CN108156766A - A kind of quick Fabrication technique of single-sided printed board - Google Patents
A kind of quick Fabrication technique of single-sided printed board Download PDFInfo
- Publication number
- CN108156766A CN108156766A CN201810111853.0A CN201810111853A CN108156766A CN 108156766 A CN108156766 A CN 108156766A CN 201810111853 A CN201810111853 A CN 201810111853A CN 108156766 A CN108156766 A CN 108156766A
- Authority
- CN
- China
- Prior art keywords
- copper
- clad plate
- heat
- printed board
- printing paper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of quick Fabrication techniques of single-sided printed board, include the following steps：S1, blanking；S2, printing；S3, transfer：The heat-transferring printing paper of step 2 is transferred in copper-clad plate, printed heat-transferring printing paper is covered in copper-clad plate, heat transfer machine is sent into and carrys out back pressure three times, the ink powder absorption completely of fusing is made after copper-clad plate cooling, to throw off heat-transferring printing paper in copper-clad plate；S4, colour-separation drafting：The copper-clad plate thermal transfer effect of checking step 3, if there are broken string and trachomas；S5, etching：Etching solution uses the mixed liquor of hydrogen peroxide, hydrochloric acid and water, wherein hydrogen peroxide：Hydrochloric acid：Water=2：1：2, concentration will be retouched the printed circuit board fixed and be totally submerged in mixed solution, etch printing figures between 28%~42%；S6, washing：Printed board after etching is immediately placed in flowing water and cleans 3min, remaining solution on clean plate；S7, drilling；S8, prefluxing.
Description
Technical field
Invention is related to wiring board and makes manufacture technology field, the quick Fabrication technique of specially a kind of single-sided printed board.
Background technology
Single-sided printed board is one kind of integrated circuit plate, is a carrier for carrying integrated circuit.But often say integrated electricity
Also on integrated circuit band during the plate of road.Integrated circuit plate mainly has silica gel composition, so generally in green.Integrated circuit plate is to adopt
With semiconductor fabrication process, first device such as many transistors and resistor, capacitor is made on one piece of smaller monocrystalline silicon piece
Part, and component is combined into complete electronic circuit according to the method that multilayer wiring or tunnel connect up.
The quick Fabrication technique of current single-sided printed board, there are the ink powder adsorbed in copper-clad plate is incomplete, printing effect
Undesirable, colour-separation drafting is second-rate, and when drilling be easy to cause the problem of copper foil squeezes out burr and undesirable protecting effect.
Invention content
The quick Fabrication technique for being designed to provide a kind of single-sided printed board of invention, to solve to carry in above-mentioned background technology
The problem of going out.
To achieve the above object, invention provides following technical solution：A kind of quick Fabrication technique of single-sided printed board, including
Following steps：
S1, blanking：Copper-clad plate is cut according to actual design size plate shearing machine, removes surrounding burr；
S2, printing：Designed PCB routing figure is passed through on laser printer types to heat-transferring printing paper；
S3, transfer：The heat-transferring printing paper of step 2 is transferred in copper-clad plate, printed heat-transferring printing paper is covered in and covers copper
It on plate, is sent into heat transfer machine and carrys out back pressure three times, make the ink powder absorption completely of fusing in copper-clad plate, after copper-clad plate cooling,
Throw off heat-transferring printing paper；
S4, colour-separation drafting：The copper-clad plate thermal transfer effect of checking step 3, if there are broken string and trachoma, if so, using oiliness
Pen retouch repairing, if nothing, directly skips this step, is directly entered next step；
S5, etching：Etching solution uses the mixed liquor of hydrogen peroxide, hydrochloric acid and water, wherein hydrogen peroxide：Hydrochloric acid：Water=2：1：2,
Concentration will be retouched the printed circuit board fixed and be totally submerged in mixed solution, etch printing figures between 28%~42%；
S6, washing：Printed board after etching is immediately placed in flowing water and cleans 3min, remaining solution on clean plate；
S7, drilling：To in printed board pad hole, mounting hole, location hole be machined, using high speed and precision bench drill
Punching, when drilling, notice that drilling machine rotating speed should be taken at a high speed, and feed is unsuitable too fast；
S8, prefluxing：It is wiped repeatedly in plate face after being first stained with cleanser with cloth waste, removes copper foil oxidation film, expose copper
Bright true qualities are rinsed after drying, immediately prefluxing using rosin alcoholic solution.
