CN102883536A - Processing method of through holes of printed circuit board (PCB) and through hole structure - Google Patents
Processing method of through holes of printed circuit board (PCB) and through hole structure Download PDFInfo
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- CN102883536A CN102883536A CN2012103794329A CN201210379432A CN102883536A CN 102883536 A CN102883536 A CN 102883536A CN 2012103794329 A CN2012103794329 A CN 2012103794329A CN 201210379432 A CN201210379432 A CN 201210379432A CN 102883536 A CN102883536 A CN 102883536A
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Abstract
The invention discloses a processing method of through holes of a printed circuit board (PCB) and a through hole structure. The method and the structure aim at resolving the problem in the existing scheme that high speed signal quality in the PCB is affected by larger parasitic capacitance generated in the through holes after press connection devices are pressed mutually in the through holes of the PCB. By means of the method, the through hole structure of the PCB is modified and is processed into a 'dumbbell'-shaped structure. Therefore, the generated parasitic capacitance is very small after the press connection devices are mutually pressed on the PCB due to the fact that vacancy hole diameter between press connection pins is much smaller than that of the through holes in the existing scheme, and signal quality of the PCB is improved. The processing method of the 'dumbbell'-shaped through hole structure is further provided.
Description
Technical field
The present invention relates to communication technical field, relate in particular to a kind of pcb board processing method of through holes and through-hole structure that improves signal quality.
Background technology
More and more higher along with individual layer pcb board signal rate, signal can produce parasitic capacitance when the metal throuth hole that forms by pcb board.And the aperture of metal throuth hole is larger, and the parasitic capacitance of generation is larger.For high speed signal, the existence of parasitic capacitance is with the rising time of delay signal, if situation is more abominable, it is serious then can to cause crosstalking, and the signal transmission can't continue.
Use more and more extensive by the technology that crimping is electrically connected electronic devices and components and pcb board.It mainly is the crimping pin in the force-applied deformation of device design, and in the time of in the metal aperture that the crimping pin is pressed into the PCB design, the crimping pin is because being pushed by hole wall, and generation deformation also abuts on the metal hole wall of pcb board, thereby realizes effectively being electrically connected.In actual application, may require connector presser spare two-sided to pressing on pcb board, realize the separately overall area occupied of signal and the direct interconnected of different pcb board circuits and saving crimping components and parts.
As shown in Figure 1, connector is two-sided to after pressing on the pcb board, and metal aperture vacant between its crimping pin is unanimous between the higher and lower levels, relatively large, in actual application, can produce larger parasitic capacitance, and then affects the high speed signal quality.
Summary of the invention
In view of this, the invention provides a kind of pcb board processing method of through holes and through-hole structure.By the present invention, can realize that the crimping device is improving the signal quality after pressing on the pcb board.
For realizing the object of the invention, implementation of the present invention is specific as follows:
A kind of processing method of pcb board through hole, described method are applied to the described pcb board through-hole structure of process and remould, and to improve the respectively quality of high speed signal after the Top face of pcb board and the crimping of Bottom face of crimping device, wherein said method comprises the steps:
Step 1, the first blind hole of back drill certain depth of carrying out from the Top face of pcb board;
Step 2, the second blind hole of another degree of depth of back drill of carrying out from the Bottom face of pcb board;
Step 3, between the first relative on pcb board blind hole and the second blind hole, bore the small-bore through hole, wherein said small-bore through hole is connected perforation with the first blind hole, the second blind hole one, and described small-bore through-hole aperture is less than the aperture of described the first blind hole and the second blind hole.
Wherein, the degree of depth of described the first blind hole is more than or equal to the pin length of crimping device on the pcb board Top face; The aperture of described the first blind hole is less than the pin widths of the crimping device of the Top face on the described pcb board; The degree of depth of described the second blind hole is more than or equal to the pin length of crimping device on the pcb board Bottom face; The aperture of described the second blind hole is less than the pin widths of crimping device on the Bottom face on the described pcb board.
