CN117956692B - Alkaline copper removing liquid for circuit board, preparation method thereof and copper removing method - Google Patents
Alkaline copper removing liquid for circuit board, preparation method thereof and copper removing method Download PDFInfo
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- CN117956692B CN117956692B CN202410359620.8A CN202410359620A CN117956692B CN 117956692 B CN117956692 B CN 117956692B CN 202410359620 A CN202410359620 A CN 202410359620A CN 117956692 B CN117956692 B CN 117956692B
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- copper
- circuit board
- suspension
- alkaline
- liquid
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 260
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 256
- 239000010949 copper Substances 0.000 title claims abstract description 256
- 239000007788 liquid Substances 0.000 title claims abstract description 84
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000002360 preparation method Methods 0.000 title abstract description 9
- 239000000725 suspension Substances 0.000 claims abstract description 112
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims abstract description 88
- 235000019270 ammonium chloride Nutrition 0.000 claims abstract description 45
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910000013 Ammonium bicarbonate Inorganic materials 0.000 claims abstract description 34
- 235000012538 ammonium bicarbonate Nutrition 0.000 claims abstract description 34
- 239000001099 ammonium carbonate Substances 0.000 claims abstract description 34
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims abstract description 26
- 235000011114 ammonium hydroxide Nutrition 0.000 claims abstract description 26
- 239000003223 protective agent Substances 0.000 claims abstract description 21
- 239000003054 catalyst Substances 0.000 claims abstract description 17
- 239000000080 wetting agent Substances 0.000 claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 239000008367 deionised water Substances 0.000 claims description 13
- 229910021641 deionized water Inorganic materials 0.000 claims description 13
- 238000002791 soaking Methods 0.000 claims description 13
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 claims description 10
- -1 methylene dinaphthyl Chemical group 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims description 7
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 6
- 229960001927 cetylpyridinium chloride Drugs 0.000 claims description 6
- YMKDRGPMQRFJGP-UHFFFAOYSA-M cetylpyridinium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+]1=CC=CC=C1 YMKDRGPMQRFJGP-UHFFFAOYSA-M 0.000 claims description 6
- 229910052708 sodium Inorganic materials 0.000 claims description 6
- 239000011734 sodium Substances 0.000 claims description 6
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 6
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 claims description 6
- XKBGEWXEAPTVCK-UHFFFAOYSA-M methyltrioctylammonium chloride Chemical compound [Cl-].CCCCCCCC[N+](C)(CCCCCCCC)CCCCCCCC XKBGEWXEAPTVCK-UHFFFAOYSA-M 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- ZFAKTZXUUNBLEB-UHFFFAOYSA-N dicyclohexylazanium;nitrite Chemical compound [O-]N=O.C1CCCCC1[NH2+]C1CCCCC1 ZFAKTZXUUNBLEB-UHFFFAOYSA-N 0.000 claims description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 4
- PNGBYKXZVCIZRN-UHFFFAOYSA-M sodium;hexadecane-1-sulfonate Chemical compound [Na+].CCCCCCCCCCCCCCCCS([O-])(=O)=O PNGBYKXZVCIZRN-UHFFFAOYSA-M 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 229940090960 diethylenetriamine pentamethylene phosphonic acid Drugs 0.000 claims description 3
- DUYCTCQXNHFCSJ-UHFFFAOYSA-N dtpmp Chemical compound OP(=O)(O)CN(CP(O)(O)=O)CCN(CP(O)(=O)O)CCN(CP(O)(O)=O)CP(O)(O)=O DUYCTCQXNHFCSJ-UHFFFAOYSA-N 0.000 claims description 3
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 claims description 3
- XPGAWFIWCWKDDL-UHFFFAOYSA-N propan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCC[O-].CCC[O-].CCC[O-].CCC[O-] XPGAWFIWCWKDDL-UHFFFAOYSA-N 0.000 claims description 3
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 claims description 3
- 230000002378 acidificating effect Effects 0.000 abstract description 9
- 125000000524 functional group Chemical group 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 description 76
- 230000000052 comparative effect Effects 0.000 description 67
- 230000000694 effects Effects 0.000 description 59
- 238000012795 verification Methods 0.000 description 42
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 9
- 238000005553 drilling Methods 0.000 description 9
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 8
- 229910001431 copper ion Inorganic materials 0.000 description 8
- 238000005273 aeration Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 229910021529 ammonia Inorganic materials 0.000 description 4
- 239000003814 drug Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000004480 active ingredient Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 231100000956 nontoxicity Toxicity 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000035943 smell Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- VUZPPFZMUPKLLV-UHFFFAOYSA-N methane;hydrate Chemical compound C.O VUZPPFZMUPKLLV-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses an alkaline suspension copper removing liquid for a circuit board, a preparation method thereof and a suspension copper removing method, and relates to the technical field of printed circuit board production. The alkaline suspension-removing copper liquid for the circuit board comprises the following components in mass concentration: 3-20g/L of ammonium chloride, 0.2-2g/L of ammonium bicarbonate, 5-15g/L of industrial ammonia water, 0.2-2g/L of wetting agent, 5-20g/L of copper surface protective agent, 0.2-2g/L of suspension removal copper accelerator and 0.5-3g/L of catalyst; the mass ratio of the copper surface protective agent to the suspension-removing copper accelerator is 1: (0.02-0.3). The alkaline suspended copper removing liquid for the circuit board can rapidly remove splash copper of larger suspended copper at the edge of the orifice of the blind hole, and functional group factors of the suspended copper removing liquid are adsorbed around the suspended copper, so that only the suspended copper is removed, and the copper surface is not bitten. In addition, the alkaline suspension copper removing liquid is used for replacing the acidic suspension copper removing liquid, so that the quality yield can be greatly improved, and the operation is simple and convenient.
