CN109982521A - A kind of preparation method of 16 layers of any interconnecting circuit board - Google Patents
A kind of preparation method of 16 layers of any interconnecting circuit board Download PDFInfo
- Publication number
- CN109982521A CN109982521A CN201910232791.3A CN201910232791A CN109982521A CN 109982521 A CN109982521 A CN 109982521A CN 201910232791 A CN201910232791 A CN 201910232791A CN 109982521 A CN109982521 A CN 109982521A
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- CN
- China
- Prior art keywords
- circuit board
- layer
- copper foil
- radium
- foil layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to a kind of preparation methods of 16 layers of any interconnecting circuit board, the upper copper foil layer of printed circuit board and lower copper foil layer are subjected to brownification processing first and form brownification layer, by treated, printed circuit board is placed in progress carbon dioxide laser laser drilling in the radium-shine machine table of carbon dioxide laser, again through removing gelatinization copper after the removal of chemical microetch, radium-shine hole is filled up after copper using radium-shine direct imaging, be finally laid with one layer of prepreg respectively in the lower section of the top of upper copper foil layer and lower copper foil layer and is pressed using oil pressure unit.Step is repeated until being pressed into 16 layer circuit boards.Preparation method of the present invention is simple, step is easily operated, printed circuit board is by 8 times radium-shine, 8 filling perforations plating, has Ultra-High Order and Multi-layer design after 7 pressings, so that it has enough space layout routes and mounting related components, thus realize electronic product powerful functional application and perfect user experience.
Description
Technical field
The present invention relates to a kind of preparation methods of 16 layers of any interconnecting circuit board, belong to printed circuit board processing technology neck
Domain.
Background technique
The electronic products such as smart phone, tablet computer and wearable device develop to miniaturization and multifunction direction,
The component number of carrying increases significantly, and the space for leaving circuit board for is but more and more limited.In this context, the essence of PCB
Density is constantly promoted, to enable PCB in the case where size, weight and volume mitigate, can accommodate more first devices instead
Part.The 16 layers of any circuit board of interconnecting circuit board as very high-density, processing flow is long, wants to material, equipment, production technology
Ask high.
Summary of the invention
The purpose of the present invention is to solve the above problems, provide a kind of preparation side of 16 layers of any interconnecting circuit board
Method.
The present invention adopts the following technical scheme: a kind of preparation method of 16 layers of any interconnecting circuit board, includes the following steps:
(1) the upper copper foil layer of printed circuit board and lower copper foil layer are subjected to brownification processing and form brownification layer, the brownification layer is micro-
Erosion amount is 2.5 ~ 3.5 μm；
It (2) will treated that printed circuit board is placed in that carbon dioxide laser is carried out in the radium-shine machine table of carbon dioxide laser is radium-shine
Drilling；
(3) the brownification layer of upper copper foil layer and lower copper foil layer is removed into gelatinization copper, the chemistry microetch again after the removal of chemical microetch
Microetch amount is 0.8 μm；
(4) use insoluble anode vertical continuous electroplating device, using cupric oxide powder provide copper ion, improve electroplating evenness with
And plating planarization, copper is filled up into radium-shine hole；
(5) line pattern is produced on upper copper foil layer and lower copper foil layer by radium-shine direct imaging technique；
(6) it is laid with one layer of prepreg respectively in the lower section of the top of upper copper foil layer and lower copper foil layer and is carried out using oil pressure unit
It presses, prepreg is heated in bonding processes, heating temperature is up to 205 DEG C, and heating rate is 3 DEG C/min；
(7) step (1)-(6) are repeated accumulative 7 times until forming 16 layers of any interconnecting circuit board.For the material for avoiding front from pressing
Over-curing and cause its reliability to be deteriorated, pressing pressure is incremented by with the increase of pressing number, pressure limit for 320 ~
380psi。
Further, the middle layer of the printed circuit board be thermosetting resin substrate layer, middle layer with a thickness of
0.05~0.075mm。
Further, the brownification handle when using immersion handle, treatment temperature be 30 ~ 40 DEG C, linear speed be 1.6 ~
1.8m/min。
Further, the carbon dioxide laser is radium-shine uses tack impulse wave, and the diaphragm diameter of processing is 1.6 ~
2.2mm, pulsewidth are 3 ~ 12 μ s, and energy is 6 ~ 14 MJ, and hair number is 3 ~ 4 hairs.