Wherein, described the first blind hole is relative with the position of described the second blind hole, the aperture is identical and central shaft overlaps, to form " dumbbell shape " through-hole structure with described small-bore through hole.
Wherein, after described step 3, further " dumbbell shape " through hole that is processed to form on the pcb board is carried out electroplating technology and process, so that should form the coat of metal to be electrically connected with destination layer PCB circuit around " dumbbell shape " through hole.
The present invention provides a kind of pcb board through-hole structure simultaneously, and described through-hole structure is applied to improve the respectively quality of high speed signal after the Top face of pcb board and the crimping of Bottom face of crimping device, and wherein said through-hole structure comprises:
The first through hole links to each other with the Top face of described pcb board, and the hole depth of described the first through hole is more than or equal to the length of the crimping device pin on the described pcb board Top face, and the aperture of described the first through hole is less than the width of the crimping device pin on the described pcb board Top face.
The second through hole, link to each other with the Bottom face of described pcb board, and the hole depth of described the first through hole is more than or equal to the length of the crimping device pin on the described pcb board Bottom face, and the aperture of described the first through hole is less than the width of the crimping device pin on the described pcb board Bottom face.
Third through-hole, with described the first through hole be connected the through hole one and be connected perforation, and described the first through hole of described third through-hole aperture ratio and described the second through-hole aperture are little.
Wherein, described the first through hole is relative with described the second lead to the hole site, and pore size equates and central shaft coincides, to form " dumbbell shape " through-hole structure with described third through-hole.
Wherein, further be electroplate with the coat of metal on described pcb board " dumbbell shape " through hole, with the electrical connection between realization and destination layer PCB circuit.
Compare with existing technical scheme, the pcb board machining process for through hole of uniqueness of the present invention, low processing cost, and can form the electrical connection of pcb board both sides pad, realize using pressing of crimping device.Because the present invention's " dumbbell shape " through-hole structure can effectively reduce the parasitic capacitance that pcb board through hole itself produces, promote the transmission quality of high speed signal simultaneously.
Description of drawings
Fig. 1 be in the existing scheme crimping device in the pcb board through hole to the structural representation after pressing.
Fig. 2 is the method flow schematic diagram of pcb board through hole processing of the present invention.
Fig. 3 a to 3c is intermediateness structural representation in the pcb board through hole Drilling operation process of the present invention.
Fig. 4 is structural representation after the pcb board via metal of the present invention.
Fig. 5 is the structural representation after docking in the pcb board metal aperture according to crimping device of the present invention.
Embodiment
In order to realize the object of the invention, the core concept that the present invention adopts is: for crimping device in the existing scheme in the pcb board metal throuth hole to after pressing, produce larger parasitic capacitance in its through hole, and then affect the situation of the interior high speed signal quality of pcb board.The present invention transforms by the through-hole structure to pcb board, it is processed into " dumbbell shape " structure.So that the crimping device on the pcb board to after pressing since between the crimping pin in the existing scheme in vacant aperture through-hole aperture much smaller, thereby the parasitic capacitance that produces is very little, the PCB signal quality is improved.The present invention provides a kind of processing to be somebody's turn to do the processing method of " dumbbell shape " through-hole structure simultaneously.
For making technical solution of the present invention more clear and clear, described in detail below in conjunction with the specific embodiment of the invention.As shown in Figure 2, the method flow diagram of processing for pcb board through hole of the present invention.Suppose that this pcb board is used for the crimping device and carries out two faces of pressing are respectively Top face and Bottom face.Described method is applied to the described pcb board through-hole structure of process and remould, and to improve the respectively quality of high speed signal after the Top face of pcb board and the crimping of Bottom face of crimping device, described method comprises the steps:
Step 1, the first blind hole of back drill certain depth of carrying out from the Top face of pcb board.
