WO2022151012A1 - Film stripping, degumming and chemical copper processing three-in-one process capable of preventing degumming contamination - Google Patents
Film stripping, degumming and chemical copper processing three-in-one process capable of preventing degumming contamination Download PDFInfo
- Publication number
- WO2022151012A1 WO2022151012A1 PCT/CN2021/071397 CN2021071397W WO2022151012A1 WO 2022151012 A1 WO2022151012 A1 WO 2022151012A1 CN 2021071397 W CN2021071397 W CN 2021071397W WO 2022151012 A1 WO2022151012 A1 WO 2022151012A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- micro
- etching
- degumming
- preventing
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 27
- 239000010949 copper Substances 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000011109 contamination Methods 0.000 title abstract description 3
- 239000000126 substance Substances 0.000 title abstract 3
- 238000005530 etching Methods 0.000 claims abstract description 27
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 238000007788 roughening Methods 0.000 claims abstract description 11
- 238000005553 drilling Methods 0.000 claims abstract description 9
- 238000007747 plating Methods 0.000 claims abstract description 5
- 239000003292 glue Substances 0.000 claims description 22
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 3
- 229910001431 copper ion Inorganic materials 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims 1
- 230000007797 corrosion Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000002203 pretreatment Methods 0.000 abstract 1
- 238000006748 scratching Methods 0.000 abstract 1
- 230000002393 scratching effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000010309 melting process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Definitions
- the invention relates to the technical field of printed circuit board manufacturing, in particular to a three-in-one process of film stripping, glue removal and copper melting capable of preventing and removing glue pollution.
- the HDI board has a browning/roughening film on the board surface after laser drilling. After the film removal process, it will not contaminate the bath liquid by degumming and micro-etching.
- the method used in the industry is laser drilling, after the debrown film/roughening film line, and then out to the degumming line. This operation method increases the number of personnel handling, generates more scratch risks, and requires manpower and material resources.
- the main purpose of the present invention is to provide a three-in-one process of film stripping, glue removal, and copper melting that can prevent glue pollution, which can avoid the contamination of the glue removal tank agent, and also allows the film stripping, glue removal, and copper melting can be combined in the same process. completed in one production line.
- the present invention achieves the above objects through the following technical solutions: a three-in-one process of film stripping, glue removal, and copper melting capable of preventing and removing glue pollution, the steps comprising:
- 1Laser processing roughen the surface of the PCB board with a copper layer on the surface, and then carry out laser drilling on the PCB board;
- 2Micro-etching Immerse the drilled PCB board in a micro-etching solution with a film stripper, and peel off the brown or roughened film while micro-etching;
- 3Pretreatment of copper plating Continuously complete the process of degumming and copper plating on the PCB board.
- the same vertical conveying line is used to convey the PCB board.
- the roughening treatment adopts a browning agent or a roughening agent.
- the micro-etching solution includes 5 ⁇ 2 wt% sulfuric acid, 4 ⁇ 1 wt% hydrogen peroxide, 4 ⁇ 1 wt% film stripper, and a copper ion content of less than 40 g/L.
- the amount of biting in the micro-etching is controlled at 10-15 mil.
- the browning film/roughening film can be removed simultaneously during the micro-etching process, so as to prevent it from contaminating the glue removal tank agent, and also allow the steps after drilling to be performed in the same assembly line It is completed in the middle, which improves the production efficiency and avoids the risk of scratches caused by handling between different lines.
- a three-in-one process of film stripping, glue removal and copper melting capable of preventing and removing glue pollution of the present invention comprises the following steps:
- Browning agent or roughening agent can be used for roughening, the purpose is to make the surface of the PCB board more conducive to the collection of laser energy, improve the drilling efficiency, save the laser energy, and reduce the expansion and contraction deformation of the PCB board.
- the same vertical conveying line is used to convey the PCB board.
- the vertical conveying line can keep the PCB board in a vertical state, the surface will not be blocked and affect the processing effect, and it is also convenient for washing.
- the micro-etching solution includes 5 ⁇ 2wt% sulfuric acid, 4 ⁇ 1wt% hydrogen peroxide, 4 ⁇ 1wt% film stripping agent and a copper ion content of less than 40g/L. According to experience, the micro-etching solution can make the processing effect of the PCB board ideal with such a formula.
