hole brown plate amplification 200 is shown
Micro mirror photo.
Specific implementation mode
In order to better understand the technical means of the present invention, it and can be implemented in accordance with the contents of the specification, below
In conjunction with the accompanying drawings and embodiments, the specific implementation mode of the present invention is described in further detail, following embodiment is for illustrating this
Invention, but it is not limited to the scope of the present invention.
Specific embodiment 1
First take 100ml deionized waters, be added 1g sulfuric acid (50%), 0.5g hydrogen peroxide stabilizers, 60g hydrogen peroxide (35%),
It stirs evenly after 0.1g propylene glycol monomethyl ethers, 0.5g dopamines, 0.5g aminotrimethylenephosphonic acid, 10g nitroanilines, then uses
Deionized water is diluted to 1L.
Specific embodiment 2
First take 100ml deionized waters, be added 1g sulfuric acid (50%), 0.5g hydrogen peroxide stabilizers, 60g hydrogen peroxide (35%),
It is stirred after 0.1g dihydroxypropane single-ethers, 0.7g succinic acids, 0.5g dopamines, 0.5g aminotrimethylenephosphonic acid, 10g nitroanilines
Uniformly, then 1L is diluted to deionized water.
Specific embodiment 3
First take 100ml deionized waters, be added 1g sulfuric acid (50%), 0.5g hydrogen peroxide stabilizers, 60g hydrogen peroxide (35%),
It is stirred after 0.1g propylene glycol monobutyl ethers, 0.6g lactic acid, 0.5g dopamines, 0.5g aminotrimethylenephosphonic acid, 10g nitroanilines equal
It is even, then 1L is diluted to deionized water.
Specific embodiment 4
First take 100ml deionized waters, be added 1g sulfuric acid (50%), 0.5g hydrogen peroxide stabilizers, 60g hydrogen peroxide (35%),
It is stirred after 0.1g glycol monoethyl ethers, 0.8g malonic acid, 0.5g dopamines, 0.5g aminotrimethylenephosphonic acid, 10g nitroanilines
Uniformly, then 1L is diluted to deionized water.
Specific embodiment 5
First take 100ml deionized waters, be added 1g sulfuric acid (50%), 0.5g hydrogen peroxide stabilizers, 60g hydrogen peroxide (35%),
It is stirred after 0.1g ethylene glycol monoethyl ethers, 0.6g tartaric acid, 0.5g dopamines, 0.5g aminotrimethylenephosphonic acid, 10g nitroanilines
Uniformly, then 1L is diluted to deionized water.
Specific embodiment 6
100ml deionized waters are first taken, 1g sulfuric acid (50%), 0.5g sulfamic acids, 0.5g hydrogen peroxide stabilizers, 60g is added
Hydrogen peroxide (35%), 0.1g ethylene glycol monoethyl ethers, 0.5g Ammonium benzoates, 0.5g aminotrimethylenephosphonic acid, 5g nitro acetophenones
It is stirred evenly after amine, is then diluted to 1L with deionized water.
Specific embodiment 7
100ml deionized waters are first taken, 1g sulfuric acid (50%), 0.5g citric acids, 5g hydrogen peroxide stabilizers, 300g dioxygens is added
It is stirred after water (35%), 0.1g propylene glycol monomethyl ethers, 0.5g ethanol amines, 1g diethylenetriamine pentas, 10g nitroanilines
It mixes uniformly, is then diluted to 1L with deionized water.
Specific embodiment 8
100ml deionized waters are first taken, 1g sulfuric acid (50%), 0.5g citric acids, 5g hydrogen peroxide stabilizers, 300g dioxygens is added
It is stirred after water (35%), 0.1g dipropylene glycol monomethyl ethers, 0.5g ethanol amines, 1g diethylenetriamine pentas, 5g nitroureas
It mixes uniformly, is then diluted to 1L with deionized water.
Specific embodiment 9
100ml deionized waters are first taken, 1g sulfuric acid (50%), 0.5g malic acid, 5g hydrogen peroxide stabilizers, 300g dioxygens is added
It is stirred after water (35%), 0.5g glycol monoethyl ethers, 0.5g ethanol amines, 1g diethylenetriamine pentas, 5g nitroureas
Uniformly, then 1L is diluted to deionized water.