Particularly, when carrying out this step, at first according to the wiring of each layer PCB on the pcb board, select the through hole Working position on the suitable pcb board.After treating that lead to the hole site on the pcb board chooses, Top face from pcb board carries out the back drill first time first, form the first blind hole (shown in Fig. 3 a) on this pcb board, the aperture of wherein said the first blind hole and the degree of depth are all undertaken by controlling dark back drill technique, the degree of depth of described the first blind hole is advisable with the pin length that is slightly larger than crimping device on the Top face on the described pcb board, but be limited with the pin length that is not shorter than described crimping device, being advisable with the pin widths of the crimping device that is slightly less than the Top face on the described pcb board in the aperture of described the first blind hole, but can not be more than or equal to the width of described pin.By the above-mentioned course of processing, can guarantee the crimping device on the Top face of pcb board and the final through-hole structure that is processed to form according to the inventive method between reliable crimping.
Step 2, the second blind hole of another degree of depth of back drill of carrying out from the Bottom face of pcb board.
Particularly, after machining described the first blind hole according to abovementioned steps 1, further carry out second blind hole (shown in Fig. 3 b) of another degree of depth of back drill from the Bottom face of pcb board, with the reliable crimping between the final through-hole structure that is used for follow-up pcb board Bottom face crimping device and is processed to form according to the inventive method.The aperture of wherein said the second blind hole and deep processing method are identical with abovementioned steps 1, also are to be undertaken by controlling dark back drill technique.And the degree of depth of described the second blind hole is advisable with the pin length that is slightly larger than the Bottom face crimping device on the described pcb board, but be limited with the pin length that is not shorter than described crimping device, being advisable with the pin widths of the crimping device that is slightly less than the Bottom face on the described pcb board in the aperture of described the second blind hole, but can not be more than or equal to described pin widths.
Preferably, described the first blind hole is relative with the position of described the second blind hole, the aperture is identical and central shaft overlaps.But according to the inventive method, position, aperture or the central shaft of described the first blind hole and described the second blind hole also can be inconsistent or do not overlapped.For example: under some special applications scene, the first blind hole of described pcb board both sides and the position between the second blind hole have necessarily departs from, perhaps there is different in the aperture of the first blind hole and the second blind hole, the one of ordinary skill in the art should be understood that this species diversity should not have influence on Spirit Essence of the present invention.
Step 3, between the first relative on pcb board blind hole and the second blind hole, bore the small-bore through hole, wherein said small-bore through hole is connected perforation with the first blind hole, the second blind hole one, and described small-bore through-hole aperture is less than the aperture of described the first blind hole and the second blind hole.
Particularly, after machining the first blind hole and the second blind hole on this pcb board from the Top face of pcb board and Bottom face respectively according to abovementioned steps 1,2, further between relative the first blind hole of pcb board and the second blind hole, bore for the third time the small-bore through hole, so as described through hole and described the first blind hole be connected the blind hole one and be connected and be formed through " dumbbell shape " through-hole structure (shown in Fig. 3 c).
Further, described middle small-bore through-hole aperture should be less than aforementioned the first blind hole and the second blind hole aperture, and preferably, with the smaller the better, but its size should realize being limited not affect the follow-up electroplating technology of each pcb board producer.
Step 4, " dumbbell shape " through hole that is processed to form on the pcb board is carried out electroplating technology process, so that should form the coat of metal around " dumbbell shape " through hole.
As shown in Figure 4, be processed to form " dumbbell shape " through-hole structure on the pcb board according to above-mentioned steps 1-3 after, this " dumbbell shape " through hole is carried out electroplating technology processes, so that should form the coat of metal around " dumbbell shape " through hole.Preferably, " dumbbell shape " through hole of described pcb board is carried out electroless copper plating or electro-coppering operation, with the Top face of realizing pcb board and the electrical connection between two holes of Bottom face and destination layer PCB circuit.
After the processing of finishing " dumbbell shape " through-hole structure on the pcb board according to the invention described above about the processing method of pcb board through hole is processed, in actual application, if need to carry out the two-sided to pressing of connector presser spare from Top face and the Bottom face of pcb board, to realize the crimping device separately during signal and different PCB circuits direct interconnected, just can be directly the crimping pin of the crimping device of the Top face of pcb board and Bottom face be pressed into directly that this " dumbbell shape " through hole is interior to be got final product.
