CN104797080A - Circuit board and through-hole manufacturing method thereof - Google Patents
Circuit board and through-hole manufacturing method thereof Download PDFInfo
- Publication number
- CN104797080A CN104797080A CN201510188131.1A CN201510188131A CN104797080A CN 104797080 A CN104797080 A CN 104797080A CN 201510188131 A CN201510188131 A CN 201510188131A CN 104797080 A CN104797080 A CN 104797080A
- Authority
- CN
- China
- Prior art keywords
- hole
- back drill
- drill hole
- wiring board
- aperture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Abstract
The invention discloses a circuit board and a through-hole manufacturing method thereof and belongs to the field of production and manufacturing process of circuit boards. The circuit board is provided with a through hole running through the circuit board, the through hole comprises a first back drilling hole, a second back drilling hole and a communication hole communicating the first back drilling hole with the second back drilling hole, the first back drilling hole and the second back drilling hole are arranged on the two opposite sides of the circuit board, and a copper layer wraps the walls of the first back drilling hole and the second back drilling hole; the diameter of the first back drilling hole and the second back drilling hole is larger than that of the communication hole. The manufacturing method is used for manufacturing the through hole of the circuit board, and the through hole is provided with metalized half holes in two ends and a non-copper communication hole in the middle. Accordingly, the same through hole can connect the two different circuit networks, and use area of the circuit board is increased.
Description
Technical field
The invention belongs to wiring board manufacturing process field, particularly relate to a kind of wiring board and via-hole fabrication process thereof.
Background technology
For design of electronic products teacher especially wiring board design personnel, the manufacturability design of product is a factor that must consider, if wiring board design does not meet manufacturability design requirement, to greatly reduce the production efficiency of product, designed product when serious, even can be caused at all cannot to create.Current through-hole mounting is for design of electronic products teacher especially wiring board design personnel, the manufacturability design of product is a factor that must consider, if wiring board design does not meet manufacturability design requirement, to greatly reduce the production efficiency of product, designed product when serious, even can be caused at all cannot to create.Current Through-Hole Technology is still in use, and manufacturability design can play great role in the efficiency improving through-hole mounting manufacture and reliability, and manufacturing design method can contribute to through-hole mounting manufacturer to be reduced defect and keeps competitiveness.Existing wiring board through hole manufacturability method for metallising flow process is: pressing-holes drilled through-heavy copper-plate electricity-outer graphics-graphic plating-etching; The method, after circuit-board drilling goes out through hole, by whole via metal, realizes conducting function, and this through hole produces a test network only, and wiring board effective area is reduced.
Summary of the invention
For the problems referred to above, the invention provides without copper wiring board through hole and manufacture method thereof in the middle of the metallization of a kind of two ends, concrete scheme is as follows:
A kind of wiring board, described wiring board is provided with the through hole running through wiring board, and described through hole comprises the first back drill hole, the second back drill hole and is communicated with the intercommunicating pore in the first back drill hole and the second back drill hole; The first described back drill hole, the second back drill hole are positioned at the relative two sides of wiring board, and the hole wall in the first back drill hole and the second back drill hole is all covered with layers of copper; The aperture in described first back drill hole and the second back drill hole is all greater than the aperture of intercommunicating pore.
The manufacture method of through hole on above-mentioned wiring board, comprises the following steps:
S1 gets out the positioning through hole that aperture is D1 in the circuit board;
One end counterboring of positioning through hole becomes aperture to be the first back drill hole of D2 by S2, and described D2 is greater than D1;
The other end counterboring of positioning through hole becomes aperture to be the second back drill hole of D3 by S3, and described D3 is greater than D1;
S4 wiring board is sunk copper, that whole plate is electroplated to required copper is thick;
The positioning through hole part counterboring in connection first back drill hole, the second back drill hole becomes aperture to be the intercommunicating pore of D4 by S5, and described D4 is greater than D1, and D4 is less than D2, and D4 is less than D3.
Preferably, the aperture D1 of described positioning through hole is 0.3mm, and the aperture D4 of intercommunicating pore is 0.45mm.
Preferably, the aperture D2 in described first back drill hole is 0.65mm, and the aperture D3 in the second back drill hole is 0.65mm.
Further, the aligning accuracy of described boring is in 0.076um.
Beneficial effect of the present invention: the wiring board through hole that manufacture method of the present invention makes, the two ends of this through hole are metallization back drill hole, and centre is the intercommunicating pore without copper, can realize same through hole and connect two different circuit networks, the usable floor area of raising wiring board.
Accompanying drawing explanation
Fig. 1 is embodiment of the present invention wiring board schematic cross-section.
