CN105792545B - Pcb board half bore moulding process - Google Patents

Pcb board half bore moulding process Download PDF

Info

Publication number
CN105792545B
CN105792545B CN201610176935.4A CN201610176935A CN105792545B CN 105792545 B CN105792545 B CN 105792545B CN 201610176935 A CN201610176935 A CN 201610176935A CN 105792545 B CN105792545 B CN 105792545B
Authority
CN
China
Prior art keywords
hole
plated
half bore
circuit board
boring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610176935.4A
Other languages
Chinese (zh)
Other versions
CN105792545A (en
Inventor
赖荣祥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAICHENG TECHNOLOGY (KUNSHAN) Co Ltd
Original Assignee
BAICHENG TECHNOLOGY (KUNSHAN) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BAICHENG TECHNOLOGY (KUNSHAN) Co Ltd filed Critical BAICHENG TECHNOLOGY (KUNSHAN) Co Ltd
Priority to CN201610176935.4A priority Critical patent/CN105792545B/en
Publication of CN105792545A publication Critical patent/CN105792545A/en
Application granted granted Critical
Publication of CN105792545B publication Critical patent/CN105792545B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • H05K2201/0919Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0221Perforating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0242Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The invention belongs to printed circuit board manufacturing technology fields, are related to a kind of pcb board half bore moulding process, and step successively includes boring plated-through-hole, boring pilot hole, bore disconnection hole and mill flat.Subdrilling pilot hole of the present invention is expanded as disconnecting hole again, avoids material shifts deformation, does not increase number of process steps, but Burr Problem has also obtained very good solution, improve the qualification rate of circuit boring;Machine path reduces about half again simultaneously, plays the role of saving processing step, improves production efficiency.

