CN105792545B - Pcb board half bore moulding process - Google Patents
Pcb board half bore moulding process Download PDFInfo
- Publication number
- CN105792545B CN105792545B CN201610176935.4A CN201610176935A CN105792545B CN 105792545 B CN105792545 B CN 105792545B CN 201610176935 A CN201610176935 A CN 201610176935A CN 105792545 B CN105792545 B CN 105792545B
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- Prior art keywords
- hole
- plated
- half bore
- circuit board
- boring
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0221—Perforating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention belongs to printed circuit board manufacturing technology fields, are related to a kind of pcb board half bore moulding process, and step successively includes boring plated-through-hole, boring pilot hole, bore disconnection hole and mill flat.Subdrilling pilot hole of the present invention is expanded as disconnecting hole again, avoids material shifts deformation, does not increase number of process steps, but Burr Problem has also obtained very good solution, improve the qualification rate of circuit boring；Machine path reduces about half again simultaneously, plays the role of saving processing step, improves production efficiency.
Description
Technical field
The present invention relates to printed circuit board manufacturing technology field, in particular to a kind of half hole forming work of the pcb board that yield is high
Skill.
Background technique
Half bore is made of cutting half on the basis of plated-through-hole, positioned at the edges of boards of printed circuit board, both to have remained original plating
The conducting function of through-hole, and capable of being welded and fixed using half bore hole wall realizes the not only easy but also high-strength of plate and plate or part
The fixation of degree, using than wide.
Traditional half-pore plate manufacture craft are as follows: film → etching → welding resistance → surface coating is moved back in image transfer → graphic plating →
→ half bore forms simultaneously with shape.This half bore is that round plated-through-hole is disposably directly cut half after the molding of round plated-through-hole
It forms, since the ductility of copper in hole is preferable, along with what is generated under machine cut pulls, if not being pocessed properly, holds very much
Easily there is the phenomenon that half bore copper wire residual and copper sheet tilting, i.e., so-called half bore Burr Problem influences half bore function, so as to cause
Properties of product and yield decline, and then make increased costs.
In order to avoid the appearance of half hole bur, following 3 kinds of methods are primarily present in prior art:
1. first method is first to carry out ink plugging after circular hole plating, half bore is then milled, then stripping.This side
Method is supported on the inside of copper facing by ink, so section can be reduced the generation of half hole bur when milling half bore；However this method increase 2
Process, increases ink cost, and ink viscosity is variable to cause half hole bur effect unstable again, so practical application and paying no attention to
Think.
2. second method is processed by the way of the milling cutter again reversed turnning and milling, this method makees half bore in column
More convenient operation for industry；But due to forming path doubles, greatly prolong the time for milling half bore, cost, friendship phase all do not have
It is competitive.
3. the third method is to be easy to produce half bore hair by the method for drilling out an empty tool bore in through-hole side to remove
The material for piercing side is just less prone to half hole bur (with reference to Chinese patent CN101152674 " shape when milling flat again in this way
Processing method ").But this method Shortcomings again in actual operation: plated-through-hole locally intersects with empty tool bore, is boring sky tool bore
When, plated-through-hole will affect the deformation of material, then causes sky tool bore position inaccurate, leads to the problem of new.
Therefore, it is necessary to provide the new method of one kind to solve the above problems.
Summary of the invention
The main purpose of the present invention is to provide a kind of pcb board half bore moulding process that yield is high.
The present invention is achieved through the following technical solutions above-mentioned purpose: a kind of pcb board half bore moulding process, step are successively wrapped
It includes:
1. boring plated-through-hole: removing region in circuit board and retain the plating drilled out on boundary between region for forming half bore and lead to
Hole；
2. boring pilot hole: drilled out in circuit board removal region with the plated-through-hole mutually from pilot hole；
Hole is disconnected 3. boring: the disconnection hole intersected with the plated-through-hole, institute are expanded on the basis of the pilot hole
It states disconnection hole and the boundary is tangent；
4. milling is flat: region mill off will be removed along the boundary, the plated-through-hole is shaped to half bore.
Specifically, the guiding bore dia D1 is the 70% of plated-through-hole diameter D.
Further, the disconnection bore dia D2 is 10mil bigger than plated-through-hole D diameter.
