CN105007691A - Fine circuit printed board etching process - Google Patents
Fine circuit printed board etching process Download PDFInfo
- Publication number
- CN105007691A CN105007691A CN201510507190.0A CN201510507190A CN105007691A CN 105007691 A CN105007691 A CN 105007691A CN 201510507190 A CN201510507190 A CN 201510507190A CN 105007691 A CN105007691 A CN 105007691A
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- Prior art keywords
- printed board
- etching
- stainless steel
- hanging basket
- cylinder
- Prior art date
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- Granted
Links
- 238000005530 etching Methods 0.000 title claims abstract description 86
- 238000000034 method Methods 0.000 title claims abstract description 34
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 23
- 239000010935 stainless steel Substances 0.000 claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 238000001514 detection method Methods 0.000 claims abstract description 6
- 238000005406 washing Methods 0.000 claims abstract description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 238000010923 batch production Methods 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 16
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 12
- 239000011889 copper foil Substances 0.000 claims description 11
- 230000002745 absorbent Effects 0.000 claims description 10
- 239000002250 absorbent Substances 0.000 claims description 10
- 238000007689 inspection Methods 0.000 claims description 10
- 210000002268 wool Anatomy 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 230000003628 erosive effect Effects 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000011109 contamination Methods 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 5
- 239000004519 grease Substances 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004140 cleaning Methods 0.000 abstract 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical group Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention relates to a fine circuit printed board etching process, which comprises the steps of S1, opening a cylinder and preparing a solution; S2, carrying out startup checking; S3, starting up; S4, carrying out initial workpiece etching, wherein the initial workpiece etching is carried out on each model of printed board; wherein the specific operating steps of initial workpiece etching are as follows: S41, surface cleaning; S42, dry film attaching; S43, etching, that is, a printed board is placed in a stainless steel hanging basket with the upper part and the lower part being fixed, the stainless steel hanging basket is put in the etching bath prepared in the step 1, the temperature in the etching bath is controlled to be 45-53 DEG C, the nozzle pressure is 2.0-3.5kg/cm2, and the stainless steel hanging basket vibrates slightly for 3min-5min and is then taken out after a window is dissolved; S44, washing; S45, ink retreating; and S46, detection; and S5, carrying out mass production, that is, a plurality of printed boards with the same model are placed on a production line to carry out mass production according to the steps S41-S45 after the printed board is detected to be qualified in the step S46, and spot check is carried out in the mass production process. The advantages of the fine circuit printed board etching process lie in that occurrence of mass unqualified products can be avoided, and the etching effect is good.
Description
Technical field
The present invention relates to the production technical field of printed circuit board, particularly fine-line printed board etch process.
Background technology
Mostly the design of electronic instrument circuits all is at present based on printed circuit board (PCB) with being connected, and along with the scientific and technological progress of electronics industry, printed board is to the future development of multiple stratification, densification, and etch process is progressively from the extensive style in past to professional development.Etching is the necessary operation during printed wiring board is produced, but along with its degree raising that becomes more meticulous, traditional etch process has started to realize, and especially lateral erosion problem is more and more serious.The method often adopted when corroding Copper Foil bearing printed circuit board in electronics industry is ferric trichloride chemical corrosion method, and it exists following shortcoming: can not be applied to anti-plating
method is newtechnique; Ferric trichloride consumption is large; Etchant solution capacity is little; Working condition difference etc.Process used solution process more complicated, reclaiming copper and regenerating ferric trichloride all needs more complicated equipment and larger investment.
Often need the window outputing designing requirement size in some region of base material in fine-line board production, if select plasma etching or laser ablation methods, exist drop in advance and maintenance cost too high, and the requirement also high deficiency to operator; And adopt machinery die-cut, often can only be applied in some in the not high single or double flexible electric circuit board of required precision, but cannot complete the production of small-sized, the highdensity fine-line multilayer circuit board to high added value.