Preferably, the printing is it should be noted that following steps：
A, wiring diagram should mirror printed；
B, wiring diagram must be printed upon the smooth surface of heat-transferring printing paper.
Compared with prior art, advantageous effect of the invention is：
1st, the quick Fabrication technique of the single-sided printed board, passes through transfer：The heat-transferring printing paper of step 2 is transferred to copper-clad plate
On, printed heat-transferring printing paper is covered in copper-clad plate, heat transfer machine is sent into and carrys out back pressure three times, the ink powder for making fusing is complete
Absorption after copper-clad plate cooling, is thrown off heat-transferring printing paper, can easily be arrived the pattern transfer on heat-transferring printing paper in copper-clad plate
In copper-clad plate；
2nd, the quick Fabrication technique of the single-sided printed board, passes through drilling：To in printed board pad hole, mounting hole, positioning
Hole is machined, and is punched using high speed and precision bench drill, and when drilling notices that drilling machine rotating speed should be taken at a high speed, and feed should not mistake
Soon, it avoids the problem that copper foil squeezing out burr；
3rd, the quick Fabrication technique of the single-sided printed board, by carrying out prefluxing：After being first stained with cleanser with cloth waste repeatedly
It is wiped in plate face, removes copper foil oxidation film, expose the bright true qualities of copper, after being dried using rosin alcoholic solution flushing, applied immediately
Scaling powder, protection pad are not oxidized；
4th, the quick Fabrication technique of the single-sided printed board, by being etched：Etching solution is using hydrogen peroxide, hydrochloric acid and water
Mixed liquor, wherein hydrogen peroxide：Hydrochloric acid：Water=2：1：2, it is complete will to retouch the printed circuit board fixed between 28%~42% for concentration
It is immersed into mixed solution entirely, etches printing figures, improve etch effect；
5th, the quick Fabrication technique of the single-sided printed board, by carrying out colour-separation drafting：The copper-clad plate thermal transfer effect of checking step 3
Fruit, if there are broken string and trachoma, if so, retouch repairing with oil pen, if nothing, directly skip this step, be directly entered
Next step is not only saved the time, but also can guarantee the quality of colour-separation drafting.
Description of the drawings
Fig. 1 is a kind of flow diagram of the quick Fabrication technique of single-sided printed board.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, invention provides a kind of technical solution：The quick Fabrication technique of a kind of single-sided printed board, including following
Step：
S1, blanking：Copper-clad plate is cut according to actual design size plate shearing machine, removes surrounding burr；
S2, printing：Designed PCB routing figure is passed through on laser printer types to heat-transferring printing paper；
S3, transfer：The heat-transferring printing paper of step 2 is transferred in copper-clad plate, printed heat-transferring printing paper is covered in and covers copper
It on plate, is sent into heat transfer machine and carrys out back pressure three times, make the ink powder absorption completely of fusing in copper-clad plate, after copper-clad plate cooling,
Throw off heat-transferring printing paper；
S4, colour-separation drafting：The copper-clad plate thermal transfer effect of checking step 3, if there are broken string and trachoma, if so, using oiliness
Pen retouch repairing, if nothing, directly skips this step, is directly entered next step；
S5, etching：Etching solution uses the mixed liquor of hydrogen peroxide, hydrochloric acid and water, wherein hydrogen peroxide：Hydrochloric acid：Water=2：1：2,
Concentration will be retouched the printed circuit board fixed and be totally submerged in mixed solution, etch printing figures between 28%~42%；
S6, washing：Printed board after etching is immediately placed in flowing water and cleans 3min, remaining solution on clean plate；
S7, drilling：To in printed board pad hole, mounting hole, location hole be machined, using high speed and precision bench drill
Punching, when drilling, notice that drilling machine rotating speed should be taken at a high speed, and feed is unsuitable too fast；
S8, prefluxing：It is wiped repeatedly in plate face after being first stained with cleanser with cloth waste, removes copper foil oxidation film, expose copper
Bright true qualities are rinsed after drying, immediately prefluxing using rosin alcoholic solution.