Description
Technical Field
The invention relates to the technical field of printed circuit board production, in particular to an alkaline suspension copper removing liquid for a circuit board, a preparation method thereof and a suspension copper removing method.
Background
With the development of new micro-machining technologies such as microelectronics and micromachines, the blind hole technology of the printed circuit board mainly adopts laser drilling. The CO 2 laser drilling of blind holes is a main processing mode of blind holes in a rigid HDI plate, and the laser blind hole technology greatly improves the drilling speed and expands the application range of micropore processing. There are generally two common modes of LASER excitation. One is UV light, and the other is heat energy of sealing CO 2 gas by using infrared rays, when the temperature is increased or the energy is increased to a certain extent, if the melting point, the ignition point or the boiling point of organic matters are obtained, the interaction force or the binding force of organic matters molecules is greatly reduced to enable the organic matters molecules to be separated from each other into a free state or a free state, and the organic matters escape or are burnt with oxygen in air to become carbon dioxide or water gas to be dispersed due to the continuous energy supply of laser, so that micro holes are formed due to the fact that the laser is processed by infrared light beams with certain diameters.
The ultraviolet laser emits high-energy ultraviolet light beams, the optical energy (high-energy photons) of the ultraviolet light beams is utilized to break molecular bonds (such as covalent bonds) of organic matters, metal crystals (such as metal bonds) and the like, suspended particles or atomic groups, molecular groups or atoms and molecules are formed and are dissipated, and finally blind holes are formed. Because the absorption rate of the copper foil to CO 2 laser is low, in order to make the copper foil absorb enough energy to form holes, the surface of the copper foil needs to be treated, high energy is used for the first pulse, and the resin is cleaned by the low energy of the subsequent pulse, so that the high energy can generate larger suspended copper by utilizing the heat effect. The hole opening of the blind hole is too large in copper suspension, diamond-shaped hole filling holes are easy to form, the hole type of the laser blind hole needs to be strictly controlled in production, and particularly the hole opening copper suspension needs to be effectively controlled. Therefore, after laser drilling, in order to ensure the smooth proceeding of the subsequent process, the splash copper and the suspension copper generated by drilling are removed by the liquid medicine after laser drilling. And the copper-removing liquid medicine is required to remove splash copper and suspended copper of the orifice under the premise of tiny micro-etching amount or no micro-etching amount of surface copper as much as possible.
Disclosure of Invention
In order to solve the technical problems, the invention provides an alkaline copper removing solution for a circuit board, a preparation method thereof and a copper removing method. The prepared circuit board alkaline suspension copper removing liquid can rapidly remove splash copper of larger suspension copper at the edge of the blind hole orifice, and functional group factors of the circuit board alkaline suspension copper removing liquid are adsorbed around the suspension copper, so that only the suspension copper is removed, and the copper surface is not bitten. In the process of removing suspended copper, suspended copper can be dissolved to generate copper ions, and when the mass concentration of copper ions in the alkaline suspended copper removing liquid of the circuit board is less than or equal to 60g/L, the suspended copper removing liquid can still maintain good suspended copper removing stability. The alkaline suspension removal copper liquid replaces the acidic suspension removal copper liquid, the aperture of the orifice can be increased by 3-8%, the aperture of the orifice is consistent with the aperture of the drilling hole, the quality yield can be greatly improved, and the operation is simple and convenient.
The method specifically comprises the following technical scheme:
In a first aspect, an alkaline suspension copper removal solution for a circuit board is provided, which comprises the following components in mass concentration:
3-20g/L of ammonium chloride,
0.2-2G/L of ammonium bicarbonate,
5-15G/L of industrial ammonia water,
0.2-2G/L of wetting agent,
5-20G/L copper surface protective agent,
0.2-2G/L of copper-removing accelerator,
0.5-3G/L of catalyst;
the mass ratio of the copper surface protective agent to the suspension-removing copper accelerator is 1: (0.02-0.3);
the copper surface protective agent is at least one selected from dicyclohexylamine nitrite, cetylpyridinium chloride and diethylenetriamine pentamethylene phosphonic acid;
The suspension-removing copper accelerator is at least one selected from tetraethyl titanate, isopropyl zirconate, tetraisopropyl titanate and n-propyl zirconate.
Preferably, the ammonia in the industrial ammonia water accounts for 20% of the total weight of the ammonia water.
Further, the mass ratio of the ammonium chloride to the ammonium bicarbonate is 1: (0.02-0.1).
Further, the wetting agent is at least one selected from sodium polyacrylate, sodium methylene dinaphthyl sulfonate and sodium hexadecyl sulfonate.
Further, the catalyst is at least one selected from trioctyl methyl ammonium chloride, methyl trialkyl ammonium chloride and trilauryl ammonium chloride.