- the amount of biting in the micro-etching is controlled at 10-15 mil. This amount of bite can ensure that the brown or roughened film is completely stripped, and prevent the copper thickness from being too thin and causing open circuit problems.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The present invention belongs to the technical field of the manufacturing of printed circuit boards, and relates to a film stripping, degumming and chemical copper processing three-in-one process capable of preventing degumming contamination, the process comprising the steps of: (1) laser processing, involving: roughening a surface of a PCB having a copper layer on the surface, and then performing laser drilling on the PCB; (2) micro-etching, involving: immersing the drilled PCB in a micro-etching solution to which a film stripping agent has been added, and also stripping a browned oxide film or a roughened film during micro-etching; and (3) copper plating pre-treatment, involving: completing degumming and chemical copper processing on the PCB in a consecutive manner. In the present invention, by adding the film stripping agent to the micro-etching solution, the browned oxide film/the roughened film is also removed during micro-etching, thereby preventing an agent in a degumming tank from being contaminated by the browned oxide film/the roughened film; in addition, the step after drilling can be completed in the same assembly line, such that the production efficiency is improved, and the risk of scratching caused by conveyance between different assembly lines is also avoided.
Description
本发明涉及印刷电路板制造技术领域，特别涉及一种能防除胶污染的退膜、除胶、化铜三合一工艺。The invention relates to the technical field of printed circuit board manufacturing, in particular to a three-in-one process of film stripping, glue removal and copper melting capable of preventing and removing glue pollution.
随着科技进步，社会的不断发展，PCB制造业面临着人力和物料成本不断增加所带来的巨大压力，在保证质量的前提下节约物料，降低生产成本输出，简化整合生产工艺流程已成为当前PCB制造业急需解决的问题，在目前生产过程中，HDI板经过激光钻孔后板面有棕化/粗化膜，如果直接经过除胶微蚀势必会污染槽液，故需要在除胶前做去膜流程后再经过除胶微蚀才不会污染槽液，目前业界所采用的方式均为激光钻孔后经过去棕化膜/粗化膜线后再出至除胶线。此种作业方式增加了人员搬运次数，产生了更多的刮伤风险，且需要耗费人力物力。With the advancement of science and technology and the continuous development of society, the PCB manufacturing industry is facing the huge pressure brought about by the continuous increase in labor and material costs. Saving materials, reducing production cost output, and simplifying and integrating the production process under the premise of ensuring quality have become the current An urgent problem to be solved in the PCB manufacturing industry. In the current production process, the HDI board has a browning/roughening film on the board surface after laser drilling. After the film removal process, it will not contaminate the bath liquid by degumming and micro-etching. At present, the method used in the industry is laser drilling, after the debrown film/roughening film line, and then out to the degumming line. This operation method increases the number of personnel handling, generates more scratch risks, and requires manpower and material resources.
因此有必要开发一种低成本的印刷电路板制造方法来解决以上问题。Therefore, it is necessary to develop a low-cost printed circuit board manufacturing method to solve the above problems.
发明内容SUMMARY OF THE INVENTION
本发明的主要目的在于提供一种能防除胶污染的退膜、除胶、化铜三合一工艺，能够避免除胶槽药剂被污染，也让退膜、除胶、化铜可以合并在同一条生产流线中完成。The main purpose of the present invention is to provide a three-in-one process of film stripping, glue removal, and copper melting that can prevent glue pollution, which can avoid the contamination of the glue removal tank agent, and also allows the film stripping, glue removal, and copper melting can be combined in the same process. completed in one production line.
本发明通过如下技术方案实现上述目的：一种能防除胶污染的退膜、除胶、化铜三合一工艺，步骤包括：The present invention achieves the above objects through the following technical solutions: a three-in-one process of film stripping, glue removal, and copper melting capable of preventing and removing glue pollution, the steps comprising:
①镭射加工：对表面有铜层的PCB板的表面进行粗糙化处理，然后对PCB板进行镭射钻孔；①Laser processing: roughen the surface of the PCB board with a copper layer on the surface, and then carry out laser drilling on the PCB board;
②微蚀：将已钻孔的PCB板浸入加有膜剥除剂的微蚀液中，微蚀的同时将棕化膜或粗化膜剥除；②Micro-etching: Immerse the drilled PCB board in a micro-etching solution with a film stripper, and peel off the brown or roughened film while micro-etching;
③镀铜前处理：对PCB板连续完成除胶和化铜制程。③Pretreatment of copper plating: Continuously complete the process of degumming and copper plating on the PCB board.
