CN104936386B - The production method in printed circuit board semi-metal hole - Google Patents
The production method in printed circuit board semi-metal hole Download PDFInfo
- Publication number
- CN104936386B CN104936386B CN201510264030.8A CN201510264030A CN104936386B CN 104936386 B CN104936386 B CN 104936386B CN 201510264030 A CN201510264030 A CN 201510264030A CN 104936386 B CN104936386 B CN 104936386B
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- Prior art keywords
- hole
- semi
- pcb board
- metal
- cut
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention provides a kind of production method in printed circuit board semi-metal hole, includes the following steps：Intend being molded the precalculated position drilling in semi-metal hole in pcb board part, form the hole to be cut position in semi-metal hole, and the heavy copper in the hole position to be cut；Pattern transfer, graphic plating are carried out to the pcb board part, film, alkali etching is moved back, moves back tin, photosensitive solder resist；The pcb board part front is placed, a through-hole is bored using gong knife is each at the left and right both ends of the hole position to be cut；The pcb board part reverse side is placed, is placed under repair using gong knife to the burr of the through-hole.The production method in printed circuit board semi-metal hole provided by the invention is respectively added by using gong knife at the left and right both ends of the hole to be cut in semi-metal hole position bores a through-hole, then plate face is overturn again the burr of the through-hole places under repair using gong knife, efficiently solve the problems, such as that copper wire, burr residual occur for semi-metal hole hole wall, so as to be conducive to improve PCB product quality.
Description
Technical field
The present invention relates to wiring board manufacturing technology fields, particularly, are related to a kind of printed circuit board (Printed
Circuit Board, PCB) semi-metal hole production method.
Background technology
So-called semi-metal hole refers to the design that half of plated through-hole is only stayed on PCB trim lines more, and the other half is being molded
Fallen during processing by gong.This design is chiefly used on power panel, individual consumer's goods or backboard.During welding processing, semi-metal hole
A mating surface of the side as crimping is a daughter board as motherboard, the semi-metal hole of daughter board and mother in most cases
The pin of plate or component is welded together to enhance welding performance.Using traditional semi-metal hole production method, often occur
Phenomena such as copper wire, burr residual occurs for semi-metal hole hole wall, and remaining copper wire, burr will lead to leg not in semi-metal hole
Jail, rosin joint or even bridge joint short circuit problem.
Invention content
Copper wire occurs, drapes over one's shoulders in order to solve the above technical problems, the present invention provides a kind of semi-metal hole hole wall that can effectively solve
The production method in the printed circuit board semi-metal hole of cutting edge of a knife or a sword residue problem.
A kind of production method in printed circuit board semi-metal hole, includes the following steps：
Intend the precalculated position drilling in molding semi-metal hole in pcb board part, form the hole to be cut position in semi-metal hole, and
The heavy copper in the hole position to be cut；
Pattern transfer, graphic plating are carried out to the pcb board part, film, alkali etching is moved back, moves back tin, photosensitive solder resist；
The pcb board part front is placed, using gong knife, each brill one is logical at the left and right both ends of the hole position to be cut
Hole；
The pcb board part reverse side is placed, is placed under repair using gong knife to the burr of the through-hole.
As being further improved for the above embodiment, the pcb board part is formed line and is divided into graph area and garbage area,
The through-hole is located at the garbage area of the pcb board part.
As being further improved for the above embodiment, repair the diameter of gong knife used in burr is made less than holes drilled through
The diameter of gong knife.
As being further improved for the above embodiment, the pcb board part reverse side is placed, using gong knife to the through-hole
Burr the step of placing under repair including use respectively the gong knife of diameter 0.8mm and diameter 0.5mm to the burr of the through-hole into
Row is repaired.
As being further improved for the above embodiment, the feed speed of the gong knife of the diameter 0.80mm and diameter 0.50mm
It spends for 0.1-0.5m/min, lamination the piece number is 1/gong.
As being further improved for the above embodiment, the pcb board part reverse side is placed, using gong knife to the through-hole
Burr the step of placing under repair after further include the pcb board part is surface-treated, character printing and gong shape.
As being further improved for the above embodiment, the semi-metal hole includes half-round metal hole and U-shaped gold
Categoryization hole.
As being further improved for the above embodiment, the Kong Weiwei circular holes to be cut.