Traditional circuit printed board when producing, once after technological parameter formulated, directly will produce in batches, but if a certain processing step goes wrong, cause PCB Production defective, bulk article will be caused defective.In traditional etching bath, etching solution service condition is indefinite, does not know and when needs to adjust etching solution, this will affect etch effect greatly.
Summary of the invention
The object of the invention is to the shortcoming overcoming prior art, provide a kind of avoiding to occur batch substandard product and the good fine-line printed board etch process of etch effect.
Object of the present invention is achieved through the following technical solutions: fine-line printed board etch process, comprises the following steps:
S1, open cylinder dosing: inboard wall of cylinder block is rinsed, eliminating impurities is clean, then add in ink retreating cylinder water to ink retreating cylinder body long-pending 1/3, then add NaOH in ink retreating cylinder, in ink retreating cylinder, add clear water again to cylinder body requirement liquid level, make solution concentration in cylinder body be 3 ~ 8%; In etching bath, add etching solution, and make Cu
2+concentration be 135 ~ 160g/L, Cl
-concentration be 180 ~ 210g/L;
S2, start check: comprise following sub-step:
S21, inspection nozzle: check each nozzle in Plate grinder, guarantee its nozzles clear, and nozzle is vertical with printed board plate face;
S22, checked filter core: check each filter core on Plate grinder, guarantee no-sundries in filter core, and change damaged filter core in time;
S23, inspection absorbent wool: guarantee that absorbent wool wheel keeps clean, and in half moisture state, and without breakage;
S3, start: Plate grinder is started in strict accordance with operation requirements, controls transfer velocity interval is 2 ~ 4m/min;
S4, initial workpiece etch: carry out initial workpiece etching to the printed board etching of each model, its concrete operation step is as follows:
S41, surface clean: be successively placed on production line by the printed board of 1 ~ 3 same model, clean printing board surface, put into acid deoiling liquid 2min ~ 6min, the grease contamination on removing plate face and oxide layer, guarantees that plate face is cleaned, dry;
S42, subsides dry film, copper foil layer is sticked in printed board, and need to etch the part not covering copper layers of foil of windowing, all the other are for cover completely; Double-face adhesive multilayer dry film is carried out again outside the printed board posting copper foil layer;
S43, sting erosion: printed board be placed in stainless steel Hanging Basket and fix up and down, inserted by stainless steel Hanging Basket in the etching bath that step S1 prepares, controlling temperature in etching bath is 45 ~ 53 DEG C, and nozzle exit pressure is 2.0 ~ 3.5 kg/cm2, vibrate 3min ~ 5min gently, takes out after window dissolves;
S44, washing: the stainless steel Hanging Basket water that printed board is housed is rinsed, till being washed out completely by etching solution;
S45, ink retreating: stainless steel Hanging Basket is put into ink retreating cylinder together with printed board, controlling ink retreating cylinder temperature is 40 ~ 50 DEG C, and nozzle exit pressure is 1.0 ~ 2.5kg/cm2, and vibrate 1min ~ 3min gently, after dry film dissolves completely, takes out and dries;
S46, detection: detect under the initial workpiece product obtained is placed on basis of microscopic observation window, then tester electric property;
S5, batch production: step S46 detect qualified after, then the printed board of polylith same model put produce in batches according to step S41 ~ S45 on a production line, inspect by random samples in batch production process.
Also be included in batch production process and detect with the proportion of densimeter to etching solution, when etching solution proportion is less than 1.1, then in etching bath, add Cu
2+and Cl
-, make its proportion between 1.1 ~ 2.5.
Etching solution in described etching bath is also added with hydrogen peroxide, and wherein the volume of hydrogen peroxide accounts for 25% of etching solution volume.
The present invention has the following advantages:
1, the present invention is before the printed board batch production of same model, carry out initial workpiece etching to the printed board of this model to produce, carry out according to the etch process step of printed board completely, and initial workpiece etching is detected, produce in batches again after qualified, and in batch production process, printed board is inspected by random samples, if there is substandard product, timely adjustment, can avoid occurring that substandard product in enormous quantities occurs.