Specifically, the brill plated-through-hole is completed under the same drilling processing procedure with pilot hole is bored.
Further, the drill bit for boring plated-through-hole, which drills through, bores the drill bit of pilot hole after circuit board and drills through circuit board again.
By adopting the above technical scheme, the beneficial effect of technical solution of the present invention is:
1, subdrilling pilot hole of the present invention is expanded as disconnecting hole again, avoids material shifts deformation, does not increase processing step
Number, but Burr Problem has also obtained very good solution, improves the qualification rate of circuit boring；
2, about half is reduced in machining path, plays the role of saving processing step, improves production efficiency；
3, plated-through-hole and pilot hole are drilled out in same step, and step is less, and working efficiency further increases；
4, plated-through-hole and pilot hole successively drill out in same step, that is, ensure that the position precision of plated-through-hole, and can prevent
Only circuit board stress excessively breaks.
Detailed description of the invention
Fig. 1 is the flow chart of this process example 1；
Fig. 2 is the circuit board localized variation schematic diagram for boring pilot hole step；
Fig. 3 is the circuit board localized variation schematic diagram for boring disconnected opening step；
Fig. 4 is the circuit board localized variation schematic diagram for milling flat step；
Fig. 5 is the flow chart of this process example 2；
Fig. 6 is the operation chart of drilling processing procedure in embodiment 3；
Fig. 7 is Customer design partial schematic diagram；
Fig. 8 is that prior art CAM egative film designs partial schematic diagram；
Fig. 9 is that this technique CAM egative film designs partial schematic diagram.
Digital representation in figure:
1- circuit board, 11- remove region, and 12- retains region, the boundary 1a-；
2a- plated-through-hole, 2b- half bore；
3a- pilot hole, 3b- disconnect hole；
4- copper film, 41- route, 41a- line boundary, 42- pad；
5- soldermask layer, 51- windowing, 51a- windowing boundary；
61,62- spur location；
71- plated-through-hole drill bit, 72- guide drill.
Specific embodiment
Invention is further described in detail combined with specific embodiments below.
Embodiment 1
As shown in Figure 1, a kind of pcb board half bore moulding process, step successively include:
1. negative film making: being designed according to the CAM that original design figure carries out route egative film and solder prevention bottom plate, wherein CAM is designed
The diameter of the line width of route 10%, CAM design solder mask window wider than original design figure is bigger than original design figure by 20%, while CAM
The solder prevention bottom plate image of design compensates design, such as Fig. 8 to the anti-welding lap of route-for being greater than 42 range of pad；
2. boring plated-through-hole 2a: being removed in circuit board and drill out diameter between region 11 and reservation region 12 on the 1a of boundary as D's
Plated-through-hole 2a；
3. bore pilot hole 3a: circuit board 1 remove region 11 in drill out with plated-through-hole 2a phase from pilot hole 3a, pilot hole
3a diameter D1=0.7D, such as Fig. 2；
4. plating: plating copper film 4 in circuit board surface；
5. route transfers: exposure ink is coated on circuit boards, and route film image is transferred on copper-plated circuit board,
Exposure, removes unhardened exposure ink；
Hole 3b is disconnected 6. boring: being expanded into the disconnection hole 3b intersected with plated-through-hole 2a on the basis of pilot hole 3a, is broken
Aperture 3b and boundary 1a are tangent, disconnect hole 3b diameter D2=D+10mil, such as Fig. 3；
7. circuit etching 41: the etching of copper film 4 on circuit board 1 being become route 41, wherein the edge plated-through-hole 2a is by copper film 4
Then covering removes exposure ink；
8. solder mask window: plating one layer of soldermask layer 5 again in 1 outer surface of circuit board, solder prevention bottom plate image is transferred to circuit
On plate, exposure removes unhardened soldermask layer 5, forms pad 42 from 41 part of route that the windowing of soldermask layer 5 51 is exposed；
9. text: increasing letter symbol outside soldermask layer 5；
10. milling is flat: 11 mill off of region will be removed along boundary 1a, plated-through-hole 2a is shaped to half bore 2b, such as Fig. 4.
