CN106132099A - A kind of etch process of high-order high-density fine-line - Google Patents
A kind of etch process of high-order high-density fine-line Download PDFInfo
- Publication number
- CN106132099A CN106132099A CN201610524337.1A CN201610524337A CN106132099A CN 106132099 A CN106132099 A CN 106132099A CN 201610524337 A CN201610524337 A CN 201610524337A CN 106132099 A CN106132099 A CN 106132099A
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- CN
- China
- Prior art keywords
- printed board
- station
- etching
- cooling water
- cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
Abstract
The invention discloses the etch process of a kind of high-order high-density fine-line, it comprises the following steps: S1, open cylinder dosing station；S2, start inspection guarantee that absorbent cotton wheel keeps cleaning, and in semi-moist state, and without breakage；Plate grinder is required to start by S3, start in strict accordance with operation, and controlling transmission speed scope is 2 ~ 4m/min；S4, the fine etching of printed board, its concrete operation step is as follows: S(41), offer heat radiation die cavity in printed board；S(42), printing board surface washing station；S(43), printed board patch dry film station, copper-surfaced paper tinsel on printing board surface, need the part windowed of etching not cover copper foil layer, remaining is for being completely covered；Post and outside the printed board of copper foil layer, carry out Double-face adhesive multilamellar dry film again；S(44) erosion station, is stung；S(45), wash station；S(46), ink retreating station.The invention has the beneficial effects as follows: technique is simple, improve product quality, can make high density fine-line.
Description
Technical field
The present invention relates to the technical field of the etching of high-order high-density circuit board, particularly a kind of high-order high-density fine lines
The etch process on road.
Background technology
Etching is the necessary operation during printed wiring board produces, but is as its degree that becomes more meticulous and improves, traditional etching
Technique has begun to realize, and especially lateral erosion problem is increasingly severe.Electronics industry is corroded Copper Foil bearing printed circuit
During plate through frequently with method be ferric chloride chemical corrosion method, it has a disadvantage in that and may not apply to anti-plating method new technology
；Ferric chloride consumption is big；Etchant solution capacity is little；Labor condition difference etc..Process used solution process more complicated, reclaim
Copper and regeneration ferric chloride are required for more complicated equipment and bigger investment.Printed circuit board is released when with acid solution etching Copper Foil
The heat of amplification quantity, heat is collected on the surface of printed board, causes printed board to deform, the circuit obtained after ultimately resulting in etching
Low precision, product does not reaches requirement.There is bigger defect in the most existing etching, does not promote employing.
Summary of the invention
It is an object of the invention to overcome the shortcoming of prior art, it is provided that a kind of technique is simple, improve product quality, can
Make the etch process of the high-order high-density fine-line of high density fine-line.
The purpose of the present invention is achieved through the following technical solutions: the etch process of a kind of high-order high-density fine-line,
It comprises the following steps:
S1, open cylinder dosing station, first inboard wall of cylinder block is rinsed, eliminating impurities is clean, in ink retreating cylinder, add water to moving back
The 1/3 of ink cylinder volume, then in ink retreating cylinder, add NaOH solution, then in ink retreating cylinder, add clear water to cylinder body requirement liquid level,
Making solution concentration in cylinder body is 3 ~ 8%；Etching solution is added in etching groove；
S2, start inspection guarantee that absorbent cotton wheel keeps cleaning, and in semi-moist state, and without breakage；
Plate grinder is required to start by S3, start in strict accordance with operation, and controlling transmission speed scope is 2 ~ 4m/min；
S4, the fine etching of printed board, its concrete operation step is as follows:
S(41), offer heat radiation die cavity in printed board, the substrate of printed board is offered the heat radiation die cavity of the shape that takes the shape of the letter U, at heat radiating type
Import department's connection cooling water in chamber flows into flexible pipe, and the exit connection at heat radiation die cavity simultaneously cooling water flow out of flexible pipe；
S(42), printing board surface washing station, printed board is put in acid deoiling liquid immersion 2min ~ 6min, to remove plate
Oils and fats on face pollutes and oxide layer, it is ensured that plate face is cleaned, and dries the moisture on surface；
S(43), printed board patch dry film station, copper-surfaced paper tinsel on printing board surface, need the part windowed of etching not cover Copper Foil
Layer, remaining is for being completely covered；Post and outside the printed board of copper foil layer, carry out Double-face adhesive multilamellar dry film again；
S(44), erosion station is stung, in the etching solution in etching groove printed board being positioned in step S1；Control temperature in etching groove
Degree is 45 ~ 53 DEG C, and nozzle exit pressure is 2.0 ~ 3.5 kg/cm2, vibrate 3min ~ 5min gently；Flow into soft to cooling water simultaneously
Being passed through cooling water in pipe, cooling water enters heat radiating type intracavity, and the heat produced in etching process is delivered to cool down in water, with heat
The cooling water of amount is flowed out by cooling water flow out of flexible pipe, takes out after window dissolves, thus prepares on the basis of printed board Copper Foil
High density fine-line；
S(45), wash station, spray head sprays in printed board, till etching solution being washed out completely；
S(46), ink retreating station, rustless steel Hanging Basket is put in ink retreating cylinder together with printed board, control ink retreating cylinder temperature be
40 ~ 50 DEG C, nozzle exit pressure is 1.0 ~ 2.5kg/cm2, vibrate 1min ~ 3min gently, after dry film is completely dissolved, takes out and dries
Dry.