Description

Pcb board half bore moulding process
Technical field
The present invention relates to printed circuit board manufacturing technology field, in particular to a kind of half hole forming work of the pcb board that yield is high Skill.
Background technique
Half bore is made of cutting half on the basis of plated-through-hole, positioned at the edges of boards of printed circuit board, both to have remained original plating The conducting function of through-hole, and capable of being welded and fixed using half bore hole wall realizes the not only easy but also high-strength of plate and plate or part The fixation of degree, using than wide.
Traditional half-pore plate manufacture craft are as follows: film → etching → welding resistance → surface coating is moved back in image transfer → graphic plating → → half bore forms simultaneously with shape.This half bore is that round plated-through-hole is disposably directly cut half after the molding of round plated-through-hole It forms, since the ductility of copper in hole is preferable, along with what is generated under machine cut pulls, if not being pocessed properly, holds very much Easily there is the phenomenon that half bore copper wire residual and copper sheet tilting, i.e., so-called half bore Burr Problem influences half bore function, so as to cause Properties of product and yield decline, and then make increased costs.
In order to avoid the appearance of half hole bur, following 3 kinds of methods are primarily present in prior art:
1. first method is first to carry out ink plugging after circular hole plating, half bore is then milled, then stripping.This side Method is supported on the inside of copper facing by ink, so section can be reduced the generation of half hole bur when milling half bore;However this method increase 2 Process, increases ink cost, and ink viscosity is variable to cause half hole bur effect unstable again, so practical application and paying no attention to Think.
2. second method is processed by the way of the milling cutter again reversed turnning and milling, this method makees half bore in column More convenient operation for industry;But due to forming path doubles, greatly prolong the time for milling half bore, cost, friendship phase all do not have It is competitive.
3. the third method is to be easy to produce half bore hair by the method for drilling out an empty tool bore in through-hole side to remove The material for piercing side is just less prone to half hole bur (with reference to Chinese patent CN101152674 " shape when milling flat again in this way Processing method ").But this method Shortcomings again in actual operation: plated-through-hole locally intersects with empty tool bore, is boring sky tool bore When, plated-through-hole will affect the deformation of material, then causes sky tool bore position inaccurate, leads to the problem of new.
Therefore, it is necessary to provide the new method of one kind to solve the above problems.
Summary of the invention
The main purpose of the present invention is to provide a kind of pcb board half bore moulding process that yield is high.
The present invention is achieved through the following technical solutions above-mentioned purpose: a kind of pcb board half bore moulding process, step are successively wrapped It includes:
1. boring plated-through-hole: removing region in circuit board and retain the plating drilled out on boundary between region for forming half bore and lead to Hole;
2. boring pilot hole: drilled out in circuit board removal region with the plated-through-hole mutually from pilot hole;
Hole is disconnected 3. boring: the disconnection hole intersected with the plated-through-hole, institute are expanded on the basis of the pilot hole It states disconnection hole and the boundary is tangent;
4. milling is flat: region mill off will be removed along the boundary, the plated-through-hole is shaped to half bore.
Specifically, the guiding bore dia D1 is the 70% of plated-through-hole diameter D.
Further, the disconnection bore dia D2 is 10mil bigger than plated-through-hole D diameter.
Specifically, the brill plated-through-hole is completed under the same drilling processing procedure with pilot hole is bored.
Further, the drill bit for boring plated-through-hole, which drills through, bores the drill bit of pilot hole after circuit board and drills through circuit board again.
By adopting the above technical scheme, the beneficial effect of technical solution of the present invention is:
1, subdrilling pilot hole of the present invention is expanded as disconnecting hole again, avoids material shifts deformation, does not increase processing step Number, but Burr Problem has also obtained very good solution, improves the qualification rate of circuit boring;
2, about half is reduced in machining path, plays the role of saving processing step, improves production efficiency;
3, plated-through-hole and pilot hole are drilled out in same step, and step is less, and working efficiency further increases;
4, plated-through-hole and pilot hole successively drill out in same step, that is, ensure that the position precision of plated-through-hole, and can prevent Only circuit board stress excessively breaks.
Detailed description of the invention
Fig. 1 is the flow chart of this process example 1;
Fig. 2 is the circuit board localized variation schematic diagram for boring pilot hole step;
Fig. 3 is the circuit board localized variation schematic diagram for boring disconnected opening step;
Fig. 4 is the circuit board localized variation schematic diagram for milling flat step;
Fig. 5 is the flow chart of this process example 2;
Fig. 6 is the operation chart of drilling processing procedure in embodiment 3;
Fig. 7 is Customer design partial schematic diagram;
Fig. 8 is that prior art CAM egative film designs partial schematic diagram;
Fig. 9 is that this technique CAM egative film designs partial schematic diagram.
Digital representation in figure:
1- circuit board, 11- remove region, and 12- retains region, the boundary 1a-;
2a- plated-through-hole, 2b- half bore;
3a- pilot hole, 3b- disconnect hole;
4- copper film, 41- route, 41a- line boundary, 42- pad;
5- soldermask layer, 51- windowing, 51a- windowing boundary;
61,62- spur location;
71- plated-through-hole drill bit, 72- guide drill.
Specific embodiment
Invention is further described in detail combined with specific embodiments below.
Embodiment 1
As shown in Figure 1, a kind of pcb board half bore moulding process, step successively include:
1. negative film making: being designed according to the CAM that original design figure carries out route egative film and solder prevention bottom plate, wherein CAM is designed The diameter of the line width of route 10%, CAM design solder mask window wider than original design figure is bigger than original design figure by 20%, while CAM The solder prevention bottom plate image of design compensates design, such as Fig. 8 to the anti-welding lap of route-for being greater than 42 range of pad;
