CN106211599A - A kind of method saving material making wiring board - Google Patents
A kind of method saving material making wiring board Download PDFInfo
- Publication number
- CN106211599A CN106211599A CN201610585943.4A CN201610585943A CN106211599A CN 106211599 A CN106211599 A CN 106211599A CN 201610585943 A CN201610585943 A CN 201610585943A CN 106211599 A CN106211599 A CN 106211599A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- corrosive liquid
- saving material
- clad plate
- copper clad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0766—Rinsing, e.g. after cleaning or polishing a conductive pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a kind of method saving material making wiring board, including step be: being put in corrosive liquid by the copper clad plate transferred and corrode, the copper film on described copper clad plate is eroded by described corrosive liquid completely, the wiring board after being corroded；Described wiring board is taken out from corrosive liquid and cleans up, then the surface drilling at described wiring board, and the powdered ink covered on described wiring board is polished off, carry out the welding of electronic component after cleaning up, obtain wiring board.By the way, the present invention saves the method that material makes wiring board, and the raw material that this manufacture method uses is few, it is possible to effectively reduces production cost, it is not necessary to carry out the buying of raw material widely, is suitable for popularization and application in enterprise and factory.
Description
Technical field
The present invention relates to electronics field, particularly relate to a kind of method saving material making wiring board.
Background technology
Wiring board is the important mechanism assembly of the electrical equipment manufactured as raw material using copper clad laminate or electronics.Substrate industry is
The basic industries of a kind of material, are the composites being made up of dielectric layer and highly purified both conductors.The material of wiring board
Including glass fibre, glass fibre is applied as supporting material in circuit board substrate.Other are such as the paper of papery substrate
Material, Fypro and quartz fibre etc. the most also can use as the supporting material of substrate.Former required for existing wiring board
Material material is many, not only increases cost, also complicated technical process.
Summary of the invention
The technical problem that present invention mainly solves is to provide a kind of method saving material making wiring board, it is possible to reduce former
The use of material material.
For solving above-mentioned technical problem, the technical scheme that the present invention uses is: provides one to save material and makes line
The method of road plate, is: put in corrosive liquid by the copper clad plate transferred and corrode that described corrosive liquid applies described including step
Copper film on copper coin erodes completely, the wiring board after being corroded；Described wiring board is taken out from corrosive liquid and cleans dry
Only, then the surface drilling at described wiring board, and the powdered ink covered on described wiring board is polished off, carry out after cleaning up
The welding of electronic component, obtains wiring board.
In a preferred embodiment of the present invention, described corrosive liquid includes concentrated hydrochloric acid, dense hydrogen peroxide and water, described dense salt
The mass ratio of hydrogen peroxide sour, dense and water is 1:2-3:3-5.
In a preferred embodiment of the present invention, described etching time is 10-30 minute.
In a preferred embodiment of the present invention, described in clean up step use clean water.
The invention has the beneficial effects as follows: the present invention saves the method that material makes wiring board, and this manufacture method uses
Raw material is few, it is possible to effectively reduce production cost, it is not necessary to carry out the buying of raw material widely, be suitable in enterprise and
Popularization and application in factory.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described enforcement
Example is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, this area is common
All other embodiments that technical staff is obtained under not making creative work premise, broadly fall into the model of present invention protection
Enclose.
Embodiment one:
There is provided a kind of and save the method that material makes wiring board, including step be:
(1) being put in corrosive liquid by the copper clad plate transferred and corrode, described corrosive liquid is by complete for the copper film on described copper clad plate
Entirely eroding, the wiring board after being corroded, wherein said corrosive liquid includes concentrated hydrochloric acid, dense hydrogen peroxide and water, described dense salt
The mass ratio of hydrogen peroxide sour, dense and water is 1:2.5:4, and described etching time is 25 minutes；
(2) described wiring board is taken out from corrosive liquid and clean by clean water, then the surface drilling at described wiring board, and
The powdered ink covered on described wiring board is polished off, carries out the welding of electronic component by clean water after clean, obtain circuit
Plate.
Embodiment two:
There is provided a kind of and save the method that material makes wiring board, including step be:
(1) being put in corrosive liquid by the copper clad plate transferred and corrode, described corrosive liquid is by complete for the copper film on described copper clad plate
Entirely eroding, the wiring board after being corroded, wherein said corrosive liquid includes concentrated hydrochloric acid, dense hydrogen peroxide and water, described dense salt
The mass ratio of hydrogen peroxide sour, dense and water is 1:3:4.5, and described etching time is 10 minutes；
(2) described wiring board is taken out from corrosive liquid and clean by clean water, then the surface drilling at described wiring board, and
The powdered ink covered on described wiring board is polished off, carries out the welding of electronic component by clean water after clean, obtain circuit
Plate.
The invention has the beneficial effects as follows:
One, the raw material of the method use that described saving material makes wiring board is few, it is possible to effectively reduce production cost；
Two, the method for described saving material making wiring board need not carry out widely the buying of raw material, is suitable in enterprise
With popularization and application in factory.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this
Equivalent structure or equivalence flow process that bright description is made convert, or are directly or indirectly used in other relevant technology neck
Territory, is the most in like manner included in the scope of patent protection of the present invention.