Because " dumbbell shape " through hole on the improved pcb board of the present invention is after the crimping device pin is pressed into from the Top face of pcb board and Bottom face respectively, compared to the prior art scheme, between two crimping pins in the existing scheme in vacant aperture through-hole aperture little a lot, thereby the parasitic capacitance that produces is very little, and the PCB signal quality is improved.
The present invention provides a kind of pcb board through-hole structure simultaneously, and described through-hole structure is applied to improve the respectively quality of high speed signal after the Top face of pcb board and the crimping of Bottom face of crimping device, and described through-hole structure comprises:
The first through hole links to each other with the Top face of described pcb board, and the hole depth of described the first through hole is more than or equal to the length of the crimping device pin on the described pcb board Top face, and the aperture of described the first through hole is less than the width of the crimping device pin on the described pcb board Top face.
The second through hole, link to each other with the Bottom face of described pcb board, and the hole depth of described the first through hole is more than or equal to the length of the crimping device pin on the described pcb board Bottom face, and the aperture of described the first through hole is less than the width of the crimping device pin on the described pcb board Bottom face.
Third through-hole, with described the first through hole be connected the through hole one and be connected perforation, and described third through-hole aperture is less than described the first through hole and described the second through-hole aperture.
Preferably, described the first through hole is relative with described the second lead to the hole site, and pore size equates and central shaft coincides, to form " dumbbell shape " through-hole structure with described third through-hole.Yet under some special applications scene, position, aperture or the central shaft of described the first through hole and described the second through hole also can be inconsistent or do not overlapped.For example: the first blind hole of described pcb board both sides and the position between the second blind hole have necessarily departs from, perhaps there is different in the aperture of the first blind hole and the second blind hole, the one of ordinary skill in the art should be understood that this species diversity should not have influence on Spirit Essence of the present invention.
Preferentially, further be electroplate with the coat of metal on described pcb board " dumbbell shape " through hole, with the Top face of realization pcb board and the electrical connection between two holes of Bottom face and destination layer PCB circuit.Particularly, the described coat of metal is metallic copper.
Because " dumbbell shape " through hole on the improved pcb board of the present invention is after the crimping device pin is pressed into from the Top face of pcb board and Bottom face respectively, compared to the prior art scheme, between two crimping pins in the existing scheme in vacant aperture through-hole aperture much smaller, thereby the parasitic capacitance that produces is very little, and the PCB signal quality is improved.In addition, above-mentioned pcb board " dumbbell shape " the through hole course of processing is simple, and the workshop section that only holes repeatedly processes, and difficulty of processing is low, without the processing risk.
The above only is preferred embodiment of the present invention, and is in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of making, is equal to replacement, improvement etc., all should be included within the scope of protection of the invention.
Claims (7)
1. the processing method of a pcb board through hole, described method is applied to the described pcb board through-hole structure of process and remould, to improve the respectively quality of high speed signal after the Top face of pcb board and the crimping of Bottom face of crimping device, it is characterized in that described method comprises the steps:
Step 1, the first blind hole of back drill certain depth of carrying out from the Top face of pcb board;
Step 2, the second blind hole of another degree of depth of back drill of carrying out from the Bottom face of pcb board;
Step 3, bore the small-bore through hole between pcb board the first blind hole respect to one another and the second blind hole, wherein said small-bore through hole is connected perforation with the first blind hole, the second blind hole one, and the small-bore through-hole aperture is less than the aperture of described the first blind hole and the second blind hole.
2. the method for claim 1 is characterized in that,
The degree of depth of described the first blind hole is more than or equal to the pin length of crimping device on the pcb board Top face; The aperture of described the first blind hole is less than the pin widths of the crimping device of the Top face on the described pcb board;
The degree of depth of described the second blind hole is more than or equal to the pin length of crimping device on the pcb board Bottom face; The aperture of described the second blind hole is less than the pin widths of crimping device on the Bottom face on the described pcb board.