As shown in figure 8, in order to make the big circles such as the presentation of pad 42, since 51 edge of windowing of practical soldermask layer 5 has
Some gradients, so the figure of transfer needs slightly enlarged-area, but 42 size aberration problems of pad in order to prevent, soldermask layer 5
On windowing 51 circle will not all be presented, and it is then right several compensating basins (not marking) to be generated according to the shape of route 41
The shape of solder mask window boundary 51a compensates, and just can be reduced the removal to soldermask layer 5 when solder mask window step in this way
Amount forms irregular windowing boundary 51a figure, but 41 exposed portion of route can be made closer same round.Shape last in this way
At 42 shape of pad it is just relatively unified, when being thus avoided that tin the problems such as rosin joint, short circuit, improve production yield.
As shown in figure 4, the copper product of the side half bore 2b can be eliminated in advance by disconnecting hole 3b, the hole 3b mistake flat with milling is disconnected boring
There is the position that burr is easy to produce at two in journey, wherein spur location 61 is in removal region 11 at one, even if without other
Step can also be milled flat step and be eliminated；Even and if there is burr in another place's spur location 62, by 41 step of circuit etching
After, the reagent that can also be corroded is bitten off.So while not increasing number of process steps, but Burr Problem has also obtained good solution
Certainly, the qualification rate of circuit boring is improved；Machine path reduces about half again simultaneously, plays and saves processing step, mentions
The effect of high efficiency.
As shown in figure 3, disconnecting hole 3b is made of being expanded as pilot hole 3a, because pilot hole 3a makes to disconnect the location hole 3b
Domain material bored it is disconnected, so again reaming when, drill bit is mainly by side turning rather than top pierces, and existing plating is logical at this time
Hole 2a structure would not cause material shifts to deform, so more preferable that realize deburring effect, improve the qualification of circuit boring
Rate.
Embodiment 2
1. negative film making: being designed according to the CAM that original design figure carries out route egative film and solder prevention bottom plate, wherein CAM is designed
The diameter of the line width of route 20%, CAM design solder mask window wider than original design figure is bigger than original design figure by 30%, while CAM
The solder prevention bottom plate image of design compensates design, such as Fig. 9 to the anti-welding lap of route-for being greater than 42 range of pad；
2. drilling: removing region 11 in circuit board and retain the plated-through-hole for drilling out diameter on the 1a of boundary between region 12 as D
2a, at the same circuit board 1 remove region 12 in drill out with plated-through-hole 2a phase from pilot hole 3a, pilot hole 3a diameter D1=
0.7D, such as Fig. 2；
3. plating: plating copper film 4 in circuit board surface；
4. route transfers: exposure ink is coated on circuit boards, and route film image is transferred on copper-plated circuit board,
Exposure, removes unhardened exposure ink；
Hole 3b is disconnected 5. boring: being expanded into the disconnection hole 3b intersected with plated-through-hole 2a on the basis of pilot hole 3a, is broken
Aperture 3b and boundary 1a are tangent, disconnect hole 3b diameter D2=D+10mil, such as Fig. 3；
6. circuit etching 41: the etching of copper film 4 on circuit board 1 being become route 41, wherein the edge plated-through-hole 2a is by copper film 4
Then covering removes exposure ink；
7. solder mask window: plating one layer of soldermask layer 5 again in 1 outer surface of circuit board, solder prevention bottom plate image is transferred to circuit
On plate, exposure removes unhardened soldermask layer 5, forms pad 42 from 41 part of route that the windowing of soldermask layer 5 51 is exposed；
8. text: increasing letter symbol outside soldermask layer 5；
9. milling is flat: 11 mill off of region will be removed along boundary 1a, plated-through-hole 2a is shaped to half bore 2b, such as Fig. 4.
As shown in figure 5, difference from example 1 is that: it bores plated-through-hole 2a step and bores the merging of pilot hole 3a step
For drill process.Pcb board procedure of processing in this way is reduced again, and working efficiency further increases.
Embodiment 3
As shown in fig. 6, with embodiment 2 the difference is that: the drill bit 71 for boring plated-through-hole, which drills through, bores guiding after circuit board 1
The drill bit 72 in hole drills through circuit board 1 again.Because plated-through-hole 2a is the hole that actual needs retains, and pilot hole 3a can be eliminated
Hole needs to drill out one step ahead so plated-through-hole 2a position accuracy demand is higher.Plated-through-hole drill bit 71 drills through circuit board 1 one step ahead
Afterwards, circuit board 1 be able to carry out stress release and reply it is smooth, in this way brill pilot hole 3a when circuit board 1 will not be because of simultaneously
Stress is excessive and breaks.