Fig. 2 is the schematic cross-section of positioning through hole in the embodiment of the present invention.；
Fig. 3 is that in the embodiment of the present invention, positioning through hole counterboring goes out the schematic cross-section behind the first back drill hole and the second back drill hole.
Fig. 4 be in the embodiment of the present invention wiring board sink copper, whole plate plating after boring schematic cross-section.
Fig. 5 is the flow chart of via-hole fabrication process on wiring board of the present invention.
Embodiment
In order to more fully understand technology contents of the present invention, below in conjunction with specific embodiment technical scheme of the present invention being introduced further and illustrating.
Embodiment
As shown in Figure 1, wiring board is 12 sandwich circuit layers, is respectively L1-L12, is PP layer between adjacent line layer.Wiring board is provided with the through hole without copper in the middle of the metallization of two ends, and through hole comprises the first back drill hole 22, back drill hole 21, second and intercommunicating pore 24.First back drill hole 22, back drill hole 21, second lays respectively at the relative two sides of wiring board, and intercommunicating pore 24 connects the bottom in the first back drill hole 21 and the second back drill hole 22.The aperture in the first back drill hole 21 and the second back drill hole 22 is equal, is all greater than the aperture of intercommunicating pore 24.The hole wall in the first back drill hole 21 and the second back drill hole 22 is all covered with layers of copper 23, and wherein, the layers of copper in the first back drill hole 21 realizes L1 and L4 conducting; The interior layers of copper in the second back drill hole 22 realizes L8 and L12 conducting.
The manufacture method of above-mentioned wiring board through hole is as follows:
The wiring board of 12 sandwich circuit layers gets out the positioning through hole 20 (as shown in Figure 2) that aperture is 0.3mm.
Control aligning accuracy in 0.076um, form from L1 face counterboring positioning through hole the first back drill hole 21 (as shown in Figure 3) that aperture is 0.65mm, the drill-through L4 of the back drill degree of depth in the first back drill hole 21, unlikely L5.
Control aligning accuracy in 0.076um, form from L12 face counterboring positioning through hole the second back drill hole 22 (as shown in Figure 3) that aperture is 0.65mm, the drill-through L8 of the back drill degree of depth in the second back drill hole 22, unlikely L7.
Wiring board being sunk copper, whole plate is electroplated to the thick 8-12um of institute's copper (as shown in Figure 4).
Control aligning accuracy in 0.076um, aperture is become by the aperture 0.3mm positioning through hole part counterboring in connection first back drill hole, the second back drill hole to be the intercommunicating pore (as shown in Figure 1) of 0.45mm, guarantee that 0.3mm aperture hole wall is bored completely to open simultaneously, and do not injure 0.625mm hole wall copper.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by protection of the present invention.
Claims (3)
1. a wiring board, is characterized in that, described wiring board is provided with the through hole running through wiring board, and described through hole comprises the first back drill hole, the second back drill hole and is communicated with the intercommunicating pore in the first back drill hole and the second back drill hole; The first described back drill hole, the second back drill hole are positioned at the relative two sides of wiring board, and the hole wall in the first back drill hole and the second back drill hole is all covered with layers of copper; The aperture in described first back drill hole and the second back drill hole is all greater than the aperture of intercommunicating pore.
2. the manufacture method of through hole on wiring board as claimed in claim 1, is characterized in that, comprise the following steps:
S1 gets out the positioning through hole that aperture is D1 in the circuit board;
One end counterboring of positioning through hole becomes aperture to be the first back drill hole of D2 by S2, and described D2 is greater than D1;
The other end counterboring of positioning through hole becomes aperture to be the second back drill hole of D3 by S3, and described D3 is greater than D1;
S4 wiring board is sunk copper, that whole plate is electroplated to required copper is thick;
The positioning through hole part counterboring in connection first back drill hole, the second back drill hole becomes aperture to be the intercommunicating pore of D4 by S5, and described D4 is greater than D1, and D4 is less than D2, and D4 is less than D3.