3. method as claimed in claim 2 is characterized in that, described the first blind hole is relative with the position of described the second blind hole, the aperture is identical and central shaft overlaps, to form " dumbbell shape " through-hole structure with described small-bore through hole.
4. method as claimed in claim 3, it is characterized in that, after described step 3, further " dumbbell shape " through hole that is processed to form on the pcb board is carried out electroplating technology and process, so that should form the coat of metal to be electrically connected with destination layer PCB circuit around " dumbbell shape " through hole.
5. pcb board through-hole structure, described through-hole structure are used for improving the respectively quality of high speed signal after the Top face of pcb board and the crimping of Bottom face of crimping device, it is characterized in that described through-hole structure comprises:
The first through hole links to each other with the Top face of described pcb board, and the hole depth of described the first through hole is more than or equal to the length of the crimping device pin on the described pcb board Top face, and the aperture of described the first through hole is less than the width of the crimping device pin on the described pcb board Top face;
The second through hole, link to each other with the Bottom face of described pcb board, and the hole depth of described the first through hole is more than or equal to the length of the crimping device pin on the described pcb board Bottom face, and the aperture of described the first through hole is less than the width of the crimping device pin on the described pcb board Bottom face;
Third through-hole, with described the first through hole be connected the through hole one and be connected perforation, and described third through-hole aperture is less than the aperture of described the first through hole and described the second through hole.
6. PCB through-hole structure as claimed in claim 5 is characterized in that, described the first through hole is relative with described the second lead to the hole site, and pore size equates and central shaft coincides, to form " dumbbell shape " through-hole structure with described third through-hole.
7. PCB through-hole structure as claimed in claim 5 is characterized in that, further is electroplate with the coat of metal on described pcb board " dumbbell shape " through hole, with the electric connection between realization and destination layer PCB circuit.
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| CN201210379432.9A CN102883536B (en) | 2012-09-29 | 2012-09-29 | A kind of PCB plate through hole processing method and through-hole structure |
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| CN201210379432.9A CN102883536B (en) | 2012-09-29 | 2012-09-29 | A kind of PCB plate through hole processing method and through-hole structure |
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| CN102883536A true CN102883536A (en) | 2013-01-16 |
| CN102883536B CN102883536B (en) | 2015-12-02 |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103260359A (en) * | 2013-04-26 | 2013-08-21 | 淳华科技(昆山)有限公司 | Manufacturing method of opposite blind holes on front surface and back surface of flexible printed circuit |
| CN103987210A (en) * | 2014-05-05 | 2014-08-13 | 杭州华三通信技术有限公司 | PCB manufacturing method and PCB |
| CN104349577A (en) * | 2013-08-02 | 2015-02-11 | 北大方正集团有限公司 | Double-face crimping backboard and hole drilling method thereof |
| CN104797080A (en) * | 2015-04-20 | 2015-07-22 | 深圳崇达多层线路板有限公司 | Circuit board and through-hole manufacturing method thereof |
| CN108882525A (en) * | 2018-08-24 | 2018-11-23 | 郑州云海信息技术有限公司 | A kind of compression bonding method of pcb board and PCB frontback connection device |