Specific embodiment 10
100ml deionized waters are first taken, 1g sulfuric acid (50%), 0.5g malic acid, 5g hydrogen peroxide stabilizers, 300g dioxygens is added
It stirs evenly after water (35%), 0.1g dipropylene glycol monomethyl ethers, 0.5g ethanol amines, 1g organic phosphine sulfonics, 5g nitroureas, then uses
Deionized water is diluted to 1L.
The surface conditioning agent that above-mentioned specific embodiment 1 to 10 is prepared to gained carries out PCB copper coin surface treatments, specifically does
Method is to contact on the copper surface of PCB copper coins with the copper surface treatment agent to be removed brown layer and the outstanding copper of blind hole, surface treatment
The temperature in use of agent is 10~40 DEG C, and the occupation mode of the surface conditioning agent is that copper is impregnated in copper surface treatment agent or is incited somebody to action
Uniformly spray is on copper surface for copper surface treatment agent, wherein the pressure sprayed is 0.05~0.30MPa.
Blind hole brown plate is carried out at surface using the copper surface treatment agent for preparing gained in above-mentioned specific embodiment 1~10
Reason, can reach using the pattern of etch-rate and etch copper back plate face as Indexs measure copper surface treatment agent of the present invention
Technique effect.Using blind hole brown plate as testing piece, the specification of testing piece is 50mm × 40mm for wherein etching test；Test condition
It is to swing to wash test 6min at 25 DEG C, test result is referring to described in table 1, corresponding copper surface treatment agent brown board blind hole before and after the processing
Surface topography is as shown in attached drawing 1-1 to attached drawing 1-10 and attached drawing 2-1 to attached drawing 2-10.
Table 1
From above-mentioned table 1 and Fig. 1-1 to Fig. 1-10 and Fig. 2-1 to Fig. 2-10 as can be seen that from copper surface described herein
Reason agent can not only uniformly remove the brown layer of blind hole brown copper coin, and can effectively remove blind hole and hang copper, to normal copper face
No corrosion obtains the uniform clean copper foil surface of microetch, and simple for process, dipping and spray, entirely appropriate industry make
With.
The above is only a preferred embodiment of the present invention, it is not intended to restrict the invention, it is noted that for this skill
For the those of ordinary skill in art field, without departing from the technical principles of the invention, can also make it is several improvement and
Modification, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (10)
1. a kind of PCB surface conditioning agents for removing brown layer and the outstanding copper of blind hole, are sulfuric acid/hydrogen peroxide system, it is characterised in that：Packet
It includes 0.5~1.0g/L of sulfuric acid, 10~200g/L of hydrogen peroxide, 0.1~8.0g/L of hydrogen peroxide stabilizer, outstanding copper and ingratiates with wetting activator
The deionized water of 0.01~20.0g/L, 10~100g/L of selective etch agent and surplus, and the pH value of the surface conditioning agent is
1.0~5.0；It is alkylol ether surfactant and the composition without hydracid that the wherein described outstanding copper, which ingratiates with wetting activator,；Institute
State salt, organic phosphine compound and the water soluble nitro compound that selective etch agent is aminated compounds and/or aminated compounds
Composition；The hydrogen peroxide stabilizer is the compound for capableing of stable peroxide hydrogen in acid solution.
2. the PCB according to claim 1 surface conditioning agents for removing brown layer and the outstanding copper of blind hole, it is characterised in that：Including
0.5~1.0g/L of sulfuric acid, 20~100g/L of hydrogen peroxide, 0.5~4.0g/L of hydrogen peroxide stabilizer, outstanding copper ingratiate with wetting activator
The deionized water of 0.1~10.0g/L, 20~80g/L of selective etch agent and surplus, and the pH value of the surface conditioning agent is 1.5
~4.5.
3. the PCB according to claim 2 surface conditioning agents for removing brown layer and the outstanding copper of blind hole, it is characterised in that：It is described
Alkylol ether surfactant is propylene glycol monomethyl ether, dihydroxypropane single-ether, propylene glycol monobutyl ether, glycol monoethyl ether, second
At least one of 2-ethoxyethanol, ethylene glycol monobutyl ether, dimethyl ether and dipropylene glycol monomethyl ether.