3. the manufacture method of through hole on wiring board according to claim 2, it is characterized in that, the aperture D1 of described positioning through hole is 0.3mm, and the aperture D4 of intercommunicating pore is 0.45mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510188131.1A CN104797080A (en) | 2015-04-20 | 2015-04-20 | Circuit board and through-hole manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510188131.1A CN104797080A (en) | 2015-04-20 | 2015-04-20 | Circuit board and through-hole manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104797080A true CN104797080A (en) | 2015-07-22 |
Family
ID=53561474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510188131.1A Pending CN104797080A (en) | 2015-04-20 | 2015-04-20 | Circuit board and through-hole manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104797080A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105722324A (en) * | 2016-03-15 | 2016-06-29 | 建业科技电子（惠州）有限公司 | Manufacturing method of circuit board counterbore |
| CN105916294A (en) * | 2016-05-20 | 2016-08-31 | 广州杰赛科技股份有限公司 | Printed circuit board back hole drilling manufacturing method and printed circuit board thereof |
| CN106604571A (en) * | 2016-12-30 | 2017-04-26 | 广州兴森快捷电路科技有限公司 | Circuit board through hole manufacturing method and circuit board |
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|---|---|---|---|---|
| US20040108137A1 (en) * | 2002-12-10 | 2004-06-10 | Litton Systems, Inc. | Cross connect via for multilayer printed circuit boards |
| CN102196677A (en) * | 2010-03-08 | 2011-09-21 | 深南电路有限公司 | PCB (Printed Circuit Board) double-sided jack machining process |
| CN102781177A (en) * | 2012-07-20 | 2012-11-14 | 中兴通讯股份有限公司 | Method for drilling printed circuit board, printed circuit board and communication equipment |
| CN102883536A (en) * | 2012-09-29 | 2013-01-16 | 杭州华三通信技术有限公司 | Processing method of through holes of printed circuit board (PCB) and through hole structure |
| CN103458627A (en) * | 2013-09-07 | 2013-12-18 | 汕头超声印制板（二厂）有限公司 | Double-surface pressing connecting through hole structure of printed-circuit board and machining method thereof |
| CN203467066U (en) * | 2013-09-07 | 2014-03-05 | 汕头超声印制板（二厂）有限公司 | Double-faced compression joint through hole structure of printed-circuit board |
| CN103687306A (en) * | 2012-09-05 | 2014-03-26 | 北大方正集团有限公司 | Printed circuit board and manufacturing method thereof |
| CN203590595U (en) * | 2013-11-19 | 2014-05-07 | 佛山市顺德区顺达电脑厂有限公司 | PCB through-hole structure |
| CN103917061A (en) * | 2013-01-07 | 2014-07-09 | 深南电路有限公司 | Method for manufacturing PCB through holes with half portions coated with copper and PCB |
-
2015
- 2015-04-20 CN CN201510188131.1A patent/CN104797080A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040108137A1 (en) * | 2002-12-10 | 2004-06-10 | Litton Systems, Inc. | Cross connect via for multilayer printed circuit boards |
| CN102196677A (en) * | 2010-03-08 | 2011-09-21 | 深南电路有限公司 | PCB (Printed Circuit Board) double-sided jack machining process |
| CN102781177A (en) * | 2012-07-20 | 2012-11-14 | 中兴通讯股份有限公司 | Method for drilling printed circuit board, printed circuit board and communication equipment |
| CN103687306A (en) * | 2012-09-05 | 2014-03-26 | 北大方正集团有限公司 | Printed circuit board and manufacturing method thereof |
| CN102883536A (en) * | 2012-09-29 | 2013-01-16 | 杭州华三通信技术有限公司 | Processing method of through holes of printed circuit board (PCB) and through hole structure |
| CN103917061A (en) * | 2013-01-07 | 2014-07-09 | 深南电路有限公司 | Method for manufacturing PCB through holes with half portions coated with copper and PCB |
| CN103458627A (en) * | 2013-09-07 | 2013-12-18 | 汕头超声印制板（二厂）有限公司 | Double-surface pressing connecting through hole structure of printed-circuit board and machining method thereof |
| CN203467066U (en) * | 2013-09-07 | 2014-03-05 | 汕头超声印制板（二厂）有限公司 | Double-faced compression joint through hole structure of printed-circuit board |
| CN203590595U (en) * | 2013-11-19 | 2014-05-07 | 佛山市顺德区顺达电脑厂有限公司 | PCB through-hole structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105722324A (en) * | 2016-03-15 | 2016-06-29 | 建业科技电子（惠州）有限公司 | Manufacturing method of circuit board counterbore |
| CN105916294A (en) * | 2016-05-20 | 2016-08-31 | 广州杰赛科技股份有限公司 | Printed circuit board back hole drilling manufacturing method and printed circuit board thereof |
| CN106604571A (en) * | 2016-12-30 | 2017-04-26 | 广州兴森快捷电路科技有限公司 | Circuit board through hole manufacturing method and circuit board |
| CN106604571B (en) * | 2016-12-30 | 2019-09-06 | 广州兴森快捷电路科技有限公司 | The production method and wiring board of wiring board through-hole |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150722 |
|
| RJ01 | Rejection of invention patent application after publication |