The printing is it should be noted that following steps：
A, wiring diagram should mirror printed；
B, wiring diagram must be printed upon the smooth surface of heat-transferring printing paper.
Operation principle：The quick Fabrication technique of the single-sided printed board, passes through transfer：The heat-transferring printing paper of step 2 is transferred to
In copper-clad plate, printed heat-transferring printing paper is covered in copper-clad plate, heat transfer machine is sent into and carrys out back pressure three times, make the ink of fusing
Powder absorption completely after copper-clad plate cooling, throws off heat-transferring printing paper in copper-clad plate, can be easily by the figure on heat-transferring printing paper
It is transferred in copper-clad plate；The quick Fabrication technique of the single-sided printed board, passes through drilling：To in printed board pad hole, mounting hole,
Location hole is machined, and is punched using high speed and precision bench drill, and when drilling notices that drilling machine rotating speed should be taken at a high speed, and feed is unsuitable
It is too fast, it avoids the problem that copper foil squeezing out burr；The quick Fabrication technique of the single-sided printed board, by carrying out prefluxing：First
It is wiped repeatedly in plate face after being stained with cleanser with cloth waste, removes copper foil oxidation film, expose the bright true qualities of copper, it is molten using rosin alcohol
After liquid flushing is dried, prefluxing, protection pad are not oxidized immediately；The quick Fabrication technique of the single-sided printed board, by into
Row etching：Etching solution uses the mixed liquor of hydrogen peroxide, hydrochloric acid and water, wherein hydrogen peroxide：Hydrochloric acid：Water=2：1：2, concentration is 28%
Between~42%, the printed circuit board fixed will be retouched and be totally submerged in mixed solution, etch printing figures, improve etching effect
Fruit；The quick Fabrication technique of the single-sided printed board, by carrying out colour-separation drafting：The copper-clad plate thermal transfer effect of checking step 3, if deposit
In broken string and trachoma, if so, retouch repairing with oil pen, if nothing, this step is directly skipped, is directly entered next step,
Not only it saves the time, but also can guarantee the quality of colour-separation drafting.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
God and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (2)
1. a kind of quick Fabrication technique of single-sided printed board, it is characterised in that：Include the following steps：
S1, blanking：Copper-clad plate is cut according to actual design size plate shearing machine, removes surrounding burr；
S2, printing：Designed PCB routing figure is passed through on laser printer types to heat-transferring printing paper；
S3, transfer：The heat-transferring printing paper of step 2 is transferred in copper-clad plate, printed heat-transferring printing paper is covered in copper-clad plate,
It is sent into heat transfer machine and carrys out back pressure three times, the ink powder absorption completely of fusing is made after copper-clad plate cooling, to throw off heat in copper-clad plate
Transfer paper；
S4, colour-separation drafting：The copper-clad plate thermal transfer effect of checking step 3, if there are broken string and trachoma, if so, with oil pen into
Row, which is retouched, to be repaiied, if nothing, is directly skipped this step, is directly entered next step；
S5, etching：Etching solution uses the mixed liquor of hydrogen peroxide, hydrochloric acid and water, wherein hydrogen peroxide：Hydrochloric acid：Water=2：1：2, concentration
Between 28%~42%, the printed circuit board fixed will be retouched and be totally submerged in mixed solution, etch printing figures；
S6, washing：Printed board after etching is immediately placed in flowing water and cleans 3min, remaining solution on clean plate；
S7, drilling：To in printed board pad hole, mounting hole, location hole be machined, beaten using high speed and precision bench drill
Hole, when drilling, notice that drilling machine rotating speed should be taken at a high speed, and feed is unsuitable too fast；
S8, prefluxing：It is wiped repeatedly in plate face after being first stained with cleanser with cloth waste, removes copper foil oxidation film, expose the light of copper
True qualities are rinsed after drying, immediately prefluxing using rosin alcoholic solution.