2. boring plated-through-hole 2a: being removed in circuit board and drill out diameter between region 11 and reservation region 12 on the 1a of boundary as D's Plated-through-hole 2a;
3. bore pilot hole 3a: circuit board 1 remove region 11 in drill out with plated-through-hole 2a phase from pilot hole 3a, pilot hole 3a diameter D1=0.7D, such as Fig. 2;
4. plating: plating copper film 4 in circuit board surface;
5. route transfers: exposure ink is coated on circuit boards, and route film image is transferred on copper-plated circuit board, Exposure, removes unhardened exposure ink;
Hole 3b is disconnected 6. boring: being expanded into the disconnection hole 3b intersected with plated-through-hole 2a on the basis of pilot hole 3a, is broken Aperture 3b and boundary 1a are tangent, disconnect hole 3b diameter D2=D+10mil, such as Fig. 3;
7. circuit etching 41: the etching of copper film 4 on circuit board 1 being become route 41, wherein the edge plated-through-hole 2a is by copper film 4 Then covering removes exposure ink;
8. solder mask window: plating one layer of soldermask layer 5 again in 1 outer surface of circuit board, solder prevention bottom plate image is transferred to circuit On plate, exposure removes unhardened soldermask layer 5, forms pad 42 from 41 part of route that the windowing of soldermask layer 5 51 is exposed;
9. text: increasing letter symbol outside soldermask layer 5;
10. milling is flat: 11 mill off of region will be removed along boundary 1a, plated-through-hole 2a is shaped to half bore 2b, such as Fig. 4.
As shown in figure 8, in order to make the big circles such as the presentation of pad 42, since 51 edge of windowing of practical soldermask layer 5 has Some gradients, so the figure of transfer needs slightly enlarged-area, but 42 size aberration problems of pad in order to prevent, soldermask layer 5 On windowing 51 circle will not all be presented, and it is then right several compensating basins (not marking) to be generated according to the shape of route 41 The shape of solder mask window boundary 51a compensates, and just can be reduced the removal to soldermask layer 5 when solder mask window step in this way Amount forms irregular windowing boundary 51a figure, but 41 exposed portion of route can be made closer same round.Shape last in this way At 42 shape of pad it is just relatively unified, when being thus avoided that tin the problems such as rosin joint, short circuit, improve production yield.
As shown in figure 4, the copper product of the side half bore 2b can be eliminated in advance by disconnecting hole 3b, the hole 3b mistake flat with milling is disconnected boring There is the position that burr is easy to produce at two in journey, wherein spur location 61 is in removal region 11 at one, even if without other Step can also be milled flat step and be eliminated;Even and if there is burr in another place's spur location 62, by 41 step of circuit etching After, the reagent that can also be corroded is bitten off.So while not increasing number of process steps, but Burr Problem has also obtained good solution Certainly, the qualification rate of circuit boring is improved;Machine path reduces about half again simultaneously, plays and saves processing step, mentions The effect of high efficiency.
As shown in figure 3, disconnecting hole 3b is made of being expanded as pilot hole 3a, because pilot hole 3a makes to disconnect the location hole 3b Domain material bored it is disconnected, so again reaming when, drill bit is mainly by side turning rather than top pierces, and existing plating is logical at this time Hole 2a structure would not cause material shifts to deform, so more preferable that realize deburring effect, improve the qualification of circuit boring Rate.
Embodiment 2
1. negative film making: being designed according to the CAM that original design figure carries out route egative film and solder prevention bottom plate, wherein CAM is designed The diameter of the line width of route 20%, CAM design solder mask window wider than original design figure is bigger than original design figure by 30%, while CAM The solder prevention bottom plate image of design compensates design, such as Fig. 9 to the anti-welding lap of route-for being greater than 42 range of pad;
2. drilling: removing region 11 in circuit board and retain the plated-through-hole for drilling out diameter on the 1a of boundary between region 12 as D 2a, at the same circuit board 1 remove region 12 in drill out with plated-through-hole 2a phase from pilot hole 3a, pilot hole 3a diameter D1= 0.7D, such as Fig. 2;
3. plating: plating copper film 4 in circuit board surface;
4. route transfers: exposure ink is coated on circuit boards, and route film image is transferred on copper-plated circuit board, Exposure, removes unhardened exposure ink;
Hole 3b is disconnected 5. boring: being expanded into the disconnection hole 3b intersected with plated-through-hole 2a on the basis of pilot hole 3a, is broken Aperture 3b and boundary 1a are tangent, disconnect hole 3b diameter D2=D+10mil, such as Fig. 3;
6. circuit etching 41: the etching of copper film 4 on circuit board 1 being become route 41, wherein the edge plated-through-hole 2a is by copper film 4 Then covering removes exposure ink;
7. solder mask window: plating one layer of soldermask layer 5 again in 1 outer surface of circuit board, solder prevention bottom plate image is transferred to circuit On plate, exposure removes unhardened soldermask layer 5, forms pad 42 from 41 part of route that the windowing of soldermask layer 5 51 is exposed;
8. text: increasing letter symbol outside soldermask layer 5;
9. milling is flat: 11 mill off of region will be removed along boundary 1a, plated-through-hole 2a is shaped to half bore 2b, such as Fig. 4.
As shown in figure 5, difference from example 1 is that: it bores plated-through-hole 2a step and bores the merging of pilot hole 3a step For drill process.Pcb board procedure of processing in this way is reduced again, and working efficiency further increases.
Embodiment 3
As shown in fig. 6, with embodiment 2 the difference is that: the drill bit 71 for boring plated-through-hole, which drills through, bores guiding after circuit board 1 The drill bit 72 in hole drills through circuit board 1 again.Because plated-through-hole 2a is the hole that actual needs retains, and pilot hole 3a can be eliminated Hole needs to drill out one step ahead so plated-through-hole 2a position accuracy demand is higher.Plated-through-hole drill bit 71 drills through circuit board 1 one step ahead Afterwards, circuit board 1 be able to carry out stress release and reply it is smooth, in this way brill pilot hole 3a when circuit board 1 will not be because of simultaneously Stress is excessive and breaks.
Above-described is only some embodiments of the present invention.For those of ordinary skill in the art, not Under the premise of being detached from the invention design, various modifications and improvements can be made, these belong to protection model of the invention It encloses.