Further, the radium-shine direct imaging technique aligning accuracy is 25 μm.
Further, the pressure uniformity of the oil pressure unit in the step (6) is less than 50 μm.
Further, the prepreg in the step (6) is FR-4 plate, and the thermal cracking temperature of the FR-4 plate is 380
DEG C, PPM/ DEG C of the Z axis coefficient of expansion 155.
Further, the pressure pressed twice before in the step (7) in 7 pressings is 320psi, and centre presses three times
Pressure position 350psi, after the pressure that presses twice be 380psi, it is intended to the excessive material for avoiding front from pressing solidifies and causes
Its reliability is deteriorated.
Preparation method of the present invention is simple, and step is easily operated, and printed circuit board passes through 8 radium-shine, 8 filling perforations plating, 7
Have Ultra-High Order and Multi-layer design after secondary pressing, so that it has enough space layout routes and mounting related components, to realize
The powerful functional application of electronic product and perfect user experience.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of 16 layer circuit boards of the invention.
Fig. 2 is each step schematic diagram of the embodiment of the present invention.
Fig. 2-1 to 2-6 is corresponding each step schematic diagram in the embodiment of the present invention.
Specific embodiment
Below in conjunction with attached drawing, the invention will be further described.
Embodiment one: as shown in Fig. 2-1 to Fig. 2-6, a kind of production method of 16 layers of any interconnecting circuit board, with 4 laminates
It is pressed into for 6 laminates, includes the following steps:
(1) brownification is handled: handling shape for brownification is carried out to the upper copper foil layer of the printed circuit board of laser drilling and lower copper foil layer
At brownification layer；The middle layer of printed circuit board is thermosetting resin substrate layer, with a thickness of 0.075mm.
(2) by printed circuit board be placed in the radium-shine machine table of carbon dioxide laser carry out carbon dioxide laser it is radium-shine；Two
Carbonoxide is radium-shine to use tack impulse wave, and different according to the prepreg thickness of printed circuit board, the diaphragm diameter of processing is
2.2mm, pulsewidth are 11 μ s, energy 11mj, and hair number is 4 hairs.
(3) the brownification layer on upper copper foil layer and lower copper foil layer is stung after etching off removes by chemistry using except gelatinization copper.
(4) by using insoluble anode vertical continuous electroplating device, copper ion is provided using cupric oxide powder substitution copper ball,
Electroplating evenness and plating planarization are improved, copper is filled up into radium-shine hole, copper face recess≤10um after filling perforation.
(5) excessively radium-shine direct imaging technique produces line pattern on upper copper foil layer and lower copper foil layer；
(6) pressing uses the low-expansion FR4 material of high-fire resistance, and thermal cracking temperature is up to 380 DEG C, the Z axis coefficient of expansion
155PPM/ DEG C (when temperature is more than 170 DEG C), pressing pressure 320psi, 3 DEG C/min of heating rate.
Embodiment two: as shown in Fig. 2-1 to Fig. 2-6, a kind of production method of 16 layers of any interconnecting circuit board, with 4 laminates
It is pressed into for 6 laminates, includes the following steps:
(1) brownification is handled: handling shape for brownification is carried out to the upper copper foil layer of the printed circuit board of laser drilling and lower copper foil layer
At brownification layer；The middle layer of printed circuit board is thermosetting resin substrate layer, with a thickness of 0.05mm.
(2) by printed circuit board be placed in the radium-shine machine table of carbon dioxide laser carry out carbon dioxide laser it is radium-shine；Two
Carbonoxide is radium-shine to use tack impulse wave, and different according to the prepreg thickness of printed circuit board, the diaphragm diameter of processing is
1.6mm, pulsewidth are 12 μ s, energy 9mj, and hair number is 3 hairs.
(3) the brownification layer on upper copper foil layer and lower copper foil layer is stung after etching off removes by chemistry using except gelatinization copper.
(4) by using insoluble anode vertical continuous electroplating device, copper ion is provided using cupric oxide powder substitution copper ball,
Electroplating evenness and plating planarization are improved, copper is filled up into radium-shine hole, copper face recess≤10um after filling perforation.