Compared to the prior art, the production method in printed circuit board semi-metal hole provided by the invention is by using gong knife
Respectively add at the left and right both ends of the hole to be cut in semi-metal hole position and bore a through-hole, then overturn plate face again and use gong knife by institute
The burr for stating through-hole places under repair, and efficiently solve the problems, such ass that copper wire, burr residual occur for semi-metal hole hole wall, so as to have
Conducive to improvement PCB product quality.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing, wherein：
Fig. 1 is the flow diagram of the production method in printed circuit board semi-metal hole provided by the invention；
Fig. 2 is preferred embodiment of the present invention semi-metal hole forming schematic diagram.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only the part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained all other without making creative work
Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, it is the flow diagram of the production method in printed circuit board semi-metal hole provided by the invention.Institute
The production method for stating printed circuit board semi-metal hole includes the following steps：
Step S1 intends the precalculated position drilling in molding semi-metal hole in pcb board part, forms the to be cut of semi-metal hole
Kong Wei, and the heavy copper in the hole position to be cut；
As shown in Fig. 2, the pcb board part, which is formed line, is divided into graph area and garbage area, the Kong Weiyi portions to be cut
Divide and be located at graph area, another part is located at garbage area.The hole position to be cut is usually circular hole.
Step S2 carries out the pcb board part pattern transfer, graphic plating, moves back film, alkali etching, moves back tin, photosensitive resistance
Weldering；
Include carrying out copper facing and wicking to the pcb board part, and make copper and tin in the pcb board part in graphic plating process
Uniform throughout deposits, and tin layers can protect the copper that need to retain in alkali etching, tin layers are peeled off again after alkali etching, exposes
Required line pattern.
Step S3 places the pcb board part front, each at the left and right both ends of the hole position to be cut using gong knife
Bore a through-hole；
In this step, the gong knife carries out feed along the direction of form wire, respectively in the left and right of the hole position to be cut
One through-hole of each brill at ends A, B, and the through-hole is located at the garbage area of the pcb board part.Since gong knife is usually all by up time
Needle direction rotates, and when boring the through-hole at left end A, chip removal can generate a small amount of burr into hole, is boring the through-hole at right end B
When, outside hole, the burr that will not generate burr or generation is few for chip removal.It is in addition, small in gong knife diameter used in the step
In the diameter for boring cutting element used in the hole to be cut position in semi-metal hole, in other words, the diameter of the through-hole is less than
The diameter of the hole position to be cut.
The pcb board part reverse side is placed, is placed under repair using gong knife to the burr of the through-hole by step S4；
In this step, the gong knife of different-diameter can be used repeatedly to repair the burr of the through-hole, with thorough
Eliminate burr.Preferably, it is placed under repair first using the gong knife of diameter 0.8mm to the burr of the through-hole, reuses diameter
The gong knife of 0.5mm places under repair to the burr of the through-hole, and the feeding speed of gong knife is slow, is normally controlled in 0.1-0.5m/
Min, in order to avoid breaking, lamination the piece number is 1/gong.Moreover, it does not need to all repair whole burrs in the through-hole
Reason need to be only repaired in the through-hole close to the burr of graph area side.In addition, repair the diameter of gong knife used in burr
It is less than the diameter of gong knife used in holes drilled through.
Step S5 is surface-treated the pcb board part, character printing and gong shape.
Using the production method in printed circuit board semi-metal hole described above, half-round metal hole can be both made,
U-shaped plated through-hole can also be made.
Compared to the prior art, the production method in printed circuit board semi-metal hole provided by the invention is by using gong knife
Respectively add at the left and right both ends of the hole to be cut in semi-metal hole position and bore a through-hole, then overturn plate face again and use gong knife by institute
The burr for stating through-hole places under repair, and efficiently solve the problems, such ass that copper wire, burr residual occur for semi-metal hole hole wall, so as to have
Conducive to improvement PCB product quality.
The foregoing is merely the embodiment of the present invention, are not intended to limit the scope of the invention, every to utilize this hair
The equivalent structure or equivalent flow shift that bright description is made directly or indirectly is used in other relevant technology necks
Domain is included within the scope of the present invention.