4. the PCB according to claim 2 surface conditioning agents for removing brown layer and the outstanding copper of blind hole, it is characterised in that：It is described
No hydracid is phosphoric acid, acetic acid, citric acid, sulfamic acid, succinic acid, nitric acid, lactic acid, malonic acid, malic acid, sulfuric acid and tartaric acid
At least one of.
5. the PCB according to claim 2 surface conditioning agents for removing brown layer and the outstanding copper of blind hole, it is characterised in that：It is described
Aminated compounds and its salt are aniline, pentamethylene amine, cycloheptyl alkanamine, dihydroxy ethyl cyclohexylamine, dicyclohexyl amine, 4- cyclohexyls
Amine, dihydroxy ethyl cyclohexylamine, dimethyl cyclohexyl amine, cyclobutane dimethylamine, N- ethyls cyclopentamine, ethanol amine, dopamine, cyclobutane
At least one of formamide, amino -1- cyclopentane formamides, Ammonium benzoate and its salt.
6. the PCB according to claim 2 surface conditioning agents for removing brown layer and the outstanding copper of blind hole, it is characterised in that：It is described
Organic phosphine compound is aminotrimethylenephosphonic acid, diethylenetriamine pentamethylenophosphonic acid, organic phosphine sulfonic, polyalcohol phosphoric acid
Ester, 2- phosphonobutane -1,2,4- tricarboxylic acids, phosphono hydroxyacetic acid, hydroxy ethylene diphosphonic acid, four methylene of polyamino polyether base
Base phosphonic acids, ethylenediamine tetramethylene phosphonic acid, diethylenetriamine penta, two hexene triamine pentamethylene phosphonic acids and its ammonium
At least one of salt.
7. the PCB according to claim 2 surface conditioning agents for removing brown layer and the outstanding copper of blind hole, it is characterised in that：It is described
Water soluble nitro compound is nitrobenzoic acid, nitro-salicylic acid, nitrophenol, nitrotoleune, nitroaniline, nitrobenzene sulphur
At least one of acid, nitrobenzene ethane nitrile, nitracetanilide, nitrourea, nitroguanidine and its salt.
8. the PCB according to claim 2 surface conditioning agents for removing brown layer and the outstanding copper of blind hole, it is characterised in that：It is described
Hydrogen peroxide stabilizer is in allylurea, 1,3- dimethyl ureas, phenylurea, phenyl acetamide, styrene glycol and phenolsulfonic acid
It is at least one.
9. at a kind of surfaces for removing brown layer and the outstanding copper of blind hole PCB using described in any claim in claim 1 to 8
Manage the method that agent carries out PCB copper coin surface treatments, it is characterised in that：By the copper surface of PCB copper coins and the copper surface treatment agent
Contact is removed brown layer and blind hole hangs copper, wherein the temperature in use of the copper surface treatment agent is 10~40 DEG C.
10. PCB copper coins surface treatment method according to claim 9, it is characterised in that：The copper surface of the PCB copper coins
The mode contacted with the copper surface treatment agent is that copper is impregnated in copper surface treatment agent or uniformly sprays copper surface treatment agent
It drenches on copper surface, wherein the pressure sprayed is 0.05~0.30MPa.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710159890.4A CN108624884B (en) | 2017-03-17 | 2017-03-17 | The PCB surface treating agent and surface treatment method for removing brownification layer and the outstanding copper of blind hole |
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| CN201710159890.4A CN108624884B (en) | 2017-03-17 | 2017-03-17 | The PCB surface treating agent and surface treatment method for removing brownification layer and the outstanding copper of blind hole |
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| CN109576717A (en) * | 2018-11-29 | 2019-04-05 | 广东工业大学 | Move back copper agent and its preparation method and application in a kind of permalloy silk table face |
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| WO2022151012A1 (en) * | 2021-01-13 | 2022-07-21 | 柏承科技(昆山)股份有限公司 | Film stripping, degumming and chemical copper processing three-in-one process capable of preventing degumming contamination |
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| CN117070948A (en) * | 2023-10-16 | 2023-11-17 | 珠海市板明科技有限公司 | Circuit board suspension removing copper solution and circuit board suspension removing copper method |
| CN117956692A (en) * | 2024-03-27 | 2024-04-30 | 深圳市板明科技股份有限公司 | Alkaline copper removing liquid for circuit board, preparation method thereof and copper removing method |
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