具体的，从微蚀到后续处理都采用同一条垂直输送线对PCB板进行输送。Specifically, from micro-etching to subsequent processing, the same vertical conveying line is used to convey the PCB board.
具体的，所述粗糙化处理采用棕化剂或粗化剂。Specifically, the roughening treatment adopts a browning agent or a roughening agent.
具体的，所述微蚀液中包括5±2wt％硫酸、4±1wt％双氧水、4±1wt％膜剥除剂和小于40g/L的铜离子含量。Specifically, the micro-etching solution includes 5±2 wt% sulfuric acid, 4±1 wt% hydrogen peroxide, 4±1 wt% film stripper, and a copper ion content of less than 40 g/L.
进一步的，所述微蚀中的咬蚀量控制在10～15mil。Further, the amount of biting in the micro-etching is controlled at 10-15 mil.
本发明技术方案的有益效果是：The beneficial effects of the technical solution of the present invention are:
本发明通过在微蚀液中添加膜剥除剂，让微蚀过程中棕化膜/粗化膜被同时除去，以免其污染除胶槽药剂，也让钻孔之后的步骤可以在同一条流水线中完成，提高了生产效率，还避免了不同流水线之间搬运而导致的刮伤风险。In the present invention, by adding a film stripper into the micro-etching liquid, the browning film/roughening film can be removed simultaneously during the micro-etching process, so as to prevent it from contaminating the glue removal tank agent, and also allow the steps after drilling to be performed in the same assembly line It is completed in the middle, which improves the production efficiency and avoids the risk of scratches caused by handling between different lines.
下面结合具体实施例对本发明作进一步详细说明。The present invention will be further described in detail below in conjunction with specific embodiments.
实施例：Example:
本发明的一种能防除胶污染的退膜、除胶、化铜三合一工艺，其步骤包括：A three-in-one process of film stripping, glue removal and copper melting capable of preventing and removing glue pollution of the present invention comprises the following steps:
①对PCB板的表面进行粗糙化处理，然后对PCB板进行镭射钻孔。粗糙化可采用棕化剂或粗化剂，其目的在于让PCB板的表面更利于激光能量汇集，提高钻孔效率，节省激光能量，降低PCB板的涨缩变形量。① Roughen the surface of the PCB board, and then perform laser drilling on the PCB board. Browning agent or roughening agent can be used for roughening, the purpose is to make the surface of the PCB board more conducive to the collection of laser energy, improve the drilling efficiency, save the laser energy, and reduce the expansion and contraction deformation of the PCB board.
②将已钻孔的PCB板浸入加有膜剥除剂的微蚀液中，微蚀的同时将棕 化膜或粗化膜剥除。本步骤能同时完成铜层的减薄和棕化膜/粗化膜的除去，以免其污染除胶槽药剂。② Immerse the drilled PCB board in the micro-etching solution with film stripper, and remove the brown or roughened film while micro-etching. This step can simultaneously complete the thinning of the copper layer and the removal of the browning film/roughening film, so as to prevent it from contaminating the glue removal tank agent.
③对PCB板连续完成除胶和化铜制程。这样使微蚀、除胶、化铜工艺连续化，提高了生产效率，还避免了PCB板在不同流水线之间搬运而导致的刮伤风险。化铜后，就可以再在PCB板的表面电镀新的铜层，并让不同层的线路导通。③Continuously complete the degumming and copper melting process for the PCB board. In this way, the micro-etching, degumming, and copper melting processes are continuous, which improves production efficiency and avoids the risk of scratches caused by PCB boards being transported between different assembly lines. After the copper is melted, a new copper layer can be electroplated on the surface of the PCB board, and the lines of different layers can be turned on.
从微蚀到后续处理都采用同一条垂直输送线对PCB板进行输送。垂直输送线能够让PCB板始终呈竖直状态，表面基本不会受到阻挡而影响处理效果，也方便冲洗。From micro-etching to subsequent processing, the same vertical conveying line is used to convey the PCB board. The vertical conveying line can keep the PCB board in a vertical state, the surface will not be blocked and affect the processing effect, and it is also convenient for washing.