| CN110662368A (en) * | 2019-09-12 | 2020-01-07 | 无锡江南计算技术研究所 | Dumbbell structure through hole design method for high-speed orthogonal middle plate |
| CN111241783A (en) * | 2020-01-10 | 2020-06-05 | 苏州浪潮智能科技有限公司 | Back drilling inspection method and device for crimping pins |
| CN111463136A (en) * | 2020-04-30 | 2020-07-28 | 北京飞宇微电子电路有限责任公司 | Metal packaging shell, manufacturing method thereof and hybrid integrated circuit |
| CN113347807A (en) * | 2021-05-31 | 2021-09-03 | 深圳市深联电路有限公司 | Method for manufacturing same-hole different-net and double-sided contact pin back plate |
| CN113334493A (en) * | 2021-05-31 | 2021-09-03 | 深圳市深联电路有限公司 | Drilling control method for holes in high-precision double-sided back-drilled back plate hole |
| CN113382563A (en) * | 2020-02-25 | 2021-09-10 | 竞华电子(深圳)有限公司 | Method for manufacturing double-faced press piece and double-faced press piece |
| CN114206010A (en) * | 2021-12-22 | 2022-03-18 | 珠海杰赛科技有限公司 | PCB back drilling process |
| CN115042303A (en) * | 2022-06-20 | 2022-09-13 | 山东硅元新型材料股份有限公司 | Method for processing deep and long through hole of inorganic non-metallic ceramic material |
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103260359A (en) * | 2013-04-26 | 2013-08-21 | 淳华科技(昆山)有限公司 | Manufacturing method of opposite blind holes on front surface and back surface of flexible printed circuit |
| CN103260359B (en) * | 2013-04-26 | 2016-03-23 | 淳华科技(昆山)有限公司 | The manufacture method of the relative blind hole in the positive back side in flexible circuit board |
| CN104349577A (en) * | 2013-08-02 | 2015-02-11 | 北大方正集团有限公司 | Double-face crimping backboard and hole drilling method thereof |
| CN104349577B (en) * | 2013-08-02 | 2017-03-29 | 北大方正集团有限公司 | Two-sided crimping backboard and its boring method |
| CN103987210A (en) * | 2014-05-05 | 2014-08-13 | 杭州华三通信技术有限公司 | PCB manufacturing method and PCB |
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| CN104797080A (en) * | 2015-04-20 | 2015-07-22 | 深圳崇达多层线路板有限公司 | Circuit board and through-hole manufacturing method thereof |
| CN108882525A (en) * | 2018-08-24 | 2018-11-23 | 郑州云海信息技术有限公司 | A kind of compression bonding method of pcb board and PCB frontback connection device |
| CN110662368A (en) * | 2019-09-12 | 2020-01-07 | 无锡江南计算技术研究所 | Dumbbell structure through hole design method for high-speed orthogonal middle plate |
| CN111241783A (en) * | 2020-01-10 | 2020-06-05 | 苏州浪潮智能科技有限公司 | Back drilling inspection method and device for crimping pins |
| CN111241783B (en) * | 2020-01-10 | 2023-01-06 | 苏州浪潮智能科技有限公司 | Back drilling inspection method and device for crimping pins |
| CN113382563A (en) * | 2020-02-25 | 2021-09-10 | 竞华电子(深圳)有限公司 | Method for manufacturing double-faced press piece and double-faced press piece |
| CN111463136A (en) * | 2020-04-30 | 2020-07-28 | 北京飞宇微电子电路有限责任公司 | Metal packaging shell, manufacturing method thereof and hybrid integrated circuit |
| CN113347807A (en) * | 2021-05-31 | 2021-09-03 | 深圳市深联电路有限公司 | Method for manufacturing same-hole different-net and double-sided contact pin back plate |
| CN113334493A (en) * | 2021-05-31 | 2021-09-03 | 深圳市深联电路有限公司 | Drilling control method for holes in high-precision double-sided back-drilled back plate hole |
| CN113334493B (en) * | 2021-05-31 | 2023-02-28 | 深圳市深联电路有限公司 | Drilling control method for holes in high-precision double-sided back-drilled back plate hole |
| CN114206010A (en) * | 2021-12-22 | 2022-03-18 | 珠海杰赛科技有限公司 | PCB back drilling process |
| CN115042303A (en) * | 2022-06-20 | 2022-09-13 | 山东硅元新型材料股份有限公司 | Method for processing deep and long through hole of inorganic non-metallic ceramic material |
| CN115042303B (en) * | 2022-06-20 | 2024-06-11 | 山东硅元新型材料股份有限公司 | Method for processing deep through hole of inorganic nonmetallic ceramic material |
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