(5) line pattern is produced on upper copper foil layer and lower copper foil layer by radium-shine direct imaging technique；
(6) pressing uses the low-expansion FR4 material of high-fire resistance, and thermal cracking temperature is up to 380 DEG C, the Z axis coefficient of expansion
155PPM/ DEG C (when temperature is more than 170 DEG C), pressing pressure 320psi, 3 DEG C/min of heating rate；
Step (the 1)-step (6) repeated in embodiment two is 7 times accumulative, and the preceding pressure pressed twice is 320psi in 7 pressings,
The pressure position 350psi that presses three times of centre, after the pressure that presses twice be 380psi, it is intended to the material mistake for avoiding front from pressing
Degree solidifies and its reliability is caused to be deteriorated, and ultimately forms 16 layer circuit boards described in Fig. 1.
Claims (8)
1. a kind of preparation method of 16 layers of any interconnecting circuit board, it is characterized in that: including the following steps:
(1) the upper copper foil layer of printed circuit board and lower copper foil layer are subjected to brownification processing and form brownification layer, the brownification layer is micro-
Erosion amount is 2.5 ~ 3.5 μm；
It (2) will treated that printed circuit board is placed in that carbon dioxide laser is carried out in the radium-shine machine table of carbon dioxide laser is radium-shine
Drilling；
(3) the brownification layer of upper copper foil layer and lower copper foil layer is removed into gelatinization copper, the chemistry microetch again after the removal of chemical microetch
Microetch amount is 0.8 μm；
(4) use insoluble anode vertical continuous electroplating device, using cupric oxide powder provide copper ion, improve electroplating evenness with
And plating planarization, copper is filled up into radium-shine hole；
(5) line pattern is produced on upper copper foil layer and lower copper foil layer by radium-shine direct imaging technique；
(6) it is laid with one layer of prepreg respectively in the lower section of the top of upper copper foil layer and lower copper foil layer and is carried out using oil pressure unit
It presses, prepreg is heated in bonding processes, heating temperature is up to 205 DEG C, and heating rate is 3 DEG C/min；
(7) step (1)-(6) are repeated accumulative 7 times until forming 16 layers of any interconnecting circuit board；
Its reliability is caused to be deteriorated for the excessive material solidification for avoiding front from pressing, pressing pressure is with the increase for pressing number
And be incremented by, pressure limit is 320 ~ 380psi.
2. the preparation method of 16 layers as described in claim 1 any interconnecting circuit board, it is characterized in that: the printed circuit board
Middle layer be thermosetting resin substrate layer, middle layer with a thickness of 0.05 ~ 0.075mm.
3. the preparation method of 16 layers as described in claim 1 any interconnecting circuit board, it is characterized in that: the brownification is adopted when handling
It is handled with immersion, treatment temperature is 30 ~ 40 DEG C, and linear speed is 1.6 ~ 1.8m/min.
4. the preparation method of 16 layers as described in claim 1 any interconnecting circuit board, it is characterized in that: the carbon dioxide laser
Radium-shine to use tack impulse wave, the diaphragm diameter of processing is 1.6 ~ 2.2mm, and pulsewidth is 3 ~ 12 μ s, and energy is 6 ~ 14 MJ, sends out number
For 3 ~ 4 hairs.
5. the preparation method of 16 layers as described in claim 1 any interconnecting circuit board, it is characterized in that: the radium-shine direct imaging
Technique aligning accuracy is 25 μm.
6. the preparation method of 16 layers as described in claim 1 any interconnecting circuit board, it is characterized in that: in the step (6)
The pressure uniformity of oil pressure unit is less than 50um.
7. the preparation method of 16 layers as described in claim 1 any interconnecting circuit board, it is characterized in that: in the step (6)
Prepreg is FR-4 plate, and the thermal cracking temperature of the FR-4 plate is 380 DEG C, PPM/ DEG C of the Z axis coefficient of expansion 155.