Claims (5)

1. a kind of pcb board half bore moulding process, it is characterised in that step successively includes:
1. boring plated-through-hole: removing region in circuit board and retain the plated-through-hole drilled out on boundary between region for forming half bore;
2. boring pilot hole: drilled out in circuit board removal region with the plated-through-hole mutually from pilot hole;
Hole is disconnected 3. boring: the disconnection hole intersected with the plated-through-hole is expanded on the basis of the pilot hole, it is described disconnected Aperture and the boundary are tangent;
4. milling is flat: region mill off will be removed along the boundary, the plated-through-hole is shaped to half bore.
2. pcb board half bore moulding process according to claim 1, it is characterised in that: the guiding bore dia D1 is that plating is logical The 70% of bore dia D.
3. pcb board half bore moulding process according to claim 2, it is characterised in that: the disconnection bore dia D2 ratio plating is logical The hole big 10mil of D diameter.
4. pcb board half bore moulding process according to claim 1, it is characterised in that: the brill plated-through-hole and brill pilot hole It is completed under the same drilling processing procedure.
5. pcb board half bore moulding process according to claim 4, it is characterised in that: in the drilling processing procedure, the brill plating The drill bit of through-hole, which drills through, to be bored the drill bit of pilot hole after circuit board and contacts circuit board again.
CN201610176935.4A 2016-03-25 2016-03-25 Pcb board half bore moulding process Active CN105792545B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610176935.4A CN105792545B (en) 2016-03-25 2016-03-25 Pcb board half bore moulding process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610176935.4A CN105792545B (en) 2016-03-25 2016-03-25 Pcb board half bore moulding process

Publications (2)