Further, the mass concentration of the ammonium chloride is 8-12g/L, the mass concentration of the ammonium bicarbonate is 0.8-1.2g/L, and the mass concentration of the industrial ammonia water is 8-12g/L.
Further, the alkaline suspension copper removing liquid for the circuit board comprises the following components in mass concentration:
8-12g/L of ammonium chloride,
0.8-1.2G/L of ammonium bicarbonate,
8-12G/L of industrial ammonia water,
0.5-1.4G/L of wetting agent,
8-18G/L copper surface protective agent,
0.5-1.5G/L of suspension copper accelerator,
Catalyst 0.8-2g/L.
Preferably, the alkaline suspension copper removing liquid for the circuit board further comprises deionized water.
In a second aspect, the preparation method of the alkaline suspension copper removing liquid for the circuit board is provided, and comprises the following steps: mixing and stirring ammonium chloride, ammonium bicarbonate, industrial ammonia water, a wetting agent, a copper surface protective agent, a suspension removal copper accelerator, a catalyst and deionized water for 20-60min to obtain the alkaline suspension removal copper liquid for the circuit board.
In a third aspect, a method for removing copper from alkaline suspension copper solution of a circuit board is provided, the alkaline suspension copper solution of the first aspect is configured into a tank solution with the mass concentration of 8-12% of the alkaline suspension copper solution of the circuit board, and the blind holes of the circuit board are subjected to copper removal in a gantry line inflation soaking mode or a horizontal line spraying mode under the conditions that the temperature of the tank solution is 20-40 ℃ and the pH value is 11.5-13.5, wherein the copper removal time is 1-3min.
Further, the inflating amount of the gantry line inflating and soaking mode is 1.1-1.4L/min.
Preferably, the spraying pressure of the horizontal line spraying mode is 1.5-2.5kg/cm 2.
Further, the aperture of the blind hole of the circuit board is 0.075-0.15mm.
The invention has the beneficial effects that:
(1) The active ingredients such as ammonium chloride, ammonium bicarbonate, industrial ammonia water, a wetting agent, a copper surface protective agent, a suspension removal copper accelerator, a catalyst and the like are added into the alkaline suspension removal copper liquid for the circuit board, and the active ingredients interact with each other, so that the practicability of the liquid medicine is improved. The active factors such as nitro, alkyl and the like in the copper surface protective agent can generate a layer of film on the surface copper, and the film can protect the surface copper, and the etching solution cannot permeate the protective film, so that the surface copper is not damaged. The functional group factors in the copper suspension can be closely absorbed around the copper suspension, attack the copper suspension, thoroughly remove the copper suspension through a certain time of biting, and improve the aperture size of the blind hole.
(2) The alkaline suspension copper removing liquid is used for replacing the acidic suspension copper removing liquid of a sulfuric acid and hydrogen peroxide system, the operation is simple and efficient, the stability of the suspension copper removing liquid is good, and the problem of hydrogen peroxide decomposition does not exist. The copper surface is not damaged completely, and meanwhile, only the suspended copper is etched, so that the copper surface is not damaged, the orifice quality is improved, and the quality yield can be improved greatly.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a circuit board effect diagram of embodiment 1 after the copper suspension removal process;
FIG. 2 is a graph showing the effect of the circuit board of comparative example 1 after the copper suspension removal process;
fig. 3 is a circuit board effect diagram of a blank example of the present invention after being treated by the method for removing suspended copper.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely, and it is apparent that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
In order to more fully understand the technical content of the present invention, the following description and description of the technical solution of the present invention will be further presented with reference to specific embodiments.
The ammonia in the industrial ammonia water in the invention accounts for 20 percent of the total weight of the ammonia water.
The preparation method of the alkaline suspension-free copper liquid for the circuit board comprises the following steps:
And (3) weighing and mixing ammonium chloride, ammonium bicarbonate, industrial ammonia water, a wetting agent, a copper surface protective agent, a suspension removal copper accelerator, a catalyst and deionized water according to a required proportion, and mixing and stirring for 20-60min to obtain the alkaline suspension removal copper liquid for the circuit board.
The method for removing the suspended copper of the alkaline suspended copper removing liquid of the circuit board comprises the following steps:
The method for removing the suspended copper of the alkaline suspended copper removing liquid of the circuit board comprises the following steps: s1, upper plate; s2, oil removal; s3, washing with water; s4, removing suspended copper; s5, washing with water; s6, drying; s7, lower plate.
The step of removing suspended copper is as follows: preparing the alkaline resuspension copper liquid of the circuit board into a bath liquid with the mass concentration of 8-12% of the alkaline resuspension copper liquid of the circuit board, and performing resuspension copper removal on the blind holes of the circuit board under the conditions that the temperature of the bath liquid is 20-40 ℃ and the pH value is 11.5-13.5 in a gantry line inflation soaking mode or a horizontal line spraying mode, wherein the time for removing the suspension copper is 1-3min.
Specifically, the inflating amount of the gantry line inflating and soaking mode is 1.1-1.4L/min.
Specifically, the spraying pressure of the horizontal line spraying mode is 1.5-2.5kg/cm 2.
Specifically, the aperture of the blind hole of the circuit board is 0.075-0.15mm.
And (3) verifying and testing the effect of the alkaline suspension-removing copper liquid of the circuit board:
1) Copper microetching Rate (μm/min): measuring the microetching rate of the copper surface of the circuit board treated by the copper removing method;
2) Color of the board: observing the color of the board surface of the circuit board treated by the method for removing the suspended copper, if the suspended copper residue of the orifice of the circuit board is less, the color of the board surface is good, otherwise, the color difference of the board surface is good;
3) Smell of liquid medicine: the alkaline copper-removing solution of the circuit board smells when the copper-removing solution is used for treating the blind hole copper-removing of the circuit board;
4) Whether the suspended copper is clean: observing whether residual suspended copper exists in the blind hole orifice of the circuit board treated by the copper removing method;
5) Pore size change size: slicing the circuit board processed by the copper-removing method. And (3) observing the copper suspension condition by using a microscope, measuring the pore size change of the blind holes of the circuit board before and after the copper suspension removal method is adopted, and calculating the qualified blind hole diameter of the circuit board after the copper suspension removal method is adopted, wherein the blind hole diameter of the circuit board is 3-8% larger than the blind hole diameter before the copper suspension removal method is adopted.
Example 1
The alkaline suspension-removing copper liquid for the circuit board comprises the following components in mass concentration: 10g/L of ammonium chloride, 1.0g/L of ammonium bicarbonate, 10g/L of industrial ammonia water, 1.0g/L of sodium polyacrylate, 10g/L of dicyclohexylamine nitrite, 0.8g/L of tetraethyl titanate, 1.2g/L of trioctylmethyl ammonium chloride and the balance of deionized water.
The preparation method of the alkaline suspension copper removing liquid for the circuit board of the embodiment 1 comprises the following steps: mixing and stirring ammonium chloride, ammonium bicarbonate, industrial ammonia water, a wetting agent, a copper surface protective agent, a suspension removal copper accelerator, a catalyst and deionized water for 40min to obtain the alkaline suspension removal copper solution for the circuit board of the example 1.
The circuit board alkaline suspension removal copper solution of example 1 was prepared into a bath solution with the mass concentration of 10% of the circuit board alkaline suspension removal copper solution, and the blind holes (the aperture of the blind holes is 0.075-0.15 mm) of the circuit board were subjected to copper suspension removal for 1.5min under the conditions that the temperature of the bath solution is 30 ℃ and the pH value is 11.5 by using a gantry line inflation soaking method with the aeration amount of 1.2L/min, so that the circuit board of example 1 was prepared.
Example 2
The alkaline suspension-removing copper liquid for the circuit board comprises the following components in mass concentration: 12g/L ammonium chloride, 1.1g/L ammonium bicarbonate, 8g/L industrial ammonia water, 1.2g/L sodium methylenedinaphthyl sulfonate, 9g/L dicyclohexylamine nitrite, 0.8g/L isopropyl zirconate, 1g/L methyltrialkyl ammonium chloride and the balance deionized water.
The circuit board alkaline suspension removal copper solution of example 2 was prepared into a bath solution with the mass concentration of 10% of the circuit board alkaline suspension removal copper solution, and the blind holes (the aperture of the blind holes is 0.125 mm) of the circuit board were subjected to copper suspension removal for 1.8min under the conditions that the temperature of the bath solution is 32 ℃ and the pH value is 12 by using a gantry line inflation soaking method with the aeration amount of 1.4L/min, so that the circuit board of example 2 was prepared.
Example 3
The alkaline suspension-removing copper liquid for the circuit board comprises the following components in mass concentration: 8g/L ammonium chloride, 0.8g/L ammonium bicarbonate, 10g/L industrial ammonia water, 1.4g/L sodium cetyl sulfonate, 11g/L cetylpyridinium chloride, 1.2g/L tetraisopropyl titanate, 0.8g/L trilauryl ammonium chloride and the balance deionized water.
The circuit board alkaline suspension removal copper solution of example 3 was prepared into a bath solution with the mass concentration of 10% of the circuit board alkaline suspension removal copper solution, and the blind holes (the aperture of the blind holes is 0.075 mm) of the circuit board were subjected to copper suspension removal for 2min under the conditions that the temperature of the bath solution is 28 ℃ and the pH value is 13 by using a gantry wire inflation soaking mode with the air inflation amount of 1.1L/min, so as to obtain the circuit board of example 3.
Example 4
The alkaline suspension-removing copper liquid for the circuit board comprises the following components in mass concentration: 10g/L ammonium chloride, 0.8g/L ammonium bicarbonate, 11g/L industrial ammonia water, 1.0g/L sodium cetyl sulfonate, 11g/L cetylpyridinium chloride, 1.0g/L n-propyl zirconate, 1.2g/L trilauryl ammonium chloride and the balance deionized water.
The circuit board alkaline suspension removal copper solution of example 4 was prepared into a bath solution with the mass concentration of 10% of the circuit board alkaline suspension removal copper solution, and the blind holes (the aperture of the blind holes is 0.075 mm) of the circuit board were subjected to copper suspension removal for 1.6min under the conditions that the temperature of the bath solution is 29 ℃ and the pH value is 12.5 by using a gantry wire inflation soaking method with the aeration amount of 1.2L/min, so that the circuit board of example 4 was prepared.
Example 5
The alkaline suspension-removing copper liquid for the circuit board comprises the following components in mass concentration: 12g/L ammonium chloride, 0.8g/L ammonium bicarbonate, 10g/L industrial ammonia water, 1.2g/L sodium methylenedinaphthyl sulfonate, 9g/L cetylpyridinium chloride, 0.8g/L isopropyl zirconate, 1.2g/L methyltrialkyl ammonium chloride and the balance deionized water.
The circuit board alkaline suspension removal copper solution of example 5 was prepared into a bath solution with the mass concentration of 10% of the circuit board alkaline suspension removal copper solution, and the blind holes (the aperture of the blind holes is 0.1 mm) of the circuit board were subjected to copper suspension removal for 1.4min under the conditions that the temperature of the bath solution is 33 ℃ and the pH value is 12.8 by using a gantry line inflation soaking method with the aeration amount of 1.3L/min, so that the circuit board of example 5 was prepared.
Example 6
The alkaline suspension-removing copper liquid for the circuit board comprises the following components in mass concentration: 10g/L ammonium chloride, 1.0g/L ammonium bicarbonate, 8g/L industrial ammonia water, 1.0g/L sodium methylenedinaphthyl sulfonate, 10g/L diethylenetriamine pentamethylenephosphonic acid, 0.8g/L tetraethyl titanate, 1.0g/L trioctyl methyl ammonium chloride and the balance deionized water.
The circuit board alkaline suspension removal copper solution of example 6 was prepared into a bath solution with the mass concentration of 10% of the circuit board alkaline suspension removal copper solution, and the blind holes (the aperture of the blind holes is 0.125 mm) of the circuit board were subjected to copper suspension removal for 1.2min under the conditions that the temperature of the bath solution is 30 ℃ and the pH value is 11.5 by using a gantry line inflation soaking method with the aeration amount of 1.2L/min, so that the circuit board of example 6 was prepared.
Example 7
The alkaline suspension-removing copper liquid for the circuit board comprises the following components in mass concentration: 10g/L of ammonium chloride, 0.8g/L of ammonium bicarbonate, 11g/L of industrial ammonia water, 1.0g/L of sodium methylenedinaphthyl sulfonate, 12g/L of cetylpyridinium chloride, 1.1g/L of tetraethyl titanate, 1.2g/L of trioctyl methyl ammonium chloride and the balance of deionized water.
The circuit board alkaline suspension removal copper solution of example 7 was prepared into a bath solution with the mass concentration of 10% of the circuit board alkaline suspension removal copper solution, and the blind holes (the aperture of the blind holes is 0.075 mm) of the circuit board were subjected to copper suspension removal for 1min under the conditions that the temperature of the bath solution is 25 ℃ and the pH value is 12.5 by using a gantry wire inflation soaking method with the aeration amount of 1.2L/min, so as to prepare the circuit board of example 7.
The preparation method of the alkaline resuspension copper solution for the circuit board of the embodiment 2-7 is the same as that of the embodiment 1, and the effect verification test is carried out on the alkaline resuspension copper solution for the circuit board of the embodiment 1-7, and the test results are shown in the table 1:
TABLE 1 Effect verification test results for examples 1-7
Fig. 1 is a circuit board effect diagram of the embodiment 1 of the present invention after the copper suspension removal process. From the test results shown in fig. 1 and table 1, the alkaline suspension-removing copper liquid for the circuit board provided by the invention has the advantages of simple proportioning, convenient operation, no toxicity or harm, no other side effects and low economic cost from the aspects of proportioning and application. The aperture of the blind hole after the alkaline copper removing solution removes copper from the circuit board is 3-8% larger than that of the blind hole before the copper removing solution removes copper, the effect of improving the quality yield of electroplating is very obvious, and the copper removing solution is quick and clean and does not damage the copper surface.
1. Based on the influence of different mass concentrations of ammonium chloride
Comparative examples 1 to 3 differ from example 1 in the mass concentration of ammonium chloride, and the other conditions are the same. Effect verification tests were performed on example 1 and comparative examples 1 to 3, respectively, and the test results are shown in table 2:
TABLE 2 Effect verification test results of example 1, comparative examples 1-3
Fig. 1 is a circuit board effect diagram of embodiment 1 after the copper suspension removal process; fig. 2 is a graph showing the effect of the circuit board treated by the method for removing suspended copper according to comparative example 1 of the present invention. As can be seen from the test results of fig. 1-2 and table 2, the above-mentioned alkaline copper removing solution for circuit board was not added with ammonium chloride (comparative example 1), and the effect was verified to be not ideal. The mass concentration of ammonium chloride is lower than 3g/L (comparative example 2) or higher than 20g/L (comparative example 3), and the effect verification test result is not ideal. Therefore, the mass concentration of ammonium chloride in the alkaline suspension copper removing liquid of the circuit board is preferably 3-20g/L.
2. Based on the influence of different mass concentrations of amine bicarbonate
Comparative examples 4 to 6 differ from example 1 in the mass concentration of the amine bicarbonate, and the other conditions are the same. Effect verification tests were performed on example 1 and comparative examples 4 to 6, respectively, and the test results are shown in table 3:
TABLE 3 Effect verification test results of example 1, comparative examples 4-6
As can be seen from the test results in Table 3, the alkaline suspension copper removing liquid for the circuit board is not added with ammonium bicarbonate (comparative example 4), and the effect verification test results are not ideal. The mass concentration of the ammonium bicarbonate was lower than 0.2g/L (comparative example 5) or higher than 2g/L (comparative example 6), and the results of the effect verification test were not ideal. Therefore, the mass concentration of the ammonium bicarbonate in the alkaline suspension copper removing liquid of the circuit board is preferably 0.2-2g/L.
3. Based on the influence of combinations of ammonium chloride and ammonium bicarbonate
Comparative example 1 differs from example 1 in that no ammonium chloride was contained, and the other conditions were the same. Comparative example 4 differs from example 1 in that no amine bicarbonate was contained, and the remaining conditions were the same. Comparative example 7 differs from example 1 in that it does not contain ammonium chloride and ammonium bicarbonate, and the remaining conditions are the same. Effect verification tests were performed on example 1, comparative example 4, and comparative example 7, respectively, and the test results are shown in table 4:
Table 4 effects of example 1, comparative example 4, comparative example 7 verify test results
As can be seen from the test results in Table 4, the results of the effect verification test were not ideal when no ammonium chloride (comparative example 1), no ammonium bicarbonate (comparative example 4) or ammonium chloride and ammonium bicarbonate (comparative example 7) were added to the alkaline de-suspension copper solution for circuit boards. Among them, the test results of the absence of the various components (comparative example 7) in ammonium chloride and ammonium bicarbonate were worse than the absence of the single component (comparative example 1, comparative example 4).
4. Based on the influence of different mass concentrations of wetting agent
Comparative examples 8 to 10 differ from example 1 in the mass concentration of the wetting agent, and the remaining conditions are the same. Effect verification tests were performed on example 1 and comparative examples 8 to 10, respectively, and the test results are shown in table 5:
TABLE 5 Effect verification test results for example 1, comparative examples 8-10
As can be seen from the test results in Table 5, the result of the effect verification test is not ideal because no wetting agent is added to the alkaline de-suspending copper liquid for circuit board (comparative example 8). The mass concentration of the wetting agent was less than 0.2g/L (comparative example 9) or more than 2g/L (comparative example 10), and the effect was confirmed to be undesirable. Therefore, the mass concentration of the wetting agent in the alkaline suspension-removing copper liquid of the circuit board is preferably 0.2-2g/L.
5. Influence of different mass concentrations based on copper surface protectants
Comparative examples 11 to 13 are different from example 1 in the mass concentration of the copper surface protecting agent, and the other conditions are the same. Effect verification tests were performed on example 1 and comparative examples 11 to 13, respectively, and the test results are shown in table 6:
TABLE 6 Effect verification test results of example 1, comparative examples 11-13
As can be seen from the test results in Table 6, the alkaline de-suspending copper liquid for the circuit board is not added with a copper surface protective agent (comparative example 11), and the effect verification test results are not ideal. The mass concentration of the copper surface protective agent is lower than 5g/L (comparative example 12) or higher than 20g/L (comparative example 13), and the effect verification test result is not ideal. Therefore, the mass concentration of the copper surface protective agent in the alkaline suspension copper removing liquid of the circuit board is preferably 5-20g/L.
6. Influence of different mass ratios based on de-suspended copper accelerator
Comparative examples 14 to 16 differ from example 1 in the mass concentration of the de-suspended copper accelerator, with the remaining conditions being the same. Effect verification tests were performed on example 1 and comparative examples 14 to 16, respectively, and the test results are shown in table 7:
TABLE 7 Effect verification test results of example 1, comparative examples 14-16
As can be seen from the test results in Table 7, the effect verification test results are not ideal because no copper removal accelerator (comparative example 14) is added to the alkaline copper removal solution for circuit boards. The mass concentration of the de-suspended copper accelerator was less than 0.2g/L (comparative example 15) or more than 2g/L (comparative example 16), and the effect verified that the test results were not ideal. Therefore, the mass concentration of the copper removal accelerator in the alkaline copper removal solution for circuit boards is preferably 0.2-2g/L.
7. Influence of different mass ratios based on copper surface protectant and de-suspended copper accelerator
Comparative examples 17 to 18 differ from example 1 in the mass ratio of the copper surface protectant and the de-suspended copper accelerator, all the other conditions being the same. Effect verification tests were performed on example 1 and comparative examples 17 to 18, respectively, and the test results are shown in table 8:
TABLE 8 Effect verification test results for example 1, comparative examples 17-18
As can be seen from the test results in table 8, the effect verification test results are not ideal when the mass ratio of the copper surface protectant to the copper surface accelerator in the alkaline copper removal solution for circuit boards is smaller (comparative example 17) or the mass ratio of the copper surface protectant to the copper surface accelerator in the alkaline copper removal solution for circuit boards is larger (comparative example 18). Therefore, the mass ratio of the copper surface protective agent to the suspension removal copper accelerator in the alkaline suspension removal copper liquid of the circuit board is preferably 1: (0.02-0.3).
8. Based on the influence of different mass concentrations of the catalyst
Comparative examples 19 to 21 differ from example 1 in the mass concentration of the catalyst, and the remaining conditions are the same. Effect verification tests were performed on example 1 and comparative examples 19 to 21, respectively, and the test results are shown in table 9:
TABLE 9 Effect verification test results for example 1, comparative examples 19-21
As can be seen from the test results in Table 9, the result of the effect verification test is not ideal because no catalyst is added to the alkaline de-suspending copper solution for circuit board (comparative example 19). The mass concentration of the catalyst was lower than 0.5g/L (comparative example 20) or higher than 3g/L (comparative example 21), and the effect verification test results were not ideal. Therefore, the mass concentration of the catalyst in the alkaline suspension copper removing liquid of the circuit board is preferably 0.5-3g/L.
9. Based on the influence of different mass ratios of ammonium chloride and ammonium bicarbonate
Comparative examples 22 to 23 differ from example 1 in the mass ratio of ammonium chloride and ammonium bicarbonate, with the remaining conditions being the same. Effect verification tests were performed on example 1 and comparative examples 22 to 23, respectively, and the test results are shown in table 10:
TABLE 10 Effect verification test results of example 1, comparative examples 22-23
As can be seen from the test results in Table 10, when the mass ratio of ammonium chloride to ammonium bicarbonate in the alkaline suspension copper solution of the circuit board is relatively small (comparative example 22) or the mass ratio of ammonium chloride to ammonium bicarbonate in the alkaline suspension copper solution of the circuit board is relatively large (comparative example 23), the effect verification test results are not ideal. Therefore, the mass ratio of the ammonium chloride to the ammonium bicarbonate in the alkaline suspension copper removing liquid of the circuit board is preferably 1: (0.02-0.1).
10. Influence of different mass concentrations on the basis of industrial ammonia
Comparative examples 24 to 26 were different from example 1 in the mass concentration of industrial aqueous ammonia, and the other conditions were the same. Effect verification tests were performed on example 1 and comparative examples 24 to 26, respectively, and the test results are shown in table 11:
TABLE 11 Effect verification test results for example 1, comparative examples 24-26
As can be seen from the test results in Table 11, the effect verification test results are not ideal without adding industrial ammonia (comparative example 24) to the alkaline de-suspending copper solution of the circuit board. The mass concentration of industrial ammonia water is lower than 5g/L (comparative example 25) or higher than 15g/L (comparative example 26), and the effect verification test result is not ideal. Therefore, the mass concentration of the industrial ammonia water in the alkaline suspension copper removing liquid of the circuit board is preferably 5-15g/L.
10. Influence of different mass concentrations of copper ions in the de-suspended copper liquid
Copper ions are generated by fully dissolving suspended copper in the process of removing suspended copper, and effect verification tests are respectively carried out on alkaline suspended copper removing solutions of the circuit board of the embodiment 1 with different copper ion mass concentrations, wherein the test results are shown in table 12:
Table 12 results of the Effect verification test of example 1 containing different copper ion mass concentrations
As shown in the test results of Table 12, when the mass concentration of copper ions in the alkaline suspension copper removing liquid of the circuit board is less than or equal to 60g/L, the alkaline suspension copper removing liquid of the circuit board can still maintain good suspension copper removing stability.
11. Comparison with blank examples
Blank example differs from example 1 in that the components in the alkaline de-suspending copper solution of the circuit board are only deionized water, and the rest conditions are the same.
Effect verification tests were performed on example 1 and blank examples, respectively, and the test results are shown in table 13:
Table 13 results of effect verification test of example 1, blank example
Fig. 1 is a circuit board effect diagram of the embodiment 1 of the present invention after the copper suspension removal method, and fig. 3 is a circuit board effect diagram of the blank embodiment of the present invention after the copper suspension removal method. As can be seen from the test results of fig. 1, 3 and table 13, if the blank example is used to replace the alkaline de-suspending copper liquid of the circuit board of the present invention, the effect verification test result is very poor.
12. Test results of alkaline suspension-free copper liquid of circuit board and acidic suspension-free copper liquid of sulfuric acid and hydrogen peroxide system are compared
The effect verification test was performed on the alkaline suspension copper removing liquid of the circuit board of example 1 and the commercially available acidic suspension copper removing liquid (sulfuric acid, hydrogen peroxide system), respectively, and the test results are shown in table 14:
TABLE 14 results of alkaline and acidic De-suspension copper solutions Effect verification test
As can be seen from the test results in Table 14, the alkaline resuspension copper solution for circuit board prepared in the embodiment of the invention has superior test results in terms of pore diameter variation compared with the acidic resuspension copper solution of sulfuric acid and hydrogen peroxide system. The alkaline suspension copper removal liquid for the circuit board prepared by the embodiment of the invention can increase the aperture of the orifice by 3-8%, so that the aperture of the orifice is consistent with the aperture of a drilling hole, and the quality yield can be greatly improved. In addition, compared with the acidic suspension copper removing liquid of a sulfuric acid and hydrogen peroxide system, the alkaline suspension copper removing liquid of the circuit board prepared by the embodiment of the invention has improved solution stability.
In conclusion, the alkaline suspension-free copper solution for the circuit board provided by the invention has the advantages of simple proportioning, convenience in operation, no toxicity or harm, no other side effects and low economic cost from the aspects of proportioning and application. The circuit board alkaline suspension removal copper liquid can rapidly remove splash copper of larger suspension copper at the edge of the blind hole orifice, the functional group of the suspension removal copper liquid is adsorbed around the suspension copper, only the suspension copper is removed, the copper surface is not snapped completely, and when copper ions in the circuit board alkaline suspension removal copper liquid are less than or equal to 60g/L, the circuit board alkaline suspension removal copper liquid can still maintain good suspension removal copper stability. The alkaline suspension removal copper liquid replaces the acidic suspension removal copper liquid, the aperture of the orifice can be increased by 3-8%, the aperture of the orifice is consistent with the aperture of the drilling hole, the quality yield can be greatly improved, and the operation is simple and convenient.
While the invention has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the invention. Therefore, the protection scope of the invention is subject to the protection scope of the claims.
Claims (8)
1. The alkaline suspension-removing copper liquid for the circuit board is characterized by comprising the following components in mass concentration:
3-20g/L of ammonium chloride,
0.2-2G/L of ammonium bicarbonate,
5-15G/L of industrial ammonia water,
0.2-2G/L of wetting agent,
5-20G/L copper surface protective agent,
0.2-2G/L of copper-removing accelerator,
0.5-3G/L of catalyst;
the mass ratio of the copper surface protective agent to the suspension-removing copper accelerator is 1: (0.02-0.3);
the copper surface protective agent is at least one selected from dicyclohexylamine nitrite, cetylpyridinium chloride and diethylenetriamine pentamethylene phosphonic acid;
The suspension removing copper accelerator is at least one selected from tetraethyl titanate, isopropyl zirconate, tetraisopropyl titanate and n-propyl zirconate;
The wetting agent is at least one selected from sodium polyacrylate, sodium methylene dinaphthyl sulfonate and sodium hexadecyl sulfonate;
The catalyst is at least one selected from trioctyl methyl ammonium chloride, methyl trialkyl ammonium chloride and trilauryl ammonium chloride.
2. The alkaline suspension-removing copper liquid for circuit boards according to claim 1, wherein the mass ratio of the ammonium chloride to the ammonium bicarbonate is 1: (0.02-0.1).
3. The alkaline de-suspending copper solution for a circuit board according to claim 1, wherein the mass concentration of the ammonium chloride is 8-12g/L, the mass concentration of the ammonium bicarbonate is 0.8-1.2g/L, and the mass concentration of the industrial ammonia water is 8-12g/L.
4. The alkaline suspension-free copper solution for the circuit board as claimed in claim 3, comprising the following components in mass concentration:
8-12g/L of ammonium chloride,
0.8-1.2G/L of ammonium bicarbonate,
8-12G/L of industrial ammonia water,
0.5-1.4G/L of wetting agent,
8-18G/L copper surface protective agent,
0.5-1.5G/L of suspension copper accelerator,
Catalyst 0.8-2g/L.
5. The method for preparing the alkaline de-suspending copper liquid for the circuit board according to any one of claims 1 to 4, comprising the following steps: mixing and stirring ammonium chloride, ammonium bicarbonate, industrial ammonia water, a wetting agent, a copper surface protective agent, a suspension removal copper accelerator, a catalyst and deionized water for 20-60min to obtain the alkaline suspension removal copper liquid for the circuit board.
6. The method for removing copper from the alkaline suspension copper removing liquid of the circuit board is characterized in that the alkaline suspension copper removing liquid of the circuit board is prepared into a bath liquid with the mass concentration of 8-12% of the alkaline suspension copper removing liquid of the circuit board, and the blind holes of the circuit board are subjected to copper removal in a gantry line inflation soaking mode or a horizontal line spraying mode under the conditions that the temperature of the bath liquid is 20-40 ℃ and the pH value is 11.5-13.5, wherein the copper removal time is 1-3min.
7. The method for removing copper from alkaline copper removing liquid of circuit board according to claim 6, wherein the inflating and soaking method of the gantry wire is 1.1-1.4L/min.
8. The method for removing copper from alkaline suspension copper liquid of circuit board according to claim 7, wherein the aperture of blind holes of the circuit board is 0.075-0.15mm.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105555062A (en) * | 2015-12-30 | 2016-05-04 | 广东工业大学 | Method for removing suspension copper in blind hole of circuit board |
| CN108624884A (en) * | 2017-03-17 | 2018-10-09 | 昆山市板明电子科技有限公司 | The PCB surface conditioning agents and surface treatment method for removing brown layer and the outstanding copper of blind hole |
| CN117070948A (en) * | 2023-10-16 | 2023-11-17 | 珠海市板明科技有限公司 | Circuit board suspension removing copper solution and circuit board suspension removing copper method |
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| JP5323677B2 (en) * | 2007-03-02 | 2013-10-23 | 古河電気工業株式会社 | Method and apparatus for producing surface roughened copper plate, and surface roughened copper plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555062A (en) * | 2015-12-30 | 2016-05-04 | 广东工业大学 | Method for removing suspension copper in blind hole of circuit board |
| CN108624884A (en) * | 2017-03-17 | 2018-10-09 | 昆山市板明电子科技有限公司 | The PCB surface conditioning agents and surface treatment method for removing brown layer and the outstanding copper of blind hole |
| CN117070948A (en) * | 2023-10-16 | 2023-11-17 | 珠海市板明科技有限公司 | Circuit board suspension removing copper solution and circuit board suspension removing copper method |
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