Above-described is only some embodiments of the present invention.For those of ordinary skill in the art, not
Under the premise of being detached from the invention design, various modifications and improvements can be made, these belong to protection model of the invention
It encloses.
Claims (5)
1. a kind of pcb board half bore moulding process, it is characterised in that step successively includes:
1. boring plated-through-hole: removing region in circuit board and retain the plated-through-hole drilled out on boundary between region for forming half bore；
2. boring pilot hole: drilled out in circuit board removal region with the plated-through-hole mutually from pilot hole；
Hole is disconnected 3. boring: the disconnection hole intersected with the plated-through-hole is expanded on the basis of the pilot hole, it is described disconnected
Aperture and the boundary are tangent；
4. milling is flat: region mill off will be removed along the boundary, the plated-through-hole is shaped to half bore.
2. pcb board half bore moulding process according to claim 1, it is characterised in that: the guiding bore dia D1 is that plating is logical
The 70% of bore dia D.
3. pcb board half bore moulding process according to claim 2, it is characterised in that: the disconnection bore dia D2 ratio plating is logical
The hole big 10mil of D diameter.
4. pcb board half bore moulding process according to claim 1, it is characterised in that: the brill plated-through-hole and brill pilot hole
It is completed under the same drilling processing procedure.
5. pcb board half bore moulding process according to claim 4, it is characterised in that: in the drilling processing procedure, the brill plating
The drill bit of through-hole, which drills through, to be bored the drill bit of pilot hole after circuit board and contacts circuit board again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610176935.4A CN105792545B (en) | 2016-03-25 | 2016-03-25 | Pcb board half bore moulding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610176935.4A CN105792545B (en) | 2016-03-25 | 2016-03-25 | Pcb board half bore moulding process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105792545A CN105792545A (en) | 2016-07-20 |
| CN105792545B true CN105792545B (en) | 2018-12-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610176935.4A Active CN105792545B (en) | 2016-03-25 | 2016-03-25 | Pcb board half bore moulding process |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107613672A (en) * | 2017-09-27 | 2018-01-19 | 生益电子股份有限公司 | A kind of PCB of hole wall selective metallization preparation method and PCB |
| CN107613673A (en) * | 2017-09-27 | 2018-01-19 | 生益电子股份有限公司 | A kind of PCB processing method and PCB |
| CN109462942A (en) * | 2018-12-20 | 2019-03-12 | 东莞市鼎新电路有限公司 | A kind of processing method of pcb board edges of boards PTH half bore |
| CN110121239B (en) * | 2019-04-10 | 2021-06-04 | 江门崇达电路技术有限公司 | Manufacturing method of mechanical blind hole and half hole |
| CN109905980B (en) * | 2019-04-19 | 2021-07-20 | 高德（江苏）电子科技有限公司 | Design process for retaining half-hole on side edge of micro copper-plated hole |
| CN110602878A (en) * | 2019-08-15 | 2019-12-20 | 鹤山市中富兴业电路有限公司 | Direct forming method for metallized semi-hole |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103785876A (en) * | 2014-02-21 | 2014-05-14 | 昆山苏杭电路板有限公司 | Method for drilling high-precision large-aperture hole in printed board |
| CN105290478A (en) * | 2015-10-19 | 2016-02-03 | 深圳崇达多层线路板有限公司 | Manufacturing method for circuit board milling groove |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06291459A (en) * | 1993-04-01 | 1994-10-18 | Nec Corp | Manufacture of printed wiring board |
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2016
- 2016-03-25 CN CN201610176935.4A patent/CN105792545B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103785876A (en) * | 2014-02-21 | 2014-05-14 | 昆山苏杭电路板有限公司 | Method for drilling high-precision large-aperture hole in printed board |
| CN105290478A (en) * | 2015-10-19 | 2016-02-03 | 深圳崇达多层线路板有限公司 | Manufacturing method for circuit board milling groove |
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| CN105792545A (en) | 2016-07-20 |
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