微蚀液中包括5±2wt％硫酸、4±1wt％双氧水、4±1wt％膜剥除剂和小于40g/L的铜离子含量。按照经验，微蚀液以这样的配方能让PCB板的处理效果比较理想。The micro-etching solution includes 5±2wt% sulfuric acid, 4±1wt% hydrogen peroxide, 4±1wt% film stripping agent and a copper ion content of less than 40g/L. According to experience, the micro-etching solution can make the processing effect of the PCB board ideal with such a formula.
微蚀中的咬蚀量控制在10～15mil。这个咬蚀量可以确保棕化膜或粗化膜被完全剥除，又防止铜厚太薄而导致断路问题。The amount of biting in the micro-etching is controlled at 10-15 mil. This amount of bite can ensure that the brown or roughened film is completely stripped, and prevent the copper thickness from being too thin and causing open circuit problems.
以上所述的仅是本发明的一些实施方式。对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。The foregoing are merely some of the embodiments of the present invention. For those of ordinary skill in the art, without departing from the inventive concept of the present invention, several modifications and improvements can be made, which all belong to the protection scope of the present invention.
Claims (5)
- 一种能防除胶污染的退膜、除胶、化铜三合一工艺，其特征在于步骤包括：A three-in-one process of film stripping, glue removal and copper melting capable of preventing and removing glue pollution is characterized in that the steps include:①镭射加工：对表面有铜层的PCB板的表面进行粗糙化处理，然后对PCB板进行镭射钻孔；①Laser processing: roughen the surface of the PCB board with a copper layer on the surface, and then carry out laser drilling on the PCB board;②微蚀：将已钻孔的PCB板浸入加有膜剥除剂的微蚀液中，微蚀的同时将棕化膜或粗化膜剥除；②Micro-etching: Immerse the drilled PCB board in a micro-etching solution with a film stripper, and peel off the brown or roughened film while micro-etching;③镀铜前处理：对PCB板连续完成除胶和化铜制程。③Pretreatment of copper plating: Continuously complete the process of degumming and copper plating on the PCB board.
- 根据权利要求1所述的能防除胶污染的退膜、除胶、化铜三合一工艺，其特征在于：从微蚀到后续处理都采用同一条垂直输送线对PCB板进行输送。The three-in-one process of film stripping, glue removal and copper melting capable of preventing and removing glue pollution according to claim 1 is characterized in that: from micro-etching to subsequent processing, the same vertical conveying line is used to convey the PCB board.
- 根据权利要求1所述的能防除胶污染的退膜、除胶、化铜三合一工艺，其特征在于：所述粗糙化处理采用棕化剂或粗化剂。The three-in-one process of film stripping, glue removal, and copper melting capable of preventing and removing glue pollution according to claim 1, characterized in that: the roughening treatment adopts a browning agent or a roughening agent.
- 根据权利要求1所述的能防除胶污染的退膜、除胶、化铜三合一工艺，其特征在于：所述微蚀液中包括5±2wt％硫酸、4±1wt％双氧水、4±1wt％膜剥除剂和小于40g/L的铜离子含量。The three-in-one process of film stripping, glue removal, and copper melting capable of preventing glue pollution according to claim 1, characterized in that: the micro-etching solution comprises 5±2wt% sulfuric acid, 4±1wt% hydrogen peroxide, 4±1wt% hydrogen peroxide, 4±1 wt% 1 wt% film stripper and copper ion content less than 40 g/L.