2, when etching solution proportion is less than 1.1, then in etching bath, Cu is added
2+and Cl
-, make its proportion between 1.1 ~ 2.5, can guarantee that etching process carries out completely, and be in optimum state, effectively can improve the etch effect of etched circuit board.When etched circuit board area is more than 4000m
2after, change the liquid in ink retreating cylinder, etching solution is monthly changed simultaneously, can guarantee liquid active in cylinder.
3, in etching bath, add hydrogen peroxide, stannous chloride oxidation regeneration can be made, reclaim.
Embodiment
The present invention will be further described below, but protection scope of the present invention is not limited to the following stated.
[embodiment 1]:
Fine-line printed board etch process, comprises the following steps:
S1, open cylinder dosing: inboard wall of cylinder block is rinsed, eliminating impurities is clean, then add in ink retreating cylinder water to ink retreating cylinder body long-pending 1/3, then add NaOH in ink retreating cylinder, in ink retreating cylinder, add clear water again to cylinder body requirement liquid level, make solution concentration in cylinder body be 8%; In etching bath, add etching solution, and make Cu
2+concentration be 160g/L, Cl
-concentration be 210g/L;
S2, start check: comprise following sub-step:
S21, inspection nozzle: check each nozzle in Plate grinder, guarantee its nozzles clear, and nozzle is vertical with printed board plate face;
S22, checked filter core: check each filter core on Plate grinder, guarantee no-sundries in filter core, and change damaged filter core in time;
S23, inspection absorbent wool: guarantee that absorbent wool wheel keeps clean, and in half moisture state, and without breakage;
S3, start: Plate grinder is started in strict accordance with operation requirements, controls transfer speed is 4m/min;
S4, initial workpiece etch: carry out initial workpiece etching to the printed board etching of each model, its concrete operation step is as follows:
S41, surface clean: be successively placed on production line by the printed board of 1 ~ 3 same model, clean printing board surface, put into acid deoiling liquid 2min ~ 6min, the grease contamination on removing plate face and oxide layer, guarantees that plate face is cleaned, dry;
S42, subsides dry film, copper foil layer is sticked in printed board, and need to etch the part not covering copper layers of foil of windowing, all the other are for cover completely; Double-face adhesive multilayer dry film is carried out again outside the printed board posting copper foil layer;
S43, sting erosion: printed board be placed in stainless steel Hanging Basket and fix up and down, inserted by stainless steel Hanging Basket in the etching bath that step S1 prepares, controlling temperature in etching bath is 45 DEG C, and nozzle exit pressure is 2.0kg/cm
2, vibrate 5min gently, takes out after window dissolves;
S44, washing: the stainless steel Hanging Basket water that printed board is housed is rinsed, till being washed out completely by etching solution;
S45, ink retreating: stainless steel Hanging Basket is put into ink retreating cylinder together with printed board, controlling ink retreating cylinder temperature is 50 DEG C, and nozzle exit pressure is 2.5kg/cm
2, vibrate 1min gently, after dry film dissolves completely, takes out and dry;
S46, detection: detect under the initial workpiece product obtained is placed on basis of microscopic observation window, then tester electric property;
S5, batch production: step S46 detect qualified after, then the printed board of polylith same model put produce in batches according to step S41 ~ S45 on a production line, inspect by random samples in batch production process.
Detect with the proportion of densimeter to etching solution in batch production process, when etching solution proportion is less than 1.1, then in etching bath, add Cu
2+and Cl
-, make its proportion be 1.1.
Etching solution in described etching bath is also added with hydrogen peroxide, and wherein the volume of hydrogen peroxide accounts for 25% of etching solution volume.