The invention have the advantages that present invention process is simple, the circuit that etching obtains more becomes more meticulous, it is to avoid etching
During heat bulk deposition and the phenomenon that printed panel deforms occurs, greatly improve the quality of product.
Detailed description of the invention
The present invention will be further described below, and protection scope of the present invention is not limited to the following stated:
Embodiment one: the etch process of a kind of high-order high-density fine-line, it comprises the following steps:
S1, open cylinder dosing station, first inboard wall of cylinder block is rinsed, eliminating impurities is clean, in ink retreating cylinder, add water to moving back
The 1/3 of ink cylinder volume, then in ink retreating cylinder, add NaOH solution, then in ink retreating cylinder, add clear water to cylinder body requirement liquid level,
Making solution concentration in cylinder body is 3%；Etching solution is added in etching groove；
S2, start inspection guarantee that absorbent cotton wheel keeps cleaning, and in semi-moist state, and without breakage；
Plate grinder is required to start by S3, start in strict accordance with operation, and controlling transmission speed scope is 2m/min；
S4, the fine etching of printed board, its concrete operation step is as follows:
S(41), offer heat radiation die cavity in printed board, the substrate of printed board is offered the heat radiation die cavity of the shape that takes the shape of the letter U, at heat radiating type
Import department's connection cooling water in chamber flows into flexible pipe, and the exit connection at heat radiation die cavity simultaneously cooling water flow out of flexible pipe；
S(42), printing board surface washing station, printed board is put in acid deoiling liquid immersion 2min, to remove on plate face
Oils and fats pollutes and oxide layer, it is ensured that plate face is cleaned, and dries the moisture on surface；
S(43), printed board patch dry film station, copper-surfaced paper tinsel on printing board surface, need the part windowed of etching not cover Copper Foil
Layer, remaining is for being completely covered；Post and outside the printed board of copper foil layer, carry out Double-face adhesive multilamellar dry film again；
S(44), erosion station is stung, in the etching solution in etching groove printed board being positioned in step S1；Control temperature in etching groove
Degree is 45 DEG C, and nozzle exit pressure is 2.0kg/cm2, vibrate 3 min gently；Flow in flexible pipe to cooling water simultaneously and be passed through cooling
Water, cooling water enters heat radiating type intracavity, and the heat produced in etching process is delivered to cool down in water, with heat cooling water by
Cooling water flow out of flexible pipe to flow out, take out after window dissolves, therefore avoid heat bulk deposition and print occurs in printed board
The phenomenon of making sheet deformation, thus on the basis of printed board Copper Foil, prepare high density fine-line, it is ensured that circuit precision, improves
The quality of product；
S(45), wash station, spray head sprays in printed board, till etching solution being washed out completely；
S(46), ink retreating station, rustless steel Hanging Basket is put in ink retreating cylinder together with printed board, control ink retreating cylinder temperature be
40 DEG C, nozzle exit pressure is 1.0kg/cm2, vibrate 1min gently, after dry film is completely dissolved, takes out and dries.
Embodiment two: the etch process of a kind of high-order high-density fine-line, it comprises the following steps:
S1, open cylinder dosing station, first inboard wall of cylinder block is rinsed, eliminating impurities is clean, in ink retreating cylinder, add water to moving back
The 1/3 of ink cylinder volume, then in ink retreating cylinder, add NaOH solution, then in ink retreating cylinder, add clear water to cylinder body requirement liquid level,
Making solution concentration in cylinder body is 5%；Etching solution is added in etching groove；
S2, start inspection guarantee that absorbent cotton wheel keeps cleaning, and in semi-moist state, and without breakage；
Plate grinder is required to start by S3, start in strict accordance with operation, and controlling transmission speed scope is 3m/min；
S4, the fine etching of printed board, its concrete operation step is as follows:
S(41), offer heat radiation die cavity in printed board, the substrate of printed board is offered the heat radiation die cavity of the shape that takes the shape of the letter U, at heat radiating type
Import department's connection cooling water in chamber flows into flexible pipe, and the exit connection at heat radiation die cavity simultaneously cooling water flow out of flexible pipe；
S(42), printing board surface washing station, printed board is put in acid deoiling liquid immersion 4min, to remove on plate face
Oils and fats pollutes and oxide layer, it is ensured that plate face is cleaned, and dries the moisture on surface；
S(43), printed board patch dry film station, copper-surfaced paper tinsel on printing board surface, need the part windowed of etching not cover Copper Foil
Layer, remaining is for being completely covered；Post and outside the printed board of copper foil layer, carry out Double-face adhesive multilamellar dry film again；
S(44), erosion station is stung, in the etching solution in etching groove printed board being positioned in step S1；Control temperature in etching groove
Degree is 50 DEG C, and nozzle exit pressure is 2.9 kg/cm2, vibrate 4min gently；Flow in flexible pipe to cooling water simultaneously and be passed through cooling
Water, cooling water enters heat radiating type intracavity, and the heat produced in etching process is delivered to cool down in water, with heat cooling water by
Cooling water flow out of flexible pipe to flow out, take out after window dissolves, thus on the basis of printed board Copper Foil, prepare high density fine lines
Road；
S(45), wash station, spray head sprays in printed board, till etching solution being washed out completely；
S(46), ink retreating station, rustless steel Hanging Basket is put in ink retreating cylinder together with printed board, control ink retreating cylinder temperature be
45 DEG C, nozzle exit pressure is 2kg/cm2, vibrate 2min gently, after dry film is completely dissolved, takes out and dries.
Embodiment three: the etch process of a kind of high-order high-density fine-line, it comprises the following steps:
S1, open cylinder dosing station, first inboard wall of cylinder block is rinsed, eliminating impurities is clean, in ink retreating cylinder, add water to moving back
The 1/3 of ink cylinder volume, then in ink retreating cylinder, add NaOH solution, then in ink retreating cylinder, add clear water to cylinder body requirement liquid level,
Making solution concentration in cylinder body is 8%；Etching solution is added in etching groove；
S2, start inspection guarantee that absorbent cotton wheel keeps cleaning, and in semi-moist state, and without breakage；
Plate grinder is required to start by S3, start in strict accordance with operation, and controlling transmission speed scope is 4m/min；
S4, the fine etching of printed board, its concrete operation step is as follows:
S(41), offer heat radiation die cavity in printed board, the substrate of printed board is offered the heat radiation die cavity of the shape that takes the shape of the letter U, at heat radiating type
Import department's connection cooling water in chamber flows into flexible pipe, and the exit connection at heat radiation die cavity simultaneously cooling water flow out of flexible pipe；
S(42), printing board surface washing station, printed board is put in acid deoiling liquid immersion 6min, to remove on plate face
Oils and fats pollutes and oxide layer, it is ensured that plate face is cleaned, and dries the moisture on surface；
S(43), printed board patch dry film station, copper-surfaced paper tinsel on printing board surface, need the part windowed of etching not cover Copper Foil
Layer, remaining is for being completely covered；Post and outside the printed board of copper foil layer, carry out Double-face adhesive multilamellar dry film again；
S(44), erosion station is stung, in the etching solution in etching groove printed board being positioned in step S1；Control temperature in etching groove
Degree is 53 DEG C, and nozzle exit pressure is 3.5 kg/cm2, vibrate 5min gently；Flow in flexible pipe to cooling water simultaneously and be passed through cooling
Water, cooling water enters heat radiating type intracavity, and the heat produced in etching process is delivered to cool down in water, with heat cooling water by
Cooling water flow out of flexible pipe to flow out, take out after window dissolves, thus on the basis of printed board Copper Foil, prepare high density fine lines
Road；
S(45), wash station, spray head sprays in printed board, till etching solution being washed out completely；
S(46), ink retreating station, rustless steel Hanging Basket is put in ink retreating cylinder together with printed board, control ink retreating cylinder temperature be
50 DEG C, nozzle exit pressure is 2.5kg/cm2, vibrate 3min gently, after dry film is completely dissolved, takes out and dries.
The above is only the preferred embodiment of the present invention, it should be understood that the present invention is not limited to described herein
Form, is not to be taken as the eliminating to other embodiments, and can be used for other combinations various, amendment and environment, and can be at this
In the described contemplated scope of literary composition, it is modified by above-mentioned teaching or the technology of association area or knowledge.And those skilled in the art are entered
The change of row and change, the most all should be at the protection domains of claims of the present invention without departing from the spirit and scope of the present invention
In.
Claims (1)
1. the etch process of a high-order high-density fine-line, it is characterised in that: it comprises the following steps:
S1, open cylinder dosing station, first inboard wall of cylinder block is rinsed, eliminating impurities is clean, in ink retreating cylinder, add water to moving back
The 1/3 of ink cylinder volume, then in ink retreating cylinder, add NaOH solution, then in ink retreating cylinder, add clear water to cylinder body requirement liquid level,
Making solution concentration in cylinder body is 3 ~ 8%；Etching solution is added in etching groove；
S2, start inspection guarantee that absorbent cotton wheel keeps cleaning, and in semi-moist state, and without breakage；
Plate grinder is required to start by S3, start in strict accordance with operation, and controlling transmission speed scope is 2 ~ 4m/min；
S4, the fine etching of printed board, its concrete operation step is as follows:
S(41), offer heat radiation die cavity in printed board, the substrate of printed board is offered the heat radiation die cavity of the shape that takes the shape of the letter U, at heat radiating type
Import department's connection cooling water in chamber flows into flexible pipe, and the exit connection at heat radiation die cavity simultaneously cooling water flow out of flexible pipe；
S(42), printing board surface washing station, printed board is put in acid deoiling liquid immersion 2min ~ 6min, to remove plate
Oils and fats on face pollutes and oxide layer, it is ensured that plate face is cleaned, and dries the moisture on surface；
S(43), printed board patch dry film station, copper-surfaced paper tinsel on printing board surface, need the part windowed of etching not cover Copper Foil
Layer, remaining is for being completely covered；Post and outside the printed board of copper foil layer, carry out Double-face adhesive multilamellar dry film again；
S(44), erosion station is stung, in the etching solution in etching groove printed board being positioned in step S1；Control temperature in etching groove
Degree is 45 ~ 53 DEG C, and nozzle exit pressure is 2.0 ~ 3.5 kg/cm2, vibrate 3min ~ 5min gently；Flow into soft to cooling water simultaneously
Being passed through cooling water in pipe, cooling water enters heat radiating type intracavity, and the heat produced in etching process is delivered to cool down in water, with heat
The cooling water of amount is flowed out by cooling water flow out of flexible pipe, takes out after window dissolves, thus prepares on the basis of printed board Copper Foil
High density fine-line；
S(45), wash station, spray head sprays in printed board, till etching solution being washed out completely；
S(46), ink retreating station, rustless steel Hanging Basket is put in ink retreating cylinder together with printed board, control ink retreating cylinder temperature be
40 ~ 50 DEG C, nozzle exit pressure is 1.0 ~ 2.5kg/cm2, vibrate 1min ~ 3min gently, after dry film is completely dissolved, takes out and dries
Dry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610524337.1A CN106132099A (en) | 2016-07-06 | 2016-07-06 | A kind of etch process of high-order high-density fine-line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610524337.1A CN106132099A (en) | 2016-07-06 | 2016-07-06 | A kind of etch process of high-order high-density fine-line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106132099A true CN106132099A (en) | 2016-11-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610524337.1A Pending CN106132099A (en) | 2016-07-06 | 2016-07-06 | A kind of etch process of high-order high-density fine-line |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101594739A (en) * | 2008-05-27 | 2009-12-02 | 华为技术有限公司 | Device embedded circuit board heat abstractor and processing method |
| CN202799520U (en) * | 2012-07-24 | 2013-03-13 | 俞权锋 | Circuit-board water cooling radiator |
| CN104185386A (en) * | 2014-09-16 | 2014-12-03 | 四川海英电子科技有限公司 | Etching process for multilayer circuit board with fine lines |
| CN204285389U (en) * | 2014-11-14 | 2015-04-22 | 广东泰卓光电科技股份有限公司 | A kind of LED radiator structure |
| CN105007691A (en) * | 2015-08-18 | 2015-10-28 | 四川海英电子科技有限公司 | Fine circuit printed board etching process |
| CN205179502U (en) * | 2015-12-01 | 2016-04-20 | 深圳华强聚丰电子科技有限公司 | Heat radiation structure of 12 layers of PCB board |
-
2016
- 2016-07-06 CN CN201610524337.1A patent/CN106132099A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101594739A (en) * | 2008-05-27 | 2009-12-02 | 华为技术有限公司 | Device embedded circuit board heat abstractor and processing method |
| CN202799520U (en) * | 2012-07-24 | 2013-03-13 | 俞权锋 | Circuit-board water cooling radiator |
| CN104185386A (en) * | 2014-09-16 | 2014-12-03 | 四川海英电子科技有限公司 | Etching process for multilayer circuit board with fine lines |
| CN204285389U (en) * | 2014-11-14 | 2015-04-22 | 广东泰卓光电科技股份有限公司 | A kind of LED radiator structure |
| CN105007691A (en) * | 2015-08-18 | 2015-10-28 | 四川海英电子科技有限公司 | Fine circuit printed board etching process |
| CN205179502U (en) * | 2015-12-01 | 2016-04-20 | 深圳华强聚丰电子科技有限公司 | Heat radiation structure of 12 layers of PCB board |
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| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161116 |
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| RJ01 | Rejection of invention patent application after publication |