2. a kind of quick Fabrication technique of single-sided printed board as described in claim 1, it is characterised in that：The printing should be noted that
Following steps：
A, wiring diagram should mirror printed；
B, wiring diagram must be printed upon the smooth surface of heat-transferring printing paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810111853.0A CN108156766A (en) | 2018-02-05 | 2018-02-05 | A kind of quick Fabrication technique of single-sided printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810111853.0A CN108156766A (en) | 2018-02-05 | 2018-02-05 | A kind of quick Fabrication technique of single-sided printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108156766A true CN108156766A (en) | 2018-06-12 |
Family
ID=62456974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810111853.0A Pending CN108156766A (en) | 2018-02-05 | 2018-02-05 | A kind of quick Fabrication technique of single-sided printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108156766A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109068497A (en) * | 2018-09-21 | 2018-12-21 | 北京梦之墨科技有限公司 | A kind of liquid metal printer and its repair mechanism |
| CN109168267A (en) * | 2018-10-25 | 2019-01-08 | 铜陵市超远科技有限公司 | A kind of high-frequency microwave copper-clad plate etch process |
| CN109298048A (en) * | 2018-11-13 | 2019-02-01 | 海南大学 | A kind of copper-based sensor chip and preparation method thereof and detection method |
| CN110225668A (en) * | 2019-06-14 | 2019-09-10 | 大连亚太电子有限公司 | A kind of route transfer method based on circuit board making |
| CN110856341A (en) * | 2019-11-21 | 2020-02-28 | 颀谱电子科技(南通)有限公司 | Manufacturing process of integrated circuit board |
| CN113382547A (en) * | 2021-06-10 | 2021-09-10 | 安徽熙泰智能科技有限公司 | PCB manufacturing method |
| CN109068497B (en) * | 2018-09-21 | 2024-05-31 | 北京梦之墨科技有限公司 | Liquid metal printer and repair mechanism thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902687A (en) * | 2015-06-18 | 2015-09-09 | 镇江华印电路板有限公司 | Anti-crack printed circuit board |
| CN106211607A (en) * | 2016-07-25 | 2016-12-07 | 苏州福莱盈电子有限公司 | A kind of circuit board manufacture method simply and easily |
| CN106211599A (en) * | 2016-07-25 | 2016-12-07 | 苏州福莱盈电子有限公司 | A kind of method saving material making wiring board |
| CN206226828U (en) * | 2016-12-08 | 2017-06-06 | 厦门大学嘉庚学院 | A kind of PCB single sided boards |
| CN206461842U (en) * | 2017-02-07 | 2017-09-01 | 厦门大学嘉庚学院 | Panel construction for making double-sided PCB board |
-
2018
- 2018-02-05 CN CN201810111853.0A patent/CN108156766A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902687A (en) * | 2015-06-18 | 2015-09-09 | 镇江华印电路板有限公司 | Anti-crack printed circuit board |
| CN106211607A (en) * | 2016-07-25 | 2016-12-07 | 苏州福莱盈电子有限公司 | A kind of circuit board manufacture method simply and easily |
| CN106211599A (en) * | 2016-07-25 | 2016-12-07 | 苏州福莱盈电子有限公司 | A kind of method saving material making wiring board |
| CN206226828U (en) * | 2016-12-08 | 2017-06-06 | 厦门大学嘉庚学院 | A kind of PCB single sided boards |
| CN206461842U (en) * | 2017-02-07 | 2017-09-01 | 厦门大学嘉庚学院 | Panel construction for making double-sided PCB board |
Non-Patent Citations (2)
| Title |
|---|
| 秦虹，万志平: "《电子CAD技术》", 31 May 2012, 浙江大学出版社 * |