Publication Number Publication Date
CN105792545A CN105792545A (en) 2016-07-20
CN105792545B true CN105792545B (en) 2018-12-04

Family

ID=56390863

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610176935.4A Active CN105792545B (en) 2016-03-25 2016-03-25 Pcb board half bore moulding process

Country Status (1)

Country Link
CN (1) CN105792545B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107613673A (en) * 2017-09-27 2018-01-19 生益电子股份有限公司 A kind of PCB processing method and PCB
CN107613672A (en) * 2017-09-27 2018-01-19 生益电子股份有限公司 A kind of PCB of hole wall selective metallization preparation method and PCB
CN109462942A (en) * 2018-12-20 2019-03-12 东莞市鼎新电路有限公司 A kind of processing method of pcb board edges of boards PTH half bore
CN110121239B (en) * 2019-04-10 2021-06-04 江门崇达电路技术有限公司 Manufacturing method of mechanical blind hole and half hole
CN109905980B (en) * 2019-04-19 2021-07-20 高德(江苏)电子科技有限公司 Design process for retaining half-hole on side edge of micro copper-plated hole
CN110602878A (en) * 2019-08-15 2019-12-20 鹤山市中富兴业电路有限公司 Direct forming method for metallized semi-hole

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103785876A (en) * 2014-02-21 2014-05-14 昆山苏杭电路板有限公司 Method for drilling high-precision large-aperture hole in printed board
CN105290478A (en) * 2015-10-19 2016-02-03 深圳崇达多层线路板有限公司 Manufacturing method for circuit board milling groove

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06291459A (en) * 1993-04-01 1994-10-18 Nec Corp Manufacture of printed wiring board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103785876A (en) * 2014-02-21 2014-05-14 昆山苏杭电路板有限公司 Method for drilling high-precision large-aperture hole in printed board
CN105290478A (en) * 2015-10-19 2016-02-03 深圳崇达多层线路板有限公司 Manufacturing method for circuit board milling groove

Also Published As

Publication number Publication date
CN105792545A (en) 2016-07-20

Similar Documents

Publication Publication Date Title
CN105792545B (en) Pcb board half bore moulding process
CN105792521B (en) Pcb board pad Compensation Design technique and its application
CN101695218B (en) Method for manufacturing printed circuit board with half-edge hole
WO2015014051A1 (en) Manufacturing method for back drilling hole in pcb and pcb
CN104717845A (en) Technological method for outer layer circuit board resin hole plugging of multi-layer circuit board
CN103687312A (en) Gold-plated circuit board manufacturing method
CN104918422A (en) Method for manufacturing semi-metallized hole of printed circuit board
CN104185377A (en) Fine-line PCB manufacturing method
CN108770209A (en) The forming method of printed wiring board profiled holes
CN105704947A (en) Forming process of burr-free printed circuit board (PCB)
CN107580419A (en) A kind of preparation method of printed substrate metallized semi-pore
CN109168265A (en) A kind of high-frequency microwave plate high density interconnection board manufacturing method
CN104936386B (en) The production method in printed circuit board semi-metal hole
CN111010802A (en) L-shaped groove hole machining method based on PCB
CN106231821A (en) A kind of four layers of pcb board processing technology
CN112333920A (en) Method for solving burrs of intersecting grooves
CN114227150B (en) Preparation process of gold finger electric gold and chemical gold copper-based circuit board
CN108200725A (en) It is a kind of to improve the boring method for pulling internal layer copper
CN105682363B (en) A kind of production method of the PCB of edges of boards metallization
CN104684277A (en) Method for manufacturing gold fingers of printed circuit board
CN111867278A (en) PCB semi-metallized hole machining process
CN201586776U (en) Processing cutting tool structure of printed circuit board
CN104349577A (en) Double-face crimping backboard and hole drilling method thereof
CN206442596U (en) Print aeroscopic plate
CN203484717U (en) Micro drill for processing of halogen-free plates and thick copper plates

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant