CN105722324A - Manufacturing method of circuit board counterbore - Google Patents
Manufacturing method of circuit board counterbore Download PDFInfo
- Publication number
- CN105722324A CN105722324A CN201610145463.6A CN201610145463A CN105722324A CN 105722324 A CN105722324 A CN 105722324A CN 201610145463 A CN201610145463 A CN 201610145463A CN 105722324 A CN105722324 A CN 105722324A
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- CN
- China
- Prior art keywords
- boring
- circuit board
- counterbore
- periphery holes
- counter sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a manufacturing method of a circuit board counterbore. According to the manufacturing method, a peripheral hole and a counterbore are manufactured in a secondary drilling manner respectively; the drilling iteration number of the peripheral hole and the counterbore is 1PNL/iteration; the peripheral hole is located above the counterbore; the aperture of the peripheral hole is smaller than that of the counterbore; and the secondary drilling manner comprises drilling of the peripheral hole and drilling of the counterbore. The manufacturing method of the circuit board counterbore has the characteristics of being low in quality hidden danger, good in consistency, high in processing speed, high in production efficiency and low in cost.
Description
Technical field
The present invention relates to circuit board processing technique field, be specially a kind of circuit board counter sink manufacture method.
Background technology
Along with the universal of electronic product and extensive use, the production of printed circuit board (PCB) and manufacturing technology are also constantly updated and develop.At present, counter sink is set on circuit boards, the problem that when solving PCBA assembling, head of screw is embedded in circuit board parallel-plate face maybe can only be adopted to design in the position needing assemble welding electronic devices and components.But, the fabrication design process of current counter sink, it is generally adopted the mode of a drilling via formations, boring repeatedly plate numerical digit 3～4PNL/ is repeatedly, for drilling via formations control range request higher, there is counter sink shape, the undulatory property of the degree of depth is bigger, concordance is poor, the defects such as process velocity is slow, and in the process of the overlapping of circuit board, depth difference due to counter sink, cannot effectively head of screw be imbedded in circuit board, scratch circuit board surface and the damage to other electronic devices and components accordingly, quality hidden danger is caused to remain high, welding circuit board reliability and dependability are had a strong impact on.
Summary of the invention
It is an object of the invention to provide a kind of circuit board counter sink manufacture method, have the advantages that quality hidden danger is low, concordance good, process velocity is fast, production efficiency is high and with low cost.
The present invention can be achieved through the following technical solutions:
The invention discloses a kind of circuit board counter sink manufacture method, described manufacture method adopts secondary drilling mode to make periphery holes and counterbore respectively, the boring of described periphery holes and counterbore repeatedly number changes for 1PNL/, described periphery holes is positioned at the top of described counterbore, the aperture of described periphery holes is less than described counterbore, and described secondary drilling mode comprises the following steps:
The first step, periphery holes are holed, overlap backing plate on circuit boards, set the drilling depth half as plate thickness, in conjunction with bore diameter D, cutting output Vs according to Vs=(n*D* π)/1000, f=(F*1000)/n, set boring rotating speed n, feed velocity f, return cutter speed F carry out periphery holes boring in the plate face of circuit board.In the boring procedure of periphery holes, rotating speed and the too high or too low meeting of running speed cause blast hole or pull hole wall and cause that Hole Wall Roughness is excessive, are not easy to the processing of counterbore.
Second step, countersunk hole, the circuit board surface completing periphery holes boring sets the drilling depth half as plate thickness, in conjunction with bore diameter D, cutting output Vs according to Vs=(n*D* π)/1000, f=(F*1000)/n, set boring rotating speed n, feed velocity f, time cutter speed F carry out countersunk hole in the plate face of circuit board.In the boring procedure of counterbore, rotating speed and the too high or too low meeting of running speed cause blast hole.
In the process of whole counter sink secondary drilling processing, drilling depth sets and counter sink too deeply can be caused to drill or split, it is impossible to play fixing screw effect；The too shallow counterbore degree of depth of drilling depth cannot meet to turn joins requirement, high ejecting plate face after circuit board build-up member, it is impossible to effective and head of screw laminating.In actual use, the manufacture method of the counter sink of the present invention can meet the making requirement that aperture is 0.20～6.40mm, meets the use needs of dissimilar counter sink, effectively meets its scope of application, and has higher machining accuracy.
Further, described counter sink be shaped as step or inclined-plane shape.
Further, described counterbore be shaped as taper hole or tack hole, when described counterbore shape is taper hole select pointed shape drill, when described counterbore shape is tack hole select the straight angle.
Further, in the process of described periphery holes boring, before boring, first cover aluminium sheet in the position of boring protect.
Further, in the process of described countersunk hole, before boring, first cover aluminium sheet in the position of boring protect.
One circuit board counter sink manufacture method of the present invention, has following beneficial effect:
The first, quality hidden danger is low; when assembling screw for PCBA after circuit boring, screw terminal circuit board face of emerging scratches other accessory and the defect taken up room; counter sink manufacture method of the present invention is by adjusting boring repeatedly number and drilling depth and improving drilling tool; solve circular hole and cannot touch head of screw; and the countersunk head part touching screw that the effect of counterbore is more intact; ensure the counterbore that touch that sunk screw can be intact, the plate face of protection circuit board；
The second, concordance is good; change for 1PNL/ by controlling the boring repeatedly number of periphery holes and counterbore; the position of every SET circuit board periphery holes and counterbore is all in correspondence with each other; without repeating to arrange parameter in the process that every PCS circuit board is processed; scale is processed; ensure that the concordance that counter sink is processed, be also effectively improved the speed of processing；
3rd, process velocity is fast, change for 1PNL/ by controlling the boring repeatedly number of periphery holes and counterbore, the position of every SET circuit board periphery holes and counterbore all in correspondence with each other, without repeating to arrange parameter in the process that every PCS circuit board is processed, simplify manufacturing process, be effectively improved the speed of processing；
4th, production efficiency is high, by adopting the counter sink manufacture method of the present invention, when solving PCBA assembling in the design of circuit board, head of screw can only be embedded in plate or adopt the restriction in parallel-plate face, the convenient position that head of screw is set according to needs of production, reduce production and processing difficulty, promote the production efficiency of circuit board；
5th, with low cost, the counter sink manufacture method step of the present invention is few, and manufacturing process is simple, and drilling parameter controllability is strong, adopts conventional rig, it is not necessary to additionally increase equipment cost, saves processing cost without using special consumptive material.
Detailed description of the invention
In order to make those skilled in the art be more fully understood that technical scheme, it is described in further detail below in conjunction with embodiment and to product of the present invention.
Embodiment 1
The invention discloses a kind of circuit board counter sink manufacture method, described manufacture method adopts secondary drilling mode to make periphery holes and counterbore respectively, the boring of described periphery holes and counterbore repeatedly number changes for 1PNL/, described periphery holes is positioned at the top of described counterbore, the aperture of described periphery holes is less than described counterbore, and described secondary drilling mode comprises the following steps:
The first step, periphery holes are holed, overlap backing plate on circuit boards, set the drilling depth half as plate thickness, be that 0.20mm, cutting output Vs are according to Vs=(n*D* π in conjunction with bore diameter D)/1000, f=(F*1000)/n, set boring rotating speed as 140 ± 5krpm, feed velocity f as 2.2 ± 0.3m/min, return cutter speed F carry out periphery holes boring as 18m/min in the plate face of circuit board；
Second step, countersunk hole, bore diameter D is that 0.70～0.75mm, cutting output Vs are according to Vs=(n*D* π)/1000, f=(F*1000)/n, set boring rotating speed as 75 ± 5krpm, feed velocity f as 3.5 ± 0.2m/min, return cutter speed F as 25m/min complete periphery holes boring circuit board surface on set the drilling depth half as plate thickness, carry out countersunk hole in the plate face of circuit board.
In the present embodiment, described counter sink be shaped as inclined-plane shape, described counterbore be shaped as tack hole, when described counterbore shape is tack hole select the straight angle.In the process of described periphery holes boring, before boring, first cover aluminium sheet in the position of boring protect.In the process of described countersunk hole, before boring, first cover aluminium sheet in the position of boring protect.
Embodiment 2
The invention discloses a kind of circuit board counter sink manufacture method, described manufacture method adopts secondary drilling mode to make periphery holes and counterbore respectively, the boring of described periphery holes and counterbore repeatedly number changes for 1PNL/, described periphery holes is positioned at the top of described counterbore, the aperture of described periphery holes is less than described counterbore, and described secondary drilling mode comprises the following steps:
The first step, periphery holes are holed, overlap backing plate on circuit boards, set the drilling depth half as plate thickness, be that 0.25mm, cutting output Vs are according to Vs=(n*D* π in conjunction with bore diameter D)/1000, f=(F*1000)/n, set boring rotating speed as 135 ± 5krpm, feed velocity f as 2.2 ± 0.3m/min, return cutter speed F carry out periphery holes boring as 18m/min in the plate face of circuit board；
Second step, countersunk hole, bore diameter D is that 0.50mm, cutting output Vs are according to Vs=(n*D* π)/1000, f=(F*1000)/n, set boring rotating speed as 100 ± 5krpm, feed velocity f as 3.3 ± 0.2m/min, return cutter speed F as 22m/min complete periphery holes boring circuit board surface on set the drilling depth half as plate thickness, carry out countersunk hole in the plate face of circuit board.
In the present embodiment, described counter sink be shaped as step, described counterbore be shaped as taper hole, select pointed shape to bore.In the process of described periphery holes boring, before boring, first cover aluminium sheet in the position of boring protect.In the process of described countersunk hole, before boring, first cover aluminium sheet in the position of boring protect.
Embodiment 3
The invention discloses a kind of circuit board counter sink manufacture method, described manufacture method adopts secondary drilling mode to make periphery holes and counterbore respectively, the boring of described periphery holes and counterbore repeatedly number changes for 1PNL/, described periphery holes is positioned at the top of described counterbore, the aperture of described periphery holes is less than described counterbore, and described secondary drilling mode comprises the following steps:
The first step, periphery holes are holed, overlap backing plate on circuit boards, set the drilling depth half as plate thickness, be that 0.40mm, cutting output Vs are according to Vs=(n*D* π in conjunction with bore diameter D)/1000, f=(F*1000)/n, set boring rotating speed as 110 ± 5krpm, feed velocity f as 2.3 ± 0.3m/min, return cutter speed F carry out periphery holes boring as 22m/min in the plate face of circuit board；
Second step, countersunk hole, bore diameter D is that 0.55mm, cutting output Vs are according to Vs=(n*D* π)/1000, f=(F*1000)/n, set boring rotating speed as 95 ± 5krpm, feed velocity f as 3.5 ± 0.2m/min, return cutter speed F as 22m/min complete periphery holes boring circuit board surface on set the drilling depth half as plate thickness, carry out countersunk hole in the plate face of circuit board.
In the present embodiment, described counter sink be shaped as inclined-plane shape, described counterbore be shaped as tack hole, when described counterbore shape is tack hole select the straight angle.In the process of described periphery holes boring, before boring, first cover aluminium sheet in the position of boring protect.In the process of described countersunk hole, before boring, first cover aluminium sheet in the position of boring protect.
Embodiment 4
The invention discloses a kind of circuit board counter sink manufacture method, described manufacture method adopts secondary drilling mode to make periphery holes and counterbore respectively, the boring of described periphery holes and counterbore repeatedly number changes for 1PNL/, described periphery holes is positioned at the top of described counterbore, the aperture of described periphery holes is less than described counterbore, and described secondary drilling mode comprises the following steps:
The first step, periphery holes are holed, overlap backing plate on circuit boards, set the drilling depth half as plate thickness, be that 0.30mm, cutting output Vs are according to Vs=(n*D* π in conjunction with bore diameter D)/1000, f=(F*1000)/n, set boring rotating speed as 130 ± 5krpm, feed velocity f as 2.2 ± 0.3m/min, return cutter speed F carry out periphery holes boring as 20m/min in the plate face of circuit board；
Second step, countersunk hole, bore diameter D is that 0.50mm, cutting output Vs are according to Vs=(n*D* π)/1000, f=(F*1000)/n, set boring rotating speed as 100 ± 5krpm, feed velocity f as 3.3 ± 0.2m/min, return cutter speed F as 22m/min complete periphery holes boring circuit board surface on set the drilling depth half as plate thickness, carry out countersunk hole in the plate face of circuit board.
In the present embodiment, described counter sink be shaped as step, described counterbore be shaped as taper hole, select pointed shape to bore.In the process of described periphery holes boring, before boring, first cover aluminium sheet in the position of boring protect.In the process of described countersunk hole, before boring, first cover aluminium sheet in the position of boring protect.
Embodiment 5
The invention discloses a kind of circuit board counter sink manufacture method, described manufacture method adopts secondary drilling mode to make periphery holes and counterbore respectively, the boring of described periphery holes and counterbore repeatedly number changes for 1PNL/, described periphery holes is positioned at the top of described counterbore, the aperture of described periphery holes is less than described counterbore, and described secondary drilling mode comprises the following steps:
The first step, periphery holes are holed, overlap backing plate on circuit boards, set the drilling depth half as plate thickness, be that 0.55mm, cutting output Vs are according to Vs=(n*D* π in conjunction with bore diameter D)/1000, f=(F*1000)/n, set boring rotating speed as 95 ± 5krpm, feed velocity f as 3.5 ± 0.2m/min, return cutter speed F carry out periphery holes boring as 12m/min in the plate face of circuit board；
Second step, countersunk hole, setting the drilling depth half as plate thickness in the circuit board surface completing periphery holes boring, bore diameter D is that 1.95～2.15mm, cutting output Vs are according to Vs=(n*D* π)/1000, f=(F*1000)/n, sets rotating speed of holing and carries out countersunk hole as 20m/min in the plate face of circuit board as 2.5 ± 0.2m/min, time cutter speed F as 35 ± 3krpm, feed velocity f.
In the present embodiment, described counter sink be shaped as inclined-plane shape, described counterbore be shaped as tack hole, when described counterbore shape is tack hole select the straight angle.In the process of described periphery holes boring, before boring, first cover aluminium sheet in the position of boring protect.In the process of described countersunk hole, before boring, first cover aluminium sheet in the position of boring protect.
Embodiment 6
The invention discloses a kind of circuit board counter sink manufacture method, described manufacture method adopts secondary drilling mode to make periphery holes and counterbore respectively, the boring of described periphery holes and counterbore repeatedly number changes for 1PNL/, described periphery holes is positioned at the top of described counterbore, the aperture of described periphery holes is less than described counterbore, and described secondary drilling mode comprises the following steps:
The first step, periphery holes are holed, overlap backing plate on circuit boards, set the drilling depth half as plate thickness, be that 0.50mm, cutting output Vs are according to Vs=(n*D* π in conjunction with bore diameter D)/1000, f=(F*1000)/n, set boring rotating speed as 100 ± 5krpm, feed velocity f as 3.3 ± 0.2m/min, return cutter speed F carry out periphery holes boring as 22m/min in the plate face of circuit board；
Second step, countersunk hole, setting the drilling depth half as plate thickness in the circuit board surface completing periphery holes boring, bore diameter D is that 1.15～1.25mm, cutting output Vs are according to Vs=(n*D* π)/1000, f=(F*1000)/n, sets rotating speed of holing and carries out countersunk hole as 25m/min in the plate face of circuit board as 3.5 ± 0.2m/min, time cutter speed F as 58 ± 3krpm, feed velocity f.
In the present embodiment, described counter sink be shaped as step, described counterbore be shaped as taper hole, select pointed shape to bore.In the process of described periphery holes boring, before boring, first cover aluminium sheet in the position of boring protect.In the process of described countersunk hole, before boring, first cover aluminium sheet in the position of boring protect.
The above, be only presently preferred embodiments of the present invention, and the present invention not does any pro forma restriction；The those of ordinary skill of all industry all can shown in by specification and the above and implement the present invention swimmingly；But, all those skilled in the art without departing within the scope of technical solution of the present invention, available disclosed above technology contents and make a little change, modify and the equivalent variations of differentiation, be the Equivalent embodiments of the present invention；Meanwhile, all change of any equivalent variations, modification and differentiation etc. above example made according to the substantial technological of the present invention, all still fall within the protection domain of technical scheme.
Claims (5)
1. a circuit board counter sink manufacture method, it is characterized in that: described manufacture method adopts secondary drilling mode to make periphery holes and counterbore respectively, the boring of described periphery holes and counterbore repeatedly number changes for 1PNL/, described periphery holes is positioned at the top of described counterbore, the aperture of described periphery holes is less than described counterbore, and described secondary drilling mode comprises the following steps:
The first step, periphery holes are holed, overlap backing plate on circuit boards, set the drilling depth half as plate thickness, in conjunction with bore diameter D, cutting output Vs according to Vs=(n*D* π)/1000, f=(F*1000)/n, set boring rotating speed n, feed velocity f, return cutter speed F carry out periphery holes boring in the plate face of circuit board；
Second step, countersunk hole, the circuit board surface completing periphery holes boring sets the drilling depth half as plate thickness, in conjunction with bore diameter D, cutting output Vs according to Vs=(n*D* π)/1000, f=(F*1000)/n, set boring rotating speed n, feed velocity f, time cutter speed F carry out countersunk hole in the plate face of circuit board.
2. circuit board counter sink manufacture method according to claim 1, it is characterised in that: described counter sink be shaped as step or inclined-plane shape.
3. circuit board counter sink manufacture method according to claim 2, it is characterised in that: described counterbore be shaped as taper hole or tack hole, when described counterbore shape is taper hole select pointed shape drill, when described counterbore shape is tack hole select the straight angle.
4. circuit board counter sink manufacture method according to claim 3, it is characterised in that: in the process of described periphery holes boring, before boring, first cover aluminium sheet in the position of boring protect.
5. circuit board counter sink manufacture method according to claim 4, it is characterised in that: in the process of described countersunk hole, before boring, first cover aluminium sheet in the position of boring protect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610145463.6A CN105722324A (en) | 2016-03-15 | 2016-03-15 | Manufacturing method of circuit board counterbore |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610145463.6A CN105722324A (en) | 2016-03-15 | 2016-03-15 | Manufacturing method of circuit board counterbore |
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| Publication Number | Publication Date |
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| CN105722324A true CN105722324A (en) | 2016-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610145463.6A Pending CN105722324A (en) | 2016-03-15 | 2016-03-15 | Manufacturing method of circuit board counterbore |
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2016
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| JP2007053134A (en) * | 2005-08-15 | 2007-03-01 | Sumitomo Bakelite Co Ltd | Method of manufacturing circuit board, printed circuit board and method of manufacturing the same |
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| CN103687308A (en) * | 2012-09-14 | 2014-03-26 | 北大方正集团有限公司 | Blind-hole Press-joint multilayer printed circuit board and manufacturing method thereof |
| CN103945656A (en) * | 2013-01-22 | 2014-07-23 | 深圳市万泰电路有限公司 | Method of manufacturing double-sided aluminum substrate with resin plug holes and counterbore holes |
| CN104772506A (en) * | 2015-04-13 | 2015-07-15 | 竞陆电子(昆山)有限公司 | Threaded counter bore forming drill pin group and threaded counter bore forming method |
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Application publication date: 20160629 |