Claims (5)
1. a kind of production method in printed circuit board semi-metal hole, which is characterized in that include the following steps：
Intend the precalculated position drilling in molding semi-metal hole in pcb board part, form the hole to be cut position in semi-metal hole, and in institute
State heavy copper in hole position to be cut；
Pattern transfer, graphic plating are carried out to the pcb board part, film, alkali etching is moved back, moves back tin, photosensitive solder resist；
The pcb board part front is placed, a through-hole, institute are bored using gong knife is each at the left and right both ends of the hole position to be cut
The diameter for stating through-hole is less than the diameter of the hole position to be cut；
The pcb board part reverse side is placed, is placed under repair using gong knife to the burr of the through-hole, specifically, respectively using straight
The gong knife of diameter 0.8mm and diameter 0.5mm places under repair to the burr of the through-hole, the diameter 0.80mm and diameter 0.50mm's
The feeding speed of gong knife is 0.1~0.5m/min, and lamination the piece number is 1/gong；
The pcb board part is formed line and is divided into graph area and garbage area, and the through-hole is located at the garbage area of the pcb board part.
2. the production method in printed circuit board semi-metal hole according to claim 1, which is characterized in that repair burr institute
The diameter of gong knife used is less than the diameter of gong knife used in holes drilled through.
3. the production method in printed circuit board semi-metal hole according to claim 1, which is characterized in that by the PCB
Plate reverse side is placed, further included after the step of being placed under repair using gong knife to the burr of the through-hole to the pcb board part into
Row surface treatment, character printing and gong shape.
4. the production method in printed circuit board semi-metal hole according to claim 1, which is characterized in that the semimetal
Change hole and include half-round metal hole and U-shaped plated through-hole.
5. the production method in printed circuit board semi-metal hole according to claim 1, which is characterized in that described to be cut
Kong Weiwei circular holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510264030.8A CN104936386B (en) | 2015-05-20 | 2015-05-20 | The production method in printed circuit board semi-metal hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510264030.8A CN104936386B (en) | 2015-05-20 | 2015-05-20 | The production method in printed circuit board semi-metal hole |
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| Publication Number | Publication Date |
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| CN104936386A CN104936386A (en) | 2015-09-23 |
| CN104936386B true CN104936386B (en) | 2018-07-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510264030.8A Active CN104936386B (en) | 2015-05-20 | 2015-05-20 | The production method in printed circuit board semi-metal hole |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106696475B (en) * | 2015-11-13 | 2019-06-18 | 富泰华工业（深圳）有限公司 | Printer and the method for utilizing printer printed circuit board |
| CN111712041A (en) * | 2020-06-02 | 2020-09-25 | 昆山飞繁电子有限公司 | Circuit board half-hole machining process |
| CN112312664B (en) * | 2020-10-28 | 2021-12-07 | 惠州市特创电子科技股份有限公司 | Circuit board and manufacturing method thereof |
| CN112752437B (en) * | 2020-12-11 | 2022-07-12 | 深圳市景旺电子股份有限公司 | Forming method of metallized semi-hole and PCB |
| CN112969312B (en) * | 2021-01-27 | 2022-07-05 | 江西红板科技股份有限公司 | PCB metallized half-hole processing technology |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244979A (en) * | 2010-05-12 | 2011-11-16 | 柏承科技(昆山)股份有限公司 | Half-hole processing mirror image manufacturing method of printed circuit board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07183658A (en) * | 1993-12-22 | 1995-07-21 | Toppan Printing Co Ltd | Forming method for side through hole of printed circuit board |
| CN101977481B (en) * | 2010-10-29 | 2012-02-29 | 东莞红板多层线路板有限公司 | Method for removing semi-metalized hole flash by back drilling |
| CN102970834A (en) * | 2011-09-02 | 2013-03-13 | 悦虎电路(苏州)有限公司 | Method for fabricating circuit board metallized half hole |
| CN103179805A (en) * | 2011-12-21 | 2013-06-26 | 珠海方正科技多层电路板有限公司 | Metal half hole molding method and manufacture method of printed circuit board |
-
2015
- 2015-05-20 CN CN201510264030.8A patent/CN104936386B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244979A (en) * | 2010-05-12 | 2011-11-16 | 柏承科技(昆山)股份有限公司 | Half-hole processing mirror image manufacturing method of printed circuit board |
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| CN104936386A (en) | 2015-09-23 |
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