CN110923797A - Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning - Google Patents

Abstract

The invention discloses a process for improving the uniformity of DPC electroplating filling hole by electrolytic cleaning, which comprises placing the developed ceramic substrate into acidic electrolytic degreasing liquid heated to 40-60 deg.C, electrolytic cleaning for 3-5min with the ceramic substrate as cathode and stainless steel plate as anode, and current density of 5-10A/m²And then quickly taking out the product to be washed clean by water, then entering a pre-dipping cylinder, and finally directly electroplating. The electrolytic degreasing liquid in the invention is acidic, can not attack and destroy dry films, and is suitable for cleaning fine circuitsAnd (4) a hole.

Description

Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning

Technical Field

The invention relates to the technology of the field of ceramic substrate manufacturing, in particular to a process for improving the uniformity of DPC electroplating hole filling by utilizing electrolytic cleaning and cleaning.

Background

The DPC is also called as a direct copper-plated substrate, the ceramic substrate is drilled, scribed and the like by laser, the ceramic substrate is plated with copper by a vacuum coating mode after being cleaned, then the circuit manufacturing is finished by yellow lithography or laser development, the thickness of the circuit is increased by an electroplating/chemical plating deposition mode, and finally the manufacturing of a metallized circuit is finished. Compared with the traditional LTCC, HTCC, DBC and other thick film processes, the DPC has the advantages of higher heat conductivity, no deformation of materials, stable process, controllable thickness of a metal layer and high line resolution.

In the manufacturing process of the DPC, oxidation layers and oil stains which are not cleaned completely after development exist in small holes of the ceramic substrate, and the substances cannot be deeply cleaned only by using a pure oil removing cleaning solution, so that when a subsequent electroplating hole filling process is carried out, the inner holes are not plated locally, and the phenomenon of uneven electroplating is caused. Therefore, there is a need to develop a solution to the above problems.

Disclosure of Invention

In view of the above, the present invention is directed to the defects of the prior art, and the main objective of the present invention is to provide a process for improving the uniformity of DPC electroplating via filling by electrolytic cleaning and cleaning, which can effectively solve the problem of uniform copper plating caused by the incomplete cleaning of inner holes in the existing DPC manufacturing process.

In order to achieve the purpose, the invention adopts the following technical scheme:

a process for improving the uniformity of filling holes in DPC electroplating by electrolytic cleaning includes such steps as putting the developed ceramic substrate in the acidic electrolytic deoiling liquid heated to 40-60 deg.C, electrolytic cleaning by using ceramic substrate as cathode and stainless steel plate as anode for 3-5min at current density of 5-10A/m²And then quickly taking out the product to be washed clean by water, then entering a pre-dipping cylinder, and finally directly electroplating.

As a preferable scheme, the acidic electrolysis deoiling liquid comprises the following components in percentage by mass: 3 to 35 percent of citric acid, 5 to 30 percent of sodium citrate, 1 to 5 percent of composite surfactant, 0.5 to 10 percent of sodium gluconate and the balance of deionized water.

As a preferred scheme, the method specifically comprises the following steps:

(1) preparing an acidic electrolytic degreasing liquid:

(1.1) adding 200L of deionized water into an electrolytic cleaning cylinder with the volume of 800L, and heating to 40 ℃;

(1.2) adding 15% of citric acid, stirring and dissolving;

(1.3) adding 20 percent of sodium citrate, stirring and dissolving;

(1.4) adding 1.5 percent of composite surfactant, stirring and dissolving;

(1.5) adding 2.5 percent of sodium gluconate, stirring and dissolving;

(1.6) continuously adding deionized water to reach the liquid level of 800L, and heating to 60 ℃;

(2) calculating the current according to the area of copper by using a hanger on the developed ceramic substrate;

(3) the hanger is sent into an electrolytic cleaning cylinder, a power supply is turned on, cathode electrolytic cleaning is firstly carried out for 4 minutes, and anode electrolytic cleaning is switched to 2 minutes;

(4) lifting the cleaned ceramic substrate out of the electrolytic cleaning cylinder, and then putting the ceramic substrate into two overflow water cylinders to be cleaned for 2 minutes respectively;

(5) and after cleaning, hoisting the ceramic substrate into an acidic pre-immersion cylinder, and finally, putting the ceramic substrate into an electroplating cylinder for electroplating.

Compared with the prior art, the invention has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:

the electrolytic degreasing liquid in the invention is acidic, can not attack and destroy a dry film, and is suitable for cleaning a fine circuit.