- 根据权利要求4所述的能防除胶污染的退膜、除胶、化铜三合一工艺，其特征在于：所述微蚀中的咬蚀量控制在10～15mil。The three-in-one process of film stripping, glue removal, and copper melting capable of preventing glue pollution according to claim 4, characterized in that: the amount of bite corrosion in the micro-etching is controlled within 10-15 mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2021/071397 WO2022151012A1 (en) | 2021-01-13 | 2021-01-13 | Film stripping, degumming and chemical copper processing three-in-one process capable of preventing degumming contamination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2021/071397 WO2022151012A1 (en) | 2021-01-13 | 2021-01-13 | Film stripping, degumming and chemical copper processing three-in-one process capable of preventing degumming contamination |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2022151012A1 true WO2022151012A1 (en) | 2022-07-21 |
Family
ID=82446376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2021/071397 WO2022151012A1 (en) | 2021-01-13 | 2021-01-13 | Film stripping, degumming and chemical copper processing three-in-one process capable of preventing degumming contamination |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2022151012A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211613A (en) * | 2016-08-05 | 2016-12-07 | 广州美维电子有限公司 | A kind of horizontal removing glue technique producing pcb board |
| CN107454760A (en) * | 2017-08-24 | 2017-12-08 | 高德（无锡）电子有限公司 | The radium-shine through-hole approaches of carbon dioxide laser |
| CN108624884A (en) * | 2017-03-17 | 2018-10-09 | 昆山市板明电子科技有限公司 | The PCB surface conditioning agents and surface treatment method for removing brown layer and the outstanding copper of blind hole |
| CN109982521A (en) * | 2019-03-26 | 2019-07-05 | 高德（江苏）电子科技有限公司 | A kind of preparation method of 16 layers of any interconnecting circuit board |
-
2021
- 2021-01-13 WO PCT/CN2021/071397 patent/WO2022151012A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211613A (en) * | 2016-08-05 | 2016-12-07 | 广州美维电子有限公司 | A kind of horizontal removing glue technique producing pcb board |
| CN108624884A (en) * | 2017-03-17 | 2018-10-09 | 昆山市板明电子科技有限公司 | The PCB surface conditioning agents and surface treatment method for removing brown layer and the outstanding copper of blind hole |
| CN107454760A (en) * | 2017-08-24 | 2017-12-08 | 高德（无锡）电子有限公司 | The radium-shine through-hole approaches of carbon dioxide laser |
| CN109982521A (en) * | 2019-03-26 | 2019-07-05 | 高德（江苏）电子科技有限公司 | A kind of preparation method of 16 layers of any interconnecting circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWM619792U (en) | Three-in-one system for film stripping, desmearing, and copper depositing or two-in-one system for desmearing and copper depositing | |
| CN108966520B (en) | Anti-plagiarism shielding type PCB printing process | |
| CN108966515A (en) | A kind of 6.0 technique of printed wiring board etching factor | |
| CN101166397A (en) | A method for removing sensitization film in flexible printed circuit board | |
| WO2022151012A1 (en) | Film stripping, degumming and chemical copper processing three-in-one process capable of preventing degumming contamination | |
| CN104640360B (en) | A kind of compensation method of pcb board copper thickness | |
| CN109511235A (en) | The production method for the selective jack panel that a kind of hole VIP hole copper requires | |
| CN106011993B (en) | Flash solution and preparation method thereof is removed in one kind electrolysis | |
| EP4317538A1 (en) | Copper removing device for conductive band | |
| WO2021120638A1 (en) | Processing method for spraying character on surface of pcb substrate | |
| CN103619131B (en) | A kind of circuit board producing method of anti-golden finger leakage copper | |
| CN111394765A (en) | Electrolytic copper foil surface treatment process | |
| CN112160002B (en) | Method for carrying out surface activation treatment on copper alloy surface | |
| CN110003709B (en) | Deplating method | |
| CN110791763A (en) | Titanium plate leveling method | |
| CN115305161A (en) | Electrolytic copper foil anode plate cleaning agent and preparation method thereof | |
| CN111010812B (en) | Manufacturing method of circuit board with dot plating pattern | |
| CN114900980A (en) | Flexible circuit board and method and system for removing inner layer glue residue of flexible circuit board | |
| CN111969077B (en) | Reworking method of solar cell | |
| CN114449765A (en) | HDI board manufacturing method for manufacturing blind hole instead of laser | |
| CN113073366A (en) | Etching silver plating matching process applied to copper sheet | |
| CN105220154B (en) | The removing process of tinning or electrotinning on a kind of copper or Ni-based material | |
| CN109468641B (en) | Method for chemically-physically removing copper and copper-zinc alloy based silver coating | |
| CN106245058B (en) | A kind of method of copper in electrolytic recovery brown oxide waste liquid | |
| CN116446029A (en) | Method and device for withdrawing tin and recovering tin simultaneously for PCB (printed circuit board) in one step |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21918229 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 21918229 Country of ref document: EP Kind code of ref document: A1 |