[embodiment 2]:
Fine-line printed board etch process, comprises the following steps:
S1, open cylinder dosing: inboard wall of cylinder block is rinsed, eliminating impurities is clean, then add in ink retreating cylinder water to ink retreating cylinder body long-pending 1/3, then add NaOH in ink retreating cylinder, in ink retreating cylinder, add clear water again to cylinder body requirement liquid level, make solution concentration in cylinder body be 5%; In etching bath, add etching solution, and make Cu
2+concentration be 150g/L, Cl
-concentration be 200g/L;
S2, start check: comprise following sub-step:
S21, inspection nozzle: check each nozzle in Plate grinder, guarantee its nozzles clear, and nozzle is vertical with printed board plate face;
S22, checked filter core: check each filter core on Plate grinder, guarantee no-sundries in filter core, and change damaged filter core in time;
S23, inspection absorbent wool: guarantee that absorbent wool wheel keeps clean, and in half moisture state, and without breakage;
S3, start: Plate grinder is started in strict accordance with operation requirements, controls transfer speed is 3m/min;
S4, initial workpiece etch: carry out initial workpiece etching to the printed board etching of each model, its concrete operation step is as follows:
S41, surface clean: be successively placed on production line by the printed board of 1 ~ 3 same model, clean printing board surface, put into acid deoiling liquid 2min ~ 6min, the grease contamination on removing plate face and oxide layer, guarantees that plate face is cleaned, dry;
S42, subsides dry film, copper foil layer is sticked in printed board, and need to etch the part not covering copper layers of foil of windowing, all the other are for cover completely; Double-face adhesive multilayer dry film is carried out again outside the printed board posting copper foil layer;
S43, sting erosion: printed board be placed in stainless steel Hanging Basket and fix up and down, inserted by stainless steel Hanging Basket in the etching bath that step S1 prepares, controlling temperature in etching bath is 48 DEG C, and nozzle exit pressure is 2.8 kg/cm
2, vibrate 4min gently, takes out after window dissolves;
S44, washing: the stainless steel Hanging Basket water that printed board is housed is rinsed, till being washed out completely by etching solution;
S45, ink retreating: stainless steel Hanging Basket is put into ink retreating cylinder together with printed board, controlling ink retreating cylinder temperature is 45 DEG C, and nozzle exit pressure is 2.0kg/cm
2, vibrate 2min gently, after dry film dissolves completely, takes out and dry;
S46, detection: detect under the initial workpiece product obtained is placed on basis of microscopic observation window, then tester electric property;
S5, batch production: step S46 detect qualified after, then the printed board of polylith same model put produce in batches according to step S41 ~ S45 on a production line, inspect by random samples in batch production process.
Detect with the proportion of densimeter to etching solution in batch production process, when etching solution proportion is less than 1.1, then in etching bath, add Cu
2+and Cl
-, make its proportion be 1.8.
Etching solution in described etching bath is also added with hydrogen peroxide, and wherein the volume of hydrogen peroxide accounts for 25% of etching solution volume.
