CN110923797A - Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning - Google Patents

Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning Download PDF

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Publication number
CN110923797A
CN110923797A CN201911087693.1A CN201911087693A CN110923797A CN 110923797 A CN110923797 A CN 110923797A CN 201911087693 A CN201911087693 A CN 201911087693A CN 110923797 A CN110923797 A CN 110923797A
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CN
China
Prior art keywords
cleaning
electrolytic
ceramic substrate
electroplating
percent
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911087693.1A
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Chinese (zh)
Inventor
郑中山
李胜武
何浩波
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Xi'an Boxin Chuangda Electronic Technology Co., Ltd
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Dongguan National China New Mstar Technology Ltd
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Publication date
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Priority to CN201911087693.1A priority Critical patent/CN110923797A/en
Publication of CN110923797A publication Critical patent/CN110923797A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F1/00Electrolytic cleaning, degreasing, pickling or descaling
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces

Abstract

The invention discloses a process for improving the uniformity of DPC electroplating filling hole by electrolytic cleaning, which comprises placing the developed ceramic substrate into acidic electrolytic degreasing liquid heated to 40-60 deg.C, electrolytic cleaning for 3-5min with the ceramic substrate as cathode and stainless steel plate as anode, and current density of 5-10A/m2And then quickly taking out the product to be washed clean by water, then entering a pre-dipping cylinder, and finally directly electroplating. The electrolytic degreasing liquid in the invention is acidic, can not attack and destroy dry films, and is suitable for cleaning fine circuitsAnd (4) a hole.

Description

Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning
Technical Field
The invention relates to the technology of the field of ceramic substrate manufacturing, in particular to a process for improving the uniformity of DPC electroplating hole filling by utilizing electrolytic cleaning and cleaning.
Background
The DPC is also called as a direct copper-plated substrate, the ceramic substrate is drilled, scribed and the like by laser, the ceramic substrate is plated with copper by a vacuum coating mode after being cleaned, then the circuit manufacturing is finished by yellow lithography or laser development, the thickness of the circuit is increased by an electroplating/chemical plating deposition mode, and finally the manufacturing of a metallized circuit is finished. Compared with the traditional LTCC, HTCC, DBC and other thick film processes, the DPC has the advantages of higher heat conductivity, no deformation of materials, stable process, controllable thickness of a metal layer and high line resolution.
In the manufacturing process of the DPC, oxidation layers and oil stains which are not cleaned completely after development exist in small holes of the ceramic substrate, and the substances cannot be deeply cleaned only by using a pure oil removing cleaning solution, so that when a subsequent electroplating hole filling process is carried out, the inner holes are not plated locally, and the phenomenon of uneven electroplating is caused. Therefore, there is a need to develop a solution to the above problems.
Disclosure of Invention
In view of the above, the present invention is directed to the defects of the prior art, and the main objective of the present invention is to provide a process for improving the uniformity of DPC electroplating via filling by electrolytic cleaning and cleaning, which can effectively solve the problem of uniform copper plating caused by the incomplete cleaning of inner holes in the existing DPC manufacturing process.
In order to achieve the purpose, the invention adopts the following technical scheme:
a process for improving the uniformity of filling holes in DPC electroplating by electrolytic cleaning includes such steps as putting the developed ceramic substrate in the acidic electrolytic deoiling liquid heated to 40-60 deg.C, electrolytic cleaning by using ceramic substrate as cathode and stainless steel plate as anode for 3-5min at current density of 5-10A/m2And then quickly taking out the product to be washed clean by water, then entering a pre-dipping cylinder, and finally directly electroplating.
As a preferable scheme, the acidic electrolysis deoiling liquid comprises the following components in percentage by mass: 3 to 35 percent of citric acid, 5 to 30 percent of sodium citrate, 1 to 5 percent of composite surfactant, 0.5 to 10 percent of sodium gluconate and the balance of deionized water.
As a preferred scheme, the method specifically comprises the following steps:
(1) preparing an acidic electrolytic degreasing liquid:
(1.1) adding 200L of deionized water into an electrolytic cleaning cylinder with the volume of 800L, and heating to 40 ℃;
(1.2) adding 15% of citric acid, stirring and dissolving;
(1.3) adding 20 percent of sodium citrate, stirring and dissolving;
(1.4) adding 1.5 percent of composite surfactant, stirring and dissolving;
(1.5) adding 2.5 percent of sodium gluconate, stirring and dissolving;
(1.6) continuously adding deionized water to reach the liquid level of 800L, and heating to 60 ℃;
(2) calculating the current according to the area of copper by using a hanger on the developed ceramic substrate;
(3) the hanger is sent into an electrolytic cleaning cylinder, a power supply is turned on, cathode electrolytic cleaning is firstly carried out for 4 minutes, and anode electrolytic cleaning is switched to 2 minutes;
(4) lifting the cleaned ceramic substrate out of the electrolytic cleaning cylinder, and then putting the ceramic substrate into two overflow water cylinders to be cleaned for 2 minutes respectively;
(5) and after cleaning, hoisting the ceramic substrate into an acidic pre-immersion cylinder, and finally, putting the ceramic substrate into an electroplating cylinder for electroplating.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:
the electrolytic degreasing liquid in the invention is acidic, can not attack and destroy a dry film, and is suitable for cleaning a fine circuit.
Detailed Description
The invention discloses a process for improving the uniformity of DPC electroplating hole filling by electrolytic cleaning, which comprises placing the developed ceramic substrate into acidic electrolytic degreasing liquid heated to 40-60 deg.C, electrolytic cleaning for 3-5min with the ceramic substrate as cathode and stainless steel plate as anode, and current density of 5-10A/m2And then quickly taking out the product to be washed clean by water, then entering a pre-dipping cylinder, and finally directly electroplating. The acidic electrolytic degreasing fluid comprises the following components in percentage by mass: 3 to 35 percent of citric acid, 5 to 30 percent of sodium citrate, 1 to 5 percent of composite surfactant, 0.5 to 10 percent of sodium gluconate and the balance of deionized water.
The method specifically comprises the following steps:
(1) preparing an acidic electrolytic degreasing liquid:
(1.1) adding 200L of deionized water into an electrolytic cleaning cylinder with the volume of 800L, and heating to 40 ℃;
(1.2) adding 15% of citric acid, stirring and dissolving;
(1.3) adding 20 percent of sodium citrate, stirring and dissolving;
(1.4) adding 1.5 percent of composite surfactant, stirring and dissolving;
(1.5) adding 2.5 percent of sodium gluconate, stirring and dissolving;
(1.6) adding deionized water continuously until the liquid level reaches 800L, and heating to 60 ℃.
(2) And calculating the current according to the area of copper by using the developed ceramic substrate on a hanger.
(3) And (3) conveying the hanger into an electrolytic cleaning cylinder, starting a power supply, firstly carrying out cathodic electrolytic cleaning for 4 minutes, and turning to anodic electrolytic cleaning for 2 minutes.
(4) And (4) lifting the cleaned ceramic substrate out of the electrolytic cleaning cylinder, and then putting the ceramic substrate into two overflow water cylinders to be cleaned for 2 minutes respectively.
(5) And after cleaning, hoisting the ceramic substrate into an acidic pre-immersion cylinder, and finally, putting the ceramic substrate into an electroplating cylinder for electroplating.
The electrolytic degreasing liquid in the invention is acidic, can not attack and destroy a dry film, and is suitable for cleaning a fine circuit.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.