| 裴新军: "利用热转印纸制作线路板（PCB）", 《电子报》 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109068497A (en) * | 2018-09-21 | 2018-12-21 | 北京梦之墨科技有限公司 | A kind of liquid metal printer and its repair mechanism |
| CN109068497B (en) * | 2018-09-21 | 2024-05-31 | 北京梦之墨科技有限公司 | Liquid metal printer and repair mechanism thereof |
| CN109168267A (en) * | 2018-10-25 | 2019-01-08 | 铜陵市超远科技有限公司 | A kind of high-frequency microwave copper-clad plate etch process |
| CN109298048A (en) * | 2018-11-13 | 2019-02-01 | 海南大学 | A kind of copper-based sensor chip and preparation method thereof and detection method |
| CN110225668A (en) * | 2019-06-14 | 2019-09-10 | 大连亚太电子有限公司 | A kind of route transfer method based on circuit board making |
| CN110856341A (en) * | 2019-11-21 | 2020-02-28 | 颀谱电子科技(南通)有限公司 | Manufacturing process of integrated circuit board |
| CN113382547A (en) * | 2021-06-10 | 2021-09-10 | 安徽熙泰智能科技有限公司 | PCB manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108156766A (en) | A kind of quick Fabrication technique of single-sided printed board | |
| CN106231816A (en) | A kind of manufacture method of golden fingerboard without lead wire | |
| CN105792545B (en) | Pcb board half bore moulding process | |
| CN110099507A (en) | Thick copper circuit board and its manufacturing method | |
| CN107484356A (en) | A kind of preparation method of the sandwich aluminium base of thick copper | |
| CN107072048A (en) | A kind of production technology optimization method of single-sided aluminum-base plate | |
| CN104202907B (en) | A kind of UV print processes make the technique that heavy copper electroplates via hole double-sided wiring board | |
| CN107949164A (en) | A kind of circuit substrate coil line etch process with higher rate | |
| CN103140059B (en) | There is the working method of the multilayer circuit board of blind hole | |
| CN105792521B (en) | Pcb board pad Compensation Design technique and its application | |
| CN109413881B (en) | Manufacturing method of carbon oil circuit board and solder-mask windowing | |
| CN104507257A (en) | Printed circuit board (PCB) molding method | |
| CN107241867B (en) | Occurs the process of plating folder film when a kind of reduction alkali etching | |
| CN108668440A (en) | A kind of bad reworking method of circuit board finished product welding resistance consent | |
| CN108040438A (en) | A kind of manufacture craft of circuit board metallization half bore | |
| CN106793534A (en) | Circuit board steel mesh printing process | |
| CN104093277A (en) | Method for improving cutter breaking condition in hole drilling process of thick copper plate | |
| CN105228357B (en) | A kind of preparation method of ladder wiring board | |
| CN105120597A (en) | Method for manufacturing printed circuit board | |
| CN109511225A (en) | A kind of semi-metal hole Wiring board processing method | |
| CN107222975A (en) | A kind of gradation etches the pattern-producing method of thick metal plated micro-strip plate | |
| CN104854684B (en) | Composition and method for manufacturing passivating back solar cell | |
| CN105704947A (en) | Forming process of burr-free printed circuit board (PCB) | |
| CN109862701A (en) | A kind of short method scrapped in reduction pcb board | |
| CN110831345A (en) | Printing method of thick copper plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180612 |
|
| RJ01 | Rejection of invention patent application after publication |