[embodiment 3]:
Fine-line printed board etch process, comprises the following steps:
S1, open cylinder dosing: inboard wall of cylinder block is rinsed, eliminating impurities is clean, then add in ink retreating cylinder water to ink retreating cylinder body long-pending 1/3, then add NaOH in ink retreating cylinder, in ink retreating cylinder, add clear water again to cylinder body requirement liquid level, make solution concentration in cylinder body be 3%; In etching bath, add etching solution, and make Cu
2+concentration be 135g/L, Cl
-concentration be 180g/L;
S2, start check: comprise following sub-step:
S21, inspection nozzle: check each nozzle in Plate grinder, guarantee its nozzles clear, and nozzle is vertical with printed board plate face;
S22, checked filter core: check each filter core on Plate grinder, guarantee no-sundries in filter core, and change damaged filter core in time;
S23, inspection absorbent wool: guarantee that absorbent wool wheel keeps clean, and in half moisture state, and without breakage;
S3, start: Plate grinder is started in strict accordance with operation requirements, controls transfer speed is 2m/min;
S4, initial workpiece etch: carry out initial workpiece etching to the printed board etching of each model, its concrete operation step is as follows:
S41, surface clean: be successively placed on production line by the printed board of 1 ~ 3 same model, clean printing board surface, put into acid deoiling liquid 2min ~ 6min, the grease contamination on removing plate face and oxide layer, guarantees that plate face is cleaned, dry;
S42, subsides dry film, copper foil layer is sticked in printed board, and need to etch the part not covering copper layers of foil of windowing, all the other are for cover completely; Double-face adhesive multilayer dry film is carried out again outside the printed board posting copper foil layer;
S43, sting erosion: printed board be placed in stainless steel Hanging Basket and fix up and down, inserted by stainless steel Hanging Basket in the etching bath that step S1 prepares, controlling temperature in etching bath is 53 DEG C, and nozzle exit pressure is 3.5 kg/cm
2, vibrate 3min gently, takes out after window dissolves;
S44, washing: the stainless steel Hanging Basket water that printed board is housed is rinsed, till being washed out completely by etching solution;
S45, ink retreating: stainless steel Hanging Basket is put into ink retreating cylinder together with printed board, controlling ink retreating cylinder temperature is 40 DEG C, and nozzle exit pressure is 1.0kg/cm
2, vibrate 3min gently, after dry film dissolves completely, takes out and dry;
S46, detection: detect under the initial workpiece product obtained is placed on basis of microscopic observation window, then tester electric property;
S5, batch production: step S46 detect qualified after, then the printed board of polylith same model put produce in batches according to step S41 ~ S45 on a production line, inspect by random samples in batch production process.
Detect with the proportion of densimeter to etching solution in batch production process, when etching solution proportion is less than 1.1, then in etching bath, add Cu
2+and Cl
-, make its proportion be 2.5.
Etching solution in described etching bath is also added with hydrogen peroxide, and wherein the volume of hydrogen peroxide accounts for 25% of etching solution volume.
Claims (3)
1. fine-line printed board etch process, is characterized in that: comprise the following steps:
S1, open cylinder dosing: inboard wall of cylinder block is rinsed, eliminating impurities is clean, then add in ink retreating cylinder water to ink retreating cylinder body long-pending 1/3, then add NaOH in ink retreating cylinder, in ink retreating cylinder, add clear water again to cylinder body requirement liquid level, make solution concentration in cylinder body be 3 ~ 8%; In etching bath, add etching solution, and make Cu
2+concentration be 135 ~ 160g/L, Cl
-concentration be 180 ~ 210g/L;
S2, start check: comprise following sub-step:
S21, inspection nozzle: check each nozzle in Plate grinder, guarantee its nozzles clear, and nozzle is vertical with printed board plate face;
S22, checked filter core: check each filter core on Plate grinder, guarantee no-sundries in filter core, and change damaged filter core in time;
S23, inspection absorbent wool: guarantee that absorbent wool wheel keeps clean, and in half moisture state, and without breakage;
S3, start: Plate grinder is started in strict accordance with operation requirements, controls transfer velocity interval is 2 ~ 4m/min;
S4, initial workpiece etch: carry out initial workpiece etching to the printed board etching of each model, its concrete operation step is as follows:
S41, surface clean: be successively placed on production line by the printed board of 1 ~ 3 same model, clean printing board surface, put into acid deoiling liquid 2min ~ 6min, the grease contamination on removing plate face and oxide layer, guarantees that plate face is cleaned, dry;
S42, subsides dry film, copper foil layer is sticked in printed board, and need to etch the part not covering copper layers of foil of windowing, all the other are for cover completely; Double-face adhesive multilayer dry film is carried out again outside the printed board posting copper foil layer;
S43, sting erosion: printed board be placed in stainless steel Hanging Basket and fix up and down, inserted by stainless steel Hanging Basket in the etching bath that step S1 prepares, controlling temperature in etching bath is 45 ~ 53 DEG C, and nozzle exit pressure is 2.0 ~ 3.5 kg/cm
2, vibrate 3min ~ 5min gently, takes out after window dissolves;
S44, washing: the stainless steel Hanging Basket water that printed board is housed is rinsed, till being washed out completely by etching solution;
S45, ink retreating: stainless steel Hanging Basket is put into ink retreating cylinder together with printed board, controlling ink retreating cylinder temperature is 40 ~ 50 DEG C, and nozzle exit pressure is 1.0 ~ 2.5kg/cm
2, vibrate 1min ~ 3min gently, after dry film dissolves completely, takes out and dry;
S46, detection: detect under the initial workpiece product obtained is placed on basis of microscopic observation window, then tester electric property;
S5, batch production: step S46 detect qualified after, then the printed board of polylith same model put produce in batches according to step S41 ~ S45 on a production line, inspect by random samples in batch production process.