8. the preparation method of 16 layers as described in claim 1 any interconnecting circuit board, it is characterized in that: 7 times in the step (7)
The pressure that presses twice is 320psi, the pressure position 350psi that centre presses three times before in pressing, after the pressure that presses twice be
380psi, it is intended to which the excessive material for avoiding front from pressing solidifies and its reliability is caused to be deteriorated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910232791.3A CN109982521B (en) | 2019-03-26 | 2019-03-26 | Preparation method of 16-layer arbitrary interconnection circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910232791.3A CN109982521B (en) | 2019-03-26 | 2019-03-26 | Preparation method of 16-layer arbitrary interconnection circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109982521A true CN109982521A (en) | 2019-07-05 |
| CN109982521B CN109982521B (en) | 2021-12-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910232791.3A Active CN109982521B (en) | 2019-03-26 | 2019-03-26 | Preparation method of 16-layer arbitrary interconnection circuit board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111970844A (en) * | 2020-09-07 | 2020-11-20 | 深圳市星河电路股份有限公司 | Manufacturing process flow method of HDI board with any layer |
| WO2022151012A1 (en) * | 2021-01-13 | 2022-07-21 | 柏承科技(昆山)股份有限公司 | Film stripping, degumming and chemical copper processing three-in-one process capable of preventing degumming contamination |
| CN116634675A (en) * | 2023-05-25 | 2023-08-22 | 江苏博敏电子有限公司 | Method for eliminating laser hole adhesive residue of core plate layer of any layer of interconnection printed circuit board |
Citations (6)
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|---|---|---|---|---|
| US5544773A (en) * | 1991-09-06 | 1996-08-13 | Haruta; Youichi | Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method |
| JPH1154914A (en) * | 1997-08-06 | 1999-02-26 | Mitsubishi Gas Chem Co Inc | Manufacturing built-up multilayered printed wiring board |
| CN104349609A (en) * | 2013-08-08 | 2015-02-11 | 北大方正集团有限公司 | Printed circuit board and manufacturing method thereof |
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| CN105530767A (en) * | 2016-01-26 | 2016-04-27 | 江苏博敏电子有限公司 | Streamline production process for HDI board |
| CN107454760A (en) * | 2017-08-24 | 2017-12-08 | 高德（无锡）电子有限公司 | The radium-shine through-hole approaches of carbon dioxide laser |
-
2019
- 2019-03-26 CN CN201910232791.3A patent/CN109982521B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5544773A (en) * | 1991-09-06 | 1996-08-13 | Haruta; Youichi | Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method |
| JPH1154914A (en) * | 1997-08-06 | 1999-02-26 | Mitsubishi Gas Chem Co Inc | Manufacturing built-up multilayered printed wiring board |
| CN104349609A (en) * | 2013-08-08 | 2015-02-11 | 北大方正集团有限公司 | Printed circuit board and manufacturing method thereof |
| CN105101623A (en) * | 2015-08-27 | 2015-11-25 | 高德（无锡）电子有限公司 | Circuit board with ultra-thin medium layers and fabrication technology of circuit board |
| CN105530767A (en) * | 2016-01-26 | 2016-04-27 | 江苏博敏电子有限公司 | Streamline production process for HDI board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111970844A (en) * | 2020-09-07 | 2020-11-20 | 深圳市星河电路股份有限公司 | Manufacturing process flow method of HDI board with any layer |
| WO2022151012A1 (en) * | 2021-01-13 | 2022-07-21 | 柏承科技(昆山)股份有限公司 | Film stripping, degumming and chemical copper processing three-in-one process capable of preventing degumming contamination |
| CN116634675A (en) * | 2023-05-25 | 2023-08-22 | 江苏博敏电子有限公司 | Method for eliminating laser hole adhesive residue of core plate layer of any layer of interconnection printed circuit board |
| CN116634675B (en) * | 2023-05-25 | 2023-11-21 | 江苏博敏电子有限公司 | Method for eliminating laser hole adhesive residue of core plate layer of any layer of interconnection printed circuit board |
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| Publication number | Publication date |
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| CN109982521B (en) | 2021-12-14 |
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Address after: Jiangsu province Wuxi Chunhui road 214101 Xishan City Economic Development Zone No. 32 Patentee after: Gaode (Jiangsu) Electronic Technology Co.,Ltd. Address before: Jiangsu province Wuxi Chunhui road 214101 Xishan City Economic Development Zone No. 32 Patentee before: GULTECH (JIANGSU) ELECTRONIC TECHNOLOGIES CO.,LTD. |