Detailed Description

The invention discloses a process for improving the uniformity of DPC electroplating hole filling by electrolytic cleaning, which comprises placing the developed ceramic substrate into acidic electrolytic degreasing liquid heated to 40-60 deg.C, electrolytic cleaning for 3-5min with the ceramic substrate as cathode and stainless steel plate as anode, and current density of 5-10A/m²And then quickly taking out the product to be washed clean by water, then entering a pre-dipping cylinder, and finally directly electroplating. The acidic electrolytic degreasing fluid comprises the following components in percentage by mass: 3 to 35 percent of citric acid, 5 to 30 percent of sodium citrate, 1 to 5 percent of composite surfactant, 0.5 to 10 percent of sodium gluconate and the balance of deionized water.

The method specifically comprises the following steps:

(1) preparing an acidic electrolytic degreasing liquid:

(1.1) adding 200L of deionized water into an electrolytic cleaning cylinder with the volume of 800L, and heating to 40 ℃;

(1.2) adding 15% of citric acid, stirring and dissolving;

(1.3) adding 20 percent of sodium citrate, stirring and dissolving;

(1.4) adding 1.5 percent of composite surfactant, stirring and dissolving;

(1.5) adding 2.5 percent of sodium gluconate, stirring and dissolving;

(1.6) adding deionized water continuously until the liquid level reaches 800L, and heating to 60 ℃.

(2) And calculating the current according to the area of copper by using the developed ceramic substrate on a hanger.

(3) And (3) conveying the hanger into an electrolytic cleaning cylinder, starting a power supply, firstly carrying out cathodic electrolytic cleaning for 4 minutes, and turning to anodic electrolytic cleaning for 2 minutes.

(4) And (4) lifting the cleaned ceramic substrate out of the electrolytic cleaning cylinder, and then putting the ceramic substrate into two overflow water cylinders to be cleaned for 2 minutes respectively.

(5) And after cleaning, hoisting the ceramic substrate into an acidic pre-immersion cylinder, and finally, putting the ceramic substrate into an electroplating cylinder for electroplating.

The electrolytic degreasing liquid in the invention is acidic, can not attack and destroy a dry film, and is suitable for cleaning a fine circuit.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.

Claims (3)

1. A process for improving the pore-filling uniformity of DPC electroplating by utilizing electrolytic cleaning and cleaning is characterized in that: putting the developed ceramic substrate into acidic electrolytic degreasing liquid heated to 40-60 ℃ for electrolytic cleaning, and carrying out electrolytic cleaning for 3-5min by taking the ceramic substrate as a cathode and a stainless steel plate as an anode, wherein the current density is 5-10A/m²And then quickly taking out the product to be washed clean by water, then entering a pre-dipping cylinder, and finally directly electroplating.

2. The process for improving DPC electroplating via filling uniformity using electrolytic cleaning, cleaning according to claim 1, wherein: the acidic electrolytic degreasing fluid comprises the following components in percentage by mass: 3 to 35 percent of citric acid, 5 to 30 percent of sodium citrate, 1 to 5 percent of composite surfactant, 0.5 to 10 percent of sodium gluconate and the balance of deionized water.

3. The process for improving DPC electroplating via filling uniformity using electrolytic cleaning, cleaning according to claim 2, wherein: the method specifically comprises the following steps:

(1) preparing an acidic electrolytic degreasing liquid:

(1.1) adding 200L of deionized water into an electrolytic cleaning cylinder with the volume of 800L, and heating to 40 ℃;

(1.2) adding 15% of citric acid, stirring and dissolving;

(1.3) adding 20 percent of sodium citrate, stirring and dissolving;

(1.4) adding 1.5 percent of composite surfactant, stirring and dissolving;

(1.5) adding 2.5 percent of sodium gluconate, stirring and dissolving;

(1.6) continuously adding deionized water to reach the liquid level of 800L, and heating to 60 ℃;

(2) calculating the current according to the area of copper by using a hanger on the developed ceramic substrate;

(3) the hanger is sent into an electrolytic cleaning cylinder, a power supply is turned on, cathode electrolytic cleaning is firstly carried out for 4 minutes, and anode electrolytic cleaning is switched to 2 minutes;

(4) lifting the cleaned ceramic substrate out of the electrolytic cleaning cylinder, and then putting the ceramic substrate into two overflow water cylinders to be cleaned for 2 minutes respectively;

(5) and after cleaning, hoisting the ceramic substrate into an acidic pre-immersion cylinder, and finally, putting the ceramic substrate into an electroplating cylinder for electroplating.