2. fine-line printed board etch process according to claim 1, it is characterized in that: be also included in batch production process and detect with the proportion of densimeter to etching solution, when etching solution proportion is less than 1.1, then in etching bath, add new midnight, make its proportion between 1.1 ~ 2.5.
3. fine-line printed board etch process according to claim 1, it is characterized in that: the etching solution in described etching bath is also added with hydrogen peroxide, wherein the volume of hydrogen peroxide accounts for 25% of etching solution volume.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510507190.0A CN105007691B (en) | 2015-08-18 | 2015-08-18 | Fine-line printed board etch process |
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|---|---|---|---|
| CN201510507190.0A CN105007691B (en) | 2015-08-18 | 2015-08-18 | Fine-line printed board etch process |
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| CN105007691B CN105007691B (en) | 2018-02-06 |
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ID=54380147
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105263270A (en) * | 2015-11-09 | 2016-01-20 | 四川普瑞森电子有限公司 | Inner plating manufacturing method |
| CN106132099A (en) * | 2016-07-06 | 2016-11-16 | 四川海英电子科技有限公司 | A kind of etch process of high-order high-density fine-line |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0396056A2 (en) * | 1989-05-02 | 1990-11-07 | Nikko Gould Foil Co., Ltd. | Treatment of copper foil for printed circuits |
| CN201386136Y (en) * | 2009-04-15 | 2010-01-20 | 苏州市飞莱克斯电路电子有限公司 | Concentration control device of flexible circuit board etching liquid |
| CN102808181A (en) * | 2011-06-01 | 2012-12-05 | 莆田市佳宜电子有限公司 | Alkaline etching process of printed circuit board |
| CN104185386A (en) * | 2014-09-16 | 2014-12-03 | 四川海英电子科技有限公司 | Etching process for multilayer circuit board with fine lines |
-
2015
- 2015-08-18 CN CN201510507190.0A patent/CN105007691B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0396056A2 (en) * | 1989-05-02 | 1990-11-07 | Nikko Gould Foil Co., Ltd. | Treatment of copper foil for printed circuits |
| CN201386136Y (en) * | 2009-04-15 | 2010-01-20 | 苏州市飞莱克斯电路电子有限公司 | Concentration control device of flexible circuit board etching liquid |
| CN102808181A (en) * | 2011-06-01 | 2012-12-05 | 莆田市佳宜电子有限公司 | Alkaline etching process of printed circuit board |
| CN104185386A (en) * | 2014-09-16 | 2014-12-03 | 四川海英电子科技有限公司 | Etching process for multilayer circuit board with fine lines |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105263270A (en) * | 2015-11-09 | 2016-01-20 | 四川普瑞森电子有限公司 | Inner plating manufacturing method |
| CN105263270B (en) * | 2015-11-09 | 2018-08-31 | 四川普瑞森电子有限公司 | Internal layer board manufacturing method |
| CN106132099A (en) * | 2016-07-06 | 2016-11-16 | 四川海英电子科技有限公司 | A kind of etch process of high-order high-density fine-line |
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