Claims (4)
1. save the method that material makes wiring board for one kind, it is characterised in that include that step is: put into by the copper clad plate transferred
Corroding in corrosive liquid, the copper film on described copper clad plate is eroded by described corrosive liquid completely, the wiring board after being corroded；
Described wiring board is taken out from corrosive liquid and cleans up, then the surface drilling at described wiring board, and will cover described
Powdered ink on wiring board polishes off, and carries out the welding of electronic component, obtain wiring board after cleaning up.
Saving material the most according to claim 1 makes the method for wiring board, it is characterised in that described corrosive liquid includes
Concentrated hydrochloric acid, dense hydrogen peroxide and water, the mass ratio of described concentrated hydrochloric acid, dense hydrogen peroxide and water is 1:2-3:3-5.
Saving material the most according to claim 1 makes the method for wiring board, it is characterised in that described etching time is
10-30 minute.
Saving material the most according to claim 1 make wiring board method, it is characterised in that described in clean up step
In use clean water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610585943.4A CN106211599A (en) | 2016-07-25 | 2016-07-25 | A kind of method saving material making wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610585943.4A CN106211599A (en) | 2016-07-25 | 2016-07-25 | A kind of method saving material making wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106211599A true CN106211599A (en) | 2016-12-07 |
Family
ID=57492600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610585943.4A Pending CN106211599A (en) | 2016-07-25 | 2016-07-25 | A kind of method saving material making wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106211599A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108156766A (en) * | 2018-02-05 | 2018-06-12 | 安吉腾新印刷厂 | A kind of quick Fabrication technique of single-sided printed board |
| CN110859025A (en) * | 2018-08-24 | 2020-03-03 | 绵阳市奇帆科技有限公司 | Manufacturing method of novel environment-friendly circuit board |
| CN111225505A (en) * | 2019-11-29 | 2020-06-02 | 大连亚太电子有限公司 | Grooving process for PCB and preparation method of PCB |
| CN112601360A (en) * | 2020-11-30 | 2021-04-02 | 湖北碧辰科技股份有限公司 | PCB production method |
| CN113382547A (en) * | 2021-06-10 | 2021-09-10 | 安徽熙泰智能科技有限公司 | PCB manufacturing method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103204003A (en) * | 2013-03-27 | 2013-07-17 | 清华大学 | Direct circuit printing system and method thereof |
| CN103476204A (en) * | 2013-10-08 | 2013-12-25 | 复旦大学 | Addition preparation method for double-side boards |
| CN103596373A (en) * | 2013-11-07 | 2014-02-19 | 南京邮电大学 | Integrated circuit plate manufacturing method based on copper nitride film |
| CN104900642A (en) * | 2015-03-26 | 2015-09-09 | 苏州市德莱尔建材科技有限公司 | MPPO board for integrated circuit and manufacturing method thereof |
| CN104902687A (en) * | 2015-06-18 | 2015-09-09 | 镇江华印电路板有限公司 | Anti-crack printed circuit board |
| CN105050323A (en) * | 2015-06-18 | 2015-11-11 | 镇江华印电路板有限公司 | Manufacturing technology of high precision circuit board |
-
2016
- 2016-07-25 CN CN201610585943.4A patent/CN106211599A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103204003A (en) * | 2013-03-27 | 2013-07-17 | 清华大学 | Direct circuit printing system and method thereof |
| CN103476204A (en) * | 2013-10-08 | 2013-12-25 | 复旦大学 | Addition preparation method for double-side boards |
| CN103596373A (en) * | 2013-11-07 | 2014-02-19 | 南京邮电大学 | Integrated circuit plate manufacturing method based on copper nitride film |
| CN104900642A (en) * | 2015-03-26 | 2015-09-09 | 苏州市德莱尔建材科技有限公司 | MPPO board for integrated circuit and manufacturing method thereof |
| CN104902687A (en) * | 2015-06-18 | 2015-09-09 | 镇江华印电路板有限公司 | Anti-crack printed circuit board |
| CN105050323A (en) * | 2015-06-18 | 2015-11-11 | 镇江华印电路板有限公司 | Manufacturing technology of high precision circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108156766A (en) * | 2018-02-05 | 2018-06-12 | 安吉腾新印刷厂 | A kind of quick Fabrication technique of single-sided printed board |
| CN110859025A (en) * | 2018-08-24 | 2020-03-03 | 绵阳市奇帆科技有限公司 | Manufacturing method of novel environment-friendly circuit board |
| CN111225505A (en) * | 2019-11-29 | 2020-06-02 | 大连亚太电子有限公司 | Grooving process for PCB and preparation method of PCB |
| CN112601360A (en) * | 2020-11-30 | 2021-04-02 | 湖北碧辰科技股份有限公司 | PCB production method |
| CN113382547A (en) * | 2021-06-10 | 2021-09-10 | 安徽熙泰智能科技有限公司 | PCB manufacturing method |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161207 |