Claims (3)

1. A process for improving the pore-filling uniformity of DPC electroplating by utilizing electrolytic cleaning and cleaning is characterized in that: putting the developed ceramic substrate into acidic electrolytic degreasing liquid heated to 40-60 ℃ for electrolytic cleaning, and carrying out electrolytic cleaning for 3-5min by taking the ceramic substrate as a cathode and a stainless steel plate as an anode, wherein the current density is 5-10A/m2And then quickly taking out the product to be washed clean by water, then entering a pre-dipping cylinder, and finally directly electroplating.
2. The process for improving DPC electroplating via filling uniformity using electrolytic cleaning, cleaning according to claim 1, wherein: the acidic electrolytic degreasing fluid comprises the following components in percentage by mass: 3 to 35 percent of citric acid, 5 to 30 percent of sodium citrate, 1 to 5 percent of composite surfactant, 0.5 to 10 percent of sodium gluconate and the balance of deionized water.
3. The process for improving DPC electroplating via filling uniformity using electrolytic cleaning, cleaning according to claim 2, wherein: the method specifically comprises the following steps:
(1) preparing an acidic electrolytic degreasing liquid:
(1.1) adding 200L of deionized water into an electrolytic cleaning cylinder with the volume of 800L, and heating to 40 ℃;
(1.2) adding 15% of citric acid, stirring and dissolving;
(1.3) adding 20 percent of sodium citrate, stirring and dissolving;
(1.4) adding 1.5 percent of composite surfactant, stirring and dissolving;
(1.5) adding 2.5 percent of sodium gluconate, stirring and dissolving;
(1.6) continuously adding deionized water to reach the liquid level of 800L, and heating to 60 ℃;
(2) calculating the current according to the area of copper by using a hanger on the developed ceramic substrate;
(3) the hanger is sent into an electrolytic cleaning cylinder, a power supply is turned on, cathode electrolytic cleaning is firstly carried out for 4 minutes, and anode electrolytic cleaning is switched to 2 minutes;
(4) lifting the cleaned ceramic substrate out of the electrolytic cleaning cylinder, and then putting the ceramic substrate into two overflow water cylinders to be cleaned for 2 minutes respectively;
(5) and after cleaning, hoisting the ceramic substrate into an acidic pre-immersion cylinder, and finally, putting the ceramic substrate into an electroplating cylinder for electroplating.
CN201911087693.1A 2019-11-08 2019-11-08 Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning Pending CN110923797A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911087693.1A CN110923797A (en) 2019-11-08 2019-11-08 Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning

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Application Number Priority Date Filing Date Title
CN201911087693.1A CN110923797A (en) 2019-11-08 2019-11-08 Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning

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CN110923797A true CN110923797A (en) 2020-03-27

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CN105483812A (en) * 2015-12-24 2016-04-13 中色奥博特铜铝业有限公司 Degreasing method adopted in rolled copper foil surface treatment process
CN106559962A (en) * 2016-10-27 2017-04-05 傅本友 A kind of reduction or the method for removing the outstanding copper in aperture
CN107236977A (en) * 2017-06-29 2017-10-10 十堰市协兴工贸有限公司 A kind of electroplating pretreatment process optimization method
CN108109986A (en) * 2017-07-13 2018-06-01 东莞市国瓷新材料科技有限公司 A kind of power semiconductor integrated form encapsulation ceramic module and preparation method thereof
CN108200716A (en) * 2018-01-16 2018-06-22 中山市佳信电路板有限公司 A kind of ceramic PCB manufacturing process based on graphene material
CN109440177A (en) * 2019-01-09 2019-03-08 湖州师范学院 A kind of environment-friendly type electrolysis without EDTA is except film and preparation method thereof
CN109587959A (en) * 2019-01-29 2019-04-05 刘夏冰 A kind of pcb board automatic production method
CN112708892A (en) * 2020-12-18 2021-04-27 深圳市山水乐环保科技有限公司 Oil removing method for metal piece

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2639962A1 (en) * 1988-12-07 1990-06-08 Chemcut Corp METHOD AND APPARATUS FOR ELECTROLYTICALLY REMOVING PROTECTIVE LAYERS FROM A SHEET METAL SUBSTRATE APPLICABLE IN PARTICULAR TO PRINTED CIRCUITS
CN1075177A (en) * 1992-02-01 1993-08-11 周继瑞 Rust removing and contaminant releasing technology for metal surface by electrochemical process
US5814204A (en) * 1996-10-11 1998-09-29 Corpex Technologies, Inc. Electrolytic decontamination processes
TWI224531B (en) * 2001-09-11 2004-12-01 Ebara Corp Substrate processing apparatus and method
US20030087524A1 (en) * 2001-11-02 2003-05-08 Nec Corporation Cleaning method, method for fabricating semiconductor device and cleaning solution
US20060079084A1 (en) * 2002-01-10 2006-04-13 Semitool, Inc. Method for applying metal features onto metallized layers using electrochemical deposition and electrolytic treatment
JP2003231991A (en) * 2002-02-07 2003-08-19 Taiyo Techno Service:Kk Pretreatment liquid for electrolytic plating, plating method, and method for manufacturing printed wiring board
US20040219298A1 (en) * 2003-02-27 2004-11-04 Akira Fukunaga Substrate processing method and substrate processing apparatus
US20070123052A1 (en) * 2003-07-31 2007-05-31 Ismail Kashkoush Process sequence for photoresist stripping and cleaning of photomasks for integrated circuit manufacturing
JP2007023241A (en) * 2005-07-21 2007-02-01 Energy Support Corp Cleaning liquid, method and apparatus for producing the same and cleaning method
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CN103014825A (en) * 2012-12-11 2013-04-03 傅本友 Method for reducing or removing suspended copper at orifices
CN104073845A (en) * 2014-06-11 2014-10-01 安徽长青电子机械(集团)有限公司 Gold plating method for PCB
CN104695003A (en) * 2015-02-10 2015-06-10 海门市明阳实业有限公司 Rapid metal descaling and cleaning method and cleaning agent for rapidly descaling for metals
CN105483812A (en) * 2015-12-24 2016-04-13 中色奥博特铜铝业有限公司 Degreasing method adopted in rolled copper foil surface treatment process
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CN108200716A (en) * 2018-01-16 2018-06-22 中山市佳信电路板有限公司 A kind of ceramic PCB manufacturing process based on graphene material
CN109440177A (en) * 2019-01-09 2019-03-08 湖州师范学院 A kind of environment-friendly type electrolysis without EDTA is except film and preparation method thereof
CN109587959A (en) * 2019-01-29 2019-04-05 刘夏冰 A kind of pcb board automatic production method
CN112708892A (en) * 2020-12-18 2021-04-27 深圳市山水乐环保科技有限公司 Oil removing method for metal piece

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Effective date of registration: 20200918

Address after: 710000 unit 1707, building 1, Wanke hi tech living Plaza, No.56 Xifeng Road, Yanta District, Xi'an, Shaanxi Province

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Applicant before: DONGGUAN GUOCI NEW MATERIAL TECHNOLOGY Co.,Ltd.